Photonics integrated module, fiber array module, co-packaged optical device and production method

Abstract

The application provides a photonic integrated module, a fiber array module, a co-encapsulation optical device and a production method, comprising a photonic integrated module and a fiber array module, positioning in the Z-axis vertical direction is realized by the lamination of a first mating plane and a second mating plane, positioning in the XY direction in the horizontal plane is realized by the cooperation of a V-shaped groove and a cylinder, and positioning in a single horizontal direction is realized by the cooperation of a second positioning groove and a second cylinder, the second cooperating curved surface has better redundancy during the insertion process, two elastic members are used to provide continuous elastic pressing force, the cooperating structure is pressed on the positioning structure, elastic self-positioning in three-dimensional directions is realized, high coupling efficiency is ensured, the elastic pressing force absorbs collision stress during the disassembly process, direct wear of the positioning surface is reduced, the linear contact cooperation of the V-shaped groove and the cylinder has self-adaptive compensation ability for processing errors, the processing precision requirement is reduced, and sub-micron level reset precision can be realized.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic co-packaging technology, and in particular to a photonic integrated module, a fiber array module, a co-packaged optical device, and a manufacturing method thereof. Background Technology

[0002] Co-packaged optics (CPO) is an advanced optoelectronic integration technology. Its core lies in integrating silicon photonics chips with switching or computing chips onto the same substrate using advanced packaging technology. This significantly shortens the electrical signal transmission distance, aiming to address the bottlenecks faced by traditional pluggable optical modules in scenarios such as artificial intelligence and high-performance computing, including high power consumption, limited bandwidth density, and signal delay. In the CPO architecture, the fiber array unit (FAU) is responsible for coupling external optical signals to the PIC. Its alignment accuracy directly determines the optical coupling efficiency; sub-micron level alignment accuracy is crucial to ensuring the high-speed optical interconnect performance of the CPO module.

[0003] The existing fiber array alignment structure in CPO packaging mainly adopts the following scheme.

[0004] The first method uses a rigid alignment structure, which uses high-rigidity materials such as glass and ceramics to make V-grooves or precision guide rails. It relies on the high dimensional accuracy of the materials themselves to achieve sub-micron level alignment. The fiber array unit and the alignment reference structure are directly matched through a rigid contact surface, which requires the alignment unit to have extremely high manufacturing precision and material stability.

[0005] The second method is to use a permanent bonding solution, in which the fiber optic array unit and the photonic integrated circuit are fixed together with adhesive and cannot be disassembled. Although this solution can achieve precise alignment in one go, once the bonding is completed, the fiber optic array unit cannot be disassembled and replaced independently.

[0006] The third type uses a precision mechanical docking structure, employing glass inserts and sleeves to achieve precise fit, and positioning is achieved through the tight fit between the insert and sleeve.

[0007] Although the above solutions can achieve submicron precision alignment, they generally have the following technical problems. First, the choice of materials is limited. In order to ensure high dimensional accuracy and low coefficient of thermal expansion, the choice of materials is limited to high rigidity and high cost materials such as glass or ceramics, resulting in high manufacturing costs.

[0008] Secondly, the alignment structure suffers severe wear during disassembly and assembly. During the disassembly and assembly of the rigid alignment unit, friction occurs directly between the contact surfaces, which easily leads to wear, debris, or micro-cracks, resulting in irreversible loss of alignment accuracy.

[0009] Another issue is the limited number of times the fiber array unit can be repeatedly disassembled and reassembled. Due to the wear and tear of the rigid contact surface, the number of times the fiber array unit can be repeatedly disassembled and reassembled is extremely limited. This is not conducive to the maintenance, upgrading, and cost control of the CPO module, and further leads to high maintenance costs. In the case of permanent bonding, once the fiber array unit is damaged or needs to be upgraded, the entire CPO package faces scrapping, resulting in high maintenance costs. Summary of the Invention

[0010] The primary objective of this invention is to provide a photonic integrated module that reduces the requirements for processing precision while improving the accuracy of insertion and resetting.

[0011] The second objective of this invention is to provide a fiber optic array module that reduces the requirements for processing accuracy while improving the accuracy of insertion and resetting.

[0012] A third objective of this invention is to provide a co-packaged optical device having the aforementioned photonic integrated module and fiber array module.

[0013] A fourth objective of this invention is to provide a method for manufacturing the aforementioned co-packaged optical device.

[0014] To achieve the first objective of this invention, a photonic integrated module is provided, comprising a first mounting base, a first lens array, and a silicon photonic chip. The silicon photonic chip is disposed on the first mounting base, and the first lens array is disposed on the silicon photonic chip. The first mounting base is provided with a first mating plane, which is arranged along a horizontal plane. A first positioning structure and a second positioning structure are provided on the first mating plane. The first positioning structure includes a first positioning groove, a first elastic element, and two first positioning surfaces. The two first positioning surfaces are arranged in a V-shape and form the first positioning groove, which extends vertically. The first elastic element is used to apply a first elastic holding force toward the first positioning groove. The second positioning structure includes a second positioning groove, a second elastic element, and a second positioning surface. The second positioning groove extends horizontally and vertically, and the second positioning surface is located on the horizontal side of the second positioning groove. The second elastic element is used to apply a second elastic holding force toward the second positioning surface.

[0015] As can be seen from the above, by setting the first positioning structure and the second positioning structure, V-shaped positioning and single-sided planar positioning are provided respectively. Combined with the elastic holding force of the first elastic element and the second elastic element, the fiber array module is elastically positioned in two orthogonal directions in the docking plane. With the design of the first positioning groove extending in the vertical direction and the second positioning groove extending in both the horizontal and vertical directions, the mating structure has a large guiding margin during insertion, reducing the processing accuracy requirements of the mounting base. At the same time, the elastic holding force can adaptively compensate for position deviations and maintain sub-micron level reset accuracy after multiple insertions. Moreover, the elastic mating process can effectively reduce wear, thereby effectively improving the number of repeated disassembly and assembly cycles and the durability of the device.

[0016] A further proposed solution is that the first positioning structure includes a first deformation groove, and a first elastic element is disposed within the first deformation groove.

[0017] As can be seen from the above, by setting the first deformation groove to provide elastic deformation space for the first elastic element, the first elastic element can elastically flex into the deformation groove when compressed, avoiding interference between the elastic element and the first mounting base, ensuring the stability and repeatability of the elastic holding force, and extending the service life of the elastic element.

[0018] A further embodiment is that the first elastic element is arranged as a first elastic arm, the first fixed end of the first elastic arm is connected to the first mounting base, and the first abutting end of the first elastic arm is used to apply a first elastic holding force toward the first positioning groove.

[0019] As can be seen from the above, setting the first elastic element as a cantilever elastic arm structure, and using the bending deformation of the elastic arm to generate a stable elastic holding force, results in a simple and compact structure that can be mass-produced by injection molding, stamping, die casting and other processes, thereby reducing manufacturing costs.

[0020] A further embodiment is that the first elastic arm extends horizontally, and the first fixed ends of the first elastic arm at both ends in the horizontal direction are connected to the first mounting base, with the first abutting end located between the two first fixed ends.

[0021] As can be seen from the above, the double-fixed elastic arm structure with fixed ends and abutment in the middle can provide greater elastic holding force under the same deformation amount compared with the single-end cantilever structure, and the elastic force distribution is more uniform, which effectively improves the durability of the elastic arm and thus enhances the positioning stability during multiple disassembly and assembly.

[0022] A further proposed solution is that the second positioning structure includes a second deformation groove, and the second elastic element is disposed within the second deformation groove.

[0023] As can be seen from the above, by setting a second deformation groove to provide elastic deformation space for the second elastic element, the second elastic element can elastically flex into the deformation groove when compressed, avoiding interference between the elastic element and the mounting base, ensuring the stability and repeatability of the elastic holding force, and extending the service life of the elastic element.

[0024] A further embodiment is that the second elastic element is arranged as a second elastic arm, the second fixed end of the second elastic arm is connected to the first mounting base, and the second abutting end of the second elastic arm is used to apply a second elastic holding force toward the second positioning groove.

[0025] As can be seen from the above, setting the second elastic element as an elastic arm structure adopts a similar design concept to the first elastic element, namely, adopting a double-fixed elastic arm structure with both ends fixed and the middle abutting, which provides greater elastic holding force under the same amount of deformation, and the elastic force distribution is more uniform, effectively improving the durability of the elastic arm.

[0026] A further embodiment is that the second elastic arm extends horizontally, and the second fixed ends of the second elastic arm at both ends in the horizontal direction are connected to the first mounting base, with the second abutting end located between the two second fixed ends.

[0027] As can be seen from the above, the second elastic arm adopts a double-fixed elastic arm structure with fixed ends and abutment in the middle. Compared with the single-end cantilever structure, it can provide greater elastic holding force under the same deformation, and the elastic force distribution is more uniform, which effectively improves the durability of the elastic arm and thus enhances the positioning stability of multiple disassembly and assembly.

[0028] A further approach is to have the direction of the second elastic holding force perpendicular to the second positioning surface.

[0029] As can be seen from the above, the second elastic holding force is perpendicular to the second positioning surface, so that the second elastic holding force is used entirely to press the mating structure onto the second positioning surface, without decomposing a component force parallel to the second positioning surface. This avoids the component force causing the mating structure to slide or shift along the second positioning surface, thereby ensuring the positioning accuracy in the second direction.

[0030] A further proposed solution is to arrange the direction of the first elastic holding force at an acute angle to the first positioning surface.

[0031] As can be seen from the above, the first elastic holding force forms an acute angle with the first positioning surface, which allows the first elastic holding force to be decomposed into a normal component perpendicular to the first positioning surface and a tangential component parallel to the first positioning surface. The normal component will press the cooperating structure onto the two positioning surfaces of the V-shaped groove, while the tangential component will press the cooperating structure against the bottom of the V-shaped groove, thus achieving efficient self-positioning in the horizontal direction.

[0032] A further approach is to arrange the first elastic holding force in the same direction as the second elastic holding force.

[0033] As can be seen from the above, the first elastic holding force and the second elastic holding force are arranged in the same direction, so that the two elastic holding forces generate a resultant force in the same direction on the horizontal plane, making the stress state of the fiber array module simple and controllable during the insertion process, which facilitates the assembly operation.

[0034] A further approach is to position the first elastic holding force perpendicular to the second positioning surface.

[0035] As can be seen from the above, the first elastic holding force is perpendicular to the second positioning surface, and the first elastic holding force and the second elastic holding force are parallel and in the same direction. The two elastic holding forces work together in the same direction, so that the V-shaped structure of the first positioning groove and the second positioning surface form a specific triangular relationship, thereby stabilizing the constraint relationship in the XY direction.

[0036] A further proposed solution is that the first positioning structure and the second positioning structure are located on both sides of the first lens array in the horizontal direction.

[0037] As can be seen from the above, the first positioning structure and the second positioning structure are respectively set on both sides of the first lens array, so that the positioning points are distributed on both sides of the lens array, forming a stable constraint layout, and at the same time, the fiber array module is subjected to balanced force during insertion.

[0038] A further proposed solution is that a lens mounting groove is vertically provided on the first mating plane, the first lens array is disposed in the lens mounting groove, and the silicon photonics chip is located on the back side of the first mating plane.

[0039] As can be seen from the above, by placing the first lens array in the first docking plane through the lens mounting slot and placing the silicon photonic chip on the back side of the first docking plane, the optical path passes through the lens mounting slot in the vertical direction and couples to the silicon photonic chip. This not only enables stable constraint positioning in the vertical direction of the Z-axis by using the docking of the docking plane, but also avoids direct mechanical interference between the fiber array module and the silicon photonic chip, thereby avoiding disassembly and assembly wear caused by physical contact of the lens array.

[0040] A further proposed solution is that the first mounting base has a chip mounting slot on the back side of the first mating plane, the chip mounting slot is connected to the lens mounting slot, and the silicon photonics chip is placed in the chip mounting slot.

[0041] As can be seen from the above, the silicon photonics chip is integrated into the interior of the first mounting base through the chip mounting slot, thereby achieving the integrated integration of the silicon photonics chip and the positioning structure.

[0042] A further proposed solution is to provide a support block on the back side of the first mating plane, with the chip mounting slot penetrating the support block in a horizontal direction, and the first positioning structure and the second positioning structure located on both sides of the chip mounting slot, respectively.

[0043] As can be seen from the above, the support block provides support and positioning for the silicon photonics chip. The first positioning structure and the second positioning structure are located on both sides of the chip mounting slot, so that the positioning force acts symmetrically on both sides of the chip, effectively improving the positioning stability.

[0044] A further proposed solution is that the first lens array is provided with multiple coupling lenses arranged along the Y-axis, the chip mounting slot extends along the X-axis, and the first mounting base is provided with clearance slots on both sides of the back side of the first mating plane along the Y-axis. The clearance slots are connected to the chip mounting slot. The first positioning structure and the second positioning structure are located at one clearance slot, the first positioning slot extends vertically and connects with one of the clearance slots, and the second positioning slot extends vertically and connects with the other clearance slot.

[0045] As can be seen from the above, the clearance slot is used for the insertion and positioning of the mating structure of the fiber array module, so that the mating structure can be smoothly inserted into the positioning slot in the vertical direction, realizing the insertion guidance and clearance in the vertical direction, and the two mating planes can be precisely mated to achieve positioning in the vertical direction of the Z-axis.

[0046] To achieve the second objective of this invention, this invention provides a fiber optic array module, including a second mounting base and a fiber optic array. The fiber optic array is disposed on the second mounting base, and the second mounting base is provided with a second mating plane. The second mating plane is arranged along a horizontal plane, and a first mating structure and a second mating structure are provided on the second mating plane. The first mating structure extends in a vertical direction and is provided with a first mating arc surface, and the second mating structure extends in a vertical direction and is provided with a second mating arc surface. The light rays of the fiber optic array are emitted in a vertical direction toward the second mating plane.

[0047] As can be seen from the above, by setting the first mating structure and the second mating structure, and setting the first mating arc surface and the second mating arc surface respectively, the mating structure can form line contact with the V-shaped positioning groove and the planar positioning groove of the photonic integrated module. Compared with the surface contact, the line contact has less frictional resistance. The light of the fiber array is emitted in the vertical direction and is perpendicular to the docking plane. The docking of the docking plane effectively realizes the precise positioning in the vertical direction of the Z-axis, so as to improve the coupling efficiency of the light.

[0048] A further proposed solution is that the first mating structure is arranged in the form of a first cylinder, which extends vertically based on the second mating plane, and the first mating arc surface is located on the radial outer peripheral wall of the first cylinder.

[0049] As can be seen from the above, by using a cylinder as the mating structure, the cylindrical surface and the two inclined surfaces of the V-groove form two contact lines, achieving precise self-positioning of the V-groove and the cylinder. This positioning method has the ability to adaptively compensate for machining errors, reducing the machining accuracy requirements of the second mounting base and the first mounting base.

[0050] A further proposed solution is to provide a first guide arc surface at the axial end of the first cylinder.

[0051] As can be seen from the above, the first guiding arc surface forms a conical or spherical guiding arc surface structure at the end of the cylinder. When the first cylinder is inserted into the first positioning groove, the guiding arc surface can drive the corresponding elastic element to deform, achieve smooth insertion, avoid damage to the positioning surface caused by hard collision, and improve the stability and service life of multiple insertions.

[0052] A further proposed solution is that the second mating structure is arranged in the form of a second cylinder, which extends vertically based on the second mating plane, and the second mating arc surface is located on the radial outer peripheral wall of the second cylinder.

[0053] As can be seen from the above, by using a cylinder as the mating structure, the cylindrical surface and the two inclined surfaces of the V-groove form two contact lines, achieving precise self-positioning of the V-groove and the cylinder. This positioning method has the ability to adaptively compensate for machining errors, reducing the machining accuracy requirements of the second mounting base and the first mounting base.

[0054] A further improvement is that a second guide arc surface is provided at the axial end of the second cylinder.

[0055] As can be seen from the above, the second guide arc surface forms a conical or spherical guide arc surface structure at the end of the cylinder. When the second cylinder is inserted into the second positioning groove, the guide arc surface can drive the corresponding elastic element to deform, achieve smooth insertion, avoid damage to the positioning surface caused by hard collision, improve the stability and service life of multiple insertions, and the second positioning groove extends in the horizontal direction, thereby improving the redundancy of the second cylinder in the insertion process.

[0056] A further proposed solution is to have a light-transmitting groove on the second docking plane in the vertical direction, and to have an optical fiber array positioned on the back side of the second docking plane, with the light from the optical fiber array passing through the light-transmitting groove in the vertical direction and exiting towards the second docking plane.

[0057] As can be seen from the above, the light-transmitting groove provides a smooth optical path for light. The fiber array is set on the back side of the second docking plane, so that the fiber array does not occupy the space of the docking plane, which facilitates the docking plane to form a tight fit with the first docking plane of the photonic integrated module, thereby realizing the positioning and cooperation in the vertical direction of the Z-axis.

[0058] A further embodiment is that the second mounting base is provided with an optical fiber mounting slot on the back side of the second docking plane. The optical fiber mounting slot is connected to the light transmission slot. The optical fiber array module also includes a second lens array and a reflecting prism. The optical fiber array, the second lens array and the reflecting prism are arranged horizontally on the optical fiber mounting slot. The light from the optical fiber array passes through the second lens array and the reflecting prism and then passes vertically through the light transmission slot toward the second docking plane.

[0059] As can be seen above, by using a reflecting prism to fold the horizontal light path into a vertical direction, the fiber optic array can be arranged horizontally, reducing the vertical height of the fiber optic array module and facilitating compact packaging within a limited space. At the same time, the second lens array collimates or focuses the light, improving optical coupling efficiency.

[0060] A further approach is to have an optical fiber array comprising multiple optical fibers arranged along the Y-axis, with a first mating structure and a second mating structure located on opposite sides of the light-transmitting groove along the Y-axis.

[0061] As can be seen from the above, the first and second mating structures are located on both sides of the fiber array arrangement direction, so that the positioning mating structures are distributed at both ends of the fiber array, providing stable support and positioning for the fiber array, avoiding interference between the positioning structure and the fiber channel, and also ensuring that the fiber array module is subjected to uniform force during the insertion process.

[0062] To achieve the third objective of this invention, the present invention provides a co-packaged optical device, comprising a photonic integration module as described above and a fiber array module as described above; a first mating plane and a second mating plane are mated; a first mating arc surface is located within a first positioning groove and adjacent to two first positioning surfaces; a first elastic member elastically abuts against the first mating structure and applies a first elastic holding force to the first mating structure; a second mating arc surface is located within a second positioning groove and adjacent to the second positioning surface; a second elastic member elastically abuts against the second mating structure and applies a second elastic holding force to the second mating structure; the light from the fiber array is incident on the silicon photonic chip after passing through a first lens array.

[0063] As can be seen from the above, vertical positioning along the Z-axis is achieved through the mating of the first and second mating planes. Positioning in the XY direction in the horizontal plane is achieved through the engagement of the V-groove and the cylinder. Positioning in a single horizontal direction is achieved through the engagement of the second positioning groove and the second cylinder. Furthermore, the second mating arc surface provides better redundancy during insertion. Simultaneously, the first and second elastic elements provide continuous elastic holding force, pressing the mating structure firmly onto the positioning structure, achieving elastic self-positioning in three dimensions. In addition, the elastic holding force absorbs collision stress during assembly and disassembly, reducing direct wear on the positioning surface. The line contact engagement between the V-groove and the cylinder has adaptive compensation capability for machining errors, reducing machining accuracy requirements, and simultaneously achieving sub-micron level reset accuracy.

[0064] To achieve the fourth objective of this invention, this invention provides a method for manufacturing a co-packaged optical device as described above. Production methods include: The fiber optic array is pre-installed onto the second mounting base; Connect the fiber optic array module to the photonic integration module; Light transmission tests were performed on the fiber array module and the photonic integration module, and the position of the fiber array was adjusted according to the preset insertion loss requirements. The fixed fiber array is positioned on the second mounting base.

[0065] As can be seen from the above, this case utilizes a photonic integrated module as a calibration device through pre-installation, optical transmission testing, and fixing processes to achieve active online calibration of the fiber optic array. Compared to traditional passive calibration, active calibration can fine-tune according to the actual optical coupling effect, compensating for the accumulation of component processing and assembly errors, further reducing the requirements for the processing precision of each component. Simultaneously, it can maintain sub-micron-level reset accuracy even after multiple insertions, improving coupling efficiency and yield. Furthermore, since the fiber optic array module can be independently disassembled from the photonic integrated module, when maintenance or upgrades are needed, it is not necessary to replace the entire CPO package; only the fiber optic array module needs to be replaced, effectively reducing maintenance costs and downtime. Attached Figure Description

[0066] Figure 1 This is a structural diagram of the first embodiment of the co-packaged optical device of the present invention.

[0067] Figure 2 This is a structural diagram of the first embodiment of the co-packaged optical device of the present invention from another perspective.

[0068] Figure 3 This is a structural diagram of the photonic integration module in the first embodiment of the co-packaged optical device of the present invention.

[0069] Figure 4 This is a structural diagram of the photonic integration module in the first embodiment of the co-packaged optical device of the present invention from another perspective.

[0070] Figure 5 This is an exploded view of the photonic integration module in the first embodiment of the co-packaged optical device of the present invention.

[0071] Figure 6 This is a structural diagram of the fiber array module in the first embodiment of the co-packaged optical device of the present invention.

[0072] Figure 7 This is a structural diagram of the fiber array module in the first embodiment of the co-packaged optical device of the present invention from another perspective.

[0073] Figure 8 This is an exploded view of the fiber array module in the first embodiment of the co-packaged optical device of the present invention.

[0074] Figure 9 This is an exploded view of the fiber array module in the first embodiment of the co-packaged optical device of the present invention from another perspective.

[0075] Figure 10 This is a schematic diagram of the interaction between the photonic integration module and the mating structure in the first embodiment of the co-packaged optical device of the present invention.

[0076] Figure 11 This is a cross-sectional view of the first embodiment of the co-packaged optical device of the present invention.

[0077] Figure 12 This is a schematic diagram of the second embodiment of the co-packaged optical device of the present invention.

[0078] Figure 13 This is a schematic diagram of the third embodiment of the co-packaged optical device of the present invention.

[0079] Figure 14 This is a schematic diagram of the fourth embodiment of the co-packaged optical device of the present invention.

[0080] Figure 15 This is a schematic diagram of the fifth embodiment of the co-packaged optical device of the present invention.

[0081] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0082] First embodiment of co-packaged optical device: Reference Figures 1 to 11 The co-packaged optical device 10 includes a photonic integration module 1 and a fiber array module 2. The photonic integration module 1 includes a first mounting base 11, a first lens array 12 and a silicon photonic chip 13. The silicon photonic chip 13 is disposed on the first mounting base 11, and the first lens array 12 is disposed on the silicon photonic chip 13. The first mounting base 11 is provided with a first mating plane 111, which is arranged along a horizontal plane and is the upper surface of the first mounting base 11.

[0083] A lens mounting groove 112 is provided through the first mating plane 111 along the vertical direction Z. A first lens array 12 is disposed within the lens mounting groove 112, and multiple coupling lenses 121 are disposed on the first lens array 12, arranged along the horizontal direction Y. A chip mounting groove 113 is provided on the back side of the first mating plane 111. The chip mounting groove 113 extends along the horizontal direction X and communicates with the lens mounting groove 112. A silicon photonic chip 13 is disposed within the chip mounting groove 113 and is located on the back side of the first mating plane 111.

[0084] A support block 115 is provided on the back side of the first docking plane 111. A chip mounting groove 113 passes through the support block 115 along the X horizontal direction. A first mounting base 11 is provided with clearance grooves 114 on both sides of the back side of the first docking plane 111 along the Y horizontal direction. The clearance grooves 114 are connected to the chip mounting groove 113. Through the separation of the chip mounting groove 113 and the two clearance grooves 114, the support block 115 is divided into four support blocks. The four support blocks are located at the four corners of the first mounting base 11. The first lens array 12 is installed in the lens mounting groove 112 with clearance fit and is in clearance fit with the inner sidewalls of the two support blocks. The silicon photonic chip 13 is installed in the chip mounting groove 113 with clearance fit and is in clearance fit with the inner sidewalls of the four support blocks.

[0085] The first docking plane 111 is provided with a first positioning structure 14 and a second positioning structure 15 located on both sides of the chip mounting groove 113 based on the Y horizontal direction. The first positioning structure 14 and the second positioning structure 15 are also located on both sides of the first lens array 12 based on the horizontal direction. The first positioning structure 14 and the second positioning structure 15 are located at a clearance groove 114.

[0086] The first positioning structure 14 includes a first positioning groove 142, a first elastic element 143, a first deformation groove 144, and two first positioning surfaces 141. The two first positioning surfaces 141 are arranged in a V-shape to form the first positioning groove 142. The included angle between the two first positioning surfaces 141 is an acute angle. The first positioning surfaces 141 are arranged at an acute angle with the X horizontal direction. The tip of the first positioning groove 142 faces the first lens array 12, and the first opening of the first positioning groove 142 faces away from the first lens array 12. The first positioning groove 142 extends along the vertical direction Z and passes through along the vertical direction Z and communicates with one of the clearance grooves 114.

[0087] The first deformation groove 144 is connected to the first positioning groove 142 and its first opening. The first elastic member 143 is disposed in the first deformation groove 144. The first elastic member 143 and the first deformation groove 144 are both located near the first opening. The first elastic member 143 is arranged as a first elastic arm. The first elastic arm extends along the Y horizontal direction. The first fixed ends of the first elastic arm at both ends in the Y horizontal direction are connected to the first mounting base 11. The first elastic arm is provided with a first abutting end in the middle. The first abutting end is located between the two first fixed ends. The first abutting end is opposite to the first opening of the first positioning groove 142. The length of the first elastic member 143 and the first deformation groove 144 in the Y horizontal direction is greater than the opening size of the first opening in the Y horizontal direction. The first abutting end of the first elastic arm is used to apply a first elastic holding force F1 toward the first positioning groove 142.

[0088] The second positioning structure 15 includes a second positioning groove 152, a second elastic element 153, a second deformation groove 154, and a second positioning surface 151. The second positioning groove 152 extends along the Y horizontal direction and along the vertical direction Z. The second positioning groove 152 passes through along the vertical direction Z and communicates with another clearance groove 114. The second positioning surface 151 is arranged in a flat plane and perpendicular to the horizontal plane. The second positioning surface 151 is located on the X horizontal side of the second positioning groove 152. The second positioning surface 151 is arranged on the side close to the first lens array 12. The length dimension of the second positioning groove 152 in the Y horizontal direction is greater than the length dimension of the second mating structure 25 in the Y horizontal direction.

[0089] The second elastic element 153 is arranged as a second elastic arm, and is disposed within the second deformation groove 154. The second elastic arm extends horizontally, and the second fixed ends at both ends of the second elastic arm in the Y-direction are connected to the first mounting base 11. The second elastic arm has a second abutment end in the middle, located between the two second fixed ends. The second abutment end of the second elastic arm is used to apply a second elastic holding force F2 toward the second positioning groove 152. The direction of the first elastic holding force F1 is the same as and parallel to the direction of the second elastic holding force F2. The direction of the second elastic holding force F2 is perpendicular to the second positioning surface 151, and the direction of the first elastic holding force F1 is perpendicular to the second positioning surface 151. The direction of the first elastic holding force F1 forms an acute angle with the first positioning surface 141.

[0090] The second mounting base 21 is provided with a second mating plane 211, which is arranged along a horizontal plane and located on the lower surface of the second mounting base 21, facing downwards. The fiber optic array module 2 includes a second mounting base 21, a fiber optic array 22, a second lens array 231, and a reflecting prism 232. The fiber optic array 22, the second lens array 231, and the reflecting prism 232 are disposed on the second mounting base 21. A light-transmitting groove 212 is provided through the second mating plane 21 along the vertical direction Z. The second mounting base 21 is provided with a fiber optic mounting groove 213 on the back side of the second mating plane 211. The fiber optic mounting groove 213 extends along the horizontal direction X and communicates with the light-transmitting groove 212. The fiber optic array 22, the second lens array 231, and the reflecting prism 232 are disposed on the fiber optic mounting groove 213 along the horizontal direction. The fiber optic array 22 is located on the back side of the second mating plane 211.

[0091] The fiber array 22 includes multiple optical fibers 222 arranged along the Y horizontal direction and a substrate 221. The substrate 221 is provided with multiple positioning holes arranged along the Y horizontal direction. The fiber core of the optical fiber 222 is inserted into a corresponding positioning hole. The substrate 221 can be integrally formed, or the substrate can be composed of a base plate and a cover plate. The base plate and the cover plate are respectively provided with positioning grooves, which are then combined to form corresponding positioning holes.

[0092] The second lens array 231 is provided with multiple microlenses. Each microlens is opposite to the core exit end of an optical fiber 222 and is used to couple the outgoing light from the optical fiber array 22. The reflecting prism 232 has an incident end face, a reflecting surface, and an exit end face. The incident end face is perpendicular to the exit end face and is connected to the second lens array 231. The exit end face is arranged in a horizontal plane and is opposite to the first lens array 12. The reflecting surface is located between the incident end face and the exit end face and is used to reflect the light emitted from the incident end face onto the exit end face. Thus, the light from the optical fiber array 22 passes through the second lens array 231 and the reflecting prism 232 and exits along the vertical direction Z through the light transmission groove 212 toward the first lens array 12.

[0093] The second mounting base 21 has two support blocks 214 on the back side of the second mating plane 211. The two support blocks 214 are located on both sides of the Y horizontal direction and form an optical fiber mounting groove 213. The inner sidewalls of the two support blocks 214 are respectively fitted with the optical fiber array 22, the second lens array 231 and the reflecting prism 232.

[0094] The second mating plane 211 is provided with a first mating structure 24 and a second mating structure 25, which are located on both sides of the light-transmitting groove 212 based on the Y horizontal direction.

[0095] The position of the first mating structure 24 is opposite to the position of the first positioning structure 14. The first mating structure 24 is arranged in the shape of a first cylinder. The first mating structure 24 is provided with a first mating arc surface 241. The first cylinder extends in the vertical direction Z based on the second mating plane 211. The first mating arc surface 241 is located on the radial outer peripheral wall of the first cylinder. The axial end of the first cylinder is provided with a first guiding arc surface 242.

[0096] The second mating structure 25 is positioned opposite to the second positioning structure 15. The second mating structure 25 is arranged in the shape of a second cylinder. The second mating structure 25 is provided with a second mating arc surface 251. The second cylinder extends in the vertical direction Z based on the second mating plane 211. The second mating arc surface 251 is located on the radial outer peripheral wall of the second cylinder. The axial end of the second cylinder is provided with a second guiding arc surface 252.

[0097] Reference Figure 10 and Figure 11When the photonic integration module 1 is connected to the fiber array module 2, when the first mating structure 24 and the first positioning structure 14 are mated, the first guiding arc surface 242 slides and engages with the first elastic element 143 and the two first positioning surfaces 141 respectively. Then, as the first mating structure 24 is inserted, the first mating arc surface 241 is located in the first positioning groove 142 and is adjacent to the two first positioning surfaces 141. The first elastic element 143 elastically abuts against the first mating structure 24 and applies a first elastic holding force F1 to the first mating structure 24.

[0098] Simultaneously, the second mating structure 25 also mates with the second positioning structure 15. Through the second guiding arc surface 252, it slides with the second elastic element 153 and the second positioning surface 151 respectively. Then, as the second mating structure 25 is inserted, the second mating arc surface 251 is located within the second positioning groove 152 and adjacent to the second positioning surface 151. The second elastic element 153 elastically abuts against the second mating structure 25 and applies a second elastic holding force F2 to the second mating structure 25. Because the length of the second positioning groove 152 in the Y-direction is greater than the length of the second mating structure 25 in the Y-direction, the second mating structure 25 has a larger insertion redundancy space during connection, making insertion smoother.

[0099] When the first mating structure 24 and the second mating structure 25 are inserted to the bottom in the vertical direction Z, the ends of the first mating structure 24 and the second mating structure 25 are respectively located in the clearance groove 114, and the first mating plane 111 is mated with the second mating plane 211. The upper part of the first lens array 12 is located in the light transmission groove 212, and the first lens array 12 is also in clearance fit with the light transmission groove 212.

[0100] As can be seen from the above, the vertical positioning of the Z-axis is achieved by the fit of the first mating plane and the second mating plane, and the positioning in the XY direction in the horizontal plane is achieved by the V-groove and the cylinder on one side, and the positioning in the X horizontal direction is achieved by the second positioning surface and the second cylinder on the other side. Thus, while having better redundancy in the insertion process, it also ensures the connection positioning accuracy. In addition, with the arrangement of elastic elements, it can not only reduce the processing accuracy requirements, but also achieve sub-micron level reset accuracy.

[0101] An example of the manufacturing method for co-packaged optical devices as described above: The manufacturing method of co-packaged optical devices includes the following steps: First, using photonic integrated module 1 as a standard component, the fiber array module 2 is debugged, installed, and generated.

[0102] The fiber array 22, the second lens array 231, and the reflecting prism 232 are then pre-installed onto the second mounting base 21 of the fiber array module 2. The installation method includes, but is not limited to, using a six-axis adjustment device with a clamp to achieve precise pre-positioning of the device, or using a clamping method to pre-position the device.

[0103] Then the fiber array module 2 is connected to the photonic integration module 1, that is, the first mating structure 24 and the second mating structure 25 are connected to the first positioning structure 14 and the second positioning structure 15, respectively.

[0104] Then, the optical transmission test is performed on the fiber array module 2 and the photonic integration module 1. The light from the fiber array passes through the first lens array and is incident on the silicon photonic chip. The positions of the fiber array 22, the second lens array 231 and the reflecting prism 232 can then be adjusted according to the preset insertion loss requirements.

[0105] When the preset insertion loss requirement is met, the fiber array 22 is fixed at the position of the second mounting base 21. The fixing method includes, but is not limited to, using glue for bonding or using light curing, both of which can achieve the fixing of the device.

[0106] Second embodiment of co-packaged optical devices Reference Figure 12 Based on the first embodiment described above, the second embodiment can adjust the first positioning structure and the second positioning structure. For example, the first elastic member 341 of the first positioning structure 34 is arranged as a first elastic arm, while the first deformation groove 342 is arranged as a slot. The first elastic arm is disposed in the first deformation groove 342. The first fixed end of the first elastic arm is connected to the first mounting base, and the free end of the first elastic arm is suspended. The first elastic member 341 is used to apply a first elastic holding force toward the first positioning groove.

[0107] Similarly, the elastic element and deformation groove of the second positioning structure are the same as those of the first positioning structure, and will not be described again below.

[0108] Third embodiment of co-packaged optical devices Reference Figure 13 Based on the first embodiment described above, the third embodiment can adjust the first positioning structure and the second positioning structure. For example, the first elastic member 441 of the first positioning structure 44 is arranged as a first spring sheet. The first spring sheet is disposed in the first deformation groove 442. The two ends of the first spring sheet abut against the first mounting base. The middle part of the first spring sheet is provided with a first abutting end. The first abutting end can also apply a first elastic holding force toward the first positioning groove.

[0109] Similarly, the elastic element and deformation groove of the second positioning structure are the same as those of the first positioning structure, and will not be described again below.

[0110] Fourth embodiment of co-packaged optical devices Reference Figure 14 Based on the first embodiment described above, the fourth embodiment can adjust the first positioning structure and the second positioning structure. For example, the first elastic element of the first positioning structure 54 includes a first slider 541 and a first spring 543. The first slider 541 is slidably disposed in the first deformation groove 542. The first spring 543 elastically abuts between the first slider 541 and the first mounting base. The first abutting end of the first slider 541 can also apply a first elastic holding force toward the first positioning groove under the elastic drive of the first spring 543.

[0111] Similarly, the elastic element and deformation groove of the second positioning structure are the same as those of the first positioning structure, and will not be described again below.

[0112] Fifth embodiment of co-packaged optical devices Reference Figure 15 Based on the first embodiment described above, the fifth embodiment can adjust the first and second positioning structures, such as adjusting the orientation of the first and second elastic holding forces, and adjusting the opening direction of the first positioning groove and the position of the first positioning surface. That is, the first positioning structure 64 is rotated 45 degrees around the vertical direction based on the first embodiment, or other angles, and the first elastic member applies the first elastic holding force towards the first positioning groove, which also achieves positioning. Although the first and second elastic holding forces are not parallel, they can still position the two mating structures, thus achieving the purpose of the invention.

[0113] As can be seen from the above, this solution achieves vertical positioning along the Z-axis by fitting the first mating plane and the second mating plane, and horizontal positioning in the XY direction by fitting the V-groove with the cylinder. Furthermore, it achieves single horizontal positioning by fitting the second positioning groove with the second cylinder. The second mating arc surface provides better redundancy during insertion. Simultaneously, two elastic elements provide continuous elastic holding force, pressing the mating structure firmly onto the positioning structure, achieving elastic self-positioning in three dimensions. This ensures high coupling efficiency, and the elastic holding force absorbs collision stress during assembly and disassembly, reducing direct wear on the positioning surface. The line contact fit between the V-groove and the cylinder has adaptive compensation capability for machining errors, reducing machining accuracy requirements and achieving sub-micron level reset accuracy.

[0114] Of course, the above embodiments are only preferred embodiments of this case. In specific applications, the fiber optic array can also be set separately on the second mounting base, and the fiber optic array can directly output light towards the first lens array. In addition to being arranged in a cylindrical shape, the mating structure can also be arranged in a D-shaped cylinder, sphere, ellipsoid, or olive shape, which can also achieve positioning. In addition, the elastic element can also be a spring, torsion spring, compression spring, tension spring, or rubber, which has elastic restoring force and can also elastically position the mating structure. The lenses of the first lens array and the second lens array can be arranged in a lens matrix. Correspondingly, the optical fibers of the fiber optic array can also be arranged in an optical fiber matrix, thereby increasing the number of input and output ports. All the above changes are within the protection scope of this invention.

Claims

1. A co-packaged optical device, characterized in that, Including photonic integrated modules and fiber array modules; The photonic integration module includes a first mounting base, a first lens array, and a silicon photonic chip. The silicon photonic chip is disposed on the first mounting base, and the first lens array is disposed on the silicon photonic chip. The first mounting base is provided with a first mating plane, which is arranged along a horizontal plane. A first positioning structure and a second positioning structure are provided on the first mating plane. The first positioning structure includes a first positioning groove, a first elastic element, and two first positioning surfaces. The two first positioning surfaces are arranged in a V-shape and form the first positioning groove. The first positioning groove extends in a vertical direction. The first elastic element is used to apply a first elastic holding force toward the first positioning groove. The second positioning structure includes a second positioning groove, a second elastic element, and a second positioning surface. The second positioning groove extends horizontally and vertically. The second positioning surface is arranged in a flat plane and perpendicular to the horizontal plane. The second positioning surface is located on the horizontal side of the second positioning groove. The second elastic element is used to apply a second elastic holding force toward the second positioning surface. The first positioning structure includes a first deformation groove, the first elastic element is disposed in the first deformation groove, the first elastic element is arranged in the form of a first elastic arm, and the first elastic arm extends in the horizontal direction. The second positioning structure includes a second deformation groove, the second elastic element is disposed in the second deformation groove, the second elastic element is arranged as a second elastic arm, and the second elastic arm extends in the horizontal direction; The fiber array module includes a second mounting base and a fiber array, wherein the fiber array is disposed on the second mounting base; The second mounting base is provided with a second mating plane, which is arranged along a horizontal plane. A first mating structure and a second mating structure are provided on the second mating plane. The first mating structure extends along the vertical direction and is provided with a first mating arc surface. The second mating structure extends along the vertical direction and is provided with a second mating arc surface. The light from the fiber array is emitted vertically toward the second docking plane; When the photonic integration module is connected to the fiber array module, the first docking plane docks with the second docking plane. The first mating arc surface is located in the first positioning groove and adjacent to the two first positioning surfaces. The first elastic member elastically abuts against the first mating structure and applies the first elastic holding force to the first mating structure. The second mating arc surface is located in the second positioning groove and adjacent to the second positioning surface; the second elastic member elastically abuts against the second mating structure and applies the second elastic holding force to the second mating structure. The light from the fiber optic array is incident on the silicon photonic chip after passing through the first lens array.

2. The co-packaged optical device according to claim 1, characterized in that: The first fixed end of the first elastic arm is connected to the first mounting base, and the first abutting end of the first elastic arm is used to apply the first elastic holding force toward the first positioning groove.

3. The co-packaged optical device according to claim 2, characterized in that: The first fixed ends of the first elastic arm at both ends in the horizontal direction are connected to the first mounting base, and the first abutting end is located between the two first fixed ends.

4. The co-packaged optical device according to claim 1, characterized in that: The second fixed end of the second elastic arm is connected to the first mounting base, and the second abutting end of the second elastic arm is used to apply the second elastic holding force toward the second positioning groove.

5. The co-packaged optical device according to claim 4, characterized in that: The second fixed ends of the second elastic arm at both ends in the horizontal direction are connected to the first mounting base, and the second abutting end is located between the two second fixed ends.

6. The co-packaged optical device according to claim 1, characterized in that: The direction of the second elastic holding force is perpendicular to the second positioning surface.

7. The co-packaged optical device according to claim 1, characterized in that: The direction of the first elastic holding force is arranged at an acute angle to the first positioning surface.

8. The co-packaged optical device according to claim 1, characterized in that: The direction of the first elastic holding force is the same as the direction of the second elastic holding force.

9. The co-packaged optical device according to claim 8, characterized in that: The direction of the first elastic holding force is perpendicular to the second positioning surface.

10. The co-packaged optical device according to claim 1, characterized in that: The first positioning structure and the second positioning structure are located on both sides of the first lens array in the horizontal direction.

11. The co-packaged optical device according to any one of claims 1 to 10, characterized in that: The first mating plane has a lens mounting groove extending vertically through it, the first lens array is disposed within the lens mounting groove, and the silicon photonic chip is located on the back side of the first mating plane.

12. The co-packaged optical device according to claim 11, characterized in that: The first mounting base has a chip mounting slot on the back side of the first mating plane. The chip mounting slot is connected to the lens mounting slot, and the silicon photonic chip is disposed in the chip mounting slot.

13. The co-packaged optical device according to claim 12, characterized in that: A support block is provided on the back side of the first mating plane, and the chip mounting slot extends horizontally through the support block. The first positioning structure and the second positioning structure are located on both sides of the chip mounting slot, respectively.

14. The co-packaged optical device according to claim 13, characterized in that: The first lens array is provided with a plurality of coupling lenses, which are arranged along the Y-axis. The chip mounting slot extends along the X-axis. The first mounting base is provided with clearance slots on both sides of the back side of the first mating plane based on the Y-axis. The clearance slots are connected to the chip mounting slot. The first positioning structure and the second positioning structure are respectively located at one of the clearance slots. The first positioning slot extends vertically and is connected to one of the clearance slots. The second positioning slot extends vertically and is connected to the other clearance slot.

15. The co-packaged optical device according to claim 1, characterized in that: The first mating structure is arranged in the form of a first cylinder, which extends vertically based on the second mating plane, and the first mating arc surface is located on the radial outer peripheral wall of the first cylinder.

16. The co-packaged optical device according to claim 15, characterized in that: The first cylinder has a first guide arc surface at its axial end.

17. The co-packaged optical device according to claim 1, characterized in that: The second mating structure is arranged in the form of a second cylinder, which extends vertically based on the second mating plane, and the second mating arc surface is located on the radial outer peripheral wall of the second cylinder.

18. The co-packaged optical device according to claim 17, characterized in that: The second cylinder has a second guide arc surface at its axial end.

19. The co-packaged optical device according to any one of claims 1, 15 to 18, characterized in that: The second docking plane has a light-transmitting groove along the vertical direction, and the optical fiber array is disposed on the back side of the second docking plane. The light from the optical fiber array passes through the light-transmitting groove along the vertical direction and exits toward the second docking plane.

20. The co-packaged optical device according to claim 19, characterized in that: The second mounting base has an optical fiber mounting groove on the back side of the second mating plane. The optical fiber mounting groove is connected to the light-transmitting groove. The optical fiber array module also includes a second lens array and a reflecting prism. The optical fiber array, the second lens array and the reflecting prism are arranged horizontally on the optical fiber mounting groove. The light from the fiber optic array passes through the second lens array and the reflecting prism, then travels vertically through the light-transmitting groove and exits toward the second docking plane.

21. The co-packaged optical device according to claim 19, characterized in that: The fiber array includes multiple optical fibers arranged along the Y-axis, and the first mating structure and the second mating structure are respectively located on both sides of the light-transmitting groove based on the Y-axis.

22. The method for manufacturing a co-packaged optical device as described in claim 1, characterized in that: The production method includes: The fiber array is pre-installed onto the second mounting base; Connect the fiber array module to the photonic integration module; The optical transmission of the fiber array module and the photonic integration module is tested, and the position of the fiber array is adjusted according to the preset insertion loss requirements. The fiber array is fixed in position on the second mounting base.

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