An automatic feeding system and method for a semiconductor packaging magazine

Abstract

The present application relates to the technical field of semiconductor manufacturing, and particularly relates to an automatic feeding system and a feeding method for a semiconductor packaging material box. The automatic feeding system comprises a base, a height adjusting device, a spacing adjusting device, a clamping device and a pushing device. The clamping device comprises a plurality of clamping adjusting assemblies. Each clamping adjusting assembly comprises two clamping pieces arranged oppositely. The two clamping pieces can move towards or away from each other to clamp the material box. The spacing adjusting device comprises a plurality of spacing adjusting execution ends arranged at intervals on the base along a first direction. The plurality of clamping adjusting assemblies and the plurality of spacing adjusting execution ends are arranged one by one to adjust the center distance of the material boxes on the adjacent two clamping adjusting assemblies. The pushing device can move along a second direction of the base to push the material box into a receiving seat. The automatic feeding system integrates a plurality of functional devices to realize the full-process automation from the feeding preparation to the final pushing, thereby improving the chip packaging efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to an automatic feeding system and method for semiconductor packaging cartridges. Background Technology

[0002] Chip packaging, a crucial process in semiconductor manufacturing, involves placing, securing, and sealing chips using specific materials and processes to protect their performance and connect chip contacts to the package casing, extending the chip's internal functions externally. As electronic products continue to upgrade towards miniaturization and multi-functionality, advanced semiconductor packaging is evolving towards multi-variety, small-batch, and highly mixed production scenarios. This significantly increases the demands on packaging production lines for flexible, intelligent, and efficient material handling. As the core carrier of valuable materials such as chips and wafers, the loading and unloading of material containers is a critical hub connecting packaging equipment and warehousing systems, directly impacting production line efficiency and material safety.

[0003] Existing packaging equipment's cassette loading and unloading devices are only suitable for single-size cassettes and cannot accommodate the positioning and conveying of multiple cassette models, resulting in poor versatility. Furthermore, the center-to-center distance between adjacent cassettes cannot be flexibly adjusted according to the actual receiving space of the receiving seat, easily leading to insufficient material docking accuracy and limited adaptability, directly impacting chip packaging efficiency. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides an automatic feeding system and feeding method for semiconductor packaging boxes, which solves the technical problem of low chip packaging efficiency.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the main technical solutions adopted by the present invention include:

[0008] This invention provides an automatic feeding system for semiconductor packaging boxes, including a base, a height adjustment device, a spacing adjustment device, a clamping device, and a pushing device. The height adjustment device is disposed on one side of the base and is used to adjust the height of the base relative to the receiving seat. The clamping device includes multiple clamping adjustment components, each of which includes two clamping members disposed opposite to each other along a first direction. The two clamping members can move towards or away from each other to clamp the box. The box extends along a second direction, and the first and second directions are perpendicular to each other. The spacing adjustment device includes multiple spacing adjustment actuators disposed at intervals along the first direction on the base. The multiple clamping adjustment components and the multiple spacing adjustment actuators are disposed one-to-one. The spacing adjustment actuators can move along the first direction of the base to adjust the center distance between the boxes on two adjacent clamping adjustment components. The pushing device is disposed on the base and can move along the second direction of the base to push the box into the receiving seat.

[0009] Preferably, the spacing adjustment device includes a first mounting plate, a docking moving component, and a spacing adjustment moving component. The docking moving component is disposed on the base and its moving end is connected to the first mounting plate. The moving end of the docking moving component can drive the first mounting plate to reciprocate relative to the base in a second direction, so that the first mounting plate extends out of the side of the base and docks with the receiving seat. The spacing adjustment moving component is disposed on the first mounting plate, and multiple moving ends of the spacing adjustment moving component form spacing adjustment execution ends. Multiple clamping adjustment components are respectively connected to the moving ends of the multiple spacing adjustment moving components one by one along the first direction of the first mounting plate. The moving end of the spacing adjustment moving component can drive the clamping adjustment components to move along the first direction to adjust the center distance of the loading boxes of two adjacent clamping adjustment components.

[0010] Preferably, the docking moving component includes a docking driving unit and a docking guiding unit. The docking driving unit drives the first mounting plate to reciprocate linearly along the second direction, and the docking guiding unit is disposed on the base and guides the movement of the first mounting plate.

[0011] Preferably, the spacing adjustment moving component includes a spacing adjustment driving unit, at least one guide rail, and a plurality of sliders disposed on the guide rail, the sliders forming the moving end of the spacing adjustment moving component; each slider on the guide rail is disposed in a one-to-one correspondence with the clamping adjustment component, and the spacing adjustment driving unit drives the slider to reciprocate along the first direction of the guide rail.

[0012] Preferably, the clamping adjustment assembly includes a clamping adjustment moving unit, a first clamping mounting plate, a second clamping mounting plate, and two clamping members; the clamping members are clamping plates; the two clamping plates are arranged opposite to each other and are respectively connected to the two moving ends of the clamping adjustment moving unit through the first clamping mounting plate and the second clamping mounting plate; the clamping adjustment moving unit can drive the two clamping plates to move towards each other or away from each other.

[0013] Preferably, the pushing device includes a pushing moving component and a pushing frame; the pushing moving component is disposed on the base, and the pushing moving component can drive the pushing frame to move in the second direction so as to simultaneously abut one end of all the material boxes and can disengage the material boxes from the clamping and adjusting component.

[0014] Preferably, the push frame is gate-shaped, and the top crossbeam of the push frame is higher than the top of the clamping and adjusting component and lower than the top of the material box so that the clamping and adjusting component passes through the push frame during the push frame's advancement; all material boxes are pushed through the top crossbeam of the same push frame.

[0015] Preferably, the height adjustment device includes a frame, a height moving component, and a mounting panel. The height moving component is disposed on the frame. The base and the mounting panel are detachably connected. The height moving component can drive the mounting panel and the base to move up and down synchronously to adapt to the bearing height of the support seat.

[0016] Preferably, it also includes a height detection sensor, a receiving seat detection sensor, and a material box detection sensor; the height detection sensor and the receiving seat detection sensor are both disposed on the first mounting plate, the height detection sensor is used to detect whether the base has reached the preset height, and the receiving seat detection sensor is used to detect whether the base has reached the preset docking position of the receiving seat; the material box detection sensor is disposed on the clamping adjustment assembly and is used to detect whether the clamping adjustment assembly is clamping the material box.

[0017] The present invention also provides an automatic feeding method for semiconductor packaging cartridges, employing the aforementioned automatic feeding system for semiconductor packaging cartridges. The automatic feeding system further includes a control device, and the automatic feeding method includes the following steps:

[0018] S1. The control device controls the clamping adjustment assembly of the clamping device, so that the two clamping parts of the clamping adjustment assembly move towards or away from each other according to the size of the material box, so as to clamp the material box.

[0019] S2. The control device controls the height adjustment device to adjust the base to match the height of the support according to the height of the support.

[0020] S3. The control device controls the spacing adjustment execution end of the spacing adjustment device to move along the first direction of the base, adjusting the center distance of the upper box of the two adjacent clamping adjustment components so that it matches the receiving space of the receiving seat.

[0021] S4. The control device controls the pushing device to push the material box along the second direction, pushing the material box from the clamping and adjusting assembly to the receiving seat to complete the automatic feeding.

[0022] (III) Beneficial Effects

[0023] The beneficial effects of this invention are:

[0024] This invention discloses an automatic feeding system for semiconductor packaging cassettes, comprising a base, a height adjustment device, a spacing adjustment device, a clamping device, and a pushing device. The height adjustment device is located on one side of the base and is used to adjust the height of the base relative to the receiving seat, enabling flexible matching with receiving seats of different heights (such as different types of packaging equipment or storage interfaces), thus improving the versatility of the equipment. The clamping device includes multiple clamping adjustment components, each including two clamping members arranged opposite each other along a first direction. The two clamping members can move towards or away from each other to clamp the cassette. The cassette extends along a second direction, and the first and second directions are perpendicular to each other. Through the towards / away movement of the clamping members, single cassettes of different widths or sizes can be reliably clamped, achieving adaptive compatibility with various cassette specifications. The spacing adjustment device includes multiple spacing adjustment actuators spaced apart on a base along a first direction. Multiple clamping adjustment components are correspondingly arranged one-to-one with each spacing adjustment actuator. The spacing adjustment actuators can move along the first direction of the base to adjust the center distance between the material boxes on adjacent clamping adjustment components. A pushing device is located on the base and can move along a second direction to push the material boxes into the receiving seat. The spacing adjustment device can accurately adjust the center distance between multiple material boxes according to the actual receiving space of the receiving seat, thereby ensuring the accuracy of the material box docking with downstream equipment and avoiding docking failure or chip damage due to center distance mismatch. The automatic feeding system integrates multiple functional devices to form a complete and automated material box feeding system, achieving full automation from feeding preparation to final pushing, thereby improving chip packaging efficiency.

[0025] The present invention provides an automatic feeding method for semiconductor packaging boxes, which realizes a fully automatic, high-precision, and high-safety feeding process. It can adapt to the multi-variety, small-batch, and highly mixed production mode in advanced semiconductor packaging production lines, thereby improving production line operating efficiency and material safety. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the automatic feeding system for semiconductor packaging cartridges according to the present invention;

[0027] Figure 2 This is a schematic diagram of the height adjustment device;

[0028] Figure 3 This is a schematic diagram of the structure of the first mounting plate and the docking moving component in the spacing adjustment device;

[0029] Figure 4 An exploded view of the spacing adjustment moving component and clamping device in the spacing adjustment device;

[0030] Figure 5 for Figure 4 A schematic diagram of the structure of the center-gap adjustment moving component;

[0031] Figure 6 for Figure 4 A schematic diagram of the clamping device.

[0032] Figure 7 for Figure 6 A schematic diagram of the decomposition process;

[0033] Figure 8 This is a schematic diagram of the pushing device.

[0034] Figure 9 This is a schematic diagram of the initial state of an automated feeding system for semiconductor packaging cartridges.

[0035] Figure 10 A schematic diagram illustrating the structure for connecting the movable component to the receiving seat;

[0036] Figure 11 This is a schematic diagram of the structure where the push frame abuts against the material box;

[0037] Figure 12 A structural diagram illustrating the process of pushing the material box to the receiving seat using the push frame;

[0038] Figure 13 This is a schematic diagram showing the structure in which the push frame has pushed the material box onto the receiving seat.

[0039] [Explanation of Labels in the Attached Image]

[0040] 1: Base;

[0041] 2: Height adjustment device; 21: Frame; 22: Height movement component; 221: First drive motor; 222: Lifting unit; 2221: First rotating wheel; 2222: First synchronous belt; 23: Mounting panel;

[0042] 3: Spacing adjustment device; 31: First mounting plate; 32: Docking moving assembly; 321: Docking drive unit; 3211: Second drive motor; 3212: First gear; 3213: First rack; 322: Docking guide unit; 3221: First guide rail; 3222: First guide block; 33: Spacing adjustment moving assembly; 331: Spacing adjustment drive unit; 3311: Third drive motor; 3312: Second rotating wheel; 3313: Second synchronous belt; 3314: First connecting plate; 332: Guide rail; 333: Slider; 34: Height detection sensor; 35: Support seat detection sensor;

[0043] 4: Clamping device; 41: Clamping adjustment assembly; 411: Clamping adjustment moving unit; 4111: Fourth drive motor; 4112: Second gear; 4113: Second rack; 4114: Third rack; 4115: Second guide rail; 4116: Second guide block; 412: First clamping mounting plate; 413: Second clamping mounting plate; 414: Clamping plate; 42: Material box detection sensor;

[0044] 5: Pushing device; 51: Pushing moving component; 511: Pushing drive unit; 5111: Fifth drive motor; 5112: Third rotating wheel; 5113: Third synchronous belt; 5114: Second connecting plate; 512: Pushing guide unit; 5121: Third guide rail; 5122: Third guide block; 52: Pushing frame;

[0045] 6: Material box;

[0046] 7: Receiving seat. Detailed Implementation

[0047] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] Example 1

[0049] like Figure 1 As shown, this embodiment of the invention provides an automatic feeding system for semiconductor packaging cartridges. The automatic feeding system includes a base 1, a height adjustment device 2, a spacing adjustment device 3, a clamping device 4, and a pushing device 5. The height adjustment device 2 is located on one side of the base 1 and is used to adjust the height of the base 1 relative to the receiving seat 7, enabling flexible matching of receiving seats 7 of different heights (such as different models of packaging equipment or storage interfaces), thus improving the versatility of the equipment. The receiving seat 7 is a docking and matching structure in subsequent semiconductor packaging equipment. It should be noted that during the feeding preparation stage of the automatic feeding system, the integrated automated transfer and precise docking of the pre-loaded cartridges 6 can be achieved through an AMR (Autonomous Mobile Robot) without manual intervention in the base transfer.

[0050] The clamping device 4 includes multiple clamping adjustment components 41. Each clamping adjustment component 41 includes two clamping members arranged opposite each other along a first direction. The two clamping members can move towards or away from each other to clamp the material box 6. The material box 6 extends along a second direction, and the first and second directions are perpendicular to each other. By moving the clamping members towards or away from each other, single material boxes 6 of different widths or sizes can be reliably clamped, achieving adaptive compatibility with various specifications of material boxes 6.

[0051] The spacing adjustment device 3 includes multiple spacing adjustment actuators spaced apart on the base 1 along a first direction. Multiple clamping adjustment components 41 are arranged one-to-one with the multiple spacing adjustment actuators. The spacing adjustment actuators can move along the first direction of the base 1 to adjust the center distance of the material boxes 6 on two adjacent clamping adjustment components 41. The spacing adjustment device 3 can accurately adjust the center distance between the multiple material boxes 6 according to the actual receiving space of the receiving seat 7, thereby ensuring the accuracy of the docking between the material boxes 6 and the downstream equipment and avoiding docking failure or chip damage caused by mismatch of center distance.

[0052] The pushing device 5 is mounted on the base 1 and can move along the second direction of the base 1 to push the material box 6 into the receiving seat 7. The automatic feeding system integrates multiple functional devices to form a complete and automated material box 6 feeding system, realizing full-process automation from feeding preparation to final pushing, thereby improving chip packaging efficiency.

[0053] like Figure 2As shown, the height adjustment device 2 includes a frame 21, a height movement component 22, and a mounting panel 23. The height movement component 22 is mounted on the frame 21, and the base 1 is detachably connected to the mounting panel 23. The height movement component 22 can drive the mounting panel 23 and the base 1 to move synchronously up and down to adapt to the receiving height of the support seat 7. The height movement component 22 includes a first drive motor 221 and a lifting unit 222, both mounted on the frame 21. The mounting panel 23 is located at the lifting end of the lifting unit 222 and is detachably connected to the base 1. The first drive motor 221 drives the lifting unit 222 to move up and down, causing the mounting panel 23 to move the base 1 up and down, thereby achieving continuous adjustment of the overall height. In this embodiment, to improve the balance and operational stability of the lifting support, two spaced-apart lifting units 222 are included, respectively connected to the left and right sides of the mounting panel 23. Each lifting unit 222 includes two first rotating wheels 2221 and a first synchronous belt 2222 sleeved on the two first rotating wheels 2221. The two sides of the mounting panel 23 are fixedly connected to the same side of the corresponding first synchronous belt 2222. The first drive motor 221 forms a synchronous transmission structure through a linkage rotating shaft, which can simultaneously drive the upper first rotating wheel 2221 of the two lifting units 222 to rotate synchronously, thereby driving the first synchronous belt 2222 to operate. The synchronous belt transmission enables smooth lifting and lowering adjustment of the mounting panel 23 and the base 1. It should be noted that the first drive motor 221 can switch between forward and reverse operation to drive the first synchronous belt 2222 to rotate in either direction, thereby controlling the mounting panel 23 to complete the rising and falling actions, achieving bidirectional and stable adjustment of the overall height of the base 1. The height adjustment device 2 adopts a combination of dual lifting units 222 and synchronous belt drive, which not only ensures the stability and synchronization of the lifting process when supporting the base 1, but also realizes left and right linkage through a single motor drive, reducing control complexity and energy consumption, while meeting the on-site needs of different support bases 7 with large height differences.

[0054] like Figure 3 and Figure 4 As shown, the spacing adjustment device 3 includes a first mounting plate 31, a docking moving component 32, and a spacing adjustment moving component 33. The docking moving component 32 is disposed on the base 1, and its moving end is connected to the first mounting plate 31. The moving end of the docking moving component 32 can drive the first mounting plate 31 to reciprocate relative to the base 1 in a second direction, so that the first mounting plate 31 extends out of the side of the base 1 and docks with the receiving seat 7. Through the docking moving component 32, the spacing adjustment device 3 can actively extend when docking is required, avoiding the cumulative error caused by frequent movement of the entire base 1, while shortening the pushing stroke of the material box 6 and improving docking efficiency.

[0055] like Figure 3As shown, the docking moving assembly 32 includes a docking drive unit 321 and a docking guide unit 322. The docking drive unit 321 drives the first mounting plate 31 to reciprocate linearly along a second direction. The docking guide unit 322 is disposed on the base 1 and guides the movement of the first mounting plate 31. The docking drive unit 321 includes a second drive motor 3211, a first gear 3212, and a first rack 3213. The second drive motor 3211 is disposed on the base 1, the first gear 3212 is disposed at the output end of the second drive motor 3211, and the first rack 3213 is disposed on the first mounting plate 31 and extends along the second direction. The first gear 3212 meshes with the first rack 3213. The second drive motor 3211 drives the first gear 3212 to rotate, thereby driving the first rack 3213 to move linearly along the second direction. The gear and rack transmission can precisely control the extension distance of the first mounting plate 31, ensuring the fitting accuracy of the docking surface between the first mounting plate 31 and the receiving seat 7.

[0056] To ensure the stability of the first mounting plate 31's movement relative to the base 1, this embodiment provides two symmetrically arranged docking guide units 322. Each docking guide unit 322 includes a first guide rail 3221 and a first guide block 3222. The first guide rail 3221 is disposed on the base 1, and the first guide block 3222 is disposed on the first mounting plate 31. The first guide block 3222 is slidably connected to the first guide rail 3221. The symmetrically arranged docking guide units 322 effectively resist the deflection torque generated by the first mounting plate 31 at its extended end due to its own weight or external force, improving the anti-eccentric load capacity during docking and extending the service life of the docking guide units 322.

[0057] like Figure 4 As shown, the spacing adjustment moving component 33 is disposed on the first mounting plate 31. Multiple moving ends of the spacing adjustment moving component 33 form spacing adjustment execution ends. Multiple clamping adjustment components 41 are respectively connected to the moving ends of the multiple spacing adjustment moving components 33 in a corresponding manner along the first direction of the first mounting plate 31. The moving ends of the spacing adjustment moving component 33 can drive the clamping adjustment components 41 to move along the first direction to adjust the center distance of the feeding box 6 of two adjacent clamping adjustment components 41.

[0058] like Figure 5As shown, the spacing adjustment moving component 33 includes a spacing adjustment driving unit 331, at least one guide rail 332, and a plurality of sliders 333 disposed on the guide rail 332. The sliders 333 form the moving ends of the spacing adjustment moving component 33. Each slider 333 on the guide rail 332 corresponds to a clamping adjustment component 41. The spacing adjustment driving unit 331 drives the sliders 333 to reciprocate along a first direction of the guide rail 332. In practical applications, the spacing adjustment driving unit 331 can be multiple telescopic components to drive the movement of the sliders 333 on each clamping adjustment component 41 on the guide rail 332.

[0059] In this embodiment, two clamping adjustment components 41 are provided. Furthermore, the spacing adjustment drive unit 331 may include a third drive motor 3311, two second rotating wheels 3312, a second synchronous belt 3313, and two first connecting plates 3314. The two second rotating wheels 3312 are spaced apart. The third drive motor 3311 drives one of the second rotating wheels 3312 to rotate. The second synchronous belt 3313 is fitted onto the two second rotating wheels 3312. The two first connecting plates 3314 are respectively disposed on the upper and lower sides of the second synchronous belt 3313. The two first connecting plates 3314 are correspondingly connected to the two clamping adjustment components 41. The third drive motor 3311 can switch between forward and reverse operation, thereby driving the second synchronous belt 3313 to rotate in the forward or reverse direction. The upper and lower sides of the synchronous belt move in opposite directions, thereby causing the two connecting plates and the clamping adjustment components 41 to move towards or away from each other, thus adjusting the center distance between the two clamping adjustment components 41. The first connecting plate 3314 has a U-shaped structure to avoid interference with the second synchronous belt 3313. The spacing adjustment drive unit 331 adopts a single motor and synchronous belt reverse connection method, which only requires one drive source to realize the synchronous symmetrical movement of the two clamping adjustment components 41, simplifying the mechanical structure and electrical control.

[0060] like Figure 6As shown, the clamping adjustment assembly 41 includes a clamping adjustment moving unit 411, a first clamping mounting plate 412, a second clamping mounting plate 413, and two clamping members. The clamping members are clamping plates 414, which are arranged opposite to each other and connected to the two moving ends of the clamping adjustment moving unit 411 via the first clamping mounting plate 412 and the second clamping mounting plate 413, respectively. The clamping adjustment moving unit 411 can drive the two clamping plates 414 to move towards or away from each other. To ensure the stability of the material box 6 clamping, the extension direction of the clamping plate 414 is greater than the length of the material box 6. The length of the clamping plate 414 exceeds the size of the material box 6, allowing the clamping force to be evenly distributed along the longitudinal direction of the material box 6, avoiding local deformation or clamping marks on the material box 6 that are easily caused by traditional short clamps. This is especially suitable for high-quality clamping of long, strip-shaped semiconductor packaging material boxes 6. To ensure the stability of the clamping plate 414 during operation, it includes two first clamping mounting plates 412, which are respectively disposed on both sides of one clamping plate 414, and a second clamping mounting plate 413, which is disposed on the middle side of the other clamping plate 414. The second clamping mounting plate 413 is longer, which can ensure the stability of the movement of the clamping plate 414. The asymmetrical mounting plate arrangement, through a combination of multi-point support and intermediate reinforcement, balances the force distribution of the clamping plate 414, ensuring clamping stability while simplifying the structural layout.

[0061] like Figure 7As shown, the clamping adjustment and moving unit 411 includes a fourth drive motor 4111, two second gears 4112, two second racks 4113, two third racks 4114, four second guide rails 4115, and four second guide blocks 4116. Each second guide rail 4115 has a second guide block 4116, and the two form a guide structure. Two first clamping mounting plates 412 correspond to one guide structure, and the first clamping mounting plates 412 are mounted on the second guide blocks 4116. Two symmetrically arranged guide structures are provided on the second clamping mounting plates 413, and the second clamping mounting plates 413 are respectively disposed on the second guide blocks 4116 of the two guide structures. The first clamping mounting plate 412 has a second rack 4113 on one side of the second guide block 4116 and a third rack 4114 on one side of the second guide block 4116. The second rack 4113 and the third rack 4114 on both sides are correspondingly arranged and a meshing second gear 4112 is provided between them. The fourth drive motor 4111 drives one of the second gears 4112 to rotate. The second gear 4112 drives the second rack 4113 and the third rack 4114 on both sides to move in opposite directions through meshing transmission, thereby driving the two clamping plates 414 to move towards each other or away from each other synchronously, effectively avoiding the asynchronous movement of the two ends of the long clamping plate 414 in the extension direction, forming a trumpet shape. The clamping adjustment and moving unit 411 effectively eliminates the motion lag caused by the difference in driving force at both ends of the long-stroke clamping plate 414 through gear and rack linkage and multi-point guiding design, ensuring that the two clamping plates 414 open and close in parallel along the entire length direction, effectively avoiding the risk of lateral slippage or jamming of the material box 6 caused by the tilting of the clamping plate 414.

[0062] like Figure 8 As shown, the pushing device 5 includes a pushing moving component 51 and a pushing frame 52. The pushing moving component 51 is disposed on the base 1. The pushing moving component 51 can drive the pushing frame 52 to move along the second direction, so as to simultaneously abut one end of all the material boxes 6 and detach the material boxes 6 from the clamping and adjusting component 41. In order to push all the material boxes 6 at the same time, the pushing frame 52 is gate-shaped, and the top crossbeam of the pushing frame 52 is higher than the top of the clamping and adjusting component 41 and lower than the top of the material box 6, so that during the advancement of the pushing frame 52, the clamping and adjusting component 41 passes through the pushing frame 52, and all the material boxes 6 are pushed by the same top crossbeam of the pushing frame 52. The gate-shaped pushing frame 52 avoids spatial interference of the clamping and adjusting component 41, realizes the function of pushing multiple material boxes 6 at the same time with one crossbeam, simplifies the structure of the pushing device 5, ensures the synchronicity of the pushing of multiple material boxes 6, and avoids the tilting or collision of the material boxes 6 due to asynchronous pushing.

[0063] The push-moving component 51 includes a push-drive unit 511 and a push-guide unit 512. The push-drive unit 511 includes a fifth drive motor 5111, a third synchronous belt 5113, and two third rotating wheels 5112. The third synchronous belt 5113 is sleeved on the two third rotating wheels 5112. The fifth drive motor 5111 drives one of the third rotating wheels 5112 to rotate. One side of the push frame 52 is connected to one side of the third synchronous belt 5113 through a second connecting plate 5114. To ensure the stability of the movement of the push frame 52, two push-guide units 512 are provided, which are spaced apart. Each push-guide unit 512 includes a third guide rail 5121 and a third guide block 5122. The third guide block 5122 is slidably connected to the third guide rail 5121. The two third guide blocks 5122 of the two push-guide units 512 are respectively connected to the two sides of the push frame 52. The double-sided guide structure restricts the frame's flipping and offset, ensuring that the push process proceeds smoothly and linearly.

[0064] In this embodiment, the automatic feeding system also includes a height detection sensor 34, a receiving seat detection sensor 35, and a material box detection sensor 42. The height detection sensor 34 and the receiving seat detection sensor 35 are both mounted on the first mounting plate 31. The height detection sensor 34 detects whether the base 1 has reached a preset height, achieving closed-loop control of height adjustment through sensor signal feedback. The receiving seat detection sensor 35 detects whether the base 1 has reached the preset docking position of the receiving seat 7. The material box detection sensor 42 is mounted on the clamping adjustment assembly 41 and detects whether the clamping adjustment assembly 41 is clamping the material box 6, preventing equipment malfunctions caused by empty pushing or missed clamping due to lack of material. Through multi-sensor collaborative detection, intelligent monitoring of the feeding process is achieved, further improving the reliability and safety of equipment operation.

[0065] Example 2

[0066] like Figures 9-12 As shown, this embodiment provides an automatic feeding method for semiconductor packaging boxes, employing the automatic feeding system for semiconductor packaging boxes from Embodiment 1. The automatic feeding system further includes a control device, which is communicatively connected to a height adjustment device 2, a spacing adjustment device 3, a clamping device 4, a pushing device 5, a height detection sensor 34, a receiving seat detection sensor 35, and a box detection sensor 42. The automatic feeding method includes the following steps:

[0067] S1. The control device controls the clamping adjustment assembly 41 of the clamping device 4 so that the two clamping parts of the clamping adjustment assembly 41 move towards or away from each other according to the size of the material box 6, so as to clamp the material box 6.

[0068] S2. The control device controls the height adjustment device 2 to adjust the base 1 to match the height of the support 7 based on the feedback signal from the height detection sensor 34.

[0069] S3. The control device controls the spacing adjustment device 3 to move the spacing adjustment execution end along the first direction of the base 1. According to the receiving space parameters of the receiving seat 7, the execution end is driven to move, and the center distance of the feeding box 6 of the two adjacent clamping adjustment components 41 is adjusted so that it is adapted to the receiving space of the receiving seat 7.

[0070] S4. The control device controls the pushing device 5 to push the material box 6 along the second direction. After the receiving seat 7 detects the sensor 35 to confirm that the docking is in place, the pushing drive unit 511 is started to push the material box 6 from the clamping adjustment component 41 into the receiving seat 7 to complete the automatic feeding.

[0071] This embodiment provides an automatic feeding method for semiconductor packaging cartridges 6, which realizes a fully automatic, high-precision, and high-safety feeding process. It can adapt to the multi-variety, small-batch, and highly mixed production mode in advanced semiconductor packaging production lines, thereby improving production line operating efficiency and material safety.

[0072] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0073] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0074] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "over," or "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0075] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0076] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An automatic feeding system for semiconductor packaging cartridges, characterized in that, It includes a base (1), a height adjustment device (2), a spacing adjustment device (3), a clamping device (4), and a pushing device (5); The height adjustment device (2) is disposed on one side of the base (1) and is used to adjust the height of the base (1) relative to the support seat (7); The clamping device (4) includes a plurality of clamping adjustment components (41), each of the clamping adjustment components (41) includes two clamping members arranged opposite to each other along a first direction. The two clamping members can move toward each other or away from each other to clamp the material box (6). The material box (6) extends along a second direction, and the first direction and the second direction are perpendicular to each other. The spacing adjustment device (3) includes a plurality of spacing adjustment execution ends that are spaced apart on the base (1) along a first direction. The plurality of clamping adjustment components (41) are arranged in a one-to-one correspondence with the plurality of spacing adjustment execution ends. The spacing adjustment execution ends can move along the first direction of the base (1) to adjust the center distance of the material box (6) on two adjacent clamping adjustment components (41). The pushing device (5) is disposed on the base (1) and can move along the second direction of the base (1) to push the material box (6) into the receiving seat (7).

2. The automatic feeding system for semiconductor packaging cartridges as described in claim 1, characterized in that: The spacing adjustment device (3) includes a first mounting plate (31), a docking moving component (32) and a spacing adjustment moving component (33). The docking moving component (32) is disposed on the base (1) and the moving end of the docking moving component (32) is connected to the first mounting plate (31). The movable end of the docking moving component (32) can drive the first mounting plate (31) to reciprocate relative to the base (1) in the second direction, so that the first mounting plate (31) extends out of the side of the base (1) and docks with the receiving seat (7). The spacing adjustment moving component (33) is disposed on the first mounting plate (31). Multiple moving ends of the spacing adjustment moving component (33) form the spacing adjustment execution end. Multiple clamping adjustment components (41) are respectively connected to the moving ends of the multiple spacing adjustment moving components (33) along the first direction of the first mounting plate (31). The moving ends of the spacing adjustment moving component (33) can drive the clamping adjustment component (41) to move along the first direction to adjust the center distance of the material box (6) on two adjacent clamping adjustment components (41).

3. The automatic feeding system for semiconductor packaging cartridges as described in claim 2, characterized in that: The docking moving component (32) includes a docking driving unit (321) and a docking guiding unit (322). The docking driving unit (321) drives the first mounting plate (31) to reciprocate linearly along the second direction. The docking guiding unit (322) is disposed on the base (1) and guides the movement of the first mounting plate (31).

4. The automatic feeding system for semiconductor packaging cartridges as described in claim 2, characterized in that: The spacing adjustment moving component (33) includes a spacing adjustment driving unit (331), at least one guide rail (332), and a plurality of sliders (333) disposed on the guide rail (332), wherein the sliders (333) form the moving end of the spacing adjustment moving component (33); Each slider (333) on the guide rail (332) is configured in a one-to-one correspondence with the clamping adjustment assembly (41), and the spacing adjustment drive unit (331) drives the slider (333) to reciprocate along the first direction of the guide rail (332).

5. The automatic feeding system for semiconductor packaging cartridges as described in claim 1, characterized in that: The clamping adjustment assembly (41) includes a clamping adjustment moving unit (411), a first clamping mounting plate (412), a second clamping mounting plate (413), and two clamping members; The clamping element is a clamping plate (414). The two clamping plates (414) are arranged opposite to each other and are respectively connected to the two moving ends of the clamping adjustment and moving unit (411) through the first clamping mounting plate (412) and the second clamping mounting plate (413); The clamping adjustment and moving unit (411) can drive the two clamping plates (414) to move toward each other or away from each other.

6. The automatic feeding system for semiconductor packaging cartridges as described in claim 1, characterized in that: The pushing device (5) includes a pushing moving component (51) and a pushing frame (52). The push-moving component (51) is disposed on the base (1). The push-moving component (51) can drive the push frame (52) to move along the second direction so as to simultaneously abut one end of all the material boxes (6) and detach the material boxes (6) from the clamping adjustment component (41).

7. The automatic feeding system for semiconductor packaging cartridges as described in claim 1, characterized in that: The push frame (52) is gate-shaped, and the top beam of the push frame (52) is higher than the top of the clamping adjustment component (41) and lower than the top of the material box (6) so that the clamping adjustment component (41) passes through the push frame (52) during the push process. All the aforementioned hoppers (6) are pushed by the top beam of the same push frame (52).

8. The automatic feeding system for semiconductor packaging cartridges as described in claim 1, characterized in that: The height adjustment device (2) includes a frame (21), a height moving component (22), and a mounting panel (23), wherein the height moving component (22) is disposed on the frame (21); The base (1) is detachably connected to the mounting panel (23), and the height moving component (22) can drive the mounting panel (23) and the base (1) to move up and down synchronously to adapt to the bearing height of the receiving seat (7).

9. The automatic feeding system for semiconductor packaging cartridges as described in claim 2, characterized in that: It also includes a height detection sensor (34), a receiving seat detection sensor (35), and a hopper detection sensor (42). The height detection sensor (34) and the support seat detection sensor (35) are both mounted on the first mounting plate (31). The height detection sensor (34) is used to detect whether the base (1) has reached the preset height, and the support seat detection sensor (35) is used to detect whether the base (1) has reached the preset docking position of the support seat (7). The material box detection sensor (42) is disposed on the clamping adjustment assembly (41) and is used to detect whether the material box (6) is clamped on the clamping adjustment assembly (41).

10. An automatic feeding method for semiconductor packaging cartridges, characterized in that, The automatic feeding system for semiconductor packaging cartridges according to any one of claims 1-9, the automatic feeding system further comprising a control device, the automatic feeding method comprising the following steps: S1. The control device controls the clamping adjustment assembly (41) of the clamping device (4) so ​​that the two clamping members of the clamping adjustment assembly (41) move towards or away from each other according to the size of the material box (6) to clamp the material box (6). S2. The control device controls the height adjustment device (2) to adjust the base (1) to match the height of the support (7) according to the height of the support (7); S3. The control device controls the spacing adjustment execution end of the spacing adjustment device (3) to move along the first direction of the base (1) to adjust the center distance of the loading box (6) of the two adjacent clamping adjustment components (41) so that it is adapted to the receiving space of the receiving seat (7). S4. The control device controls the pushing device (5) to push the material box (6) along the second direction, and pushes the material box (6) from the clamping and adjusting assembly (41) into the receiving seat (7) to complete the automatic feeding.

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