A high-uniformity nano-spherical bump array antenna and a preparation method thereof

Abstract

The application provides a high-uniformity nano spherical bump array antenna and a preparation method thereof. 60 The powder is prepared into a stock solution with a target concentration by using an inert organic solvent; the stock solution is uniformly sprayed onto the silver foil substrate under an inert atmosphere to obtain a sprayed liquid film with a thickness of 5-15 microns; the organic solvent in the sprayed liquid film is volatilized at room temperature to form bumps; the silver foil substrate with the bumps is immersed into a curing agent for curing and then cleaned and dried to obtain the antenna with the bump array.

Description

Technical Field

[0001] This application relates to the field of antenna fabrication technology, and in particular to a high-uniformity nanospherical bump array antenna and its fabrication method. Background Technology

[0002] Existing nanoarray antennas mostly rely on complex processes such as photolithography, etching, and deposition, which are expensive, cumbersome, and costly to produce. At the same time, traditional antenna bumps are difficult to form a regular and uniform spherical structure, resulting in poor uniformity and consistency. Most antenna bumps have a fixed spacing, and if different application scenarios are required, the mask must be redesigned or the entire process must be adjusted. This results in poor versatility, long cycle time, and high cost, making it difficult to meet the industrial production needs of low cost, high efficiency, and multi-specification compatibility. Summary of the Invention

[0003] This application aims to at least partially solve one of the technical problems in the related art. To this end, this application proposes a high-uniformity nanospherical bump array antenna and its fabrication method, wherein the nanospherical bumps on the antenna are regular spheres with high uniformity, and the bump spacing can be from 1 nm to 1000 nm. By changing the bump spacing and arrangement density, it can adapt to the signal reception and transmission requirements of different scenarios and bands.

[0004] To achieve the above objectives, a method for fabricating a high-uniformity nanospherical bump array antenna is proposed according to the first aspect of this application, comprising the following steps: The silver foil substrate is obtained after pretreatment of the silver foil. C 60 The powder was prepared into a stock solution of the target concentration using an inert organic solvent; The stock solution is uniformly sprayed onto the silver foil substrate under an inert atmosphere to obtain a sprayed liquid film with a thickness of 5-15 μm; the organic solvent in the sprayed liquid film is allowed to evaporate at room temperature to form bumps. After immersing the silver foil substrate with the bumps in a curing agent for curing, it is cleaned and dried to obtain an antenna with a bump array.

[0005] In some embodiments, the pretreatment method for silver foil includes cleaning the silver foil to remove the surface oxide layer, followed by vacuum argon ion sputtering and high-temperature annealing.

[0006] In some embodiments, the cleaning process of the silver foil involves sequential ultrasonic cleaning with acetone, ethanol, and pure water.

[0007] In some embodiments, after cleaning, the silver foil is heated at 40°C-60°C with 30-35% dilute nitric acid to remove the surface oxide layer.

[0008] In some embodiments, the inert organic solvent includes toluene, xylene, or carbon disulfide.

[0009] In some embodiments, the silver foil substrate is an atomically flat silver foil substrate with a surface roughness of less than 0.5 nm.

[0010] In some embodiments, the volume control accuracy of the stock solution uniformly sprayed onto the silver foil substrate is not less than 0.1 μL.

[0011] In some embodiments, the curing agent is a dithiol ethanol solution with a volume concentration of 3% to 8%; The silver foil substrate with the raised dots is immersed in the curing agent at room temperature for 5 to 15 minutes to complete the curing process.

[0012] In some embodiments, the silver foil substrate with the bumps is cured, cleaned with ethanol, dried with nitrogen, and then encapsulated.

[0013] According to a second aspect of this application, a high-uniformity nanospherical bump array antenna is proposed, comprising a silver foil substrate and an array distributed on the surface C of the silver foil substrate. 60 The array consists of nano-bumps; the bumps are regular spheres with consistent morphology, size, and height; the spacing between the bumps is 1 nm to 1000 nm; and the array density is 4 × 10⁻⁶. 12 pcs / cm²

[0014] Compared with related technologies, this application has the following advantages: 1. The fabrication process is extremely simple and efficient: The entire process adopts a high-precision spraying process, eliminating the need for complex equipment and procedures such as photolithography, etching, deposition, and evaporation. The operation steps are few, the controllability is strong, and rapid prototyping is possible, which greatly simplifies the fabrication process of traditional nano-antennas.

[0015] 2. Low overall production cost, suitable for mass production: In this invention, the single antenna C 60 The actual consumption is only in the microgram range, the amount used is extremely small, and the material cost of a single antenna is extremely low; at the same time, the process is simple, the equipment investment is small, and no multiple processing is required, so the overall manufacturing cost is significantly lower than that of traditional photolithography antennas, giving it a strong advantage in industrial mass production.

[0016] 3. Extremely simple and highly versatile spacing control method: This application can achieve continuous adjustment of spacing from 1 nm to 1000 nm simply by preparing a high-concentration non-agglomeration solution and diluting it step by step. No tooling changes or structural redesign are required. One process can cover all spacing specifications, greatly improving production efficiency and product versatility.

[0017] 4. The antenna structure is highly regular and has good performance consistency: the protrusions directly adopt C-type antennas. 60Its self-stable spherical structure results in a uniform appearance, size, and neat arrangement after molding, solving the problems of irregular protrusions, rough edges, and poor uniformity in traditional processes. This leads to more stable antenna signal output and better directivity.

[0018] 5. High degree of miniaturization and strong integration: The bump size and spacing are both at the nanoscale, and the array density is high, which can realize chip-level and miniaturized integration, and is suitable for high-end application scenarios such as high-performance microelectronic devices, photoelectric detection, and signal transmission.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein: Figure 1 This is a schematic diagram of the antenna fabrication process proposed in the embodiments of this application. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided with reference to the embodiments. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. All other technical solutions obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0022] To achieve the above objectives, a method for fabricating a high-uniformity nanospherical bump array antenna is proposed according to the first aspect of this application, comprising the following steps: S1: Silver foil substrate is obtained after pretreatment of silver foil; S2: C 60 The powder was prepared into a stock solution of the target concentration using an inert organic solvent; S3: Under an inert atmosphere, the stock solution is uniformly sprayed onto the silver foil substrate to obtain a spray film with a thickness of 5-15 μm; the organic solvent in the spray film is allowed to evaporate at room temperature to form bumps. S4: Immerse the silver foil substrate with bumps in the curing agent, cure it, clean it, and blow it dry to obtain an antenna with a bump array.

[0023] In step S1, the silver foil is pretreated to obtain a silver foil substrate. In some embodiments, the pretreatment method for the silver foil includes cleaning the silver foil to remove the surface oxide layer, followed by vacuum argon ion sputtering and high-temperature annealing. For example, if the silver foil is high-purity silver foil, the cleaning process involves ultrasonically cleaning the high-purity silver foil sequentially with acetone, ethanol, and pure water, wherein the concentrations of acetone and ethanol are analytical grade. After cleaning, the high-purity silver foil is heated at 40°C-60°C with 30-35% dilute nitric acid to remove the surface oxide layer, followed by vacuum argon ion sputtering and high-temperature annealing to obtain an atomically smooth silver foil substrate with a surface roughness of less than 0.5 nm.

[0024] In step S2, high-purity C is used. 60 Powder is prepared into a high-concentration stock solution; for example, high-purity C 60 The powder was dispersed in an inert organic solvent, including at least one of toluene, xylene, or carbon disulfide, by stirring and ultrasonication in the dark. Testing confirmed that the stock solution was clear, free of agglomerates and particles. It should be noted that, based on the target bump spacing and density, the powder was gradually diluted to the target concentration using the same organic solvent, achieving a continuously adjustable spacing from 1 nm to 1000 nm.

[0025] In step S3, a high-precision micro-volume spraying device is used to uniformly spray the stock solution onto the silver foil substrate under an inert atmosphere. The volume control accuracy of the stock solution uniformly sprayed onto the silver foil substrate is not less than 0.1 μL. In some embodiments, the inert atmosphere is a nitrogen inert atmosphere; the thickness of the sprayed liquid film is controlled to be 5–15 μm, preferably 10 μm, to ensure that the carbon content in the sprayed liquid film is within a certain range. 60 The molecules are uniformly distributed in a monolayer.

[0026] In step S4, the silver foil substrate with raised dots is immersed in a curing agent for curing and then cleaned. The curing agent is a 3% to 8% dithiol ethanol solution. The silver foil substrate with raised dots is immersed in the curing agent at room temperature for 5 to 15 minutes to complete the curing, so that the raised dots are firmly bonded to the silver foil substrate. After curing, the silver foil substrate is cleaned with ethanol, dried with nitrogen, and then encapsulated to obtain a high-uniformity nanospherical raised dot array antenna.

[0027] This application achieves the goal of keeping the spraying volume and film thickness constant by adjusting C. 60 By adjusting the solution concentration, various array antennas with different bump spacing and arrangement densities can be fabricated: the lower the concentration of the stock solution, the larger the bump spacing and the sparser the arrangement; the higher the solution concentration, the smaller the spacing and the denser the arrangement. The entire process requires no equipment replacement, no re-fabrication of plates, and no adjustment of complex parameters, enabling the rapid fabrication of antennas of multiple specifications.

[0028] According to a second aspect of this application, a high-uniformity nanospherical bump array antenna is proposed, comprising a silver foil substrate and an array distributed on the surface C of the silver foil substrate. 60 The array features nano-bumps; the bumps are regular spherical with consistent morphology, size, and height; the bump spacing ranges from 1 nm to 1000 nm; and the array density is 4 × 10⁻⁶. 12 pcs / cm²

[0029] This application discloses a highly uniform nanosphere convex array antenna, comprising an atomically flat silver foil substrate and C-shaped bumps distributed on the surface of the substrate. 60 Nanosphere-shaped bumps. C 60 As a highly stable spherical fullerene molecule, it exhibits excellent photoelectric response and photoelectric conversion efficiency. Its spherical structure is highly compatible with the requirements of antenna bumps, significantly improving signal transmission stability and conversion efficiency. The bumps in this application are regularly spherical, with consistent morphology, size, and height, exhibiting no aggregation, deformation, or dispersion. In some embodiments, the bump spacing can be continuously and precisely adjusted within the range of 1 nm to 1000 nm. By changing the spacing, the bump density can be continuously controlled to meet the signal transmission requirements of different application scenarios. A typical implementation has a spacing of 5 nm, corresponding to an array density of up to 4 × 10⁻⁶. 12 pcs / cm² Example 1

[0030] This embodiment provides a highly uniform nanospherical bump array antenna, the fabrication process and parameters of which are as follows: using atomically flat silver foil as a substrate, and selecting toluene as a solvent to prepare a high-concentration C 60 After the solution was dispersed and confirmed to be free of agglomeration, it was diluted stepwise according to the target spacing and density requirements. A high-precision micro-spraying device was used to uniformly spray the solution with a liquid film thickness of 10μm under a nitrogen atmosphere. After the solvent evaporated, the solution was cured by immersing in a 6% dithiol ethanol solution at room temperature for 8 minutes. After cleaning, drying and packaging, a nano-spherical bump array antenna with regular bump shape, uniform spacing, no agglomeration and controllable density was obtained. Example 2

[0031] This embodiment provides a highly uniform nanospherical bump array antenna, the fabrication process and parameters of which are as follows: using atomically flat silver foil as a substrate, and selecting toluene as a solvent to prepare a high-concentration C 60 After the solution was dispersed and confirmed to be free of agglomeration, it was diluted stepwise according to the target spacing and density requirements. A high-precision micro-spraying device was used to uniformly spray the solution with a liquid film thickness of 15μm under a nitrogen atmosphere. After the solvent evaporated, the solution was soaked in a 3% dithiol ethanol solution at room temperature for 15 minutes to cure. After cleaning, drying and packaging, a nano-spherical bump array antenna with regular bump shape, uniform spacing, no agglomeration and controllable density was obtained. Example 3

[0032] This embodiment provides a highly uniform nanospherical bump array antenna, the fabrication process and parameters of which are as follows: using atomically flat silver foil as a substrate, xylene is selected as the solvent to prepare a high-concentration C 60 After the solution was dispersed and confirmed to be free of agglomeration, it was diluted stepwise according to the target spacing and density requirements. A high-precision micro-spraying device was used to uniformly spray the solution with a liquid film thickness of 5μm under a nitrogen atmosphere. After the solvent evaporated, the solution was soaked in an 8% dithiol ethanol solution at room temperature for 10 minutes to cure. After cleaning, drying and packaging, a nano-spherical bump array antenna with regular spherical bumps, uniform spacing, no agglomeration and controllable density was obtained.

[0033] This application employs a spherical C-shaped structure that exhibits structural stability and excellent photoelectric properties. 60 Molecules serve as bumps, with atomically flat silver foil as the substrate. The bump spacing is continuously adjustable from 1 nm to 1000 nm, and antennas with different spacings and densities can be fabricated by adjusting the solution concentration. This application's process is extremely simple, low-cost, easy to control, and highly consistent; molding can be completed using only a spray coating process. 60 The amount used is in the microgram range, and the cost of a single antenna material is extremely low. It solves the problems of complex process, high cost, non-adjustable spacing and poor uniformity of traditional nano-antennas. It can achieve miniaturization and chip-level integration, and is suitable for high-performance signal transmission and optoelectronic applications in multiple scenarios. It has significant industrial mass production value.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A method for fabricating a high-uniformity nanospherical bump array antenna, characterized in that, Includes the following steps: The silver foil substrate is obtained after pretreatment of the silver foil. C 60 The powder was prepared into a stock solution of the target concentration using an inert organic solvent; The stock solution is uniformly sprayed onto the silver foil substrate under an inert atmosphere to obtain a sprayed liquid film with a thickness of 5-15 μm; the organic solvent in the sprayed liquid film is allowed to evaporate at room temperature to form bumps. After immersing the silver foil substrate with the bumps in a curing agent for curing, it is cleaned and dried to obtain an antenna with a bump array.

2. The preparation method according to claim 1, characterized in that, The pretreatment method for silver foil includes cleaning the silver foil to remove the surface oxide layer, followed by vacuum argon ion sputtering and high-temperature annealing.

3. The preparation method according to claim 2, characterized in that, The silver foil is cleaned by ultrasonic cleaning in sequence with acetone, ethanol, and pure water.

4. The preparation method according to claim 2, characterized in that, After cleaning, the silver foil is heated at 40-60°C with 30-35% dilute nitric acid to remove the surface oxide layer.

5. The preparation method according to claim 1, characterized in that, The inert organic solvent includes toluene, xylene, or carbon disulfide.

6. The preparation method according to claim 1, characterized in that, The silver foil substrate is an atomically flat silver foil substrate with a surface roughness of less than 0.5 nm.

7. The preparation method according to any one of claims 1-6, characterized in that, The volume control accuracy of the stock solution being uniformly sprayed onto the silver foil substrate is no less than 0.1 μL.

8. The preparation method according to claim 7, characterized in that, The curing agent is a dithiol ethanol solution with a volume concentration of 3% to 8%; The silver foil substrate with the raised dots is immersed in the curing agent at room temperature for 5 to 15 minutes to complete the curing process.

9. The preparation method according to claim 7, characterized in that, After the silver foil substrate with the aforementioned protrusions is cured, it is cleaned with ethanol, dried with nitrogen, and then encapsulated.

10. A high-uniformity nanospherical bump array antenna, characterized in that, Includes a silver foil substrate and an array distributed on the surface C of the silver foil substrate. 60 The array consists of nano-bumps; the bumps are regular spheres with consistent morphology, size, and height; the spacing between the bumps is 1 nm to 1000 nm; and the array density is 4 × 10⁻⁶. 12 pcs / cm²

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