Automobile electric control combination integrated device based on multi-layer architecture

Abstract

The application relates to the technical field of automobile electronic control and discloses a kind of automobile electric control combination integrated devices based on multi-layer architecture, including power distribution layer board, logic control layer board and power drive layer board that are sequentially and parallelly stacked, are connected by vertical conductive interconnection components between layers, and main control chip is internally integrated with modules such as data perception, heat conduction prediction, dynamic impedance evaluation, multidimensional cross-constraint solution and bottom layer timing reconstruction; the device combines physical substrate to establish a space thermal resistance matrix and extract high-frequency parasitic parameters of the interconnection components, quantifies the dynamic temperature increment and transient voltage drop generated by multi-task concurrency; on this basis, the optimal phase shift is iteratively solved within the multidimensional physical boundary, and the task timestamp is translated and reconstructed. The application avoids local thermal conflict and power grid anomaly caused by task concurrency through staggered scheduling of physical timing, triggers derating under limited working conditions to avoid deadlock, and maintains the running ability of hardware foundation.

Images