A phased array antenna

Abstract

The application relates to the technical field of phased array antennas, in particular to a phased array antenna which comprises a transmitting substrate, a receiving substrate, a first heat dissipation assembly, a second heat dissipation assembly and a heat sink, the first heat dissipation assembly comprises a first semiconductor refrigerating part and a first phase-change heat dissipation part, the cold end of the first semiconductor refrigerating part is used for absorbing the heat of a transmitting antenna unit array of the transmitting substrate, the first phase-change heat dissipation part is used for absorbing the heat of the hot end of the first semiconductor refrigerating part, the second heat dissipation assembly comprises a second semiconductor refrigerating part and a second phase-change heat dissipation part, the cold end of the second semiconductor refrigerating part is used for absorbing the heat of a receiving antenna unit array of the receiving substrate, the second phase-change heat dissipation part is used for absorbing the heat of the hot end of the second semiconductor refrigerating part, the heat sink is used for taking away the heat on the first phase-change heat dissipation part and the second phase-change heat dissipation part, and the heat dissipation capacity of the first semiconductor refrigerating part is greater than that of the second semiconductor refrigerating part. The temperature difference between the signal transmitting side and the signal receiving side is reduced.

Description

Technical Field

[0001] This invention relates to the field of phased array antenna technology, and more particularly to a phased array antenna. Background Technology

[0002] A phased array antenna is an antenna system composed of multiple spatially distributed antenna radiating elements. By changing the amplitude and / or phase of the excitation signal of each element through electronic control, the total radiation pattern (beam pointing, shape, and sidelobes) of the array is synthesized or scanned as required.

[0003] An existing phased array antenna includes a housing, a transmitting array, a receiving array, and a heat dissipation unit. The transmitting array, the receiving array, and the heat dissipation unit are installed inside the housing. The transmitting array and the receiving array are arranged at intervals. The heat dissipation unit faces the transmitting array and the receiving array. The transmitting array and the receiving array generate heat when they are working. The heat dissipation unit is used to dissipate heat from the transmitting array and the receiving array, thereby reducing the temperature of the transmitting array and the receiving array.

[0004] However, in existing phased array antennas, the power of the transmitting array is greater than that of the receiving array, and there is a large temperature difference between the transmitting and receiving arrays, which leads to a decrease in signal transmission accuracy and a shortened service life. Summary of the Invention

[0005] This invention provides a phased array antenna, which aims to solve the problem that existing phased array antennas have a large temperature difference between the transmitting and receiving arrays, resulting in decreased signal transmission accuracy and shortened service life.

[0006] To address the aforementioned problems, this invention provides a phased array antenna, comprising a transmitting substrate, a receiving substrate, a first heat dissipation component, a second heat dissipation component, and a heat sink. The transmitting substrate is provided with a transmitting antenna element array, and the receiving substrate is provided with a receiving antenna element array. The first heat dissipation component includes a first semiconductor cooling element and a first phase-change heat dissipation component. The first semiconductor cooling element is located between the transmitting substrate and the first phase-change heat dissipation component. The cold end of the first semiconductor cooling element is used to absorb the heat of the transmitting antenna element array, and the first phase-change heat dissipation component is used to absorb the heat of the hot end of the first semiconductor cooling element. The second heat dissipation component includes a second semiconductor cooling element and a second phase change heat dissipation element. The second semiconductor cooling element is located between the receiving substrate and the second phase change heat dissipation element. The cold end of the second semiconductor cooling element is used to absorb the heat of the receiving antenna unit array, and the second phase change heat dissipation element is used to absorb the heat of the hot end of the second semiconductor cooling element. The heat sink is used to remove heat from the first phase change heat sink and the second phase change heat sink, and the heat dissipation capacity of the first semiconductor refrigeration component is greater than that of the second semiconductor refrigeration component.

[0007] Optionally, the area of ​​the first phase change heat sink is larger than the area of ​​the second phase change heat sink.

[0008] Optionally, the radiator includes a cooling fan; The first heat dissipation component further includes a first finned plate, which contacts the side of the first phase change heat sink that is opposite to the first semiconductor cooling component. The second heat dissipation component further includes a second finned plate, which contacts the side of the second phase change heat sink that is away from the second semiconductor cooling component; The cooling fan is used to blow air onto the first finned plate and the second finned plate.

[0009] Optionally, the phased array antenna further includes a mounting plate; The mounting plate is located between the first phase change heat sink and the first semiconductor cooling component; The mounting plate can transfer the heat from the first semiconductor cooling element to the first phase change heat sink, and the mounting plate can transfer the heat from the second semiconductor cooling element to the second phase change heat sink.

[0010] Optionally, the first finned plate is provided with a first heat dissipation air duct, and the second finned plate is provided with a second heat dissipation air duct; The mounting plate is provided with multiple heat dissipation fins, which are arranged at intervals and form a first air inlet duct, a second air inlet duct, a first air outlet duct, and a second air outlet duct on the mounting plate. The first heat dissipation air duct is located between the first air inlet air duct and the first air outlet air duct, and the second heat dissipation air duct is located between the second air inlet air duct and the second air outlet air duct.

[0011] Optionally, the mounting plate is further provided with an air inlet channel and an air outlet channel, wherein the air inlet channel is located between the first air inlet duct and the second air inlet duct, and the air outlet channel is located between the first air outlet duct and the second air outlet duct; The cooling fan is installed in the air intake channel, and the cooling fan faces the first cooling air duct and the second cooling air duct.

[0012] Optionally, the phased array antenna further includes a housing, on which a first air inlet, a second air inlet, a first air outlet, and a second air outlet are provided; The first air inlet is directly opposite the first air inlet duct, the second air inlet is directly opposite the second air inlet duct, the first air outlet is directly opposite the first air outlet duct, and the second air outlet is directly opposite the second air outlet duct.

[0013] Optionally, the first heat dissipation component further includes a first thermal pad, which is located between the mounting plate and the first thermoelectric cooler, and is used to transfer heat from the first thermoelectric cooler to the mounting plate. The second heat dissipation component further includes a second thermal pad, which is located between the mounting plate and the second semiconductor cooling device, and is used to transfer heat from the second semiconductor cooling device to the mounting plate.

[0014] Optionally, the first heat dissipation component further includes a first heat-conducting plate, which is located between the first phase change heat sink and the emitting substrate, and is used to transfer the heat of the emitting substrate to the first semiconductor cooling component. The second heat dissipation component further includes a second heat-conducting plate, which is located between the second phase change heat sink and the receiving substrate. The second heat-conducting plate is used to transfer the heat from the receiving substrate to the second semiconductor cooling component.

[0015] Optionally, the phased array antenna further includes an isolation strip located between the transmitting substrate and the receiving substrate.

[0016] According to the phased array antenna provided in the embodiments of the present invention, a first semiconductor cooler absorbs the heat generated by the transmitting antenna element array and transfers the heat to a first phase-change heat sink, where the heat sink removes the heat from the first phase-change heat sink, thereby reducing the temperature of the transmitting antenna element array. A second semiconductor cooler absorbs the heat generated by the receiving antenna element array and transfers the heat to a second phase-change heat sink, where the heat sink removes the heat from the second phase-change heat sink, thereby reducing the temperature of the receiving antenna element array. Since the heat dissipation capacity of the first semiconductor cooler is greater than that of the second semiconductor cooler, and the power of the first semiconductor cooler can be adjusted to cool the transmitting antenna element array, the first semiconductor cooler dissipates heat from the transmitting antenna element array more quickly, thereby reducing the temperature rise caused by the high power of the transmitting antenna element array, and further reducing the temperature difference between the signal transmitting side and the signal receiving side of the phased array antenna, improving signal transmission accuracy and extending service life. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a phased array antenna provided in an embodiment of the present invention; Figure 2 This is an assembly diagram of the transmitting substrate, receiving substrate, mounting plate, and isolation strip; Figure 3 for Figure 1 Internal decomposition diagram; Figure 4 This is a ventilation diagram of a phased array antenna provided in an embodiment of the present invention.

[0019] Reference numerals in the accompanying drawings: 1. Outer shell; 2. Front shell; 3. Rear cover; 4. Mounting plate; 5. Isolation strip; 6. Transmitting substrate; 7. Transmitting antenna array; 8. Transmitting antenna element; 9. Receiving substrate; 10. Receiving antenna array; 11. Receiving antenna element; 12. Air inlet; 13. Middle section; 14. Air outlet; 15. Heat sink fins; 16. First mounting slot; 17. Second mounting slot; 18. Cable exit hole; 19. RF cable exit cover; 20. Heat sink; 21. First air inlet duct; 22. Second air inlet duct; 23. Air inlet channel; 24. First air outlet duct; 25. Second air outlet duct; 26. Air outlet vent 27. Cooling fan; 28. First finned plate; 29. ​​First fin; 30. First cooling duct; 31. First phase change heat sink; 32. First thermal pad; 33. First semiconductor cooling component; 34. First thermoelectric chip; 35. First heat-conducting plate; 36. Second finned plate; 37. Second fin; 38. Second cooling duct; 39. Second phase change heat sink; 40. Second thermal pad; 41. Second semiconductor cooling component; 42. Second thermoelectric chip; 43. Second heat-conducting plate; 44. First air inlet; 45. Second air inlet; 46. Air inlet; 47. First air outlet; 48. Second air outlet; 49. Air outlet. Detailed Implementation

[0020] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] like Figures 1 to 4As shown, an embodiment of the present invention provides a phased array antenna, including a transmitting substrate 6, a receiving substrate 9, a first heat dissipation component, a second heat dissipation component, and a heat sink 20. The transmitting substrate 6 is provided with a transmitting antenna element array 7, and the receiving substrate 9 is provided with a receiving antenna element array. The first heat dissipation component includes a first semiconductor cooler 33 and a first phase change heat sink 31. The first semiconductor cooler 33 is located between the transmitting substrate 6 and the first phase change heat sink 31. The cold end of the first semiconductor cooler 33 is used to absorb the heat of the transmitting antenna element array 7, and the first phase change heat sink 31 is used to absorb the heat of the hot end of the first semiconductor cooler 33.

[0023] The second heat dissipation component includes a second semiconductor cooler 41 and a second phase change heat dissipation component 39. The second semiconductor cooler 41 is located between the receiving substrate 9 and the second phase change heat dissipation component 39. The cold end of the second semiconductor cooler 41 is used to absorb the heat of the receiving antenna unit array 10, and the second phase change heat dissipation component 39 is used to absorb the heat of the hot end of the second semiconductor cooler 41.

[0024] The heat sink 20 is used to remove heat from the first phase change heat sink 31 and the second phase change heat sink 39. The heat dissipation capacity of the first semiconductor cooling element 33 is greater than that of the second semiconductor cooling element 41.

[0025] In this embodiment, the first semiconductor cooler 33 absorbs the heat generated by the transmitting antenna array 7 and transfers the heat to the first phase change heat sink 31. The heat sink 20 then removes the heat from the first phase change heat sink 31, thereby reducing the temperature of the transmitting antenna array 7. The second semiconductor cooler 41 absorbs the heat generated by the receiving antenna array 10 and transfers the heat to the second phase change heat sink 39. The heat sink 20 then removes the heat from the second phase change heat sink 39, thereby reducing the temperature of the receiving antenna array 10. Since the heat dissipation capacity of the first semiconductor cooler 33 is greater than that of the second semiconductor cooler 41, the first semiconductor cooler 33 dissipates heat from the transmitting antenna array 7 more quickly, thereby reducing the temperature rise caused by the high power of the transmitting antenna array 7, and further reducing the temperature difference between the transmitting and receiving arrays, improving signal transmission accuracy, and extending service life.

[0026] In this embodiment, the transmitting antenna element array 7 includes a plurality of transmitting antenna elements 8 arranged in a rectangular array on the transmitting substrate 6. Specifically, the transmitting antenna elements 8 can be radiators such as microstrip patches, slots, and dipoles.

[0027] The receiving antenna element array 10 includes multiple receiving antenna elements 11 arranged in a rectangular array on the receiving substrate 9. Specifically, the receiving antenna elements 11 can be radiators such as microstrip patches, slots, and dipoles.

[0028] In this embodiment, the first semiconductor cooling device 33 includes a plurality of first thermoelectric chips 34, and the second semiconductor cooling device 41 includes a plurality of second thermoelectric chips 42, wherein the number of first thermoelectric chips 34 is greater than the number of second thermoelectric chips 42.

[0029] The number of first thermoelectric chips 34 is greater than the number of second thermoelectric chips 42, making the heat dissipation capacity of the first semiconductor cooling element 33 greater than that of the second semiconductor cooling element 41.

[0030] In this embodiment, a plurality of first thermoelectric chips 34 are arranged in a rectangular array on the first semiconductor refrigeration element 33, and a plurality of second thermoelectric chips 42 are arranged in a rectangular array on the second semiconductor refrigeration element 41.

[0031] In this embodiment, the cold end of the first thermoelectric chip 34 faces the transmitting antenna unit array 7. When the first thermoelectric chip 34 is powered on, it utilizes the Peltier effect to achieve active and precise cooling. The cold end of the first thermoelectric chip 34 continuously absorbs the heat generated by the transmitting antenna unit 8. The absorbed heat is rapidly transferred to the hot end of the first thermoelectric chip 34 through internal thermoelectric conversion, completing the directional transfer of heat and quickly suppressing the temperature rise of the transmitting antenna unit 8. This achieves primary temperature control of the transmitting antenna unit 8. The transmitting antenna unit 8 can be cooled by adjusting the power of the first thermoelectric chip 34.

[0032] The first phase change heat sink 31 contains a solid phase change material. When the first phase change heat sink 31 absorbs heat transferred from the hot end of the first thermoelectric chip 34, the solid phase change material inside the first phase change heat sink 31 gradually changes from solid to a solid-liquid mixture. Utilizing the large latent heat characteristic of the solid material itself, it absorbs and stores a large amount of heat, thus achieving two-stage temperature control for the transmitting antenna unit 8.

[0033] The cold end of the second thermoelectric chip 42 faces the receiving antenna unit array 10. When the second thermoelectric chip 42 is powered on, its cold end continuously absorbs the heat generated by the receiving antenna unit 11. The absorbed heat is rapidly transferred to the hot end of the second thermoelectric chip 42 through internal thermoelectric conversion, completing the directional transfer of heat and quickly suppressing the temperature rise of the receiving antenna unit 11, thus achieving primary temperature control of the receiving antenna unit 11. The temperature of the receiving antenna unit 11 can be reduced by adjusting the power of the second thermoelectric chip 42.

[0034] The second phase change heat sink 39 contains a solid phase change material. When the second phase change heat sink 39 absorbs the heat transferred by the second semiconductor cooling device 41, the solid phase change material inside the second phase change heat sink 39 gradually changes from solid to solid-liquid mixed state. By utilizing the large latent heat characteristic of the solid material itself, a large amount of heat is absorbed and stored, thereby achieving two-stage temperature control of the receiving antenna unit array 10.

[0035] In this embodiment, the first phase-change heat sink 31 and the second phase-change heat sink 39, utilizing their large latent heat characteristics, can smooth temperature fluctuations and offset the heat dissipation difference between the transmitting antenna unit 8 and the receiving antenna unit 11, thereby reducing the temperature difference between the transmitting antenna unit 8 and the receiving antenna unit 11, making the temperature fields around the transmitting substrate 6 and the receiving substrate 9 consistent. Even when the phased array antenna is in a transient operating condition with intermittent operation and sudden power changes, the first phase-change heat sink 31 and the second phase-change heat sink 39 can quickly buffer thermal shocks, preventing sudden temperature rises and falls in the transmitting antenna unit 8 and the receiving antenna unit 11.

[0036] In one embodiment, the area of ​​the first phase change heat sink 31 is larger than the area of ​​the second phase change heat sink 39.

[0037] In this embodiment, both the first phase change heat sink 31 and the second phase change heat sink 39 are rectangular. The area of ​​the first phase change heat sink 31 is larger than the area of ​​the second phase change heat sink 39, which makes the heat dissipation capacity of the first phase change heat sink 31 greater than that of the second phase change heat sink 39. This further improves the overall heat dissipation capacity of the first heat dissipation component, accelerates the heat dissipation of the transmitting antenna unit array 7, and further reduces the temperature difference between the transmitting antenna unit array 7 and the receiving antenna unit array 10.

[0038] In one embodiment, the heat sink 20 includes a cooling fan 27, the first heat sink assembly further includes a first finned plate 28, the first finned plate 28 is in contact with the side of the first phase change heat sink 31 that is away from the first semiconductor cooler 33, and the second heat sink assembly further includes a second finned plate 36, the second finned plate 36 is in contact with the side of the second phase change heat sink 39 that is away from the second semiconductor cooler 41.

[0039] The cooling fan 27 is used to blow air onto the first finned plate 28 and the second finned plate 36.

[0040] In this embodiment, the heat sink 20 includes a cooling fan 27. The side of the first finned plate 28 facing the first phase change heat sink 31 is in contact with the first phase change heat sink 31. The side of the first finned plate 28 facing away from the first phase change heat sink 31 is provided with a plurality of first fins 29. The plurality of first fins 29 are arranged at intervals. The heat absorbed by the first finned plate 28 will be concentrated and transferred to the first fins 29. When the cooling fan 27 is working, it blows air toward the first fins 29, thereby quickly removing the heat on the first finned plate 28.

[0041] The side of the second finned plate 36 facing the second phase change heat sink 39 is in contact with the second phase change heat sink 39. The side of the second finned plate 36 facing away from the second phase change heat sink 39 is provided with a plurality of second fins 37, which are arranged at intervals. The heat absorbed by the second finned plate 36 will be concentrated and transferred to the second fins 37. When the cooling fan 27 is working, it blows air toward the second fins 37, thereby quickly removing the heat on the second finned plate 36.

[0042] In other embodiments, the first fin 29 and the second fin 37 can directly contact the metal shell 1 of the phased array antenna, and heat transfer between the first fin 29 and the second fin 37 and the metal shell 1 is achieved through the contact between the first fin 29 and the second fin 37 and the metal shell 1.

[0043] In other embodiments, the radiator 20 may also include a liquid cooling plate that is in contact with the first phase change heat sink 31 and the second phase change heat sink 39, and the heat on the first phase change heat sink 31 and the second phase change heat sink 39 is carried away by the continuously flowing liquid in the liquid cooling plate.

[0044] In one embodiment, the phased array antenna further includes a mounting plate 4, which is located between the first phase change heat sink 31 and the first semiconductor cooler 33. The mounting plate 4 can transfer the heat from the first semiconductor cooler 33 to the first phase change heat sink 31, and the mounting plate 4 can transfer the heat from the second semiconductor cooler 41 to the second phase change heat sink 39.

[0045] The first finned plate 28 is provided with a first heat dissipation duct 30, and the second finned plate 36 is provided with a second heat dissipation duct 38.

[0046] The mounting plate 4 is provided with multiple heat dissipation fins 15, which are arranged at intervals and form a first air inlet duct 21, a second air inlet duct 22, a first air outlet duct 24 and a second air outlet duct 25 on the mounting plate 4.

[0047] The first heat dissipation duct 30 is located between the first air inlet duct 21 and the first air outlet duct 24, and the second heat dissipation duct 38 is located between the second air inlet duct 22 and the second air outlet duct 25.

[0048] In this embodiment, the mounting plate 4 is a metal plate, and the heat dissipation fins 15 are integrally formed with the mounting plate 4. Multiple heat dissipation fins 15 are arranged at intervals on one side of the mounting plate 4 facing away from the transmitting substrate 6 and the receiving substrate 9. The interval between any two adjacent heat dissipation fins 15 forms an air duct for airflow.

[0049] Multiple first fins 29 are arranged at intervals on a first fin plate 28, and the interval between any two adjacent first fins 29 forms a first heat dissipation duct 30. Multiple second fins 37 are arranged at intervals on a second fin plate 36, and the interval between any two adjacent second fins 37 forms a second heat dissipation duct 38.

[0050] The mounting plate 4 includes an air inlet 12, a middle section 13, and an air outlet 14. The middle section 13 is provided with a first mounting groove 16 and a second mounting groove 17. The first mounting groove 16 and the second mounting groove 17 are spaced apart. Except for the first mounting groove 16 and the second mounting groove 17, heat dissipation fins 15 are provided on the air inlet 12, the air outlet 14, and the middle section 13.

[0051] The thickness of the first phase change heat sink 31 is the same as the depth of the first mounting groove 16, so that the side of the first phase change heat sink 31 facing away from the first semiconductor cooler 33 is flush with the side of the mounting plate 4 facing away from the first semiconductor cooler 33. The mounting plate 4 has a blank mounting portion around the circumferential edge of the first mounting groove 16. The circumferential edge of the first fin plate 28 is screwed to the blank mounting portion, so that the side of the first fin 29 facing the first semiconductor cooler 33 is in contact with the side of the first phase change heat sink 31 facing away from the first semiconductor cooler 33.

[0052] The height and thickness of the first fin 29 on the first fin plate 28 are the same as those of the heat dissipation fin 15. The spacing between two adjacent first fins 29 is the same as the spacing between two connected heat dissipation fins 15. The end of the first fin 29 away from the air outlet 14 is connected to the end of the heat dissipation fin 15 on the middle part 13 away from the air outlet 14. The end of the first fin 29 away from the air inlet 12 is connected to the end of the heat dissipation fin 15 on the air outlet 14 near the air inlet 12. This makes the first fin 29 on the first fin plate 28 and the heat dissipation fin 15 form a conformal design, so that the first fin 29 and the heat dissipation fin 15 transition smoothly and facilitate airflow.

[0053] The heat dissipation fins 15 located on the side of the air inlet 12 away from the second phase change heat sink 39 are inclined. The distance between the end of the heat dissipation fin 15 away from the air outlet 14 and the second phase change heat sink 39 is greater than the distance between the end of the heat dissipation fin 15 near the air outlet 14 and the second phase change heat sink 39. The interval between two adjacent heat dissipation fins 15 in this part forms the first air inlet duct 21.

[0054] The heat dissipation fins 15 located on the side of the air outlet 14 away from the second phase change heat sink 39 are arc-shaped. The end of the heat dissipation fins 15 in this part extends to the side of the mounting plate 4 away from the second phase change heat sink 39. The interval between two adjacent heat dissipation fins 15 in this part forms the first air outlet duct 24.

[0055] The thickness of the second phase change heat sink 39 is the same as the depth of the second mounting groove 17, so that the side of the second phase change heat sink 39 facing away from the second semiconductor cooler 41 is flush with the side of the mounting plate 4 facing away from the second semiconductor cooler 41. The mounting plate 4 has a blank mounting portion around the circumferential edge of the second mounting groove 17. The circumferential edge of the second fin plate 36 is screwed to the blank mounting portion, so that the side of the second fin 37 facing the second semiconductor cooler 41 contacts the side of the second phase change heat sink 39 facing away from the second semiconductor cooler 41.

[0056] The height and thickness of the second fin 37 on the second fin plate 36 are the same as those of the heat dissipation fin 15. The spacing between two adjacent second fins 37 is the same as the spacing between two connected heat dissipation fins 15. The end of the second fin 37 away from the air outlet 14 is connected to the end of the heat dissipation fin 15 on the middle part 13 away from the air outlet 14. The end of the second fin 37 away from the air inlet 12 is connected to the end of the heat dissipation fin 15 on the air outlet 14 near the air inlet 12. This makes the second fin 37 on the second fin plate 36 conform to the heat dissipation fin 15, so that the second fin 37 and the heat dissipation fin 15 have a smooth transition and facilitate airflow.

[0057] The heat dissipation fins 15 located on the side of the air inlet 12 away from the first phase change heat sink 31 are inclined. The distance between the end of the heat dissipation fin 15 away from the air outlet 14 and the first phase change heat sink 31 is greater than the distance between the end of the heat dissipation fin 15 near the air outlet 14 and the first phase change heat sink 31. The interval between two adjacent heat dissipation fins 15 in this part forms a second air inlet duct 22.

[0058] The heat dissipation fins 15 located on the side of the air outlet 14 away from the first phase change heat sink 31 are arc-shaped. The end of the heat dissipation fins 15 in this part extends to the side of the mounting plate 4 away from the first phase change heat sink 31. The interval between two adjacent heat dissipation fins 15 in this part forms a second air outlet duct 25.

[0059] In one embodiment, the mounting plate 4 is further provided with an air inlet channel 23 and an air outlet channel 26. The air inlet channel 23 is located between the first air inlet channel 21 and the second air inlet channel 22, and the air outlet channel 26 is located between the first air outlet channel 24 and the second air outlet channel 25.

[0060] Cooling fan 27 is installed in air intake channel 23, and cooling fan 27 is directed toward first cooling air duct 30 and second cooling air duct 38.

[0061] In this embodiment, the heat dissipation fins 15 on the air inlet 12 between the first air inlet duct 21 and the second air inlet duct 22 are perpendicular to the side edge of the mounting plate 4 away from the air outlet 14. The middle part 13 of the heat dissipation fins 15 in this part is provided with a relief groove, and the cooling fan 27 is screwed into the relief groove.

[0062] The heat dissipation fins 15 on the air outlet 14, located between the first air outlet duct 24 and the second air outlet duct 25, are perpendicular to the side edge of the mounting plate 4 away from the air inlet 12.

[0063] The first fin 29 and the second fin 37 are arranged opposite each other. The first fin 29 on the first fin plate 28 and the heat dissipation fin 15 on the middle part 13 are both arc-shaped, making the first heat dissipation air duct 30 arc-shaped. The end of the first heat dissipation air duct 30 away from the air outlet 14 faces the location of the cooling fan 27, facilitating the airflow from the air inlet 12 to enter the first heat dissipation air duct 30. The second fin 37 on the second fin plate 36 and the heat dissipation fin 15 on the middle part 13 are both arc-shaped, making the second heat dissipation air duct 38 arc-shaped. The end of the second heat dissipation air duct 38 away from the air outlet 14 faces the location of the cooling fan 27, facilitating the airflow from the air inlet 12 to enter the second heat dissipation air duct 38.

[0064] In one embodiment, the phased array antenna further includes a housing 1, which has a first air inlet 44, a second air inlet 45, a first air outlet 47, and a second air outlet 48.

[0065] The first air inlet 44 is directly opposite the first air inlet duct 21, the second air inlet 45 is directly opposite the second air inlet duct 22, the first air outlet 47 is directly opposite the first air outlet duct 24, and the second air outlet 48 is directly opposite the second air outlet duct 25.

[0066] In this embodiment, the outer shell 1 includes a front shell 2 and a rear cover 3. The mounting plate 4 is located between the front shell 2 and the rear cover 3. The front shell 2 is screwed to the side of the mounting plate 4 facing away from the rear cover 3, and the rear cover 3 is screwed to the side of the mounting plate 4 facing away from the front shell 2.

[0067] The cooling fan 27 is located within the space enclosed by the mounting plate 4 and the rear cover 3. The rear cover 3 is generally shaped like a truncated quadrangular pyramid. The first air inlet 44 and the first air outlet 47 are spaced apart on the side of the rear cover 3 near the first phase change heat sink 31. The second air inlet 45 and the second air outlet 48 are spaced apart on the side of the rear cover 3 near the second phase change heat sink 39.

[0068] An air inlet 46 is provided on the rear cover 3 between the first air inlet 44 and the second air inlet 45, and the air inlet 46 is directly opposite the air inlet channel 23. An air outlet 49 is provided on the rear cover 3 between the first air outlet 47 and the second air outlet 48, and the air outlet 49 is directly opposite the air outlet channel 26.

[0069] When the cooling fan 27 is started, the outside airflow enters the outer casing 1 through the first air inlet 44, the second air inlet 45 and the air inlet 46, and exits the outer casing 1 through the first air outlet 47, the second air outlet 48 and the air outlet 49, thereby forming a high-speed airflow in the space between the rear cover 3 and the mounting plate 4. The high-speed airflow continuously washes the surface of the first fin 29 and the second fin 37, and through forced convection heat exchange, it continuously carries heat out of the outer casing 1, realizing the heat release and regeneration of the phase change material, ensuring that the phase change material is always in a highly efficient heat storage state, and avoiding the loss of temperature control ability due to the completion of phase change.

[0070] In one embodiment, the first heat dissipation component further includes a first thermal pad 32, which is located between the mounting plate 4 and the first semiconductor cooling element 33. The first thermal pad 32 is used to transfer heat from the first semiconductor cooling element 33 to the mounting plate 4.

[0071] The second heat dissipation component also includes a second thermal pad 40, which is located between the mounting plate 4 and the second semiconductor cooling element 41. The second thermal pad 40 is used to transfer the heat of the second semiconductor cooling element 41 to the mounting plate 4.

[0072] In this embodiment, both the first thermal pad 32 and the second thermal pad 40 are made of high thermal conductivity silicone.

[0073] The side of the first thermal pad 32 facing the first semiconductor refrigeration element 33 is in contact with the first semiconductor refrigeration element 33, and the side of the first thermal pad 32 facing away from the first semiconductor refrigeration element 33 is in contact with the side of the mounting plate 4 facing the first semiconductor refrigeration element 33. The first thermal pad 32 can improve the heat transfer efficiency between the first semiconductor refrigeration element 33 and the mounting plate 4 and increase the heat transfer rate.

[0074] The side of the second thermal pad 40 facing the second semiconductor cooler 41 is in contact with the second semiconductor cooler 41, and the side of the second thermal pad 40 facing away from the second semiconductor cooler 41 is in contact with the side of the mounting plate 4 facing the second semiconductor cooler 41. The second thermal pad 40 can improve the heat transfer efficiency between the second semiconductor cooler 41 and the mounting plate 4 and increase the heat transfer rate.

[0075] In other embodiments, the first thermal pad 32 and the second thermal pad 40 may also be made of elastic thermally conductive foam panels, ceramic thermally conductive plates, and graphite thermally conductive sheets.

[0076] In one embodiment, the first heat dissipation component further includes a first heat-conducting plate 35, which is located between the first phase change heat sink 31 and the emitting substrate 6. The first heat-conducting plate 35 is used to transfer the heat of the emitting substrate 6 to the first semiconductor cooling component 33.

[0077] The second heat dissipation component also includes a second heat-conducting plate 43, which is located between the second phase change heat sink 39 and the receiving substrate 9. The second heat-conducting plate 43 is used to transfer the heat from the receiving substrate 9 to the second semiconductor cooling component 41.

[0078] In this embodiment, the transmitting substrate 6 is screwed to the mounting plate 4, and the receiving substrate 9 is screwed to the mounting plate 4.

[0079] Both the first heat-conducting plate 35 and the second heat-conducting plate 43 are metal plates.

[0080] The side of the first heat-conducting plate 35 facing the transmitting substrate 6 is in contact with the transmitting antenna element array 7, and the side of the first heat-conducting plate 35 facing away from the transmitting substrate 6 is in contact with the side of the first semiconductor cooling element 33 facing the transmitting substrate 6. The first heat-conducting plate 35 can improve the heat transfer efficiency between the first semiconductor cooling element 33 and the transmitting antenna element array 7, thereby increasing the heat transfer rate. The first heat-conducting plate 35 can also ensure that the heat on the transmitting antenna element array 7 is evenly distributed, preventing the accumulation of local hot spots in the transmitting antenna element array 7.

[0081] The side of the second heat-conducting plate 43 facing the receiving substrate 9 contacts the receiving antenna unit array 10, and the side of the second heat-conducting plate 43 facing away from the receiving substrate 9 contacts the side of the second semiconductor cooling element 41 facing the receiving substrate 9. The second heat-conducting plate 43 can improve the heat transfer efficiency between the second semiconductor cooling element 41 and the receiving antenna unit array 10, thereby increasing the heat transfer rate. The second heat-conducting plate 43 can also ensure that the heat on the receiving antenna unit array 10 is evenly distributed, preventing the accumulation of local hot spots in the receiving antenna unit array 10.

[0082] In one embodiment, the phased array antenna further includes an isolation strip 5 located between the transmitting substrate 6 and the receiving substrate 9.

[0083] In this embodiment, the isolation strip 5 is a polyurethane heat-insulating isolation strip 5, which is located between the transmitting substrate 6 and the receiving substrate 9, and is screwed to the mounting plate 4.

[0084] The isolation strip 5 can completely block heat crosstalk between the transmitting substrate 6 and the receiving substrate 9, preventing the high heat on the transmitting substrate 6 from being conducted to the receiving substrate 9 and thus aggravating the temperature difference.

[0085] In this embodiment, the mounting plate 4 is provided with a wire outlet hole 18, and the phased array antenna also includes a radio frequency (RF) wire outlet cover plate 19. The RF wire outlet cover plate 19 is used to block the wire outlet hole 18, which protects the array surface and reserves a RF wiring channel while not interfering with the airflow of heat dissipation, thus ensuring a balance between the airtightness of the heat dissipation structure and the heat dissipation efficiency.

[0086] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] According to the phased array antenna provided in the embodiment of the present invention, the first semiconductor cooler 33 absorbs the heat generated by the transmitting antenna element array 7 and transfers the heat to the first phase change heat sink 31. The heat sink 20 removes the heat from the first phase change heat sink 31, thereby reducing the temperature of the transmitting antenna element array 7. The second semiconductor cooler 41 absorbs the heat generated by the receiving antenna element array 10 and transfers the heat to the second phase change heat sink 39. The heat sink 20 removes the heat from the second phase change heat sink 39, thereby reducing the temperature of the receiving antenna element array 10. Since the heat dissipation capacity of the first semiconductor cooler 33 is greater than that of the second semiconductor cooler 41, the first semiconductor cooler 33 dissipates heat from the transmitting antenna element array 7 more quickly, thereby reducing the temperature rise caused by the high power of the transmitting antenna element array 7, and further reducing the temperature difference between the transmitting array and the receiving array, improving signal transmission accuracy, and increasing service life.

[0088] In addition, the phased array antenna provided in this embodiment of the invention achieves high-precision temperature control of the antenna unit (phased array chip) under all working conditions and for a long time through a three-layer structure of active cooling by semiconductor cooling components, uniform temperature storage by phase change heat dissipation components, and enhanced heat dissipation by air cooling, which works in a closed loop. This completely solves the industry problems of large temperature difference, local overheating and uneven heat dissipation between the transmitting antenna unit 8 and the receiving antenna unit 11, ensuring stable signal transmission and meeting the service life of the components in the phased array antenna.

[0089] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A phased array antenna, characterized in that, The device includes a transmitting substrate (6), a receiving substrate (9), a first heat dissipation component, a second heat dissipation component, and a heat sink (20). The transmitting substrate (6) is provided with a transmitting antenna unit array (7), and the receiving substrate (9) is provided with a receiving antenna unit array. The first heat dissipation component includes a first semiconductor cooling element (33) and a first phase change heat sink (31). The first semiconductor cooling element (33) is located between the transmitting substrate (6) and the first phase change heat sink (31). The cold end of the first semiconductor cooling element (33) is used to absorb the heat of the transmitting antenna unit array (7), and the first phase change heat sink (31) is used to absorb the heat of the hot end of the first semiconductor cooling element (33). The second heat dissipation component includes a second semiconductor cooling element (41) and a second phase change heat dissipation element (39). The second semiconductor cooling element (41) is located between the receiving substrate (9) and the second phase change heat dissipation element (39). The cold end of the second semiconductor cooling element (41) is used to absorb the heat of the receiving antenna unit array (10), and the second phase change heat dissipation element (39) is used to absorb the heat of the hot end of the second semiconductor cooling element (41). The heat sink (20) is used to remove heat from the first phase change heat sink (31) and the second phase change heat sink (39), and the heat dissipation capacity of the first semiconductor refrigeration element (33) is greater than that of the second semiconductor refrigeration element (41).

2. The phased array antenna according to claim 1, characterized in that, The area of ​​the first phase change heat sink (31) is larger than the area of ​​the second phase change heat sink (39).

3. The phased array antenna according to claim 1, characterized in that, The radiator (20) includes a cooling fan (27); The first heat dissipation component further includes a first finned plate (28), which contacts the side of the first phase change heat sink (31) that is away from the first semiconductor cooling component (33); The second heat dissipation component also includes a second finned plate (36), which contacts the side of the second phase change heat sink (39) that is away from the second semiconductor cooling component (41); The cooling fan (27) is used to blow air onto the first finned plate (28) and the second finned plate (36).

4. The phased array antenna according to claim 3, characterized in that, The phased array antenna also includes a mounting plate (4). The mounting plate (4) is located between the first phase change heat sink (31) and the first semiconductor cooling component (33); The mounting plate (4) can transfer the heat of the first semiconductor cooling element (33) to the first phase change heat sink (31), and the mounting plate (4) can transfer the heat of the second semiconductor cooling element (41) to the second phase change heat sink (39).

5. The phased array antenna according to claim 4, characterized in that, The first finned plate (28) is provided with a first heat dissipation air duct (30), and the second finned plate (36) is provided with a second heat dissipation air duct (38). The mounting plate (4) is provided with a plurality of heat dissipation fins (15), which are arranged at intervals and form a first air inlet duct (21), a second air inlet duct (22), a first air outlet duct (24) and a second air outlet duct (25) on the mounting plate (4). The first heat dissipation duct (30) is located between the first air inlet duct (21) and the first air outlet duct (24), and the second heat dissipation duct (38) is located between the second air inlet duct (22) and the second air outlet duct (25).

6. The phased array antenna according to claim 5, characterized in that, The mounting plate (4) is also provided with an air inlet channel (23) and an air outlet channel (26). The air inlet channel (23) is located between the first air inlet duct (21) and the second air inlet duct (22), and the air outlet channel (26) is located between the first air outlet duct (24) and the second air outlet duct (25). The cooling fan (27) is installed in the air inlet channel (23) and the cooling fan (27) faces the first cooling air duct (30) and the second cooling air duct (38).

7. The phased array antenna according to claim 5, characterized in that, The phased array antenna also includes a housing (1), which is provided with a first air inlet (44), a second air inlet (45), a first air outlet (47) and a second air outlet (48). The first air inlet (44) is directly opposite the first air inlet duct (21), the second air inlet (45) is directly opposite the second air inlet duct (22), the first air outlet (47) is directly opposite the first air outlet duct (24), and the second air outlet (48) is directly opposite the second air outlet duct (25).

8. The phased array antenna according to claim 4, characterized in that, The first heat dissipation component further includes a first thermal pad (32), which is located between the mounting plate (4) and the first semiconductor cooling element (33). The first thermal pad (32) is used to transfer the heat of the first semiconductor cooling element (33) to the mounting plate (4). The second heat dissipation component further includes a second thermal pad (40), which is located between the mounting plate (4) and the second semiconductor cooling element (41). The second thermal pad (40) is used to transfer the heat of the second semiconductor cooling element (41) to the mounting plate (4).

9. The phased array antenna according to claim 1, characterized in that, The first heat dissipation component further includes a first heat-conducting plate (35), which is located between the first phase change heat sink (31) and the emission substrate (6). The first heat-conducting plate (35) is used to transfer the heat of the emission substrate (6) to the first semiconductor cooling component (33). The second heat dissipation component further includes a second heat-conducting plate (43), which is located between the second phase change heat sink (39) and the receiving substrate (9). The second heat-conducting plate (43) is used to transfer the heat of the receiving substrate (9) to the second semiconductor cooling component (41).

10. The phased array antenna according to claim 1, characterized in that, The phased array antenna also includes an isolation strip (5), which is located between the transmitting substrate (6) and the receiving substrate (9).

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