Circuit board assembly

By employing coreless technology and magnetic materials, a three-dimensional stacked structure for circuit boards was achieved, solving the problems of insufficient space utilization and signal interference, and improving the miniaturization and reliability of circuit boards.

CN122438262APending Publication Date: 2026-07-21HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
Filing Date
2025-01-17
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing circuit boards suffer from insufficient space utilization in terms of miniaturization, lightweighting, and high circuit density. They also pose reliability risks due to signal interference and direct conduction between the interposer chip and the circuit board.

Method used

The circuit board assembly is manufactured using a coreless process. The graphics processing unit (GPU) and high bandwidth memory (HBM) are wrapped and embedded in the circuit board using magnetic materials. The magnetic materials separate and connect the processor and memory chips, forming a three-dimensional stacked structure, which avoids signal interference and eliminates the reliability risks of direct laser hole conduction.

Benefits of technology

This technology enables miniaturization of circuit boards and high space utilization, while effectively preventing signal interference, improving the reliability of circuit boards, and reducing reliability risks.

✦ Generated by Eureka AI based on patent content.

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Abstract

A circuit board assembly includes an insulating material, a processor die, at least one memory die, a magnetic material, and a plurality of conductive layers. The insulating material has an upper surface and a lower surface. The processor die is disposed within the insulating material. The memory die is disposed vertically above the processor die. The magnetic material is disposed in the insulating material, wherein the magnetic material has a first portion and a second portion stacked vertically on the first portion, and the magnetic material is disposed around the processor die and the memory die. The conductive layers are disposed on the upper surface and the lower surface of the insulating material and in the insulating material, wherein the conductive layers are electrically connected to the memory die and the processor die. The circuit board can wrap and bury the processor and the high bandwidth memory in the circuit board by the magnetic material. Thus, while reducing the thickness of the circuit board and improving the space utilization of the circuit board, signal interference can also be effectively prevented.
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