Transmitting assembly and high-speed optical module

Abstract

The application relates to the technical field of optical modules, and provides a transmitting assembly and a high-speed optical module. The transmitting assembly comprises a fiber array, a heat-conducting platform and at least four laser assemblies arranged on the front and back surfaces of the heat-conducting platform; the fiber array comprises an array base and an array cover plate, wherein the array base is provided with at least four fiber positioning grooves, namely a first fiber positioning groove, a second fiber positioning groove, a third fiber positioning groove and a fourth fiber positioning groove; the front and back surfaces of the heat-conducting platform are provided with at least two columns, the top and side surfaces of the columns are provided with the laser assemblies, the rear ends of the laser assemblies arranged on the top of the columns are coupled with inverted L-shaped heat-conducting pieces so as to transfer the heat of the laser assemblies to the heat-conducting platform; the fibers in the first fiber positioning groove and the second fiber positioning groove are coupled with the laser assemblies arranged below the heat-conducting platform; and the fibers in the third fiber positioning groove and the fourth fiber positioning groove are coupled with the laser assemblies arranged above the heat-conducting platform.

Description

Technical Field

[0001] This invention relates to the field of optical module technology, and in particular to a transmitting component and a high-speed optical module. Background Technology

[0002] With the rapid development of large-scale artificial intelligence models, the requirements for the transmission rate of high-speed optical modules in data centers are becoming increasingly higher. In order to meet the actual needs, high-speed optical modules with speeds of 400 gigabits per second (G) or 800G are currently in mass production, while optical modules with speeds of 1.6 terabits per second (T) are in small-batch production.

[0003] In data center scenarios, the space available inside servers and switches to accommodate optical modules is limited. To fit more channels (to achieve throughput of 1.6T or even higher) within a limited area, it is necessary to make each optical component smaller, increase the packaging density of optical components, and reduce the package size of the product. Furthermore, for high-power modules, reducing the package size allows for more space to be reserved for heat dissipation devices, thus improving the overall heat dissipation performance of the device.

[0004] Existing technological solutions are all based on integrating more lasers into planar arrays. However, the width and length of optical modules are standard, which determines that the existing solutions have corresponding technical bottlenecks. Therefore, how to integrate more lasers into existing standard optical modules has become a key research direction for speed breakthroughs. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a transmitting component and a high-speed optical module, which solves the problems of low packaging density, bottleneck in speed breakthrough, and inability to achieve effective heat dissipation of existing optical components.

[0006] The present invention adopts the following technical solution: In a first aspect, a transmitting assembly is provided, including an optical fiber array, a heat-conducting platform 5, and at least four laser assemblies disposed on the front and back surfaces of the heat-conducting platform 5; The fiber optic array includes an array base 1 and an array cover 2. The array base 1 is provided with at least four fiber optic positioning slots: a first fiber optic positioning slot 100, a second fiber optic positioning slot 110, a third fiber optic positioning slot 120, and a fourth fiber optic positioning slot 130. The first fiber optic positioning slot 100 and the second fiber optic positioning slot 110 are arranged horizontally and vertically at a first preset height. The third fiber optic positioning slot 120 and the fourth fiber optic positioning slot 130 are arranged horizontally and vertically at a first preset height. At least two pillars 4 are provided on the front and back surfaces of the heat conduction platform 5. The laser assembly is installed on the top and side of the pillars 4. An inverted L-shaped heat conduction element 50 is coupled to the rear end of the laser assembly located at the top of the pillars 4 to transfer the heat of the laser assembly to the heat conduction platform 5. The first fiber positioning slot 100 and the second fiber positioning slot 110 are disposed below the heat-conducting platform 5, and the optical fibers in the first fiber positioning slot 100 and the second fiber positioning slot 110 are coupled to the laser assembly disposed below the heat-conducting platform 5; the third fiber positioning slot 120 and the fourth fiber positioning slot 130 are disposed above the heat-conducting platform 5, and the optical fibers in the third fiber positioning slot 120 and the fourth fiber positioning slot 130 are coupled to the laser assembly disposed above the heat-conducting platform 5.

[0007] Furthermore, the first preset height is set according to the height difference between the upper and lower stacked lasers.

[0008] Furthermore, the first fiber positioning groove 100 is located at the bottom of the stepped channel 19 generated on the array base 1, and the second fiber positioning groove 110 is located on the first step 10; wherein, the bottom of the first step 10 and the bottom of the stepped channel 19 are vertically separated by the first preset height.

[0009] Furthermore, the third fiber positioning groove 120 is located on the second step 11, which is a second preset height away from the first step 10, and the fourth fiber positioning groove 130 is located on the third step 12, which is a third preset height away from the second step 11; wherein, the height difference between the first step 10, the second step 11 and the third step 12 and the bottom of the step channel 19 increases sequentially, and the horizontal distance between them and the bottom of the step channel 19 increases sequentially.

[0010] Furthermore, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is processed into a stepped shape. The kick surface 210 of the first step is used to couple the first optical fiber positioning groove 100, the kick surface 211 of the second step is used to couple the second optical fiber positioning groove 110, the kick surface 212 of the third step is used to couple the third optical fiber positioning groove 120, and the substrate 20 is used to couple the fourth optical fiber positioning groove 130.

[0011] Furthermore, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is processed into a stepped shape. The kick surface 210 of the first step is used to couple the first optical fiber positioning groove 100, the kick surface 211 of the second step is used to couple the second optical fiber positioning groove 110, the kick surface 212 of the third step is used to couple the third optical fiber positioning groove 120, and the kick surface 213 of the fourth step is used to couple the fourth optical fiber positioning groove 130. The substrate 20 is used to couple the corresponding surfaces of the array base 1.

[0012] Furthermore, the third fiber positioning slot 120 and the fourth fiber positioning slot 130 replicate the relative structural relationship of the first fiber positioning slot 100 and the second fiber positioning slot 110 on the array base 1, and form an arrangement combination with the first fiber positioning slot 100 and the second fiber positioning slot 110.

[0013] Furthermore, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is a three-dimensional square wave shape. The peak 215 of the square wave is used to abut against the second optical fiber positioning groove 110 and the fourth optical fiber positioning groove 130, and the trough 216 of the square wave is used to abut against the first optical fiber positioning groove 100 and the third optical fiber positioning groove 120.

[0014] Furthermore, on the light-incident surface side, the structure 21 extends beyond the array base 1 by a predetermined length; a lens mounting base 214 is formed on the crest 215 and trough 216 of the structure 21 of the predetermined length.

[0015] Furthermore, n first fiber positioning slots 100 and m second fiber positioning slots 110 are arranged alternately, wherein the n first fiber positioning slots 100 constitute a first fiber positioning slot array and the m second fiber positioning slots 110 constitute a second fiber positioning slot array.

[0016] Furthermore, the array base 1 is also provided with p third fiber positioning slots 120 and q fourth fiber positioning slots 130, wherein the plane where the p third fiber positioning slots 120 are located is higher than the plane where the m second fiber positioning slots 110 are located by a second preset height, and the plane where the q fourth fiber positioning slots 130 are located is higher than the plane where the p third fiber positioning slots 120 are located by a third preset height; wherein, the fiber array is arranged in a periodic pattern with adjacent first fiber positioning slots 100, second fiber positioning slots 110, third fiber positioning slots 120 and fourth fiber positioning slots 130.

[0017] Furthermore, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and has a comb-shaped wave. Each peak 215 of the comb-shaped wave is used to abut against the first fiber positioning groove 100, the second fiber positioning groove 110 and the third fiber positioning groove 120. The substrate 20 is used to abut against the fourth fiber positioning groove 130.

[0018] Furthermore, the third preset height is equal to the first preset height, and the second preset height is determined according to the array spacing of two adjacent sets of laser components in the mirror configuration.

[0019] Furthermore, the column 4 is T-shaped, π-shaped, or rectangular.

[0020] Furthermore, it also includes a fixed bracket 3 with at least two partition structures; wherein, the vertical contact surfaces of each partition on the fixed bracket 3 that are used to abut against the laser components are horizontally separated by a preset distance; the preset distance is equal to the left-right arrangement distance of the first optical fiber positioning groove 100 and the second optical fiber positioning groove 110, and the vertical height difference of the light outlets of adjacent laser components is equal to the first preset height.

[0021] Furthermore, the fixed bracket 3 is composed of a vertical support plate 34 and at least one partition plate 35 horizontally disposed on the support plate 34.

[0022] Secondly, a high-speed optical module is provided, the high-speed optical module including the above-mentioned transmitting component.

[0023] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: The fiber array of the present invention distributes optical fibers in the height direction to match laser components at different heights, thereby improving the space utilization of the laser components in the vertical space inside the optical module. Since adjacent channels are at different heights, the optical fibers of adjacent channels are relatively independent for the fiber array, so there is no mutual interference problem between channels during fiber array assembly. The horizontal spacing between adjacent vertically arranged lasers can be further compressed, thereby further improving the space utilization effect. Furthermore, by placing the laser components on the heat-conducting platform and specifically coupling an inverted L-shaped heat-conducting component at the rear end of the laser component located at the top of the platform, the heat dissipation efficiency of the laser components is improved. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0025] Figure 1 This is a schematic diagram of a specific example of a 4-channel fiber optic array provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of a specific example of a 4-channel fiber optic array provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of a specific example of a 4-channel fiber optic array provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a specific example of a stepped trench provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of a specific example of an array base provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of a specific example of an array cover plate provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of a specific example of an array cover plate provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of a specific example of a 4-channel fiber optic array provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of a specific example of a 4-channel optical component provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of a specific example of a fixed bracket provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of a specific example of a fixed bracket provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of a specific example of a fixed bracket provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of a specific example of a fixed bracket provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of a specific example of a fixed bracket provided in an embodiment of the present invention; Figure 15 This is a schematic diagram illustrating a specific example of optical path coupling provided in an embodiment of the present invention; Figure 16 This is a schematic diagram of a specific example of an array base provided in an embodiment of the present invention; Figure 17This is a schematic diagram of a specific example of an array cover plate provided in an embodiment of the present invention; Figure 18 This is a schematic diagram of a specific example of an array base and an array cover provided in an embodiment of the present invention; Figure 19 This is a schematic diagram illustrating a specific example of a second lens provided in an embodiment of the present invention; Figure 20 This is a schematic diagram illustrating a specific example of a method for manufacturing a lens mounting base according to an embodiment of the present invention; Figure 21 This is a schematic diagram illustrating a specific example of a method for manufacturing a lens mounting base according to an embodiment of the present invention; Figure 22 This is a schematic diagram of a specific example of a lens mounting base provided in an embodiment of the present invention; Figure 23 This is a schematic diagram of a specific example of an 8-channel array base provided in an embodiment of the present invention; Figure 24 This is a schematic diagram of a specific example of an 8-channel optical component provided in an embodiment of the present invention; Figure 25 This is a schematic diagram of a specific example of a T-shaped pedestal provided in an embodiment of the present invention; Figure 26 This is a schematic diagram of a specific example of a π-shaped pedestal from a first-view perspective provided in an embodiment of the present invention; Figure 27 This is a schematic diagram illustrating a specific example of a π-shaped pedestal from a second perspective, provided in an embodiment of the present invention. Figure 28 This is a schematic diagram of a specific example of a laser assembly with a two-layer layout provided in an embodiment of the present invention; Figure 29 This is a schematic diagram illustrating another specific example of the alternating arrangement of multiple fiber positioning slots provided in this embodiment of the invention; Figure 30 This is a schematic diagram of a specific example of a comb-shaped wave structure provided in an embodiment of the present invention; Figure 31 This is a schematic diagram illustrating a specific example of fiber optic array spacing provided in an embodiment of the present invention; Figure 32 This is a schematic diagram of a specific example of a 16-channel optical component provided in an embodiment of the present invention; Figure 33 This is a schematic diagram of a specific example of a 16-channel optical component provided in an embodiment of the present invention; Figure 34 This is a schematic diagram of a specific example of a comb-shaped base provided in an embodiment of the present invention; Figure 35This is a schematic diagram of a specific example of a heat dissipation component and a comb-shaped base provided in an embodiment of the present invention; Figure 36 This is a schematic diagram of a specific example of a heat dissipation component provided in an embodiment of the present invention; Figure 37 This is a schematic diagram of a specific example of a flexible tape provided in an embodiment of the present invention.

[0026] The reference numerals in the attached figures are as follows: Array base 1, First step 10, First fiber positioning groove 100, Second step 11, Second fiber positioning groove 110, Third step 12, Third fiber positioning groove 120, Fourth fiber positioning groove 130, Fifth fiber positioning groove 140, Sixth fiber positioning groove 150, Seventh fiber positioning groove 160, Eighth fiber positioning groove 170, Fiber 18, Step channel 19, Array cover plate 2, Substrate 20, Structure 21, Kick surface of the first step 210, Kick surface of the second step 211, Kick surface of the third step 212, Kick surface of the fourth step 213, Lens mounting base 214, Peak 215, Valley 216, Upright 217, First array cover plate 22, Second array cover plate 23, Fixing bracket 3, First laser group Component 30, First vertical contact surface 300, Second laser assembly 31, Second vertical contact surface 310, Third laser assembly 32, Third vertical contact surface 320, Fourth laser assembly 33, Fourth vertical contact surface 330, Support plate 34, Partition plate 35, Fifth laser assembly 36, Sixth laser assembly 37, Seventh laser assembly 38, Eighth laser assembly 39, Column 4, First column 40, Second column 41, Third column 42, Fourth column 43, Column 45, Heat-conducting platform 5, Inverted L-shaped heat-conducting component 50, Comb-shaped base 6, Comb teeth 60, Bottom of comb tooth gap 61, Soft strip 62, First lens 70, Second lens 71, Heat dissipation assembly 8, First TEC 80, Second TEC 81, Third TEC 82, Fourth TEC 83. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0028] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0029] In this invention, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0030] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "coupled" can refer to an electrical connection that enables signal transmission.

[0031] In the specific embodiments of this invention, the use of embodiment numbers is merely for the convenience of browsing the technical solutions, distinguishing different implementations that belong to the same technical solution of this invention but have obvious differences in details. When specifically determining the technical combination and scope of protection, the technical examples in each embodiment should not be physically separated and differentiated. Instead, they should be analyzed from the underlying principles and concepts, understanding each embodiment as a different means of presenting a complete technical solution. Their underlying principles and extension methods can be mutually referenced and used.

[0032] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0033] Example 1: Embodiment 1 of the present invention provides an optical fiber array, such as Figure 1 , Figure 2 and Figure 3 The examples shown are all structural representations of the present invention during the implementation process. They all share the common features of an array base 1 and an array cover 2, wherein the array base 1 is provided with at least two fiber positioning slots.

[0034] In the corresponding Figure 1 , Figure 2 and Figure 3 In the examples, the fiber optic positioning slots are all depicted as V-groove structures. However, as optional implementations, the corresponding fiber optic positioning slots can also be made into rectangular slots, arc-shaped slots, or polygonal slots, thus adapting to different fiber optic application scenarios. Therefore, the fiber optic positioning slot structures in the related figures should not be over-interpreted as meaning that the present invention can only use V-groove structures.

[0035] In one embodiment, the first fiber positioning slot 100 and the second fiber positioning slot 110 are arranged horizontally and vertically at a first preset height. In the various optional embodiments of the present invention, the horizontal and vertical arrangements shown in the corresponding figures should be understood as optional arrangements. After understanding the innovative core of the vertical layout of the present invention, the horizontal relationship and vertical arrangement shown in the corresponding figures can be adapted to be replaced. Here, the first fiber positioning slot 100 and the second fiber positioning slot 110 are used to distinguish the two types of fiber positioning slots with different spatial structures for the convenience of subsequent feature description.

[0036] like Figure 1 As shown, in one embodiment, a relatively extreme vertical load capacity is achieved under the current optical module size standard, considering the height of the chip-on-carrier (CoC) board (also described as a laser assembly in this embodiment), namely a 4-channel fiber array, which is used to house 4 optical fibers 18. With future specification modifications, if the height space of the optical module or the scenario in which this invention is applied can be further permitted, then the number of fiber positioning slots in the vertical direction can also exceed [a certain limit]. Figure 1 The diagram shows four slots; however, in specific scenario requirements, the number of fiber optic positioning slots in the vertical direction can also be set to two or three. For example... Figure 1 The image shows the combined state of the array base 1 and array cover 2 after setup. This is only for showcasing the core structure; therefore, only one fiber optic array is presented. In actual optical module applications, the corresponding array will be different. Figure 1 The fiber array structure shown can be presented as 4 fiber arrays side by side (in which case the number of laser components is 16) or 8 fiber arrays side by side (in which case the number of laser components is 32).

[0037] like Figure 4 and Figure 5 As shown, taking the array base 1 with four fiber optic positioning slots as an example, the first fiber optic positioning slot 100 is located in the stepped groove 19 (i.e., ...) generated on the array base 1. Figure 4 At the bottom of the shaded area, the second fiber positioning groove 110 is located on the first step 10 (e.g., in the shaded area). Figure 5As shown, it is located on the upper surface of the first step 10). The first step 10 is vertically separated from the bottom of the step channel 19 by a first preset height. Further, the array base 1 is also provided with a third fiber optic positioning groove 120 and a fourth fiber optic positioning groove 130. The third fiber optic positioning groove 120 is located on the second step 11, which is vertically separated from the first step 10 by a second preset height. The fourth fiber optic positioning groove 130 is located on the third step 12, which is vertically separated from the second step 11 by a third preset height. The height difference between the first step 10, the second step 11, and the third step 12 relative to the bottom of the step channel 19 increases sequentially, and the horizontal spacing relative to the bottom of the step channel 19 also increases sequentially. Figure 5 For example, the vertical height difference between the upper surface of the first step 10 and the bottom of the step channel 19 is h1, the vertical height difference between the upper surface of the second step 11 and the bottom of the step channel 19 is 2×h1, and the vertical height difference between the upper surface of the third step 12 and the bottom of the step channel 19 is 3×h1. In this case, it is equivalent to the default parameter values ​​of the first preset height, the second preset height, and the third preset height being the same. The horizontal distance between the sidewall of the first step 10 and the sidewall of the bottom of the step channel 19 is d1, the horizontal distance between the sidewall of the second step 11 and the sidewall of the bottom of the step channel 19 is 2×d1, and the horizontal distance between the sidewall of the third step 12 and the sidewall of the bottom of the step channel 19 is 3×d1. In an optional embodiment of an optical module application, the horizontal distance d1 of the 4-channel fiber array can be 125 micrometers. It should be noted here that the second preset height and the third preset height... Figure 1 In the application scenarios shown, the parameter values ​​are usually set to be consistent with the first preset height. Of course, it is also possible that for the sake of heat dissipation and layout improvement (for example, in embodiment 3), the first preset height, the second preset height and the third preset height are deliberately set to different parameter values, which should all be considered within the scope of protection of this invention.

[0038] For every two adjacent fiber optic positioning slots (e.g., the first fiber optic positioning slot 100 and the second fiber optic positioning slot 110) on the array base 1: the first fiber optic positioning slot 100 and the second fiber optic positioning slot 110 are arranged horizontally and vertically at a first preset height (i.e., Figure 5 h1 in the middle), forming as Figure 1 The stepped, staggered structure is shown. For the fiber optic positioning slots that do not involve the top surface, the fiber optic cable 18 is disposed in the space formed between the step of the array cover plate 2 and the first fiber optic positioning slot 100 and the second fiber optic positioning slot 110, as shown. Figure 1The first and second fiber positioning slots from bottom to top are shown; the top surface is the side of the array base 1 facing the array cover plate 2. For the fiber positioning slots involving the top surface, as shown... Figure 1 As shown in the first fiber positioning slot from top to bottom, the corresponding fiber 18 is located in the space formed by the top surface and the array cover plate 2. The first preset height is the distance between the center lines of adjacent channel fiber 18 in the vertical height component. The first preset height is determined by those skilled in the art based on the specific application scenario. For example, in applications coupled with laser components, the first preset height is set according to the height difference between the upper and lower stacked lasers.

[0039] like Figure 6 and Figure 7 As shown, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 (the word "on" here is mainly to indicate that the structure 21 is fabricated on the substrate 20, and should not be limited to a directional description), and is processed into a stepped shape, wherein, as... Figure 7 As shown, the kick surface 210 of the first step is used to couple the first fiber positioning slot 100, the kick surface 211 of the second step is used to couple the second fiber positioning slot 110, the kick surface 212 of the third step is used to couple the third fiber positioning slot 120, and the substrate 20 is used to couple the fourth fiber positioning slot 130. The kick surface of each step refers to the surface parallel to the surface of the substrate 20; each fiber positioning slot abuts against the kick surface of the corresponding step.

[0040] Besides being able to use Figure 7 In addition to adapting the above-mentioned array base 1 to the surface substrate 20, which is reused as the positioning plate for the uppermost fiber positioning slot (the positioning plates for the other fiber positioning slots are referred to as kick surfaces), another design scheme for the array cover plate 2 and the array base 1 can also be adopted in the implementation of the embodiments of the present invention. A new step is added to the structure 21. Specifically, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is processed into a step shape. The kick surface 210 of the first step is used to couple the first fiber positioning slot 100, the kick surface 211 of the second step is used to couple the second fiber positioning slot 110, the kick surface 212 of the third step is used to couple the third fiber positioning slot 120, and the kick surface 213 of the fourth step (which can be referenced to the third step, with the fourth step set between the third step and the substrate, such as...) Figure 8 (As shown) is used for coupling the fourth fiber positioning slot 130, and the substrate 20 is used for coupling the surface of the array base 1. It should be noted that, to improve integration, the preferred embodiment of the present invention uses... Figure 5 and Figure 6The combination schemes described herein are merely illustrative, and other secondary structural schemes that may arise when circumventing the preferred combination scheme of the present invention should be interpreted as another combination scheme that is equivalent to the preferred combination scheme of the present invention. In comparison, Figure 8 Structural ratio Figure 7 The structural coupling stability will be higher; intuitively, this means that the lower surface of the substrate 20 will fit more tightly with the upper surface of the array base 1. Figure 7 Its advantages lie more in its smaller size and less material usage.

[0041] The fiber array structure proposed in this embodiment of the invention, when applied to optical module scenarios, especially in transmitting components, distributes optical fibers 18 in the height direction to match laser components of different heights, thereby improving the space utilization rate of laser components in the vertical space inside the optical module.

[0042] The appendix to the above analysis Figure 1 The structure itself allows for more modular fiber optic arrays, enabling more flexible combinations of different numbers of laser components for various application scenarios. For example, a fiber optic array unit can be built with four lasers per group. If the number of lasers in the laser component needs to be set to eight, then the corresponding additional components... Figure 1 The number of fiber array units can be doubled, which also provides flexibility in the layout of laser components.

[0043] To facilitate the explanation of the actual application scenarios of the aforementioned fiber optic array and to illustrate the corresponding beneficial effects in conjunction with these scenarios, based on the fiber optic array provided in Embodiment 1 of the present invention, the following is discussed... Figure 1 The example scenario shown further demonstrates a combined application method of it in the transmitting components of optical modules. (See also...) Figure 9This invention also provides a transmitting component using a fiber optic array, comprising a laser assembly arranged in four layers (upper and lower) and a fiber optic array with four layers of fiber positioning slots coupled to the laser assemblies. The fiber optic array includes an array base 1 and an array cover 2. The array base 1 has four fiber positioning slots: a first fiber positioning slot 100, a second fiber positioning slot 110, a third fiber positioning slot 120, and a fourth fiber positioning slot 130, arranged in a staggered horizontal direction and spaced at a first preset height h1 from bottom to top. Fibers 18 disposed in the first fiber positioning slot 100, second fiber positioning slot 110, third fiber positioning slot 120, and fourth fiber positioning slot 130 are respectively coupled to the optical paths of the first laser assembly 30, second laser assembly 31, third laser assembly 32, and fourth laser assembly 33 in the upper and lower layers. A first lens 70 is coupled between the fiber 18 and the laser assembly for adjusting the light spot. In a possible implementation, two lenses can be arranged between a laser and an optical fiber 18. The first lens 70, adjacent to the laser, converts the diverging light emitted by the laser into horizontal light, while the second lens 71, adjacent to the light-incident surface of the optical fiber (e.g., ...). Figure 19 (As shown) This function converts horizontal light into focused light, thereby further meeting the requirements of miniaturized light spots in various scenarios.

[0044] The Transmitter Optical Subassembly (TOSA) is the core component in the optical module responsible for converting electrical signals into optical signals. It is located at the transmitting end and is responsible for achieving optical signal output. For example... Figure 9 The image shows a specific example of a 4-channel fiber optic array transmitter assembly. This is to achieve a three-dimensional layout of the laser assembly. Figure 10 and Figure 12 Two specific forms of a fixing bracket 3 for fixing the laser assembly are provided, wherein the fixing bracket 3 has a total of four layers.

[0045] like Figure 10 The image shows a mounting bracket 3 for a laser assembly with a four-layer structure; wherein, the vertical contact surfaces of each layer on the mounting bracket 3 that abut against the laser assembly are sequentially spaced horizontally at predetermined intervals, for example, in... Figure 10 The three vertical abutment surfaces are: the first vertical abutment surface 300, the second vertical abutment surface 310, the third vertical abutment surface 320, and the fourth vertical abutment surface 330, with a horizontal distance of d1 between them. Figure 5The horizontal spacing d1 shown in the figure); the preset spacing is equal to the left-right arrangement spacing of the first fiber positioning slot 100 and the second fiber positioning slot 110, and the vertical height difference of the light outlets of adjacent laser components is equal to the first preset height. Figure 10 Unlike other processes, the number of corresponding partitions 35 can also be adjusted during implementation. Figure 12 As shown in the diagram, specifically, the fixing bracket 3 consists of a vertical support plate 34 and four horizontally arranged partitions 35 on the support plate 34, and the gold fingers of each laser component are coupled to the conductive pattern on the support plate 34. For example, the gold fingers of the CoC (i.e., the aforementioned laser component) coupled with the laser are fabricated on the side of the CoC that is in contact with the support plate 34. In this way, the conductivity problem of multiple laser components in a three-dimensional layout can be effectively solved.

[0046] It can be seen that, in order to improve the overall integration tightness between the fixed bracket 3 and the laser assembly, the partition 35 located at the bottom of the fixed bracket 3 is removed in the design, and is directly connected by the heat conduction platform 5 (such as...). Figure 9 (As shown) can be used as an alternative. Alternatively, the heat-conducting platform 5 can be fabricated with slots for embedding the mounting bracket 3, and precision-machined and fixed using a three-axis positioning method. For those skilled in the art, Figure 11 This method is easier to fix, while Figure 10 This method saves more component materials, and relatively speaking, the alignment and fixing process can be completed more gradually by inserting the support plate 34 into the heat-conducting platform 5. In this respect, because Figure 11 The method shown has a large bottom area, which may lead to displacement or change in the adhesive or welding fixing.

[0047] In practice, for ease of manufacturing and to reduce the overall volume, the top vertical contact surface can usually be removed during the design phase, resulting in the following final effect: Figure 12 As shown. It is not difficult to understand, in Figure 10 The fourth vertical contact surface 330, located at the top, can serve to position the laser assembly. However, this requires additional material for the fixing bracket 3, and the vertical contact surface must also have a certain thickness to maintain the rigidity and prevent deformation necessary for the positioning function. This increases the volume of the fixing bracket 3. Therefore, this embodiment of the invention further proposes... Figure 12 The optional structure shown. In this case, because the top-layer laser assembly cannot be coupled via the conductive pattern on the support plate 34, in the implementation of this embodiment, the following can be selected: Figure 37 The flexible strip structure shown completes the electrical connection between the flexible strip structure and the printed circuit board (PCB).

[0048] In such Figure 10 and Figure 12 On the structure of the fixed bracket 3 shown, the first vertical abutment surface 300, the second vertical abutment surface 310, and the third vertical abutment surface 320 are staggered by a preset distance d1 on the left and right sides. The key point is to form Figure 10 The vertical structure shown by the dotted lines inside the middle support plate 34, with the thickness of each interlayer gradually narrowing from bottom to top, creates a unidirectional heat dissipation channel from top to bottom, avoiding cross-thermal interference.

[0049] like Figure 13 and Figure 14 As shown, a comparison is presented of the corresponding vertically aligned laser assembly and the innovative surrounding type of the present invention. Figure 12 The proposed structural comparison. Figure 14 The structural design, where the laser components in adjacent channels are not on the same vertical plane, allows for more efficient downward heat dissipation of the laser components in the corresponding different partitions, avoiding [further issues]. Figure 13 The problem of crosstalk caused by center-aligned stacking. This is because heat is conducted unidirectionally from high-temperature to low-temperature regions, whereas similar... Figure 13 The design of the support plate 34 shown will cause the heat conduction direction of the intermediate laser component to become uncontrollable, and if... Figure 14 The support plate 34 structure design shown can form an effective heat conduction step by relying on the structural effect of the thickness of each layer gradually narrowing from bottom to top in the vertical direction, thus creating unidirectional heat conduction and avoiding the problem of cross-thermal interference.

[0050] In this embodiment of the invention, the fixing bracket 3 for mounting the laser assembly is provided by, as shown in... Figure 1 The fiber optic array structure shown is defined by its structural characteristics. However, in reality, their design can be considered to have been completed simultaneously, such as... Figure 15 As shown, the output optical path of the corresponding second laser assembly 31 is to be coupled with the end face of the optical fiber 18 in the second optical fiber positioning slot 110 on the optical fiber array. The other first laser assembly 30, third laser assembly 32, and fourth laser assembly 33 in spatial position are also to be coupled with… Figure 15 The end faces of the optical fiber 18 in the first optical fiber positioning slot 100, the third optical fiber positioning slot 120, and the fourth optical fiber positioning slot 130 are coupled one by one.

[0051] The specific types of the first laser component 30 and the second laser component 31 are determined by those skilled in the art based on the specific application scenario. In one embodiment, the first laser component 30 and / or the second laser component 31 can be chips mounted on a carrier plate. In optical module packaging, the core sub-component formed by directly mounting an optical chip on a carrier plate is called a CoC. CoC is a chip-level packaging form in which laser or photodetector chips are fixed on a small carrier plate through processes such as soldering. The specific type of carrier plate is determined by those skilled in the art based on the specific application scenario. In one embodiment, the carrier plate can be made of tungsten-copper alloy or other thermally conductive materials. It should be noted that the CoC example here is merely an explanation to facilitate those skilled in the art to effectively map the laser components in the embodiments of the present invention to existing technical theories. In the present invention, the laser component is more of an integrated component that integrates laser characteristics and can be directly assembled and operated. In some optional solutions, the corresponding laser component itself can also be equipped with detectors, thermistors, and other devices.

[0052] The present invention's embodiment features a structural design in which laser components in adjacent channels are not located on the same vertical plane. This design allows for more efficient downward heat dissipation of the laser components in the corresponding different partitions, avoiding the crosstalk problem caused by simple alignment stacking.

[0053] Example 2: In Example 1, not only was the following described... Figure 1 , Figure 2 and Figure 3 The illustrated centralized fiber optic array optional structure scheme also focuses on its... Figure 1 The structural details of the fiber optic array and its corresponding application combinations are described in detail. The embodiments of this invention focus on... Figure 2 As a structural implementation method for fiber optic arrays, its technical details are elaborated in detail, and it is related to... Figure 1 Further analysis will be conducted on the differences in implementation characteristics.

[0054] Example 1 has already described the fiber array side, such as Figures 4-15 As shown in Embodiment 1, the first fiber positioning slot 100 is located at the bottom of the stepped channel 19 on the array base 1, the second fiber positioning slot 110 is located on the first step 10, and the bottom of the first step 10 and the stepped channel 19 are vertically separated by a first preset height in the fiber array arrangement design. Embodiment 2 of the present invention also provides a surrounding Figure 2 The structural framework shown is designed to form the fiber optic array.

[0055] like Figure 16As shown, the array base 1 is also provided with a third fiber positioning slot 120 and a fourth fiber positioning slot 130. The third fiber positioning slot 120 and the fourth fiber positioning slot 130 replicate the relative structural relationship of the first fiber positioning slot 100 and the second fiber positioning slot 110 on the array base 1, and form an arrangement with the first fiber positioning slot 100 and the second fiber positioning slot 110. To adapt to the array base 1, accordingly, as shown... Figure 17 and Figure 18 As shown, in one embodiment, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and has a three-dimensional square wave shape. The peak 215 of the square wave is used to abut against the second optical fiber positioning groove 110 and the fourth optical fiber positioning groove 130, and the trough 216 of the square wave is used to abut against the first optical fiber positioning groove 100 and the third optical fiber positioning groove 120.

[0056] pass Figure 18 We can also see the change in its structural details; the structure 21 extends beyond the preset length d2 of the array base 1; lens mounting bases 214 are fabricated on the peaks 215 and troughs 216 of the structure 21 at the preset length. The core reason for proposing this optional implementation of the lens mounting base 214 is that current lasers themselves are undergoing size optimization, resulting in smaller light spots and greater difficulty in coupling. Therefore, setting a second lens 71 on the input port side of the fiber array has become an increasingly popular choice for design manufacturers. After installing the second lens 71, the fiber array described in this embodiment... Figure 19 As shown, the preset length is determined by those skilled in the art based on the specific application scenario. The reason for fabricating the lens mounting base 214 on the structure 21 of the array cover plate 2 instead of the array base 1 is that the array base 1 needs to support the position of the fiber positioning groove. Introducing the lens mounting base 214 at this time would not only increase the difficulty of designing around avoiding structural conflicts, but also further increase the difficulty of fabricating the base.

[0057] pass Figure 18 It can also be observed that the corresponding lens mounting base 214 is integrally machined onto the structure 21, and the lens mounting base 214 can be considered as the rear surrounding Figure 18 In fiber optic array applications, a structural representation of the mounting column 4 for laser components is adopted (the column 4 will be described in detail later when the application scenario is further elaborated).

[0058] exist Figure 18 The lens mounting base 214 can be understood from two structural perspectives.

[0059] like Figure 20As shown, from a first-person perspective: it can be understood as two I-shaped pillars (such as...). Figure 20 The combined structure (shown in the shaded area) includes a plane below the I-shaped pillar that is connected, while the width of the plane above the I-shaped pillar is each limited within the width distance of the crest 215 of the three-dimensional square wave of structure 21. This allows the lens mounting base 214 to be directly obtained by extending the array cover plate 2 to a specified length and then etching or laser cutting. This simplifies the manufacturing process and reduces material waste. Figure 17 It can also be seen that the reason why the tops of the I-shaped pillars are independent and not connected is, on the one hand, the preferred solution is to use an extended array cover, and the three-dimensional square wave peaks 215 are themselves disconnected; on the other hand, it is to allow the second lens 71 set between adjacent I-shaped pillars to be effectively adjusted by relying on the gap above the I-shaped pillars.

[0060] like Figure 21 As shown, from the second perspective: it can be understood that T-shaped pillars (such as...) are made on the array cover plate 2. Figure 21 (As shown in the shaded area).

[0061] The two perspectives mentioned above are merely explanations derived from different analytical viewpoints on the same structure, viewed from different reference points. However, it can be further understood as... Figure 18 The lens mounting base 214 shown can also be obtained not only from the extended structure 21 through secondary processing; in the actual processing method, it can also be processed in the same process as the corresponding structure 21, that is, the lens mounting base 214 is also processed at the same time as the three-dimensional square wave structure 21 is processed using the same blank.

[0062] exist Figure 22 The paper also provides another structural design idea for the lens mount 214, namely, to create a platform on the waist of the extended three-dimensional square wave crest 215. In fact, and... Figure 20 In comparison, this can be understood as removing the vertical support 217 of the corresponding I-shaped column. Figure 22 and Figure 20 By comparison, one can observe Figure 20 The lens mount 214 is more reliable, while Figure 22 While the lens mount 214 is easier to manufacture, its reliability is correspondingly reduced. However, it is still one of the optional methods for implementing this invention.

[0063] If according to Figure 23To understand this using an example of a fiber optic array structure, the relative structural relationship between the first fiber positioning slot 100 and the second fiber positioning slot 110 on the array base 1 is replicated not only by the third fiber positioning slot 120 and the fourth fiber positioning slot 130, but also by the fifth fiber positioning slot 140 and the sixth fiber positioning slot 150, as well as the seventh fiber positioning slot 160 and the eighth fiber positioning slot 170. Figure 18 and Figure 23 The application scenarios and characteristics of each differ, among which, Figure 18 The application scenarios are suitable for situations where the corresponding laser components number 4, or 4 components per group; and the corresponding Figure 23 The application scenario is more suitable for a group of 8 laser components; and, through Figure 18 and Figure 23 From the perspective of the upright placement, it is not difficult to see that in the various embodiments of the present invention, the fiber optic array can be placed in a way that the array base 1 is located below and close to the substrate 20, with the array cover 2 facing upwards; or it can be placed in a way that the array cover 2 is located below and close to the substrate 20, with the array base 1 facing upwards.

[0064] Although Figure 23 The document does not show an example structure of a lens mounting base 214 on a corresponding fiber optic array, however, Figure 23 It is itself Figure 18 The number of fiber optic positioning slots was simply replicated by Figure 18 The 4-channel structure evolved into an 8-channel structure, therefore, it can be easily replicated. Figure 18 The lens mounting bracket 214 structure in the middle Figure 23 I will not go into too much detail here.

[0065] As the most typical representation of the number of optical fibers 18 in the embodiments of this invention Figure 23 The fiber optic array shown in the embodiment of the present invention further provides an example of its application in a transmitting component, such as... Figure 24 and Figure 25 As shown, in the corresponding transmitting components, four pillars 4 serve the eight laser components, namely the first pillar 40, the second pillar 41, the third pillar 42, and the fourth pillar 43. In this embodiment of the invention, the laser component disposed on the side of the first pillar 40 is designated as the first laser component 30, and the laser component disposed on the top of the first pillar 40 is designated as the second laser component 31. It should be noted that, in order to demonstrate the coupling relationship between the optical fiber 18 and the laser component (e.g., ...), Figure 24 (as indicated by the dashed arrow in the middle) Figure 24 The middle does not set such Figure 19 The lens mounting base 214 and the second lens 71 shown can also be based on [other components] in practical applications to achieve better results. Figure 19 The lens mounting base 214 and the second lens 71 are provided.

[0066] Furthermore, in this embodiment of the invention, the first column 40, the second column 41, the third column 42, and the fourth column 43 are evenly and equidistantly arranged on the heat-conducting platform 5. The laser assembly disposed on the side of the second column 41 is designated as the third laser assembly 32, and the laser assembly disposed on the top of the second column 41 is designated as the fourth laser assembly 33. The laser assembly disposed on the side of the third column 42 is designated as the fifth laser assembly 36, and the laser assembly disposed on the top of the third column 42 is designated as the sixth laser assembly 37. The laser assembly disposed on the side of the fourth column 43 is designated as the seventh laser assembly 38, and the laser assembly disposed on the top of the fourth column 43 is designated as the eighth laser assembly 39.

[0067] In many optional embodiments of the present invention, the column 4 is T-shaped, π-shaped, or rectangular. For example... Figure 25 The image shows a specific example of a T-shaped pillar 4, used to ensure space for gold wire bonding. For example... Figure 26 The image shows a specific example of a π-shaped pillar 4. Figure 25 and Figure 26 The diagram shows two sets of structural options for the pillars 4. As an optional solution, the heat-conducting platform 5, used to fix the first pillar 40, second pillar 41, third pillar 42, and fourth pillar 43, has pre-fabricated positioning grooves for securing the respective pillars. Alternatively, it can be achieved through... Figure 26 and Figure 27 The number of additional columns 45 shown is to improve the stability of the platform after the columns 4 are installed.

[0068] By comparison, it can be observed that in the embodiments of the present invention... Figure 24 The introduced structure of the pedestal 4 for setting up the laser assembly and Figure 18 The lens mount 214 in the image is very similar, for a simple reason: the laser assembly can be viewed as the projection of the second lens 71 on the incident light side of the corresponding fiber array.

[0069] Therefore, as an optional implementation scheme, in the corresponding Figure 24 and Figure 25 If the machining precision of the stage 4 where the laser assembly is located is high enough, then the stages 4 can also be interconnected. Figure 18In the first-person perspective, the corresponding first pillar 40, second pillar 41, third pillar 42 and fourth pillar 43 are connected as the lower plane structure of the I-beam. They can be integrally formed or obtained by assembly and fixation. In this way, the assembly components of the optical module can be divided into blocks, which can further improve the assembly efficiency.

[0070] Through the above surrounding Figure 24 Structural analysis makes it easy to see Figure 24 The fiber optic array shown can also be referenced Figure 19 To better highlight the rationality of the fiber array structure designed in this invention and the ingenuity of the corresponding additional lens mounting 214, the following section introduces the planar fiber optic slot design concept from another optional embodiment of this invention (such as...). Figure 28 The vertical fiber array solution (shown) illustrates the shortcomings and problems when applied to situations requiring a lens mounting base 214.

[0071] like Figure 28 As shown, the first fiber positioning slot 100 and the second fiber positioning slot 110 are directly fabricated on the upper and lower planes of an array base 1, and the corresponding array cover plate 2 is also manifested as a first array cover plate 22 and a second array cover plate 23 respectively adapted to the lower surface and upper surface of the array base 1. Figure 28 Based on its structural foundation, it can be seen that it lacks features similar to those of this invention. Figure 18 The space shown for fabricating the lens mounting base 214 on the array cover plate 2 can only be used to assemble the second lens 71 (not shown in the figure) by directly gluing it to the light-incident surface of the optical fiber 18 (the end face closest to the laser assembly). This inevitably leads to assembly difficulties and deviations. It should be noted that... Figure 28 The structure shown can also be achieved by fabricating lens mounting bases 214 in the extended areas of the array base 1 and the array cover plate 2 respectively, but this would inevitably increase the difficulty of fabrication accuracy and the amount of deviation during coupling. This further demonstrates the innovation of the fiber optic array structure proposed in this embodiment of the invention. Figure 28 It is not difficult to see that, because its first array cover plate 22 serves as both a cover and a fixing plate for the optical fiber 18, it also acts as a substantial base for the optical fiber array. Figure 28 The array base 1 in the original text is merely a base for the fiber positioning slots. This leads to a problem: if the adhesive expands or contracts with temperature changes, it can cause alignment instability between the fixed fiber 18 and the laser assembly. In contrast, the solution proposed in this embodiment uses its square wave limiting shape and uniform unilateral fixing method to achieve a more stable alignment. Figure 28The fiber optic array structure is much more stable.

[0072] Example 3: This embodiment of the invention revolves around the same core innovative point of this invention as in Example 1. Figure 3 The example of a fiber optic array shown. Only with... Figure 1 , Figure 2 and Figure 3 The three fiber optic array examples presented in this invention clearly demonstrate that, in Embodiment 1, the focus is on... Figure 1 The described structure is more suitable for solutions involving single-sided laser module layouts (and makes full use of the internal space of the module located on one side of the PCB after the PCB is installed inside the optical module); in Example 2, around Figure 2 The described structure is more suitable for situations where heat dissipation and temperature control do not reach the level of Example 1. Figure 1 In the case of a four-layer laser assembly structure, a compromise solution is adopted to reduce the corresponding four-layer laser assembly to a two-layer laser assembly; while this embodiment revolves around Figure 3 The fiber optic array shown is in Figure 1 Building upon this foundation, further utilizing the spatial location of the PCB board within the optical module, and the characteristic that the heat-conducting platform 5 (usually made of tungsten copper) in the transmitting assembly is fixed by slotting into the PCB board, the corresponding laser components are arranged on the front and back sides of the heat-conducting platform 5. This leads to the following: Figure 3 The unique design of the density and vertical spacing of the corresponding fiber positioning slots in the fiber array shown.

[0073] like Figures 29-32 As shown, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and has a comb-shaped wave design. The peaks 215 of the comb-shaped wave abut against the first fiber positioning groove 100, the second fiber positioning groove 110, and the third fiber positioning groove 120. The substrate 20 abuts against the fourth fiber positioning groove 130. It should be noted that, as... Figure 32 As shown, the laser assembly is arranged in a manner similar to... Figure 24 The settings are similar in other cases, so I won't go into detail here. Figure 32 The structure shown is relative to Figure 24 The main difference in the structures shown is that, Figure 32The laser assembly described herein is disposed on both sides of the heat-conducting platform 5. At least two pillars 4 are disposed on both sides of the heat-conducting platform 5, and the laser assembly is mounted on the top and side of the pillars 4. The structure 21 adopts a comb-like structure, and based on this, the relative positions of the fiber optic positioning slots are redefined. The first fiber optic positioning slot 100 and the second fiber optic positioning slot 110 are disposed below the heat-conducting platform 5, and the optical fibers in the first fiber optic positioning slot 100 and the second fiber optic positioning slot 110 are coupled to the laser assembly disposed below the heat-conducting platform 5. Specifically, the first fiber optic positioning slot 100 is disposed below the top of the first pillar 40, and the second fiber optic positioning slot 110 is disposed on one side of the first pillar 40. The third fiber positioning slot 120 and the fourth fiber positioning slot 130 are disposed above the heat-conducting platform 5. The optical fibers in the third fiber positioning slot 120 and the fourth fiber positioning slot 130 are coupled to the laser assembly disposed above the heat-conducting platform 5. Specifically, the third fiber positioning slot 120 is disposed on one side of the second column 41, and the fourth fiber positioning slot 130 is disposed above the top of the second column 41.

[0074] Furthermore, to ensure the heat dissipation efficiency of each laser component, based on the alternating arrangement of n first fiber positioning slots 100 and m second fiber positioning slots 110, with the n first fiber positioning slots 100 forming a first fiber positioning slot array and the m second fiber positioning slots 110 forming a second fiber positioning slot array, the corresponding positioning slots and other structures are arranged relatively uniformly in an array form; furthermore, the array base 1 is also provided with p third fiber positioning slots 120 and q fourth fiber positioning slots 130, wherein the plane where the p third fiber positioning slots 120 are located is higher than the plane where the m second fiber positioning slots 110 are located by a second preset height h2, and the plane where the q fourth fiber positioning slots 130 are located is higher than the plane where the p third fiber positioning slots 120 are located by a third preset height h3; the first fiber positioning slots 100 and the second fiber positioning slots 110 are vertically separated by a first preset height h1. In this arrangement, the fiber optic array consists of a group of adjacent first fiber positioning slots 100, second fiber positioning slots 110, third fiber positioning slots 120, and fourth fiber positioning slots 130, forming a periodic arrangement. Specifically, in one embodiment, such as... Figure 31 As shown, the third preset height h3 is equal to the first preset height h1, that is, the third fiber positioning slot 120 and the fourth fiber positioning slot 130 are arranged horizontally and vertically at a distance of the first preset height; the second preset height h2 is determined according to the array spacing of two adjacent laser arrays set in a mirror image.

[0075] This embodiment can be understood as being in Embodiment 1. Figure 1A type of alternative structure is used in the application of double-sided laser assembly on a heat-conducting platform 5. The reason it is described as... Figure 1 A type of substitution structure, the reason being, Figure 1 The corresponding adjacent fiber optic positioning slots are fabricated within a common stepped channel 19, but at different channel depths. Figure 29 This simplifies the process by directly creating a separate channel for each fiber positioning slot, thus forming a comb-like channel structure. For example... Figure 29 The array base 1 with the comb-like communication structure shown presents a challenge in achieving high machining precision. Furthermore, in Reference Embodiment 1... Figure 1 The fiber optic array solution shown is in Figure 29 Similarly, the four fiber optic positioning slots can be grouped together (e.g.) Figure 29 (as shown in the dashed box), thus enabling... Figure 29 The 32 fiber optic positioning slots are divided into 8 independent groups for combination.

[0076] The corresponding combination of laser components and Figure 31 The transmitting component following the fiber array structure shown is as follows: Figure 32 As shown, the column 4 has a T-shaped structure. The laser assembly mounted on the side of the column 4 is in contact with the heat-conducting platform 5 to dissipate heat through the heat-conducting platform 5. The rear end of the laser assembly located at the top of the column 4 is coupled with an inverted L-shaped heat-conducting component 50 to transfer the heat of the laser assembly to the heat-conducting platform 5. From the perspective of the heat-conducting platform 5 alone, the arrangement of the laser assembly is consistent with the arrangement via the column 4 in Embodiment 2. It is not difficult to see from this that the implementation difficulty of this embodiment is higher than that of the fiber array in Embodiment 1. However, the implementation difficulty of the laser assembly in Embodiment 1 is reduced to the level of Embodiment 2, thus ensuring that the overall process difficulty is within the tolerance of the current production line.

[0077] Example 4: This embodiment focuses on embodiment 1, which is the most difficult to achieve temperature control among the various embodiments of the present invention. Figure 9 The laser assembly with the layered layout shown provides an achievable solution.

[0078] like Figure 33As shown, the laser assembly is supported by a comb-shaped base 6, which is vertically fixed on the heat-conducting platform 5. The comb teeth 60 of the comb-shaped base 6 extend horizontally, and each comb tooth 60 is equipped with a laser assembly. In this embodiment, the comb-shaped base 6 is essentially the fixed bracket 3 with a partition structure in embodiment 1. The description of it as a comb-shaped base 6 in this embodiment is due to its shape resembling an upright comb, thus using a more vivid term, but essentially both describe the same technical object. In the following description, the relevant descriptions of the comb-shaped base 6 can be directly mapped to the relevant appendix in embodiment 1. Figure 12 The structural features described herein will be appropriately referenced in this embodiment.

[0079] Among them, such as Figure 34 As shown, the comb back of the comb-shaped base 6 increases in thickness by a specified parameter from top to bottom with each stage of comb teeth 60 (represented as partitions 35 in Embodiment 1). This characteristic description is the same as the related characteristic description of the laser component mounting bracket 3 in Embodiment 1: the vertical contact surfaces of each partition on the mounting bracket 3 that abut against the laser component are successively horizontally separated by a preset distance. In this way, a unidirectional heat dissipation channel can be established from top to bottom, avoiding cross-thermal interference.

[0080] One sidewall of each laser assembly abuts against the bottom 61 of the comb teeth, and the other sidewall of the laser assembly abuts against the heat dissipation assembly 8. For example... Figure 35 As shown, the other sidewall of the laser assembly specifically refers to... Figure 35 The shaded surface in the image, and the corresponding sidewall of the laser component, specifically refers to... Figure 35 The surface opposite to the shaded side.

[0081] To achieve better heat dissipation, the length of the comb teeth 60 is also strictly constrained in this embodiment of the invention, such as... Figure 35 As shown, the distance d4 from the top of each comb tooth 60 to the bottom 61 of the comb tooth gap is the same. In the most direct embodiment of this invention, the length of the comb tooth 60 described here is the same as the width of the laser assembly fixed to its surface; the plane of the other sidewall of each laser assembly coincides with the plane of the top of the comb tooth 60 that supports it. In this way, it can be ensured that one side of the corresponding laser assembly abuts against the bottom 61 of the comb tooth gap, and the other side, together with the top surface of the comb tooth 60, abuts against the vertical heat-conducting surface of the heat dissipation assembly 8.

[0082] In conjunction with the embodiments of the present invention, considering that in practical application scenarios, a homogeneous heat dissipation component 8 alone may not be sufficient to meet specific heat dissipation requirements. In particular, with the increasing trend towards higher integration requirements, it is impossible to provide sufficiently large gaps to allow for the placement of a sufficiently large heat dissipation component 8 between the comb-shaped bases 6 to achieve the desired heat dissipation effect. Therefore, the embodiments of the present invention also provide an alternative... Figure 35 The preferred embodiment of the heat dissipation assembly 8 made of homogeneous material shown.

[0083] like Figure 36 As shown, the heat dissipation assembly 8 is composed of three L-shaped thermoelectric coolers (TECs) and one rectangular TEC. From top to bottom, the heat dissipation assembly 8 consists of a fourth TEC 83, a third TEC 82, a second TEC 81, and a first TEC 80. The fourth TEC 83 transfers heat from the other sidewall of the fourth laser assembly 33 to the top surface of the third TEC 82 located below it. The third TEC 82 transfers heat from the other sidewall of the third laser assembly 32 and the fourth TEC 83 to the top surface of the second TEC 81 located below it. The second TEC 81 transfers heat from the other sidewall of the second laser assembly 31 and the third TEC 82 to the top surface of the first TEC 80 located below it. The first TEC 80 transfers heat from the other sidewall of the first laser assembly 30 and the second TEC 81 to the heat-conducting platform 5 located below it. In the optional implementation scheme, the first TEC can also adopt the same L-shaped structure as other TECs, and the vertical part of the corresponding L-shaped structure is directly embedded in the heat conduction platform 5. This is also an improved design that takes into account the consistency of the corresponding procurement specifications.

[0084] In the implementation scheme using TEC combinations, the selection of the fourth TEC83, third TEC82, second TEC81, and first TEC80 is preferably based on the power matching according to the number of laser components they support; for example, the fourth TEC83 requires the heat dissipation power of one laser component, the third TEC82 requires the heat dissipation power of two laser components, the second TEC81 requires the heat dissipation power of three laser components, and the first TEC80 requires the heat dissipation power of four laser components. Therefore, Figure 36 The four TECs shown are stacked, and their right stacking surface is a vertical plane. However, in reality, due to power selection and cost considerations, the corresponding... Figure 36 The stacked surface on the right is stepped (not shown in the attached figure).

[0085] To achieve more precise temperature control, the laser assembly is typically coupled with a thermistor (such as...). Figure 36 (As shown in the shaded area), the thermistor is used to accurately detect the true junction temperature of the laser component and provide a temperature feedback signal for closed-loop temperature control of the TEC. The thermistor and the TEC are coupled to the control circuit. The control circuit calculates the current temperature based on the resistance or voltage of the thermistor, compares it with the preset temperature, and drives the TEC to cool or heat, so that the laser component operates at a constant temperature.

[0086] like Figure 37 The diagram shows an optional implementation scheme for the external electrical interface connection provided by the corresponding stacked laser component layout solution of this invention. It is implemented using a flexible band 62. In actual implementation, the PCB carrying the driver chip can also be fabricated as a small chip and vertically mounted. Figure 37 The back side of the laser component array shown further reduces the increased impedance matching difficulty caused by the varying softband lengths of the individual laser components. It should be noted that... Figure 37 The flexible strip in the middle did not have a mating position on the PCB board side. Figure 37 Accurate expression in Chinese, while Figure 37 The image shows the other ends of the soft strips stacked together as an illustration.

[0087] This invention provides a high-speed optical module, which includes a transmitting component of any of the above-mentioned fiber array applications, without specific limitations. The fiber array distributes optical fibers in the height direction to match laser components at different heights, thereby improving the space utilization rate of the laser components in the vertical space inside the high-speed optical module.

[0088] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A transmitting assembly, characterized in that, It includes an optical fiber array, a heat-conducting platform (5), and at least four laser components disposed on the front and back surfaces of the heat-conducting platform (5); The fiber optic array includes an array base (1) and an array cover plate (2). The array base (1) is provided with at least four fiber optic positioning slots: a first fiber optic positioning slot (100), a second fiber optic positioning slot (110), a third fiber optic positioning slot (120), and a fourth fiber optic positioning slot (130). The first fiber optic positioning slot (100) and the second fiber optic positioning slot (110) are arranged horizontally and vertically at a first preset height. The third fiber optic positioning slot (120) and the fourth fiber optic positioning slot (130) are arranged horizontally and vertically at a first preset height. At least two columns (4) are provided on the front and back surfaces of the heat-conducting platform (5). The laser assembly is installed on the top and side of the column (4). An inverted L-shaped heat-conducting component (50) is coupled to the rear end of the laser assembly located at the top of the column (4) to transfer the heat of the laser assembly to the heat-conducting platform (5). The first fiber positioning slot (100) and the second fiber positioning slot (110) are disposed below the heat-conducting platform (5), and the optical fibers in the first fiber positioning slot (100) and the second fiber positioning slot (110) are coupled to the laser assembly disposed below the heat-conducting platform (5); the third fiber positioning slot (120) and the fourth fiber positioning slot (130) are disposed above the heat-conducting platform (5), and the optical fibers in the third fiber positioning slot (120) and the fourth fiber positioning slot (130) are coupled to the laser assembly disposed above the heat-conducting platform (5).

2. The launching assembly according to claim 1, characterized in that, The first preset height is set according to the height difference between the upper and lower stacked lasers.

3. The launching assembly according to claim 1, characterized in that, The first fiber positioning groove (100) is located at the bottom of the stepped channel (19) generated on the array base (1), and the second fiber positioning groove (110) is located on the first step (10); wherein the first step (10) and the bottom of the stepped channel (19) are vertically separated by the first preset height.

4. The launching assembly according to claim 3, characterized in that, The third fiber positioning groove (120) is located on the second step (11) which is a second preset height away from the first step (10), and the fourth fiber positioning groove (130) is located on the third step (12) which is a third preset height away from the second step (11); wherein, the height difference between the first step (10), the second step (11) and the third step (12) relative to the bottom of the step channel (19) increases sequentially, and the horizontal distance between them relative to the bottom of the step channel (19) increases sequentially.

5. The launching assembly according to claim 4, characterized in that, The array cover plate (2) includes a substrate (20) and a structure (21). The structure (21) is located on the substrate (20) and is processed into a stepped shape. The kick surface (210) of the first step is used to couple the first optical fiber positioning groove (100), the kick surface (211) of the second step is used to couple the second optical fiber positioning groove (110), the kick surface (212) of the third step is used to couple the third optical fiber positioning groove (120), and the substrate (20) is used to couple the fourth optical fiber positioning groove (130).

6. The launching assembly according to claim 4, characterized in that, The array cover plate (2) includes a substrate (20) and a structure (21). The structure (21) is located on the substrate (20) and is processed into a stepped shape. The kick surface (210) of the first step is used to couple the first optical fiber positioning groove (100), the kick surface (211) of the second step is used to couple the second optical fiber positioning groove (110), the kick surface (212) of the third step is used to couple the third optical fiber positioning groove (120), and the kick surface (213) of the fourth step is used to couple the fourth optical fiber positioning groove (130). The substrate (20) is used to couple the corresponding surface of the array base (1).

7. The launching assembly according to claim 3, characterized in that, The third fiber positioning slot (120) and the fourth fiber positioning slot (130) replicate the relative structural relationship of the first fiber positioning slot (100) and the second fiber positioning slot (110) on the array base (1), and form an arrangement combination with the first fiber positioning slot (100) and the second fiber positioning slot (110).

8. The launching assembly according to claim 7, characterized in that, The array cover plate (2) includes a substrate (20) and a structure (21). The structure (21) is located on the substrate (20). The structure (21) is a three-dimensional square wave shape, wherein the peak (215) of the square wave is used to abut against the second optical fiber positioning groove (110) and the fourth optical fiber positioning groove (130), and the trough (216) of the square wave is used to abut against the first optical fiber positioning groove (100) and the third optical fiber positioning groove (120).

9. The launching assembly according to claim 8, characterized in that, On the light-incident side, the structure (21) extends beyond the array base (1) by a predetermined length; lens mounting bases (214) are made on the peaks (215) and troughs (216) of the structure (21) of the predetermined length.

10. The transmitting assembly according to claim 1, characterized in that, n first fiber positioning slots (100) and m second fiber positioning slots (110) are arranged alternately, wherein the n first fiber positioning slots (100) constitute a first fiber positioning slot array and the m second fiber positioning slots (110) constitute a second fiber positioning slot array.

11. The transmitting assembly according to claim 10, characterized in that, The array base (1) is also provided with p third fiber positioning slots (120) and q fourth fiber positioning slots (130). The plane where the p third fiber positioning slots (120) are located is higher than the plane where the m second fiber positioning slots (110) are located by a second preset height, and the plane where the q fourth fiber positioning slots (130) are located is higher than the plane where the p third fiber positioning slots (120) are located by a third preset height. The fiber array is arranged in a periodic pattern with adjacent first fiber positioning slots (100), second fiber positioning slots (110), third fiber positioning slots (120) and fourth fiber positioning slots (130).

12. The transmitting assembly according to claim 11, characterized in that, The array cover plate (2) includes a substrate (20) and a structure (21). The structure (21) is located on the substrate (20). The structure (21) is a comb-shaped wave. Each peak (215) of the comb wave is used to abut against the first fiber positioning groove (100), the second fiber positioning groove (110) and the third fiber positioning groove (120). The substrate (20) is used to abut against the fourth fiber positioning groove (130).

13. The transmitting assembly according to claim 11, characterized in that, The third preset height is equal to the first preset height, and the second preset height is determined according to the array spacing of two adjacent sets of laser components in the mirror configuration.

14. The transmitting assembly according to claim 1, characterized in that, The column (4) is T-shaped, π-shaped or rectangular.

15. The launching assembly according to claim 1, characterized in that, It also includes a fixed bracket (3) with at least two partition structures; wherein, the vertical contact surfaces of each partition on the fixed bracket (3) for contacting the laser components are horizontally separated by a preset distance; the preset distance is equal to the left-right arrangement distance of the first fiber positioning groove (100) and the second fiber positioning groove (110), and the vertical height difference of the light outlets of adjacent laser components is equal to the first preset height.

16. The launching assembly according to claim 15, characterized in that, The fixed bracket (3) consists of a vertical support plate (34) and at least one horizontal partition (35) arranged on the support plate (34).

17. A high-speed optical module, characterized in that, The high-speed optical module includes the transmitting component as described in any one of claims 1-16.

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