A semiconductor wafer surface defect detection device
By combining a ring-shaped coaxial light and a side-emitting light superimposed illumination field with a high frame rate line scan camera, the problems of high false negative rate, long detection time and poor adaptability in semiconductor wafer surface defect detection are solved, achieving efficient and accurate defect detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI SEMICON WAFER TECH CO LTD
- Filing Date
- 2026-06-10
- Publication Date
- 2026-07-24
AI Technical Summary
In existing technologies, the detection of surface defects on semiconductor wafers suffers from several problems, including the easy omission of minute mechanical damage, long detection time that cannot match the high-speed production line cycle, and a lack of efficient lighting and algorithm coordination solutions.
By employing a superimposed illumination field of ring coaxial light and side-emitting light, coupled with a high frame rate line scan camera and synchronous fixing mechanism, a completely dark and sealed inspection environment is constructed to achieve precise illumination and rapid scanning. Combined with a high-precision transmission mechanism, it can adapt to different wafer sizes and defect types.
It reduces the rate of missed and false defects, shortens the inspection time per wafer, matches the high-speed turnover of semiconductor production lines, and improves inspection accuracy and adaptability.
Smart Images

Figure CN122448857A_ABST