Vertical movement device, control method, and semiconductor apparatus

Abstract

The application relates to a vertical movement device, a control method and a semiconductor equipment, and belongs to the technical field of semiconductor equipment. The vertical movement device comprises a macro-micro movement mechanism, a lifting mechanism and a driving structure. The macro-micro movement mechanism comprises a bottom plate, a first wedge-shaped block and a second wedge-shaped block which are sequentially connected in a sliding mode, and the driving structure is in driving connection with the first wedge-shaped block. The lifting mechanism is arranged in the first wedge-shaped block and the second wedge-shaped block, and comprises a lifting plate, a roller and a lifting sliding block which is arranged on the first wedge-shaped block. The lifting sliding block is connected with the lifting plate through the roller. The driving structure drives the first wedge-shaped block to move, the roller moves along the lifting sliding block, so that the lifting plate is driven to make vertical movement. The driving structure drives the first wedge-shaped block to move, so that the second wedge-shaped block makes vertical macro movement and micro movement. The wedge-shaped mechanism can drive larger load movement with smaller output force, greatly reduces the height in the Z movement direction, and makes the structure more compact and facilitates modular integration.

Description

Technical Field

[0001] This invention relates to a vertical motion device, a control method, and a semiconductor device, belonging to the field of semiconductor device technology. Background Technology

[0002] In semiconductor front-end metrology equipment, after the wafer is transferred to the vacuum chamber, a lifting mechanism is needed to receive and place the wafer. Simultaneously, to optimize signals from different detectors and achieve high-resolution focusing, the metrology equipment requires millimeter-level macroscopic Z-axis movements. Furthermore, due to wafer warping or the flatness of the stage itself, electron beam inspection equipment experiences scanning deviations between different scanning points. When these deviations exceed the depth range of the scanning electron microscope, defocusing occurs. Therefore, Z-axis micro-motion is needed to compensate for this. This micro-motion is typically at the micrometer or even sub-micrometer level, and requires rapid image acquisition and a fast response.

[0003] Currently, most vertical motion devices are only equipped with a single motion adjustment. For example, Chinese patent document CN221687493U provides a leveling and focusing device that uses four piezoelectric micro-stepping motors to achieve vertical motion. However, the adjustment range of piezoelectric motors is small and cannot achieve millimeter-level macro-motion. Other methods use wedge blocks to achieve macro-motion structures, and then stack micro-motion stages on top of the macro-motion. For instance, Chinese patent document CN224069080U provides a vertical motion device and semiconductor equipment that uses large and small wedge blocks to achieve macro-motion, and then installs micro-motion stages on top of these. However, this method increases the vertical height and Abbe error, and if the load is too heavy, the system rigidity is insufficient and vibration is likely to occur.

[0004] Most existing wafer lifting mechanisms use voice coil motors or have the motors externally mounted, using a lever mechanism for lifting. For example, Chinese patent document CN113394066A provides a Z-axis motion platform and its usage method. This lever-type lifting generates eccentric force, which is not conducive to the stability of the stage. Moreover, the structure is complex, requiring holes to be made in the vacuum cavity to connect to the external motor, which is not conducive to ensuring the airtightness of the vacuum cavity. Voice coil motors also introduce electromagnetic interference problems.

[0005] Moreover, none of the existing equipment mentioned above is equipped with a proper limiting structure. In the event of program abnormalities or sensor malfunctions, moving parts are prone to overtravel, causing equipment collisions. This can damage precision transmission structures and inspection lenses, destroy wafer workpieces, increase maintenance costs, cause production line shutdowns, and affect production continuity.

[0006] There is currently no effective solution to the aforementioned problems in the existing technology. Summary of the Invention

[0007] To address the aforementioned problems, this invention provides a vertical motion device, a control method, and a semiconductor device. This vertical motion device can achieve millimeter-level macro-motion, submicron-level micro-motion leveling, and lifting motion of the wafer stage, integrating the three motions. Furthermore, it is equipped with a limit structure to avoid the risk of collisions under abnormal conditions.

[0008] To achieve the above objectives, the technical solution adopted by the present invention is as follows: In a first aspect, the present invention provides a vertical motion device, including... The macro-micro-motion mechanism includes a base plate, a first wedge block, and a second wedge block that are slidably connected in sequence, as well as a drive structure that is drivenly connected to the first wedge block; The lifting mechanism, located within the first and second wedge blocks, includes a lifting plate, rollers, and a lifting slider mounted on the first wedge block. The lifting slider is connected to the lifting plate via the rollers. The driving structure drives the first wedge block to move the lifting slider, and the rollers move along the lifting slider, thereby causing the lifting plate to move vertically. The drive structure drives the first wedge block to move, and the lifting slider drives the lifting mechanism to move vertically, so that the second wedge block makes a vertical macro motion. The driving structure drives the first wedge block to move slightly, so that the second wedge block makes a vertical slight movement.

[0009] In one embodiment of the present invention, the lifting slider includes a first flat section, a lifting section, and a second flat section connected in sequence, wherein the height of the second flat section is greater than the height of the first flat section; the driving structure is used to drive the first wedge block to move, thereby enabling the first flat section, the lifting section, and the second flat section to abut against the rollers respectively, so that the lifting mechanism can perform vertical movement.

[0010] In one embodiment of the present invention, the macro-micro-motion mechanism includes a linear guide rail and a guide rail mounting base. A slider and a track are disposed inside the linear guide rail. A groove and a first mounting block are respectively disposed on both sides of the second wedge block. The groove and the first mounting block are connected to the track of the linear guide rail. The track slides vertically inside the slider.

[0011] In one embodiment of the present invention, the macro-micro motion mechanism includes a limiting mechanism, the limiting mechanism including a photoelectric limiting device, a fourth mounting block and a limiting piece, the photoelectric limiting device being mounted on the base plate via the fourth mounting block, the fourth mounting block being provided with a waist hole, the limiting piece being mounted on the first wedge block, the limiting piece moving with the first wedge block and being able to pass through the photoelectric limiting device to trigger the photoelectric limiting device.

[0012] In one embodiment of the present invention, the limiting mechanism includes a mechanical limiting block and an elastic buffer structure. The elastic buffer structure is installed inside the mechanical limiting block. The mechanical limiting block is installed on the base plate and located on two sides perpendicular to the photoelectric limiting block. The mechanical limiting block can abut against the first wedge block.

[0013] In one embodiment of the present invention, the macro-micro-motion mechanism includes a measurement feedback mechanism, which includes a grating ruler, a third mounting block, and a reading head. The reading head is mounted on the base plate via a second mounting block, and the grating ruler is mounted on the second wedge block via the third mounting block. The grating ruler and the reading head are parallel. The second mounting block is provided with a mounting hole, which is an oblong hole.

[0014] In one embodiment of the present invention, a lifting column is installed on one side of the lifting plate, an O-ring is installed at one end of the lifting column, and a guide column, a roller mounting plate and a tension spring are installed on the side of the lifting plate opposite to the lifting column, and the rollers are installed on both sides of the roller mounting plate. A bearing mounting seat is installed on the base plate, a press-fit bearing is installed in the bearing mounting seat, and the guide column is embedded in the press-fit bearing; Both the bearing mounting base and the lifting plate are provided with grooves, and the tension spring is suspended on the grooves to connect the bearing mounting base and the lifting plate.

[0015] In one embodiment of the present invention, the base plate, the first wedge block, and the second wedge block are connected by a cross roller guide, and friction elements are attached to both sides of the first wedge block, and the driving structure abuts against the friction elements; The driving structure is a piezoelectric ultrasonic motor.

[0016] Secondly, the present invention provides a control method for a vertical motion device, using the aforementioned vertical motion device, the control method comprising the following steps: S1: The upper, lower and lifting positions of the vertical motion device are calibrated. The drive structure is connected to the controller. In the vertical direction, the grating ruler transmits the height data to the controller in real time, and adjusts the drive structure to move to the specified position to form a closed-loop control. S2: The first wedge block moves away from the groove, causing the second wedge block to move downward. The platform descends, the roller abuts against the second straight section, and the lifting mechanism reaches the lifting position. At this time, the lifting column is higher than the platform, and the wafer pick-and-place device places the wafer on the lifting column from the wafer transfer port to complete the wafer pick-and-place. S3: When it is necessary to raise the stage to perform quantity detection on the wafer, the first wedge block moves towards the groove, driving the second wedge block to move upward, and the stage begins to rise. At the same time, the lifting mechanism descends. After the wafer falls onto the plane of the stage, the stage supports the wafer and continues to rise. At this time, the lifting mechanism is located at the first straight section. The lifting mechanism descends below the plane of the stage, and the device reaches the height of the lower station. The stage continues to rise to reach the height of the upper station. S4: After the macro motion is in place, the scanning electron microscope begins to scan various points on the wafer. There are height deviations between various points. A displacement sensor in the height direction is installed below the microscope tube, which transmits the height information that needs to be adjusted to the controller in real time. The controller controls the drive structure to move at the micrometer level in the horizontal direction, so that the second wedge block can achieve sub-micrometer level movement in the vertical direction, thereby adjusting the position of each point and completing the detection.

[0017] Thirdly, the present invention provides a semiconductor device including the aforementioned vertical motion device.

[0018] The beneficial effects of this invention are: The vertical motion device, control method, and semiconductor device provided by this invention have the following advantages: 1. The vertical motion device provided by this invention achieves macro and micro movements in the vertical direction through two symmetrically arranged drive structures and two cooperating wedge blocks, and lifts the wafer by adjusting the slope of the lifting slider. The wedge mechanism allows for greater load movement with less output force, while significantly reducing the height in the Z-axis direction, resulting in a more compact structure and facilitating modular integration. A crossed roller guide is provided between the first and second wedge blocks. Compared to commonly used linear guides, the crossed roller guide has less friction and higher rigidity, resulting in smoother movement and improved positioning accuracy.

[0019] 2. The drive structure of this vertical motion device utilizes a vacuum-compatible piezoelectric motor, positioned inside the vacuum chamber. This direct drive eliminates complex intermediate transmission links, resulting in higher efficiency. Furthermore, the absence of interfaces within the vacuum chamber eliminates the risk of leaks. Piezoelectric motors do not introduce electromagnetic compatibility issues, eliminating the need for electromagnetic shielding. Once the piezoelectric micro-stepping motor reaches the preset position, it remains relatively stationary, avoiding frequent servo control jitter, thus achieving high positioning accuracy. The symmetrical arrangement of the ultrasonic motors counteracts the horizontal rotational torque. Both macro- and micro-motions, as well as the wafer lifting motion, utilize ultrasonic motors, eliminating redundant motors and mechanisms and saving costs.

[0020] 3. This vertical motion device uses two pairs of linear guides in the vertical direction for guidance, while eliminating parasitic movements such as horizontal movement in the XY directions and rotation in the Z direction. Feedback from the grating ruler during macro-motion enables high-precision closed-loop control. During the micro-motion process of wafer inspection, the displacement sensor also provides position feedback to achieve closed-loop control. Furthermore, the device is equipped with photoelectric and mechanical limits, ensuring safe movement and preventing collisions through dual limiting.

[0021] 4. The lifting slider of the vertical motion device is set on the first wedge block, and the lifting mechanism is set between the first and second wedge blocks, making full use of the space and reducing the vertical height. The lifting mechanism is equipped with a sliding bearing guide, which releases the vertical degree of freedom while ensuring high rigidity in the XY direction. The spring in the vertical direction plays a pre-tensioning role, which helps the platform to rise smoothly and prevents it from getting stuck during descent. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a perspective view of the vertical motion device provided by the present invention.

[0024] Figure 2 This is a perspective view of the vertical motion device provided by the present invention.

[0025] Figure 3 This is a perspective view of the second wedge block provided by the present invention.

[0026] Figure 4 This is a perspective view of the first wedge block and the lifting mechanism provided by the present invention.

[0027] Figure 5 This is a perspective view of the lifting mechanism provided by the present invention.

[0028] Figure 6 This is a bottom view of the lifting mechanism provided by the present invention.

[0029] Figure 7 This is a front view of the roller provided by the present invention in the first straight section.

[0030] Figure 8 This is the front view of the lifting state provided by the present invention.

[0031] Figure 9 This is a perspective view of the lifting slider provided by the present invention.

[0032] Figure 10 This is a perspective view of the measurement feedback mechanism provided by the present invention.

[0033] Figure 11 This is a flowchart of the vertical motion device control method provided by the present invention.

[0034] In the diagram: 1. XY motion platform; 2. Macro / micro motion mechanism; 21. Base plate; 22. Drive structure; 23. Mounting plate; 24. Cross roller guide rail; 25. First wedge block; 251. Inclined surface; 26. Friction component; 27. Second wedge block; 271. Groove; 272. First mounting block; 28. Guide rail mounting seat; 29. ​​Slider; 210. Measurement feedback mechanism; 2101. Grating ruler; 2102. Reading head; 2103. Second mounting block; 2104. Third mounting block; 2105. Mounting hole; 211. Limiting mechanism; 2111. Photoelectric limiter; 2112. Fourth mounting block; 2113. Limiting piece; 2114. Mechanical limiter block; 2115. Elastic buffer structure; 212. Linear guide rail; 213. Press-fit bearing; 214. Bearing mounting seat; 3. Lifting mechanism; 31. Lifting plate; 32. Lifting column; 33. Guide column; 34. Roller; 35. Roller mounting plate; 36. Tension spring; 37. O-ring; 38. Lifting slider; 381. First straight section; 382. Second straight section; 383. Lifting section; 39. Groove; 4. Platform. Detailed Implementation

[0035] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0037] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0038] like Figures 1 to 10 As shown, the present invention provides a vertical motion device, which includes an XY motion platform 1, a macro-micro motion mechanism 2, and a lifting mechanism 3. The XY motion platform 1 is located at the bottom of the entire structure, the macro-micro motion mechanism 2 is mounted on the XY motion platform 1, and the lifting mechanism 3 is provided in the middle of the macro-micro motion mechanism 2. The macro-micro motion mechanism 2 realizes the macro-motion and micro-motion in the vertical direction, and the lifting mechanism 3 realizes the lifting of the wafer.

[0039] like Figures 1 to 4 As shown, in some embodiments, the macro-micro motion mechanism 2 includes a base plate 21, a drive structure 22, and a mounting plate 23. The base plate 21 is mounted on the XY motion platform 1, and the drive structure 22 is mounted on the base plate 21 via the mounting plate 23. The two drive structures 22 are symmetrically distributed on the base plate 21, which can balance the forces and prevent the generation of horizontal deflection torque. Crossed roller guides 24 are symmetrically mounted on the base plate 21. A first wedge block 25 is mounted on the side of the cross roller guide 24 away from the base plate 21, so that the first wedge block 25 is slidably connected to the base plate 21. Friction members 26 are provided on both sides of the first wedge block 25. The friction members 26 can be strip-shaped structures that can be attached to both sides of the first wedge block 25 and can abut against the output shaft of the drive structure 22. Under the drive of the drive structure 22, the first wedge block 25 can move relative to the base plate 21. The first wedge block 25 has an inclined surface 251 on the side opposite to the base plate 21. A pair of parallel cross roller guides 24 are also installed on the inclined surface 251. A second wedge block 27 is provided above the inclined surface 251. The second wedge block 27 cooperates with the first wedge block 25 through the cross roller guides 24, and the second wedge block 27 is movably connected to the first wedge block 25.

[0040] In some embodiments, a groove 271 is provided on one side of the second wedge block 27, and a first mounting block 272 is installed on the side symmetrical to the groove 271. The first mounting block 272 also has a groove structure. Guide rail mounting seats 28 are symmetrically arranged on both sides of the base plate 21. The macro-micro-motion mechanism 2 also includes a linear guide rail 212, which includes a slider 29 and a track. The slider 29 of the linear guide rail 212 is installed in the guide rail mounting seat 28, and the track of the linear guide rail 212 is installed on the groove 271 and the first mounting block 272. The track and the slider 29 form a sliding connection, so that the second wedge block 27 can only move along the slider 29, thus restricting the horizontal movement of the second wedge block 27. At the same time, the linear guide rail 212 can also provide guidance for the vertical movement of the second wedge block 27. When the drive structure 22 is working, the contact of the drive structure abuts against the friction member 26, driving the friction member 26 and the first wedge block 25 to move linearly in the horizontal direction, thereby driving the movement of the second wedge block 27. Since the linear guide rail 212 restricts the horizontal movement of the second wedge block 27 and only retains the vertical lifting movement, the linear guide rail 212 can restrict the horizontal movement of the second wedge block 27 in the XY direction and the parasitic movement of the vertical rotation, retaining only the unidirectional degree of freedom in the vertical direction.

[0041] Both the first wedge block 25 and the second wedge block 27 are wedge-shaped plate structures. The wedge angle θ of the wedge block determines the wedge ratio of the horizontal movement distance L and the vertical lifting height H of the macro-micro motion mechanism 2, and their relationship is as follows: A fixed lifting height H can be obtained by controlling the horizontal movement distance L. Assuming the thrust required by the drive structure 22 is F, G is the load weight, θ is the wedge angle, α is the friction angle, and the friction coefficient μ=tanα, it can be deduced that the thrust F must satisfy the following: compared to directly lifting the load G, the wedge structure can save effort; the smaller the wedge angle θ, the smaller the friction, and therefore the smaller the required motor thrust.

[0042] like Figure 2 , Figure 3 and Figure 10 As shown, in some embodiments, the macro / micro-motion mechanism 2 includes a measurement feedback mechanism 210. The measurement feedback mechanism 210 includes a grating ruler 2101, a reading head 2102, a second mounting block 2103, and a third mounting block 2104. The reading head 2102 is mounted on the second mounting block 2103 and is fixedly mounted on the base plate 21 together with the second mounting block 2103. The grating ruler 2101 is attached to the third mounting block 2104, which is mounted on the side of the second wedge block 27 near the first wedge block 25. The second mounting block 2103 is provided with a mounting hole 2105, through which the second mounting block 2103 is connected to the base plate 21.

[0043] Optionally, the mounting hole 2105 is set as an oblong hole, which can adjust the position of the reading head 2102 to ensure that the reading head 2102 and the grating ruler 2101 are parallel. When the second wedge block 27 is raised to a specified height, the distance information can be measured. The drive structure 22 uses the measurement result for closed-loop control to ensure motion accuracy.

[0044] like Figure 1 and Figure 2 As shown, in some embodiments, the macro-micro motion mechanism 2 further includes a limiting mechanism 211. The limiting mechanism 211 includes a photoelectric limiting structure and a mechanical limiting structure. The photoelectric limiting structure includes a photoelectric limiter 2111, a fourth mounting block 2112, and a limiting piece 2113. The photoelectric limiter 2111 is mounted on the base plate 21 via the fourth mounting block 2112, and the limiting piece 2113 is mounted on the side of the first wedge block 25 near the photoelectric limiting structure. There are two symmetrically arranged photoelectric limiters 2111 and fourth mounting blocks 2112. The mechanical limiting structure includes a mechanical limiting block 2114 and an elastic buffer structure 2115. The mechanical limiting block 2114 is mounted on the base plate 21 and located on both sides perpendicular to the photoelectric limiting structure. The elastic buffer structure 2115 is installed inside the mechanical limiting block 2114 to absorb impact forces. Initially, the limiting piece 2113 is positioned between the two photoelectric limiting pieces 2111. When the first wedge block 25 moves to one side, the limiting piece 2113 first contacts the photoelectric limiting piece 2111 in that direction of movement, triggering photoelectric sensing, and the mechanism stops moving. If the photoelectric limiting piece 2111 fails, the first wedge block 25 continues to move in that direction until it comes into contact with the mechanical limiting piece 2114 in that direction, stopping it and achieving a hard limit stop. Similarly, when the first wedge block 25 moves in the opposite direction, it first contacts the photoelectric limiting piece 2111 in that direction and stops. If the photoelectric limiting piece 2111 in that direction fails, the first wedge block 25 continues to move in that direction until it comes into contact with the mechanical limiting piece 2114 in that direction, stopping it and achieving a hard limit stop. The fourth mounting block 2112 is provided with a waist hole, allowing the position of the photoelectric limiting piece 2111 to be adjustable, enabling free control of the horizontal travel range.

[0045] In some embodiments, two bearing mounting seats 214 are symmetrically mounted on the base plate 21, and a press-fit bearing 213 is installed in the bearing mounting seat 214. A long through hole is opened in the first wedge block 25, and the two bearing mounting seats 214 pass through the first wedge block 25.

[0046] In some embodiments, the lifting mechanism 3 includes a lifting plate 31, lifting columns 32, and guide columns 33. Three lifting columns 32 are mounted on the lifting plate 31, and an O-ring 37 is provided at the top of each lifting column 32. The O-ring 37 can be used to protect and support the wafer. Two guide columns 33 are symmetrically mounted on the side of the lifting plate 31 opposite to the lifting columns 32. The guide columns 33 cooperate with the press-fit bearing 213 to achieve smooth guidance of the lifting mechanism 3, releasing vertical freedom while ensuring high rigidity in the XY direction. A roller mounting plate 35 and rollers 34 are also mounted on the side of the lifting plate 31 near the first wedge block 25. The roller mounting plate 35 is shaped like a trolley, and four rollers 34 are symmetrically mounted on both sides of the roller mounting plate 35.

[0047] like Figures 7 to 9 As shown, in some embodiments, a lifting slider 38 is installed on one side of the first wedge block 25. The lifting slider 38 includes a first straight section 381, a second straight section 382, ​​and a lifting section 383, with the second straight section 382 being higher than the first straight section 381. The two ends of the lifting section 383 are connected to the first straight section 381 and the second straight section 382, ​​respectively, and the second straight section 382 is located on the side near the groove 271. When the first wedge block 25 moves, the roller 34 can move from the first straight section 381 through the lifting section 383 to the second straight section 382, ​​thereby achieving a height increase. Grooves 39 are provided on both the lifting plate 31 and the bearing mounting seat 214. A tension spring 36 is also provided in the lifting mechanism 3, with the two ends of the tension spring 36 connected to the grooves 39 on the lifting plate 31 and the bearing mounting seat 214, respectively. The tension spring 36 serves as a preload. Initially, the tension spring 36 is in a slightly stretched state, providing a certain initial preload. As the lifting height increases, the spring is stretched to ensure the smoothness of the lifting movement. At the same time, when the lifting mechanism needs to descend, there is a downward force to prevent the mechanism from jamming.

[0048] In some embodiments, a stage 4 is mounted on the side of the second wedge block 27 opposite to the first wedge block 25. Both the stage 4 and the second wedge block 27 are provided with through holes, and the lifting column 32 passes through the stage 4 and the second wedge block 27. The stage 4 can fix the wafer by vacuum adsorption, ensuring accurate and stable testing operations.

[0049] In some implementations, the device is also equipped with an external controller and a driver. The controller can be electrically connected to the grating ruler 2101 and the driver, and the driver is connected to the drive structure 22 and can drive the drive structure 22 to operate under the control of the controller.

[0050] Optionally, the drive structure 22 is a piezoelectric ultrasonic motor. Piezoelectric ultrasonic motors offer numerous advantages, including small size, high torque density, high torque at low speeds, rapid response, high positioning accuracy, power-off self-locking, no electromagnetic interference, quiet operation, and strong environmental adaptability. The piezoelectric motor is positioned inside the vacuum chamber, directly driving the actuator and eliminating complex intermediate transmission links, resulting in higher efficiency. It also eliminates the need for interfaces on the vacuum chamber, thus removing the risk of seal leakage. Piezoelectric motors do not introduce electromagnetic compatibility issues, requiring no electromagnetic shielding. Furthermore, the piezoelectric microstepping motor can remain relatively stationary after reaching the preset position, avoiding frequent servo control jitter, thereby achieving high positioning accuracy.

[0051] Optionally, the elastic buffer structure 2115 can be an elastic element such as a spring, or it can be a buffer material with elasticity.

[0052] In summary, the vertical motion device of the present invention is driven by two symmetrically arranged piezoelectric ultrasonic motors. It can achieve macro and micro movements in the vertical direction through two wedge blocks, and achieve wafer lifting by setting the slope of the lifting slider 38. In the initial state, the roller 34 is located at the first straight section 381 of the lifting slider 38. When it is necessary to raise the stage 4 to perform quantitative inspection on the wafer, the first wedge block 25 moves towards the groove 271, driving the second wedge block 27 to move upward. The stage 4 remains in a high position. At the same time, since the first wedge block 25 moves towards the groove 271, it drives the lifting slider 38 to move in the same direction, but the roller 34 always remains on the first straight section 381. Therefore, the lifting mechanism 3 remains at its original height position.

[0053] When the wafer needs to be lifted above the stage 4 for wafer pick-and-place operations, the first wedge block 25 moves away from the groove 271, causing the second wedge block 27 to move downwards. Simultaneously, the lifting slider 38 moves in the same direction, and the roller 34 passes through the lifting section 383 to the second straight section 382. At this point, the lifting mechanism 3 is in a high position. The descent of the second wedge block 27 combined with the rise of the lifting mechanism 3 causes the lifting column to extend above the stage 4, allowing an external robot or other mechanism to remove the wafer.

[0054] This invention employs a wedge structure, which allows for greater load movement with less output force, while significantly reducing the height in the Z-axis direction, resulting in a more compact structure and facilitating modular integration. A cross roller guide 24 is positioned between the first wedge block 25 and the second wedge block 27. Compared to commonly used linear guides, the cross roller guide has less friction and higher rigidity, enabling smoother movement and improved positioning accuracy. A lifting slider 38 is mounted on the first wedge block 25, and a lifting mechanism 3 is positioned between the first wedge block 25 and the second wedge block 27, making full use of space and reducing the vertical height.

[0055] like Figure 11 As shown, the present invention also provides a control method for a vertical motion device, which uses the above-mentioned vertical motion device. The specific control method is as follows: S1: The upper, lower, and lifting positions of the vertical motion device are calibrated. During macro motion, the drive structure 22 moves. The drive structure 22 is connected to an external controller. In the vertical direction, a grating ruler 2101 monitors and provides feedback in real time. The grating ruler 2101 transmits the height data to the controller in real time, adjusting the drive structure 22 to the specified position, thus forming a closed-loop control.

[0056] S2: The first wedge block 25 moves away from the groove 271, causing the second wedge block 27 to move downward. The platform 4 descends, and the roller 34 passes through the lifting section 383 to the second straight section 382. The lifting mechanism 3 rises to the lifting position. At this time, the lifting column 32 is higher than the platform 4. The wafer pick-and-place device places the wafer on the lifting column 32 from the wafer transfer port. After the wafer pick-and-place is completed.

[0057] S3: When it is necessary to raise the stage 4 to perform quantitative inspection on the wafer, the first wedge block 25 moves towards the groove 271, driving the second wedge block 27 to move upward, and the stage 4 begins to rise. At the same time, the lifting mechanism 3 descends. When it descends to a certain height, the wafer falls onto the plane of the stage 4, and the stage 4 continues to rise. At this time, the lifting mechanism 3 has reached the first straight section 381 and there will be no height change. The lifting mechanism 3 descends below the plane of the stage 4, that is, inside the wedge structure. At this time, the device has reached the height of the lower station. The stage 4 can continue to rise to reach the height of the upper station. Any station can be selected for inspection according to the testing requirements.

[0058] S4: After the macro-motion station is in position, the scanning electron microscope (SEM) begins scanning various points on the wafer. Height deviations exist between these points, typically at the sub-micron level. A height displacement sensor is installed below the microscope tube, transmitting the required height information to the controller in real time. The controller then drives the driver to move the piezoelectric ultrasonic motor horizontally at the micron level. Due to the horizontal and vertical stroke ratio of the wedge mechanism, sub-micron vertical movement is achieved, thereby adjusting the position of each point and completing the inspection. Because electron beam inspection requires frequent scanning of various points on the wafer during image acquisition, the motor needs to have a high movement frequency.

[0059] Furthermore, the present invention also provides a semiconductor device including the aforementioned vertical motion device. Because the semiconductor device uses any of the aforementioned vertical motion devices and control methods, it possesses all the advantages described above.

[0060] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A vertical motion device, characterized in that, include: The macro-micro motion mechanism (2) includes a base plate (21), a first wedge block (25), and a second wedge block (27) that are slidably connected in sequence, and a drive structure (22) that is drivenly connected to the first wedge block (25). The base plate (21), the first wedge block (25), and the second wedge block (27) are slidably connected. A linear guide rail (212) is installed on the base plate (21). The linear guide rail (212) is connected to the second wedge block (27) and causes the second wedge block (27) to move vertically along it. The lifting mechanism (3) is placed inside the first wedge block (25) and the second wedge block (27), and includes a lifting plate (31), a roller (34), and a lifting slider (38) mounted on the first wedge block (25). The lifting slider (38) is connected to the lifting plate (31) through the roller (34). The lifting slider (38) includes a lifting section (383). The driving structure (22) drives the first wedge block (25) to move the lifting slider (38). The roller (34) moves along the lifting section (38), thereby driving the lifting plate (31) to make vertical movements. During macro motion, the drive structure (22) drives the first wedge block (25) to move, and the first wedge block (25) pushes the second wedge block (27) to move vertically along the linear guide rail (212) so that the second wedge block (27) performs vertical macro motion. During micro-motion, the driving structure (22) drives the first wedge block (25) to micro-motion, and uses the wedge ratio between the first wedge block (25) and the second wedge block (27) to make the first wedge block (25) push the second wedge block (27) to make vertical micro-motion along the linear guide rail (212).

2. The vertical motion device according to claim 1, characterized in that, The lifting slider (38) includes a first straight section (381) and a second straight section (382) connected in sequence. The height of the second straight section (382) is greater than the height of the first straight section (381). The driving structure (22) is used to drive the first wedge block (25) to move, so that the first straight section (381), the lifting section (383) and the second straight section (382) can respectively abut against the roller (34) so ​​that the lifting mechanism (3) can make vertical movement.

3. The vertical motion device according to claim 1, characterized in that, The macro-micro motion mechanism (2) includes a guide rail mounting base (28), a slider (29) and a track are provided in the linear guide rail (212), and grooves (271) and first mounting blocks (272) are respectively provided on both sides of the second wedge block (27). The grooves (271) and the first mounting blocks (272) are connected to the track of the linear guide rail (212), and the track slides vertically in the slider (29).

4. The vertical motion device according to claim 1, characterized in that, The macro-micro motion mechanism (2) includes a limiting mechanism (211), which includes a photoelectric limiting mechanism (2111), a fourth mounting block (2112), and a limiting piece (2113). The photoelectric limiting mechanism (2111) is mounted on the base plate (21) via the fourth mounting block (2112). The fourth mounting block (2112) is provided with a waist hole. The limiting piece (2113) is mounted on the first wedge block (25). The limiting piece (2113) moves with the first wedge block (25) and can pass through the photoelectric limiting mechanism (2111) to trigger the photoelectric limiting mechanism.

5. The vertical motion device according to claim 4, characterized in that, The limiting mechanism (211) includes a mechanical limiting block (2114) and an elastic buffer structure (2115). The elastic buffer structure (2115) is installed inside the mechanical limiting block (2114). The mechanical limiting block (2114) is installed on the base plate (21) and located on both sides perpendicular to the photoelectric limiting (2111). The mechanical limiting block (2114) can abut against the first wedge block (25).

6. The vertical motion device according to claim 5, characterized in that, The macro-micro motion mechanism (2) includes a measurement feedback mechanism (210), which includes a grating ruler (2101), a third mounting block (2104), and a reading head (2102). The reading head (2102) is mounted on the base plate (21) via a second mounting block (2103), and the grating ruler (2101) is mounted on the second wedge block (27) via the third mounting block (2104). The grating ruler (2101) and the reading head (2102) are parallel. The second mounting block (2103) is provided with a mounting hole (2105), which is an oblong hole.

7. The vertical motion device according to claim 3, characterized in that, A lifting column (32) is installed on one side of the lifting plate (31), and an O-ring (37) is installed at one end of the lifting column (32). A guide column (33), a roller mounting plate (35) and a tension spring (36) are installed on the side of the lifting plate (31) away from the lifting column (32). The rollers (34) are installed on both sides of the roller mounting plate (35). A bearing mounting seat (214) is installed on the base plate (21), and a press-fit bearing (213) is installed inside the bearing mounting seat (214). The guide column (33) is embedded inside the press-fit bearing (213). The bearing mounting base (214) and the lifting plate (31) are both provided with grooves (39), and the tension spring (36) is suspended on the grooves (39) to connect the bearing mounting base (214) and the lifting plate (31).

8. The vertical motion device according to claim 7, characterized in that, The base plate (21), the first wedge block (25) and the second wedge block (27) are connected by a cross roller guide (24). Friction elements (26) are attached to both sides of the first wedge block (25). The drive structure (22) abuts against the friction elements (26). The drive structure (22) is a piezoelectric ultrasonic motor.

9. A control method for a vertical motion device, characterized in that, The control method using the vertical motion device according to any one of claims 1-8 includes: S1: The upper, lower and lifting positions of the vertical motion device are calibrated. The drive structure (22) is connected to the controller. In the vertical direction, the grating ruler (2101) transmits the height data to the controller in real time, and adjusts the drive structure (22) to move to the specified position to form a closed-loop control. S2: The first wedge block (25) moves away from the groove (271), causing the second wedge block (27) to move downward, the platform (4) descends, the roller (34) abuts against the second straight section (382), the lifting mechanism (3) reaches the lifting position, at this time, the lifting column (32) is higher than the platform (4), the wafer pick-and-place device places the wafer on the lifting column (32) from the wafer transfer port, and completes the wafer pick-and-place; S3: When it is necessary to raise the stage (4) to perform quantity detection on the wafer, the first wedge block (25) moves toward the groove (271), causing the second wedge block (27) to move upward, and the stage (4) begins to rise. At the same time, the lifting mechanism (3) descends. After the wafer falls onto the plane on the stage (4), the stage (4) supports the wafer and continues to rise. At this time, the lifting mechanism (3) is located at the first straight section (381). The lifting mechanism (3) descends below the plane of the stage (4), and the device reaches the height of the lower station. The stage (4) continues to rise to the height of the upper station. S4: After the macro motion is in place, the scanning electron microscope begins to scan each point on the wafer. There is a height deviation between each point. A displacement sensor in the height direction is installed below the microscope tube. It will transmit the height information that needs to be adjusted to the controller in real time. The controller controls the drive structure (22) to move at the micrometer level in the horizontal direction, so that the second wedge block (27) can achieve submicrometer level movement in the vertical direction, thereby adjusting the position of each point and completing the detection.

10. A semiconductor device, characterized in that, Includes a vertical motion device as described in any one of claims 1-8.

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