LED packaging bracket and LED lamp bead

By designing shared die-bonding pads and partitioned connection pads in the LED package bracket, compatibility and heat dissipation issues are resolved, the compactness and reliability of the LED package structure are improved, and the lifespan of LED devices is extended.

CN122438451APending Publication Date: 2026-07-21HONGLI ZHIHUI GRP CO LTD +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HONGLI ZHIHUI GRP CO LTD
Filing Date
2026-04-02
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing LED packaging brackets are incompatible with LED chips of different sizes and power, and have poor heat dissipation and conductivity, resulting in heat accumulation, accelerated light decay and shortened lifespan.

Method used

An LED packaging bracket was designed, which adopts a structure of substrate, dam, die bond pads and connecting pad group. By using shared die bond pads and partitioned connecting pads, heat dissipation efficiency and conductivity are improved, and it can adapt to the mixed packaging requirements of LED chips of different sizes and power.

Benefits of technology

It improves the compactness and reliability of LED packaging structure, can effectively dissipate heat, is compatible with LED chips of different sizes and power, and extends the life of LED devices.

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Abstract

The application provides an LED packaging support and an LED lamp bead, and belongs to the technical field of LEDs. The LED packaging support comprises a substrate, a cofferdam located on the substrate and used for separating the substrate into four chip arrangement areas, the chip arrangement areas being arranged in two rows and two columns, two die bonding pads respectively located in the two chip arrangement areas of the first row and the two chip arrangement areas of the second row, and two connection pad groups respectively located in the two chip arrangement areas of the first row and the two chip arrangement areas of the second row, each connection pad group comprising at least three connection pads, and the two connection pad groups being located at the periphery of the two die bonding pads. The die bonding pads of the two chip arrangement areas of each row are shared, the area of the die bonding pad is increased, and the heat dissipation effect is improved. The die bonding pad and the connection pad group are separated in space, the heat dissipation function and the electrical connection function are flexibly combined and distributed, the mixed mounting of LED chips of different sizes and different powers is realized, and the compactness and reliability of the overall LED packaging structure are improved.
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