A multi-band low latency combiner

Abstract

The application relates to the technical field of combiners, and discloses a multi-frequency-band low-latency combiner which comprises a shell, at least one partition plate, multiple input interfaces and one output interface; the shell has an accommodating space inside; the partition plate is arranged in the accommodating space and divides the accommodating space into multiple sub-chambers; the multiple input interfaces and the output interface are arranged on the two sides of the shell; wherein the multiple sub-chambers comprise one output common chamber, one 50-ohm common chamber and a plurality of filter module cavities, the filter module cavities and the output common chamber are connected to the two ends of the 50-ohm common chamber, the 50-ohm common chamber is provided with a band-stop filter piece and a 50-ohm switching rod connected in series, the combiner further comprises a PTPE fixing switching block, and the band-stop filter piece and the 50-ohm switching rod are welded and arranged on the PTPE fixing switching block. The combiner improves signal quality and stability.

Description

Technical Field

[0001] This application relates to the field of combiner technology, and in particular to a multi-band low-delay combiner. Background Technology

[0002] The rapid development of mobile communications demands ever-expanding signal coverage from base station antennas. However, the space available for building base stations is becoming increasingly limited. To address this issue, situations have arisen where multiple different standards, frequency bands, and even different operators share a single site. This objectively drives the trend of a single base station antenna simultaneously supporting multiple different frequency bands and standards. In critical communication environments, this is currently achieved primarily by using combiners within the antenna to separate the radio frequency signals from different systems and route them to different antenna RF ports. However, existing combiners have relatively low power at the common interface and poor far-end suppression, making them difficult to meet practical application requirements.

[0003] Signal quality and stability are crucial issues during the use of combiners. Therefore, improving the signal quality and stability of combiners is a technical problem that needs to be solved. Summary of the Invention

[0004] This application provides a multi-band low-delay combiner, which improves signal quality and stability.

[0005] To achieve the above objectives, the main technical solutions adopted in this application include:

[0006] In a first aspect, embodiments of this application provide a multi-band low-delay combiner, including a housing, at least one partition, multiple input interfaces, and one output interface; the housing has an internal accommodating space; the partition is disposed in the accommodating space and divides the accommodating space into multiple sub-chambers; the multiple input interfaces and the output interface are respectively disposed on both sides of the housing; wherein, the multiple sub-chambers include an output common cavity, a 50-ohm common cavity, and several output filter module cavities, the filter module cavities and the output common cavity are connected to the two ends of the 50-ohm common cavity, the 50-ohm common cavity is provided with a series-connected band-stop filter chip and a 50-ohm adapter bar, the combiner also includes a PTPE fixed adapter block, the band-stop filter chip and the 50-ohm adapter bar are welded and are all disposed on the PTPE fixed adapter block.

[0007] This application proposes a multi-band low-delay combiner. Through a partitioned sub-chamber structure constructed with a housing and partitions, the output common cavity, a 50-ohm common cavity, and several filter module cavities are clearly separated. This effectively avoids cross-interference between signals in different cavities, laying a stable structural foundation for independent processing and efficient combining of multi-band signals. The 50-ohm common cavity contains a series-connected band-stop filter and a 50-ohm adapter bar, which are integrated with a PTPE fixing block. This reduces reflection loss during signal transmission through 50-ohm impedance matching and precisely suppresses out-of-band spurious signals (such as radio harmonics) using the band-stop filter. It significantly improves signal purity by eliminating interference from switching power supplies, etc. Meanwhile, the PTPE fixed adapter block not only ensures the robust connection and assembly consistency between the band-stop filter and the 50-ohm adapter bar, facilitating product precision control during mass production, but its insulation properties also further reduce electromagnetic interference between components. Combined with a layout of multiple input interfaces and a single output interface, it enables the orderly input and efficient combined output of multi-band signals (such as 700MHz-3800MHz covering 2G-5G), meeting the needs of base station antennas for multi-standard and multi-band sharing, while balancing low signal loss and high stability, thus improving signal quality and stability.

[0008] Optionally, the output common cavity is provided with a low-pass filter component and a PTPE dielectric block. The low-pass filter component includes several alternating low-impedance sections and high-impedance sections. The low-pass filter component is embedded in the PTPE dielectric block, and one end of the PTPE dielectric block extends into the 50-ohm common cavity and is in contact with the top surface of the band-stop filter chip.

[0009] In the above scheme, the low-pass filter component, through its alternating low-impedance and high-impedance sections, can accurately filter out high-frequency interference signals and retain low-frequency useful signals, thus improving the signal purity of the combined output. The PTPE dielectric block not only provides a stable mounting position for the low-pass filter component, preventing displacement due to vibration and other factors from affecting the filtering effect, but its excellent insulation properties also isolate the electromagnetic coupling between the low-pass filter component and the metal structure such as the housing, reducing additional interference and ensuring the consistency of component assembly during mass production. Furthermore, the bonding design between the PTPE dielectric block and the band-stop filter chip shortens the signal transmission time between the low-pass filter component and the band-stop filter chip. The path reduces signal transmission loss, thereby helping the combiner achieve low latency performance (e.g., latency ≤ 0.5ns). On the other hand, it can achieve the synergistic effect of band-stop filtering and low-pass filtering. The band-stop filter chip first suppresses spurious signals in specific frequency bands, and the low-pass filter component further filters out high-frequency noise. The dual filtering significantly improves the out-of-band interference suppression capability. In addition, the PTPE dielectric block can also form physical isolation between different components to avoid signal crosstalk. Ultimately, it ensures that the combiner has both high signal transmission quality and stable performance of low latency and high anti-interference core performance in the process of combining multi-frequency signals, adapting to the usage requirements of complex communication scenarios such as base station antennas.

[0010] Optionally, the combiner may also include a hoist string low-pass filter, the output of which is soldered to the output interface, and the input of which is soldered to the end of the PTPE dielectric block away from the 50-ohm common cavity.

[0011] In the above scheme, from the perspective of signal transmission efficiency, welding connection can minimize contact resistance and signal transmission gap, avoid signal reflection and loss problems caused by traditional plugging or loose connection, significantly shorten the signal transmission path from the filtering stage to the output interface, help achieve low latency, and meet the real-time signal requirements of critical communication scenarios. From the perspective of enhanced filtering performance, the gourd string low-pass filter, with its unique high and low impedance alternating gourd string structure, can form multiple attenuation zero points in the stopband. Compared with ordinary low-pass filters, it can more efficiently suppress out-of-band high-frequency noise (such as interference signals in the 4.2GHz-12.76GHz frequency band). With the PTPE dielectric block connected to the input end, it can not only use the excellent insulation properties of PTPE to isolate the electromagnetic coupling between the filter and the housing and other components, avoiding the introduction of additional interference, but also ensure the accurate installation position of the gourd string low-pass filter through the fixing effect of PTPE, improving the assembly consistency during mass production. It helps to deeply suppress residual high-frequency noise, and the triple filtering synergy can improve the far-end suppression capability to a higher level.

[0012] Optionally, the housing adopts a one-piece aluminum alloy structure, and the top of the housing is equipped with a removable waterproof cover. A rubber waterproof ring is provided at the connection between the waterproof cover and the housing. The waterproof ring has a U-shaped cross section and is fitted onto the edge of the top of the housing.

[0013] In the above solution, aluminum alloy material itself combines lightweight, high strength, and excellent thermal conductivity. The one-piece molding process can completely eliminate splicing gaps, avoiding electromagnetic leakage and external interference infiltration caused by seams in traditional assembled housings. It enhances the electromagnetic shielding effect on internal filter modules, resonant columns, and other precision components, ensuring anti-crosstalk capability during multi-band signal transmission. It also improves the overall vibration and deformation resistance of the housing, making it suitable for outdoor or high-load installation scenarios such as base stations. The detachable waterproof cover ensures structural sealing while providing convenience for later maintenance (such as replacing filter components and adjusting resonant columns) without disassembling the entire combiner body, significantly reducing maintenance costs and downtime. The U-shaped rubber waterproof ring fitted around the top edge of the housing, compared to ordinary flat-pad waterproof structures, has a U-shaped groove that can more tightly wrap the edge of the housing. Even if the housing or cover undergoes slight deformation due to temperature changes, it can still maintain a tight seal through its own elasticity, effectively blocking rainwater, moisture, dust, and other intrusions, thus improving reliability.

[0014] Optionally, a positioning platform is provided at the end of the PTPE dielectric block away from the 50-ohm common cavity. A copper connecting piece is welded to the output end of the low-pass filter component. The copper connecting piece is fastened to the top surface of the positioning platform by screws, and the other end of the connecting piece extends to the output interface and is welded to the signal end of the output interface.

[0015] In the above solution, the raised positioning platform can provide precise physical positioning for the copper connecting piece, preventing it from shifting or misaligning during assembly or use. This ensures a consistently stable signal transmission path between the low-pass filter component and the output interface, significantly improving assembly accuracy and product performance consistency during mass production. It also solves the signal loss and latency fluctuation problems caused by installation deviations in traditional non-positioning structures. The copper connecting piece itself has excellent conductivity, minimizing resistance loss during signal transmission. The dual fixing method of "screw fastening + welding" ensures the connection piece is securely positioned to the positioning platform. The platform's firm fit prevents loosening caused by environmental factors such as vibration and temperature changes. Welding eliminates contact gaps between the connecting piece and the output interface, reducing signal reflection and further shortening the signal transmission path. Meanwhile, the insulation properties of the PTPE dielectric block can be extended to the connecting piece area through the positioning platform, effectively isolating the electromagnetic coupling between the copper connecting piece and the housing and other metal components. This prevents external interference signals from seeping into the filter link through the connecting piece, ensuring the purity of the low-pass filter component's output signal. Combined with the previous multi-stage filtering structure, this further enhances the long-range suppression effect in the 4.2GHz-12.76GHz frequency band.

[0016] Optionally, the combiner also includes a PTPE fixing rod. The filter module cavity is provided with several resonant pillars. The PTPE fixing rod is arranged along the arrangement direction of the resonant pillars, and a through hole adapted to the PTPE fixing rod is opened in the middle of the resonant pillar. The PTPE fixing rod passes through the through hole to position the resonant pillar. The end of the resonant pillar away from the PTPE fixing rod is set on the inner wall of the housing.

[0017] In the above scheme, from the perspective of core filtering performance, the resonant columns, as key components of each frequency band filtering module, have their arrangement and spacing directly determining the filtering accuracy. The positioning method of the PTPE fixing rod with through holes can precisely constrain the radial and circumferential displacement of each resonant column, ensuring that the spacing and perpendicularity of the resonant columns fully meet the design standards, avoiding frequency band drift and filtering curve distortion caused by positional offset, and thus ensuring the accurate screening of target frequency band signals and out-of-band interference suppression capability of each path. In terms of structural stability, the resonant column is positioned by a PTPE fixing rod at one end and connected to the inner wall of the shell at the other end, forming a double fixation. This can resist the vibration and impact in the combiner transportation or base station installation scenarios, and also offset the thermal expansion and contraction difference between the shell and the resonant column caused by temperature changes (such as outdoor high and low temperatures), preventing the resonant column from loosening or deforming, and avoiding the increase in standing wave ratio caused by structural instability (ensuring...). This addresses issues such as VSWR ≤ 1.3 and increased signal reflection loss. From an anti-interference perspective, PTPE material possesses excellent insulation properties. The fixing rod can isolate electromagnetic coupling between different resonant columns and between the resonant column and the aluminum alloy shell. Especially for the differentiated materials of different resonant columns, it can effectively avoid stray capacitance interference between different metal components, reduce signal crosstalk, and further improve the purity of multi-band signal parallel processing. From a production and maintenance perspective, the standardized through-hole design of the PTPE fixing rod eliminates the need for complex welding or bonding fixing of the resonant column. During assembly, positioning can be completed simply by inserting the rod, significantly improving mass production efficiency and ensuring consistent resonant column positioning accuracy for each combiner, avoiding product performance differences caused by manual assembly errors. At the same time, the strong chemical stability of PTPE material can prevent electrochemical corrosion between the resonant column and the shell metal, extending the service life of the resonant column.

[0018] Optionally, the resonant pillar includes multiple resonant pillar groups, which are respectively disposed in the cavity of the corresponding filter module, wherein at least some of the resonant pillar groups are made of the same material.

[0019] In the above solution, a high-efficiency balance is achieved between control and production efficiency: From a performance perspective, the resonant pillars made of different materials can be specifically adapted to different frequency band requirements due to differences in conductivity, permeability, and other characteristics. Furthermore, using the same material for some resonant pillar groups ensures that filter modules in similar frequency bands obtain consistent electromagnetic characteristics, avoiding performance fluctuations caused by material differences. This guarantees low-loss transmission and stable out-of-band suppression of signals in the corresponding frequency bands. For example, using steel resonant pillars for P3, P5, and P7 paths can uniformly improve the consistency of far-end suppression in the 1805-3800MHz high-frequency band. From a cost and supply chain perspective, reducing the number of material types simplifies the raw material procurement process and reduces inventory management costs for multiple material categories. Simultaneously, the same materials can achieve price advantages through bulk purchasing, especially for materials used in large quantities (such as steel and aluminum), where economies of scale can significantly reduce overall costs. Ultimately, while meeting the core requirements of accurate filtering and low-latency (≤0.5ns) transmission of multi-frequency (700MHz-3800MHz) signals, the solution also considers both economy and practicality.

[0020] Optionally, each input interface is provided with an input port tap between itself and the corresponding filter module cavity. One end of the input port tap is welded to the input interface, and the other end is welded to the input end of the filter module in the corresponding filter module cavity to realize the transmission of the input signal.

[0021] In the above solution, from the perspective of core signal transmission requirements, welding connections can completely eliminate the contact gaps and contact resistance present in traditional plug-in or crimp connections, minimizing signal transmission loss between the input interface and the filter module. Simultaneously, it shortens the signal transmission path, directly helping the combiner achieve a low latency of ≤0.5ns, meeting the real-time requirements of critical communication scenarios. From a structural stability perspective, the welded taps will not loosen or shift due to vibration (such as vibration during base station equipment operation) or temperature changes (outdoor high and low temperature environments), preventing connection failures. To address issues such as signal interruption and enhanced reflection, the system effectively ensures that the VSWR of the combiner is stably controlled within 1.3, reducing the interference of signal reflection on the performance of the filter module. In terms of multi-band adaptability, the input port tap can be flexibly designed in terms of size and material (such as using high-conductivity copper) according to the frequency band requirements of the corresponding filter module (such as 703-758MHz, 1805-1880MHz, etc.), ensuring that input signals of different frequency bands can be accurately and without crosstalk to the corresponding filter module. Combined with the physical isolation of the filter module cavity, it further avoids cross-interference of multi-frequency signals at the input stage.

[0022] Optionally, the outer wall of the housing is provided with several fastening screws and grounding screws. The fastening screws are spaced apart along the edge of the housing to fix the housing to the external equipment. The grounding screws are located on one side of the output interface to realize the grounding function of the combiner.

[0023] In the above scheme, the spaced fastening screws can securely fix the housing to external equipment (such as base station antenna brackets and cabinets) with uniform force, avoiding displacement or loosening of the housing due to outdoor wind, equipment vibration, etc. This prevents internal filter modules, resonant columns, PTPE fasteners and other precision components from having poor contact or positioning deviation due to structural shaking, ensuring the stability of the signal transmission path (such as the welding joint between the low-pass filter component and the output interface not shifting), and providing a stable structural foundation for the combiner. The grounding screw on the output interface side can quickly conduct away the static charge accumulated in the housing and internal components, preventing electrostatic discharge from damaging sensitive components such as the band-stop filter and the 50-ohm adapter. At the same time, the grounding forms an electromagnetic shielding loop, effectively suppressing external electromagnetic interference (such as radio frequency noise around the base station and radiation from industrial equipment) from penetrating into the interior through the housing. Especially when grounding near the output interface, a key node for signal combining, it can further reduce the impact of interference signals on the final output signal, ensure the purity of the signal after multi-band combining, and help meet the 3GPP TR38.801 spurious radiation requirements.

[0024] Optionally, the outer wall of the 50-ohm adapter is fitted with a PTPE insulating sleeve, which is integrally injection molded with the PTPE fixed adapter block.

[0025] In the above solution, PTPE material itself possesses excellent insulation properties. The insulating sleeve can directly isolate the 50-ohm adapter rod from the physical contact and electromagnetic coupling between the shell (aluminum alloy material) and surrounding metal components (such as resonant pillars and band-stop filter plates), completely avoiding the risk of short circuits caused by inter-metal conductivity. Simultaneously, it reduces external electromagnetic interference from penetrating the 50-ohm common cavity through the adapter rod, preventing interference signals from affecting the series filtering effect of the band-stop filter plate and the adapter rod, thus building a solid insulation barrier for the stable transmission of multi-band signals within the common cavity. Furthermore, the integrated injection molding process... The molding process abandons the traditional separate assembly method of "first putting on the sleeve and then fixing the adapter block", so that the insulating sleeve and the fixed adapter block form a seamless whole structure. This can not only firmly wrap the adapter rod, preventing it from shifting or loosening during transportation, vibration or temperature changes, and ensuring that the adapter rod always maintains a precise installation position (ensuring 50-ohm impedance matching accuracy), but also eliminate the gaps that may be generated by separate assembly, reduce signal reflection loss at the adapter, and directly help the combiner achieve a low latency of ≤0.5ns and a standing wave ratio of ≤1.3. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall structure in some embodiments of this application;

[0028] Figure 2 This is a top cross-sectional view of the combiner in some embodiments of this application;

[0029] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure along the DD direction;

[0030] Figure 4 for Figure 3 Enlarged structural diagram at point V;

[0031] Figure 5 for Figure 2 Schematic diagram of the cross-sectional structure in the middle EE direction;

[0032] Figure 6 for Figure 5 Enlarged structural diagram of section III.

[0033] [Explanation of Labels in the Attached Image]

[0034] 1: Cover plate; 2: Housing; 3: Connector; 4: Grounding screw; 5: Fastening screw; 6: First resonant column group; 7: Second resonant column group; 8: Third resonant column group; 9: Fourth resonant column group; 10: Fifth resonant column group; 12: Sixth resonant column group; 11: Seventh resonant column group;

[0035] P1: First filter path; P2: Second filter path; P3: Third filter path; P4: Fourth filter path; P5: Fifth filter path; P6: Sixth filter path; P7: Seventh filter path; P8: Output port;

[0036] 200: PTTE dielectric block; 202: band-stop filter chip; 203: loop-type low-pass filter; 300: output connector; 302: output loop-type low-pass filter; 305: resonant post. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0039] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0042] In this application, "multiple" refers to two or more (including two), and similarly, "multiple groups" refers to two or more (including two), and "multiple pieces" refers to two or more (including two).

[0043] The rapid development of mobile communications demands ever-expanding signal coverage from base station antennas. However, the space available for building base stations is becoming increasingly limited. To address this issue, situations have arisen where multiple different standards, frequency bands, and even different operators share a single site. This objectively drives the trend of a single base station antenna needing to simultaneously support multiple different frequency bands and standards. Multi-frequency low-latency combiners perfectly meet this requirement.

[0044] In critical communication environments, current methods primarily utilize combiners within the antenna to separate radio frequency (RF) signals from different systems and route them to different antenna RF ports. However, existing combiners have low power at the common interface and poor far-end suppression, making them unsuitable for practical applications. Multi-frequency low-delay combiners fully meet this requirement.

[0045] In existing technologies: 1. Traditional combiners struggle to cover the entire 2G to 5G frequency band (e.g., the 758-3800MHz range), leading to severe mutual interference when multiple frequency bands coexist. 2. Insufficient far-end suppression: Weak spurious emission suppression capability above 6GHz, causing the system to fail industry testing standards (e.g., 3GPP TR38.801 spurious emission requirements). 3. Lack of protection for critical frequency bands: Low-frequency bands such as 700MHz / 900MHz are susceptible to high harmonic interference, and existing designs lack targeted combiners. 4. Traditional multi-frequency combiners struggle to achieve low latency at the output port, affecting the VSWR between different channels and impacting call quality.

[0046] Signal quality and stability are crucial issues during the use of combiners. Therefore, improving the signal quality and stability of combiners is a technical problem that needs to be solved.

[0047] In view of this, in order to improve the signal quality and stability of the combiner, this application provides a multi-band low-delay combiner, which includes multiple sub-chambers including an output common cavity, a 50-ohm common cavity, and several output filter module cavities. The filter module cavities and the output common cavity are connected to the two ends of the 50-ohm common cavity. The 50-ohm common cavity is provided with a series-connected band-stop filter chip and a 50-ohm adapter bar. The combiner also includes a PTPE fixed adapter block. The band-stop filter chip and the 50-ohm adapter bar are welded and are both disposed on the PTPE fixed adapter block. The band-stop filter chip is connected in series within the 50-ohm common cavity. Integrated with a 50-ohm adapter bar and a PTPE fixed adapter block, the 50-ohm impedance matching reduces reflection loss during signal transmission, while the band-stop filter precisely suppresses out-of-band spurious signals (such as radio harmonics and switching power supply interference), significantly improving signal purity. Connecting the output port 203 to the 50-ohm adapter bar, then connecting to a low-pass filter and a low-to-high impedance adapter block, and fixing it to the PTPE fixed adapter block creates multiple zero-attenuation points within the stopband, significantly improving the ability to suppress out-of-band high-frequency noise, such as radio harmonics and switching power supply interference, thereby improving signal quality and stability.

[0048] The following is in conjunction with the appendix Figure 1 -Appendix Figure 6 This application provides a specific description of a multi-band low-delay combiner in its embodiments.

[0049] This application provides a multi-band low-delay combiner, including a housing, at least one partition, multiple input interfaces and one output interface.

[0050] The housing has an internal space; a partition is set in the space and divides the space into multiple sub-chambers. It can be understood that the partitioned sub-chamber structure constructed by the housing and the partition clearly separates the output common cavity, the 50-ohm common cavity and several filter module cavities, which can effectively avoid cross-interference of signals in different cavities and lay a stable structural foundation for independent processing and efficient combining of multi-band signals.

[0051] Multiple input and output interfaces are respectively located on both sides of the housing; among them, multiple sub-chambers include an output common cavity, a 50-ohm common cavity, and several output filter module cavities. The filter module cavities and the output common cavity are connected to the two ends of the 50-ohm common cavity. The 50-ohm common cavity is equipped with a series-connected band-stop filter chip and a 50-ohm adapter bar. The combiner also includes a PTPE fixed adapter block. The band-stop filter chip and the 50-ohm adapter bar are welded and are all located on the PTPE fixed adapter block.

[0052] In the above scheme, the 50-ohm band-stop filter and the 50-ohm adapter bar connected in series within the common cavity are integrated and fixed with a PTPE fixing block. This reduces reflection loss during signal transmission through 50-ohm impedance matching and precisely suppresses out-of-band spurious signals (such as radio harmonics and switching power supply interference) with the help of the band-stop filter, significantly improving signal purity. At the same time, the PTPE fixing block not only ensures the robust connection and assembly consistency between the band-stop filter and the 50-ohm adapter bar, facilitating product precision control during mass production, but its insulation properties also further reduce electromagnetic interference between components. Combined with the layout of multiple input interfaces and a single output interface, it can realize the orderly input and efficient combined output of multi-band signals (such as 700MHz-3800MHz covering 2G-5G), meeting the needs of base station antennas for multiple standards and multiple frequency bands, balancing low signal transmission loss and high stability, and improving signal quality and stability.

[0053] In other embodiments, please refer to Figures 1-4 The output common cavity is equipped with a low-pass filter component and a PTPE dielectric block. It can be understood that the PTPE dielectric block not only provides a stable mounting position for the low-pass filter component, preventing the component from shifting due to vibration and other factors, thus affecting the filtering effect, but its excellent insulation properties can also isolate the electromagnetic coupling between the low-pass filter component and the metal structure such as the housing, reducing additional interference, and ensuring the consistency of component assembly during mass production.

[0054] The low-pass filter component consists of several alternating low-impedance and high-impedance sections. It can be understood that the low-pass filter component can accurately filter out high-frequency interference signals and retain low-frequency useful signals through the alternating structure of low-impedance and high-impedance sections, thus building a solid first line of defense for the purity of the combined output signal.

[0055] The low-pass filter component is embedded in a PTPE dielectric block. One end of the PTPE dielectric block extends into a 50-ohm common cavity and is attached to the top surface of the band-stop filter chip. This attachment design shortens the signal transmission path between the low-pass filter component and the band-stop filter chip, reducing signal transmission loss and thus helping the combiner achieve low latency performance (e.g., latency ≤ 0.5ns). Furthermore, it allows the "band-stop filter + low-pass filter" to work synergistically. The band-stop filter chip first suppresses spurious signals in specific frequency bands, and the low-pass filter component further filters out high-frequency noise. This dual filtering significantly improves out-of-band interference suppression capabilities, such as ≥40dB far-end suppression in the 4.2GHz-12.76GHz frequency band, and ≥60dB in some bands. In addition, the PTPE dielectric block provides physical isolation between different components, preventing signal crosstalk. Ultimately, this ensures that the combiner maintains high signal transmission quality and consistently delivers low latency and high anti-interference performance during multi-band signal combining, meeting the needs of complex communication scenarios such as base station antennas.

[0056] In other embodiments, the combiner further includes a gourd string low-pass filter, the output of which is welded to the output interface, and the input of which is welded to the end of the PTPE dielectric block away from the 50-ohm common cavity.

[0057] In the above scheme, from the perspective of signal transmission efficiency, welding connection can minimize contact resistance and signal transmission gap, avoid signal reflection and loss problems caused by traditional plugging or loose connection, significantly shorten the signal transmission path from the filtering stage to the output interface, and directly help the combiner achieve a low latency index of ≤0.5ns, meeting the real-time requirements of key communication scenarios.

[0058] From the perspective of enhanced filtering performance, the gourd string low-pass filter, with its unique "alternating high and low impedance" gourd string structure, can form multiple zero-attenuation points within the stopband. Compared with ordinary low-pass filters, it can more efficiently suppress out-of-band high-frequency noise, such as interference signals in the 4.2GHz-12.76GHz frequency band. With the PTPE dielectric block connected to the input end, it can not only use the excellent insulation properties of PTPE to isolate the electromagnetic coupling between the filter and the housing and other components, avoiding the introduction of additional interference, but also ensure the accurate installation position of the gourd string low-pass filter through the fixing effect of PTPE, improving the assembly consistency during mass production.

[0059] From a functional synergy perspective, this connection method enables the gourd string low-pass filter to form a "multi-stage progressive filtering" architecture with the previous "band-stop filter chip + PTPE dielectric block embedded low-pass filter component". The band-stop filter chip first initially suppresses spurious emissions in specific frequency bands, the pre-filter component further filters out high-frequency interference, and the gourd string low-pass filter acts as the "last line of defense" at the output end, deeply suppressing residual high-frequency noise. The triple filtering synergy can improve the far-end suppression capability to a higher level, with some frequency bands ≥60dB, fully meeting the 3GPP TR38.801 spurious radiation requirements.

[0060] In addition, the welded and fixed structure has strong stability, can adapt to high-power signal transmission scenarios, avoids component displacement caused by vibration and temperature changes, and ensures long-term stable operation of the combiner in complex environments such as high altitude and extreme temperature and humidity.

[0061] In other embodiments, the housing is made of a one-piece aluminum alloy structure, and the top of the housing is provided with a removable waterproof cover. A rubber waterproof ring is provided at the connection between the waterproof cover and the housing. The waterproof ring has a U-shaped cross section and is fitted onto the edge of the top of the housing.

[0062] Understandably, aluminum alloy material itself combines lightweight, high strength, and excellent thermal conductivity. The one-piece molding process can completely eliminate splicing gaps, which not only avoids electromagnetic leakage and external interference infiltration caused by seams in traditional assembled shells, but also enhances the electromagnetic shielding effect on internal filter modules, resonant pillars and other precision components, ensuring anti-crosstalk capability during multi-band signal transmission, but also improves the overall vibration resistance and deformation resistance of the shell, making it suitable for outdoor or high-load installation scenarios such as base stations.

[0063] The detachable waterproof cover ensures structural airtightness while providing convenience for later maintenance, such as replacing filter components and adjusting resonant columns, without having to disassemble the entire combiner body, greatly reducing maintenance costs and downtime.

[0064] The U-shaped rubber waterproof ring fitted around the top edge of the housing, compared to ordinary flat-pad waterproof structures, allows the U-shaped groove to more tightly wrap around the edge of the housing. Even if the housing or cover plate deforms slightly due to temperature changes, it can still maintain a tight seal through its own elasticity, effectively blocking the intrusion of rainwater, moisture, dust, etc., easily achieving IP67 waterproof and dustproof performance. This prevents internal metal components such as the band-stop filter and 50-ohm adapter from getting damp and corroding or getting dusty, ensuring impedance matching accuracy and welding node stability. This, in turn, ensures the long-term stability of the combiner's core performance such as low latency and high far-end suppression, ultimately allowing the combiner to operate reliably in extreme environments such as high altitude, rain, and dust, adapting to the long-term use requirements of multi-band signal combining for 2G-5G base station antennas.

[0065] In other embodiments, a raised positioning platform is provided at the end of the PTPE dielectric block away from the 50-ohm common cavity. It is understood that the raised positioning platform can form a precise physical limit on the copper connecting piece, avoiding the connecting piece from shifting or misaligning during assembly or use, ensuring that the signal transmission path between the low-pass filter component and the output interface is always stable and consistent, greatly improving the assembly accuracy and product performance consistency during mass production, and solving the problem of signal loss and time delay fluctuation caused by installation deviation in traditional non-positioning structures.

[0066] The output end of the low-pass filter component is soldered with a copper connecting piece, which is fastened to the top surface of the positioning platform by screws, and the other end of the connecting piece extends to the output interface and is soldered to the signal end of the output interface.

[0067] In the above scheme, the connecting piece itself has excellent conductivity, which can minimize the resistance loss during signal transmission. The dual fixing method of "screw fastening + welding" not only ensures the firm fit between the connecting piece and the positioning table through screw fastening, preventing loosening of the connection caused by environmental factors such as vibration and temperature changes, but also eliminates the contact gap between the connecting piece and the output interface through welding, reducing signal reflection and further shortening the signal transmission path, which helps to ensure the low latency capability of the combiner.

[0068] Meanwhile, the insulation properties of the PTPE dielectric block can be extended to the connecting piece area through the positioning platform, effectively isolating the electromagnetic coupling between the copper connecting piece and the shell and other metal components, preventing external interference signals from penetrating into the filter link through the connecting piece, ensuring the purity of the output signal of the low-pass filter component, and further enhancing the long-range suppression effect on the 4.2GHz-12.76GHz frequency band in conjunction with the previous multi-stage filtering structure.

[0069] In addition, the screw-fastening design makes later maintenance more convenient. If the low-pass filter component or output interface needs to be inspected, the connecting piece can be removed simply by removing the screws without damaging the overall welded structure. This reduces the difficulty and cost of maintenance and ultimately ensures that the combiner has stable low latency and high anti-interference performance in long-term use, while also taking into account the practicality of production and maintenance, and adapting to the needs of complex communication scenarios such as base station antennas.

[0070] In other embodiments, the combiner further includes a PTPE fixing rod. A plurality of resonant pillars are provided within the cavity of the filter module. The PTPE fixing rod is arranged along the arrangement direction of the resonant pillars, and a through hole adapted to the PTPE fixing rod is formed in the middle of each resonant pillar. The PTPE fixing rod passes through the through hole to position the resonant pillar. The end of the resonant pillar furthest from the PTPE fixing rod is located on the inner wall of the housing.

[0071] From the perspective of core filtering performance, the resonant pillars are key components of each frequency band filtering module (e.g., 6 resonant pillars in the P1 channel correspond to the 703-758MHz frequency band, and 8 resonant pillars in the P2 channel correspond to the 821-960MHz frequency band). Their arrangement and spacing directly determine the filtering accuracy. The positioning method of the PTPE fixing rod with through holes can accurately constrain the radial and circumferential displacement of each resonant pillar, ensuring that the spacing and perpendicularity of the resonant pillars fully meet the design standards, avoiding frequency band drift and filtering curve distortion caused by positional offset, and thus ensuring the accurate screening of target frequency band signals and out-of-band interference suppression capability of each channel (e.g., far-end suppression ≥40dB in the 4.2GHz-12.76GHz frequency band, and ≥60dB in the P3-P7 channels).

[0072] In terms of structural stability, the resonant column is positioned by a PTPE fixing rod at one end and connected to the inner wall of the shell at the other end, forming a double fixation. This can resist the vibration and impact in the scenario of transporting the combiner or installing the base station, and can also offset the difference in thermal expansion and contraction between the shell and the resonant column caused by temperature changes (such as high and low outdoor temperatures), preventing the resonant column from loosening or deforming, and avoiding problems such as increased standing wave ratio (SWR) (ensuring SWR ≤ 1.3) and increased signal reflection loss caused by structural instability.

[0073] From an anti-interference perspective, PTPE material has excellent insulation properties. The fixing rod can isolate the electromagnetic coupling between different resonant pillars and between the resonant pillars and the aluminum alloy shell. In specific embodiments, P1 and P2 paths have copper resonant pillars, P3, P5 and P7 paths are all steel resonant pillars, and P4 and P6 paths are all aluminum resonant pillars. This can effectively avoid stray capacitance interference between different metal components, reduce signal crosstalk, and further improve the purity of multi-band signal parallel processing.

[0074] From a production and maintenance perspective, the standardized through-hole design of the PTPE fixing rod eliminates the need for complex welding or bonding of the resonant column. During assembly, positioning can be completed simply by inserting the rod through, which greatly improves the efficiency of mass production and ensures that the resonant column positioning accuracy of each combiner is consistent, avoiding product performance differences caused by manual assembly errors.

[0075] Meanwhile, the strong chemical stability of PTPE material can avoid electrochemical corrosion between the resonant column and the metal shell, extend the service life of the resonant column, and ultimately ensure that the combiner can perform its core functions of multi-band filtering, low latency and high reliability in a long-term stable manner, adapting to the long-term use needs of complex communication scenarios such as base station antennas.

[0076] In other embodiments, the resonant pillar includes multiple resonant pillar groups, which are respectively disposed in the cavity of the corresponding filter module, wherein at least some of the resonant pillar groups are made of the same material.

[0077] From a performance perspective, resonant pillars made of different materials (such as copper, steel, and aluminum) can be specifically adapted to different frequency band requirements due to differences in conductivity, permeability, and other characteristics. For example, copper resonant pillars are suitable for the 703-960MHz low-frequency band, while steel and aluminum are suitable for the 1800MHz and above high-frequency bands. Some resonant pillar groups use the same material, which can ensure that filter modules in similar frequency bands (such as those belonging to the low-frequency or high-frequency range) obtain consistent electromagnetic characteristics, avoid performance fluctuations caused by material differences, and ensure low-loss transmission and stable out-of-band suppression of signals in the corresponding frequency bands. For example, the P3, P5, and P7 paths all use steel resonant pillars, which can uniformly improve the consistency of far-end suppression in the 1805-3800MHz high-frequency band.

[0078] From a cost and supply chain perspective, reducing the types of materials can simplify the raw material procurement process, reduce the inventory management costs of multiple types of materials, and at the same time, the same materials can gain a price advantage through bulk purchasing. Especially for materials with large usage (such as steel and aluminum), economies of scale can significantly reduce overall costs.

[0079] From a manufacturing process perspective, resonant columns made of the same material can share processing equipment and process standards (such as cutting and welding parameters), reducing the frequency of process switching on the production line, improving processing accuracy and efficiency, and thus ensuring the consistency of the performance of each filter module during mass production, avoiding increased debugging complexity due to material differences.

[0080] In addition, the versatility of materials can simplify later maintenance. Resonant pillar spare parts made of the same material can be used interchangeably, reducing the maintenance difficulty and spare parts reserve pressure in scenarios such as base stations. Ultimately, while meeting the core requirements of accurate filtering and low-latency transmission of multi-band (700MHz-3800MHz) signals, it also takes into account economy and practicality.

[0081] In other embodiments, each input interface is provided with an input port tap between it and the corresponding filter module cavity. One end of the input port tap is welded to the input interface, and the other end is welded to the input end of the filter module in the corresponding filter module cavity to realize the transmission of input signals.

[0082] From the perspective of core signal transmission requirements, welding connections can completely eliminate the contact gaps and contact resistance present in traditional plug-in or crimp connections, minimize signal transmission loss between the input interface and the filter module, and shorten the signal transmission path. This directly helps the combiner achieve a low latency of ≤0.5ns, meeting the real-time requirements of key communication scenarios.

[0083] In terms of structural stability, the welded taps will not loosen or shift due to vibration (such as vibration during base station equipment operation) or temperature changes (outdoor high and low temperature environments), avoiding problems such as signal interruption and enhanced reflection caused by connection failure. This effectively ensures that the VSWR of the combiner is stably controlled within 1.3, reducing the interference of signal reflection on the performance of the filter module.

[0084] In terms of multi-band adaptability, the input port tap can be flexibly designed in terms of size and material (such as using high-conductivity copper) according to the frequency band requirements of the corresponding filter module (such as 703-758MHz, 1805-1880MHz, etc.), ensuring that input signals of different frequency bands can be accurately and without crosstalk to the corresponding filter module. Combined with the physical isolation of the filter module cavity, cross-interference of multi-frequency signals at the input stage is further avoided.

[0085] From a production and maintenance perspective, standardized welding processes facilitate batch operations, reduce manual assembly errors, ensure consistent tap connection accuracy in each input path of every combiner, and improve product performance consistency.

[0086] Meanwhile, the reliability of welded connections can reduce the frequency of later maintenance. Even under high-load operation scenarios, it can reduce failures caused by input connection problems. Ultimately, when multiple frequency band signals are input in parallel, the combiner can not only have high signal transmission quality, but also play a long-term stable role with low latency and high anti-interference core functions, adapting to the complex requirements of multiple standards and multiple frequency bands of base station antennas.

[0087] In other embodiments, the outer side wall of the housing is provided with a plurality of fastening screws 5 and grounding screws. The fastening screws 5 are spaced apart along the edge of the housing to fix the housing to the external equipment. The grounding screws are located on one side of the output interface to realize the grounding function of the combiner.

[0088] The spaced fastening screws can securely fix the housing to external equipment (such as base station antenna brackets and cabinets) with uniform force, avoiding displacement or loosening of the housing due to outdoor wind, equipment vibration and other factors. This prevents poor contact and positioning deviation of internal filter modules, resonant columns, PTPE fasteners and other precision components due to structural shaking, ensuring the stability of the signal transmission path (such as the welding nodes of the low-pass filter component and the output interface not being offset), and providing a stable structural foundation for the combiner.

[0089] The grounding screw on the output interface side can quickly conduct away the static charge accumulated in the housing and internal components, preventing electrostatic discharge from damaging sensitive components such as the band-stop filter and the 50-ohm adapter. At the same time, the grounding forms an electromagnetic shielding circuit, effectively suppressing external electromagnetic interference (such as radio frequency noise around the base station and radiation from industrial equipment) from penetrating into the interior through the housing. Especially when grounded near the output interface, a critical node for signal combining, it can further reduce the impact of interference signals on the final output signal, ensuring the purity of the signal after multi-band combining and making it easier to meet the 3GPP TR38.801 spurious radiation requirements.

[0090] In addition, the screw fixing method takes into account both the ease of installation and the flexibility of later maintenance. It is easy to quickly assemble and fix on site, and can be easily disassembled when internal components need to be inspected. Moreover, the high structural strength of the metal screws can adapt to extreme environments such as high altitude and drastic temperature difference, ensuring the long-term stable operation of the combiner. Ultimately, it achieves the dual guarantee of "stable structure and anti-interference + pure and reliable signal", perfectly adapting to the usage needs of complex communication scenarios such as base stations.

[0091] In other embodiments, the outer wall of the 50-ohm adapter rod is fitted with a PTPE insulating sleeve, which is integrally injection molded with the PTPE fixed adapter block. It is understood that PTPE material itself possesses excellent insulation properties. The insulating sleeve can directly isolate the 50-ohm adapter rod from the physical contact and electromagnetic coupling between it and the housing (aluminum alloy material) and surrounding metal components (such as resonant pillars and band-stop filter plates), completely avoiding the risk of short circuits caused by inter-metal conductivity. Simultaneously, it reduces the penetration of external electromagnetic interference into the 50-ohm common cavity through the adapter rod, preventing interference signals from affecting the series filtering effect of the band-stop filter plate and the adapter rod, thus building a solid insulation barrier for the stable transmission of multi-band signals within the common cavity.

[0092] The integrated injection molding process abandons the traditional separate assembly method of "first putting on the sleeve and then fixing the adapter block", so that the insulating sleeve and the fixed adapter block form a seamless whole structure. This can not only firmly wrap the adapter rod, preventing it from shifting or loosening during transportation, vibration or temperature changes, and ensuring that the adapter rod always maintains a precise installation position (ensuring 50-ohm impedance matching accuracy), but also eliminate the gaps that may be generated by separate assembly, reduce signal reflection loss at the adapter, and help improve signal quality and reliability.

[0093] From a production perspective, integrated injection molding enables standardized mass production, eliminating the need for manual assembly of sleeves and adapter blocks, significantly reducing assembly errors, ensuring consistent positioning accuracy and insulation performance of the 50-ohm adapter bar in each combiner, and improving product qualification rate. In addition, PTPE material has excellent chemical stability and anti-aging properties, resisting the corrosion of outdoor base station environments such as high altitude, humidity, and severe temperature differences, preventing adapter bars from rusting or failing in insulation due to environmental factors, extending component lifespan, and ultimately ensuring the stable operation of the 50-ohm common cavity as a "multi-band signal combining hub," providing key support for the low latency, high anti-interference, and high reliability performance of the combiner as a whole.

[0094] In a specific embodiment, this embodiment connects the output port to a 50-ohm adapter bar, connects a low-pass filter and a low-to-high impedance circuit, and fixes them together on PTPE. The 50-ohm adapter bar, low-pass filter, and low-to-high impedance circuit are welded together to form multiple zero-attenuation points within the stopband, which significantly improves the ability to suppress high-frequency noise outside the band, such as suppressing radio harmonics and switching power supply interference, and fully meets the requirements for signal transmission.

[0095] As a further improvement to this embodiment, the output port of the low-pass filter of the output hoist string is connected to a 700-2600MHz band-stop filter chip, PTPE screw, 50-ohm adapter rod, and PTPE fixed adapter block, which further decomposes the energy from low frequency to high frequency. The product's power capacity, third-order intermodulation, far-end suppression, and other superposition effects are all met, and the output delay is 0.5ns.

[0096] As a further improvement of this embodiment, the main body of the combiner is an aluminum alloy housing 2, wherein the combiner includes a first filtering path P1, the first filtering path P1 is connected to the output port P8, and is provided with an output hoist string low-pass filter and a low-to-high impedance filter.

[0097] The first filter path P1 is also equipped with a band-stop filter chip. The first resonant post group 6 contains six resonant posts 305, which are fastened with M4 screws. It also includes a PTPE fixing rod, an output hoist string 302, high and low impedance, and the resonant posts 305 are welded to the input port of the output hoist string. The output port of the hoist string is welded to the output connector 300. The band-stop filter chip is welded with a 50-ohm adapter rod. The frequency band is 703-758MHz, meeting the requirements of high far-end suppression 4.2GHz-12.76GHz ≥40dB, high intermodulation, and high echo.

[0098] As a further improvement of this embodiment, the combiner includes a second filter path P2 arranged in parallel. The second filter path P2 is connected to the output port P8. The second filter path P2 includes an output hoist string low-pass filter, a low-high impedance filter, a band-stop filter chip, a second resonant column group 7 containing 8 resonant columns, corresponding M4 screw fasteners, PTPE fixing rods, an output hoist string 302, and high and low impedance filters.

[0099] The resonant post 305 is soldered to the input port of the output hoist string, and the output port of the hoist string is soldered to the output connector 300. The frequency band is 821-960MHz, meeting the requirements of high far-end suppression (4.2GHz-12.76GHz ≥40dB), high intermodulation, and high echo.

[0100] As a further improvement to this embodiment, the combiner includes a third filter path P3 arranged in parallel, which is connected to the output port P8. The third resonant column group 8 includes 7 resonant columns, corresponding M4 screw fasteners, PTPE fixing rods, an output hoist string 302, high and low impedance, and resonant columns 305 welded to the input port of the output hoist string. A copper connecting piece 14, a band-stop filter piece, and a 50-ohm adapter are provided at the output end. The frequency band is 1805-1880MHz, meeting the requirements of high far-end suppression (4.2GHz-12.76GHz ≥60dB), high intermodulation, and high echo.

[0101] As a further improvement to this embodiment, the combiner includes a fourth filter path P4 arranged in parallel, which is connected to the output port P8. The fourth filter path P4 includes a band-stop filter chip, PTPE screws, a fourth resonant post group 9 containing five resonant posts, a PTPE fixing rod, and a copper connecting piece, a band-stop filter chip, and a 50-ohm adapter rod at the output end. The frequency band is 2110-2170MHz, meeting the requirements of high far-end rejection (4.2GHz-12.76GHz ≥60dB), high intermodulation, and high echo.

[0102] As a further improvement to this embodiment, the combiner includes a fifth filter path P5 arranged in parallel, which is connected to the output port P8. It includes a band-stop filter plate, PTPE screws, a fifth resonant post group 10 comprising six resonant posts, corresponding M4 screw fasteners, a PTPE fixing rod, and a copper connecting piece, a band-stop filter plate, and a 50-ohm adapter rod at the output end. The frequency band is 2620-2690MHz, meeting the requirements of high far-end rejection (4.2GHz-12.76GHz ≥60dB), high intermodulation, and high echo.

[0103] As a further improvement to this embodiment, the combiner includes a sixth filter path P6 arranged in parallel, which is connected to the output port P8. A circular low-pass filter 203 is soldered to the output port P8. A PTTE dielectric block 200 is fitted onto the circular low-pass filter 203. One end of the PTTE dielectric block 200 extends into the 50-ohm common cavity and is in contact with the top surface of the band-stop filter chip 202, resulting in surface-to-surface induction and low latency of up to 0.5ns. The sixth resonant pillar group 12 contains six resonant pillars and has a copper connecting piece at the output end. The frequency band is 3300-3400MHz, meeting the requirements of high far-end rejection (4.2GHz-12.76GHz ≥60dB), high intermodulation, and high echo.

[0104] As a further improvement to this embodiment, the combiner includes a seventh filter path P7 arranged in parallel, which is connected to the output port P8. A circular low-pass filter 203 is welded to the output port P8. A PTTE circular fixing bracket is fitted onto the circular low-pass filter. The other end of the circular low-pass filter 203 extends into a 50-ohm common cavity and is in contact with the top surface of the band-stop filter chip 202, resulting in surface-to-surface induction and low latency of up to 0.5ns. The seventh resonant pillar group 11 includes seven resonant pillars with corresponding M4 screw fasteners, and a copper connecting piece is provided at the output end. The frequency band is 3600-3800MHz, meeting the requirements of high far-end suppression (4.2GHz-12.76GHz ≥60dB), high intermodulation, and high echo.

[0105] In other specific embodiments: the combiner includes a combiner housing 2, with two waterproof rings built into the combiner housing. The cover plate 1 is fixed to the combiner housing 2 with M4 screws. One end of the combiner body is provided with a total output port. The combiner includes a grounding screw 4 and an output port 3. The cover plate 1 is fastened to the housing 2 with screws, which can meet the IP67 waterproof function and can be used in high altitude and extreme conditions. The combiner product has a frequency band of 700MHz-3800MHz, covering the entire frequency band from 2G to 5G communication. It has low latency and high remote suppression functions, effectively reducing product costs and ensuring consistency in assembly and debugging. It has the ability to guarantee sensitivity and product stability and can realize 7-input 1-output combining function.

[0106] The metal + low-pass combiner in this application can simultaneously process and separate high-frequency and low-frequency signals. By combining the metal and low-pass filter, signals in different frequency ranges can be filtered and isolated, thus achieving the purpose of signal processing and separation. Furthermore, because the combiner incorporates precise loop-string low-pass and band-stop filters, it can effectively suppress signal reflection and interference, improving signal quality and stability. It features low latency and high far-end rejection. Since the combiner does not require additional power or control signals, it has wide applications and value in wireless communication, RF testing, antenna distribution, and other fields. Moreover, due to its flexibility, the combiner can also be combined with other signal processing devices to meet the needs of different complex application scenarios.

[0107] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0108] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0109] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

[0110] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A multi-band low-delay combiner, characterized in that, include: The shell has internal storage space; At least one partition is disposed in the receiving space and divides the receiving space into multiple sub-chambers; Multiple input interfaces and one output interface are provided, with the multiple input interfaces and the output interface respectively disposed on both sides of the housing; The plurality of sub-chambers include an output common chamber, a 50-ohm common chamber, and several output filter module cavities. The filter module cavities and the output common chamber are connected to the two ends of the 50-ohm common chamber. The 50-ohm common chamber is provided with a series-connected band-stop filter chip and a 50-ohm adapter bar. The combiner also includes a PTPE fixed adapter block. The band-stop filter chip and the 50-ohm adapter bar are welded together and are both disposed on the PTPE fixed adapter block.

2. The combiner according to claim 1, characterized in that, The output common cavity is provided with a low-pass filter component and a PTPE dielectric block. The low-pass filter component includes several alternating low-impedance sections and high-impedance sections. The low-pass filter component is embedded in the PTPE dielectric block. One end of the PTPE dielectric block extends into the 50-ohm common cavity and is in contact with the top surface of the band-stop filter chip.

3. The combiner according to claim 2, characterized in that, The combiner also includes a gourd-string low-pass filter, the output end of which is soldered to the output interface, and the input end of which is soldered to the end of the PTPE dielectric block away from the 50-ohm common cavity.

4. The combiner according to claim 2, characterized in that, The housing is made of one-piece aluminum alloy. The top of the housing is equipped with a detachable waterproof cover. A rubber waterproof ring is provided at the connection between the waterproof cover and the housing. The waterproof ring has a U-shaped cross-section and is fitted around the edge of the top of the housing.

5. The combiner according to claim 2, characterized in that, The PTPE dielectric block is provided with a positioning platform at one end away from the 50-ohm common cavity. A copper connecting piece is welded to the output end of the low-pass filter component. The copper connecting piece is fastened to the top surface of the positioning platform by screws, and the other end of the connecting piece extends to the output interface and is welded to the signal end of the output interface.

6. The combiner according to claim 1, characterized in that, The combiner also includes a PTPE fixing rod. The filter module cavity is provided with a plurality of resonant columns. The PTPE fixing rod is arranged along the arrangement direction of the resonant columns, and the resonant column has a through hole in the middle that is adapted to the PTPE fixing rod. The PTPE fixing rod passes through the through hole to position the resonant column. The end of the resonant column away from the PTPE fixing rod is provided on the inner wall of the housing.

7. The combiner according to claim 6, characterized in that, The resonant pillar includes multiple resonant pillar groups, which are respectively disposed in the cavity of the corresponding filter module, wherein at least some of the resonant pillar groups are made of the same material.

8. The combiner according to claim 1, characterized in that, Each input interface is provided with an input port tap between itself and the corresponding filter module cavity. One end of the input port tap is welded to the input interface, and the other end is welded to the input end of the filter module in the corresponding filter module cavity to realize the transmission of input signals.

9. The combiner according to claim 1, characterized in that, The outer wall of the housing is provided with a number of fastening screws and grounding screws. The fastening screws are spaced apart along the edge of the housing to fix the housing to external equipment. The grounding screws are located on one side of the output interface to realize the grounding function of the combiner.

10. The combiner according to claim 1, characterized in that, The outer wall of the 50-ohm adapter rod is fitted with a PTPE insulating sleeve, and the PTPE insulating sleeve and the PTPE fixed adapter block are integrally injection molded.

Images