Wafer detection device's clamping stage

Abstract

The application relates to a clamping platform of a wafer detection device, which comprises: a plurality of flexible clamping pieces arranged in the interior of a machine table and surrounding a clamping cavity, the diameter of the top of the clamping cavity being larger than the diameter of the bottom of the clamping cavity to place a wafer; a connecting belt arranged at the top end and the bottom end of the flexible clamping piece; the connecting belt passes through the plurality of flexible clamping pieces in sequence and surrounds a clamping ring; a first driving device arranged in the interior of the machine table and connected with the end of the connecting belt, used for driving the end of the connecting belt to move to adjust the diameter of the clamping ring; a second driving device arranged in the interior of the machine table and movable in the vertical direction; an adjusting device arranged in the interior of the machine table and corresponding to the flexible clamping piece and movable in the radial direction of the wafer, used for being connected with the edge of the flexible clamping piece to drive the edge of the flexible clamping piece to move away from the wafer. The application can not block the front surface and the back surface of the wafer in the wafer detection process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a clamping stage for a wafer inspection device. Background Technology

[0002] In the field of wafer manufacturing and inspection, transmission line inspection is a key method for identifying internal defects, measuring film thickness, and detecting microcracks.

[0003] In existing technologies, wafer fixation methods struggle to balance stable support with complete openness of the detection optical path. Specifically, vacuum chucks or electrostatic chucks create obstructions during transmission detection because they cover the entire back or a portion of the wafer; mechanical holders, while reducing the contact area through three or four-point support, still cause local blind spots in the detection image due to shadows at the support points; traditional edge grippers, with their rigid metal structure and concentrated gripping points, are prone to edge chipping or micro-cracks, and the grippers themselves also obstruct the detection area at the wafer edges.

[0004] Therefore, it is necessary to provide a new clamping stage for a wafer inspection device to solve the aforementioned problems in the prior art. Summary of the Invention

[0005] The technical problem to be solved by this application is how to provide a clamping stage of a wafer inspection apparatus that does not obstruct the front and back sides of the wafer during the wafer inspection process.

[0006] To address the aforementioned technical problems, according to embodiments of this application, a clamping stage for a wafer inspection apparatus is provided, comprising: a plurality of flexible clamping members disposed inside the apparatus and forming a clamping cavity, wherein the diameter of the top of the clamping cavity is larger than the diameter of the bottom of the clamping cavity for placing a wafer; a connecting strip disposed opposite to each other at the top and bottom ends of the flexible clamping members; the connecting strip passing through the plurality of flexible clamping members sequentially and forming a clamping ring; a first driving device disposed inside the apparatus and connected to the end of the connecting strip, for driving the end of the connecting strip to move, thereby adjusting the diameter of the clamping ring; a second driving device connected to the first driving device and movably disposed inside the apparatus in a vertical direction, for driving the first driving device to move in a vertical direction so that the connecting strip abuts against the edge of the wafer; and an adjusting device movably disposed inside the apparatus in a radial direction along the wafer and corresponding to the flexible clamping members, for connecting to the edge of the flexible clamping members, thereby driving the edge of the flexible clamping members away from the wafer.

[0007] According to an embodiment of this application, the flexible clamping member has a clamping groove, and the connecting strip is disposed in the clamping groove; there is a gap between adjacent flexible clamping members so that when the end of the connecting strip moves, the adjacent flexible clamping members move closer or further away from each other to adjust the diameter of the clamping cavity.

[0008] According to an embodiment of this application, the first driving device includes: a support member connected to the second driving device, the support member having a fixing member with a fixing hole, one end of the connecting band being disposed in the fixing hole; a limiting member disposed on the support member, the limiting member having a limiting hole, and the top surface of the limiting hole being flush with the top surface of the fixing hole; and a rotating member rotatably disposed on the support member, the other end of the connecting band being connected to the rotating member via the limiting hole, the rotating member rotating to drive the connecting band to move, thereby adjusting the diameter of the clamping ring.

[0009] According to an embodiment of this application, the first driving device further includes a locking member, a position control shaft, and a position control member; the position control shaft is disposed on the locking member and passes through the support member; the position control member is rotatably disposed on the locking member and threadedly connected to the support member, so as to adjust the distance between the locking member and the support member when the position control member rotates; the locking member is provided with a passage for the connecting belt to pass through.

[0010] According to an embodiment of this application, the second driving device includes guide modules arranged opposite each other in the horizontal direction, the guide modules corresponding to the support member; the guide module includes a guide shaft and a guide screw arranged in the vertical direction; the support member has a guide hole for the guide shaft to pass through and a threaded hole for the guide screw to pass through; during the wafer clamping process, the wafer is placed in the clamping cavity, the rotating member is controlled to rotate to adjust the diameter of the clamping rings so that the diameters of the clamping rings arranged opposite each other are smaller than the diameter of the wafer, the guide screw is controlled to rotate to move the clamping rings arranged opposite each other toward the wafer, and during the movement, the rotating member is controlled to rotate in the opposite direction so that the inner diameter of the clamping rings is the same as the diameter of the wafer, so as to clamp the wafer.

[0011] According to an embodiment of this application, the second driving device further includes a moving track arranged radially along the wafer, and the guiding module is disposed on the moving track to move closer to or further away from the wafer.

[0012] According to an embodiment of this application, a shaping member is also included that is movably disposed in the machine tool in a vertical direction. The shaping member has a first arm and a second arm that is movably disposed on the first arm in a radial direction along the wafer. The second arm has a shaping groove. The shaping member is placed between adjacent flexible clamping members, and the connecting strip passes through the shaping groove.

[0013] According to an embodiment of this application, the shaping groove is provided on the end face of the second arm and the shaping groove has an opening, so that the openings of the shaping grooves of the oppositely arranged shaping members are oppositely arranged; the width of the opening is smaller than the diameter of the connecting strip.

[0014] According to an embodiment of this application, the flexible clamping member is provided with a connecting iron plate; the adjusting device includes an adjusting member and a movable connecting member disposed at the top and bottom of the adjusting member; an electromagnet is provided at the end of the connecting member; during the wafer clamping process, the wafer is placed in the clamping cavity, and the diameter of the clamping ring is controlled to be smaller than the diameter of the wafer; the adjusting member is controlled to move toward the wafer and abut against the flexible clamping member to position the wafer; the connecting member moves so that the electromagnet is attracted to the connecting iron plate; the connecting strip is controlled to move toward the wafer, and the inner diameter of the clamping ring is the same as the diameter of the wafer to clamp the wafer; the adjusting member moves away from the wafer so that the end of the flexible clamping member is away from the wafer.

[0015] According to an embodiment of this application, the adjusting member has an adjusting groove, an adjusting frame and an operating member are provided in the adjusting groove, the operating member pushes the adjusting frame to move towards the end of the adjusting member; the connecting member passes through the adjusting frame.

[0016] By adopting the above technical solution, multiple vertical flexible strips surround to form a frustum-shaped clamping cavity, and connecting strips are inserted inside the flexible strips to form a radially adjustable clamping ring. The diameter of the clamping ring is adjusted by the first driving device, and the connecting strips are driven to abut the edge of the wafer by the second driving device. At the same time, after clamping, the adjustment component magnetically pulls the end of the flexible clamping component away from the wafer, thereby achieving stable wafer clamping while ensuring that the front and back sides of the wafer are unobstructed. This allows the front and back sides of the wafer to be exposed during wafer transmission inspection, facilitating the inspection process. In addition, the flexible clamping component is made of flexible material to avoid edge chipping and microcracks caused by rigid clamping. The diameter of the clamping cavity can be flexibly adjusted by moving the end of the connecting strip to accommodate wafers of different sizes. The adjustment device can prevent the end of the flexible clamping component from bending and collapsing inward due to lack of support, thus preventing the formation of a blind spot in the inspection process. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the main structure of a clamping platform according to an embodiment of the present invention.

[0018] Figure 2 for Figure 1 Enlarged view of section A.

[0019] Figure 3 for Figure 1 Enlarged view of section B.

[0020] Figure 4 This is a cross-sectional view of the position of the connecting strip in the shaping groove according to an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram illustrating a connection method between a locking member and a support member according to an embodiment of the present invention.

[0022] Figure 6 This is a schematic diagram illustrating the positional relationship of various components when the wafer position is adjusted, the adjusting member abuts against the flexible clamping member, and the connecting member extends out to attract the electromagnet to the connecting iron sheet, according to an embodiment of the present invention.

[0023] Figure 7 This is a schematic diagram illustrating the positional relationship of various components as the connector moves the connecting iron plate to a vertical position, and the connecting strip moves toward the wafer, according to an embodiment of the present invention.

[0024] Figure 8 This is a schematic diagram illustrating the positional relationship of various components when the adjusting device moves the edge of the flexible clamping member away from the wafer, according to an embodiment of the present invention, and when the connecting belt clamps the wafer.

[0025] Figure 9 This is a schematic diagram illustrating the positional relationship of various components when the flexible clamping element moves away from the wafer, which is another adjustment device according to an embodiment of the present invention, and when the connecting belt clamps the wafer.

[0026] Figure label: 100. Flexible clamping component; 101. Clamping groove; 102. Connecting iron plate; 110. Clamping cavity; 200. Connecting belt; 310. Support component; 311. Guide hole; 312. Threaded hole; 320. Fixing component; 321. Fixing hole; 330. Limiting component; 331. Limiting hole; 340. Rotating component; 350. Reset wheel; 360. Locking component; 370. Position control shaft; 380. Position control component; 410. Guide module; 411. Guide shaft; 412. Guide screw; 420. Moving track; 500. Adjusting device; 510. Adjusting component; 511. Adjusting groove; 512. Adjusting frame; 513. Operating component; 520. Connecting component; 530. Electromagnet; 600. Shaping component; 610. First arm; 620. Second arm; 621. Shaping groove. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0028] The following is in conjunction with the appendix Figures 1-9 The specific embodiments of the present invention will be further described in detail below.

[0029] An embodiment of the present invention provides a clamping stage for a wafer inspection apparatus, wherein the wafer inspection apparatus is a machine tool (not shown in the figure) with an internal cavity. The clamping stage is disposed in the cavity of the wafer inspection apparatus to clamp the wafer, and can ensure that neither the front nor the back of the wafer is obstructed after clamping. Specifically, the clamping stage includes a plurality of flexible clamping members 100, a connecting belt 200 arranged opposite to each other, a first driving device, a second driving device, and an adjustment device 500.

[0030] In some embodiments, multiple flexible clamping members 100 are disposed inside the machine tool and surround a clamping cavity 110. The diameter of the top of the clamping cavity 110 is larger than the diameter of the bottom of the clamping cavity 110 to hold the wafer. Specifically, the multiple flexible clamping members 100 are all plate-shaped, and the length direction of the flexible clamping members 100 extends vertically. The material of the flexible clamping members 100 can be silicone, polytetrafluoroethylene, or other materials that allow the flexible clamping members 100 to be bent. The multiple flexible clamping members 100 surround each other circumferentially inside the machine tool to form a clamping structure. During wafer clamping, the wafer is first placed inside the clamping cavity 110. When no wafer is placed inside, the clamping cavity 110 forms a frustum shape. The diameter of the top of the clamping cavity 110 is larger than the diameter of the bottom of the clamping cavity 110, so that the wafer can be placed into the clamping cavity 110 from above. More specifically, the diameter of the opening at the bottom of the clamping cavity 110 is less than 6 inches, and the diameter of the opening at the top of the clamping cavity 110 is greater than 12 inches, so that the clamping cavity 110 can hold wafers of 6 to 12 inches.

[0031] In some embodiments, in order to facilitate adjustment of the shape of the clamping cavity 110 and to facilitate clamping the wafer, connecting strips 200 are respectively provided at the top and bottom of the flexible clamping member 100; the connecting strips 200 pass through multiple flexible clamping members 100 in sequence and form a clamping ring around them. Specifically, the connecting strap 200 is a steel wire rope, and the outer wall of the connecting strap 200 is coated with rubber, which is well known to those skilled in the art and will not be described in detail here. When the connecting strap 200 is joined end to end, it can form a ring due to its rigidity. Therefore, the connecting strap 200 passes through multiple flexible clamping members 100 in sequence and forms a clamping ring. By controlling the position of the ends of the connecting strap 200, the diameter of the clamping ring can be controlled. Since the connecting strap 200 is inserted inside the flexible clamping member 100, the diameter of the corresponding position of the clamping cavity 110 formed by the flexible clamping member 100 can be controlled. For example, when the connecting strap 200 is placed on the top of the flexible clamping member 100, the diameter of the top of the clamping cavity 110 can be adjusted by adjusting the diameter of the clamping ring. When the connecting strap 200 is placed on the bottom of the flexible clamping member 100, the diameter of the bottom of the clamping cavity 110 can be adjusted by adjusting the diameter of the clamping ring. It is worth noting that the flexible clamping member 100 can be rectangular or trapezoidal. In this embodiment, the flexible clamping member 100 is preferably an isosceles trapezoid, and the length of the bottom is less than the length of the top.

[0032] In some specific embodiments, to facilitate the movement of the connecting strap 200, a clamping groove 101 is provided on the flexible clamping member 100. The clamping groove 101 passes through the flexible clamping member 100 along the width direction, and the connecting strap 200 is disposed within the clamping groove 101; that is, the connecting strap 200 passes through the clamping groove 101 on each flexible clamping member 100 sequentially along the width direction, thereby forming a clamping cavity 110 by multiple flexible clamping members 100 surrounding each other circumferentially; and adjacent flexible clamping members 100 The flexible clamping members 100 are spaced apart so that when the end of the connecting band 200 moves, adjacent flexible clamping members 100 move closer or further apart to adjust the diameter of the clamping cavity 110. For example, when the end of the connecting band 200 moves, causing the diameter of the clamping ring to decrease, adjacent flexible clamping members 100 will move closer to each other under the constraint of the connecting band 200. When the end of the connecting band 200 moves, causing the diameter of the clamping ring to increase, adjacent flexible clamping members 100 will move further apart under the constraint of the connecting band 200, thereby adjusting the diameter of the clamping cavity 110. More specifically, in this embodiment, three flexible clamping members 100 are provided, and the width of each flexible clamping member 100 is less than or equal to 5 cm, so that the flexible clamping member 100 will not bend in the middle and fail to clamp the wafer due to being too wide.

[0033] In some embodiments, to facilitate adjustment of the clamping ring diameter, a first driving device is provided inside the machine tool and connected to the end of the connecting belt 200, for driving the end of the connecting belt 200 to move, thereby adjusting the diameter of the clamping ring; specifically, the first driving device can drive the end of the connecting belt 200 to move, thereby adjusting the diameter of the clamping ring; the first driving device includes a support member 310, a limiting member 330, and a rotating member 340; wherein, the support member 310 is connected to the second driving device, and its connection position and connection method will be detailed later; the support member 310 is plate-shaped, and the upper part of the support member 310... The end face is provided with a fixing member 320, which can be set by bonding, snap-fitting or integral molding, etc. In this embodiment, the integral molding setting method is preferred. The fixing member 320 is provided with a fixing hole 321 through it, and the fixing hole 321 is set towards the clamping cavity 110. One end of the connecting strip 200 is located in the fixing hole 321 and passes through the fixing hole 321. The end of the connecting strip 200 is provided with a protrusion, which is snapped into the fixing hole 321 so that the position of the connecting strip 200 located in the fixing hole 321 will not change. This is known to those skilled in the art and will not be described in detail here. The limiting member 330 is provided on the support member 310. It can be set by bonding, snap-fitting or integral molding. In this embodiment, the integral molding method is preferred. At the same time, the limiting member 330 is provided with a limiting hole 331. The limiting hole 331 is set towards the clamping cavity 110, and the top surface of the limiting hole 331 is flush with the top surface of the fixing hole 321 so that the connecting strip 200 can form a flat clamping ring. In addition, the rotating member 340 is rotatably mounted on the support member 310. The support member 310 is equipped with a motor, and the motor shaft is keyed to the rotating member 340 to drive the rotating member 340 to rotate. The other end of the connecting belt 200 is connected to the rotating member 340 through the limiting hole 331. The rotation of the rotating member 340 drives the connecting belt 200 to move, thereby adjusting the diameter of the clamping ring. Specifically, during the rotation of the rotating member 340, the connecting belt 200 is wound around the rotating member 340, thereby reducing the diameter of the clamping ring. More specifically, the rotating member 340 is also rotatably equipped with a reset wheel 350. The side wall of the reset wheel 350 abuts against the connecting belt 200. When the diameter of the clamping ring needs to be increased, the reset wheel 350 is controlled to rotate, thereby causing the connecting belt 200 wound around the rotating member 340 to detach from the rotating member 340.

[0034] In some specific embodiments, to facilitate wafer clamping, the first driving device further includes a locking member 360, a position control shaft 370, and a position control member 380. The position control shaft 370 is disposed on the locking member 360 and passes through the support member 310. Specifically, the locking member 360 is block-shaped, and the position control shaft 370 can be disposed on the locking member 360 by bonding, snapping, or integral molding. In this embodiment, it is preferred to be disposed on the locking member 360 by integral molding. The support member 310 has a control hole, and the position control shaft 370 passes through the control hole and can move axially along the control hole so that the locking member 360 can approach or move away from the clamping cavity 110. The position control member 380 is rod-shaped and is rotatably disposed on the locking member 360 and threadedly connected to the support member 310. Specifically, the support member 310 has a hole for the position control member 380 to pass through, and the position control member 380 is threadedly connected to the hole. In addition, the end of the position control member 380 is rotatably disposed on the locking member 360, so that the position control member 380 will not drive the locking member 360 to rotate when it rotates. When the position control member 380 rotates, the position of the position control member 380 on the support member 310 changes, thereby adjusting the distance between the locking member 360 and the support member 310. The locking member 360 is provided with a passage for the connecting strip 200 to pass through. Specifically, during the wafer clamping process, since the clamping ring formed by the connecting strip 200 is not a complete ring, and if the first drive device and the second drive device are too close to the wafer, they may interfere with the wafer inspection process. Therefore, the locking member 360 is provided. After the initial wafer clamping is completed, the first drive device and the second drive device stop moving and control the position control member 380 to rotate, so that the locking member 360 is close to the wafer. At this time, due to the restriction of the passage, the contact length between the connecting strip 200 and the side wall of the wafer is increased, thereby enhancing the stability of wafer clamping.

[0035] In some embodiments, a second driving device is connected to a first driving device and is movably disposed inside the machine tool in a vertical direction. It drives the first driving device to move vertically so that the connecting belt 200 abuts against the edge of the wafer, thereby facilitating the clamping of the wafer by the connecting belt 200 when the wafer is placed into the clamping cavity 110. Specifically, the second driving device includes guide modules 410 arranged horizontally opposite each other, corresponding to the support member 310. The guide modules 410 are spaced apart, and each guide module 410 controls the vertical movement of the connecting belt 200. More specifically, to facilitate control of the vertical movement of the connecting belt 200, the guide module 410 includes a guide shaft 411 and a guide screw 412 arranged vertically. The guide shaft 411 is fixed inside the machine tool, and the guide screw 412 is rotatable. The guide shaft 411 and the guide screw 412 are both located inside the machine tool and extend vertically. The support member 310 has a guide hole 311 for the guide shaft 411 and a threaded hole 312 for the guide screw 412 through it in the vertical direction. The machine tool is equipped with a motor for driving the guide screw 412 to rotate. The rotation of the motor can drive the guide screw 412 to rotate. At the same time, the guide screw 412 is threadedly connected to the threaded hole 312 so that the rotation of the guide screw 412 can drive the support member 310 to move in the vertical direction, thereby adjusting the height of the connecting belt 200.

[0036] In some specific embodiments, during wafer clamping, the wafer is placed in the clamping cavity 110, at which time the clamping cavity 110 maintains a state where the top diameter is larger than the bottom diameter. After the wafer is placed stably, the rotating component 340 is controlled to rotate and adjust the diameter of the clamping rings so that the diameters of the relatively arranged clamping rings are all smaller than the diameter of the wafer. It is worth noting that the diameters of the relatively arranged clamping rings can be controlled to be the same. Since the flexible clamping component 100 is made of flexible material, when the diameters of the relatively arranged clamping rings are the same and all smaller than the diameter of the wafer, the flexible clamping component 100 will drive the wafer to move towards the middle of the flexible clamping component 100 in the vertical direction, thereby facilitating the subsequent clamping process. Alternatively, the wafer can be placed in the middle of the flexible clamping component 100 in the vertical direction when placing the wafer, thereby facilitating the subsequent clamping process. After the initial positioning of 100 pairs of wafers is completed, the guide screw is rotated to move the relatively positioned clamping rings toward the wafers. During the movement, the reset wheel 350 is rotated to make the rotating component 340 rotate in the opposite direction, so that the inner diameter of the clamping ring is the same as the diameter of the wafer, thereby clamping the wafer when the connecting belt 200 moves to the edge of the wafer. It is worth noting that since the flexible clamping component 100 has a certain thickness, for example, its thickness is 1mm, there are two ways to clamp the wafers here. One is that the relatively positioned connecting belts 200 all move to the edge of the wafer and are respectively engaged with the top and bottom edges of the wafer by the flexible clamping component 100, thereby achieving wafer clamping. The other is that the relatively positioned connecting belts 200 all move to the edge of the wafer and are engaged with the side wall of the wafer by the flexible clamping component 100, thereby achieving wafer clamping.

[0037] In some specific embodiments, to ensure that the center position of the wafer does not change after the wafer is clamped, the second driving device further includes a moving track 420 arranged radially along the wafer, and a guide module 410 is disposed on the moving track 420 to approach or move away from the wafer. Specifically, the second driving device also has a mounting sleeve, which is arranged around the guide module 410, and its side wall has a groove for mounting the support member 310, which is known to those skilled in the art and will not be described in detail here. At the same time, a pusher is also provided at the bottom of the machine, which can be a cylinder, an electric cylinder, or other devices with a pushing function, and the piston rod of the pusher is connected to the mounting sleeve to push the guide module 410 to move along the moving track 420. During the wafer clamping process, since the wafer has a tendency to move toward the guide module 410, controlling the guide module 410 to move toward the wafer can ensure that the center position of the wafer does not change during the clamping process. Maintaining the center position of the wafer does not change during wafer clamping is known to those skilled in the art and will not be described in detail here.

[0038] In some embodiments, the adjustment device 500 is movably disposed inside the machine tool along the radial direction of the wafer and is provided corresponding to the flexible clamping member 100. Specifically, the number of adjustment devices 500 corresponds to the number of flexible clamping members 100, and the adjustment device 500 is used to connect with the edge of the flexible clamping member 100 to drive the edge of the flexible clamping member 100 away from the wafer. During the wafer clamping process, since the connecting belt 200 moves towards the middle of the flexible clamping member 100 to clamp the wafer, there is no support at the upper and lower ends of the flexible clamping member 100 at this time, and it will bend towards the wafer to block the detection process. Therefore, by connecting the adjustment device 500 with the edge of the flexible clamping member 100, the end of the flexible clamping member 100 will not block the wafer, thereby facilitating the wafer detection process.

[0039] In some specific embodiments, the flexible clamping member 100 is provided with a connecting iron plate 102, which is embedded in the end of the flexible clamping member 100, and there is a gap between the connecting iron plate 102 and the clamping groove 101. The adjustment device 500 includes an adjustment member 510 and movable connecting members 520 located at the top and bottom of the adjustment member 510. The adjustment member 510 is plate-shaped and its position corresponds to that of the flexible clamping member 100. A drive cylinder is provided inside the machine tool, and the piston rod of the drive cylinder is connected to the adjustment member 510 to drive the adjustment member 510 closer to or further away from the wafer. At the same time, connecting members 520 are provided at the top and bottom of the adjustment member 510. The connecting members 520 can move radially along the wafer on the adjustment member 510 to move closer to or further away from the wafer. An electromagnet 530 is embedded at the end of the connecting member 520. When the electromagnet 530 is energized, it can attract the connecting iron piece 102, thereby preventing the end of the flexible clamping member 100 from shifting towards the center of the wafer.

[0040] In some specific embodiments, during wafer clamping, the wafer is placed in the clamping cavity 110, and the diameter of the clamping ring is controlled to be smaller than the diameter of the wafer, so that the wafer is placed in the middle of the flexible clamping member 100. Then, the adjusting member 510 is controlled to move towards the wafer and abut against the flexible clamping member 100 to position the wafer. At this time, the wafer is restricted by the adjusting member 510, and the position of the wafer does not change. Meanwhile, the connecting strip 200 has not yet moved, so the position of the end of the flexible clamping member 100 is fixed. Then, the connecting member 520 is controlled to move, bringing it closer to the end of the flexible clamping member 100, so that... Electromagnet 530 is attracted to connecting iron plate 102 to fix the end of flexible clamping member 100. After the end of flexible clamping member 100 is fixed, the connecting band 200 is controlled to move towards the wafer, and the inner diameter of the clamping ring is the same as the diameter of the wafer. At the same time, the adjusting member 510 is controlled to move away from the wafer, thereby driving the end of flexible clamping member 100 to move away from the wafer, so as to clamp the wafer and prevent the end of flexible clamping member 100 from interfering with the wafer inspection process; that is, the adjusting member 510 moves away from the wafer so that the end of flexible clamping member 100 is away from the wafer.

[0041] In some specific embodiments, since the positions of the flexible clamping member 100's bent and vertical ends differ during the connection process between the adjusting member 510 and the flexible clamping member 100, the position of the connecting member 520 needs to be able to adapt to the end of the flexible clamping member 100. Therefore, the adjusting member 510 is provided with an adjusting groove 511, and there are two adjusting grooves 511, respectively located at the top and bottom ends of the adjusting member 510. The adjusting groove 511 extends vertically and penetrates the adjusting member 510 radially along the wafer. An adjusting frame 512 and an operating member 513 are provided inside the adjusting groove 511. The operating member 513 pushes the adjusting frame 512 to move towards the end of the adjusting member 510. Specifically, the operating member 513 is an electric cylinder, or more specifically, the operating member 513 is... A miniature servo electric cylinder is used, and the operating component 513 is located on the bottom wall of the adjustment groove 511. The operating component 513 can be installed by bonding, snapping, or bolting. In this embodiment, the operating component 513 is preferably installed on the bottom wall of the adjustment groove 511 by bolting. At the same time, the adjustment frame 512 is keyed to the piston rod of the operating component 513. The connecting component 520 passes through the adjustment frame 512. Specifically, the bottom of the adjustment frame 512 is integrally formed with a mounting plate. The electric cylinder used to control the movement of the connecting component 520 is located on the mounting plate, so as to drive the connecting component 520 to move towards or away from the wafer. During the wafer clamping process, the position of the adjustment frame 512 is controlled by the miniature servo electric cylinder, so that the position of the connecting component 520 is adapted to the end of the flexible clamping component 100.

[0042] In some embodiments, the clamping platform further includes a shaping component 600 that is movably disposed within the machine tool in the vertical direction. Specifically, the machine tool is provided with a shaping shaft extending in the vertical direction and a shaping screw. The shaping component 600 is movably sleeved on the shaping shaft and threadedly connected to the shaping screw. When the shaping screw rotates, it can drive the shaping component 600 to move in the vertical direction. In order to facilitate the rotation of the shaping screw, a motor is also provided within the machine tool. The motor shaft is keyed to the shaping screw. This is known to those skilled in the art and will not be described in detail here. The shaping component 600 has a first arm 610 and a second arm 620 movably disposed on the first arm 610 along the radial direction of the wafer. The first arm 610 is mounted on a shaping shaft and a shaping lead screw. The second arm 620 can move closer to or further away from the wafer along the radial direction of the wafer on the first arm 610. Specifically, the first arm 610 is equipped with an electric cylinder (a miniature electric cylinder), and the piston rod of the electric cylinder is connected to the second arm 620 to push the second arm 620 closer to or further away from the wafer. In addition, the second arm 620 has a shaping groove 621. The shaping component 600 is placed adjacent to... The flexible clamping members 100 are positioned between each other, and the connecting strip 200 passes through the shaping groove 621 to support the connecting strip 200. It is worth noting that since there are two connecting strips 200, two shaping members 600 are correspondingly provided between each two adjacent flexible clamping members 100 to support the two connecting strips 200 respectively. At the same time, the distance from the shaping groove 621 to the end face of the second arm 620 near the wafer is less than the thickness of the flexible clamping member 100, and the width of the second arm 620 is less than or equal to 3mm, so that the second arm 620 will not interfere with the wafer clamping process.

[0043] In some specific embodiments, to prevent the two shaping members 600 between two adjacent flexible clamping members 100 from interfering with each other, a gap is provided between the two shaping members 600 between the two adjacent flexible clamping members 100. At the same time, the shaping groove 621 is provided on the end face of the second arm 620 and the shaping groove 621 has an opening, so that the openings of the shaping grooves 621 of the oppositely arranged shaping members 600 are oppositely arranged. That is, the shaping groove 621 on the upper second arm 620 is opened on the bottom surface of the second arm 620, and the shaping groove 621 on the lower second arm 620 is opened on the top surface of the second arm 620. This allows the two connecting strips 200 to approach each other during the wafer clamping process and not be blocked by the second arm 620. In addition, the width of the opening is smaller than the diameter of the connecting strip 200, so that the connecting strip 200 will not detach from the shaping groove 621, and the second arm 620 will not interfere with the movement process when the two connecting strips 200 approach each other during the wafer clamping process. In addition, when adjusting the diameter of the clamping ring, the electric cylinder can control the connecting belt 200 to move radially along the wafer, so as to facilitate the adjustment of the diameter of the clamping ring.

[0044] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A clamping stage for a wafer inspection device, characterized in that, include: Multiple flexible clamping elements are disposed inside the machine and surround to form a clamping cavity, wherein the diameter of the top of the clamping cavity is larger than the diameter of the bottom of the clamping cavity, so as to place the wafer; The connecting strips are respectively located at the top and bottom of the flexible clamping member; the connecting strips pass through multiple flexible clamping members in sequence and form a clamping ring around them; A first driving device includes a support member disposed inside the machine base and connected to the end of the connecting belt, for driving the end of the connecting belt to move in order to adjust the diameter of the clamping ring; The second driving device has a guide shaft and a guide screw. The support member has a through guide hole for the guide shaft and a threaded hole for the guide screw, so that the second driving device is connected to the first driving device and is movably disposed inside the machine tool in the vertical direction, for driving the first driving device to move in the vertical direction so that the connecting strip abuts against the edge of the wafer. An adjustment device is movably disposed inside the machine tool along the radial direction of the wafer and is configured corresponding to the flexible clamping member. It is used to connect with the edge of the flexible clamping member to drive the edge of the flexible clamping member away from the wafer.

2. The clamping platform according to claim 1, characterized in that, The flexible clamping member has a clamping groove, and the connecting band is disposed in the clamping groove; there is a gap between adjacent flexible clamping members so that when the end of the connecting band moves, the adjacent flexible clamping members move closer or further away from each other to adjust the diameter of the clamping cavity.

3. The clamping platform according to claim 1, characterized in that, The first driving device includes, The support member is connected to the second driving device, and the support member is provided with a fixing member having a fixing hole, and one end of the connecting strip is disposed in the fixing hole; A limiting member is provided on the support member, and a limiting hole is provided on the limiting member, and the top surface of the limiting hole is flush with the top surface of the fixing hole. A rotating component is rotatably disposed on the support component. The other end of the connecting belt is connected to the rotating component via the limiting hole. The rotating component rotates to drive the connecting belt to move, thereby adjusting the diameter of the clamping ring.

4. The clamping platform according to claim 3, characterized in that, The first driving device further includes a locking member, a position control shaft, and a position control member; the position control shaft is disposed on the locking member and passes through the support member; the position control member is rotatably disposed on the locking member and threadedly connected to the support member, so as to adjust the distance between the locking member and the support member when the position control member rotates; the locking member is provided with a passage for the connecting belt to pass through.

5. The clamping platform according to claim 3, characterized in that, The second driving device includes guide modules arranged opposite each other in the horizontal direction, and the guide modules correspond to the support members; The guide module includes the guide shaft and the guide screw arranged in the vertical direction; During wafer clamping, the wafer is placed in the clamping cavity. The rotating component is controlled to rotate and adjust the diameter of the clamping rings so that the diameters of the opposing clamping rings are all smaller than the diameter of the wafer. The guide screw is controlled to rotate so that the opposing clamping rings move toward the wafer. During the movement, the rotating component is controlled to rotate in the opposite direction so that the inner diameter of the clamping ring is the same as the diameter of the wafer, thereby clamping the wafer.

6. The clamping platform according to claim 5, characterized in that, The second drive device further includes a moving track arranged radially along the wafer, and the guide module is disposed on the moving track to move closer to or further away from the wafer.

7. The clamping platform according to claim 1, characterized in that, It also includes a shaping component that is movable in the vertical direction within the machine tool. The shaping component has a first arm and a second arm that is movable in the radial direction of the wafer and disposed on the first arm. The second arm has a shaping groove. The shaping component is placed between adjacent flexible clamping components, and the connecting strip passes through the shaping groove.

8. The clamping platform according to claim 7, characterized in that, The shaping groove is provided on the end face of the second arm and the shaping groove has an opening, so that the openings of the shaping grooves of the oppositely arranged shaping parts are oppositely arranged; the width of the opening is smaller than the diameter of the connecting strip.

9. The clamping platform according to claim 1, characterized in that, The flexible clamping component is equipped with a connecting iron plate; The adjusting device includes an adjusting member and movable connecting members disposed at the top and bottom of the adjusting member; an electromagnet is provided at the end of the connecting member; During wafer clamping, the wafer is placed in the clamping cavity, and the diameter of the clamping ring is controlled to be smaller than the diameter of the wafer; the adjusting member is controlled to move toward the wafer and abut against the flexible clamping member to position the wafer; the connecting member moves to attract the electromagnet to the connecting iron piece; the connecting strip is controlled to move toward the wafer, and the inner diameter of the clamping ring is made the same as the diameter of the wafer to clamp the wafer; the adjusting member moves away from the wafer so that the end of the flexible clamping member moves away from the wafer.

10. The clamping platform according to claim 9, characterized in that, The adjusting member has an adjusting groove, and an adjusting frame and an operating member are provided in the adjusting groove. The operating member pushes the adjusting frame to move towards the end of the adjusting member; the connecting member passes through the adjusting frame.

Images