Semiconductor structure and method of forming the same

CN122438375APending Publication Date: 2026-07-21BEIJING INTPROP OPERATION MANAGEMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING INTPROP OPERATION MANAGEMENT CO LTD
Filing Date
2025-01-21
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

反相器的信号传输在PULVT会变慢,导致N/P MOS传输信号不同步

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Abstract

The application provides a semiconductor structure and a forming method thereof. The semiconductor structure comprises a semiconductor substrate, a PMOS structure is formed on the surface of the semiconductor substrate, the PMOS structure comprises a fin and a gate structure covering the top and sidewall of the fin; the gate structure on the top of the fin comprises a second metal layer and a third metal layer stacked from bottom to top in sequence, and the resistivity of the third metal layer is less than that of the second metal layer. The application provides a semiconductor structure and a forming method thereof. By reducing the titanium nitride of the gate structure in the PULVT device, the gate resistance difference between the PULVT and the NULVT is reduced, and the N / P MOS transmission signal synchronization rate is improved.
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