Test method and system for connecting tests of different test equipment

Abstract

The application relates to the field of semiconductor technology, in particular to a test method and system for communication test of different test equipment. A transmission control protocol is configured in a server; a data transmission channel between a test host and a test slave is established by using the transmission control protocol; a general interface bus is used to connect the test host and the test slave, so that an instruction transmission channel between the test host and the test slave is established; the test host sends test instructions to the test slave through the instruction transmission channel; the test slave obtains the test instructions, executes test on a wafer, and obtains slave test results of the wafer; and the slave test results of the test slave are fed back to the test host through the data transmission channel. The application unifies and analyzes the slave test results of the multiple test equipment, improves the test efficiency, and reduces the quality risk caused by long-distance transfer during cross-platform test.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a test method and system for interconnection testing of different test devices. Background Technology

[0002] Current CIS (CMOS Image Sensor) chip testing typically requires step-by-step testing on different ATE (Automatic Test Equipment) platforms. However, this cross-platform testing approach based on multiple test devices has drawbacks, including long testing cycles. Furthermore, platform switching and long-distance transport can lead to uncontrollable quality risks in the wafer under test, reducing testing efficiency and extending operation time. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose a test method and system for connectivity testing of different test devices, in order to solve the above-mentioned technical problems.

[0004] To achieve the above objectives, this application provides a test method for interconnectivity testing of different test devices, wherein the test devices include a test host and a test slave for performing wafer testing, comprising:

[0005] Configure the transmission control protocol in the server; The transmission control protocol is used to establish a data transmission channel between the test host and the test slave. A general-purpose interface bus is used to connect the test host and the test slave to establish an instruction transmission channel between the test host and the test slave; The test host sends test commands to the test slave through the command transmission channel. The test instruction is obtained using the test slave device, the test is performed on the wafer, and the slave test result of the wafer is obtained; The slave test results of the slave device are fed back to the test host through the data transmission channel; The test host is used to analyze the test results of the slave device in order to complete the connectivity test between the test host and the test slave device.

[0006] Optionally, establishing a data transmission channel between the test host and the test slave using the transmission control protocol includes: Establish a local area network based on the Transmission Control Protocol (TCP). In the local area network, the test host first requests a connection to a server running the TCP. Configure the server with a static Internet Protocol address, and establish a connection between the test slave and the server through a handshake to perform data transmission between the test host and the test slave.

[0007] Optionally, before sending test commands to the test slave via the command transmission channel using the test host, the following steps are included: The test host is used to perform functional tests on the wafer and obtain the functional test results of the wafer.

[0008] Optionally, the step of feeding back the slave test results of the test slave device to the test host through the data transmission channel includes: The slave test results of the test slave are fed back to the test host through the data transmission channel, and the slave test results of the test slave are saved in the first storage path; The step of performing functional tests on the wafer using the test host and obtaining the functional test results of the wafer includes: The functional test results of the wafer are obtained and saved in a second storage path, wherein the first storage path is different from the second storage path.

[0009] Optionally, the analysis of the slave device test results using the test host includes: The test host is used to analyze the test results of the slave device, and the slave device test results include test data in a first format; The acquisition of the functional test results of the wafer includes: Obtain the functional test results of the wafer, which include test data in a second format.

[0010] Optionally, after performing functional testing on the wafer using the test host and obtaining the functional test results of the wafer, and before sending test commands to the test slave device through the command transmission channel using the test host, the process includes: The wafers are classified according to the functional test results. Perform failure classification on the wafers that fail the functional tests; The wafer that has passed the functional test is used as the wafer to be tested, and the test slave device is used to test the wafer to be tested again.

[0011] Optionally, the step of using the wafer that has passed the functional test as the wafer under test, and then using the test slave to test the wafer under test again, includes: The wafer is reclassified based on the wafer slave test results of the test slave device. The failure classification is performed again on the wafers that fail the test; Obtain and output the tested wafer that has passed the test.

[0012] Optionally, the step of connecting the test host and the test slave using a universal interface bus includes: The communication between the test host and the test slave is determined using hexadecimal code values.

[0013] Optionally, the step of sending test commands to the test slave via the command transmission channel using the test host includes: The test host sends test commands to multiple test slaves through the command transmission channel.

[0014] Based on the same inventive concept, this application provides a test system for interconnection testing of different test devices, including: The Transmission Control Protocol (TCP) configuration module is used to configure the TCP in the server. The data transmission module is used to establish a data transmission channel between the test host and the test slave using the transmission control protocol; The instruction transmission module is used to connect the test host and the test slave using a general interface bus to establish an instruction transmission channel between the test host and the test slave. The test command sending module is used to send test commands to the test slave through the command transmission channel using the test host. The testing module is used to obtain the test instructions using the test slave device, perform tests on the wafer, and obtain the slave test results of the wafer. The data feedback module is used to feed back the slave test results of the test slave to the test host through the data transmission channel; The results analysis module is used to analyze the test results of the slave device using the test host in order to complete the connectivity test between the test host and the test slave device.

[0015] As described above, the testing method and system for interconnecting different test devices provided in this application utilize a transmission control protocol to establish a data transmission channel between the test host and the test slave, thereby connecting and integrating two test devices into a unified test system. This shortens the test delivery cycle and reduces testing costs. By using a universal interface bus to connect the test host and the test slave, a command transmission channel is established between them, enabling rapid command interaction and unified analysis of slave test results from multiple test devices. This improves testing efficiency and reduces the quality risks associated with long-distance transport during cross-platform testing. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A flowchart of a test method for connectivity testing of different test devices provided in an embodiment of this application; Figure 2 A flowchart illustrating the process of establishing a data transmission channel between a test host and a test slave using a transmission control protocol in a test method for interconnection testing of different test devices provided in an embodiment of this application; Figure 3 A data flow diagram between the test host, test slave, and server in a test method for connectivity testing of different test devices provided in an embodiment of this application; Figure 4 A flowchart of a test method for connectivity testing of different test devices provided in another embodiment of this application; Figure 5 A block diagram of a test system for interconnection testing of different test devices provided in another embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0019] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the component or object preceding the word covers the components or objects listed after the word and their equivalents, without excluding other components or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0020] It should be noted that the method in this embodiment can be executed by a single device, such as a controller or server. The method can also be applied in a distributed scenario, where multiple devices cooperate to complete the process. In such a distributed scenario, one of these devices may execute only one or more steps of the method in this embodiment, and the multiple devices will interact with each other to complete the method.

[0021] Currently, CIS chip testing typically categorizes tests into two types based on the testing capabilities of the testing equipment: ATE electrical performance testing and light source image testing. However, since wafer functional testing and image acquisition testing are performed by different testing equipment, the transition from wafer functional testing to image acquisition testing involves conversion processes such as test data conversion, map alignment, and long-distance transport. This cross-platform testing approach has a long testing cycle. During test platform conversion and long-distance transport, data processing becomes discontinuous and time-consuming, potentially leading to uncontrollable quality risks on the wafer under test, reducing testing efficiency and extending operation time.

[0022] Therefore, this application provides a test method and system for connectivity testing of different test devices to solve the above problems.

[0023] Reference Figure 1 This application provides a test method for interconnectivity testing of different test devices. The test devices include a test host and a test slave for performing wafer testing, and include the following steps: Step S100: Configure the transmission control protocol in the server; Step S200: Establish a data transmission channel between the test host and the test slave using the transmission control protocol; Step S300: Connect the test host and the test slave using a general interface bus to establish an instruction transmission channel between the test host and the test slave; Step S400: Use the test host to send test commands to the test slave through the command transmission channel; Step S500: Obtain test instructions using the test slave device, perform tests on the wafer, and obtain the slave device test results of the wafer; Step S600: The slave test results of the test slave are fed back to the test host through the data transmission channel; Step S700: Analyze the test results of the slave device using the test host to complete the connectivity test between the test host and the test slave device.

[0024] In this embodiment, two types of test devices, a master and a slave, are set up. A data transmission channel between the test master and the test slave is established using the transmission control protocol. The control interface of the transmission control protocol in the server is connected to the interface interface of the test master. This allows the two types of test devices to be connected and integrated into a complete test system through the transmission control protocol, which shortens the test delivery cycle and reduces the test cost.

[0025] For example, the test host is an ATE (Electrical Equipment for Testing) device, and the test slave is a Light Source (light source system). The test host is configured with a GPIB (General Purpose Interface Bus) and acquires electrical performance data from the wafer. The test host processes the electrical performance data and outputs the processing results. In the test slave, an image sensor acquires image data and transmits it to the slave. The slave requires the assistance of the light source system to process the image data. After completing image processing, the slave sends feedback to the test host to generate a shipment test report for quality confirmation before wafer shipment.

[0026] Furthermore, in this embodiment, the ATE electrical performance testing equipment is activated and a test command is sent to the light source system. The ATE electrical performance testing equipment first performs electrical performance testing, and then transmits the electrical performance test data to the server through a transmission control protocol. The test host is configured with the GPIB (General Purpose Interface Bus) protocol, and the GPIB is used to execute the command call response between the test host and the test slave. The light source system responds to the call command and performs image acquisition testing on the chip. After the image acquisition is completed, the image slave test result is fed back to the ATE electrical performance testing equipment, and the signal transmission task is completed in real time with the ATE electrical performance testing equipment. At the same time, the image slave test result is transmitted to the server for storage.

[0027] In some implementations, in step S200, a data transmission channel between the test host and the test slave is established using the Transmission Control Protocol (TCP), referring to... Figure 2 This includes the following steps: Step S210: Establish a local area network based on the Transmission Control Protocol. In the local area network, the test host first requests a connection to the server running the Transmission Control Protocol. Step S220: Configure the server's static Internet Protocol address, and establish a connection between the test slave and the server through a handshake to enable data transmission between the test master and the test slave.

[0028] In this embodiment, the test host and test slave are connected to a local area network built on the Transmission Control Protocol. The network environment is identified according to the assigned static Internet Protocol to ensure that the test system in this embodiment corresponds to a unique gateway entry point, avoiding problems such as human-caused disconnection and incorrect connection, ensuring the stability of the network environment, and guaranteeing the security of network data transmission. In the event of sudden situations such as system crashes or network outages, existing test data can be automatically saved, and data being transmitted can be cached and retained. Once mass production is restored, the interrupted transmission can be resumed, avoiding the problem of test data loss.

[0029] Meanwhile, this embodiment utilizes a universal interface bus to execute command call responses between the test host and the test slave. After the test host sends test commands to the test slave, the test slave executes the test and feeds back the test results to the test host for unified processing and analysis. This integrates the test processes of multiple separate test devices into one test, further improving test efficiency and reducing test costs. It also reduces the quality risks caused by long-distance transportation during cross-platform testing, while achieving automatic transmission of test data in cross-platform testing.

[0030] Optionally, the transmission control protocol in this embodiment is TCP / IP (Transmission Control Protocol / Internet Protocol).

[0031] In some embodiments, before sending test commands to the test slave via the command transmission channel using the test host in step S400, the following steps are included: Step S310: Perform functional tests on the wafer using the test host and obtain the functional test results of the wafer.

[0032] In this embodiment, before starting the test slave to perform tests on the wafer, the test master first starts the test to perform functional tests on the wafer, and performs preliminary screening of the wafer based on the functional slave test results. Here, by testing whether the core functions of the chip meet the standards (e.g., the chip's electrical performance), it is determined whether the chip can complete the subsequent testing process. If the chip has basic functional problems, the subsequent comprehensive testing cannot continue.

[0033] Therefore, in this embodiment, prior functional testing of the wafer is performed to ensure the accuracy and reliability of subsequent testing processes and to avoid meaningless testing in later stages.

[0034] In some embodiments, step S600, feeding back the slave test result of the test slave to the test host through the data transmission channel, includes the following steps: Step S610: Feed back the slave test results of the test slave to the test host through the data transmission channel, and save the slave test results of the test slave in the first storage path; Step S620: Perform functional tests on the wafer using the test host and obtain the functional test results of the wafer, including: Step S630: Obtain the functional test results of the wafer and save the functional test results of the wafer in the second storage path. The first storage path is different from the second storage path.

[0035] In this embodiment, the slave test results of the test slave device are stored in the first storage path, and the functional test results of the wafer are stored in the second storage path. At the same time, the first storage path and the second storage path are different to distinguish the slave test results of the test slave device and the functional test results of the wafer, which facilitates the subsequent analysis and organization of different test data, thereby further facilitating the judgment of the test quality of the wafer.

[0036] In some embodiments, step S700 involves analyzing the slave test results using the test host, including: The test host is used to analyze the test results of the slave device. The slave device test results include test data in the first format. Obtain the functional test results of the wafer, including: Obtain the functional test results of the wafer, which include test data in a second format.

[0037] Optionally, the first format of test data includes test data in JPG format, and the second format of test data includes test data in STDF format or CSV format.

[0038] In this embodiment, the test host directly obtains the slave test results in JPG format, as well as the functional test results in STDF and CSV formats, and synchronously completes the test data analysis based on the slave test results, which indirectly demonstrates the integrated control of wafer testing and analysis in this embodiment.

[0039] Meanwhile, by directly acquiring test data in JPG, STDF, and CSV formats from the test host, secondary data transfer can be effectively avoided. This not only significantly shortens the time for long-distance data transfer but also further improves overall testing efficiency, avoiding potential data loss or errors during long-distance transfer, thereby significantly reducing the quality risks of wafer testing.

[0040] In some embodiments, after performing functional tests on the wafer using the test host and obtaining the functional test results in step S310, before sending test commands to the test slave using the test host through the command transmission channel in step S400, refer to... Figure 4 This includes the following steps: Step S310: Classify the wafers according to the functional test results; Step S320: Perform failure classification on wafers that fail the functional test; Step S330: The wafer that has passed the functional test is used as the wafer under test, and the test slave device is used to test the wafer under test again.

[0041] In this embodiment, when performing functional testing on the wafer using the test host, a "Fail bin distribute" process is performed on wafers that fail the functional test to filter out wafers whose basic functions do not meet the test conditions. Defect analysis and improvements are then made to these non-compliant wafers to optimize wafer manufacturing and avoid impacting subsequent testing processes. Wafers that pass the functional test are then used as wafers under test (DUT) in the test slave unit to continue testing, thereby improving the testing quality and efficiency of the DUT in subsequent comprehensive wafer testing.

[0042] In some embodiments, in step S330, the wafer that has passed the functional test is used as the wafer under test, and the test slave device is used to test the wafer under test again, referring to... Figure 4 This includes the following steps: Step S331: Based on the test results of the test slave device, the wafers are reclassified. Step S332: Perform failure classification again on the wafers that failed the test; Step S333: Obtain and output the wafer that has passed the test.

[0043] In this embodiment, when performing wafer testing using a test slave, the defect type and cause of the wafer are located by performing fail bin distribution on the failed test wafers, so as to adjust the subsequent test process. At the same time, the wafers that pass the functional test are output to achieve precise control of the test process and ensure that the test closed loop is completed for wafers that meet the test quality requirements.

[0044] In some embodiments, in step S300, connecting the test host and the test slave using a universal interface bus includes: The communication between the test host and the test slave is determined using hexadecimal code values.

[0045] In this embodiment, each hexadecimal code value corresponds to a specific instruction (e.g., 46H for start test and 30H for end test) to improve the clarity of instruction response between the test host and the test slave, avoid communication errors between the test host and the test slave, and further improve the testing efficiency between the test host and the test slave.

[0046] Furthermore, refer to Figure 3 In this embodiment, the analysis data (wafer functional test results) in the test host and the analysis images (wafer slave test results) in the test slave are both stored in the server. The GPIB interface bus is used to transmit instructions between the test host and the test slave, so as to manage the scattered test data in a unified manner, so as to facilitate subsequent data traceability and query. At the same time, it also further improves the security of data storage and avoids the risk of data loss and leakage.

[0047] In some embodiments, in step S400, the test host sends test commands to the test slave via the command transmission channel, including: The test host sends test commands to multiple test slaves through the command transmission channel.

[0048] In this embodiment, the interface interfaces of the test host and multiple test slaves are respectively established with the server. Multiple test slaves are used to perform tests on the wafer, and the slave test results are obtained and stored on the server. Multiple test hosts are started to perform various functional tests on the wafer, and the functional test results are obtained and stored on the server.

[0049] Based on the same inventive concept, this application also provides a test system for interconnecting different test devices, referring to... Figure 5 ,include: The Transmission Control Protocol (TCP) configuration module is used to configure the TCP in the server. The data transmission module is used to establish a data transmission channel between the test host and the test slave using the transmission control protocol; The command transmission module is used to connect the test host and the test slave using a general interface bus, and establish a command transmission channel between the test host and the test slave. The test command sending module is used to send test commands from the test host to the test slave through the command transmission channel; The test module is used to obtain test instructions from the test slave device, perform tests on the wafer, and obtain the slave test results of the wafer. The data feedback module is used to feed back the slave test results of the test slave to the test host through the data transmission channel; The results analysis module is used to analyze the test results of the slave device using the test host in order to complete the connectivity test between the test host and the test slave device.

[0050] In this embodiment, an independent IP gateway is built in the local area network through the Transmission Control Protocol (TCP) to achieve network communication between test devices. This has the advantages of stable connection and reliable data transmission. In this embodiment, by ensuring that the test host and test slave are in the same local area network and configuring the server with a static Internet Protocol (IP) address, the test host acts as a client and initiates a connection request to the server. At this time, the test slave acts as a service listening port, that is, the instruction receiving and feedback subject, and completes a handshake connection with the server. Finally, the communication link built through the TCP enables network interconnection between the test host and test slave, and completes integrated testing of multiple test items.

[0051] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0052] The embodiments of the various products and devices in this application are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar embodiments can be referred to interchangeably. For ease of description, the above devices are divided into various modules based on their functions. Of course, in implementing this application, the functions of each module can be implemented in one or more software or hardware components.

[0053] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the above embodiments of this application, which are not provided in detail for the sake of brevity.

[0054] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to the integrated circuit (IC) wafer and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0055] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0056] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A test method for interconnectivity testing of different test devices, wherein the test devices include a test host and a test slave for performing different test items on a wafer, characterized in that, include: Configure the transmission control protocol in the server; A data transmission channel based on the server is established between the test host and the test slave using the transmission control protocol. The data transmission channel is used to transmit test result data. The test host and the test slave are directly connected using a general interface bus to establish an independent instruction transmission channel between the test host and the test slave. The instruction transmission channel is used to transmit control instructions. The test host sends test commands to the test slave through the command transmission channel. The test instruction is obtained using the test slave device, the test is performed on the wafer, and the slave test result of the wafer is obtained; The slave test results of the slave device are fed back to the test host through the data transmission channel; The test host is used to analyze the test results of the slave device in order to complete the connectivity test between the test host and the test slave device.

2. The test method for connectivity testing of different test devices according to claim 1, characterized in that, The step of establishing a data transmission channel between the test host and the test slave using the transmission control protocol includes: Establish a local area network based on the Transmission Control Protocol (TCP). In the local area network, the test host first requests a connection to a server running the TCP. Configure the server with a static Internet Protocol address, and establish a connection between the test slave and the server through a handshake to perform data transmission between the test host and the test slave.

3. The test method for connectivity testing of different test devices according to claim 1, characterized in that, Before the test host sends test commands to the test slave through the command transmission channel, the process includes: The test host is used to perform functional tests on the wafer and obtain the functional test results of the wafer.

4. The test method for connectivity testing of different test devices according to claim 3, characterized in that, The step of feeding back the slave test results of the test slave device to the test host device through the data transmission channel includes: The slave test results of the test slave are fed back to the test host through the data transmission channel, and the slave test results of the test slave are saved in the first storage path; The step of performing functional tests on the wafer using the test host and obtaining the functional test results of the wafer includes: The functional test results of the wafer are obtained and saved in a second storage path, wherein the first storage path is different from the second storage path.

5. The test method for connectivity testing of different test devices according to claim 3, characterized in that, The analysis of the slave device test results using the test host includes: The test host is used to analyze the test results of the slave device, and the slave device test results include test data in a first format; The acquisition of the functional test results of the wafer includes: Obtain the functional test results of the wafer, which include test data in a second format.

6. The test method for connectivity testing of different test devices according to claim 3, characterized in that... After performing functional tests on the wafer using the test host and obtaining the functional test results of the wafer, and before sending test commands to the test slave device through the command transmission channel using the test host, the process includes: The wafers are classified according to the functional test results. Perform failure classification on the wafers that fail the functional tests; The wafer that has passed the functional test is used as the wafer to be tested, and the test slave device is used to test the wafer to be tested again.

7. The test method for connectivity testing of different test devices according to claim 6, characterized in that... The step of using the wafer that has passed the functional test as the wafer to be tested, and then using the test slave to test the wafer to be tested again, includes: The wafer is reclassified based on the wafer slave test results of the test slave device. The failure classification is performed again on the wafers that fail the test; Obtain and output the tested wafer that has passed the test.

8. The test method for connectivity testing of different test devices according to claim 1, characterized in that... The method of connecting the test host and the test slave using a universal interface bus includes: The communication between the test host and the test slave is determined using hexadecimal code values.

9. The test method for connectivity testing of different test devices according to claim 1, characterized in that... The step of sending test commands from the test host to the test slave via the command transmission channel includes: The test host sends test commands to multiple test slaves through the command transmission channel.

10. A test system for interconnecting different test devices, wherein the test devices include a test host and a test slave for performing different test items on a wafer, characterized in that, include: The Transmission Control Protocol (TCP) configuration module is used to configure the TCP in the server. The data transmission module is used to establish a data transmission channel between the test host and the test slave based on the server using the transmission control protocol. The data transmission channel is used to transmit test result data. The instruction transmission module is used to directly connect the test host and the test slave using a general interface bus, and establish an independent instruction transmission channel between the test host and the test slave. The instruction transmission channel is used to transmit control instructions. The test command sending module is used to send test commands to the test slave through the command transmission channel using the test host. The testing module is used to obtain the test instructions using the test slave device, perform tests on the wafer, and obtain the slave test results of the wafer. The data feedback module is used to feed back the slave test results of the test slave to the test host through the data transmission channel; The results analysis module is used to analyze the test results of the slave device using the test host in order to complete the connectivity test between the test host and the test slave device.

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