Display module and display device

Abstract

The application provides a display module and a display device, and relates to the technical field of display. The display module comprises a display panel and a flexible circuit board. The display panel comprises a bonding part, and the flexible circuit board comprises a circuit board main body and a gold finger. The gold finger and the pad of the bonding part are arranged in a stack along a first direction and are overlapped to form an electrical connection. At least two grooves are arranged in the overlapped part of the gold finger and the pad. A first protective glue layer is coated on the surface of the side of the gold finger away from the pad to cover the overlapped gap between the gold finger and the pad, fill the grooves and cover the surface of the pad under the grooves. According to the scheme, the glue in the bonding area can seal and protect the side edge area, improve the strength, avoid peeling and effectively improve the hand sweat level.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] With the continuous development of display technology, users' requirements for display panel products are also constantly increasing. Flexible organic light-emitting diode (OLED) screens have significant advantages in terms of thinness, flexibility, high contrast, low power consumption, and wide viewing angles, and are gradually becoming the mainstream choice for display technology. Currently, flexible OLED display modules in mobile phones have expanded from high-end models to mid-range and low-end models, basically covering all price ranges of mobile terminals. However, as flexible OLED technology matures, end-users are placing increasingly higher demands on the reliability of these modules. Sweat resistance testing has become one of the reliability testing standards that end-users are focusing on. The hand sweat resistance test simulates the user's daily use, where hand sweat enters the module's curved area through the edge of the cover plate, then intrudes into the module's bonding area through the edge of the display panel. Due to current limitations in dispensing technology, adhesive design cannot be applied to the side edges of the flexible printed circuit board (FPC On Panel, FOP) on the display panel. The side parts of the flexible printed circuit (FPC) bonding area are not covered with adhesive, so sweat can intrude through the sides, causing peeling and resulting in reliability issues such as black screen, abnormal display, or no display.

[0003] Therefore, improving the sweat resistance of display modules is an urgent problem to be solved. Summary of the Invention

[0004] This application provides a display module and a display device. The flexible circuit board gold fingers of the display module are designed in a segmented manner to ensure that the bonding adhesive can seal and protect the side areas, improve the strength of the FOP position, avoid peeling, and thus effectively improve the display module's resistance to hand sweat.

[0005] In a first aspect, a display module is provided, comprising a display panel and a flexible circuit board. The display panel includes a bonding portion, and the flexible circuit board includes a circuit board body and gold fingers. The gold fingers and the pads of the bonding portion are stacked and overlapped along a first direction to form an electrical connection. The portion of the gold fingers overlapping the pads has at least two grooves. The surface of the gold fingers away from the pads is coated with a first protective adhesive layer to cover the overlap gap between the gold fingers and the pads, fill the grooves, and cover the surface of the pads beneath the grooves.

[0006] In this embodiment, the gold fingers of the flexible circuit board corresponding to the edge of the pads on the display panel are segmented, i.e., grooves are set. When the first protective adhesive layer is applied, the adhesive flows into the grooves of the gold fingers of the flexible circuit board while covering the front overlap gap, thereby covering the side of the bonding part. Thus, the long side and side of the front of the bonding part are treated with adhesive, which improves the strength of the FOP position, avoids peeling during bending or use, and effectively improves the sweat resistance of the display module.

[0007] In conjunction with the first aspect, in certain implementations of the first aspect, in a second direction perpendicular to the first direction, the width of the gold finger is greater than the width of the pad, and the two side edges of the gold finger in the second direction protrude towards the pad along the first direction, with a gap between the two protruding edges of the gold finger and the edge of the pad. A second protective adhesive layer is coated on the surface of the bonding portion away from the gold finger to cover the overlap gap between the gold finger and the pad and to fill the gap.

[0008] In this embodiment, the gold fingers of the flexible circuit board are designed with unequal thickness at their edges, meaning the thickness at the two side edges is greater than the thickness at the middle edge. There are gaps between the side edges of the gold fingers and the pads. When applying the second protective adhesive layer, the adhesive simultaneously flows into the gaps at the side edges of the gold fingers, covering the overlap between the back of the gold fingers and the pads, and also covering the sides of the pads on the display panel. Furthermore, the raised edges of the gold fingers prevent the second protective adhesive layer from flowing out, avoiding adhesive overflow and residue. This ensures that both the long and side edges of the bonding area are treated with adhesive, improving the strength of the FOP (Flexible Opening) position, preventing peeling during bending or use, and effectively improving the display module's resistance to hand sweat.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the display panel further includes a display portion and a bent portion, with the display portion and the bonding portion located at opposite ends of the bent portion, and the display portion electrically connected to the bonding portion via the bent portion. The bent portion is used to create a bend, so that the bonding portion and the flexible circuit board are located on the back side of the display portion. A cover tape is provided on the side of the bonding portion away from the display portion to cover the driver chip on the bonding portion, and a shim is provided between the bonding portion and the display portion to support the bonding portion.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, in a second direction perpendicular to the first direction, the two sides of the pad block are provided with protrusions, which are flush with or extended outward relative to the two sides of the bonding portion.

[0011] In this embodiment, the raised block is partially designed to expand outwards, ensuring that there is no inward shrinkage between the bonding part and the display part. This prevents sweat from entering from the edge of the cover plate and penetrating into the bonding part through the gap, thus avoiding the problem of hand sweat corrosion and improving the hand sweat resistance of the display module.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, in a second direction perpendicular to the first direction, the two side edges of the covering tape are flush with or extended outward relative to the protruding edge of the pad block.

[0013] In this embodiment, the covering tape is designed to extend outward at the corresponding position of the local extension of the shim block, covering the exposed part of the shim block. This not only avoids the risk of foreign objects sticking to the exposed shim block, but also prevents sweat from invading the bonding area from the edge of the covering tape, thus avoiding the problem of hand sweat corrosion and improving the hand sweat resistance of the display module.

[0014] In conjunction with the first aspect, in some implementations of the first aspect, in a second direction perpendicular to the first direction, the two side edges of the shim are recessed relative to the two side edges of the bonding portion. Each side edge of the shim is provided with an absorbent layer for absorbing liquid, and the edges of the absorbent layers are flush with or extended outwards relative to the edges of the bonding portion.

[0015] In this embodiment, absorbent layers are locally added to both sides of the raised block. These absorbent layers effectively absorb liquid, thereby drawing in sweat that has seeped in from the edge of the cover plate into the absorbent layers and preventing sweat from corroding the bonding area. When sweat enters the bonding area along the lower edge of the display module, it flows through the gap between the raised block and the bonding area due to capillary action. When it reaches the absorbent layers, they absorb the sweat, preventing it from flowing further towards the solder pads, thus avoiding corrosion and improving the display module's resistance to hand sweat.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, the absorbent layer is absorbent foam or absorbent silicone.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, in the second direction, the two side edges of the covering tape are flush with or extended outward relative to the two side edges of the absorbent layer.

[0018] In this embodiment, the cover tape is designed to extend outwards at a local location on the raised block, covering the exposed area of ​​the absorbent layer. This prevents sweat from invading the bonding area from the edge of the cover tape, thus blocking the intrusion of sweat along the propagation path, thereby avoiding corrosion problems and improving the sweat resistance of the display module.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, the pins of the gold fingers are disposed in the portion between any two of the at least two grooves, and the pins form an electrical connection with the pads.

[0020] In a second aspect, a display device is provided, the display device comprising a display module in any of the implementations of the first aspect described above.

[0021] In conjunction with the second aspect, in some implementations of the second aspect, the display device further includes components such as a housing, a power supply, and control buttons. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a display panel and a flexible circuit board provided in an embodiment of this application; Figure 2 This is a schematic cross-sectional view of the bonding area of ​​a display module provided in an embodiment of this application; Figure 3 This is a schematic cross-sectional view of another display module bonding area provided in an embodiment of this application; Figure 4 This is a schematic cross-sectional view of another display module bonding area provided in an embodiment of this application; Figure 5 This is a schematic cross-sectional view of another display module bonding area provided in an embodiment of this application; Figure 6 This is a schematic diagram of the bonding structure between a display panel and a flexible circuit board provided in an embodiment of this application; Figure 7 This is an enlarged schematic diagram of the bonding structure between a display panel and a flexible circuit board provided in an embodiment of this application; Figure 8 This is a schematic cross-sectional view of the bending area of ​​a display module provided in an embodiment of this application; Figure 9 This is a schematic cross-sectional view of the bending area of ​​another display module provided in an embodiment of this application; Figure 10 This is a schematic cross-sectional view of the bending area of ​​another display module provided in an embodiment of this application; Figure 11 This is a schematic cross-sectional view of the bending area of ​​another display module provided in an embodiment of this application; Figure 12 This is a schematic cross-sectional view of the bending area of ​​another display module provided in an embodiment of this application. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0024] The "range" disclosed in this application is defined by a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, which define the boundaries of a specific range. Ranges defined in this way include endpoint values ​​and can be arbitrarily combined; that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60-120 and 80-110 are listed for a specific parameter, it is also expected that ranges of 60-110 and 80-120 are also included. Furthermore, if the minimum range values ​​are listed as 1 and 2, and the maximum range values ​​are listed as 3, 4, and 5, then the following ranges are all expected: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5. In this application, unless otherwise stated, the numerical range "ab" represents a shortened representation of any combination of real numbers between a and b, where a and b are real numbers. For example, the numerical range "0-5" means that all real numbers between "0-5" have been listed herein; "0-5" is simply a shortened representation of these numerical combinations. Furthermore, when a parameter is described as an integer greater than or equal to 2, it is equivalent to disclosing that the parameter is, for example, an integer such as 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0025] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined with each other to form new technical solutions.

[0026] Unless otherwise specified, all technical features and optional technical features of this application may be combined to form new technical solutions.

[0027] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0028] References to "one embodiment," "some embodiments," "one example," or "some examples" used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0029] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different descriptive objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0030] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are represented by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known parts may not be shown in the drawings.

[0031] It should be understood that the solution of this application can be applied to any form of display device, such as mobile phones, tablets, monitors, etc.

[0032] Currently, flexible OLED display modules for mobile phones have expanded from high-end models to mid-range and low-end models, basically covering all price ranges of mobile terminals. However, as flexible OLED technology matures, end-users are demanding higher reliability from these modules. The hand sweat resistance test simulates the experience of users' hands sweat entering the module's bending area through the cover edge and then infiltrating the module's FOP (Flexible Opening) area through the panel edge. Due to current limitations in adhesive application technology, adhesive cannot be applied to the FOP's side edges. Therefore, sweat can penetrate the FOP's bumps through the FOP's sides, causing peeling and resulting in reliability issues such as black screens, abnormal display, or no display.

[0033] like Figure 1 As shown, the display module includes a display panel 100 and a flexible circuit board 200. The display panel 100 includes a display portion 130, a bending portion 120, and a bonding portion 110. The flexible circuit board 200 includes a circuit board body 220 and gold fingers 210.

[0034] The bonding portion 110 of the display panel 100 includes an area for mounting a driver chip; in other words, the driver chip is connected to the display panel 100 at the bonding portion 110. Additionally, a flexible circuit board 200 is mounted on the bonding portion 110 of the display panel 100; in other words, the flexible circuit board 200 is connected to the display panel 100 at the bonding portion 110. Furthermore, the bonding portion 110 of the flexible circuit board can also be used to mount one or more other electronic devices.

[0035] like Figure 2 As shown, the traditional FPC has an inward-sloping design compared to the panel pads 111 of the display panel 100. Due to limitations in the adhesive coating process, it cannot be coated to the edge of the panel (affected by process precision, if it is coated flush, it may cause residual adhesive problems in the coating machine). As a result, the side part of the bonding area of ​​the module FPC is not covered with adhesive. In a sweaty environment, it is invaded by sweat and peeled off, resulting in black screen defects.

[0036] To ensure the adhesive protects the FOP (Folded Opening) area as much as possible, the adhesive needs to completely cover the long side and side edges of the FOP. This is because the sides are close to the panel edge, and during the application process, the adhesive may extend beyond the panel, resulting in adhesive residue on the bonding platform.

[0037] Based on the above problems, this application provides a display module and a display device. The flexible circuit board 200 of the display module has a segmented design for the gold fingers 210, which ensures that the adhesive of the bonding part 110 can seal and protect the side area, improve the strength of the FOP position, avoid peeling, and thus effectively improve the display module's resistance to hand sweat.

[0038] The display module provided in this application includes a display panel 100 and a flexible circuit board 200. The display panel 100 includes a bonding portion 110, and the flexible circuit board 200 includes a circuit board body 220 and gold fingers 210. The gold fingers 210 and the pads 111 of the bonding portion 110 are stacked and overlapped along a first direction to form an electrical connection.

[0039] It should be understood that the first direction X is as follows: Figures 2 to 5 as well as Figures 8 to 12 As shown, the first direction X can also be referred to as the thickness direction of the display panel 100, display module, or display device. The second direction Y is as follows... Figures 1 to 12 As shown, the second direction Y can also be referred to as the width direction of the display panel 100, display module, or display device. The third direction Z is as follows... Figure 1 , Figure 6 and Figure 7 As shown, the third direction Z can also be referred to as the length direction of the display panel 100, display module, or display device.

[0040] In this application, the bonding area refers to the portion where the gold finger 210 overlaps with the solder pad 111 of the bonding part 110 and the portion coated with adhesive.

[0041] In one embodiment, such as Figure 3 As shown, the gold finger 210 and the pad 111 of the bonding portion 110 are stacked and overlapped along a first direction to form an electrical connection. The overlapping portion of the gold finger 210 and the pad 111 has at least two grooves. The surface of the gold finger 210 away from the pad 111 is coated with a first protective adhesive layer 31 to cover the overlap gap between the gold finger 210 and the pad 111, and to fill and cover the surface of the pad 111 beneath the grooves.

[0042] At least two grooves are provided at the overlap between the gold finger 210 and the pad 111. That is, the bonding area of ​​the gold finger 210 of the flexible circuit board 200 is segmented. The gold finger 210 of the flexible circuit board 200 is segmented at the pin edge position of the display panel 100, so that during the FOP coating process, the adhesive flows into the groove position of the gold finger 210 of the flexible circuit board 200 while covering the front overlap gap, covering the side position of the FOP.

[0043] In one implementation, the pins of the gold finger 210 are disposed between any two of the at least two grooves, and the pins form an electrical connection with the pad 111. The grooves on both sides of the pad 111 are filled with a first protective adhesive layer 31, and the sides are protected by the first protective adhesive layer 31, so that sweat cannot corrode the pins of the gold finger 210 and the pad 111 portion through the side position of the FOP.

[0044] For example, the gold fingers 210 of the flexible circuit board 200 adopt a single-layer board groove design.

[0045] It should be understood that the number of grooves is at least two, thereby protecting both sides of the FOP. This application does not limit the number of grooves and more grooves can be provided. The grooves are provided on both sides of the gold finger 210, and the pins of the gold finger 210 are provided in the middle part of the gold finger 210, so that the glue filled in the grooves can protect the sides of the FOP.

[0046] For the segmented design of the gold fingers 210 of the flexible circuit board 200 described above, the groove position is preferably 0.2 mm-0.5 mm away from the edge of the solder pin, and more preferably 0.3 mm.

[0047] In one implementation, the groove width of the gold fingers 210 of the flexible circuit board 200 is preferably 0.5 mm to 1 mm, and more preferably 0.8 mm. A suitable groove width ensures that the adhesive in the first protective layer 31 can flow into the groove without generating adhesive bubbles.

[0048] According to this embodiment, the gold fingers 210 of the flexible circuit board 200 corresponding to the edge of the pad 111 of the display panel 100 are segmented, i.e., grooves are set. When the first protective adhesive layer 31 is applied, the adhesive flows into the groove of the gold fingers 210 of the flexible circuit board 200 at the same time as covering the front overlap gap, thereby covering the side of the bonding part 110. Thus, the long side and side of the front of the bonding part 110 are treated with adhesive, which improves the strength of the FOP position, avoids peeling caused by bending or use, and effectively improves the resistance of the display module to hand sweat.

[0049] In one embodiment, such as Figure 4 As shown, in a second direction perpendicular to the first direction, the width of the gold finger 210 is greater than the width of the pad 111, and the two side edges of the gold finger 210 in the second direction protrude towards the pad 111 along the first direction, with a gap between the two protruding edges of the gold finger 210 and the edge of the pad 111. A second protective adhesive layer 32 is coated on the surface of the bonding portion 110 away from the gold finger 210 to cover the overlap gap between the gold finger 210 and the pad 111 and to fill the gap.

[0050] The gold fingers 210 of the flexible circuit board 200 have an unequal thickness design. That is, the thickness on both sides of the gold fingers 210 is greater than the thickness in the middle. The two side edges of the gold fingers 210 protrude towards the pads 111, forming a thicker protrusion. There is a gap between this protrusion and the edge of the pads 111.

[0051] For example, the gold fingers 210 of the flexible circuit board 200 adopt a single-layer board design in the middle position and a double-layer board design at the edge position.

[0052] During the FOP coating process, the adhesive flows into the side edge of the gold finger 210 while covering the back overlap gap, covering the side of the FOP. Since the edge of the gold finger 210 is a double-layer board design, it can prevent the second protective adhesive layer 32 from flowing out of the edge of the flexible circuit board 200, thus avoiding adhesive overflow and residue problems.

[0053] For the unequal thickness design of the gold fingers 210 of the flexible circuit board 200, the thicker part is located at the two ends of the gold fingers 210 of the flexible circuit board 200, and its width is preferably 1 mm-2 mm, and its thickness is preferably 0.15 mm-0.3 mm.

[0054] According to this embodiment, the gold fingers 210 of the flexible circuit board 200 are designed with unequal thickness at their edges, meaning the thickness at the two side edges is greater than the thickness at the middle. There are gaps between the two side edges of the gold fingers 210 and the pads 111. When the second protective adhesive layer 32 is applied, the adhesive simultaneously flows into the gaps at the side edges of the gold fingers 210, covering the overlap between the back of the gold fingers 210 and the pads 111, and also covering the side edges of the pads 111 of the display panel 100. Furthermore, because the edges of the gold fingers 210 of the flexible circuit board 200 are raised, the second protective adhesive layer 32 can be prevented from flowing out of the edges of the gold fingers 210, avoiding adhesive overflow and residue problems. This ensures that both the long side and the side edge of the back of the bonding portion 110 are treated with adhesive, improving the strength of the FOP (Flexible Opening) position, preventing peeling during bending or use, and effectively improving the display module's resistance to hand sweat.

[0055] It should be understood that the first protective adhesive layer 31 in this application may also be referred to as the positive adhesive, and the second protective adhesive layer 32 may also be referred to as the back adhesive.

[0056] In one embodiment, such as Figures 5 to 7 As shown, the portion of the gold finger 210 that overlaps with the pad 111 has two grooves. A first protective adhesive layer 31 is coated on the surface of the gold finger 210 away from the pad 111 to cover the overlap gap between the gold finger 210 and the pad 111, fill the grooves, and cover the surface of the pad 111 beneath the grooves. In a second direction perpendicular to the first direction, the width of the gold finger 210 is greater than the width of the pad 111, and the two side edges of the gold finger 210 in the second direction protrude towards the pad 111 along the first direction, with a gap between the two protruding edges of the gold finger 210 and the edge of the pad 111. A second protective adhesive layer 32 is coated on the surface of the bonding portion 110 away from the gold finger 210 to cover the overlap gap between the gold finger 210 and the pad 111 and to fill the gap.

[0057] The gold fingers 210 of the flexible circuit board 200 are designed in a segmented and unequal thickness manner to ensure that the first protective adhesive layer 31 and the second protective adhesive layer 32 in the bonding area can seal and protect the side area of ​​the FOP.

[0058] At least two grooves are provided at the overlap between the gold finger 210 and the pad 111. That is, the bonding area of ​​the gold finger 210 of the flexible circuit board 200 is segmented. The gold finger 210 of the flexible circuit board 200 is segmented at the pin edge position of the display panel 100, so that during the FOP coating process, the adhesive flows into the groove position of the gold finger 210 of the flexible circuit board 200 while covering the front overlap gap, covering the side position of the FOP.

[0059] For the segmented design of the gold fingers 210 of the flexible circuit board 200 described above, the groove position is preferably 0.2 mm-0.5 mm away from the edge of the solder pin, and more preferably 0.3 mm.

[0060] In one implementation, the groove width of the gold fingers 210 of the flexible circuit board 200 is preferably 0.5 mm to 1 mm, and more preferably 0.8 mm. A suitable groove width ensures that the adhesive in the first protective layer 31 can flow into the groove without generating adhesive bubbles.

[0061] The gold fingers 210 of the flexible circuit board 200 adopt a single-layer board design in the middle and a double-layer board design at the edge.

[0062] During the FOP coating process, the adhesive flows into the side edge of the gold finger 210 while covering the back overlap gap, covering the side of the FOP. Since the edge of the gold finger 210 is a double-layer board design, it can prevent the second protective adhesive layer 32 from flowing out of the edge of the flexible circuit board 200, thus avoiding adhesive overflow and residue problems.

[0063] For the unequal thickness design of the gold fingers 210 of the flexible circuit board 200, the thicker part is located at the two ends of the gold fingers 210 of the flexible circuit board 200, and its width is preferably 1 mm-2 mm, and its thickness is preferably 0.15 mm-0.3 mm.

[0064] According to this embodiment, the gold fingers 210 of the flexible circuit board 200 corresponding to the edge of the pads 111 of the display panel 100 are segmented and of unequal thickness. When the first protective adhesive layer 31 is applied, the adhesive simultaneously flows into the groove of the gold fingers 210 of the flexible circuit board 200 while covering the front overlap gap, thereby covering the side of the bonding portion 110. There are gaps between the two sides of the gold fingers 210 of the flexible circuit board 200 and the pads 111. When the second protective adhesive layer 32 is applied, the adhesive simultaneously flows into the gap at the side edge of the gold fingers 210 of the flexible circuit board 200 while covering the back overlap gap of the gold fingers 210 of the flexible circuit board 200 and the pads 111, covering the side of the pads 111 of the display panel 100. Furthermore, because the edges of the gold fingers 210 of the flexible circuit board 200 are raised, the second protective adhesive layer 32 can be prevented from flowing out of the edges of the gold fingers 210 of the flexible circuit board 200, avoiding adhesive overflow and residue problems. The long side and side of the front of the bonding part 110 are treated with adhesive to improve the strength of the FOP position, prevent peeling during bending or use, and effectively improve the display module's resistance to hand sweat.

[0065] See also Figure 1 and Figure 8The display panel 100 also includes a display portion 130 and a bending portion 120. The display portion 130 and the bonding portion 110 are located at opposite ends of the bending portion 120, and the display portion 130 is electrically connected to the bonding portion 110 through the bending portion 120. The bending portion 120 is used to generate a bend, so that the bonding portion 110 and the flexible circuit board 200 are located on the back side of the display portion 130. A cover tape 43 is provided on the side of the bonding portion 110 away from the display portion 130. The cover tape 43 is used to cover the driver chip on the bonding portion 110. A shim 42 is provided between the bonding portion 110 and the display portion 130. The shim 42 is used to support the bonding portion 110.

[0066] The display panel 100 bends the bonding portion 110 to the back side using pad bending technology, and the flexible circuit board 200 achieves electrical connection by overlapping and connecting with the bonding portion 110 of the display panel 100.

[0067] An SCF component 41 is disposed on one side of the backlight surface of the display panel 100. The SCF component 41 may be an SCF composite film, and the SCF component 41 includes an adhesive layer, a buffer layer, and a heat dissipation layer stacked sequentially in a direction away from the display panel 100. The SCF component 41 is a high-strength support, buffer, absorption, and heat dissipation structure. In order to ensure thermal conductivity, heat dissipation performance, support performance, and impact buffering performance, a three-layer stacked design of Embo adhesive-Foam foam-Cu copper foil is usually adopted.

[0068] It should be understood, such as Figure 8 As shown, hand sweat enters the module's bent portion 120 through the edge of the cover plate, and then infiltrates the module's FOP position through the edge of the display panel 100. There are two infiltration paths: one is due to the spacer 42 being recessed relative to the display panel 100, creating a gap between the display panel 100 and the SCF component 41, allowing sweat to infiltrate along the edge to the FOP edge. The other is due to the ICCover Tape 43 being recessed relative to the display panel 100, allowing sweat to infiltrate the FOP edge along the edge of the ICCover Tape 43.

[0069] To address the aforementioned issues, the display module and display device provided in this application prevent hand sweat from penetrating the bonding location through the gaps, thereby avoiding the corrosion problem caused by hand sweat.

[0070] In one embodiment, such as Figure 9 As shown, in a second direction perpendicular to the first direction, the two sides of the shim block 42 are provided with protrusions, which are flush with or extended outward relative to the two sides of the bonding part 110.

[0071] The raised block 42 has a local outward expansion design to ensure that there is no inward shrinkage between the bonding part 110 and the SCF component 41, thus preventing sweat from entering the bonding position through the gap.

[0072] The raised portion of the pad 42 is preferably located 5 mm to 10 mm from the bonding area, the raised portion is preferably 2 mm to 3 mm wide, and the raised portion is preferably 0.5 mm to 2 mm long.

[0073] According to this embodiment, the raised block 42 is partially expanded outward to ensure that there is no inward shrinkage between the bonding part 110 and the display part 130, thus preventing sweat from entering from the edge of the cover plate and penetrating into the bonding part 110 through the gap, avoiding the problem of hand sweat corrosion, and improving the hand sweat resistance of the display module.

[0074] In one embodiment, such as Figure 10 As shown, in a second direction perpendicular to the first direction, the two sides of the shim block 42 are provided with protrusions, which are flush with or extend outward relative to the two sides of the bonding portion 110. In the second direction perpendicular to the first direction, the two sides of the cover tape 43 are flush with or extend outward relative to the protrusions of the shim block 42.

[0075] The raised portion of the pad 42 is preferably located 5 mm to 10 mm from the bonding area, the raised portion is preferably 2 mm to 3 mm wide, and the raised portion is preferably 0.5 mm to 2 mm long.

[0076] The outer extension of the covering tape 43 (e.g., copper foil or conductive cloth) corresponds to the position of the protrusion of the pad 42. Its size is preferably greater than the protruding length and width of the protrusion by 1 mm to 3 mm, and more preferably 2 mm.

[0077] According to this embodiment, the covering tape 43 is designed to extend outward at the corresponding position of the local extension of the shim block 42, covering the exposed part of the shim block 42. This not only avoids the risk of foreign objects sticking to the exposed shim block 42, but also prevents sweat from invading the bonding part 110 area from the edge of the covering tape 43, thus avoiding the problem of hand sweat corrosion and improving the hand sweat resistance of the display module.

[0078] In one embodiment, such as Figure 11 As shown, in a second direction perpendicular to the first direction, the two side edges of the shim 42 are recessed relative to the two side edges of the bonding portion 110. A water-absorbing layer 44 is provided on each side edge of the shim 42. The water-absorbing layer 44 is used to absorb liquid, and the edges of the water-absorbing layer 44 are flush with or extended outwards relative to the edges of the bonding portion 110.

[0079] In one implementation, the absorbent layer 44 is absorbent foam or absorbent silicone.

[0080] It should be understood that the absorbent layer 44 can also be made of other materials.

[0081] Add absorbent foam to the raised block 42 to absorb intruding sweat, thus preventing sweat from corroding the bonding area. Alternatively, add absorbent silicone to the raised block 42 to absorb intruding sweat, thus preventing sweat from corroding the bonding area.

[0082] The location of the locally added absorbent foam in the shim block 42 is preferably 5 mm-10 mm away from the bonding area. The foam is about 4 mm-6 mm long and about 1 mm-3 mm wide, and its distance from the pad 111 of the display panel 100 is 2 mm-4 mm.

[0083] The location of the locally added absorbent silicone pad 42 is preferably 5 mm-10 mm away from the bonding area. The silicone pad is about 4 mm-6 mm long and about 1-3 mm wide, and its distance from the pad 111 of the display panel 100 is 2-4 mm.

[0084] According to this embodiment, absorbent layers 44 are locally added to both sides of the raised block 42. The absorbent layers 44 can effectively absorb liquid, thereby absorbing sweat that has invaded from the edge of the cover plate into the absorbent layers 44, thus preventing sweat from corroding the bonding portion 110. When sweat enters the bonding portion 110 along the lower edge of the display module, due to the capillary action of the liquid, the sweat will flow through the gap between the raised block 42 and the edge of the bonding portion 110. When it flows to the absorbent layer 44, the absorbent layer 44 will absorb it, preventing the sweat from continuing to flow to the solder pad 111, thereby avoiding corrosion problems and improving the display module's resistance to hand sweat.

[0085] In one embodiment, such as Figure 12 As shown, in a second direction perpendicular to the first direction, the two side edges of the shim 42 are recessed relative to the two side edges of the bonding portion 110. Each side edge of the shim 42 is provided with an absorbent layer 44 for absorbing liquid, and the edges of the absorbent layer 44 are flush with or extend outwards relative to the edges of the bonding portion 110. The two side edges of the cover tape 43 are flush with or extend outwards relative to the two side edges of the absorbent layer 44.

[0086] An absorbent layer 44 is added to a portion of the raised block 42, and the covering tape 43 is designed to extend outwards in a localized manner. This absorbs intruding sweat into the absorbent layer 44, thereby preventing sweat from corroding the bonding area. In addition, the covering tape 43 is designed to extend outwards at the corresponding locations of the extended portion of the raised block 42, covering the exposed parts of the raised block 42.

[0087] The position of the padding block 42 with the added water-absorbing layer 44 is preferably 5 mm-10 mm away from the bonding area. The foam is about 4 mm-6 mm long and about 1 mm-3 mm wide, and its distance from the pad 111 of the display panel 100 is 2 mm-4 mm.

[0088] The position of the covering tape 43 (e.g., copper foil or conductive cloth) extends outward to correspond to the position of the added absorbent layer 44. Its size is preferably greater than the protruding length and width of the absorbent layer 44 by 1 mm to 3 mm, and more preferably by 2 mm.

[0089] According to this embodiment, absorbent layers 44 are locally added to both sides of the raised block 42. The absorbent layers 44 can effectively absorb liquid, thereby absorbing sweat that has invaded from the edge of the cover plate into the absorbent layers 44, thus preventing sweat from corroding the bonding portion 110. When sweat enters the bonding portion 110 along the lower edge of the display module, due to the capillary action of the liquid, the sweat will flow through the gap between the edge of the raised block 42 and the bonding portion 110. When it flows to the absorbent layer 44, the absorbent layer 44 will absorb it, preventing the sweat from continuing to flow to the pad 111. The cover tape 43 is simultaneously designed to extend outward at a local location on the raised block 42, covering the exposed part of the absorbent layer 44, blocking the sweat from invading the bonding area from the edge of the cover tape 43, blocking the intrusion of sweat from the propagation path, thereby avoiding corrosion problems and improving the sweat resistance of the display module.

[0090] This application also provides a display device, which includes the display module described in the above embodiments.

[0091] Optionally, the display device may also include components such as a housing, power supply, and control buttons.

[0092] Alternatively, the display device may be a mobile phone, a flat-screen computer, a monitor, a virtual reality device, or an augmented reality device.

[0093] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components or steps can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no conflict in structure or method steps. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0094] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, The display module includes a display panel and a flexible circuit board. The display panel includes a bonding portion, and the flexible circuit board includes a circuit board body and gold fingers. The gold fingers and the pads of the bonding portion are stacked and overlapped along a first direction to form an electrical connection. The portion of the gold finger that overlaps with the pad has at least two grooves. The surface of the gold finger away from the pad is coated with a first protective adhesive layer to cover the overlap gap between the gold finger and the pad, and to fill the grooves and cover the surface of the pad under the grooves.

2. The display module according to claim 1, characterized in that, In a second direction perpendicular to the first direction, the width of the gold finger is greater than the width of the pad, and the gold finger is located on both sides of the second direction, protruding towards the pad along the first direction, with a gap between the protruding edges of the gold finger and the edge of the pad; The bonding portion has a second protective adhesive layer applied to the side of the surface away from the gold finger to cover the overlap gap between the gold finger and the pad and to fill the gap.

3. The display module according to claim 1 or 2, characterized in that, The display panel further includes a display portion and a curved portion, wherein the display portion and the bonding portion are located at opposite ends of the curved portion, and the display portion is electrically connected to the bonding portion through the curved portion; the curved portion is used to generate a bend, such that the bonding portion and the flexible circuit board are located on the back side of the display portion; The bonding portion has a cover tape on the side away from the display portion to cover the driver chip on the bonding portion, and a shim is provided between the bonding portion and the display portion to support the bonding portion.

4. The display module according to claim 3, characterized in that, In a second direction perpendicular to the first direction, the two sides of the shim block are provided with protrusions, which are flush with or extended outward relative to the two sides of the bonding portion.

5. The display module according to claim 4, characterized in that, In a second direction perpendicular to the first direction, the two side edges of the covering tape are flush with or extended outward relative to the protruding edge of the pad block.

6. The display module according to claim 3, characterized in that, In a second direction perpendicular to the first direction, the two side edges of the shim are recessed relative to the two side edges of the bonding portion; each side edge of the shim is provided with an absorbent layer, and the edge of the absorbent layer is flush with or extended relative to the edge of the bonding portion.

7. The display module according to claim 6, characterized in that, The absorbent layer is absorbent foam or absorbent silicone.

8. The display module according to claim 6 or 7, characterized in that, In the second direction, the two side edges of the covering tape are flush with or extended outward relative to the two side edges of the absorbent layer.

9. The display module according to any one of claims 1-8, characterized in that, The pins of the gold fingers are disposed in the portion between any two of the at least two grooves, and the pins form an electrical connection with the pads.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.

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