Optical modulation assembly, method of manufacturing, method of controlling and light control device

Abstract

The application provides a light modulation assembly, a manufacturing method and a control method thereof, and a light control device. The light modulation assembly comprises a substrate, a light modulation unit, an electrode layer, and a connecting part. The light modulation unit comprises a connecting part, a modulation subunit, and a first conductive layer. The modulation subunit comprises a second conductive layer and a semiconductor switching device on the substrate. The second conductive layer is in contact with an output end of the semiconductor switching device. The first conductive layer is located on a side of the second conductive layer away from the substrate. A normal projection of the first conductive layer on the substrate overlaps the second conductive layer. A surface of the first conductive layer away from the substrate is a light reflection surface. The connecting part is located between the first conductive layer and the substrate and in contact with the first conductive layer at a first end. The electrode layer is located on the substrate and is spaced apart from the second conductive layer. A second end of the connecting part is in contact with the electrode layer.

Description

Technical Field

[0001] This application relates to the field of optical modulation technology, and more specifically, to an optical modulation component, its manufacturing method, control method, and optical control device. Background Technology

[0002] High Dynamic Range (HDR) technology aims to improve the contrast and color gamut of display devices, making displayed images closer to what the human eye sees in natural environments, thereby improving the user's visual experience. HDR technology requires display systems to have a higher dynamic range, meaning they must simultaneously display very bright and very dark details, requiring precise light control capabilities. Current projection display systems, unable to adjust the brightness of different areas, cannot meet this requirement.

[0003] Furthermore, when performing zonal modulation of the illumination light field in traditional digital micromirror arrays, the spatial light modulator for illumination light field modulation only has two states: ON / OFF. In the OFF state, the reflective elements do not reflect light into the output optical path, thus wasting the energy of this light and reducing the optical efficiency of the system. Especially in applications requiring high brightness, the low energy utilization efficiency necessitates increasing the power of the light source, which also leads to more severe heat generation. Summary of the Invention

[0004] The main objective of this application is to provide a light modulation component, its manufacturing method, control method, and light control device, so as to at least solve the technical problem that the existing projection display system cannot adjust the brightness of different areas, resulting in poor light control capability.

[0005] To achieve the above objectives, according to one aspect of this application, an optical modulation assembly is provided, comprising: a substrate; an optical modulation unit including a connection portion, a modulation subunit, and a first conductive layer, the modulation subunit including a second conductive layer located on the substrate and a semiconductor switching device, the second conductive layer being in contact with the output terminal of the semiconductor switching device, the first conductive layer being located on the side of the second conductive layer away from the substrate, the orthographic projection of the first conductive layer on the substrate overlapping the second conductive layer, the surface of the first conductive layer away from the substrate being a light-reflecting surface, the connection portion being located between the first conductive layer and the substrate and having a first end in contact with the first conductive layer; and an electrode layer located on the substrate and spaced apart from the second conductive layer, the second end of the connection portion being in contact with the electrode layer.

[0006] Optionally, the optical modulation component includes a plurality of optical modulation units, which are arranged at intervals on the substrate.

[0007] Optionally, one of the optical modulation units includes a plurality of modulation sub-units arranged at intervals, wherein the orthographic projection of the first conductive layer on the substrate overlaps with the second conductive layer in each of the modulation sub-units.

[0008] Optionally, one first conductive layer corresponds to two modulation sub-units, and the two modulation sub-units are symmetrically distributed about the central axis of the corresponding first conductive layer.

[0009] Optionally, one first conductive layer corresponds to four modulation sub-units, the four modulation sub-units are symmetrically distributed about the central axis of the corresponding first conductive layer, and the four modulation sub-units are also symmetrically distributed about a predetermined line, the predetermined line being perpendicular to the central axis.

[0010] Optionally, the semiconductor switching device includes: an active layer located on the substrate; a source electrode located on the substrate and in contact with one side of the active layer; a drain electrode located on the substrate and in contact with one side of the active layer away from the source electrode, wherein the source electrode or the drain electrode is in contact with the second conductive layer; a gate oxide layer located on the surface of the active layer away from the substrate; and a gate electrode located on the surface of the gate oxide layer away from the substrate.

[0011] Optionally, the gate oxide layer is also located on the surface of the source electrode away from the substrate, on the side surface of the source electrode, on the surface of the drain electrode away from the substrate, on the side surface of the drain electrode, and on the side surface of the active layer.

[0012] Optionally, the optical modulation assembly further includes an insulating layer located on the surface of the substrate near the optical modulation unit and the electrode layer.

[0013] Optionally, the insulating layer is also located on the surface of the gate away from the gate oxide layer and on the sidewall of the gate.

[0014] According to another aspect of this application, a method for manufacturing the aforementioned optical modulation component is provided, comprising: providing a substrate; forming a second conductive layer, a semiconductor switching device, and an electrode layer on the substrate, wherein the second conductive layer is in contact with the output terminal of the semiconductor switching device, and the electrode layer is spaced apart from the second conductive layer; forming a connection portion on the surface of the electrode layer away from the substrate, and forming a first conductive layer on the surface of the connection portion away from the electrode layer, wherein the orthographic projection of the first conductive layer on the substrate overlaps with the second conductive layer, and the surface of the first conductive layer away from the substrate is a light-reflecting surface; the connection portion is in contact with the first conductive layer and the electrode layer respectively; a modulation subunit includes the second conductive layer and the semiconductor switching device; and an optical modulation unit includes the connection portion, the modulation subunit, and the first conductive layer.

[0015] Optionally, a second conductive layer, a semiconductor switching device, and an electrode layer are formed on the substrate, including: forming a spaced-apart second conductive layer and an active layer on the substrate; forming a source and a drain on the substrate on both sides of the active layer, the source and the drain respectively contacting the active layer, and the source or the drain also contacting the second conductive layer; sequentially forming a gate oxide layer and a gate electrode on the surface of the active layer away from the substrate to obtain the semiconductor switching device; and forming the electrode layer located on one side of the second conductive layer on the substrate.

[0016] Optionally, forming a connection portion on the surface of the electrode layer away from the substrate, and forming a first conductive layer on the surface of the connection portion away from the electrode layer, includes: forming a sacrificial layer on the exposed surface of the substrate, the second conductive layer, the semiconductor switching device, and the exposed surface of the electrode layer away from the substrate, wherein the surface of the sacrificial layer away from the substrate is planar; removing a portion of the sacrificial layer to obtain a trench that exposes the surface of the electrode layer away from the substrate; depositing a metal material in the trench and on the remaining surface of the sacrificial layer away from the substrate to form the connection portion and the first conductive layer; and removing the remaining sacrificial layer.

[0017] Optionally, before forming the spaced second conductive layer and active layer on the substrate, the method further includes: forming an insulating layer on the substrate; forming the spaced second conductive layer and active layer on the substrate includes: forming the spaced second conductive layer and active layer on the surface of the insulating layer away from the substrate.

[0018] According to another aspect of this application, a control method for the aforementioned optical modulation component is provided, comprising: obtaining a correspondence between the operating voltage of the optical modulation unit and the deflection angle of the optical reflecting surface of the optical modulation unit, wherein the deflection angle is the angle between the optical reflecting surface and a predetermined plane, and the predetermined plane is the plane where the optical reflecting surface is located when the optical modulation unit is turned off; controlling the operating voltage at least according to the correspondence, such that the optical reflecting surface is deflected, so that the deflected optical reflecting surface reflects light from a light beam to a bright area of ​​a spatial light modulator, wherein the spatial light modulator modulates the light beam into a light pattern, the light pattern including a first pattern portion and a second pattern portion, wherein the brightness of the first pattern portion is greater than the brightness of the second pattern portion, the bright area is a pixel area of ​​the first pattern portion, and the optical reflecting surface before deflection reflects the light to a dark area of ​​the spatial light modulator, wherein the dark area is the pixel area of ​​the second pattern portion.

[0019] Optionally, the optical modulation component includes a plurality of optical modulation units, the spatial light modulator includes a plurality of pixel regions, one optical modulation unit corresponds to at least one pixel region, and the operating voltage is controlled at least according to the correspondence, including: determining the optical modulation unit corresponding to the dark area as the target optical modulation unit according to the light pattern generated by the spatial light modulator; determining the deflection angle to be deflected of the target optical modulation unit, and determining the operating voltage corresponding to the deflection angle as the target operating voltage according to the deflection angle and the correspondence; controlling the target optical modulation unit to operate at the target operating voltage, and controlling the optical modulation units other than the target optical modulation unit to remain inactive.

[0020] Optionally, one of the optical modulation units includes a plurality of modulation sub-units arranged at intervals, the orthographic projection of the first conductive layer on the substrate overlaps with the second conductive layer in each of the modulation sub-units, the plurality of semiconductor switching devices in the target optical modulation unit are target semiconductor switching devices, the target operating voltage includes a plurality of sub-voltages corresponding one-to-one with the target semiconductor switching devices, and controlling the target optical modulation unit to operate at the target operating voltage includes: providing a conduction voltage to the control terminals of the plurality of target semiconductor switching devices to turn on the plurality of target semiconductor switching devices; and when the plurality of target semiconductor switching devices are turned on, providing the corresponding sub-voltage to the input terminals of the plurality of target semiconductor switching devices.

[0021] Optionally, determining the deflection angle of the target light modulation unit includes: determining the light displacement of the target light modulation unit based on the position of the bright area and the position of the dark area, wherein the light displacement is the difference between the position of the light on the spatial light modulator before the light reflecting surface is deflected and the position of the light on the spatial light modulator after the light reflecting surface is deflected; and determining the deflection angle based on the light displacement.

[0022] Optionally, the component of the light displacement in the first direction is greater than the width of the first conductive layer of the target light modulation unit in the first direction, and the component of the light displacement in the second direction is greater than the width of the first conductive layer of the target light modulation unit in the second direction, wherein the first direction is perpendicular to the second direction.

[0023] According to another aspect of this application, an optical control device is provided, comprising: any one of the optical modulation components described above; and a spatial light modulator located on a substrate of the optical modulation component.

[0024] Optionally, the optical control device further includes: an optical reflector located on the side of the spatial light modulator away from the substrate, the optical reflector being used to reflect the light emitted by the optical modulation component to the spatial light modulator.

[0025] By applying the technical solution of this application, in the light modulation component, the second conductive layer, the semiconductor switching device, and the electrode layer are located on the substrate. The second conductive layer is in contact with the output terminal of the semiconductor switching device, and the second conductive layer and the electrode layer are spaced apart. The first conductive layer is located on the side of the second conductive layer away from the substrate. The surface of the first conductive layer away from the substrate is a light-reflecting surface for reflecting light. The connecting part connects the first conductive layer and the electrode layer. The first conductive layer is powered through the electrode layer, and the voltage of the second conductive layer is controlled by the semiconductor switching device, so that an electrostatic field is formed between the first conductive layer and the second conductive layer. The presence of the electrostatic field will cause the light-reflecting surface to deflect, thereby realizing the electrostatic deflection control of the light-reflecting surface of the first conductive layer. The position of the light reflected from the light-reflecting surface to the display panel can be adjusted to achieve regional light modulation, thus solving the technical problem that the projection display system in the prior art cannot adjust the brightness of different areas, resulting in poor light control capability. Attached Figure Description

[0026] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0027] Figure 1 A schematic diagram of the structure of an optical modulation component provided in an embodiment of this application is shown;

[0028] Figure 2 A schematic diagram of another optical modulation component provided in an embodiment of this application is shown;

[0029] Figure 3 It shows Figure 2 A top-down view;

[0030] Figure 4 A schematic diagram of the structure of another optical modulation component provided in an embodiment of this application is shown;

[0031] Figure 5 It shows Figure 4 A top-down view;

[0032] Figure 6 A schematic flowchart illustrating a method for fabricating an optical modulation component according to an embodiment of this application is shown.

[0033] Figures 7 to 13A schematic diagram of the structure obtained after each process step in the fabrication method of the optical modulation component according to this application is shown;

[0034] Figure 14 A flowchart illustrating a control method for an optical modulation component according to an embodiment of this application is shown.

[0035] Figure 15 A schematic diagram of an existing light pattern is shown;

[0036] Figure 16 A schematic diagram of the light pattern modulated using the control method of the light modulation component of this application is shown;

[0037] Figure 17 A schematic diagram of the structure of a light control device according to an embodiment of this application is shown;

[0038] Figure 18 A schematic diagram of the structure of an optical modulation component in an optical control device after deflection is shown according to an embodiment of this application;

[0039] Figure 19 A schematic diagram of an optical modulation component array and a spatial optical modulator arrangement according to an embodiment of this application is shown;

[0040] Figure 20 A schematic diagram illustrating the relationship between the duty cycle of a display image and the brightness gain factor according to an embodiment of this application is shown.

[0041] Figure 21 A schematic diagram showing the correspondence between the spacing between an optical modulation component and an optical reflection device and the displacement of an illumination zone, according to an embodiment of this application, is provided.

[0042] The above figures include the following reference numerals:

[0043] 10. Substrate; 11. Optical modulation unit; 12. Connector; 13. Modulation subunit; 14. First conductive layer; 15. Second conductive layer; 16. Semiconductor switching device; 161. Active layer; 162. Source; 163. Drain; 164. Gate oxide layer; 165. Gate; 17. Electrode layer; 18. Insulating layer; 19. Sacrificial layer; 20. Trench; 21. Optical modulation component; 22. Spatial light modulator; 23. Optical reflector; 24. Optical modulation component array. Detailed Implementation

[0044] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0045] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0046] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0047] As described in the background section, existing projection display systems cannot adjust the brightness of different areas, resulting in poor light control capabilities. To solve the above-mentioned technical problems, embodiments of this application provide a light modulation component, its manufacturing method, control method, and light control device.

[0048] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0049] This application provides an optical modulation component, such as Figure 1 As shown, the optical modulation component includes:

[0050] substrate 10;

[0051] The optical modulation unit 11 includes a connection portion 12, a modulation subunit 13, and a first conductive layer 14. The modulation subunit 13 includes a second conductive layer 15 located on the substrate 10 and a semiconductor switching device 16. The second conductive layer 15 is in contact with the output terminal of the semiconductor switching device 16. The first conductive layer 14 is located on the side of the second conductive layer 15 away from the substrate 10. The orthographic projection of the first conductive layer 14 on the substrate 10 overlaps with the second conductive layer 15. The surface of the first conductive layer 14 away from the substrate 10 is a light-reflecting surface. The connection portion 12 is located between the first conductive layer 14 and the substrate 10, and its first end is in contact with the first conductive layer 14.

[0052] An electrode layer 17 is located on the substrate 10 and is spaced apart from the second conductive layer 15. The second end of the connection portion 12 is in contact with the electrode layer 17.

[0053] Specifically, the electrode layer 17 and the second conductive layer 15 are spaced apart on the substrate 10. The connecting portion 12 extends along the stacking direction of the substrate 10 and the modulation sub-unit 13. The connecting portion 12 has a first end and a second end along the extending direction. The first end is connected to the first conductive layer 14, and the second end is connected to the electrode layer 17, that is, the electrical connection between the electrode layer 17 and the first conductive layer 14 is achieved through the connecting portion 12. There is a gap between the first conductive layer 14 and the modulation sub-unit 13. Except for the area in contact with the connecting portion 12, the other areas of the first conductive layer 14 are in a suspended state.

[0054] In the aforementioned embodiment, the second conductive layer, semiconductor switching device, and electrode layer are located on the substrate in the light modulation component. The second conductive layer is in contact with the output terminal of the semiconductor switching device, and the second conductive layer and the electrode layer are spaced apart. The first conductive layer is located on the side of the second conductive layer away from the substrate, and the surface of the first conductive layer away from the substrate is a light-reflecting surface for reflecting light. The connecting part connects the first conductive layer and the electrode layer, and the first conductive layer is powered through the electrode layer. The voltage of the second conductive layer is controlled by the semiconductor switching device, so that an electrostatic field is formed between the first conductive layer and the second conductive layer. The presence of the electrostatic field causes the light-reflecting surface to deflect, thereby realizing the electrostatic deflection control of the light-reflecting surface of the first conductive layer. The position of the light reflected from the light-reflecting surface to the display panel can be adjusted to achieve regional light modulation, thus solving the technical problem in the prior art that the projection display system cannot adjust the brightness of different areas, resulting in poor light control capability.

[0055] In specific applications, the electrode layer 17 may be located on the side of the second conductive layer 15 away from the semiconductor switching device 16; the electrode layer 17 may also be located on the side of the semiconductor switching device 16 away from the second conductive layer 15.

[0056] In the embodiments of this application, such as Figure 2 and Figure 3 As shown, the optical modulation component includes a plurality of optical modulation units 11, which are arranged at intervals on the substrate 10. In this embodiment, by setting a plurality of optical modulation units, each optical modulation unit corresponds to an area to be adjusted, and each optical modulation unit can deflect a light reflecting surface, thereby enabling individual brightness control of the area corresponding to each optical modulation unit.

[0057] Furthermore, in the optical modulation assembly, the second ends of the connection portions 12 of the plurality of optical modulation units 11 are all in contact with the electrode layer 17.

[0058] Specifically, the optical modulation unit 11 may include only one modulation subunit 13 or multiple modulation subunits 13.

[0059] In one alternative, such as Figure 4 and Figure 5 As shown, one of the optical modulation units 11 includes multiple modulation sub-units 13 arranged at intervals. The orthographic projection of the first conductive layer 14 on the substrate 10 overlaps with the second conductive layer 15 in each of the modulation sub-units 13. The orthographic projection of the first conductive layer on the substrate overlaps with the multiple second conductive layers. By controlling the voltage of the multiple second conductive layers through semiconductor switching devices in the multiple modulation sub-units, the multiple second conductive layers can jointly drive the deflection of a first conductive layer, giving the light reflecting surface a degree of deflection freedom, thereby enabling precise control of the light reflection angle of the light reflecting surface.

[0060] In some exemplary embodiments, one first conductive layer corresponds to two modulation sub-units, and the two modulation sub-units are symmetrically distributed about the central axis of the corresponding first conductive layer. That is, the orthographic projection of the first conductive layer on the substrate overlaps with the two modulation sub-units, and the first conductive layer is deflected by the two modulation sub-units together. For example, when one of the two modulation sub-units exerts a pushing force on the first conductive layer, the other of the two modulation sub-units exerts a pulling force on the first conductive layer, thereby achieving the deflection of the first conductive layer.

[0061] In other exemplary embodiments, one first conductive layer corresponds to four modulation sub-units. The four modulation sub-units are symmetrically distributed about the central axis (X-axis) of the corresponding first conductive layer, and also symmetrically distributed about a predetermined line (Y-axis), which is perpendicular to the central axis. That is, the orthographic projection of the first conductive layer on the substrate overlaps with the four modulation sub-units. By using the four modulation sub-units to jointly drive the deflection of the first conductive layer, deflection control of the first conductive layer can be achieved in both the X and Y directions. Two modulation sub-units drive the first conductive layer in each of the X and Y directions, giving the first conductive layer deflection degrees of freedom in both the X and Y directions.

[0062] In addition to the embodiments described above, one first conductive layer may correspond to other numbers of the modulation sub-units. When the optical modulation unit includes at least four modulation sub-units 13 arranged in a matrix, the optical modulation unit has deflection degrees of freedom in two orthogonal directions, the X and Y axes, allowing for precise adjustment of the light direction in these two directions to achieve the desired optical modulation effect.

[0063] Specifically, the plurality of optical modulation units 11 may satisfy the following conditions: each optical modulation unit 11 includes only one modulation subunit 13; or each optical modulation unit 11 includes multiple modulation subunits 13; or some of the optical modulation units 11 include only one modulation subunit 13, while the remaining optical modulation units 11 include multiple modulation subunits 13.

[0064] In practical applications, the semiconductor switching device can be any suitable semiconductor transistor, such as a thin-film transistor (TFT) and a diode.

[0065] In some exemplary embodiments, such as Figure 1 As shown, the semiconductor switching device 16 includes: an active layer 161 located on the substrate 10; a source 162 located on the substrate 10 and in contact with one side of the active layer 161; a drain 163 located on the substrate 10 and in contact with one side of the active layer 161 away from the source 162, wherein the source 162 or the drain 163 is in contact with the second conductive layer 15; a gate oxide layer 164 located on the surface of the active layer 161 away from the substrate 10; and a gate 165 located on the surface of the gate oxide layer 164 away from the substrate 10. In this embodiment, LCD-TFT technology and materials are used to set thin-film transistors as semiconductor devices on the substrate, so that the output terminal of the thin-film transistor is in contact with the second conductive layer. By applying a voltage to the input terminal of the thin-film transistor, the second conductive layer is charged with different magnitudes of voltage. In conjunction with providing voltage to the electrode layer, electrostatic fields of different magnitudes can be formed between the first conductive layer and the second conductive layer, thereby enabling the first conductive layer to achieve different degrees of deflection, and further ensuring that the light-reflecting surface reflects light to different positions of the display panel.

[0066] Specifically, the gate is used to control the switching state of the thin-film transistor, and the source and drain are used to transmit current.

[0067] Furthermore, the source electrode 162 may also be located on a portion of the active layer 161 away from the substrate 10, and the drain electrode 163 may also be located on a portion of the active layer 161 away from the substrate 10; the gate oxide layer 164 is located between the source electrode 162 and the drain electrode 163 to prevent the source electrode 162 and the drain electrode 163 from contacting each other.

[0068] In practical applications, the gate oxide layer 164 can also be located on the surface of the source electrode 162 away from the substrate 10, on the side of the source electrode, on the surface of the drain electrode 163 away from the substrate 10, on the side of the drain electrode 163, and on the side of the active layer 161.

[0069] like Figure 1 As shown, the optical modulation assembly further includes an insulating layer 18 located on the surface of the substrate 10 near the optical modulation unit 11 and the electrode layer 17. The insulating layer provides electrical isolation and also offers some mechanical support.

[0070] For example, such as Figure 1 As shown, the insulating layer 18 is also located on the surface of the gate 165 away from the gate oxide layer 164 and on the side surface of the gate 165. The insulating layer covers the gate and can protect the gate.

[0071] In this application, such as Figure 1 As shown, the insulating layer 18 can also be located on the exposed surface of the semiconductor switching device 16, that is, the insulating layer 18 covers the sidewalls of the source 162, the drain 163, the gate 165 and the gate oxide layer 164 and the surface away from the substrate 10. The insulating layer can protect the semiconductor switching device and prevent the semiconductor switching device from being interfered with and contaminated by external factors.

[0072] Those skilled in the art can choose any suitable material as the material for each structural layer. For example, the materials for the insulating layer and the gate oxide layer include, but are not limited to, silicon nitride and silicon oxide. The active layer includes, but is not limited to, semiconductor conductive materials such as amorphous silicon and polycrystalline silicon. The materials for the gate, source, drain, connection portion, first conductive layer, and second conductive layer include, but are not limited to, metallic materials such as aluminum, molybdenum, and their alloys. The electrode layer includes, but is not limited to, metallic materials such as indium tin oxide. Those skilled in the art can choose any suitable material as the substrate material for this application according to actual device requirements, such as a silicon substrate, silicon carbide substrate, silicon-germanium substrate, SOI substrate, or GOI substrate.

[0073] This application also provides a method for manufacturing the aforementioned optical modulation component. Figure 6 This is a flowchart illustrating a method for manufacturing an optical modulation component according to an embodiment of this application. Figures 6 to 13 as well as Figure 1 As shown, the method includes the following steps:

[0074] Step S201, as follows Figure 7 As shown, a substrate 10 is provided;

[0075] Step S202, as follows Figure 11As shown, a second conductive layer 15, a semiconductor switching device 16, and an electrode layer 17 are formed on the substrate 10. The second conductive layer 15 is in contact with the output terminal of the semiconductor switching device 16, and the electrode layer 17 is spaced apart from the second conductive layer 15.

[0076] Step S203, as follows Figure 1 As shown, a connection portion 12 is formed on the surface of the electrode layer 17 away from the substrate 10, and a first conductive layer 14 is formed on the surface of the connection portion 12 away from the electrode layer 17. The orthographic projection of the first conductive layer 14 on the substrate 10 overlaps with the second conductive layer 15. The surface of the first conductive layer 14 away from the substrate 10 is a light-reflecting surface. The connection portion 12 is in contact with the first conductive layer 14 and the electrode layer 17, respectively. The modulation subunit 13 includes the second conductive layer 15 and the semiconductor switching device 16. The optical modulation unit 11 includes the connection portion 12, the modulation subunit 13, and the first conductive layer 14.

[0077] Specifically, the electrode layer 17 and the second conductive layer 15 are spaced apart on the substrate 10. The connecting portion 12 extends along the stacking direction of the substrate 10 and the modulation sub-unit 13. The connecting portion 12 has a first end and a second end along the extending direction. The first end is connected to the first conductive layer 14, and the second end is connected to the electrode layer 17, that is, the electrical connection between the electrode layer 17 and the first conductive layer 14 is achieved through the connecting portion 12. There is a gap between the first conductive layer 14 and the modulation sub-unit 13. Except for the area in contact with the connecting portion 12, the other areas of the first conductive layer 14 are in a suspended state.

[0078] In the above embodiment, a substrate is first provided, and then a second conductive layer, a semiconductor switching device, and an electrode layer are formed on the substrate, such that the second conductive layer is in contact with the output terminal of the semiconductor switching device, and the second conductive layer and the electrode layer are spaced apart. Finally, a connection portion is formed on the surface of the electrode layer away from the substrate, and a first conductive layer is formed on the surface of the connection portion away from the electrode layer. The surface of the first conductive layer away from the substrate is a light-reflecting surface for reflecting light. Power is supplied to the first conductive layer through the electrode layer, and the voltage of the second conductive layer is controlled by the semiconductor switching device, so that an electrostatic field is formed between the first conductive layer and the second conductive layer. The presence of the electrostatic field causes the light-reflecting surface to deflect, realizing electrostatic deflection control of the light-reflecting surface of the first conductive layer. The position of the light reflected from the light-reflecting surface to the display panel can be adjusted to achieve regional light modulation, thereby solving the technical problem that the projection display system in the prior art cannot adjust the brightness of different areas, resulting in poor light control capability.

[0079] In one alternative embodiment, step S202: forming a second conductive layer 15, a semiconductor switching device 16, and an electrode layer 17 on the substrate 10, including: Figure 8 and Figure 9 As shown, a second conductive layer 15 and an active layer 161 are formed spaced apart on the substrate 10; as Figure 10 As shown, a source electrode 162 and a drain electrode 163 are formed on the substrate 10 on both sides of the active layer 161, respectively. The source electrode 162 and the drain electrode 163 are in contact with the active layer 161, and the source electrode 162 or the drain electrode 163 is also in contact with the second conductive layer 15; Figure 11 As shown, a gate oxide layer 164 and a gate electrode 165 are sequentially formed on the surface of the active layer 161 away from the substrate 10 to obtain the semiconductor switching device 16; an electrode layer 17 is formed on the substrate 10 on one side of the second conductive layer 15. In this embodiment, the second conductive layer, the semiconductor switching device, and the electrode layer are formed on the substrate using an LCD-TFT manufacturing process, making it compatible with current LCD-TFT technology. This process effectively utilizes standard materials and structures in LCD-TFT technology, reducing costs and improving manufacturing efficiency.

[0080] Specifically, step S203 involves forming a connection portion 12 on the surface of the electrode layer 17 away from the substrate 10, and forming a first conductive layer 14 on the surface of the connection portion 12 away from the electrode layer 17, including: Figure 11 and Figure 12 As shown, a sacrificial layer 19 is formed on the exposed surface of the substrate 10, the second conductive layer 15, the semiconductor switching device 16, and the exposed surface of the electrode layer 17 away from the substrate 10. The surface of the sacrificial layer 19 away from the substrate 10 is planar. Removing a portion of the sacrificial layer 19 yields a trench 20 that exposes the surface of the electrode layer 17 away from the substrate 10. Figure 13 As shown, metal material is deposited in the trench 20 and on the surface of the remaining sacrificial layer 19 away from the substrate 10 to form the connection portion 12 and the first conductive layer 14. The metal material in the trench forms the connection portion 12, and the metal material on the surface of the remaining sacrificial layer 19 away from the substrate forms the first conductive layer 14. The remaining sacrificial layer 19 is removed to obtain... Figure 1The structure is shown. In this embodiment, a sacrificial layer is first formed on a substrate on which a second conductive layer, a semiconductor switching device, and an electrode layer are formed, such that the surface of the sacrificial layer away from the substrate is planar. Then, by removing part of the sacrificial layer, a trench is formed that exposes the electrode layer. Next, a metal material is formed on the surface of the trench and the remaining sacrificial layer away from the substrate to obtain the connection portion and the first conductive layer. Finally, the remaining sacrificial layer is removed, so that a gap is formed between the first conductive layer and the second conductive layer. The manufacturing process is relatively mature and can further ensure a high yield and high manufacturing efficiency of the optical modulation component.

[0081] Specifically, the material of the sacrificial layer can be photoresist. The thickness of the sacrificial layer can control the distance between the first conductive layer and the second conductive layer.

[0082] Optionally, before forming the spaced second conductive layer 15 and active layer 161 on the substrate 10, the method further includes: Figure 7 As shown, an insulating layer 18 is formed on the substrate 10; a second conductive layer 15 and an active layer 161 spaced apart are formed on the substrate 10, including: the second conductive layer 15 and the active layer 161 spaced apart are formed on the surface of the insulating layer 18 away from the substrate 10. The insulating layer provides electrical isolation and also provides some mechanical support.

[0083] Furthermore, before forming the sacrificial layer 19 on the exposed surfaces of the substrate 10, the second conductive layer 15, the semiconductor switching device 16, and the electrode layer 17 away from the substrate 10, the method further includes: depositing an insulating dielectric material on the exposed surfaces of the gate 165, the gate oxide layer 164, the source 162, and the drain 163; forming the sacrificial layer 19 on the exposed surfaces of the substrate 10, the second conductive layer 15, the semiconductor switching device 16, and the electrode layer 17 away from the substrate 10 includes: forming the sacrificial layer 19 on the exposed surfaces of the substrate 10, the exposed surfaces of the insulating dielectric material, and the exposed surfaces of the electrode layer 17 away from the substrate 10. The insulating dielectric material can protect the semiconductor switching device from external interference and contamination.

[0084] The insulating dielectric material and the insulating layer located on the substrate together constitute the insulating layer of the optical modulation component.

[0085] According to some alternative solutions, a second conductive layer 15, a semiconductor switching device 16, and an electrode layer 17 are formed on the substrate 10. This includes: forming the electrode layer 17, a plurality of second conductive layers 15, and a plurality of semiconductor switching devices 16 on the substrate 10 to obtain a plurality of modulation sub-units 13; forming a connection portion 12 on the surface of the electrode layer 17 away from the substrate 10, and forming a first conductive layer 14 on the surface of the connection portion 12 away from the electrode layer 17, such that the orthographic projection of the first conductive layer 14 on the substrate 10 overlaps with the plurality of second conductive layers 15. Since the orthographic projection of the first conductive layer on the substrate overlaps with the plurality of second conductive layers, the voltage of the plurality of second conductive layers can be controlled by the semiconductor switching devices in the plurality of modulation sub-units. This allows the plurality of second conductive layers to jointly drive the deflection of a first conductive layer, giving the light-reflecting surface a degree of deflection freedom, thereby enabling fine control of the light reflection angle of the light-reflecting surface.

[0086] In some exemplary embodiments, one first conductive layer corresponds to two modulation sub-units, and the two modulation sub-units are symmetrically distributed about the central axis of the corresponding first conductive layer. That is, the orthographic projection of the first conductive layer on the substrate overlaps with the two modulation sub-units, and the first conductive layer is deflected by the two modulation sub-units together. For example, when one of the two modulation sub-units exerts a pushing force on the first conductive layer, the other of the two modulation sub-units exerts a pulling force on the first conductive layer, thereby achieving the deflection of the first conductive layer.

[0087] In other exemplary embodiments, one first conductive layer corresponds to four modulation sub-units. The four modulation sub-units are symmetrically distributed about the central axis (X-axis) of the corresponding first conductive layer, and also symmetrically distributed about a predetermined line (Y-axis), which is perpendicular to the central axis. That is, the orthographic projection of the first conductive layer on the substrate overlaps with the four modulation sub-units. By using the four modulation sub-units to jointly drive the deflection of the first conductive layer, deflection control of the first conductive layer can be achieved in both the X and Y directions. Two modulation sub-units drive the first conductive layer in each of the X and Y directions, giving the first conductive layer deflection degrees of freedom in both the X and Y directions.

[0088] In some embodiments, a second conductive layer 15, semiconductor switching devices 16, and an electrode layer 17 are formed on the substrate 10. This includes forming the electrode layer 17, multiple second conductive layers 15, and multiple semiconductor switching devices 16 on the substrate 10, with the output terminals of the semiconductor switching devices 16 correspondingly contacting the second conductive layers 15 to obtain multiple modulation sub-units 13. A connection portion 12 is formed on the surface of the electrode layer 17 away from the substrate 10, and a first conductive layer 14 is formed on the surface of the connection portion 12 away from the electrode layer 17. This includes forming multiple spaced connection portions 12 on the surface of the electrode layer 17 away from the substrate 10, and forming multiple first conductive layers 14 correspondingly on the surface of the connection portion 12 away from the electrode layer 17 to obtain multiple optical modulation units 11. In this embodiment, by setting multiple optical modulation units, each optical modulation unit corresponds to the area to be adjusted, and each optical modulation unit can achieve the deflection of a light reflecting surface, thereby realizing individual brightness control of the area corresponding to each optical modulation unit.

[0089] Specifically, the plurality of optical modulation units 11 may satisfy the following conditions: each optical modulation unit 11 includes only one modulation subunit 13; or each optical modulation unit 11 includes multiple modulation subunits 13; or some of the optical modulation units 11 include only one modulation subunit 13, while the remaining optical modulation units 11 include multiple modulation subunits 13.

[0090] This embodiment provides a control method for an optical modulation component that runs on a mobile terminal, computer terminal, or similar computing device. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0091] Figure 14 This is a flowchart of a control method for an optical modulation assembly according to an embodiment of this application. Figure 14 As shown, the method includes the following steps:

[0092] Step S301: Obtain the correspondence between the operating voltage of the optical modulation unit and the deflection angle of the optical reflecting surface of the optical modulation unit, wherein the deflection angle is the angle between the optical reflecting surface and a predetermined plane, and the predetermined plane is the plane where the optical reflecting surface is located when the optical modulation unit is turned off.

[0093] Specifically, the operating voltage of the optical modulation unit is the input voltage of the semiconductor switching device in the optical modulation unit. When the optical modulation unit is turned off, the semiconductor switching device in the optical modulation unit is in the off state, the second conductive layer is not charged, there is no electrostatic field between the first conductive layer and the second conductive layer, and the first conductive layer does not undergo electrostatic deflection. Therefore, the predetermined plane is the light reflecting surface when the first conductive layer does not undergo electrostatic deflection.

[0094] Step S302: At least according to the correspondence, control the operating voltage to deflect the light reflecting surface so that the deflected light reflecting surface reflects the light in the beam to the bright area of ​​the spatial light modulator. The spatial light modulator is used to modulate the beam into a light pattern, the light pattern including a first pattern portion and a second pattern portion. The brightness of the first pattern portion is greater than the brightness of the second pattern portion. The bright area is the pixel area of ​​the first pattern portion. The light reflecting surface before deflection reflects the light to the dark area of ​​the spatial light modulator. The dark area is the pixel area of ​​the second pattern portion.

[0095] Through the above embodiment, the correspondence between the operating voltage of the light modulation unit and the deflection angle of the light reflecting surface of the light modulation unit is first obtained; then, based at least on this correspondence, the operating voltage of the light modulation unit is controlled to deflect the light reflecting surface, thereby adjusting the position of the light reflected from the light reflecting surface to the display panel. The deflected light reflecting surface can distribute the light in the beam from the dark area of ​​the spatial light modulator to the bright area of ​​the spatial light modulator, so that compared with before deflection, the brightness of the bright area is higher and the brightness of the dark area is lower, ensuring a better display effect of the light pattern and realizing high-quality HDR display.

[0096] like Figure 15 and Figure 16 As shown, the pixel area constituting the "G" shape is a bright area, and the other areas are dark areas. Through the control method described in this application, the... Figure 15 At least some of the light from the dark areas is distributed to the bright areas, thus making the bright areas brighter and the dark areas darker.

[0097] In one optional embodiment, the optical modulation component includes a plurality of optical modulation units, the spatial light modulator includes a plurality of pixel regions, one optical modulation unit corresponds to at least one pixel region, and the operating voltage is controlled at least according to the correspondence, including: determining the optical modulation unit corresponding to the dark area as a target optical modulation unit based on the light pattern generated by the spatial light modulator; determining the deflection angle to be deflected by the target optical modulation unit, and determining the operating voltage corresponding to the deflection angle as a target operating voltage based on the deflection angle and the correspondence; controlling the target optical modulation unit to operate at the target operating voltage, and controlling the optical modulation units other than the target optical modulation unit to remain inactive.

[0098] In the aforementioned embodiment, the target light modulation unit corresponding to the dark area is determined based on the light pattern. Then, the operating voltage of the target light modulation unit is determined based on the deflection angle and corresponding relationship of the target light modulation unit. The target light modulation unit is controlled to operate at this operating voltage, so that the light reflecting surface corresponding to the target light modulation unit is deflected, reflecting the light from the dark area to the bright area. At the same time, other light modulation units are controlled not to operate, so that the light reflecting surfaces corresponding to other light modulation units are not deflected, thereby allowing the light reflecting surfaces to reflect the light back to their original positions. That is, the light in other pixel areas remains unchanged, and only the light in the dark area is allocated to the bright area. This further ensures that the bright areas of the light pattern modulated by the light modulation component are brighter and the dark areas are darker, further ensuring a higher contrast of the light pattern.

[0099] Specifically, one of the optical modulation units includes multiple modulation sub-units arranged at intervals. The orthographic projection of the first conductive layer on the substrate overlaps with the second conductive layer in each of the modulation sub-units. The multiple semiconductor switching devices in the target optical modulation unit are target semiconductor switching devices. The target operating voltage includes multiple sub-voltages corresponding one-to-one with the target semiconductor switching devices. Controlling the target optical modulation unit to operate at the target operating voltage includes: providing a conduction voltage to the control terminals of the multiple target semiconductor switching devices, causing the multiple target semiconductor switching devices to conduct; and, when the multiple target semiconductor switching devices are conducting, providing the corresponding sub-voltages to the input terminals of the multiple target semiconductor switching devices. In this embodiment, controlling the semiconductor switching devices in the target optical modulation unit to conduct and providing corresponding sub-voltages to their input terminals to control the voltage of the multiple second conductive layers can achieve deflection control of the first conductive layer.

[0100] To further ensure modulation accuracy, optionally, determining the deflection angle of the target light modulation unit includes: determining the light displacement of the target light modulation unit based on the positions of the bright area and the dark area, wherein the light displacement is the difference between the position of the light on the spatial light modulator before the light reflecting surface is deflected and the position of the light on the spatial light modulator after the light reflecting surface is deflected; and determining the deflection angle based on the light displacement. In this embodiment, the difference between the positions of the light on the spatial light modulator before and after the deflection is determined based on the positions of the bright and dark areas, thereby determining the deflection angle, ensuring that the deflection angle is relatively accurate, and further ensuring that the light position adjustment based on the deflection angle is relatively accurate.

[0101] Specifically, such as Figure 18 As shown, the component Δ of the light displacement in the first direction is greater than the width of the first conductive layer of the target light modulation unit in the first direction, and the component of the light displacement in the second direction is greater than the width of the first conductive layer of the target light modulation unit in the second direction. The first direction is perpendicular to the second direction. In other words, the adjustable range of the light is at least greater than the size of a light reflecting surface, ensuring that the reflected light can be adjusted from one area to another, and guaranteeing that the light modulation component has a sufficient range for light adjustment.

[0102] It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0103] According to another aspect of this application, a light control device is provided, such as... Figure 17 As shown, the optical control device includes:

[0104] Any of the aforementioned optical modulation components 21;

[0105] Specifically, the optical modulation component is used to reflect the light beam emitted by the light source to the spatial light modulator;

[0106] Spatial light modulator 22, which is located on the substrate of the light modulation component 21.

[0107] Specifically, the spatial light modulator is used to modulate the light beam into a light pattern and project it onto a projection screen.

[0108] In the embodiment described, the light control device includes a light modulation component and a spatial light modulator. The second conductive layer, semiconductor switching device, and electrode layer of the light modulation component are located on the substrate. The second conductive layer is in contact with the output terminal of the semiconductor switching device. The second conductive layer and the electrode layer are spaced apart. The first conductive layer is located on the side of the second conductive layer away from the substrate. The surface of the first conductive layer away from the substrate is a light reflecting surface for reflecting light. The connecting part connects the first conductive layer and the electrode layer. Power is supplied to the first conductive layer through the electrode layer. The voltage of the second conductive layer is controlled by the semiconductor switching device, so that an electrostatic field is formed between the first conductive layer and the second conductive layer. The presence of the electrostatic field causes the light reflecting surface to deflect, thereby realizing the electrostatic deflection control of the light reflecting surface of the first conductive layer. The position of the light reflected from the light reflecting surface to the display panel can be adjusted to achieve regional light modulation, thus solving the technical problem that the projection display system in the prior art cannot adjust the brightness of different areas, resulting in poor light control capability.

[0109] Optionally, such as Figure 17 As shown, the optical control device further includes a light reflecting device 23, located on the side of the spatial light modulator 22 away from the substrate. The light reflecting device 23 is used to reflect the light emitted by the light modulation component 21 to the spatial light modulator 22. By changing the path of the light through the light reflecting device, the light emitted by the light modulation component can reach the spatial light modulator after reflection, achieving effects such as optical path folding and beam shaping.

[0110] Furthermore, the spatial light modulator may include multiple pixel arrays, which may be transmissive / reflective displays (LCDs or LCoSs). These pixels can switch between ON and OFF states in multiple levels to achieve multi-level transmittance / reflectance (i.e., grayscale) modulation, thereby reconstructing the displayed image.

[0111] In some embodiments, a film structure, including an insulating layer and a semiconductor layer, is first stacked on a substrate to form a film common to both the spatial light modulator and the optical modulation component. Then, a TFT-LCD is formed on the stacked film structure using different processes to obtain the spatial light modulator, and an optical modulation unit and electrode layer are formed to obtain the optical modulation component. This achieves the integration of the spatial light modulator and the optical modulation component onto the same substrate.

[0112] The light source can generate multi-band light required for projection display and is suitable for white light, laser light, or LED light.

[0113] The optical control device further includes a driver for executing the control method of the optical modulation component.

[0114] like Figure 19As shown, the optical control device includes a plurality of optical modulation components 21, which are arranged in an array to form an optical modulation component array 24, such as... Figure 19 As shown in (a), the optical modulation component array 24 can be located on one side of the spatial optical modulator 22, such as Figure 19 As shown in (b), the optical modulation component array 24 can also be located on both sides of the spatial optical modulator 22, such as... Figure 19 As shown in (c), the optical modulation component array 24 can also be located around the spatial optical modulator 22.

[0115] The specific working steps of the optical control equipment are as follows:

[0116] 1) Real-time video data processing: Calculate the content of the displayed screen and generate a sequence of control signals for the optical modulation component array at the frame rate;

[0117] 2) Dynamic illumination light field modulation of the light modulation component array: Generate a coarse illumination partition pattern, apply a control signal sequence to the light modulation component array, drive it to redistribute the reflected light on the spatial light modulator, redistribute the light from the dark area of ​​the video frame to the bright area, that is, redistribute the light of one or more first areas (dark area) of the video frame to one or more second areas (bright area), making one or more second areas brighter than one or more first areas, improving the utilization efficiency of illumination light, thereby projecting video data under high dynamic range (HDR);

[0118] 3) Amplitude modulation: The redistributed illumination field is then subjected to pixel-level light intensity modulation via a spatial light modulator;

[0119] 4) Projection: Amplitude-modulated light is projected onto the viewing area to display a brighter and darker image.

[0120] The technology enables projection systems to effectively utilize light sources, achieve high-quality HDR displays, and reduce overall energy consumption.

[0121] like Figure 18 As shown, the light modulation component 21 of this application can adjust the deflection of the light reflecting surface through voltage control, shifting the light from that area to other areas requiring higher brightness to meet display requirements and improve the system's light intensity modulation capability. With 100*100 backlight zones and 400*400 pixels, the relationship between the image display duty cycle and the brightness gain factor is as follows: Figure 20As shown, the light control device of this application can generate a significant brightness gain. The voltage signal required to drive the light modulation component adopts timing logic similar to that used for charging pixel electrodes in a TFT-LCD display. Specifically, the driving voltage signal is composed of the voltage states of the TFT pixels occupied by each light modulation component. This design enables the multiplexing of data loading and control logic, resulting in a system with high integration and ease of operation.

[0122] Furthermore, at the same deflection angle, different distances L between the light modulation component and the light reflection device result in different light displacements in the illumination zones. The specific correspondences are as follows: Figure 21 As shown, Figure 21 In this context, distance represents the spacing L between the optical modulation component and the optical reflection device.

[0123] This application provides an efficient and economical light control device design by reusing the standard electrode structure and data loading logic of LCD-TFT, which significantly improves the performance and compatibility of lighting systems.

[0124] The solution proposed in this application has the following advantages:

[0125] 1) This application significantly reduces the wavelength dependence of the light source: it adopts the principle of pure reflection for zoned modulation, which is applicable to both single-wavelength and continuous-spectrum light sources in the visible light band. This avoids the need for phase modulation devices to be optimized for a single wavelength and the risk and optimization compensation problems caused by the diffraction angle deviation of different wavelengths of light.

[0126] 2) Non-polarization dependent and high optical efficiency: Compared with LCoS phase modulators which need to operate in polarized light mode, it uses pure reflection principle for partitioned modulation, which does not depend on the polarization characteristics of light waves, resulting in high light utilization and improved optical efficiency of the entire system.

[0127] 3) High light power density: Compared with phase modulators using liquid crystal polymers, the light reflecting surface in this solution is a metal or inorganic dielectric film high-reflectivity mirror. The material has low intrinsic light absorption, high reflectivity, and strong heat resistance, and can withstand better light density, making it more suitable for high-brightness laser projection systems.

[0128] 4) Low computing power requirement and low hardware cost: Compared with phase modulation schemes, there is no need to perform target light field deduction and holographic calculation, so the computing power requirement is low, no complex algorithms are required, and the running speed is fast.

[0129] 5) Compared to existing methods using digital light modulation arrays for zonal modulation of illumination light fields, where the reflective elements do not reflect light into the output light path in the OFF state, resulting in energy waste, this application can deflect light from unlit zones to the required illumination zones, greatly reducing energy waste and simultaneously improving the brightness of the illuminated area. Compared to digital light modulation arrays, which can only perform single-zone illumination light field pattern modulation similar to a mirror shape, this application can project arbitrary zone patterns according to the specific content of the displayed image, greatly improving the precision of zoned illumination and significantly enhancing the final display effect.

[0130] 6) High compatibility and cost-effectiveness: By reusing LCD-TFT processes and materials, the manufacturing cost of the light modulation component array is reduced, while the production process is simplified. It is fully compatible with existing LCD-TFT technologies in terms of manufacturing processes and pixel control logic, and can be seamlessly integrated into existing projection display systems.

[0131] This invention provides a computer-readable storage medium including a stored program, wherein, when the program is executed, it controls the device containing the computer-readable storage medium to perform a control method for the optical modulation component.

[0132] This invention provides a processor for running a program, wherein the program executes a control method for the optical modulation component during runtime.

[0133] This invention provides a device including a processor, a memory, and a program stored in the memory and executable on the processor. When the processor executes the program, it implements a method for controlling an optical modulation component. The device described herein can be a server, PC, PAD, mobile phone, etc.

[0134] This application also provides a computer program product, including computer instructions, which, when executed by a processor, at least implement a method for controlling an optical modulation component.

[0135] It will be apparent to those skilled in the art that the modules or steps of the present invention can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using device-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented herein, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the present invention is not limited to any particular hardware and software combination.

[0136] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0137] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0138] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0139] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0140] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0141] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0142] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0143] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0144] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An optical modulation component, characterized in that, include: substrate; An optical modulation unit includes a connection portion, a modulation subunit, and a first conductive layer. The modulation subunit includes a second conductive layer located on the substrate and a semiconductor switching device. The second conductive layer is in contact with the output terminal of the semiconductor switching device. The first conductive layer is located on the side of the second conductive layer away from the substrate. The orthographic projection of the first conductive layer on the substrate overlaps with the second conductive layer. The surface of the first conductive layer away from the substrate is a light-reflecting surface. The connection portion is located between the first conductive layer and the substrate, and its first end is in contact with the first conductive layer. An electrode layer is located on the substrate and is spaced apart from the second conductive layer, and the second end of the connection portion is in contact with the electrode layer.

2. The optical modulation component according to claim 1, characterized in that, The optical modulation component includes a plurality of optical modulation units, which are arranged at intervals on the substrate.

3. The optical modulation component according to claim 1, characterized in that, One of the optical modulation units includes a plurality of modulation sub-units arranged at intervals, wherein the orthographic projection of the first conductive layer on the substrate overlaps with the second conductive layer in each of the modulation sub-units.

4. The optical modulation component according to claim 3, characterized in that, Each first conductive layer corresponds to two modulation sub-units, and the two modulation sub-units are symmetrically distributed about the central axis of the corresponding first conductive layer.

5. The optical modulation component according to claim 3, characterized in that, Each first conductive layer corresponds to four modulation sub-units. The four modulation sub-units are symmetrically distributed about the central axis of the corresponding first conductive layer. The four modulation sub-units are also symmetrically distributed about a predetermined line, which is perpendicular to the central axis.

6. The optical modulation component according to claim 1, characterized in that, The semiconductor switching device includes: An active layer is located on the substrate; The source electrode is located on the substrate and is in contact with one side of the active layer. The drain is located on the substrate and is in contact with the side of the active layer away from the source, and the source or the drain is in contact with the second conductive layer; A gate oxide layer is located on the surface of the active layer away from the substrate; The gate is located on the surface of the gate oxide layer away from the substrate.

7. The optical modulation component according to claim 6, characterized in that, The gate oxide layer is also located on the surface of the source electrode away from the substrate, on the side surface of the source electrode, on the surface of the drain electrode away from the substrate, on the side surface of the drain electrode, and on the side surface of the active layer.

8. The optical modulation component according to claim 6 or 7, characterized in that, The optical modulation component further includes: An insulating layer is located on the surface of the substrate near the optical modulation unit and the electrode layer.

9. The optical modulation component according to claim 8, characterized in that, The insulating layer is also located on the surface of the gate away from the gate oxide layer and on the side surface of the gate.

10. A method for manufacturing an optical modulation component according to any one of claims 1 to 9, characterized in that, include: Provide substrate; A second conductive layer, a semiconductor switching device, and an electrode layer are formed on the substrate. The second conductive layer is in contact with the output terminal of the semiconductor switching device, and the electrode layer is spaced apart from the second conductive layer. A connection portion is formed on the surface of the electrode layer away from the substrate, and a first conductive layer is formed on the surface of the connection portion away from the electrode layer. The orthographic projection of the first conductive layer on the substrate overlaps with the second conductive layer. The surface of the first conductive layer away from the substrate is a light-reflecting surface. The connection portion is in contact with the first conductive layer and the electrode layer, respectively. The modulation subunit includes the second conductive layer and the semiconductor switching device. The optical modulation unit includes the connection portion, the modulation subunit, and the first conductive layer.

11. The method according to claim 10, characterized in that, A second conductive layer, a semiconductor switching device, and an electrode layer are formed on the substrate, including: A second conductive layer and an active layer are formed on the substrate at intervals; A source electrode and a drain electrode are formed on the substrate on both sides of the active layer, respectively. The source electrode and the drain electrode are in contact with the active layer, and the source electrode or the drain electrode is also in contact with the second conductive layer. A gate oxide layer and a gate electrode are sequentially formed on the surface of the active layer away from the substrate to obtain the semiconductor switching device; An electrode layer is formed on the substrate on one side of the second conductive layer.

12. The method according to claim 10, characterized in that, A connection portion is formed on the surface of the electrode layer away from the substrate, and a first conductive layer is formed on the surface of the connection portion away from the electrode layer, including: A sacrificial layer is formed on the exposed surface of the substrate, the second conductive layer, the semiconductor switching device, and the exposed surface of the electrode layer away from the substrate, wherein the surface of the sacrificial layer away from the substrate is planar. By removing a portion of the sacrificial layer, a trench is obtained that exposes the electrode layer away from the surface of the substrate; Metal material is deposited in the trench and on the remaining surface of the sacrificial layer away from the substrate to form the connection and the first conductive layer; Remove the remaining sacrificial layer.

13. The method according to claim 10, characterized in that, Before forming the spaced second conductive layer and active layer on the substrate, the method further includes: forming an insulating layer on the substrate; Forming a spaced second conductive layer and an active layer on the substrate includes: forming the spaced second conductive layer and the active layer on the surface of the insulating layer away from the substrate.

14. A control method for an optical modulation assembly according to any one of claims 1 to 9, characterized in that, include: The correspondence between the operating voltage of the optical modulation unit and the deflection angle of the optical reflecting surface of the optical modulation unit is obtained. The deflection angle is the angle between the optical reflecting surface and a predetermined plane. The predetermined plane is the plane where the optical reflecting surface is located when the optical modulation unit is turned off. At least according to the aforementioned correspondence, the operating voltage is controlled to deflect the light reflecting surface, so that the deflected light reflecting surface reflects the light in the beam to the bright area of ​​the spatial light modulator. The spatial light modulator is used to modulate the beam into a light pattern, the light pattern including a first pattern portion and a second pattern portion, the brightness of the first pattern portion being greater than the brightness of the second pattern portion, the bright area being the pixel area of ​​the first pattern portion, and the light reflecting surface before deflection reflecting the light to the dark area of ​​the spatial light modulator, the dark area being the pixel area of ​​the second pattern portion.

15. The method according to claim 14, characterized in that, The optical modulation component includes a plurality of optical modulation units, and the spatial light modulator includes a plurality of pixel regions. Each optical modulation unit corresponds to at least one pixel region. The operating voltage is controlled at least according to the correspondence, including: Based on the light pattern generated by the spatial light modulator, the light modulation unit corresponding to the dark area is determined as the target light modulation unit; The deflection angle of the target optical modulation unit is determined, and the operating voltage corresponding to the deflection angle is determined as the target operating voltage based on the deflection angle and the corresponding relationship. The target optical modulation unit is controlled to operate at the target operating voltage, and the optical modulation units other than the target optical modulation unit are controlled to remain in a non-operating state.

16. The method according to claim 15, characterized in that, An optical modulation unit includes a plurality of modulation sub-units arranged at intervals. The orthographic projection of the first conductive layer on the substrate overlaps with the second conductive layer in each of the modulation sub-units. The plurality of semiconductor switching devices in the target optical modulation unit are target semiconductor switching devices. The target operating voltage includes a plurality of sub-voltages corresponding one-to-one with the target semiconductor switching devices. Controlling the target optical modulation unit to operate at the target operating voltage includes: Provide a turn-on voltage to the control terminals of the plurality of target semiconductor switching devices, so that the plurality of target semiconductor switching devices are turned on; When multiple target semiconductor switching devices are turned on, the corresponding sub-voltage is provided to the input terminals of the multiple target semiconductor switching devices.

17. The method according to claim 15, characterized in that, Determining the deflection angle of the target optical modulation unit includes: Based on the position of the bright area and the position of the dark area, the light displacement of the target light modulation unit is determined. The light displacement is the difference between the position of the light on the spatial light modulator before the light reflecting surface is deflected and the position of the light on the spatial light modulator after the light reflecting surface is deflected. The angle to be deflected is determined based on the amount of light displacement.

18. The method according to claim 17, characterized in that, The component of the light displacement in the first direction is greater than the width of the first conductive layer of the target light modulation unit in the first direction, and the component of the light displacement in the second direction is greater than the width of the first conductive layer of the target light modulation unit in the second direction, wherein the first direction is perpendicular to the second direction.

19. A light control device, characterized in that, include: The optical modulation component according to any one of claims 1 to 9; A spatial light modulator, wherein the spatial light modulator is located on the substrate of the light modulation assembly.

20. The optical control device according to claim 19, characterized in that, The optical control device further includes: an optical reflector located on the side of the spatial light modulator away from the substrate, the optical reflector being used to reflect the light emitted by the optical modulation component to the spatial light modulator.

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