A circuit board assembly, a circuit board system and an electronic device

Abstract

The embodiment of the present application provides a circuit board assembly, a circuit board system and an electronic device, relates to the technical field of electrical components, and aims to improve the integration and connection rate of the circuit board system. The circuit board assembly comprises a support, a first circuit board, a first connector, a connecting piece and an elastic piece. The first connector is connected with the first circuit board. The first connector is connected with the support through the connecting piece, and the first connector is configured to be movable relative to the support. In the embodiment of the present application, the first connector is connected with the circuit board and the support, and can also move relative to the support. The matching precision of the connector connection can be improved through the floating of the first connector, and the connection rate of the connector can be improved. Since different connection rate chips can be integrated conveniently, the integration of the circuit board assembly and even the circuit board system can also be improved.

Description

Technical Field

[0001] This application relates to the field of electrical component technology, and in particular to a circuit board assembly, circuit board system and electronic device. Background Technology

[0002] The rise of new technologies such as big data, cloud computing, and artificial intelligence (AI) has placed higher demands on chip computing power and the speed of data interaction between chips. Integrating multiple chips into the same circuit board system can improve the computing power of devices through chip clustering. To support higher computing power, the connection speed between chips and the circuit board system also needs to be improved. Chips are typically connected to the circuit board system via connectors, and the increased connection speed requires connectors with higher mating precision. Furthermore, chips connected to the same circuit board system often have different connection speeds, increasing the difficulty of integrating different connectors into the circuit board system. Traditional circuit board systems can no longer simultaneously meet the demands of high integration and high connection speed, severely limiting the continued development of multiple fields involving circuit board systems.

[0003] Therefore, how to make the circuit board system have both high connection speed and high integration is a problem that technicians urgently need to solve. Summary of the Invention

[0004] This application provides a circuit board assembly, a circuit board system, and an electronic device, the main purpose of which is to enable the circuit board system to have both high connection speed and high integration.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, embodiments of this application provide a circuit board assembly, which includes a bracket, a first circuit board, a first connector, a connector, and a resilient member. The first connector is connected to the first circuit board. The first connector is connected to the bracket via the connector, and the first connector is configured to be movable relative to the bracket.

[0007] In some embodiments of the first aspect, the circuit board assembly provided includes a first connector connected to a first circuit board and also connected to a support. This prevents the circuit board (e.g., the first circuit board) and the connector (e.g., the first connector) from becoming detached, and also prevents the circuit board and connector from becoming detached from the support. The support assists in the integration of the circuit board assembly, enabling the integration of chips with different connection rates and improving the overall integration of the circuit board assembly. The ability of the first connector to move relative to the support allows for flexible adjustment of the relative positions of the connectors during connection with other connectors (e.g., connectors on a chip, or second connectors). Therefore, the floating design of the first connector accommodates internal dimensional tolerances, thereby improving the mating accuracy between connectors on the circuit board and connectors on the chip. This helps to shorten the size of metal contacts within the connector, reduce metal wire redundancy (stub) within the connector, improve the signal transmission quality of the connector, and thus increase the maximum connection rate supported by the connector, achieving high-speed connection between the circuit board assembly and the chip. Thus, the circuit board assembly and even the circuit board system can possess both high connection rate and high integration characteristics.

[0008] In conjunction with the first aspect, in one possible implementation, the elastic element is located between the first connector and the bracket. When the elastic element is compressed, the first end of the elastic element is connected to the first connector, and the second end of the elastic element is connected to the bracket.

[0009] In this implementation, the elastic element, in its compressed state, connects to both the first connector and the bracket. The elastic element then mates with the connector, which ensures the connection between the first connector and the bracket. The elastic element, utilizing its inherent elasticity, applies its compressive force to the first connector, ensuring a precise and secure connection between the first connector and the connector on the chip. This reduces or avoids misfitting, overfitting, or poor contact between connectors, guaranteeing the normal operation of the circuit board assembly or the circuit board system it is used in. The locking effect of the elastic element also facilitates connector integration within the circuit board assembly. This implementation not only utilizes the elastic force of the compressed element to connect connectors but also allows the elastic element to adapt to dimensional differences within the connectors caused by design flaws or errors, with varying degrees of compression and elastic force. This improves the fit accuracy between the connectors on the circuit board and the connectors on the chip, further enhancing signal transmission quality and achieving higher connection speeds. Thus, the circuit board assembly and even the entire circuit board system further combine high connection speeds and high integration.

[0010] In conjunction with the first aspect, in one possible implementation, the elastic element surrounds the connector. This not only allows the connector to limit the elastic element, preventing it from skewing during compression or extension, but also ensures that the elastic element receives a balanced force when the first connector moves and adjusts in any direction. This guarantees a balanced elastic force on the first connector during connection, improving the stability of the connector connection.

[0011] In conjunction with the first aspect, in one possible implementation, the first connector has a first opening, and the bracket has a second opening. The connector includes a pin portion and a limiting portion, with the pin portion passing through the first and second openings. The limiting portion is located at one or both ends of the pin portion. In this implementation, the pin portion and the limiting portion achieve a limiting connection between the first connector and the bracket, and the movement of the first connector and / or the bracket relative to the pin portion allows the first connector to move relative to the bracket.

[0012] In conjunction with the first aspect, in one possible implementation, the limiting portion includes a first limiting portion and / or a second limiting portion. The first limiting portion is connected to the pin portion and is located on the side of the first opening away from the second opening. The size of the first limiting portion is larger than the size of the first opening along the radial direction of the first opening. The second limiting portion is connected to the pin portion and is located on the side of the second opening away from the first opening. The size of the second limiting portion is larger than the size of the second opening along the radial direction of the second opening. In this implementation, the relative position of the first connector and the bracket is limited by the first limiting portion and / or the second limiting portion to maintain the integration of the circuit board assembly.

[0013] In conjunction with the first aspect, in one possible implementation, a guide pin is provided on the surface of the first connector facing away from the bracket. In this implementation, the guide pin on the first connector, in conjunction with the guide hole on the connector of the chip, is used to position the connector, thereby achieving alignment of the connector connection.

[0014] In conjunction with the first aspect, in one possible implementation, a guide hole is provided on the surface of the first connector facing away from the bracket. The opening size of the guide hole is larger than the bottom size. In this implementation, the guide hole on the first connector, in conjunction with the guide pin on the connector of the chip, is used to position the connector, thereby achieving alignment of the connector connection.

[0015] In conjunction with the first aspect, in one possible implementation, the first circuit board is a flexible circuit board. In this implementation, the flexible circuit board allows all or part of the structure of the first circuit board to move relative to the support.

[0016] In conjunction with the first aspect, in one possible implementation, the circuit board assembly further includes a second circuit board, through which the first connector is connected to the first circuit board, and the second circuit board is a rigid circuit board. In this implementation, the combination of a flexible circuit board and a rigid circuit board allows all or part of the structure of the first circuit board to move relative to the support, and the second circuit board enhances the support and structural strength of the circuit board, thereby improving the structural stability of the circuit board.

[0017] Secondly, embodiments of this application provide a circuit board system, which includes a third circuit board and a circuit board assembly as described in any of the above embodiments, wherein a first circuit board is connected to the third circuit board.

[0018] In some embodiments of the second aspect, a third circuit board is used as the main board in the circuit board system. The same third circuit board can be connected to multiple first circuit boards, and / or multiple third circuit boards are provided in the circuit board system, thereby enhancing the integration capability of the circuit board system for chips or other modules.

[0019] In conjunction with the second aspect, in one possible implementation, the circuit board system includes multiple circuit board assemblies, with a first circuit board and a third circuit board connected to each other. Thus, by increasing the number of circuit board assemblies, the circuit board system's integration capability for chips or other modules is enhanced.

[0020] In conjunction with the second aspect, in one possible implementation, the first circuit board in a plurality of circuit board assemblies is located on one side of the extension direction of the third circuit board, and the plurality of first circuit boards are arranged along the extension direction. Within the same circuit board assembly, the first connector is located on the side of the first circuit board away from the third circuit board. Thus, the third circuit board is connected to the plurality of circuit board assemblies, and placing the first connectors in the plurality of circuit board assemblies on one side of the extension direction of the third circuit board helps to place the surfaces (or plug surfaces) of the plurality of first connectors used for connection on the same plane, improving the integration of the circuit board system.

[0021] In conjunction with the second aspect, in one possible implementation, the first circuit board in a plurality of circuit board assemblies is located on one side of the thickness direction of the third circuit board, and the plurality of first circuit boards are arranged along the thickness direction. Within the same circuit board assembly, the direction of the first connector facing the first circuit board intersects with the thickness direction of the third circuit board. Thus, the third circuit board is connected to the plurality of circuit board assemblies, and placing the first connectors in the plurality of circuit board assemblies on one side of the thickness direction of the third circuit board helps to place the surfaces of the plurality of first connectors used for connection on the same plane, improving the integration of the circuit board system.

[0022] In conjunction with the second aspect, in one possible implementation, the circuit board system includes multiple third circuit boards. These multiple third circuit boards are arranged along the thickness direction. Thus, by increasing the number of third circuit boards, the circuit board system's integration capability for chips or other modules is enhanced, and it remains compatible with the above embodiments. Furthermore, by placing the surfaces of the multiple first connectors used for connection on the same plane, the integration density of the circuit board system is further improved.

[0023] Thirdly, embodiments of this application provide an electronic device including a chip and a circuit board assembly. The circuit board assembly may be a circuit board assembly or a circuit board system as described in any of the foregoing embodiments. The chip has a second connector, and a first connector is connected to the second connector.

[0024] Unless otherwise specified, the technical effects of any of the design methods in the second or third aspect can be found in the technical effects of different design methods in the first aspect, and will not be repeated here. Attached Figure Description

[0025] Figure 1 This is a structural block diagram of an electronic device provided in an embodiment of this application;

[0026] Figure 2 This is a structural block diagram of a circuit board system provided in an embodiment of this application;

[0027] Figure 3 These are structural diagrams of some circuit board systems provided in the embodiments of this application;

[0028] Figure 4 These are structural diagrams of some other circuit board systems provided in the embodiments of this application;

[0029] Figure 5 These are structural diagrams of some circuit board assemblies provided in the embodiments of this application;

[0030] Figure 6 These are connection structure diagrams of some connectors provided in the embodiments of this application;

[0031] Figure 7 These are connection structure diagrams of some connectors provided in the embodiments of this application;

[0032] Figure 8 These are connection structure diagrams of some other connectors provided in the embodiments of this application;

[0033] Figure 9 This is a connection structure diagram of some of the connectors provided in the embodiments of this application;

[0034] Figure 10 These are structural diagrams of some first connectors provided in the embodiments of this application;

[0035] Figure 11 These are some connection structure diagrams of the first connector provided in the embodiments of this application;

[0036] Figure 12 These are structural diagrams of some other circuit board systems provided in the embodiments of this application;

[0037] Figure 13 These are structural diagrams of some circuit boards provided in the embodiments of this application;

[0038] Figure 14 These are structural diagrams of some other circuit board systems provided in the embodiments of this application;

[0039] Figure 15 yes Figure 14 The illustrated embodiment provides a structural diagram of the circuit board assembly in the circuit board system.

[0040] Figure 16 These are structural diagrams of some other circuit boards provided in the embodiments of this application;

[0041] Figure 17 These are structural diagrams of some other circuit boards provided in the embodiments of this application.

[0042] Explanation of reference numerals in the attached figures:

[0043] 1000. Electronic device; 100. Chip; 200. Circuit board system; 210. Circuit board assembly; 220. Third circuit board; 221. First connecting part; 222. Second connecting part; 230. Middle frame; 240. Fourth circuit board; 250. Fifth circuit board; 201. Composite circuit board; 1. Bracket; 11. Second opening; 2. First circuit board; 3. First connector; 31. First opening; 32. Guide pin; 33. Guide hole; 34. First metal contact; 4. Connector; 41. Pin part; 42. First limiting part; 43. Second limiting part; 5. Elastic element; 6. Second circuit board; 7. Second connector; 71. Second metal contact. Detailed Implementation

[0044] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0045] In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0046] Furthermore, to facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with substantially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that "first" and "second" are not necessarily different. Meanwhile, in the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is being used as an example, illustration, or description. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of terms such as "exemplary" or "for example" is intended to present related concepts in a concrete manner for ease of understanding.

[0047] In describing some embodiments, the term "connection" and its derivative expressions are used. The term "connection" should be interpreted broadly; for example, "connection" can be an electrical connection or a structural connection. When expressing a structural connection between two things, "connection" can be a fixed connection, a detachable connection, or an integral part of the structure. "Connection" can be a direct link or an indirect link through an intermediate medium.

[0048] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0049] In the embodiments of this application, "upper", "lower", "left" and "right" are not limited to the orientation of the components in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0050] In the accompanying drawings, the thickness of some layers or regions has been selectively exaggerated for clarity, and the dimensional proportions between the portions shown do not reflect actual dimensional proportions. Therefore, variations in shape relative to the drawings are conceivable due to factors such as manufacturing techniques and / or tolerances. Consequently, exemplary embodiments should not be construed as limited to the shapes of the regions shown in this application, but rather include shape deviations caused, for example, by manufacturing processes. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0051] Figure 1 This is a structural block diagram of an electronic device provided in an embodiment of this application.

[0052] This application provides an electronic device 1000, such as... Figure 1 As shown, the electronic device 1000 includes a chip 100 and a circuit board system 200.

[0053] For example, electronic device 1000 may include a plurality of chips 100.

[0054] In yet another example, electronic device 1000 may include multiple circuit board systems 200. Exemplarily, the multiple circuit board systems 200 may be electrically connected to each other.

[0055] In this embodiment of the application, the circuit board system 200 may also be referred to as a backplane system.

[0056] In some optional embodiments, the chip 100 and the circuit board system 200 are respectively provided with matching connectors. For example, the circuit board system 200 is provided with a female connector and the chip 100 is provided with a male connector, thereby enabling plug-and-play functionality of the chip 100 through connector connection, that is, enabling the chip 100 to be pluggable, improving the flexibility of customization, manufacturing and assembly of the electronic device 1000, and using the circuit board system 200 to integrate multiple chips 100 and transmit signals, ensuring the integration level of the electronic device 1000.

[0057] In some alternative embodiments, the chip 100 described above may also be referred to as an integrated circuit (IC), or in other words, the chip 100 is a module or assembly including an integrated circuit. Exemplarily, the chip 100 may include chips with different connection rates. For example, the chip 100 may include, but is not limited to, a central processing unit (CPU), a graphics processing unit (GPU), a solid-state disk (SSD), and a power management integrated circuit (PMIC). For example, the connection rate of a CPU is higher than that of a PMIC.

[0058] In some alternative embodiments, the above-described electronic device 1000 can be applied to various communication systems or communication protocols, such as: Global System for Mobile Communication (GSM), Code Division Multiple Access (CDMA) system, Wideband Code Division Multiple Access (WCDMA), General Packet Radio Service (GPRS), Long Term Evolution (LTE), etc.

[0059] For example, the aforementioned electronic device 1000 includes, but is not limited to, communication products, consumer products, home products, in-vehicle products, wearable products, financial terminal products, and intelligent detection products. Exemplarily, the electronic device 1000 may include, but is not limited to, communication devices, computing devices, switches, mobile phones, tablets, smart wearable products (e.g., smartwatches, smart bracelets), extended reality (XR) devices, inertial navigation systems, supplemental inflatable restraint systems (SRS) devices, smart door locks, etc. The aforementioned XR devices may be, for example, virtual reality (VR) devices, augmented reality (AR) devices, or mixed reality (MR) devices.

[0060] In this embodiment, the circuit board system 200 may have pluggable components, and the electronic device 1000 can also be applied to pluggable node interconnection scenarios. For example, the aforementioned communication device may be a complete product in the server field, such as a general-purpose server or a node server. This embodiment does not limit the specific form of the electronic device 1000.

[0061] Figure 2 This is a structural block diagram of a circuit board system 200 provided in an embodiment of this application.

[0062] This application provides a circuit board system 200, such as... Figure 2 As shown, the circuit board system 200 includes a third circuit board 220 and a circuit board assembly 210.

[0063] In some alternative implementations, the circuit board system 200 may include a plurality of third circuit boards 220. Exemplarily, the plurality of third circuit boards 220 may be electrically connected to each other.

[0064] In some alternative embodiments, the circuit board system 200 may also include a plurality of circuit board assemblies 210.

[0065] For example, the third circuit board 220 is a motherboard, which is typically depicted as horizontally positioned and may also be referred to as a horizontal management board. The circuit board assembly 210 may include sub-boards and connectors. For instance, the third circuit board 220 is a rigid circuit board, and the circuit board assembly 210 may also include a flexible circuit board or a rigid-flex circuit board, with the flexible or rigid-flex circuit board connected to the circuit board assembly 210.

[0066] In some embodiments of the circuit board system 200 provided in this application, the third circuit board 220 can be used as the main board in the circuit board system 200. The same third circuit board 220 can be connected to multiple circuit board assemblies 210, and / or multiple third circuit boards 220 are provided in the circuit board system 200, thereby enhancing the integration capability of the circuit board system 200 for the chip 100 or other modules.

[0067] In some alternative embodiments, the third circuit board 220 is a sub-board, and the circuit board system 200 also includes a main board, with the sub-board connected to the main board in the circuit board system 200.

[0068] This application embodiment also provides an electronic device 1000, which includes a chip 100 and a circuit board assembly 210. Exemplarily, the circuit board assembly 210 is used to implement all or part of the functions of the circuit board system 200. Similar to the circuit board system 200, it can integrate the chip 100 and perform signal interconnection and transmission.

[0069] As chip processor performance continues to improve, the high-speed interface of chip 100, using the high-speed serial computer expansion bus standard (Peripheral Component Interconnect Express, PCIe), has evolved from version 1.0 to version 5.0, with the connection speed increasing from 2.5G to 32G. Taking optical communication modules used in servers as an example, the chip 100's speed and unified bus (UB) have also evolved to support 112G / 224G speeds. With the evolution of connection speeds, in order to achieve high-speed connection between circuit board system 200 and chip 100, the signal transmission quality and performance of connectors need to be higher, and the tolerance requirements for connector mating also become increasingly stringent. Connectors achieve connection through metal contacts, requiring the metal wire redundancy at the metal contacts to be as short as possible.

[0070] Taking a server as an example, based on the intersection direction of the circuit board and the connector, the circuit board system 200 is typically divided into vertical backplane, horizontal orthogonal backplane, and horizontal backplane. In these circuit board systems 200, the connectors and circuit boards are usually relatively fixed.

[0071] Figure 3 These are structural diagrams of some circuit board systems provided in the embodiments of this application.

[0072] In some examples, such as Figure 3 As shown, the circuit board system 200 includes a first circuit board 2 and a first connector 3. The first circuit board 2 and the first connector 3 can be orthogonally connected; therefore, the first circuit board 2 and the first connector 3 can be collectively referred to as a horizontal orthogonal backplane. The first circuit board 2 and the first connector 3 are relatively fixed.

[0073] Considering the inherent errors in connector manufacturing and connection, if the first circuit board 2 and the first connector 3 are relatively fixed, the connector connection position cannot be flexibly adjusted. Therefore, in the first connector 3 of the aforementioned circuit board system 200, the metal wire redundancy at the metal contact often exceeds 1mm.

[0074] Therefore, the circuit board 200 system or circuit board assembly 210 in this embodiment is no longer able to meet the needs of the high-speed evolution of the chip 100, and is even less able to simultaneously accommodate chips 100 with different connection rates.

[0075] Figure 4 These are structural diagrams of other circuit board systems provided in the embodiments of this application.

[0076] In some examples, such as Figure 4As shown, the circuit board system 200 includes a first circuit board 2 and a first connector 3. The first connector 3 is connected to the first circuit board 2 via a cable, thereby achieving a free-floating design of the connector through a full cable mode to meet the mating tolerance requirements of different connectors in the circuit board system 200.

[0077] Therefore, the circuit board system 200 in this embodiment helps to some extent to accommodate chips 100 with different connection speeds. However, since the circuit board system 200 typically contains many connectors, this type of free-floating design not only occupies too much space and has low integration, but also often makes chip installation, removal, and maintenance difficult due to complex wiring. Furthermore, because the connectors are free-floating from the circuit board, the circuit board system 200 cannot adaptively adjust the relative positions between the male and female connectors during connector connection, which is detrimental to improving the fitting accuracy of the connector connection and thus limits the improvement of the connection speed of the circuit board system 200.

[0078] Figure 5 This is a structural diagram of a circuit board assembly provided in an embodiment of this application.

[0079] This application provides a circuit board assembly 210, such as... Figure 5 As shown, the circuit board assembly 210 includes a bracket 1, a first circuit board 2, a first connector 3, and a connector 4.

[0080] In some alternative embodiments, the circuit board including the first circuit board 2 can be a printed circuit board. For example, the circuit board can be a rigid circuit board or a flexible circuit board.

[0081] In some alternative embodiments, the first circuit board 2 is configured to be movable relative to the support 1. Exemplarily, the first circuit board 2 may be partially or entirely movable relative to the support 1. For example, the first circuit board 2 is a flexible circuit board, with one end fixed relative to the support 1 and the other end movable relative to the support 1. As another example, the first circuit board 2 is a rigid circuit board, with one end fixed to the flexible circuit board, allowing the entire first circuit board 2 to move relative to the support 1 during the deformation of the flexible circuit board.

[0082] In this embodiment of the application, the first connector 3 and the first circuit board 2 can be fixedly connected, and the first connector 3 and the first circuit board 2 can also be electrically connected.

[0083] In some optional implementations, the first connector 3 can be a male connector or a female connector.

[0084] In this embodiment, the connector, including the first connector 3, can be referred to as a connector, or a high-speed connector. A high-speed connector can maintain stable transmission performance under high-frequency signals.

[0085] In this embodiment, the first connector 3 is connected to the bracket 1 via the connector 4, and the first connector 3 is configured to be movable relative to the bracket 1.

[0086] In some optional implementations, such as Figure 5 As shown, the first connector 3 can be slidably connected to the bracket 1 via the connector 4. Exemplarily, the connector 4 may include a pin, and the first connector 3 and / or the bracket 1 can move relative to the bracket 1 by sliding relative to the connector 4. For example, the first connector 3 can move closer to or further away from the bracket 1, or in other words, the first connector 3 can move along the Z-direction.

[0087] In some alternative implementations, such as Figure 5 As shown, the first connector 3 can also establish a rocking connection with the bracket 1 via the connector 4. Exemplarily, the connector 4 may include a pin, and the pin's size is smaller than a pin hole (e.g., the first opening or the second opening mentioned below). By rocking the pin within the pin hole, the connector 4 can rock relative to the first connector 3 and / or the bracket 1, thus enabling the first connector 3 to rock relative to the bracket 1, or enabling the bracket 1 to rock relative to the first connector 3. For example, the first connector 3 can move in any direction within the XYZ space.

[0088] In some alternative embodiments, the bracket 1 can be a rigid structure, thereby providing structural support for the first circuit board 2 or the first connector 3.

[0089] In some optional embodiments, rigidity can represent a material or structure's strong resistance to elastic deformation, while flexibility can represent a material or structure's strong ability to undergo elastic deformation. For example, rigidity can represent a structural strength greater than or equal to a preset structural strength value, while flexibility can represent a structural strength less than or equal to a preset structural strength value. For instance, rigidity can represent a yield strength greater than or equal to 85 MPa and a tensile strength greater than or equal to 160 MPa.

[0090] In some alternative embodiments, such as Figure 5 As shown, the support 1 can be planar or plate-shaped.

[0091] In some optional embodiments, the bracket 1 may intersect with the first circuit board 2. Exemplarily, the bracket 1 may be perpendicular to the first circuit board 2. Exemplarily, as... Figure 5 As shown, the bracket 1 is formed into a rectangular ring by the frame, and the first circuit board 2 passes through the space enclosed by the frame of the bracket and is connected to the first connector 3.

[0092] In some optional embodiments, the bracket 1 may intersect with the insertion direction of the first connector 3. Exemplarily, the bracket 1 may be perpendicular to the insertion direction of the first connector 3. Exemplarily, the bracket 1 is formed into a rectangular ring by a frame, and the first connector 3 passes through the space enclosed by the frame of the bracket to connect to the first circuit board 2.

[0093] In some examples, the support 1 may be, but is not limited to, a rectangular ring (e.g., Figure 5 The bracket shown is 1), C-shaped, or strip-shaped. For example, the first circuit board 2 or the first connector 3 can pass through the bracket 1 so that one or more ends of the first connector 3 can be connected to the bracket 1.

[0094] In the above embodiments, the first connector 3 is connected to the first circuit board 2, and also to the bracket 1. This prevents the circuit board and connector from becoming detached from the bracket 1, and the bracket 1 assists in the integration of the circuit board assembly 210. Chips 100 with different connection rates can be integrated, such as high-speed memory chips and low-speed power management chips, thereby improving the integration level of the circuit board assembly 210. Both the first circuit board 2 and the first connector 3 can move relative to the bracket 1, providing conditions for the first connector 3 to achieve flexible adjustment of its relative position during connection with other connectors. Therefore, the floating design of the first connector 3 adapts to the internal dimensional tolerances of the connector, thereby improving the fitting accuracy between the connectors on the circuit board and the connectors on the chip 100. This helps to shorten the size of the metal contacts within the connector, reduce metal wire redundancy within the connector, improve the signal transmission quality of the connector, and thus increase the maximum connection rate supported by the connector, thereby achieving high-speed connection between the circuit board assembly 210 and the chip 100. This enables circuit board assemblies and even circuit board systems to possess both high connection speeds and high integration. Therefore, circuit board assembly 210 and even circuit board system 200 can possess both high connection speeds and high integration.

[0095] In some alternative embodiments, such as Figure 5 As shown, the circuit board assembly 210 also includes an elastic element 5.

[0096] In this embodiment, the elastic element 5 is located between the first connector 3 and the bracket 1. When the elastic element 5 is compressed, the first end of the elastic element 5 is connected to the first connector 3, and the second end of the elastic element 5 is connected to the bracket 1.

[0097] For example, the elastic element 5 may include, but is not limited to, a wave spring, a spring sheet, an elastic bellows, etc. For instance, along the direction of the first connector 3 toward the bracket 1, the elastic element 5 may be elastic, which helps to provide elastic support for the first connector 3 during the movement of the first connector 3 toward or away from the bracket 1, so that the first connector 3 floats relative to the bracket 1.

[0098] For example, the elastic element 5 can also be elastic in the direction that intersects with the direction of the first connector 3 toward the bracket 1. This helps to provide elastic support for the first connector 3 when the direction of movement of the first connector 3 intersects with the direction of the first connector 3 toward the bracket 1, so that the first connector 3 floats relative to the bracket 1.

[0099] In this embodiment, the distance between the first connector 3 and the bracket 1 can be compressed to be less than the maximum size of the elastic element 5. For example, the maximum size of the elastic element 5 can be the size of the elastic element 5 under no external force.

[0100] In the above embodiments, the elastic element 5, in its compressed state, is connected to both the first connector 3 and the bracket 1. The elastic element 5 can then cooperate with the connector 4, ensuring the connection between the first connector 3 and the bracket 1. The elastic element 5, utilizing its elasticity, applies its elastic force under compression to the first connector, causing the first connector 3 to float relative to the bracket 1. This allows the first connector 3 to precisely engage and lock with the connector on the chip 100, reducing or avoiding underfitting, overfitting, or poor contact between connectors. This ensures the normal operation of the circuit board assembly 210 or the circuit board system 200 used by the circuit board assembly 210. The locking function of the elastic element 5 also facilitates the integration of connectors into the circuit board assembly 210. Therefore, not only can the elastic force of the elastic element 5 under compression achieve the connection between connectors, but the elastic element 5 can also adapt to dimensional differences within the connectors caused by design flaws or errors by varying degrees of compression and elastic force. This improves the fitting accuracy between the connectors on the circuit board and the connectors on the chip 100, further enhancing the signal transmission quality of the connectors and achieving higher connection speeds. This enables the circuit board assembly 210 and even the circuit board system 200 to further combine the characteristics of high connection speed and high integration.

[0101] In some alternative embodiments, the first circuit board 2 is a flexible circuit board. Therefore, by using a flexible circuit board, all or part of the structure of the first circuit board 2 can be moved relative to the support 1.

[0102] In some alternative embodiments, such as Figure 5As shown, the circuit board assembly 210 also includes a second circuit board 6, and the first connector 3 is connected to the first circuit board 2 through the second circuit board 6.

[0103] In some examples, the second circuit board 6 is a rigid circuit board.

[0104] In some examples, the first connector 3 can be connected to the second circuit board 6 by injection molding, or by welding or pressing.

[0105] For example, the first circuit board 2 is a flexible circuit board, and the second circuit board 6 is a rigid circuit board. The first circuit board 2 and the second circuit board 6 can be crimped together by bonding, and the first circuit board 2 and the second circuit board 6 are connected to form a rigid-flexible circuit board.

[0106] In some alternative implementations, the bracket 1 may also intersect with the second circuit board 6.

[0107] Through the above embodiments, by utilizing the combination of flexible and rigid circuit boards, as the first circuit board 2 undergoes flexible deformation, the second circuit board 6 connected to the first circuit board 2 can move relative to the support 1. This provides conditions for the elastic adjustment of the relative positions between connectors during the connection of the first connector 3 with other connectors. Furthermore, as a rigid circuit board, the second circuit board 6 can enhance the overall support and structural strength of the circuit board, thereby improving the structural stability of the circuit board.

[0108] Figure 6 This is a connection structure diagram of some connectors provided in the embodiments of this application.

[0109] like Figure 6 As shown, the first connector 3 is used to connect with the second connector 7.

[0110] In some examples, the first connector 3 is disposed on the circuit board assembly 210, and the second connector 7 is disposed on the chip 100.

[0111] like Figure 6 As shown, the first metal contact 34 in the first connector 3 contacts the second metal contact 71 in the second connector 7, and the first metal contact 34 and the second metal contact 71 are electrically connected, thereby realizing the connection between the first connector 3 and the second connector 7. For example, the end of the metal wire where the first metal contact 34 is located that does not contact the second metal contact 71 can be referred to as metal wire redundancy.

[0112] In the above embodiments, the first connector 3 and the first circuit board 2 can float relative to the bracket 1, realizing the floating design of the first connector 3. When the circuit board assembly 210 includes multiple first connectors 3, and every two first connectors 3 can be decoupled, it also supports the independent floating of each first connector 3. Furthermore, with the assistance of the connector 4 and the elastic member 5, during the connection process between the first connector 3 and the second connector 7, the position of each first connector 3 relative to the bracket 1 can be adaptively adjusted, so that the first connector 3 and the second connector 7 are precisely matched, and the first metal contact 34 and the second metal contact 71 are electrically connected.

[0113] Figures 7-9 This is a connection structure diagram of some connectors provided in the embodiments of this application.

[0114] In some alternative embodiments, such as Figure 7 As shown, the first connector 3 is provided with a first opening 31, and the bracket 1 is provided with a second opening 11.

[0115] In some optional implementations, such as Figure 7 As shown, the number of first openings 31 on each first connector 3 can be multiple, and the number of second openings 11 on each bracket 1 can be multiple.

[0116] For example, in each circuit board assembly 210, each first connector 3 may have two first openings 31, with the two first openings 31 located at opposite ends of the first connector 3. This helps to improve the structural stability of the connection between the first connector 3 and the bracket 1, and also enhances the controllability of the position adjustment of the first connector 3.

[0117] In some specific examples, the first opening 31 can be located at both ends of the length direction of each first connector 3. For example, the first connector 3 has ears at both ends of the length direction, and the ears are provided with the first opening 31, which faces the bracket 1.

[0118] In some specific examples, the first opening 31 may also be located at both ends of the thickness direction of each first connector 3.

[0119] In some examples, the number of first openings 31 on the first connector 3 may be the same as the number of second openings 11 on the bracket 1.

[0120] In some optional embodiments, the shape of the first opening 31 includes a circle, a square, etc., and the shape of the second opening 11 may be different from or the same as the shape of the first opening 31. This application embodiment does not impose any restrictions.

[0121] In some alternative embodiments, such as Figure 7As shown, the connector 4 includes a pin portion 41 and a limiting portion, with the pin portion 41 passing through the first opening 31 and the second opening 11.

[0122] In some examples, the limiting portion is located at one end of the pin portion 41. For example... Figure 7 As shown, the limiting part includes a first limiting part 42, which is located at the end where the pin part 41 passes through the first opening 31.

[0123] In some other examples, the limiting portion is located at both ends of the pin portion 41. For example... Figure 8 As shown, the limiting part includes a first limiting part 42 and a second limiting part 43. The first limiting part 42 is located at the end where the pin part 41 passes through the first opening 31, and the second limiting part 43 is located at the end where the pin part 41 passes through the second opening 11.

[0124] In some alternative embodiments, the radial shape of the pin portion 41 may be similar to the shape of the first opening 31 or the second opening 11.

[0125] For example, if the first opening 31 or the second opening 11 is a through hole, the pin portion 41 can be inserted into the through hole, or the pin portion 41 can pass through the through hole. If the first opening 31 or the second opening 11 is a blind hole, the pin portion 41 can be inserted into the blind hole.

[0126] Taking the example where at least one end of the pin portion 41 has a circular radial shape, an illustrative explanation will be provided:

[0127] In the first example, such as Figure 7 As shown, the radial dimension of the pin portion 41 in the first opening 31 is smaller than that of the first opening 31, and the pin portion 41 in the second opening 11 is threaded into the second opening 11.

[0128] For example, the second opening 11 is provided with an internal thread, and the pin part 41 is provided with an external thread. The pin part 41 and the bracket 1 are connected by the internal thread in the second opening 11 and the external thread on the pin part 41.

[0129] For example, if the pin part 41 is fixedly connected to the bracket 1, and the first connector 3 can slide or rock relative to the pin part 41, then the first connector 3 can move relative to the bracket 1 connected to the pin part 41.

[0130] In the second example, the pin portion 41 in the first opening 31 is threadedly engaged with the first opening 31, and the radial dimension of the pin portion 41 in the second opening 11 is smaller than that of the second opening 11.

[0131] For example, the first opening 31 is provided with an internal thread, and the pin part 41 is provided with an external thread. By the internal thread in the first opening 31 and the external thread on the pin part 41, the pin part 41 and the first connector 3 are connected by a thread.

[0132] For example, if the pin part 41 is fixedly connected to the first connector 3, and the pin part 41 can slide or rock relative to the bracket 1, then the first connector 3 can move relative to the bracket 1.

[0133] In the first and second examples described above, the structures connected to the pin portion 41 can be interchanged. For example, if the length of the second opening 11 that can be provided in the bracket 1 is greater than the length of the first opening 31 that can be provided in the first connector 3, then the structure connected to the pin portion 41 can be the bracket 1. If the length of the second opening 11 that can be provided in the bracket 1 is less than the length of the first opening 31 that can be provided in the first connector 3, then the structure connected to the pin portion 41 can be the first connector 3.

[0134] In the third example, such as Figure 8 As shown, the radial dimension of the pin portion 41 in the first opening 31 is smaller than that of the first opening 31, and the radial dimension of the pin portion 41 in the second opening 11 is smaller than that of the second opening 11.

[0135] For example, the pin part 41 is not fixedly connected to the bracket 1, the pin part 41 is not fixedly connected to the first connector 3, the pin part 41 can slide or rock relative to the bracket 1, the bracket 1 can slide or rock relative to the bracket 1, and the first connector 3 can move relative to the bracket 1.

[0136] In the above embodiments, the first connector 3 and the bracket 1 are connected by the pin part 41, and the first connector 3 can move relative to the bracket 1 by the movement of the first connector 3 and / or the bracket 1 relative to the pin part 41.

[0137] In some alternative embodiments, such as Figure 7 or Figure 8 As shown, the limiting part includes a first limiting part 42, which is connected to the pin part 41 and is located on the side of the first opening 31 away from the second opening 11.

[0138] In some examples, such as Figure 7 As shown, the first limiting part 42 and the pin part 41 can be an integral structure.

[0139] In some other examples, such as Figure 8 As shown, the first limiting part 42 is provided with an opening and an internal thread is provided in the opening, and the pin part 41 is provided with an external thread. The first limiting part 42 and the pin part 41 can establish a threaded connection.

[0140] For example, the opening provided on the first limiting part 42 is a through hole, and the first limiting part 42 can be a nut.

[0141] In some optional embodiments, the size of the first limiting portion 42 is larger than the size of the first opening 31 along the radial direction of the first opening 31. Therefore, the first limiting portion 42 can restrict the movement of the connector 4 along the first connector 3 in a direction away from the bracket 1, ensuring the connection between the first connector 3 and the bracket 1.

[0142] In some alternative embodiments, such as Figure 8 or Figure 9 As shown, the limiting part also includes a second limiting part 43, which is connected to the pin part 41 and is located on the side of the second opening 11 away from the first opening 31.

[0143] In some examples, such as Figure 8 As shown, the second limiting part 43 is provided with an opening and an internal thread is provided in the opening, and the pin part 41 is provided with an external thread. The second limiting part 43 and the pin part 41 can be threadedly connected.

[0144] For example, the second limiting part 43 and the pin part 41 are an integral structure, and the first limiting part 42 is threadedly connected to the pin part 41. Alternatively, the first limiting part 42 and the pin part 41 are an integral structure, and the second limiting part 43 is threadedly connected to the pin part 41. This facilitates the assembly of the connector 4 with the first connector 3 and the bracket 1, making the circuit board assembly 210 easier to manufacture.

[0145] In some other examples, such as Figure 9 As shown, the second limiting part 43 and the pin part 41 can be an integral structure.

[0146] In some optional embodiments, the size of the second limiting portion 43 is larger than the size of the second opening 11 along the radial direction of the second opening 11. Therefore, the second limiting portion 43 can restrict the movement of the connector 4 along the bracket 1 in a direction away from the first connector 3, ensuring the connection between the first connector 3 and the bracket 1.

[0147] Through the above embodiments, by using the limiting part to restrict the relative position of the first connector 3 and the bracket 1, it is possible to maintain the integration of the first connector 3 while cooperating with the pin part 41 to realize the relative movement of the first connector 3 and the bracket 1, and adjust the position of the first connector 3 during the process of connecting the first connector 3 with other connectors.

[0148] In some alternative embodiments, such as Figure 9 As shown, the elastic element 5 surrounds the connecting element 4.

[0149] For example Figure 9As shown, the elastic element 5 is a wave spring, which can surround the connecting element 4. Alternatively, the elastic element 5 can be an elastic bellows, which can surround the connecting element 4.

[0150] Therefore, not only can the elastic element 5 be limited by the connector 4 to prevent it from tilting during compression or extension, but the elastic element 5 can also be evenly stressed when the first connector 3 moves and adjusts in any direction. This ensures the balance of the elastic force on the first connector 3 during the connector connection process and improves the stability of the connector connection.

[0151] In some alternative embodiments, the elastic element 5 also extends into the first opening 31 and / or the second opening 11.

[0152] In some examples, the first opening 31 is a blind hole, and when the elastic element 5 is compressed, the first end of the elastic element 5 contacts the bottom of the first opening 31. In still other examples, the first opening 31 is a through hole, and when the elastic element 5 is compressed, the first end of the elastic element 5 contacts the connector 4.

[0153] Figure 10 This is a structural diagram of some first connectors provided in the embodiments of this application.

[0154] To illustrate the location of the relevant components, Figure 10 The position of the first connector 3 relative to the bracket 1 in the circuit board assembly 210 is schematically shown.

[0155] In some alternative embodiments, such as Figure 10 As shown, the first connector 3 has a guide pin 32 on its surface facing away from the bracket 1.

[0156] Accordingly, in some examples, a second connector 7 is provided on the chip 100, and a guide hole 33 is provided on the second connector 7.

[0157] For example, the surface of the first connector 3 facing away from the bracket 1 is used to realize the connection between the connectors. The extension direction of the guide pin 32 is the same as the direction of the bracket 1 toward the first connector 3. This direction can also be the same as the extension direction of the guide hole 33 on the connector of the chip 100, so that the guide pin 32 plays a positioning and alignment role in the process of connecting the first connector 3 with other connectors.

[0158] Figure 11 These are some connection structure diagrams of the first connector provided in the embodiments of this application.

[0159] In some alternative embodiments, such as Figure 11 As shown, the first connector 3 has a guide hole 33 on its surface facing away from the bracket 1.

[0160] Accordingly, in some examples, a second connector 7 is provided on chip 100, and a guide pin 32 is provided on the second connector 7.

[0161] Through the above embodiments, by using the guide hole 33 on the first connector 3 and the guide pin 32 on the connector of the chip 100, the connector can be positioned, thereby achieving the guidance and alignment of the connector connection.

[0162] In some alternative embodiments, the opening size of the guide hole 33 is larger than the bottom size.

[0163] For example, the inner wall of the guide hole 33 is provided with a slope, which intersects the direction of the first connector 3 away from the bracket 1, so that the guide pin 32 can be guided to the correct position, which is conducive to the alignment of the first connector 3 with respect to the bracket 1. For example, the angle between the slope and the direction of the first connector 3 away from the bracket 1 is, but is not limited to, one of 20°, 30°, 40°, 45°, and 50°.

[0164] Figure 12 These are structural diagrams of some other circuit board systems provided in the embodiments of this application.

[0165] This application embodiment also provides a circuit board system 200, such as Figure 12 As shown, the circuit board system 200 includes a third circuit board 220 and a circuit board assembly 210 in any of the above embodiments.

[0166] In some alternative embodiments, the first circuit board 2 is connected to the third circuit board 220.

[0167] For example, the first connector 3 can be connected to the third circuit board 220 in sequence via the second circuit board 6, the first circuit board 2, and the third circuit board 220.

[0168] Through the above embodiments, in the circuit board system 200, the third circuit board 220 is used as the main board in the circuit board system 200. The same third circuit board 220 can be connected to multiple third circuit boards 220, and / or multiple third circuit boards 220 are provided in the circuit board system 200. Thus, the integration capability of the circuit board system 200 for the chip 100 or other modules can be enhanced.

[0169] Furthermore, since the connection between circuit boards often adopts crimping or multi-layer wiring, and the direct connection between the connector and the circuit board requires the use of multiple interfaces, occupying a large area of ​​the motherboard, the above embodiment uses the first circuit board 2 to realize the conversion between the connector and the motherboard, which can reduce the area occupied by the motherboard. More motherboard area can be set up for other modules or openings for heat dissipation, which helps to improve the system opening ratio of the motherboard and enhance the heat dissipation capacity of the circuit board system 200.

[0170] In this embodiment, the combination of rigid-flex circuit board and connector floating design can be used to enable the connector to float in the XYZ three-dimensional space, without completely relying on the floating design of the connector body or the flexible characteristics of the circuit board. This allows the circuit board system 200 to fully meet the different mating tolerances of the connector, reduce the design complexity and cost of the connector, circuit board assembly 210 and circuit board system 200, and at the same time be compatible with non-floating designs and connect to low-speed chips 100.

[0171] In some alternative embodiments, such as Figure 12 As shown, the circuit board system 200 may also include a middle frame 230.

[0172] In some optional embodiments, the third circuit board 220 is connected to the middle frame 230, and / or the bracket 1 is connected to the middle frame 230. Exemplarily, the third circuit board 220 is fixedly connected to the middle frame 230, and / or the bracket 1 is fixedly connected to the middle frame 230.

[0173] In some examples, the third circuit board 220 may be stacked with the middle frame 230, and the bracket 1 may intersect with the middle frame 230.

[0174] In some alternative embodiments, the circuit board system 200 includes a plurality of circuit board assemblies 210, wherein a first circuit board 2 of the plurality of circuit board assemblies 210 is connected to a third circuit board 220.

[0175] For example, the surfaces of the first connectors 3 in the multiple circuit board assemblies 210 used for connection can be on the same plane to improve the integration of the circuit board system 200, which is beneficial for the installation, removal and maintenance of the chip 100, and also facilitates the integration of the bracket 1.

[0176] For example Figure 12 The bracket 1 shown can be Figure 5 The circuit board assembly 210 shown is formed by multiple supports 1 located on the same plane and connected as a single structure. For example... Figure 12 As shown, the bracket 1 can be plate-shaped. The surfaces of the first connector 3 used for connection are on the same plane. Thus, the brackets 1 in multiple circuit board assemblies 210 can also be on the same plane, thereby connecting them into an integrated structure on the same plane to achieve the integration of the bracket 1.

[0177] Therefore, by increasing the number of circuit board assemblies 210, the integration capability of the circuit board system 200 for the chip 100 or other modules is enhanced.

[0178] In some alternative embodiments, such as Figure 12 As shown, the first circuit board 2 in the plurality of circuit board assemblies 210 is located on one side of the extension direction of the third circuit board 220, and the plurality of first circuit boards 2 are arranged along the extension direction.

[0179] In this embodiment of the application, in the same circuit board assembly 210, the first connector 3 is located on the side of the first circuit board 2 away from the third circuit board 220.

[0180] Through the above embodiments, the third circuit board 220 is connected to multiple circuit board assemblies 210, and the first connectors 3 of the multiple circuit board assemblies 210 are disposed on one side of the extension direction of the third circuit board 220, which makes it easier to set the surfaces of the multiple first connectors 3 used for connection on the same plane, thereby facilitating the realization of... Figure 12 The integrated design of bracket 1 also helps to improve the integration of circuit board system 200.

[0181] In some alternative embodiments, the supports 1 in the multiple circuit board assemblies 210 can be interconnected. This helps to improve the overall structural stability of the circuit board system 200. For example, the supports 1 in the multiple circuit board assemblies 210 can be fixedly connected to each other. Alternatively, the supports 1 in the multiple circuit board assemblies 210 can be a single, integrated structure.

[0182] Figure 13 These are structural diagrams of some circuit boards provided in the embodiments of this application. Figure 13 The positional relationship between the circuit board and the middle frame 230 in the circuit board system 200 is also illustrated by way of example.

[0183] This application embodiment also provides a composite circuit board 201, such as Figure 13 As shown, the composite circuit board 201 includes the first circuit board 2, the second circuit board 6 and the third circuit board 220 in the above embodiments.

[0184] In some optional embodiments, the first circuit board 2, the second circuit board 6, and the third circuit board 220 are connected in sequence and extend in the same direction.

[0185] In some examples, the first circuit board 2 is a flexible circuit board, the second circuit board 6 is a rigid circuit board, and the third circuit board 220 is a rigid circuit board. The first circuit board 2, the second circuit board 6, and the third circuit board 220 are connected to form a rigid-flexible circuit board.

[0186] For example, in the circuit board system 200, the third circuit board 220 is connected to the middle frame 230. Taking advantage of the fact that the first circuit board 2 is a flexible circuit board, the first circuit board 2 and / or the second circuit board 6 connected to the third circuit board 220 can move relative to the middle frame 230, and the first connector 3 can also move relative to the middle frame 230.

[0187] Figure 14 These are structural diagrams of some other circuit board systems provided in the embodiments of this application. For ease of illustration, Figure 14The bracket 1, connector 4, elastic element 5, etc. are not shown in the diagram.

[0188] Figure 15 yes Figure 14 The illustrated embodiment provides a structural diagram of a circuit board assembly in a circuit board system. Wherein, Figure 15 The brackets 1 in the multiple circuit board assemblies 210 shown can be connected to each other, and the brackets 1 in the multiple circuit board assemblies 210 can also be integrated into a single structure.

[0189] In some alternative embodiments, such as Figure 14 As shown, the first circuit board 2 in the plurality of circuit board assemblies 210 is located on one side of the thickness direction of the third circuit board 220, and the plurality of first circuit boards 2 are arranged along the thickness direction.

[0190] In some alternative embodiments, within the same circuit board assembly 210, the direction of the first connector 3 toward the first circuit board 2 intersects the thickness direction of the third circuit board 220. For example, within the same circuit board assembly 210, the direction of the first connector 3 toward the first circuit board 2 is perpendicular to the thickness direction of the third circuit board 220.

[0191] Through the above embodiments, the third circuit board 220 is connected to multiple circuit board assemblies 210, and the first connectors 3 of the multiple circuit board assemblies 210 are disposed on one side of the thickness direction of the third circuit board 220, which makes it easier to set the surfaces of the multiple first connectors 3 used for connection on the same plane, thereby facilitating the realization of... Figure 15 The integrated design of bracket 1 also helps to improve the integration of circuit board system 200.

[0192] For example Figure 15 The bracket 1 shown can be Figure 5 The circuit board assembly 210 shown in the figure has multiple brackets 1 located on the same plane and connected into an integral structure, thereby realizing the integration of brackets 1.

[0193] In some optional implementations, such as Figure 14 As shown, the circuit board system 200 also includes a fourth circuit board 240.

[0194] In some examples, the fourth circuit board 240 and the third circuit board 220 may intersect and be connected. Exemplarily, the third circuit board 220 and the fourth circuit board 240 may be connected by crimping or plugging. For example, the fourth circuit board 240 and the third circuit board 220 may be perpendicular to each other.

[0195] For example, the first circuit board 2 can be connected to the third circuit board 220 in sequence via the second circuit board 6, the fourth circuit board 240, and so on.

[0196] In some optional implementations, such as Figure 14 As shown, the circuit board system 200 also includes a fifth circuit board 250.

[0197] In some examples, in circuit board system 200, fifth circuit board 250 can serve as a motherboard. Circuit board system 200 includes multiple third circuit boards 220 that intersect with and are connected to fifth circuit board 250. For example, third circuit boards 220 and fifth circuit board 250 can be connected by crimping or plugging. For example, third circuit boards 220 and fifth circuit board 250 can be perpendicular to each other.

[0198] For example, the fifth circuit board 250 may be connected to the middle frame 230. For instance, the fifth circuit board 250 may be stacked and connected to the middle frame 230.

[0199] In some examples of this implementation, the first connector 3 can be electrically connected to the fifth circuit board 250 in sequence via the first circuit board 2, the second circuit board 6, the fourth circuit board 240, and the third circuit board 220.

[0200] In the above embodiments, the fourth circuit board 240 can also be used as the main board and the third circuit board 220 as the sub-board. Thus, if the number of connectors needs to be expanded, the number of the third circuit board 220 can be increased, thereby eliminating the need to increase the number of main boards. This can effectively reduce the cost of the circuit board system 200 and the complexity of installation and maintenance.

[0201] In some alternative embodiments, the circuit board system 200 includes a plurality of third circuit boards 220 arranged along the thickness direction.

[0202] Through the above embodiments, by increasing the number of third circuit boards 220, the integration capability of the circuit board system 200 for the chip 100 or other modules is enhanced, and it is compatible with the above embodiments. The surfaces of multiple first connectors 3 used for connection are arranged on the same plane, further improving the integration of the circuit board system 200.

[0203] Figure 16 These are structural diagrams of some other circuit boards provided in the embodiments of this application.

[0204] This application embodiment also provides a composite circuit board 201, such as Figure 16 As shown, the composite circuit board 201 includes the first circuit board 2, the second circuit board 6 and the fourth circuit board 240 in the above embodiments.

[0205] In some optional embodiments, the first circuit board 2, the second circuit board 6, and the fourth circuit board 240 are connected in sequence and extend in the same direction.

[0206] In some examples, the first circuit board 2 is a flexible circuit board, the second circuit board 6 is a rigid circuit board, and the fourth circuit board 240 is a rigid circuit board. The first circuit board 2, the second circuit board 6, and the fourth circuit board 240 are connected to form a rigid-flexible circuit board.

[0207] For example, in the circuit board system 200, the third circuit board 220 is connected to the middle frame 230 through the fifth circuit board 250, and the fourth circuit board 240 is connected to the third circuit board 220. Taking advantage of the fact that the first circuit board 2 is a flexible circuit board, the first circuit board 2 and / or the second circuit board 6 connected to the fourth circuit board 240 can move relative to the middle frame 230, and the first connector 3 can also move relative to the middle frame 230.

[0208] Figure 17 These are structural diagrams of some other circuit boards provided in the embodiments of this application.

[0209] This application embodiment also provides a third circuit board 220, such as Figure 17 As shown, a plurality of first connection portions 221 are provided on the surface of the third circuit board 220.

[0210] In some alternative embodiments, the first connection portion 221 is used for connection to other circuit boards. For example, the first connection portion 221 can be connected to other circuit boards by plugging or crimping.

[0211] For example, other circuit boards may include, but are not limited to, the first circuit board 2, the second circuit board 6, and the fourth circuit board 240. For instance, the first connecting part 221 can be connected to other circuit boards by plugging in. The first connecting part 221 can be a female connector. The circuit board connected to the third circuit board 220 is provided with a male connector. The third circuit board 220 is connected to other circuit boards by plugging in the female connector and the male connector.

[0212] In this embodiment, a plurality of first connecting portions 221 are disposed on the surface of the third circuit board 220, which facilitates the connection of a plurality of fourth circuit boards 240 to the same third circuit board 220.

[0213] In some alternative embodiments, such as Figure 17 As shown, a second connecting part 222 may also be provided at one end of the third circuit board 220.

[0214] For example, the first connection part 221 can be connected to the fifth circuit board 250 by plugging or crimping.

[0215] In this embodiment, the second connection part 222 is disposed at one end of the third circuit board 220, which facilitates the connection of multiple third circuit boards 220 to the same fifth circuit board 250.

[0216] This application also provides an electronic device 1000, which includes a chip 100 and a circuit board assembly. The circuit board assembly may be the circuit board assembly 210 or the circuit board system 200 in any of the above embodiments.

[0217] In some alternative embodiments, chip 100 has a second connector 7, and the first connector 3 is connected to the second connector 7.

[0218] For example, the first connector 3 is a female connector, and the second connector 7 is a male connector. Or, for another example, the first connector 3 is a male connector, and the second connector 7 is a female connector.

[0219] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Furthermore, with the evolution of architectures and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

Claims

1. A circuit board assembly, characterized in that, The circuit board assembly includes: support; First circuit board; The first connector is connected to the first circuit board; A connector, wherein the first connector is connected to the bracket via the connector, and the first connector is configured to be movable relative to the bracket.

2. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly further includes: a flexible element; The elastic element is located between the first connector and the bracket; when the elastic element is compressed, the first end of the elastic element is connected to the first connector, and the second end of the elastic element is connected to the bracket.

3. The circuit board assembly according to claim 2, characterized in that, The elastic element surrounds the connector.

4. The circuit board assembly according to any one of claims 1 to 3, characterized in that, The first connector has a first opening, and the bracket has a second opening; the connector includes a pin portion and a limiting portion. The pin portion passes through the first opening and the second opening; the radial dimension of the pin portion is smaller than the radial dimension of the first opening, and / or the radial dimension of the pin portion is smaller than the radial dimension of the second opening; The limiting part is located at one or both ends of the pin part.

5. The circuit board assembly according to claim 4, characterized in that, The limiting part includes a first limiting part and / or a second limiting part; The first limiting part is connected to the pin part and is located on the side of the first opening away from the second opening; along the radial direction of the first opening, the size of the first limiting part is larger than the size of the first opening; The second limiting part is connected to the pin part and is located on the side of the second opening away from the first opening; along the radial direction of the second opening, the size of the second limiting part is larger than the size of the second opening.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that, The first connector has a guide pin on its surface facing away from the bracket.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that, The first connector has a guide hole on its surface facing away from the bracket; the opening size of the guide hole is larger than the bottom size.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The first circuit board is a flexible circuit board.

9. The circuit board assembly according to claim 8, characterized in that, The circuit board assembly also includes a second circuit board; The first connector is connected to the first circuit board via the second circuit board, which is a rigid circuit board.

10. A circuit board system, characterized in that, The circuit board system includes: Third circuit board; The circuit board assembly as described in any one of claims 1 to 9, wherein the first circuit board is connected to the third circuit board.

11. The circuit board system according to claim 10, characterized in that, The circuit board system includes a plurality of circuit board assemblies, wherein the first circuit board of the plurality of circuit board assemblies is connected to the third circuit board.

12. The circuit board system according to claim 11, characterized in that, The first circuit board in the plurality of circuit board assemblies is located on one side of the extension direction of the third circuit board, and the plurality of first circuit boards are arranged along the extension direction; In the same circuit board assembly, the first connector is located on the side of the first circuit board away from the third circuit board.

13. The circuit board system according to claim 11, characterized in that, The first circuit board in the plurality of circuit board assemblies is located on one side of the thickness direction of the third circuit board, and the plurality of first circuit boards are arranged along the thickness direction; In the same circuit board assembly, the direction of the first connector toward the first circuit board intersects with the thickness direction of the third circuit board.

14. The circuit board system according to any one of claims 10 to 13, characterized in that, The circuit board system includes a plurality of the third circuit boards; the plurality of the third circuit boards are arranged along the thickness direction.

15. An electronic device, characterized in that, The electronic device includes: A chip having a second connector; The circuit board assembly as described in any one of claims 1 to 9 or the circuit board system as described in any one of claims 10 to 14; the first connector is connected to the second connector.

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