Contact assembly, method of manufacturing a contact assembly, and PCB interconnect assembly

Abstract

The application is suitable for the field of connectors, and provides a contact assembly, a manufacturing method of the contact assembly and a PCB interconnection assembly. The contact assembly comprises a base, a jack terminal, a transition part, a mating part and a board end interconnection part. The transition part is connected to the inside of the base. At least a part of the board end interconnection part protrudes from the surface of the base. The end of the mating part close to the transition part is configured as a mating square frame which is configured to contact with an external pin. The end of the mating part away from the transition part is configured as a positioning square frame which is configured to cooperate with a fixing tool for positioning. A soldering tin ball is connected to the part of the board end interconnection part protruding from the surface of the base. In the application, stable contact at multiple points in the circumferential direction can be realized, the anti-vibration and anti-impact capability is effectively improved, and reliable transmission of low-frequency and high-speed signals is ensured.

Description

Technical Field

[0001] This application belongs to the field of connectors, and particularly relates to a contact assembly, a method for manufacturing the contact assembly, and a PCB interconnect assembly. Background Technology

[0002] As electronic devices in fields such as communications, industrial control, and automotive continue to evolve towards miniaturization, high density, and high reliability, the signal interconnection between internal PCBs places more stringent demands on connectors. Especially in harsh mechanical environments with strong vibration and continuous impact, connectors must simultaneously ensure stable electrical contact, high-density arrangement, and reliable PCB end connection.

[0003] In related technologies, the docking end often adopts a single-point or single-sided elastic contact form, which is prone to loosening of the contact, fluctuation of contact resistance, or even instantaneous circuit breakage under vibration and shock conditions, making it difficult to ensure the stable transmission of low-frequency and high-speed signals. Summary of the Invention

[0004] This application provides a contact component assembly, a method for manufacturing the contact component assembly, and a PCB interconnect assembly, which can solve the technical problem in the related art that it is difficult to ensure stable signal transmission when the mating end adopts a single-point or single-sided elastic contact form.

[0005] The first aspect of this application provides a contact component assembly, comprising:

[0006] Base;

[0007] The socket terminal includes a transition portion and a mating portion and a board-end interconnection portion respectively connected to both ends of the transition portion. The transition portion is connected to the interior of the base, and at least a portion of the board-end interconnection portion extends out of the surface of the base. The end of the mating portion near the transition portion is configured as a mating frame, which is configured to contact an external pin. The end of the mating portion away from the transition portion is configured as a positioning frame, which is configured to cooperate with a fixing fixture for positioning.

[0008] Solder balls are the portions of the board-end interconnects that extend beyond the base surface.

[0009] The contact assembly provided in this application embodiment forms a docking frame for contacting external pins in the docking portion, and a positioning frame for positioning in conjunction with a fixed fixture. This enables stable multi-point contact in the circumferential direction, effectively improving vibration and shock resistance, ensuring reliable transmission of low-frequency and high-speed signals, and providing a structural basis for precise terminal positioning and high-density arrangement. It also enables a stable connection between the board-end interconnection portion and the solder balls, thus achieving an independent contact assembly with reliable contact, precise positioning, and a compact structure.

[0010] In some implementations, the contact assembly includes multiple socket terminals that are evenly spaced on the base.

[0011] By adopting the above technical solution, multiple socket terminals are evenly spaced on the base, which can ensure that the electrical and mechanical performance of each terminal is consistent, reduce the risk of signal crosstalk, and achieve a regular high-density arrangement, effectively reducing the overall size of the component and adapting to the development needs of miniaturization and high integration of electronic devices.

[0012] In some implementations, the docking portion includes a connecting arm and four docking springs connected to one end of the connecting arm. The other end of the connecting arm is connected to a transition portion. The four docking springs are opposite each other in pairs. The docking frame is located at the end of the docking springs away from the connecting arm, and the positioning frame is located at the end of the docking springs closer to the connecting arm.

[0013] By adopting the above technical solution, the connecting arm and four docking springs form the docking part, with the four docking springs arranged in pairs facing each other. The docking frame is located at the end of the docking springs away from the connecting arm, and the positioning frame is located at the end closer to the connecting arm. This forms a symmetrical and stable encircling contact structure, improving contact reliability and insertion and removal smoothness. At the same time, it provides a rigid reference for terminal positioning, bending and injection molding, avoiding terminal deformation and displacement.

[0014] In some implementations, four docking springs are evenly connected to the connecting arm at intervals. The docking springs are constructed as a cantilever beam structure extending from the connecting arm to the distal end, with one of the docking springs aligned with the transition section.

[0015] By adopting the above technical solution, four docking springs are evenly arranged and set as a cantilever beam structure extending from the connecting arm to the far end. At the same time, one of the docking springs is aligned with the transition part, which can provide a stable and uniform elastic contact force, ensure stable contact resistance, optimize the quality of high-speed signal transmission, and facilitate stamping, bending and positioning processing, thereby improving the terminal forming accuracy and batch consistency.

[0016] In some implementations, the base includes a first stepped portion and a second stepped portion connected to the first stepped portion, a transition portion located within the first stepped portion, and a plate end interconnection portion located within the second stepped portion and at least a portion extending out of the surface of the second stepped portion.

[0017] By adopting the above technical solution, the base is configured as a first step and a second step, and the transition part is placed in the first step and the board end interconnection part is placed in the second step and at least partially protrudes. This enables segmented fixing and protection of different parts of the terminal, improves the holding force of the terminal in the base, reduces the size of the lower part of the base, saves PCB installation space, and facilitates assembly, soldering and automated production.

[0018] In some implementations, the length of the board end interconnect extending beyond the surface of the second step portion is 0.3 mm to 0.4 mm.

[0019] By adopting the above technical solution, the length of the interconnect portion extending beyond the surface of the second step portion is set to 0.3 mm to 0.4 mm. This ensures that the solder balls are fully fused while avoiding short circuits, skewness, or abnormal solder climbing caused by excessive extension. It also ensures that the soldering shape is regular, the connection strength is reliable, and it is compatible with the requirements of SMT reflow soldering process.

[0020] In some implementations, the second step has a groove, the board end interconnect passes through the groove, and the solder balls are supported in the groove.

[0021] By adopting the above technical solution, a groove is set in the second step and the board end interconnection part passes through the groove, and the solder ball is supported in the groove. This can effectively limit the position of the solder ball, prevent the solder ball from shifting, flowing and the solder from climbing upward, reduce soldering defects such as cold solder joints and bubbles, and improve the stability and reliability of the board end connection.

[0022] In some implementations, the board end interconnection portion has crimping holes that extend out of the surface of the second step portion.

[0023] By adopting the above technical solution, crimping holes are opened in the interconnection part at the board end, so that the interconnection part at the board end can be connected to the PCB board by crimping, which can meet the usage requirements of solderless scenarios. The connection with high holding force is achieved by relying on the elastic deformation of the crimping holes, which further improves the vibration resistance and pull-out resistance of the component and expands the application range and versatility of the component.

[0024] A second aspect of this application provides a method for manufacturing a contact component assembly, comprising:

[0025] The mating portion of the socket terminal is bent and flipped to form a mating frame at the end of the mating portion near the transition portion and a positioning frame at the end of the mating portion away from the transition portion. The mating frame is configured to contact the external pin, and the positioning frame is configured to cooperate with the fixing fixture for positioning.

[0026] A fixed fixture is used in conjunction with the outer frame of the positioning frame to fix the socket terminals;

[0027] A base is injection molded in the transition section, and at least a portion of the board-end interconnect portion and the mating portion of the socket terminal protrude from the surface of the base;

[0028] Solder balls are soldered to the portion of the board-end interconnect that extends beyond the base surface.

[0029] The manufacturing method of the contact component provided in this application involves first bending and flipping the socket terminal to form a docking frame and a positioning frame, then using the outer frame of the positioning frame to cooperate with the fixing fixture to position the terminal, and then injection molding the base in the transition part and welding the solder ball to the protruding part of the board end interconnection. This method can accurately control the position and spacing of the terminal, achieve a small-pitch high-density arrangement, and ensure the structural accuracy and performance stability of the component.

[0030] A third aspect of this application provides a PCB interconnect assembly, including a PCB board and any of the contact components described above;

[0031] The PCB board includes signal pads, and the solder balls of the contact components are soldered to the signal pads.

[0032] The contact component assembly, the manufacturing method of the contact component assembly, and the PCB interconnect assembly provided in this application embodiment combine the aforementioned contact component assembly with a PCB board having signal pads to form a PCB interconnect assembly, and solder balls are soldered to the signal pads. This enables stable and reliable electrical interconnection between PCB boards inside the chassis. The assembly has advantages such as vibration resistance, impact resistance, stable contact, strong soldering, and high-density miniaturization, and can meet the requirements for long-term reliable transmission of high and low frequency signals in harsh environments such as communication, industrial control, and automotive. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of a contact component assembly at an angle according to an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the contact component assembly from another angle, according to an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the structure of a contact assembly for concealing solder balls provided in an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the structure of the insertion terminal before cutting according to an embodiment of this application;

[0038] Figure 5 This is a schematic diagram of the structure of a bent socket terminal provided in one embodiment of this application;

[0039] Figure 6This is a schematic diagram of the structure of a cut-down socket terminal provided in one embodiment of this application;

[0040] Figure 7 This is a schematic diagram of a plug terminal with a crimped hole structure provided in one embodiment of the present application;

[0041] Figure 8 This is a schematic diagram of the structure of the socket terminal being inserted into the base according to an embodiment of this application;

[0042] Figure 9 This is a flowchart illustrating the implementation of a method for manufacturing a contact component according to an embodiment of this application;

[0043] Figure 10 This is a schematic diagram of the structure of a PCB interconnect component provided in an embodiment of this application. Detailed Implementation

[0044] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0045] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0047] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] Please see Figures 1 to 8 This application provides a contact assembly 100, including a base 10, a socket terminal 20, and solder balls 30.

[0049] The base 10 is constructed as a seat structure.

[0050] The socket terminal 20 includes a transition portion 21 and mating portions 22 and board-end interconnection portions 23 respectively connected to both ends of the transition portion 21. The mating portions 22 are connected to one side of the transition portion 21, and the board-end interconnection portions 23 are connected to the other side of the transition portion 21.

[0051] The transition portion 21 is connected inside the base 10, the mating portion 22 is located outside the base 10, and at least a portion of the board-end interconnect portion 23 extends out of the surface of the base 10. The end of the mating portion 22 near the transition portion 21 is configured as a mating frame 2221, which is arranged to contact external pins. Each side of the mating frame 2221 can contact external pins, enabling stable multi-point contact in the circumferential direction. The end of the mating portion 22 away from the transition portion 21 is configured as a positioning frame 2222, which is configured to cooperate with a fixing fixture for positioning. The fixing fixture can cooperate with the outer frame of the positioning frame 2222 to rearrange and fix the multiple socket terminals 20 according to a predetermined spacing.

[0052] The solder ball 30 is generally spherical and is connected to the portion of the board-end interconnect 23 that extends beyond the surface of the base 10. Specifically, the solder ball 30 covers the portion of the board-end interconnect 23 that extends beyond the surface of the base 10 and is supported on the surface of the base 10. Furthermore, the solder ball 30 can be soldered onto the PCB board, thereby achieving an electrical connection between the contact assembly 100 and the PCB board.

[0053] The contact assembly 100 provided in this application embodiment forms a docking frame 2221 for contacting external pins in the docking portion 22, and a positioning frame 2222 for positioning in conjunction with a fixed fixture. This enables stable multi-point contact in the circumferential direction, effectively improving vibration and shock resistance, ensuring reliable transmission of low-frequency and high-speed signals, and providing a structural basis for precise terminal positioning and high-density arrangement. It also enables a stable connection between the board-end interconnect portion 23 and the solder ball 30, thus achieving a reliable contact, precise positioning, and compact structure for the independent contact assembly 100.

[0054] like Figures 1 to 3 As shown, in some embodiments, the contact assembly 100 includes a plurality of socket terminals 20, which are evenly spaced on the base 10.

[0055] Preferably, the contact assembly 100 includes four socket terminals 20, which are evenly spaced and inserted into the base 10. Here, by using a fixing fixture to engage with the outer frame of the docking frame 2221, the four socket terminals 20 are evenly spaced, and then a base 10 is injection molded on the transition portion 21 of the socket terminals 20, so that the four socket terminals 20 are evenly spaced and inserted into the base 10.

[0056] By adopting the above technical solution, multiple socket terminals 20 are evenly spaced on the base 10, which can ensure that the electrical and mechanical performance of each terminal is consistent, reduce the risk of signal crosstalk, and achieve a regular high-density arrangement, effectively reduce the overall size of the component, and adapt to the development needs of miniaturization and high integration of electronic devices.

[0057] like Figures 1 to 8 As shown, in some embodiments, the docking portion 22 includes a connecting arm 221 and four docking springs 222 connected to one end of the connecting arm 221. The other end of the connecting arm 221 is connected to the transition portion 21. The four docking springs 222 are opposite each other, thereby forming a docking frame 2221 and a positioning frame 2222 at both ends of the docking springs 222. The docking frame 2221 is located at the end of the docking spring 222 away from the connecting arm 221, and the positioning frame 2222 is located at the end of the docking spring 222 closer to the connecting arm 221.

[0058] By adopting the above technical solution, the connecting arm 221 and four docking springs 222 are used to form the docking part 22, so that the four docking springs 222 are arranged opposite each other in pairs, and the docking frame 2221 is located at the end of the docking spring 222 away from the connecting arm 221, and the positioning frame 2222 is located at the end close to the connecting arm 221. This can form a symmetrical and stable encircling contact structure, improve contact reliability and insertion and removal smoothness, and at the same time provide a rigid reference for terminal positioning, bending and injection molding, avoiding terminal deformation and displacement.

[0059] like Figures 1 to 6 As shown, in some embodiments, four docking springs 222 are evenly connected to the connecting arm 221 at intervals. The docking springs 222 are constructed as cantilever beam structures extending distally from the connecting arm 221, with one docking spring 222 aligned with the transition portion 21. During bending, the relative positions of the docking springs 222 aligned with the transition portion 21 remain fixed. At the position of the connecting arm 221, the remaining three docking springs 222 are bent and flipped sequentially, so that the four docking springs 222 are paired up to form a docking frame 2221 and a positioning frame 2222.

[0060] By adopting the above technical solution, the four docking springs 222 are evenly arranged and set as a cantilever beam structure extending from the connecting arm 221 to the far end. At the same time, one of the docking springs 222 and the transition part 21 are in the same straight line, which can provide a stable and uniform elastic contact force, ensure stable contact resistance, optimize the quality of high-speed signal transmission, and facilitate stamping, bending and positioning processing, thereby improving the terminal forming accuracy and batch consistency.

[0061] In some alternative implementations, the socket terminal 20 is precision stamped using a metal stamping die. Each stamped socket terminal 20 is connected into a whole by a connecting strip 24. The connecting strip 24 can be cut to obtain multiple socket terminals 20. Then, the connecting arm 221 of the socket terminal 20 is bent and flipped to obtain a socket terminal 20 including a docking frame 2221 and a positioning frame 2222, while other positions remain unchanged.

[0062] like Figure 1 and Figure 2 As shown, in some embodiments, the base 10 includes a first step portion 11 and a second step portion 12 connected to the first step portion 11, a transition portion 21 located within the first step portion 11, and a plate end interconnection portion 23 located within the second step portion 12 and at least a portion extending out of the surface of the second step portion 12.

[0063] The first step portion 11 is located between the second step portion 12 and the mating portion 22, and the overall size of the first step portion 11 is larger than the overall size of the second step portion 12. The portion of the board end interconnection portion 23 that extends out of the surface of the second step portion 12 is perpendicular to the surface of the second step portion 12.

[0064] By adopting the above technical solution, the base 10 is configured as a first step portion 11 and a second step portion 12, and the transition portion 21 is placed in the first step portion 11 and the board end interconnect portion 23 is placed in the second step portion 12 and at least partially protrudes. This enables segmented fixing and protection of different parts of the terminal, improves the holding force of the terminal in the base 10, reduces the lower size of the base 10, saves PCB installation space, and facilitates assembly, soldering and automated production.

[0065] In some implementations, the length of the board end interconnect 23 extending from the surface of the second step portion 12 is 0.3 mm to 0.4 mm.

[0066] By adopting the above technical solution, the length of the board-end interconnect 23 extending out of the surface of the second step 12 is set to 0.3 mm to 0.4 mm. This ensures that the solder balls 30 are fully fused while avoiding short circuits, skewness, or abnormal solder climbing caused by excessive extension. It also ensures that the soldering shape is regular, the connection strength is reliable, and it is compatible with the requirements of SMT reflow soldering process.

[0067] like Figure 3 As shown, in some embodiments, the second step portion 12 is provided with a groove 121. The groove 121 is located on the surface of the second step portion 12 away from the first step portion 11. The board-end interconnect portion 23 passes through the groove 121, and the solder ball 30 is supported in the groove 121. Specifically, the board-end interconnect portion 23 is constructed as a solder pillar. The solder ball 30 is fixed by a special tooling and then fused to the solder pillar by a high-temperature reflow SMT process. After fusion, the solder pillar is located inside the solder ball 30, and the solder ball 30 maintains a spherical shape and is supported by the groove 121 of the second step portion 12 to prevent the solder ball 30 from flowing downward.

[0068] By adopting the above technical solution, a groove 121 is provided in the second step portion 12 and the board end interconnection portion 23 passes through the groove 121, and the solder ball 30 is supported in the groove 121. This can effectively limit the position of the solder ball 30, prevent the solder ball from shifting, flowing and the solder from climbing upward, reduce soldering defects such as cold solder joints and bubbles, and improve the stability and reliability of the board end connection.

[0069] like Figure 7 and Figure 8 As shown, in some embodiments, the board-end interconnect portion 23 has a crimp hole 231 that extends out of the surface of the second step portion 12. Optionally, the crimp hole 231 is configured as a fisheye structure that is crimped to a hole in the PCB board.

[0070] By adopting the above technical solution, a crimping hole 231 is opened in the board-end interconnection part 23, so that the board-end interconnection part 23 can be connected to the PCB board by crimping to achieve solderless connection, which can meet the usage requirements of solderless scenarios. The high holding force connection is achieved by relying on the elastic deformation of the crimping hole 231, which further improves the component's vibration resistance and pull-out resistance, and expands the component's application range and versatility.

[0071] Please see Figure 9 , Figure 9 This is a flowchart of a method for manufacturing a contact component according to an embodiment of this application, including the following steps 901 to 904.

[0072] Step 901: Bend and flip the mating part of the socket terminal to form a mating frame at the end of the mating part near the transition part and a positioning frame at the end of the mating part away from the transition part.

[0073] The docking frame is configured to contact the external pin, and the positioning frame is configured to cooperate with the fixed fixture for positioning.

[0074] Step 902: Use a fixed fixture to fix the outer frame of the positioning frame to fix the socket terminal.

[0075] Step 903: Inject a base into the transition portion, and extend at least a portion of the board-end interconnect portion and the mating portion of the socket terminal out of the surface of the base.

[0076] Step 904: Solder the solder balls onto the portion of the board end interconnect that extends beyond the base surface.

[0077] The manufacturing method of the contact component provided in this application involves first bending and flipping the socket terminal to form a docking frame and a positioning frame, then using the outer frame of the positioning frame to cooperate with the fixing fixture to position the terminal, and then injection molding the base in the transition part and welding the solder ball to the protruding part of the board end interconnection. This method can accurately control the position and spacing of the terminal, achieve a small-pitch high-density arrangement, and ensure the structural accuracy and performance stability of the component.

[0078] Please see Figure 10 , Figure 10 This is a schematic diagram of the structure of a PCB interconnect assembly provided in an embodiment of this application. The PCB interconnect assembly 300 includes a PCB board 200 and any of the contact components 100 described above. The PCB board 200 includes signal pads 201, and the solder balls 30 of the contact components 100 are soldered to the signal pads 201.

[0079] Before assembling the contact assembly 100 with the PCB board 200, a layer of solder paste with a thickness of 0.10 mm to 0.13 mm is first applied to the signal pads 201 on the PCB board 200. Then, the contact assembly 100 is placed on the surface of the PCB board 200, aligning the solder balls 30 on it with the signal pads 201. The solder balls 30 on the socket terminal 20 are then melted using a high-temperature reflow soldering process, causing them to fuse with the signal pads 201 on the PCB board 200 to form signal solder joints. This connects the socket terminal 20 on the contact assembly 100 with the signal pads 201 on the PCB board 200, thus establishing a transmission link connection.

[0080] The contact component assembly, the manufacturing method of the contact component assembly, and the PCB interconnect assembly provided in this application embodiment combine the aforementioned contact component assembly with a PCB board having signal pads to form a PCB interconnect assembly, and solder balls are soldered to the signal pads. This enables stable and reliable electrical interconnection between PCB boards inside the chassis. The assembly has advantages such as vibration resistance, impact resistance, stable contact, strong soldering, and high-density miniaturization, and can meet the requirements for long-term reliable transmission of high and low frequency signals in harsh environments such as communication, industrial control, and automotive.

[0081] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A contact component assembly, characterized in that, include: Base; A socket terminal includes a transition portion and a mating portion and a board-end interconnection portion respectively connected to both ends of the transition portion. The transition portion is connected to the interior of the base, and at least a portion of the board-end interconnection portion extends out of the surface of the base. The end of the mating portion near the transition portion is configured as a mating frame, which is configured to contact an external pin. The end of the mating portion away from the transition portion is configured as a positioning frame, which is configured to cooperate with a fixing fixture for positioning. Solder balls are connected to the portion of the board end interconnect that extends out of the base surface.

2. The contact assembly according to claim 1, characterized in that, The contact assembly includes a plurality of socket terminals, which are evenly spaced on the base.

3. The contact assembly according to claim 1, characterized in that, The docking portion includes a connecting arm and four docking springs connected to one end of the connecting arm. The other end of the connecting arm is connected to the transition portion. The four docking springs are opposite each other in pairs. The docking frame is located at the end of the docking springs away from the connecting arm, and the positioning frame is located at the end of the docking springs close to the connecting arm.

4. The contact assembly according to claim 3, characterized in that, The four docking springs are evenly connected to the connecting arm at intervals. The docking springs are constructed as cantilever beam structures extending from the connecting arm to the distal end, and one of the docking springs is in a straight line with the transition portion.

5. The contact assembly according to claim 1, characterized in that, The base includes a first stepped portion and a second stepped portion connected to the first stepped portion. The transition portion is located within the first stepped portion, and the plate end interconnection portion is located within the second stepped portion and at least a portion extends out of the surface of the second stepped portion.

6. The contact assembly according to claim 5, characterized in that, The length of the plate end interconnect portion extending beyond the surface of the second step portion is 0.3 mm to 0.4 mm.

7. The contact assembly according to claim 5, characterized in that, The second step portion is provided with a groove, the plate end interconnect portion passes through the groove, and the solder ball is supported in the groove.

8. The contact assembly according to claim 5, characterized in that, The plate end interconnection portion has a crimping hole, which extends out of the surface of the second step portion.

9. A method for manufacturing a contact component assembly, characterized in that, include: The mating portion of the socket terminal is bent and flipped to form a mating frame at one end of the mating portion near the transition portion and a positioning frame at the other end of the mating portion away from the transition portion. The mating frame is configured to contact the external pin, and the positioning frame is configured to cooperate with the fixing fixture for positioning. The socket terminal is fixed by using the fixing fixture in conjunction with the outer frame of the positioning frame; A base is injection molded in the transition portion, and at least a portion of the plate-end interconnect of the socket terminal and the mating portion extend out of the surface of the base; Solder balls are soldered to the portion of the board end interconnect that extends beyond the surface of the base.

10. A PCB interconnect assembly, characterized in that, Includes a PCB board and a contact assembly as described in any one of claims 1 to 8; The PCB board includes signal pads, and the solder balls of the contact assembly are soldered to the signal pads.

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