An ultra-high-speed optoelectronic hybrid connector

Abstract

The application relates to the technical field of photoelectric transmission, and provides an ultrahigh-speed photoelectric hybrid connector, which comprises a first connector and a second connector, the first connector and the second connector are respectively provided with matched magnetic attraction components, the first connector is further provided with a first optical connection assembly, a first electric connection assembly and a positioning column, the second connector is further provided with a second optical connection assembly, a second electric connection assembly and a positioning hole, when the first connector and the second connector are magnetically attracted and adhered through the magnetic attraction components, the positioning column and the positioning hole are matched to realize accurate butt joint, so that the first optical connection assembly and the second optical connection assembly complete optical path alignment and realize optical link communication, and the first electric connection assembly and the second electric connection assembly complete circuit alignment and realize electric link communication. The application relies on a magnetic attraction structure and a positioning structure to assist in realizing accurate alignment, transmitting signals of different rates, well adapting to an ultrahigh-speed photoelectric signal transmission application scene, and being high in accuracy and transmission efficiency.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic transmission technology, and more specifically to an ultra-high-speed optoelectronic hybrid connector. Background Technology

[0002] Hybrid optoelectronic connectors are core basic connection devices in optoelectronic transmission systems, enabling simultaneous high-speed optical signal transmission and electrical signal conduction. They are widely used in high-speed communication, big data transmission, precision intelligent devices, and high-speed interconnected terminals. With the rapid iteration of 5G communication, high-speed data transmission, and precision optoelectronic integration technologies, the market has placed stringent demands on the transmission rate, mating accuracy, connection stability, and ease of assembly of optoelectronic connectors. Ultra-high-speed optoelectronic signal transmission scenarios urgently require high-precision and high-stability hybrid optoelectronic connection devices.

[0003] Existing optoelectronic connectors have simple and singular positioning structures, lacking pre-alignment auxiliary mechanisms and precise locking mechanisms. This results in low mating error tolerance, insufficient alignment accuracy, and an inability to adapt to high-end applications requiring high-frequency mating and ultra-high-speed signal transmission. They generally suffer from poor adaptability, insufficient practicality, and weak transmission stability, which are common industry pain points. Based on these shortcomings, there is an urgent need to develop a compact, precise, efficient, and highly stable ultra-high-speed optoelectronic hybrid connector to meet the demands of ultra-high-speed optoelectronic signal transmission. Summary of the Invention

[0004] In view of the problems of insufficient alignment accuracy and slow transmission rate in existing technologies, the purpose of this invention is to provide an ultra-high-speed optoelectronic hybrid connector.

[0005] To address the above problems, the present invention provides the following technical solution: An ultra-high-speed optoelectronic hybrid connector includes a first connector and a second connector that are mated together. The first connector and the second connector are respectively provided with cooperating magnetic attraction components for automatically magnetically aligning the first connector and the second connector when they come close together. The first connector is also provided with a first optical connection component, a first electrical connection component, and a positioning post; The second connector is also provided with a second optical connection component adapted to mate with the first optical connection component, a second electrical connection component adapted to mate with the first electrical connection component, and a positioning hole adapted to mate with the positioning post; When the first connector and the second connector are magnetically attached by the magnetic attraction component, the positioning post and the positioning hole cooperate to achieve precise docking, thereby the first optical connection component and the second optical connection component complete optical path alignment and achieve optical link connection; the first electrical connection component and the second electrical connection component complete circuit alignment and achieve electrical link connection.

[0006] In some embodiments, the magnetic attraction component includes a first magnetic attraction element and a second magnetic attraction element that cooperate with each other. The first magnetic attraction element and the second magnetic attraction element are respectively disposed on the first connector and the second connector, and are disposed facing each other.

[0007] In some embodiments, the first optical connection assembly includes a first injection-molded lens and a first glass sheet. The first injection-molded lens is sleeved on the first magnetic chuck, and the first glass sheet is disposed on the side of the first injection-molded lens near the second connector and fixedly connected to the first magnetic chuck. A first optical window is provided on the first injection-molded lens. The second optical connection assembly includes a second injection-molded lens and a second glass sheet. The second injection-molded lens is sleeved on the second magnetic chuck, and the second glass sheet is disposed on the side of the second injection-molded lens near the first connector and fixedly connected to the second magnetic chuck. A second optical window is provided on the second injection-molded lens. The central axes of the first optical window and the second optical window coincide, and the optical paths are precisely aligned to achieve optical signal transmission.

[0008] In some embodiments, the first connector is provided with a first through hole and a second through hole, the first through hole and the second through hole passing through the first injection-molded lens and the first glass sheet, the positioning post passing through the first through hole and one end of the positioning post extending out of the first connector through the first through hole; The second connector is provided with a third through hole, and the third through hole and the positioning hole penetrate the second injection-molded lens and the second glass sheet.

[0009] In some embodiments, the first electrical connection assembly includes a first probe, which passes through the second through hole, with one end of the first probe fixedly mounted on the first connector and the other end extending out of the first connector through the second through hole to form an electrical contact end; The second electrical connection assembly includes a second probe, which passes through the third through hole. One end of the second probe is fixedly mounted on the second connector, and the other end is located in the third through hole. The electrical contact end of the first probe extends into the interior of the second connector through the third through hole, making elastic contact with the second probe and achieving electrical conduction.

[0010] In some embodiments, a first substrate is fixedly connected to the side of the first magnetic member away from the first glass sheet, and a first driving chip and a first photoelectric chip are integrated on the first substrate. The second magnetic component is fixedly connected to a second substrate on the side away from the second glass sheet, and a second driving chip and a second optoelectronic chip are integrated on the second substrate.

[0011] In some embodiments, the first probe is fixedly disposed on the first substrate, and the end of the first probe extends out of the first substrate; The second probe is fixedly disposed on the second substrate, and the end of the second probe extends out of the second substrate.

[0012] In some embodiments, the number and position of the positioning posts and positioning holes are one-to-one and at least two are respectively provided. The at least two positioning posts and positioning holes are symmetrically distributed on both sides of the central axis of the first connector and the second connector. The end of the positioning post located inside the first connector is a free end, and a gap is reserved between the free end and the first substrate.

[0013] In some embodiments, the number and position of the first probe and the second probe are one-to-one and multiple of each are provided. Multiple first probes are distributed in a ring and symmetrically arranged on both sides of the positioning post; multiple second probes are distributed in a ring and symmetrically arranged on both sides of the positioning hole.

[0014] In some embodiments, the first magnetic attractor and the second magnetic attractor are annular in shape, the first injection-molded lens and the second injection-molded lens are respectively embedded inside the first magnetic attractor and the second magnetic attractor, and the outer contours of the first glass sheet and the second glass sheet are respectively matched with the outer contours of the first magnetic attractor and the second magnetic attractor.

[0015] In some embodiments, the second connector further includes a lower body and a first accelerated heat dissipation component disposed in the lower body. The first accelerated heat dissipation component includes a plurality of first heat dissipation elements, a plurality of second heat dissipation elements, and a plurality of third heat dissipation elements. The plurality of first heat dissipation elements are close to the second photoelectric chip and the second driving chip, and the plurality of third heat dissipation elements are sequentially away from the second photoelectric chip and the second driving chip. The second heat dissipation element is located between the first heat dissipation elements and the third heat dissipation elements. The thermal conductivity of the material of the first heat dissipation element is lower than that of the second heat dissipation element, and the thermal conductivity of the material of the second heat dissipation element is lower than that of the third heat dissipation element. The first clamping plate is disposed on the side wall of the lower seat body and is used to clamp the second base plate.

[0016] In some embodiments, the first connector further includes an upper body and a second accelerated heat dissipation component disposed in the upper body for heat conduction and accelerated heat dissipation. The second accelerated heat dissipation component includes a plurality of fourth heat dissipation elements, a plurality of fifth heat dissipation elements, and a plurality of sixth heat dissipation elements, and is disposed in a second through slot at the bottom of the upper housing. The positions of the plurality of second through slots are offset from the positions of the fourth heat dissipation elements. The plurality of fourth heat dissipation elements are close to the first optoelectronic chip and the first driving chip, and the plurality of sixth heat dissipation elements are sequentially away from the first optoelectronic chip and the first driving chip. The fifth heat dissipation element is located between the fourth heat dissipation elements and the sixth heat dissipation elements. The thermal conductivity of the material of the fourth heat dissipation element is lower than that of the fifth heat dissipation element, and the thermal conductivity of the material of the fifth heat dissipation element is lower than that of the sixth heat dissipation element. The second clamping plate is disposed on the side wall of the upper seat and is used to clamp the first substrate.

[0017] The beneficial effects of this invention are: This invention features mutually cooperating magnetic components that enable automatic magnetic pre-alignment when the first and second connectors are close together. This eliminates the limitations of traditional manual visual alignment, significantly simplifies the assembly process, and improves docking efficiency. The magnetic pre-alignment, combined with the precise docking of the positioning post and positioning hole, provides dual positioning to ensure docking accuracy. This meets the high-precision coaxial requirements of ultra-high-speed photoelectric transmission, driving optical path alignment to achieve optical link connection. Circuit alignment achieves electrical link connection, abandoning the traditional step-by-step docking method. This results in good docking consistency and strong conduction stability, and can meet the transmission requirements of ultra-high-speed photoelectric signals. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an ultra-high-speed optoelectronic hybrid connector according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of an ultra-high-speed optoelectronic hybrid connector according to an embodiment of the present invention; Figure 3 This is a top view of an embodiment of the ultra-high-speed optoelectronic hybrid connector of the present invention; Figure 4 This is a front view of an embodiment of the ultra-high-speed optoelectronic hybrid connector of the present invention; Figure 5 for Figure 4 A sectional view; Figure 6 This is a schematic diagram of the structure of the first substrate; Figure 7 This is a schematic diagram of the structure of the second substrate; Figure 8 This is an exploded view of the first connector; Figure 9 Exploded view of the second connector; Figure 10 This is a schematic diagram of the structure of the first connector of another embodiment of the ultra-high-speed optoelectronic hybrid connector of the present invention; Figure 11 for Figure 10 Exploded view; Figure 12 This is a schematic diagram of the structure of the second connector of the ultra-high-speed optoelectronic hybrid connector according to another embodiment of the present invention; Figure 13 for Figure 12 Exploded view; Figure 14 This is a schematic diagram of the upper body structure; Figure 15 This is a schematic diagram of the lower body structure; Figure 16 This is an exploded view of the second connector of the ultra-high-speed optoelectronic hybrid connector according to the third embodiment of the present invention.

[0019] Figure label: First connector 1, first optical connection assembly 11, first injection molded lens 111, first optical window 1111, first glass sheet 112, first electrical connection assembly 12, first probe 121, positioning post 13, first magnetic suction component 14, first through hole 15, second through hole 16, first substrate 17, first driving chip 171, first optoelectronic chip 172, upper seat 18, second accelerated heat dissipation assembly 181, fourth heat dissipation component 181a, fifth heat dissipation component 181b, sixth heat dissipation component 181c, second through slot 19, second card plate 19a; Second connector 2, second optical connection assembly 21, second injection molded lens 211, second optical window 2111, second glass sheet 212, second electrical connection assembly 22, second probe 221, positioning hole 23, second magnetic suction component 24, third through hole 25, second substrate 26, second driving chip 261, second optoelectronic chip 262, lower seat 27, first accelerated heat dissipation assembly 271, first heat sink 271a, second heat sink 271b, third heat sink 271c, first card plate 28; Graphene heat dissipation layer 3, seventh through hole 31. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] For ease of description of the first, second, and third directions in the embodiments of this application, the first direction is the left-right direction in the figures, the second direction is the front-back direction in the figures, and the third direction is the up-down direction in the figures. The x-axis arrow direction is referred to as the "right" direction, the y-axis arrow direction as the "up" direction, and the z-axis arrow direction as the "back" direction, but these are not the sole limitations in the actual application of this application.

[0023] like Figures 1 to 9 As shown, this embodiment provides an ultra-high-speed optoelectronic hybrid connector, including a first connector 1 and a second connector 2 that are mated to each other. The first connector 1 and the second connector 2 are respectively provided with cooperating magnetic attraction components, which are used to automatically magnetically align the first connector 1 and the second connector 2 when they are close together. The first connector 1 is also provided with a first optical connection component 11, a first electrical connection component 12 and a positioning post 13; The second connector 2 is also provided with a second optical connection component 21 adapted to be connected to the first optical connection component 11, a second electrical connection component 22 adapted to be connected to the first electrical connection component 12, and a positioning hole 23 adapted to be connected to the positioning post 13. When the first connector 1 and the second connector 2 are magnetically attached by the magnetic attraction component, the positioning post 13 and the positioning hole 23 cooperate to achieve precise docking, thereby completing the optical path alignment and realizing the optical link connection between the first optical connection component 11 and the second optical connection component 21; the first electrical connection component 12 and the second electrical connection component 22 complete the circuit alignment and realize the electrical link connection. The magnetic attraction component, the positioning post 13 and the positioning hole 23 cooperate to form a dual positioning structure: first, the magnetic attraction component achieves low-resistance automatic pre-alignment, and then the locking cooperation between the positioning post 13 and the positioning hole 23 achieves micron-level precise positioning, providing a reliable structural guarantee for the subsequent alignment of the optical path and the circuit, avoiding the errors and tedious operations of manual alignment.

[0024] In this embodiment, the magnetic attraction component includes a first magnetic attraction member 14 and a second magnetic attraction member 24 that cooperate with each other. The first magnetic attraction member 14 and the second magnetic attraction member 24 are respectively disposed on the first connector 1 and the second connector 2, and are disposed facing each other.

[0025] Specifically, the first magnetic accumulator 14 and the second magnetic accumulator 24 are both annular permanent magnets with opposite polarities when they are facing each other. When the first connector 1 and the second connector 2 approach each other to a certain distance, the magnetic attraction generated by the two can drive the connectors to automatically move towards the center, achieving preliminary axial and radial pre-alignment without the need for manual visual calibration, greatly reducing the assembly difficulty, and providing guidance for the subsequent precise insertion of the positioning post 13 and the positioning hole 23.

[0026] like Figure 8 As shown, in this embodiment, the first optical connection assembly 11 includes a first injection-molded lens 111 and a first glass sheet 112. The first injection-molded lens 111 is sleeved on the first magnetic suction member 14, and the first glass sheet 112 is disposed on the side of the first injection-molded lens 111 near the second connector 2 and is fixedly connected to the first magnetic suction member 14. A first optical window 1111 is provided on the first injection-molded lens 111. like Figure 9 As shown, the second optical connection assembly 21 includes a second injection-molded lens 211 and a second glass sheet 212. The second injection-molded lens 211 is sleeved on the second magnetic absorbing member 24. The second glass sheet 212 is disposed on the side of the second injection-molded lens 211 close to the first connector 1 and is fixedly connected to the second magnetic absorbing member 24. A second optical window 2111 is provided on the second injection-molded lens 211. The central axes of the first optical window 1111 and the second optical window 2111 coincide, and the optical paths are precisely aligned to achieve optical signal transmission.

[0027] The first injection-molded lens 111 and the second injection-molded lens 211 are disc-shaped optical structures adapted to the contour of the connector end face, embedded inside the corresponding magnetic suction component and arranged coaxially with it. The injection-molded lens integrates an optical signal collimation structure, which can collimate the optical signals emitted / received by the optoelectronic chip and reduce transmission loss. The first optical window 1111 and the second optical window 2111 are light transmission channels that pass through the first injection-molded lens 111 and the second injection-molded lens 211. After docking, their central axes are completely coincident, forming a continuous optical transmission path, ensuring that the optical signal is transmitted without offset and with low loss, meeting the stringent requirements of coaxiality of the optical path for ultra-high-speed optoelectronic transmission.

[0028] In this embodiment, the first connector 1 is provided with a first through hole 15 and a second through hole 16. The first through hole 15 and the second through hole 16 pass through the first injection-molded lens 111 and the first glass plate 112. The positioning post 13 passes through the first through hole 15 and one end of the positioning post 13 extends out of the first connector 1 through the first through hole 15. The first through hole 15 provides an installation channel for the positioning post 13. The extended end of the positioning post 13 can be set as a tapered or guide head structure to facilitate insertion into the positioning hole 23 of the second connector 2. The second connector 2 is provided with a third through hole 25, and the third through hole 25 and the positioning hole 23 pass through the second injection-molded lens 211 and the second glass sheet 212.

[0029] In this embodiment, the first electrical connection component 12 includes a first probe 121, which passes through the second through hole 16. One end of the first probe 121 is fixedly installed on the first connector 1, and the other end extends out of the first connector 1 through the second through hole 16 to form an electrical contact end. The second electrical connection assembly 22 includes a second probe 221, which passes through the third through hole 25. One end of the second probe 221 is fixedly mounted on the second connector 2, and the other end is located in the third through hole 25. The electrical contact end of the first probe 121 extends into the interior of the second connector 2 through the third through hole 25, and makes elastic contact with the second probe 221 to achieve electrical conduction. The second through hole 16 and the third through hole 25 provide through channels for the first probe 121 and the second probe 221, respectively. The position of each through hole corresponds one-to-one with the distribution of probes and positioning posts, ensuring that the components do not interfere with each other during the insertion process, while maintaining the compactness of the overall structure.

[0030] The first probe 121 is an elastic probe, preferably a pogo pin probe, which can generate elastic deformation during insertion to ensure stable contact pressure and avoid poor contact after long-term insertion and removal. The second probe 221 is a copper pillar structure. The extension length of the first probe 121 is less than the extension length of the positioning post 13. Therefore, during the docking process, the positioning post 13 first inserts into the positioning hole 23 to complete precise positioning. Then, the first probe 121 extends into the third through hole 25 to contact and conduct with the second probe 221, avoiding hard contact of the probes without positioning, which could cause damage. When the connector is docked in place, the contact surfaces of the first probe 121 and the second probe 221 are completely fitted together, forming a stable electrical connection path and realizing synchronous transmission of electrical signals.

[0031] In this embodiment, the first magnetic accumulator 14 is fixedly connected to the first substrate 17 on the side away from the first glass sheet 112, and the first driving chip 171 and the first photoelectric chip 172 are integrated on the first substrate 17. The second magnetic chuck 24 is fixedly connected to the second substrate 26 on the side away from the second glass sheet 212. The second substrate 26 integrates the second driving chip 261 and the second optoelectronic chip 262.

[0032] The first substrate 17 and the second substrate 26 are FPC flexible circuit boards or rigid PCB boards, serving as the circuit carriers of the connector and integrating photoelectric signal processing and transmission circuits. The first photoelectric chip 172 and the second photoelectric chip 262 are respectively coupled to the optical windows of the corresponding injection-molded lenses, which can convert electrical signals into optical signals for transmission or receive optical signals and convert them into electrical signals. The first driving chip 171 and the second driving chip 261 are respectively electrically connected to the corresponding probes and photoelectric chips, used to drive the photoelectric chips to work and realize the transmission and processing of electrical signals, enabling the connector to have the ability to transmit optical signals and electrical signals synchronously.

[0033] In this embodiment, the first probe 121 is fixedly disposed on the first substrate 17, and the end of the first probe 121 extends out of the first substrate 17. The second probe 221 is fixedly disposed on the second substrate 26, and the end of the second probe 221 extends out of the second substrate 26.

[0034] The first probe 121 and the first substrate 17, and the second probe 221 and the second substrate 26 can be fixedly connected by welding, pressing or SMT surface mount technology to ensure the reliability of electrical connection; the probe tip extends out of the substrate to facilitate electrical connection with external circuits or internal chips, simplify the overall wiring structure and improve integration.

[0035] In this embodiment, the number and position of the positioning posts 13 and the positioning holes 23 are one-to-one and at least two of each are provided. At least two positioning posts 13 and positioning holes 23 are symmetrically distributed on both sides of the central axis of the first connector 1 and the second connector 2, forming a two-point positioning structure, which effectively prevents the connector from rotating and shifting during docking, and further improves the positioning accuracy. The end of the positioning post 13 located inside the first connector 1 is a free end. A gap is reserved between the free end and the first substrate 17, which can prevent the positioning post 13 from pressing the first substrate 17 backward during the insertion process, and prevent the substrate and the chips and circuits on the board from being damaged by force, thereby improving the reliability and service life of the connector.

[0036] In this embodiment, the number and position of the first probe 121 and the second probe 221 are one-to-one and multiple of them are respectively provided. Multiple first probes 121 are distributed in a ring and symmetrically arranged on both sides of the positioning post 13; multiple second probes 221 are distributed in a ring and symmetrically arranged on both sides of the positioning hole 23.

[0037] like Figure 6 and Figure 7As shown, there are eight first probes 121 and eight second probes 221, which are arranged in a circular pattern around the central axis of the connector. They are divided into two groups and symmetrically distributed on both sides of the positioning posts 13, with the axis of symmetry of the two positioning posts 13 as the boundary. They correspond to the second probes 221 on the second connector 2. This circular symmetrical distribution not only ensures uniform force on the electrical connection and avoids overload of one side of the probe, but also maximizes the use of the internal space of the connector by combining with the ring structure of the magnetic suction component, making the overall structure more compact. Moreover, the probes make synchronous contact during docking, ensuring the consistency of electrical signal transmission.

[0038] In this embodiment, the first magnetic absorbing member 14 and the second magnetic absorbing member 24 are in the shape of a ring. The first injection-molded lens 111 and the second injection-molded lens 211 are respectively embedded in the inner side of the first magnetic absorbing member 14 and the second magnetic absorbing member 24. The outer contours of the first glass sheet 112 and the second glass sheet 212 are respectively matched with the outer contours of the first magnetic absorbing member 14 and the second magnetic absorbing member 24.

[0039] This annular magnetic chuck structure provides installation space for the injection-molded lens and generates uniform magnetic force, ensuring the stability of pre-alignment. The injection-molded lens is embedded inside the magnetic chuck, and the two are arranged coaxially, which can effectively utilize the hollow space of the magnetic chuck, making the overall structure of the connector more compact. At the same time, it ensures the coaxiality of the optical window and the magnetic chuck, providing a structural basis for optical path alignment. The glass plate matches the outer contour of the magnetic chuck and can fit tightly with the magnetic chuck and the injection-molded lens, improving the connector's protective performance and structural stability.

[0040] The complete docking process of this invention is as follows: When docking the first connector 1 and the second connector 2, the docking end faces of the two are brought close to each other. The magnetic attraction force generated by the first magnetic suction member 14 and the second magnetic suction member 24 will drive the connectors to automatically move towards the center, completing the initial pre-alignment. Subsequently, the positioning post 13 is inserted into the positioning hole 23 under the magnetic attraction guidance to achieve precise locking and positioning. As the connectors continue to fit together, the first optical window 1111 of the first injection-molded lens 111 and the second optical window 2111 of the second injection-molded lens 211 are coaxially aligned. At the same time, the first probe 121 extends into the third through hole 25 and elastically contacts the second probe 221 to achieve the conduction of the optical link and the electrical link. The entire docking process does not require manual calibration. High-precision docking can be completed solely by the cooperation of the magnetic pre-alignment and the positioning structure, which greatly improves the assembly efficiency and connection stability. It is suitable for application scenarios of ultra-high-speed photoelectric signal transmission, where the high-speed signal can reach 32Gbps or 64Gbps.

[0041] like Figure 10-15 As shown, in another embodiment of the present invention, a heat dissipation structure is further added, such as... Figure 12 , 13As shown in Figure 15, the second connector 2 also includes a lower base 27 and a first accelerated heat dissipation component 271 disposed within the lower base 27. The first accelerated heat dissipation component 271 is used to guide the heat generated by the second optoelectronic chip 262 and the second driving chip 261 to the outside and accelerate heat dissipation.

[0042] The first accelerated heat dissipation component 271 includes multiple first heat sinks 271a, multiple second heat sinks 271b, and multiple third heat sinks 271c. The multiple first heat sinks 271a are close to the second photoelectric chip 262 and the second driving chip 261; the multiple third heat sinks 271c are sequentially moved away from the second photoelectric chip 262 and the second driving chip 261; the second heat sinks 271b are located between the first heat sinks 271a and the third heat sinks 271c.

[0043] The thermal conductivity of the material of the first heat sink 271a is lower than that of the second heat sink 271b, and the thermal conductivity of the material of the second heat sink 271b is lower than that of the third heat sink 271c. For example, the first heat sink 271a is made of thermally conductive plastic or ceramic with a thermal conductivity of approximately 10-50 W / m·K, the second heat sink 271b is made of aluminum with a thermal conductivity of approximately 200 W / m·K, and the third heat sink 271c is made of copper with a thermal conductivity of approximately 400 W / m·K. This gradient design allows heat to be conducted from the chip area to the heat sink, with the thermal conductivity of the heat sink increasing the further away from the chip. This quickly transfers heat to the edge of the casing for dissipation, while preventing excessive heat concentration near the chip.

[0044] The second connector 2 also includes a first clamping plate 28, which is disposed on the side wall of the lower seat 27 and is used to clamp the second substrate 26.

[0045] like Figure 10 , 11 As shown in Figure 14, the first connector 1 includes an upper body 18 and a second accelerated heat dissipation assembly 181 disposed within the upper body 18. The second accelerated heat dissipation assembly 181 includes multiple fourth heat dissipation elements 181a, multiple fifth heat dissipation elements 181b, and multiple sixth heat dissipation elements 181c, whose material thermal conductivity also increases in a gradient, i.e., the fourth heat dissipation element 181a has the lowest thermal conductivity and the sixth heat dissipation element 181c has the highest thermal conductivity. The bottom of the first connector 1 is provided with a second through slot 19, and the positions of the multiple second through slots 19 are staggered from the positions of the fourth heat dissipation elements 181a to avoid blocking the light path. The first connector 1 also includes a second clamping plate 19a for clamping the first substrate 17.

[0046] Furthermore, the third embodiment of the present invention further adds a graphene heat dissipation layer. For example... Figure 16As shown, the second connector 2 also includes a graphene heat dissipation layer 3 disposed between the second substrate 26 and the second injection-molded lens 211. The graphene heat dissipation layer 3 is also provided with a seventh through hole 31, through which the second probe 221 passes, so that the lower surface of the graphene heat dissipation layer 3 contacts the second substrate 26 and its upper surface contacts the second injection-molded lens 211.

[0047] Graphene has extremely high in-plane thermal conductivity, which can quickly and evenly diffuse the heat on the second probe 221 to the surroundings, preventing the second probe 221 from overheating in the confined space, thereby avoiding the second injection-molded lens 211 from being burned through by heat, and further improving the overall heat dissipation efficiency.

[0048] For example, graphene has an in-plane thermal conductivity of 2000 W / m·K or higher.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A high-speed optoelectronic hybrid connector, comprising a first connector and a second connector that are mated to each other, characterized in that: The first connector and the second connector are respectively provided with cooperating magnetic components. The magnetic components include a first magnetic element and a second magnetic element that cooperate with each other, which are used to automatically magnetically align the first connector and the second connector when they are close together. The first connector includes a first optical connection component, a first electrical connection component, and a positioning post. The first optical connection component includes a first injection-molded lens and a first glass sheet. The first injection-molded lens is sleeved on the first magnetic chuck, and the first glass sheet is disposed on the side of the first injection-molded lens near the second connector and is fixedly connected to the first magnetic chuck. The first connector has a first through hole and a second through hole, which penetrate the first injection-molded lens and the first glass sheet. The positioning post passes through the first through hole, and one end of the positioning post extends out of the first connector through the first through hole. The second connector includes a second optical connection component adapted to mate with the first optical connection component, a second electrical connection component adapted to mate with the first electrical connection component, and a positioning hole adapted to mate with the positioning post. The second optical connection component includes a second injection-molded lens and a second glass sheet. The second injection-molded lens is sleeved on the second magnetic suction member, and the second glass sheet is disposed on the side of the second injection-molded lens near the first connector and is fixedly connected to the second magnetic suction member. The second connector is provided with a third through hole, and the third through hole and the positioning hole penetrate the second injection-molded lens and the second glass sheet; The first magnetic attractor and the second magnetic attractor are in the shape of a ring. The first injection-molded lens and the second injection-molded lens are respectively embedded in the inner side of the first magnetic attractor and the second magnetic attractor. The outer contours of the first glass sheet and the second glass sheet are respectively matched with the outer contours of the first magnetic attractor and the second magnetic attractor. The first magnetic attractor is fixedly connected to a first substrate on the side away from the first glass sheet, and a first driving chip and a first optoelectronic chip are integrated on the first substrate. The second magnetic chuck is fixedly connected to a second substrate on the side away from the second glass sheet, and a second driving chip and a second optoelectronic chip are integrated on the second substrate. When the first connector and the second connector are magnetically attached by the magnetic attraction component, the positioning post and the positioning hole cooperate to achieve precise docking, thereby the first optical connection component and the second optical connection component complete optical path alignment and achieve optical link connection; the first electrical connection component and the second electrical connection component complete circuit alignment and achieve electrical link connection.

2. The ultra-high-speed optoelectronic hybrid connector according to claim 1, characterized in that: The first magnetic attractor and the second magnetic attractor are respectively disposed on the first connector and the second connector, and are arranged facing each other.

3. The ultra-high-speed optoelectronic hybrid connector according to claim 1, characterized in that: The first injection-molded lens has a first optical window; The second injection-molded lens has a second optical window; The central axes of the first optical window and the second optical window coincide, and the optical paths are precisely aligned to achieve optical signal transmission.

4. The ultra-high-speed optoelectronic hybrid connector according to claim 1, characterized in that: The first electrical connection assembly includes a first probe, which passes through the second through hole. One end of the first probe is fixedly mounted on the first connector, and the other end extends out of the first connector through the second through hole to form an electrical contact end. The second electrical connection assembly includes a second probe, which passes through the third through hole. One end of the second probe is fixedly mounted on the second connector, and the other end is located in the third through hole. The electrical contact end of the first probe extends into the interior of the second connector through the third through hole, making elastic contact with the second probe and achieving electrical conduction; The first probe is an elastic probe, and its extension length is less than that of the positioning post.

5. The ultra-high-speed optoelectronic hybrid connector according to claim 4, characterized in that: The first probe is fixedly disposed on the first substrate, and the end of the first probe extends out of the first substrate; The second probe is fixedly disposed on the second substrate, and the end of the second probe extends out of the second substrate.

6. The ultra-high-speed optoelectronic hybrid connector according to claim 1, characterized in that: The number and position of the positioning posts and positioning holes are one-to-one and at least two of each are provided. The at least two positioning posts and positioning holes are symmetrically distributed on both sides of the central axis of the first connector and the second connector. The end of the positioning post located inside the first connector is a free end, and a gap is reserved between the free end and the first substrate.

7. The ultra-high-speed optoelectronic hybrid connector according to claim 4 or 5, characterized in that: The number and position of the first probe and the second probe are one-to-one and multiple of each are provided. Multiple first probes are distributed in a ring and symmetrically arranged on both sides of the positioning post; multiple second probes are distributed in a ring and symmetrically arranged on both sides of the positioning hole.

8. The ultra-high-speed optoelectronic hybrid connector according to claim 1, characterized in that: The second connector further includes a lower body and a first accelerated heat dissipation assembly disposed in the lower body. The first accelerated heat dissipation assembly includes a plurality of first heat dissipation elements, a plurality of second heat dissipation elements, and a plurality of third heat dissipation elements. The plurality of first heat dissipation elements are close to the second optoelectronic chip and the second driving chip, and the plurality of third heat dissipation elements are sequentially away from the second optoelectronic chip and the second driving chip. The second heat dissipation element is located between the first heat dissipation elements and the third heat dissipation elements. The thermal conductivity of the material of the first heat dissipation element is lower than that of the second heat dissipation element, and the thermal conductivity of the material of the second heat dissipation element is lower than that of the third heat dissipation element. The first clamping plate is disposed on the side wall of the lower seat body and is used to clamp the second base plate.

9. The ultra-high-speed optoelectronic hybrid connector according to claim 1, characterized in that: The first connector further includes an upper body and a second accelerated heat dissipation component disposed within the upper body for heat conduction and accelerated heat dissipation. The second accelerated heat dissipation component includes a plurality of fourth heat dissipation elements, a plurality of fifth heat dissipation elements, and a plurality of sixth heat dissipation elements, and is disposed in a second through slot at the bottom of the upper body. The positions of the plurality of second through slots are offset from the positions of the fourth heat dissipation elements. The plurality of fourth heat dissipation elements are close to the first optoelectronic chip and the first driving chip, and the plurality of sixth heat dissipation elements are sequentially away from the first optoelectronic chip and the first driving chip. The fifth heat dissipation element is located between the fourth heat dissipation elements and the sixth heat dissipation elements. The thermal conductivity of the material of the fourth heat dissipation element is lower than that of the fifth heat dissipation element, and the thermal conductivity of the material of the fifth heat dissipation element is lower than that of the sixth heat dissipation element. The second clamping plate is disposed on the side wall of the upper seat and is used to clamp the first substrate.

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