Heat dissipation assembly, domain controller and movable platform

Abstract

The application provides a heat dissipation assembly, a domain controller and a movable platform. The heat dissipation assembly comprises a shell and a fan cover. The shell is internally provided with a circuit board. The surface of the shell is provided with a fan and a plurality of heat dissipation fins. The plurality of heat dissipation fins surround the outer circumferential side of the fan. The shell is further provided with a through hole. At least one of the shell and the fan cover is further provided with a shielding structure. The shielding structure extends towards the other one of the shell and the fan cover. The shielding structure surrounds the outer circumferential side of the through hole. The shielding structure is provided with a wire harness through hole. The wire harness of the fan passes through the wire harness through hole and the through hole and is plugged into the circuit board. The application shields the through hole by the shielding structure, thereby ensuring that the shell has good sealing performance. When the fan and the circuit board are assembled, the wire harness only needs to be plugged into the circuit board after passing through the wire harness through hole and the through hole, which is beneficial to shorten the assembly time and improve the assembly efficiency.

Description

[0001] This application claims priority to Chinese Patent Application No. 202520579927.9, filed on March 27, 2025, entitled “Heat Dissipation Assembly, Domain Controller and Mobile Platform”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to domain controller heat dissipation technology, and more particularly to a heat dissipation component, a domain controller, and a mobile platform. Background Technology

[0003] A domain controller is a critical network server used to manage and control computers, users, and resources within a domain. For example, in the automotive field, a domain controller manages and controls various vehicle functions, including but not limited to powertrain, chassis control, and smart cockpit information processing. Domain controllers integrate multiple heat-generating components, such as chips; therefore, they are equipped with corresponding heat dissipation components that contact these components to dissipate heat as quickly as possible, ensuring the domain controller maintains optimal operating conditions.

[0004] The heat dissipation components within the domain controller include a housing, with a fan and multiple heat dissipation fins on its surface. Inside the housing is a circuit board, with heat-generating components mounted on the circuit board. The fan is positioned on the housing corresponding to the heat-generating components. To better control the fan's speed and start / stop, the fan needs to communicate with the circuit board inside the housing. Specifically, the housing has through-holes through which the fan's wiring harness passes and connects to the circuit board. To ensure the sealing of the through-holes, related technical solutions also require sealing the gap between the wiring harness and the through-holes using components such as rubber plugs.

[0005] However, the structure of the above solution is relatively complex, resulting in a long assembly time and low assembly efficiency between the fan and the circuit board. Summary of the Invention

[0006] In order to overcome the above-mentioned defects in related technologies, the purpose of this application is to provide a heat dissipation component, a domain controller and a mobile platform. This application ensures good sealing after the housing is opened, while shortening the assembly time between the fan and the circuit board and improving the assembly efficiency.

[0007] On one hand, this application provides a heat dissipation component, including a housing and a fan cover. The housing contains a circuit board, and the surface of the housing is provided with a fan and a plurality of heat dissipation fins. The plurality of heat dissipation fins surround the outer periphery of the fan, and the housing is also provided with through holes.

[0008] At least one of the housing and the fan cover is further provided with a shielding structure, the shielding structure extending toward the other of the housing and the fan cover, the shielding structure surrounding the outer periphery of the through hole, the shielding structure being provided with a wiring harness through hole, the fan wiring harness passing through the wiring harness through hole and the through hole and then being plugged into the circuit board.

[0009] In one possible implementation, the shielding structure includes a first shield and a second shield, the first shield being disposed on the side of the housing facing the fan cover, the second shield being disposed on the side of the fan cover facing the housing, the wiring harness via being disposed on the first shield and / or the second shield, the diameter of the second shield being larger than the diameter of the first shield, and the second shield being fitted over the outside of the first shield.

[0010] In one possible implementation, the gap between the first shield and the second shield is smaller than the diameter of the wire harness, and the wire harness is interference-fitted with the first shield and the second shield.

[0011] In one possible implementation, the wiring harness via includes a first wiring harness via disposed on the side wall of the first shield, the second shield covering the first wiring harness via, the end of the second shield away from the fan cover abutting against the wiring harness, the wiring harness also being provided with a protective sleeve, the wiring harness abutting against the second shield through the protective sleeve.

[0012] In one possible implementation, the wire harness via includes a first wire harness via disposed on the side wall of the first shield and a second wire harness via disposed on the side wall of the second shield, with the first wire harness via and the second wire harness via spaced apart along the axial direction of the shielding structure.

[0013] In one possible implementation, the shielding structure includes a shielding cover disposed on the side of the housing facing the fan cover, the wiring harness via being disposed on the shielding cover, and one end of the shielding cover facing away from the housing abutting against the fan cover;

[0014] Alternatively, the shielding structure includes a shielding cover disposed on the side of the fan cover facing the housing, the wiring harness through-hole disposed on the shielding cover, and the end of the shielding cover opposite to the fan cover abutting against the housing.

[0015] In one possible implementation, the outer diameter of the shielding structure is 16-22 mm.

[0016] In one possible implementation, the outer casing is further provided with an electromagnetic shield on the side facing the circuit board, the electromagnetic shield being disposed around the through hole; the circuit board is provided with a fan connector and a conductive layer, the conductive layer being disposed around the fan connector;

[0017] In a plane parallel to the circuit board, the projection of the electromagnetic shield coincides with the projection of the conductive layer; the electromagnetic shield abuts against the conductive layer.

[0018] On the other hand, this application provides a domain controller including the heat dissipation components described above.

[0019] In another aspect, this application provides a mobile platform, including the domain controller described above.

[0020] This application provides a heat dissipation component, a domain controller, and a portable platform. The heat dissipation component includes a housing and a fan cover. A circuit board is housed inside the housing, and a fan and multiple heat dissipation fins are provided on the surface of the housing. The multiple heat dissipation fins surround the outer periphery of the fan. The housing also has through holes. At least one of the housing and the fan cover has a shielding structure extending toward the other of the housing and the fan cover. The shielding structure surrounds the outer periphery of the through holes and has wiring harness vias. The fan's wiring harness passes through the wiring harness vias and the through holes and then plugs into the circuit board. This application ensures good sealing of the housing by shielding the through holes through the shielding structure. When assembling the fan and the circuit board, the wiring harness only needs to pass through the wiring harness vias and the through holes and then plug into the circuit board, which helps to shorten the assembly time and improve the assembly efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 An exploded view of a heat dissipation assembly provided in an embodiment of this application;

[0023] Figure 2 for Figure 1 Enlarged view of part A in the middle;

[0024] Figure 3 This is a simplified diagram of the connection structure between the fan and the circuit board provided in one embodiment of this application;

[0025] Figure 4 A partial schematic diagram of the casing provided in an embodiment of this application;

[0026] Figure 5 This is a simplified structural diagram of a fan cover provided in one embodiment of this application;

[0027] Figure 6 A simplified structural diagram of a fan cover provided in another embodiment of this application;

[0028] Figure 7 A simplified diagram of the connection structure between the fan and the circuit board provided in another embodiment of this application;

[0029] Figure 8 This is a schematic diagram of a fan assembly provided in one embodiment of this application;

[0030] Figure 9 A schematic diagram of a fan assembly provided for another embodiment of this application;

[0031] Figure 10 This is a schematic diagram of fan disassembly provided according to an embodiment of this application;

[0032] Figure 11 A simplified structural diagram of the upper housing provided in one embodiment of this application;

[0033] Figure 12 A simplified structural diagram of a circuit board provided in an embodiment of this application.

[0034] Figure label:

[0035] 10 - Palm;

[0036] 20-jigs;

[0037] 30- Crowbar;

[0038] 100 - Outer shell; 101 - Upper shell; 1011 - Slot; 102 - End cap; 110 - Heat dissipation fins; 120 - Through hole; 130 - First shielding cover; 131 - First wire harness through hole; 140 - Electromagnetic shielding cover;

[0039] 200-Fan cover; 201-Claw; 210-Second shield; 211-Second wiring harness through hole;

[0040] 300 - Circuit board; 310 - Fan connector; 320 - Conductive layer;

[0041] 400 - Fan; 410 - Wiring harness; 411 - Fan connector plug;

[0042] 500 - Fasteners. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0044] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0045] As described in the background section, in order to ensure the sealing performance of the housing, it is necessary to seal the through holes on the housing with parts such as rubber plugs. Due to the introduction of new accessories, the complexity of the structure is increased, resulting in a longer assembly time and lower assembly efficiency between the fan and the circuit board.

[0046] In view of this, the embodiments of this application aim to provide a heat dissipation component, a domain controller, and a mobile platform. This application provides a shielding structure to block the through holes on the original structure of the heat dissipation component, thereby ensuring that the outer shell has good sealing performance. When assembling the fan and the circuit board, the wire harness only needs to be inserted into the circuit board after passing through the wire harness through holes and the through holes, which helps to shorten the assembly time and improve the assembly efficiency.

[0047] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can gain a more detailed understanding of the contents of this application.

[0048] Please refer to Figures 1-12 This embodiment provides a heat dissipation component, including a housing 100 and a fan cover 200. The housing 100 contains a circuit board 300, and the surface of the housing 100 is provided with a fan 400 and a plurality of heat dissipation fins 110.

[0049] Specifically, such as Figure 1 As shown, the housing 100 of this embodiment includes an upper housing 101 and an end cap 102 disposed opposite to each other. The upper housing 101 and the end cap 102 together form a cavity for accommodating the circuit board 300. The upper housing 101 and the end cap 102 can be detachably connected, for example, by fasteners such as bolts, thereby facilitating installation and subsequent maintenance and replacement. The upper housing 101 and the end cap 102 can also be connected and fixed by means such as welding or bonding, and the specific connection method can be selected according to needs. The circuit board 300 is provided with multiple heat-generating devices, and a fan 400 and multiple heat sink fins 110 are used to dissipate heat from the heat-generating devices, so as to dissipate the heat generated by the heat-generating devices as quickly as possible.

[0050] For example, the fan 400 and multiple heat dissipation fins 110 can both be disposed on the side of the upper housing 101 away from the end cover 102. The multiple heat dissipation fins 110 surround the outer periphery of the fan 400, and an airflow channel is formed between two adjacent heat dissipation fins 110. The fan cover 200 is disposed on the side of the fan 400 away from the housing 100 to protect the fan 400. The fan 400 can be, for example, an axial fan. The air blown by the fan 400 is perpendicular to the upper housing 101. After contacting the upper housing 101, the air diffuses and flows in all directions and flows out from the surrounding airflow channels.

[0051] In this embodiment, the fan 400 can be detachably connected to the upper housing 101 via fasteners such as bolts. Multiple heat dissipation fins 110 can be integrally formed with the upper housing 101 by die casting. The fan cover 200 has multiple latches 201 around its perimeter, and the upper housing 101 has multiple slots 1011 around its perimeter, allowing the fan cover 200 and the upper housing 101 to be snapped together. To improve connection stability, after the fan cover 200 is snapped together with the upper housing 101, it can also be connected to the upper housing 101 via fasteners 500. Specifically, the fan cover 200 has through holes for the fasteners 500 to pass through, and the upper housing 101 has corresponding fixing holes. The fasteners 500 pass through the through holes and are fixedly connected to the corresponding fixing holes. The fasteners 500 can be, for example, bolts or screws. In other embodiments, the fan cover 200 can be directly connected to the upper housing 101 via fasteners 500.

[0052] To facilitate communication between the fan 400 and the circuit board 300, the housing 100 in this embodiment is also provided with a through hole 120. At least one of the housing 100 and the fan cover 200 is also provided with a shielding structure, which extends toward the other of the housing 100 and the fan cover 200. The shielding structure surrounds the outer periphery of the through hole 120 and is provided with a wiring harness through hole. The wiring harness 410 of the fan 400 passes through the wiring harness through hole and the through hole 120 in sequence and then plugs into the circuit board 300.

[0053] It is understandable that, since the shielding structure is arranged around the through hole 120, the shielding structure, the upper housing 101, and the fan cover 200 can together form a cavity, with the through hole 120 located within this cavity. Therefore, the outer casing 100 can maintain good sealing performance without needing to seal the through hole 120 with a plug or other parts, thus providing good waterproof and dustproof performance. In this embodiment, a fan connector 310 can be provided on the circuit board 300, and a fan connector plug 411 can be provided at the end of the wiring harness 410 away from the fan 400. The structure of the fan connector plug 411 is compatible with that of the fan connector 310. When assembling the fan 400 with the circuit board 300, it is only necessary to pass the wiring harness 410 through the wiring harness through hole and the through hole 120 and then plug it into the fan connector 310 on the circuit board 300. Since it is not necessary to install a plug into the through hole 120, it is beneficial to shorten the assembly time and improve the assembly efficiency.

[0054] In this embodiment, the through hole 120 is blocked by a shielding structure, thereby ensuring that the outer casing 100 has good sealing performance. When assembling the fan 400 with the circuit board 300, the wiring harness 410 only needs to be passed through the wiring harness through hole and the through hole 120 and then plugged into the circuit board 300, which helps to shorten the assembly time and improve the assembly efficiency.

[0055] Please continue to refer to Figures 3-5 In one possible implementation, the shielding structure of this embodiment includes a first shielding cover 130 and a second shielding cover 210. The first shielding cover 130 is disposed on the side of the housing 100 facing the fan cover 200, and the second shielding cover 210 is disposed on the side of the fan cover 200 facing the housing 100; the first shielding cover 130 and the second shielding cover 210 have similar shapes, for example, both can be hollow cylindrical or prismatic. A wire harness through-hole can be provided on the first shielding cover 130 and / or the second shielding cover 210 to facilitate the passage of the wire harness 410.

[0056] Optionally, the diameter of the second shield 210 can be larger than the diameter of the first shield 130. The second shield 210 can be fitted over the outside of the first shield 130. By fitting the second shield 210 over the outside of the first shield 130, the through hole 120 is prevented from contacting the outside, thus giving the outer shell 100 a high degree of sealing.

[0057] It is understood that in other possible implementations, the diameter of the first shield 130 may be larger than the diameter of the second shield 210, and the first shield 130 may be fitted over the outside of the second shield 210. By fitting the first shield 130 over the outside of the second shield 210, the through hole 120 is prevented from contacting the outside, thereby giving the outer casing 100 a high degree of sealing.

[0058] Optionally, the wiring harness via in this embodiment may include an opening on the side of the first shielding cover 130 opposite to the upper housing 101. In this embodiment, the wiring harness 410 can pass through the opening on the side of the first shielding cover 130 opposite to the upper housing 101, enter the first shielding cover 130, and then pass through the through hole 120 on the upper housing 101 to achieve a plug-in engagement with the circuit board 300. After the wiring harness 410 is properly engaged with the circuit board 300, the fan cover 200 is installed, and the second shielding cover 210 is fitted over the outside of the first shielding cover 130, or the first shielding cover 130 is fitted over the outside of the second shielding cover 210, thereby giving the outer casing 100 better sealing performance.

[0059] like Figure 3 and Figure 4 As shown, optionally, the wiring harness via in this embodiment may include a first wiring harness via 131 disposed on the side wall of the first shielding cover 130, and the second shielding cover 210 blocks the first wiring harness via 131, thereby ensuring that the housing 100 has good sealing performance. The end of the second shielding cover 210 away from the fan cover 200 abuts against the wiring harness 410, and the wiring harness 410 is also provided with a protective sleeve (not shown in the figure). The wiring harness 410 abuts against the second shielding cover 210 through the protective sleeve to prevent the wiring harness 410 from cracking. In this embodiment, the wiring harness 410 can pass through the first wiring harness via 131 into the first shielding cover 130, and then pass through the through hole 120 on the upper housing 101 to achieve plug-in engagement with the circuit board 300. After the wiring harness 410 is properly fitted to the circuit board 300, the fan cover 200 is installed. The second shield 210 is then fitted over the outside of the first shield 130. The second shield 210 is used to block the first wiring harness through hole 131, thereby giving the housing 100 a better seal.

[0060] Furthermore, in this embodiment, the gap between the first shielding cover 130 and the second shielding cover 210 is smaller than the diameter of the wire harness 410, and the wire harness 410 is interference-fitted with the first shielding cover 130 and the second shielding cover 210. By fixing the wire harness 410 between the first shielding cover 130 and the second shielding cover 210 through an interference fit, the risk of connection failure between the wire harness 410 and the circuit board 300 due to vibration can be avoided.

[0061] Please continue to refer to Figure 4 and Figure 6In other possible implementations, the wiring harness vias in this embodiment may include a first wiring harness via 131 disposed on the side wall of the first shielding cover 130 and a second wiring harness via 211 disposed on the side wall of the second shielding cover 210. The first wiring harness via 131 and the second wiring harness via 211 are spaced apart along the axial direction of the shielding structure (i.e., perpendicular to the fan cover 200). In this embodiment, when the second shielding cover 210 is fitted over the outside of the first shielding cover 130, the wiring harness 410 first passes through the second wiring harness via 211 and then through the first wiring harness via 131 into the first shielding cover 130. Conversely, when the first shielding cover 130 is fitted over the outside of the second shielding cover 210, the wiring harness 410 first passes through the first wiring harness via 131 and then through the second wiring harness via 211 into the first shielding cover 130. The wiring harness 410 then passes through the through hole 120 on the upper housing 101 and is then inserted into the circuit board 300. After the wiring harness 410 is properly fitted to the circuit board 300, the fan cover 200 is then fixed to the housing 100. Since the first wiring harness through hole 131 and the second wiring harness through hole 211 are spaced apart, the first shielding cover 130 can be used to shield the second wiring harness through hole 211 and the second shielding cover 210 can be used to shield the first wiring harness through hole 131, thereby giving the housing 100 a better seal.

[0062] In this embodiment, when the wire harness 410 is plugged into the circuit board 300, different installation methods can be selected as needed. For example... Figure 8 As shown, the operator can use the fingers on their palm 10 to press against the fan connector plug 411 of the wiring harness 410, and judge whether the fan connector plug 411 and the fan connector 310 are properly engaged by the sound and tactile feedback when they click together. Or, as... Figure 9 As shown, the operator can use calipers, clamps, or other fixtures 20 to hold the fan connector plug 411 and engage the fan connector plug 411 and the fan connector 310.

[0063] like Figure 10 As shown, when it is necessary to remove the wiring harness 410 from the circuit board 300, a pry bar 30 or tweezers can be inserted into the through hole 120 to apply force to the clips on the fan connector plug 411, while simultaneously pulling the wiring harness 410 outwards to complete the disassembly process. Alternatively, the operator can press the clips on the fan connector plug 411 with their fingers and pull the wiring harness 410 outwards to disassemble the wiring harness 410 by hand.

[0064] It is understood that in this embodiment, the wire harness 410 and the circuit board 300 can be quickly installed and removed by hand or with the aid of simple tools.

[0065] In other possible implementations, such as Figure 4 and Figure 7As shown, the shielding structure of this embodiment includes a shield (i.e., the first shield 130 shown in the figure), the shield is disposed on the side of the housing 100 facing the fan cover 200, the wire harness through hole is disposed on the shield, and the end of the shield away from the housing 100 abuts against the fan cover 200.

[0066] Or, such as Figure 6 As shown, the shielding structure of this embodiment includes a shield (i.e., the second shield 210 shown in the figure), the shield is disposed on the side of the fan cover 200 facing the outer shell 100, the wire harness through hole is disposed on the shield, and the end of the shield away from the fan cover 200 abuts against the outer shell 100.

[0067] It is understandable that the above solution can also achieve the shielding of the through hole 120 with just one layer of shielding cover, thereby giving the outer shell 100 good sealing performance.

[0068] In this embodiment, the outer diameter of the shielding structure is 16-22mm. Specifically, when the jig 20 is used to install the wire harness 410, the shielding structure can have a smaller outer diameter; while when the palm 10 is used to install the wire harness 410, the outer diameter of the shielding structure can be appropriately increased. By setting the outer diameter of the shielding structure within the above-mentioned range in this embodiment, it can be ensured that the shielding structure has minimal obstruction to the airflow of the fan 400, thereby ensuring that the heat dissipation component has good heat dissipation capacity.

[0069] Please continue to refer to Figure 11 and Figure 12 In this embodiment, the outer casing 100 facing the circuit board 300 is also provided with an electromagnetic shielding cover 140, which surrounds the through hole 120. Exemplarily, the electromagnetic shielding cover 140 is disposed on the side of the upper casing 101 opposite to the fan 400, located inside the cavity formed by the upper casing 101 and the end cover 102. The electromagnetic shielding cover 140 can be made of a conductive metal material. The shape of the electromagnetic shielding cover 140 can be a hollow prism or cylinder. Optionally, the electromagnetic shielding cover 140 and the upper casing 101 can be integrally formed by die casting.

[0070] The circuit board 300 has a fan connector 310 and a conductive layer 320, the conductive layer 320 being disposed around the fan connector 310. Exemplarily, the conductive layer 320 may be formed from surface copper foil on the circuit board 300. The conductive layer 320 may be polygonal or circular in shape.

[0071] In a plane parallel to the circuit board 300, the projection of the electromagnetic shield 140 coincides with the projection of the conductive layer 320. The electromagnetic shield 140 abuts against the conductive layer 320, thereby forming a Faraday cage effect, which prevents the circuit board 300 from being affected by external electromagnetic fields. Even if a through hole 120 is provided on the outer casing 100, it still has good electromagnetic compatibility performance.

[0072] In this embodiment, the through hole 120 can be located on the housing 100 near the fan 400, and the fan connector 310 corresponds to the through hole 120, that is, the fan connector 310 is located on the circuit board 300 near the fan 400, in the middle of the circuit board 300. This can shorten the length of the wiring harness 410, and eliminate the need to add the fan connector 310 at the edge of the circuit board, which helps to reduce the area of ​​the circuit board 300 and reduce costs.

[0073] This embodiment also provides a domain controller, including the above-described heat dissipation component.

[0074] It is understood that, due to the use of the aforementioned heat dissipation components, the domain controller in this embodiment can ensure good sealing performance and improve assembly efficiency. The domain controller in this embodiment also exhibits good electromagnetic compatibility performance and helps reduce the area of ​​the internal circuit board.

[0075] This embodiment also provides a mobile platform, including the domain controller described above.

[0076] Specifically, the mobile platform in this embodiment can be, for example, a vehicle, a drone, or a robot. Because of the use of the aforementioned domain controller, the heat dissipation capacity of the mobile platform can be improved, ensuring its optimal operating condition and increasing assembly efficiency. The mobile platform of this embodiment also exhibits good electromagnetic compatibility performance and helps reduce the area of ​​the internal circuit board of the domain controller.

[0077] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0078] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0079] It should be noted that in the description of this application, the terms "first" and "second" are used only for convenience in describing different components and should not be construed as indicating or implying a sequential relationship, relative importance, or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features.

[0080] The embodiments or implementation methods in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0081] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation component, characterized in that, The device includes a housing and a fan cover. The housing contains a circuit board, and the surface of the housing is provided with a fan and multiple heat dissipation fins. The multiple heat dissipation fins surround the outer periphery of the fan, and the housing also has through holes. At least one of the housing and the fan cover is further provided with a shielding structure, the shielding structure extending toward the other of the housing and the fan cover, the shielding structure surrounding the outer periphery of the through hole, the shielding structure being provided with a wiring harness through hole, the fan wiring harness passing through the wiring harness through hole and the through hole and then being plugged into the circuit board.

2. The heat dissipation assembly according to claim 1, characterized in that, The shielding structure includes a first shield and a second shield. The first shield is disposed on the side of the outer casing facing the fan cover, and the second shield is disposed on the side of the fan cover facing the outer casing. The wiring harness through-hole is disposed on the first shield and / or the second shield. The diameter of the second shield is larger than the diameter of the first shield, and the second shield is fitted over the outside of the first shield.

3. The heat dissipation assembly according to claim 2, characterized in that, The gap between the first shield and the second shield is smaller than the diameter of the wire harness, and the wire harness is interference-fitted with the first shield and the second shield.

4. The heat dissipation assembly according to claim 2, characterized in that, The wiring harness through-hole includes a first wiring harness through-hole disposed on the side wall of the first shielding cover, the second shielding cover blocks the first wiring harness through-hole, one end of the second shielding cover away from the fan cover abuts against the wiring harness, the wiring harness is also provided with a protective sleeve, and the wiring harness abuts against the second shielding cover through the protective sleeve.

5. The heat dissipation assembly according to claim 2, characterized in that, The wire harness via includes a first wire harness via disposed on the side wall of the first shield and a second wire harness via disposed on the side wall of the second shield, with the first wire harness via and the second wire harness via spaced apart along the axial direction of the shielding structure.

6. The heat dissipation assembly according to claim 1, characterized in that, The shielding structure includes a shield, which is disposed on the side of the housing facing the fan cover. The wiring harness through-hole is disposed on the shield, and the end of the shield away from the housing abuts against the fan cover. Alternatively, the shielding structure includes a shielding cover disposed on the side of the fan cover facing the housing, the wiring harness through-hole disposed on the shielding cover, and the end of the shielding cover opposite to the fan cover abutting against the housing.

7. The heat dissipation assembly according to claim 1, characterized in that, The outer diameter of the shielding structure is 16-22 mm.

8. The heat dissipation assembly according to any one of claims 1-7, characterized in that, The outer casing is also provided with an electromagnetic shielding cover on the side facing the circuit board, and the electromagnetic shielding cover is arranged around the through hole; the circuit board is provided with a fan connector and a conductive layer, and the conductive layer is arranged around the fan connector; In a plane parallel to the circuit board, the projection of the electromagnetic shield coincides with the projection of the conductive layer; the electromagnetic shield abuts against the conductive layer.

9. A domain controller, characterized in that, Includes the heat dissipation component as described in any one of claims 1-8.

10. A mobile platform, characterized in that, Includes the domain controller as described in claim 9.

Images