High-speed transmitting module and optical module

Abstract

The present application relates to the technical field of optical communication, in particular to a high-speed transmitting module and an optical module. The present application vertically arranges a laser assembly in a fixed groove, sets the fixed groove in a through groove on a PCB, and keeps the top electrode of the laser assembly and the gold fingers at the edge of the through groove of the PCB at the same horizontal plane, so that the laser assembly can emit light in the vertical direction. The vertical light emission mode is conducive to the coupling of subsequent optical path assemblies, can reduce the length of the module in the horizontal direction, and is conducive to reducing the arrangement spacing between laser assemblies, thereby improving the integration density of the module as a whole, making the high-speed transmitting module more compact in overall structure, effectively improving the integration of the product, and meeting the needs of high-density integration and miniaturization application scenarios.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a high-speed transmission module and optical module. Background Technology

[0002] With the rapid development of large-scale artificial intelligence models, the requirements for the transmission rate of high-speed optical modules in data centers are becoming increasingly higher. In order to meet the actual needs, 400G or 800G high-speed optical modules are currently in mass production, and 1.6T optical modules are in small-batch production.

[0003] In the field of high-speed optical emission modules, traditional multi-channel laser components are usually integrated on printed circuit boards (PCBs) using horizontal mounting or side mounting methods. When integrated using horizontal mounting or side mounting methods, the length of the laser components and the layout of other optical devices will overlap in the horizontal direction, making it difficult to compress the overall length of the module. This results in a low overall integration of the module, which cannot meet the needs of high-density integration and miniaturization application scenarios.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0005] The technical problem to be solved by this invention is how to address the issue that existing high-speed transmission modules have low integration levels and cannot meet the needs of high-density integration and miniaturization application scenarios.

[0006] The present invention adopts the following technical solution: In the first aspect, a high-speed emission module is provided, including multiple laser components 1, a fixing slot 2, an optical path component 3 and a PCB board 4; The laser assembly 1 is vertically disposed in the fixing groove 2; wherein, the electrode of the laser assembly 1 is disposed at the top; the light output path of the laser assembly 1 faces the plane where the top is located; The fixing groove 2 is disposed in a through groove 40 on the PCB board 4 that is adapted to the outline size of the fixing groove 2; wherein, the depth of the fixing groove 2 is such that the electrode of the laser assembly 1 and the gold fingers at the edge of the through groove 40 are located on the same horizontal plane. The optical path component 3 is coupled to the output optical path of the plurality of laser components 1.

[0007] In a second aspect, a high-speed optical module is provided, the high-speed optical module including the high-speed transmission module as described in the first aspect.

[0008] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention vertically arranges the laser component in a fixed slot, which is set in a through slot on a PCB board. The top electrode of the laser component is kept at the same level as the gold fingers on the edge of the through slot on the PCB board. This allows the laser component to emit light vertically. Vertical light emission facilitates the coupling of subsequent optical path components, reduces the overall length of the module in the horizontal direction, and helps to reduce the spacing between laser components, thereby improving the overall integration density of the module. This makes the overall structure of the high-speed emission module more compact, effectively improving the integration of the product and meeting the needs of high-density integration and miniaturization applications. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0010] Figure 1a This is a schematic diagram of the specific structure of a high-speed transmission module provided in an embodiment of the present invention; Figure 1 This is a schematic diagram of the structure of a high-speed transmission module provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of a through groove provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of a fixing groove provided in an embodiment of the present invention; Figure 3a This is another structural schematic diagram of a fixing groove provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of a through-groove edge gold finger provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of a laser assembly provided in an embodiment of the present invention; Figure 5a This is another structural schematic diagram of a laser assembly provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the installation structure of a laser assembly and an optical path assembly provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of an optical transmission route provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of a projection overlap region provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of a first arrangement structure of a laser assembly provided in an embodiment of the present invention; Figure 10 This is another structural schematic diagram of a first arrangement structure of a laser component provided in an embodiment of the present invention; Figure 10a This is a schematic diagram of a heat dissipation path for a laser component provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of the structure of a heat-conducting baffle provided in an embodiment of the present invention; Figure 11a This is a schematic diagram of the structure of a heat-conducting protective cover provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of the electrode arrangement structure on a PCB board provided by an embodiment of the present invention; Figure 13 This is a schematic diagram of a second arrangement structure of a laser assembly provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of the electrode structure corresponding to the second arrangement structure of a laser component provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of a preset distance corresponding to a second arrangement structure of a laser component provided in an embodiment of the present invention; Figure 15a This is a schematic diagram of another heat-conducting baffle provided in an embodiment of the present invention; Figure 16 This is a schematic diagram of the structure of an optical path component provided in an embodiment of the present invention; Figure 17 This is a schematic diagram of the structure of a mounting platform provided in an embodiment of the present invention; Figure 18 This is a schematic diagram of the structure of an optical fiber array provided in an embodiment of the present invention; Figure 19 This is a schematic diagram of another structure of an optical fiber array provided in an embodiment of the present invention; Figure 20 This is a schematic diagram of the structure of an array cover plate provided in an embodiment of the present invention; Figure 21 This is a schematic diagram of another structure of an optical path component provided in an embodiment of the present invention; Figure 22 This is a schematic diagram of another structure of an array cover plate provided in an embodiment of the present invention; Figure 23 This is a schematic diagram of a specific structure of an optical path component provided in an embodiment of the present invention; Figure 24 This is a schematic diagram of a lens array structure provided in an embodiment of the present invention; Figure 25 This is a schematic diagram of another structure of a lens array provided in an embodiment of the present invention. Detailed Implementation

[0011] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0012] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0013] In this invention, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0014] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "coupled" can refer to an electrical connection that enables signal transmission.

[0015] In the specific embodiments of this invention, the use of various embodiment numbers is merely for the convenience of browsing the technical solutions. Numbering distinguishes different implementations that belong to the same technical solution but have obvious differences in details. When specifically determining the technical combination and scope of protection, the technical examples in each embodiment should not be physically separated and differentiated. Instead, the underlying principles and concepts should be analyzed, understanding each embodiment as a different means of presenting a complete technical solution. Their underlying principles and extension methods can be mutually referenced and used.

[0016] Furthermore, the technical features involved in the various implementations of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0017] Example 1: To address the issue of low integration density in existing high-speed transmission modules, which fails to meet the demands of high-density integration and miniaturization applications, Embodiment 1 of this invention provides a high-speed transmission module, such as... Figure 1a and Figure 1 As shown, the high-speed emission module includes multiple laser components 1, a mounting slot 2, an optical path assembly 3, and a PCB board 4. The laser components 1 are vertically arranged in the mounting slot 2. The electrodes of the laser components 1 are located at the top, and the light output path of the laser components 1 faces the plane where the top is located. Here, "top" refers to the area relative to the top. Figure 1 From a directional perspective, and from another perspective, the top can also be understood as the corresponding light-emitting surface side. It should be noted that in this embodiment of the invention, the laser assembly 1 uses a horizontal laser suitable for long-distance transmission, rather than the vertical laser of the prior art. Correspondingly, in the prior art that also uses the laser assembly proposed in this embodiment of the invention, the laser assembly 1 is usually arranged in a horizontal array. The innovation of this invention lies in proposing a vertical arrangement that can significantly increase the integration density of the laser assembly 1. Figure 1 In this example, the high-speed emission module includes 8 laser components 1. In actual use, the number of laser components 1 included in the high-speed emission module can also be 4, 16 or more, depending on the actual situation. No specific limitation is made here.

[0018] To clearly illustrate the various structures proposed in this embodiment, such as Figure 1 The structure is shown from a close-up perspective, and some parts of the PCB board 4 are omitted and are shown in cross-sectional view. The cross-sectional views of other figures in this embodiment are shown in the same way and will not be described again below.

[0019] like Figure 2 and Figure 3 As shown, the fixing groove 2 is disposed in a through groove 40 on the PCB board 4 that matches the outline size of the fixing groove 2, wherein, in Figure 2 To more clearly demonstrate the through slot 40, Figure 1 The 90° angle turning prism 5 (such as Figure 8 As shown, both the laser assembly 1 and the gold fingers on the PCB board 4 are hidden; however, the gold fingers and gold wire bonding wires on the PCB board 4 are retained. Figure 4 As shown, the depth of the fixing groove 2 ensures that the electrode of the laser assembly 1 and the gold fingers (marked as M in the figure) at the edge of the through groove 40 are on the same horizontal plane; the optical path assembly 3 is coupled to the output optical path of the plurality of laser assemblies 1. It should be further noted here that... Figures 1-3 The presented fixing slot 2 is assembled by fixing it to the bottom of the PCB board. In actual implementation, the fixing slot 2 can also be designed as two narrow-sided slots with hanging ears that are directly embedded into the through slot 40 on the PCB. The corresponding hanging ears can then serve as... Figure 2The mounting platform 20 of the 90° angle turning prism 5 shown serves the purpose of making the height of the long side of the fixing groove 2 equal to or slightly lower than the gold fingers on the PCB surface.

[0020] For ease of description below, such as Figure 3 and Figure 3a As shown, the four inner walls of the fixing groove 2 are the first inner wall 201, the second inner wall 202, the third inner wall 203 and the fourth inner wall 204, wherein the first inner wall 201 and the fourth inner wall 204 are arranged opposite to each other, and the second inner wall 202 and the third inner wall 203 are arranged opposite to each other.

[0021] Before describing the specific structure of the high-speed emission module proposed in this embodiment, the structure of laser component 1 will be described first, such as... Figure 5 The diagram shows a structure of laser assembly 1 arranged vertically, including its top surface. The electrodes on the top surface include a first electrode P and a second electrode N. In the prior art, the first electrode P and the second electrode N are typically only located on the top surface, unlike in this invention. Figure 5 The requirement shown extends from the top surface to the top end surface. The side opposite to the top surface is the substrate surface of the laser assembly 1 (i.e., the back side where the laser is located). In conventional prior art, the laser assembly 1 is usually fixed horizontally with its substrate surface. Figure 5 The middle arrow m indicates the light output direction of laser component 1. Figure 5 The shaded area represents one side of the laser assembly 1, with its other side opposite to that side.

[0022] In this embodiment, the topmost surface of the laser assembly 1 is the top surface of the entire laser assembly 1. Figure 5a Based on this, the laser assembly 1 includes a substrate 10 and a laser 11 disposed on the substrate 10. The surface d of the substrate 10 is the device mounting surface, and the side opposite to the device mounting surface is the substrate of the laser assembly 1. If the laser 11 is directly attached to the device mounting surface of the substrate 10, the top surface of the laser 11 protrudes from the device mounting surface, and the side of the top surface of the laser 11 is taken as the top surface of the entire laser assembly 1; if the laser 11 is embedded in the surface of the substrate 10, the top surface of the laser 11 is lower than the device mounting surface, and the device mounting surface is taken as the top surface of the entire laser assembly 1.

[0023] In one implementation of this invention, the laser component 1 can be obtained in the form of a COC (Chip On Carrier), for example, the laser component 1 can be understood as a COC device. Figure 5Taking the perspective shown in the figure as an example, as long as the light output direction of the laser component 1 is ensured to be vertically upward, the fixing method of the laser component 1 relative to the fixing groove 2 includes at least the following: Figure 4 The first setting method shown and Figure 13 The second setting method is shown.

[0024] The first setup method is as follows (refer to...). Figure 2 , Figure 4 and Figure 5 As shown, the laser assembly 1 is arranged in two rows in the fixing slot 2 (with... Figure 4 From the perspective shown (left is the first row, right is the second row), the bottom surface of each row of laser assembly 1 is in thermal contact with the bottom surface of the fixing groove 2, and the back side of each row of laser assembly 1 with the laser on the opposite side is in thermal contact with the inner wall of the fixing groove 2. Combined with... Figure 3 and Figure 3a The substrate surface of the first row of laser components 1 abuts against the third inner wall 203 of the fixing groove 2, and the substrate surface of the second row of laser components 1 abuts against the second inner wall 202 of the fixing groove 2. The top surfaces of the two rows of laser components 1 are opposite each other and spaced apart by a preset distance.

[0025] The second setup method is as follows. Figure 5 and Figure 13 As shown, the laser assembly 1 is arranged in two rows in the fixing slot 2 (with... Figure 13 From the perspective shown (left is the first row, right is the second row), the bottom surface of each row of laser components 1 is in thermal contact with the bottom surface of the fixing groove 2, and the adjacent surfaces of each row of laser components 1 with the lasers on opposite sides are in thermal contact with the inner wall of the fixing groove 2. Combined with... Figure 3 and Figure 3a The first row of laser assembly 1 has adjacent surfaces (facing away from each other) on one side of the laser. Figure 5 The shaded side of the laser assembly 1 (one side of the laser assembly 1) abuts against the third inner wall 203 of the fixing groove 2, and the other side of the laser assembly 1 (one side of the laser assembly 1) Figure 5 The shaded side (in the middle) faces the second inner wall 202 of the fixing groove 2; the second row of laser assemblies 1 has adjacent sides on the laser side ( Figure 5 The shaded side of the laser assembly 1 is abutted against the second inner wall 202 of the fixing groove 2, while the other side of the laser assembly 1 faces the third inner wall 203 of the fixing groove 2.

[0026] Specifically, the aforementioned contact setting refers to the formation of thermally conductive contact between two surfaces used for contact. Typically, thermally conductive adhesive is applied between the two surfaces to ensure sufficient thermal contact.

[0027] In one implementation, the laser assembly 1 is installed in at least two of the following ways: The first installation method of the laser component 1 is to fix the bottom surface of each laser component 1 to the bottom surface of the fixing groove 2 after the fixing groove 2 is integrally formed from a high thermal conductivity material, and then embed the laser component 1 and the integrally formed fixing groove 2 into the through groove 40 of the PCB board 4 to complete the installation.

[0028] The second installation method of the laser component 1 is to directly embed the corresponding high thermal conductivity material into the inner wall of the through groove 40 to form the fixing groove 2, and then fix the bottom surface of each laser component 1 to the bottom surface of the fixing groove 2.

[0029] The essential difference between the two installation methods lies in the following: In the first method, the laser component 1 and the mounting slot 2 are pre-installed as a single unit into the through slot 40 of the PCB board 4. In the second method, the mounting slot 2 is first installed into the through slot 40 of the PCB board, and then the laser component 1 is fixed to the bottom surface of the mounting slot 2. The first installation method is suitable for rapid assembly production on a production line where processing precision is guaranteed, while the second installation method is more suitable for situations where fine-tuning of each laser component 1 is required during the initial production process.

[0030] To meet the heat dissipation requirements of the laser assembly 1, in one implementation, the material constituting the fixing groove 2 is tungsten copper or ceramic, or other materials with high thermal conductivity. The specific material selected is up to those skilled in the art.

[0031] like Figure 6 , Figure 7 and Figure 8 As shown, unlike the traditional horizontal mounting method, this embodiment places the laser assembly 1 vertically, so that the light emission direction of the laser assembly 1 faces the top. Using the horizontally placed PCB board 4 as the horizontal reference plane, the light emission direction of the laser assembly 1 is upward (the optical path is as follows). Figure 7 (As shown by the middle arrow), the vertical light emission method allows the projection of the 45° angle reflecting surface of the 90° angle turning prism 5 in the subsequent optical path assembly 3 onto the horizontal plane to cover the projection area of ​​the laser output port on the horizontal plane of each laser assembly 1. Among these, Figure 8 The shaded area is the projection area. Through the 90° angled prism 5 and the laser output ports on each laser component 1, projection areas are formed on the horizontal plane, thereby reducing the overall horizontal length of the module and further improving the overall integration of the module. It is worth noting that... Figure 8 The PCB board 4 and the corresponding fixing slot 2 are hidden to make the projection area visible.

[0032] To achieve a multi-channel high-speed emission module and meet the heat dissipation requirements of each laser component 1, in one implementation, such as Figure 5 and Figure 9 As shown, the laser assembly 1 is arranged in two rows in the fixing slot 2 (with... Figure 9 From the perspective shown (the left side is the first row and the right side is the second row), the bottom surface of each row of laser components 1 is in thermal contact with the bottom surface of the fixing groove 2, and the back side of each row of laser components 1 (also described as a substrate in this embodiment) is respectively in thermal contact with the third inner wall 203 or the second inner wall 202 of the fixing groove 2.

[0033] In one embodiment, refer to Figure 5 and Figure 9 The top electrodes on the first row of laser assemblies 1 and the top electrodes on the second row of laser assemblies 1 are electrically connected to the gold fingers on the PCB board 4 adjacent to the inner wall of their respective abutting fixing grooves via gold wire bonding. Figure 9 For example, the top electrode on the laser assembly 1 in the second row (such as...) Figure 9 The first electrode P and the second electrode N in the circuit are connected to the gold fingers on the PCB board 4 (such as...). Figure 9 Electrical connection (as indicated by the letter M).

[0034] Reference Figure 9 This embodiment takes a high-speed emission module comprising 8×2 laser components 1 as an example. Each of the two rows of laser components 1 includes 8 laser components 1, specifically: the second laser component 112, the fourth laser component 114, the sixth laser component 116, the eighth laser component 118, the tenth laser component 120, the twelfth laser component 122, the fourteenth laser component 124, and the sixteenth laser component 126 in the first row; and the first laser component 111, the third laser component 113, the fifth laser component 115, the seventh laser component 117, the ninth laser component 119, the eleventh laser component 121, the thirteenth laser component 123, and the fifteenth laser component 125 in the second row. The specific number of laser components 1 should be determined based on the overall speed of the optical module using this high-speed emission module and the speed of each individual laser component.

[0035] The 8×2 laser assembly 1 is arranged in two rows along the length direction within the fixing groove 2, with the two rows of laser assemblies 1 facing each other. It is worth noting that, for example... Figure 10As shown, the relative arrangement here does not mean that each laser component 1 in the first row and each laser component 1 in the second row are arranged in a one-to-one correspondence in the horizontal direction. If the laser components are arranged in a one-to-one correspondence, the light output directions of the laser components 1 in the first row and the laser components 1 in the second row will be arranged into two optical paths in each vertical direction after being adjusted to a horizontal optical path by the 90° corner prism 5. This not only increases the difficulty of designing, assembling and aligning the subsequent optical path components 3, but also easily causes problems such as optical path interference and increased crosstalk, thus complicating the arrangement and debugging of the subsequent optical path components 3.

[0036] To circumvent the aforementioned problems, in one embodiment, reference is made to... Figure 9 The second laser assembly 112, fourth laser assembly 114, sixth laser assembly 116, eighth laser assembly 118, tenth laser assembly 120, twelfth laser assembly 122, fourteenth laser assembly 124, and sixteenth laser assembly 126 in the first row are arranged in a staggered manner with the first laser assembly 111, third laser assembly 113, fifth laser assembly 115, seventh laser assembly 117, ninth laser assembly 119, eleventh laser assembly 121, thirteenth laser assembly 123, and fifteenth laser assembly 125 in the second row. For example... Figure 10 As shown by the dashed line, the horizontal center axis of the fourth laser assembly 114 in the first row is located between the third laser assembly 113 and the fifth laser assembly 115 in the second row, while the horizontal center axis of the fifth laser assembly 115 in the corresponding second row is located between the fourth laser assembly 114 and the sixth laser assembly 116 in the first row. Similarly, the horizontal center axis of the seventh laser assembly 117 in the corresponding second row is located between the sixth laser assembly 116 and the eighth laser assembly 118 in the first row, thereby causing the two rows of laser assemblies 1 to be staggered in the horizontal direction.

[0037] By using the above staggered arrangement, the output optical paths of the two rows of laser components 1 can be spatially staggered, avoiding overlap and interference between the output optical paths. This provides sufficient assembly and debugging space for the subsequent installation, positioning, and coupling of optical path components 3, thereby improving the reliability and consistency of optical path coupling.

[0038] In one implementation, for each row of laser components 1, its bottom surface is in close thermal contact with the bottom surface of the fixing groove 2. The heat generated by the laser components 1 during operation can be directly conducted to the fixing groove 2 through the bottom surface, forming a bottom heat conduction path (e.g., ...). Figure 10a(As shown by the vertical downward arrow in the middle). Simultaneously, in each row of laser components 1, the side facing away from the top surface of the laser component 1 (which is the substrate surface for COC devices) is in close thermal contact with the inner wall of the corresponding position in the fixing groove 2. This allows the heat generated by the laser component 1 to be conducted to the inner wall of the fixing groove 2 through the back side, thus forming a side thermal conduction path (e.g., ...). Figure 10a (As shown by the horizontal arrow pointing to the right). (Refer to...) Figure 3 , Figure 3a and Figure 9 , Figure 10a The example shown is that the substrate surface of the second row of laser components 1 abuts against the second inner wall 202 of the fixing groove 2.

[0039] To further improve heat dissipation, refer to Figure 9 Furthermore, thermally conductive adhesive can be filled into the gaps between the laser components 1 within the fixing groove 2. These gaps include, for example, the gap between the second laser component 112 and the fourth laser component 114, and may also include the gap between the first laser component 111 and the second laser component 112. Filling the gap between, for example, the second laser component 112 and the fourth laser component 114 with thermally conductive adhesive allows heat transfer from the sides of each laser component 1, effectively preventing heat accumulation on the sides of the laser component 1 and improving overall heat dissipation. Filling the gap between, for example, the first laser component 111 and the second laser component 112 with thermally conductive adhesive further utilizes the heat-conducting area of ​​the fixing groove 2 located between the two rows of laser components 1, improving thermal conductivity.

[0040] Through the aforementioned bidirectional heat-conducting contact structure on the bottom and back sides, the laser assembly can still achieve efficient heat dissipation from multiple sides under the premise of vertical arrangement and high-density layout. This significantly increases the heat-conducting contact area, accelerates the heat conduction rate, and reduces the operating junction temperature of the laser assembly, thereby ensuring the luminescence stability and lifespan of the laser assembly under high integration and high-power operating conditions.

[0041] Of course, with sufficiently high processing precision, the bottom surface of each row of laser components 1 can be thermally contacted with the bottom surface of the fixing groove 2. Alternatively, the top surface of each row of laser components 1 can be contacted with the second inner wall 202 and the third inner wall 203 of the fixing groove 2 respectively (replacing the scheme described above where the laser component substrate contacts the inner wall of the fixing groove 2). The specific structure will not be elaborated upon in this embodiment. Relatively speaking, its heat dissipation effect is not as good as that described above. Figure 9 The implementation shown is, however, not excluded as an optional parallel implementation scheme under the innovative idea of ​​vertically setting laser components in this invention, and should still be interpreted as being within the protection scope of this invention.

[0042] In response to the above-mentioned heat conduction methods, this embodiment also proposes a structure that can further improve the overall heat dissipation of the laser component 1, such as... Figure 5 and Figure 11 As shown, the high-speed emission module also includes a heat-conducting baffle 8. The heat-conducting baffle 8 is disposed in the fixing groove 2, and the bottom of the heat-conducting baffle 8 abuts against the bottom surface of the fixing groove 2. The two larger vertical sides of the heat-conducting baffle 8 abut against the top surface of the laser assembly 1 on the first row of laser assemblies and the top surface of the laser assembly 1 on the second row of laser assemblies, respectively. It should also be noted that in the relevant figures of the embodiments of the present invention, the corresponding lasers 11 are all presented as being disposed on the device mounting surface of the laser assembly 1. However, after combining the extended implementation method of adding the heat-conducting baffle 8, the position where the laser 11 is disposed on the corresponding laser assembly 1 can also be made into a groove, so that the top surface of the laser assembly 1 is presented as a large flat surface with a laser storage groove in the middle, thereby increasing the contact area and heat conduction effect between the laser assembly 1 and the heat-conducting baffle 8.

[0043] To increase the heat dissipation area of ​​the heat-conducting baffle 8, refer to Figure 3 , Figure 3a and Figure 11 The two smaller vertical sides of the heat-conducting baffle 8 are respectively abutted against the first inner wall 201 and the fourth inner wall 204 of the fixing groove 2.

[0044] In one embodiment, the height of the heat-conducting baffle 8 should theoretically match the depth of the fixing groove 2, that is, the top surface of the heat-conducting baffle 8 ( Figure 11 The shaded surface shown is on the same horizontal plane as the light-emitting surface of laser assembly 1, thus avoiding any impact on the light output of laser assembly 1. It should be further explained that the light-emitting surface of laser assembly 1 and the light-emitting surface of the laser are viewed from their respective structural perspectives. The light-emitting surface of the laser is the light-emitting end face of the laser, while the light-emitting surface of laser assembly 1 should be understood as... Figure 5 The top surface where the first electrode P and the second electrode N are located is shown.

[0045] In conjunction with the structure of the heat-conducting block 8 described above, to prevent one side of the heat-conducting block 8 from affecting the normal operation of the laser when it comes into contact with the top surface of the laser assembly 1 (which may also be a substrate in the above extended implementation; the following embodiments take the top surface of the laser assembly 1 as an example) (e.g., squeezing causing laser misalignment), in one implementation, before the top surface of the laser assembly 1 comes into contact with the heat-conducting block 8, a heat-conducting protective cover 9 is also provided on the top surface of the laser assembly 1 (e.g., a heat-conducting protective cover 9 is provided on the top surface of the laser assembly 1). Figure 11a (as shown), or, a thermally conductive filling layer is formed on the top surface of the laser assembly 1, so that the top surface of the laser assembly 1 after the laser is installed presents a complete contact surface.

[0046] The above embodiments illustrate the use of Figure 9 The laser assembly 1 is arranged in the manner shown, with the substrate surfaces of the two rows of laser assemblies 1 abutting against the inner walls of their corresponding fixing slots 2. This arrangement provides better heat dissipation, but it occupies a significant amount of space on the PCB board 4. This is because there is a certain distance between the first electrode P and the second electrode N on the laser assembly 1. Correspondingly, there is also a certain distance between the two corresponding gold fingers on the PCB board 4. The greater the distance between the gold fingers, the more space is occupied on the PCB board 4, making it inconvenient for the installation and routing of other components on the PCB board 4. Figure 12 As shown, the distance r between the first gold finger 41 and the second gold finger 42 on the PCB board 4 is relatively large, and the distance r between the third gold finger 43 and the fourth gold finger 44 is also relatively large, resulting in the space on the PCB board 4 not being fully utilized.

[0047] To address the aforementioned problems, this invention also proposes a second configuration for the laser component 1. This second configuration has been described previously and will be further explained below. Figure 5 and Figure 13 The reason why the second arrangement can make full use of PCB board 4 is explained. The laser components 1 are arranged in two rows in the fixing slot 2. The eighteenth laser component 128, twentieth laser component 130, twenty-second laser component 132, twenty-fourth laser component 134, twenty-sixth laser component 136, twenty-eighth laser component 138, thirtieth laser component 140 and thirty-second laser component 142 in the first row are staggered with the seventeenth laser component 127, nineteenth laser component 129, twenty-first laser component 131, twenty-third laser component 133, twenty-fifth laser component 135, twenty-seventh laser component 137, twenty-ninth laser component 139 and thirty-first laser component 141 in the second row. For example, the eighteenth laser assembly 128 in the first row is disposed between the seventeenth laser assembly 127 in the second row and the nineteenth laser assembly 129 in the second row. Or, for example, the nineteenth laser assembly 129 in the second row is disposed between the eighteenth laser assembly 128 in the first row and the twentieth laser assembly 130 in the first row.

[0048] Specifically, Figure 13 The second setting shown is the same as the one described above. Figure 4The core difference in the first arrangement shown lies in the different thermal contact positions between the laser assembly 1 and the inner wall of the fixing groove 2. In the first arrangement, the substrate surface of the laser assembly 1 abuts against the inner wall of the fixing groove 2, while in the second arrangement, for each laser assembly 1 in each row, its contact position with the two adjacent surfaces opposite to the side where the laser is located (…). Figure 5 The shaded side (or the side opposite to the shaded side) respectively achieves tight thermal contact with the third inner wall 203 or the second inner wall 202 of the fixing groove 2. For example... Figure 14 As shown, based on the second setting method, the gold fingers on the PCB board 4 corresponding to the same laser component 1 are distributed on both sides of the fixing groove 2, thus reducing the spacing between the gold fingers on the PCB board 4.

[0049] Among them, such as Figure 14 As shown, when the light-emitting ports of the first row of laser components 1 are mapped onto the straight line containing the light-emitting ports of the second row of laser components 1, the light-emitting ports of the two rows of laser components 1 are arranged alternately. For example, the horizontal central axis of the eighteenth laser component 128 in the first row is located between the seventeenth laser component 127 and the nineteenth laser component 129 in the second row, while the horizontal central axis of the nineteenth laser component 129 in the corresponding second row is located between the eighteenth laser component 128 and the twentieth laser component 130 in the first row, thus causing the two rows of laser components 1 to be staggered in the horizontal direction.

[0050] By using the above staggered arrangement, the output optical paths of the two rows of laser components 1 can be spatially staggered, avoiding overlap and interference between the output optical paths. This provides sufficient assembly and debugging space for the subsequent installation, positioning, and coupling of optical path components 3, thereby improving the reliability and consistency of optical path coupling.

[0051] exist Figure 9 The scheme shown is the same as Figure 14 In the illustrated scheme, each of the PCB boards 4 on one side of the through slot 40 includes 16 gold fingers, but... Figure 9 The scheme shown has a certain distance between two adjacent gold fingers (this distance corresponds to the width of the laser), and Figure 14 The distance between two adjacent gold fingers in the illustrated scheme is small and can be ignored to a certain extent. Only the integrity and reliability of the weld need to be satisfied. Figure 14 The solution shown can save more area on PCB board 4. The saved area can be flexibly used to set other auxiliary structures or functional devices. For example, a small heat sink can be added to further enhance the overall heat dissipation effect. Additional electrode lead-out structures or signal shielding structures can also be set to optimize high-frequency signal transmission performance. A spare laser component 1 can also be reserved for installation, thereby improving the overall redundancy, scalability and integration of the module.

[0052] It is worth noting that, Figure 9 In the illustrated scheme, two electrodes (first electrode P and second electrode N) belonging to the same laser component 1 are coupled to gold fingers on the same side of the edge of the through slot 40, for example, as shown. Figure 9 As shown, the first electrode P and the second electrode N of the first laser assembly 111 are coupled to two gold fingers M on the same side of the PCB board 4, respectively, wherein the coupling method is gold wire bonding. Figure 14 In the scheme shown, the first electrode P and the second electrode N of the seventeenth laser assembly 127 are coupled to the gold fingers (as shown in M2 and M1) on opposite sides of the PCB board 4, respectively.

[0053] Specifically, the core difference between the above-mentioned electrode coupling method and the aforementioned same-side coupling scheme lies in the different electrode bonding layout. In the aforementioned scheme, the two electrodes of the same laser component 1 face the same side of the gold fingers of the PCB board 4 through slot 40. In this scheme, by means of the abutment structure between the side of the laser component 1 and the inner wall of the fixing groove 2, the two electrodes of the same laser component 1 face the opposite sides of the PCB board 4 through slot 40, forming a symmetrical gold wire bonding layout.

[0054] The specific implementation of gold wire bonding is as follows: one end of the gold wire is tightly bonded to the electrode pad of the laser component 1, and the other end is tightly bonded to the corresponding gold finger pad on the PCB board 4. During the bonding process, the length and curvature of the gold wire are strictly controlled to ensure reliable contact at the bonding point and to prevent any false soldering or cold soldering. At the same time, interference between the gold wire and the fixing groove 2, the laser component 1, or other structures is avoided to ensure the continuity and stability of high-frequency signal transmission.

[0055] exist Figure 14 In the demonstrated solution, since the two electrodes of the same laser component 1 are bonded to the gold fingers on opposite sides of the PCB board 4, the spacing between the two gold fingers connected to the same laser component 1 on the PCB board 4 can be effectively increased, avoiding signal crosstalk caused by the two gold fingers being too close together. This is especially suitable for high-speed signal transmission scenarios, and can effectively reduce the impact of parasitic capacitance and parasitic inductance on signal integrity, thereby improving the signal transmission rate and reliability of the module.

[0056] Combination Figure 15 ,exist Figure 14 In the presented scheme, the adjacent areas of the laser components 1 in the first row and the laser components 1 in the second row are stacked with each other at a preset distance R; wherein, the preset stacking distance avoids the location of each laser and avoids collision.

[0057] The preset distance is set according to the substrate size, light emission position and optical path coupling requirements of the laser component 1. The core is that in the horizontal projection direction, the main body of the two rows of laser components 1 has a partially overlapping area, but the overlapping area does not cover the light-emitting active area of ​​the laser, thereby avoiding the problem of optical path occlusion caused by stacking. This structure can further improve the overall integration.

[0058] To further improve the overall heat dissipation of laser component 1, such as Figure 15a As shown, a heat-conducting block 8 can also be provided between the two rows of laser components 1. The heat-conducting block 8 is disposed in the fixing groove 2, and the bottom of the heat-conducting block 8 abuts against the bottom surface of the fixing groove 2. The two larger vertical sides of the heat-conducting block 8 abut against one side of the first row of laser components 1 and one side of the second row of laser components 1, respectively. For example, refer to Figure 14 and Figure 15a One side of the eighteenth laser assembly 128 abuts against one vertical side of the heat-conducting baffle 8, and one side of the nineteenth laser assembly 129 abuts against another vertical side of the heat-conducting baffle 8. To increase the heat dissipation area of ​​the heat-conducting baffle 8, the two smaller vertical sides of the heat-conducting baffle 8 abut against the first inner wall 201 and the fourth inner wall 204 of the fixing groove 2, respectively. In one embodiment, the height of the heat-conducting baffle should theoretically match the depth of the fixing groove 2, and the top surface of the heat-conducting baffle 8 (e.g., Figure 15a The shaded surface shown in the figure is on the same horizontal plane as the light-emitting surfaces of the eighteenth laser assembly 128 and the nineteenth laser assembly 129, thereby avoiding any impact on the light output of each laser assembly.

[0059] If a heat-conducting baffle 8 is installed between the two rows of laser components 1, refer to Figure 15 and Figure 15a At this point, two rows of laser components need to be horizontally separated to allow space for the installation of heat-conducting baffles. The eighteenth laser component 128 in the first row and the nineteenth laser component 129 in the second row do not exist in adjacent areas. Figure 15 The preset distance R shown in the figure sacrifices the compactness of the structure to improve heat dissipation.

[0060] Both of the above-mentioned configuration methods can ensure that the light output direction of laser component 1 is vertically upward. In order to convert the light signal emitted vertically by laser component 1 into a horizontal direction for subsequent use, Figure 9 Taking the laser component 1 shown as an example, as... Figure 16As shown, the optical path assembly 3 includes at least one 90° angle prism 5 and a set of fiber arrays 6. The incident surface of the 90° angle prism 5 receives the vertically emitted light from two rows of laser assemblies 1, and couples it into the fiber array 6 after being refracted at a 90° angle to form two rows of horizontal light.

[0061] The 90° angle turning prism 5 is fixedly disposed above the through slot 40 on the PCB board 4 and located above the light output path of all laser components 1. The incident surface of the 90° angle turning prism 5 faces the light output end face of each laser component 1, and the output surface of the 90° angle turning prism 5 faces the fiber array 6, thereby turning the vertically emitted light emitted vertically upward by the laser component 1 by 90° and converting it into horizontal transmission.

[0062] In one implementation, the 90° angle turning prism 5 can be fixed to the corresponding mounting position on the through slot 40 or PCB board 4 by adhesive bonding to ensure the relative positional accuracy between it and the laser assembly 1. A certain preset distance should be reserved between the incident surface of the 90° angle turning prism 5 and the light-emitting end face of the laser assembly 1 to ensure the complete transmission of the optical signal and the transmission effect.

[0063] To ensure a predetermined distance between the incident surface of the 90° angled prism 5 and the light-emitting end face of the laser assembly 1, such as... Figure 16 and Figure 17 As shown, the two inner walls with smaller areas on the fixing groove 2 (refer to...) Figure 3 and Figure 3a Mounting platforms 20 are provided on the end faces of the first inner wall 201 and the fourth inner wall 204. The height of the mounting platforms 20 exceeds the preset distance of the light-emitting surface of the laser assembly 1. The two ends of the 90° angle turning prism 5 are respectively set on the mounting platforms 20, so as to ensure that there is a preset distance between the incident surface of the 90° angle turning prism 5 and the light-emitting end face of the laser assembly 1, thereby ensuring the light-emitting effect of the laser assembly 1.

[0064] In summary, this embodiment, through the cooperation of the 90° angle turning prism 5 and the fiber array 6, achieves the turning, focusing, and coupling output of vertically emitted light without increasing the overall lateral size of the module or disrupting the vertical arrangement structure of the laser component 1. This further improves the optical path coupling efficiency and structural compactness, and adapts to the packaging requirements of high-speed, high-density emission modules.

[0065] In one implementation, such as Figure 17 , Figure 18 and Figure 19As shown, the fiber optic array 6 includes an array base 60 and an array cover plate 61 that are configured to cooperate with each other. The array base 60 of the fiber optic array 6 is provided with a row of first fiber positioning grooves 600 of a first depth and a row of second fiber positioning grooves 601 located on the surface of the array base 60.

[0066] In this embodiment, both the first fiber positioning slot 600 and the second fiber positioning slot 601 are V-groove structures. However, as an optional implementation, the corresponding fiber positioning slots can also be made into rectangular slots, arc slots, or polygonal slots to adapt to different fiber optic application scenarios. Therefore, the fiber positioning slot structures in the relevant figures should not be over-interpreted as meaning that the present invention can only use V-groove structures.

[0067] Reference Figure 19 The first fiber optic positioning slot 600 and the second fiber optic positioning slot 601 are arranged horizontally and vertically at a first preset height x. In the various optional implementations of this invention, the horizontal and vertical arrangements shown in the corresponding figures should be understood as optional arrangements. After understanding the innovative core of the vertical layout of this invention, the horizontal relationship and vertical arrangement shown in the corresponding figures can be adapted to be replaced. Here, the first fiber optic positioning slot 600 and the second fiber optic positioning slot 601 are used to distinguish the two types of fiber optic positioning slots with different spatial structures for the convenience of subsequent feature description.

[0068] In one implementation, refer to Figure 18 and Figure 19 As shown, the array base 60 is provided with eight first fiber positioning slots 600 and eight second fiber positioning slots 601, each fiber positioning slot being used to fix the fiber in the corresponding optical path. Figure 18 and Figure 20 As shown, to accommodate the array base 60, the array cover 61 of the fiber optic array 6 includes a substrate 610 and a structure 611, with the structure 611 located on the substrate 610. (Refer to...) Figure 19 The structure 611 can be a three-dimensional square wave shape, wherein the peak of the square wave is used to abut the optical fiber in the first optical fiber positioning groove 600, and the trough of the square wave is used to abut the optical fiber in the second optical fiber positioning groove 601.

[0069] The base plate 610 of the array cover plate 61 is made of an insulating and thermally conductive material that matches the material of the array base 60. Its size is adapted to the external size of the array base 60, ensuring that the array cover plate 61 can completely cover the upper surface of the array base 60, thereby achieving full compression and fixation of the optical fiber in the optical fiber positioning groove.

[0070] The structure 611 and the substrate 610 are integrally formed. It can also be reliably connected to the substrate 610 by bonding, welding or other fixing methods. The core purpose of its three-dimensional square wave shape design is to adapt to the spatial structure of the first optical fiber positioning groove 600 and the second optical fiber positioning groove 601 with a first preset height, so that the square wave structure can accurately abut against two rows of optical fibers of different heights at the same time, avoiding problems such as uneven clamping force and insecure optical fiber fixing caused by the height difference between the two rows of optical fibers.

[0071] The height difference between the peaks and troughs of the square wave matches the preset height difference between the first fiber positioning slot 600 and the second fiber positioning slot 601. The end face of the peak is in contact with the upper surface of the fiber in the first fiber positioning slot 600, and the end face of the trough is in contact with the upper surface of the fiber in the second fiber positioning slot 601. After the array cover plate 61 and the array base 60 are assembled and fixed, the peaks and troughs of the structure 611 can apply a uniform clamping force to the two rows of optical fibers, firmly confining the optical fibers in the corresponding fiber positioning slots. This prevents the optical fibers from shifting due to environmental factors such as vibration and temperature changes during transmission, ensuring the stability and reliability of optical signal coupling. Simultaneously, the square wave sidewall of the structure 611 can adopt a smooth transition design to avoid scratching or damaging the fiber surface, protecting the transmission performance of the optical fiber.

[0072] In one implementation, positioning holes (not shown in the figure) can be provided on the substrate 610 of the array cover plate 61, and corresponding positioning posts (not shown in the figure) can be provided on the array base 60. During assembly, the positioning posts and positioning holes are precisely matched to achieve rapid positioning of the array cover plate 61 and the array base 60, ensuring that the peaks and troughs of the structure 611 can be precisely aligned with the optical fibers in the first optical fiber positioning groove 600 and the second optical fiber positioning groove 601, reducing assembly difficulty and improving assembly efficiency and accuracy.

[0073] In an optional implementation, the square wave shape of the structure 611 can be adaptively adjusted according to the number and spacing of the first fiber positioning slot 600 and the second fiber positioning slot 601. For example, when the array base 60 is provided with 8 first fiber positioning slots 600 and 8 second fiber positioning slots 601, the square wave peaks and valleys of the structure 611 are also provided with 8 corresponding peaks and valleys. Each peak corresponds to an optical fiber in a first fiber positioning slot 600, and each valley corresponds to an optical fiber in a second fiber positioning slot 601, so as to achieve one-to-one correspondence and fixing.

[0074] In addition, the structure 611 of the array cover plate 61 can also be made of an elastic thermally conductive material, which can play a certain buffering role while applying pressure to the optical fiber, avoiding damage to the optical fiber caused by rigid contact. At the same time, it can help conduct the small amount of heat generated during the operation of the optical fiber. Together with the heat dissipation structure of the array base 60, it can further ensure the long-term stable operation of the optical fiber.

[0075] like Figure 21 and Figure 22 As shown, the structure 611 can also be a comb-shaped wave, wherein each peak of the comb-shaped wave is used to abut the optical fiber in the first optical fiber positioning groove 600, and the substrate 610 is used to abut the optical fiber in the second optical fiber positioning groove 601.

[0076] The comb-shaped waveform structure 611 in this embodiment has the same core function as the aforementioned three-dimensional square wave structure 611. Both are designed to adapt to the height difference between the first fiber positioning groove 600 and the second fiber positioning groove 601 on the array base 60, so as to simultaneously press and fix two rows of fibers at different heights. The only difference is in the structural form. Its core concept still falls within the protection scope of this invention and should not be excluded from its protection scope because of the difference in structural form.

[0077] Reference Figure 22 The comb-shaped waveform structure 611 and the substrate 610 of the array cover plate 61 are integrally formed and made of insulating, wear-resistant and elastic material. This ensures structural strength and avoids damage to the surface of the optical fiber. It also has a certain buffering performance to accommodate minor positional deviations during the optical fiber assembly process.

[0078] The arrangement of the comb-shaped waveform structure 611 corresponds one-to-one with the first fiber positioning groove 600 on the array base 60. That is, each peak of the comb-shaped wave corresponds to a first fiber positioning groove 600. The end face of the peak is polished to form a smooth arc structure, which is precisely attached to the outer surface of the fiber in the first fiber positioning groove 600. This ensures that uniform pressure can be applied to the fiber when it is pressed, and the fiber is firmly limited in the first fiber positioning groove 600 to prevent the fiber from shifting.

[0079] Reference Figure 21 and Figure 22 Since the second fiber positioning groove 601 is located on the surface of the array base 60 and its groove depth is relatively shallow, the height of the corresponding upper surface of the fiber is lower than that of the upper surface of the fiber in the first fiber positioning groove 600. Therefore, in this embodiment, it is not necessary to set a trough structure corresponding to the second fiber positioning groove 601 on the structure 611. Instead, the lower surface of the substrate 610 of the array cover plate 61 is directly used to press and clamp the fiber in the second fiber positioning groove 601. Specifically, after the array cover plate 61 is assembled and fixed with the array base 60, the lower surface of the substrate 610 is tightly attached to the upper surface of the fiber in the second fiber positioning groove 601, applying a uniform clamping force. Combined with the limiting effect of the second fiber positioning groove 601, the fiber is firmly fixed. At the same time, the large-area attachment design of the substrate 610 can further improve the fixing stability of the fiber in the second fiber positioning groove 601 and avoid fiber loosening due to uneven local pressure. It is worth noting that in Figure 21 and Figure 22 The number of fiber optic channels shown can be adapted to the laser assembly 1, and will not be described in detail in this embodiment.

[0080] The peak height of the comb-shaped waveform structure 611 is adapted to the preset height difference between the first fiber positioning groove 600 and the second fiber positioning groove 601. This ensures that when the lower surface of the substrate 610 abuts against the fiber in the second fiber positioning groove 601, the peak of the comb-shaped wave can just fit against the upper surface of the fiber in the first fiber positioning groove 600, achieving synchronous pressing of the two rows of fibers. This prevents the fiber in the first fiber positioning groove 600 from being damaged due to excessive pressure caused by an excessively high peak, and also prevents insufficient pressing force and insecure fiber fixing due to an excessively low peak.

[0081] A gap is provided between adjacent peaks of the comb-shaped waveform structure 611. The width of the gap is adapted to the spacing between the first fiber positioning slots 600. This avoids mutual interference between adjacent peaks and provides a certain amount of space for the end of the fiber, which facilitates the coupling and docking of the fiber with the optical path assembly 3.

[0082] During assembly, the array cover plate 61 and the array base 60 can still be positioned using the aforementioned positioning hole and positioning post combination structure. This ensures that the peaks of the comb-shaped wave are precisely aligned with the first fiber positioning slot 600, and that the lower surface of the substrate 610 is precisely fitted with the fiber in the second fiber positioning slot 601. This reduces assembly difficulty and improves assembly accuracy and efficiency. Furthermore, in an optional implementation, the number of peaks in the comb-shaped wave structure 611 can be adaptively adjusted according to the number of first fiber positioning slots 600. For example, when eight first fiber positioning slots 600 are provided on the array base 60, eight peaks of the comb-shaped wave are also correspondingly provided, ensuring that each peak corresponds one-to-one with the fiber in a first fiber positioning slot 600, guaranteeing reliable clamping and fixing.

[0083] It is important to emphasize that, regardless of whether it is the comb-shaped waveform structure 611 or the three-dimensional square wave structure 611 provided in this embodiment, or the stepped protrusion structure, the staggered protrusion structure, etc., they are all structural variations of the core concept of adapting to two rows of optical fibers of different heights and achieving synchronous compression and fixation. Essentially, they all achieve secure positioning of the optical fibers by matching the height difference between the two rows of optical fibers through different protrusion structure designs. Therefore, stepped protrusion structures, staggered protrusion structures, or structural variations with the same core concept should all fall within the protection scope of this invention. In practical use, the structure of structure 611 can be flexibly selected according to the actual assembly space, optical fiber size, and manufacturing process requirements, improving the adaptability and practicality of the high-speed transmission module of this invention and better meeting the high-density, high-speed optical transmission needs in different scenarios.

[0084] To accommodate the staggered arrangement of the two rows of laser components 1 mentioned earlier, and to ensure that the vertical light signal emitted by each laser component 1 can be accurately coupled into the fiber array 6 after optical path deflection, collimation, and isolation, thereby improving optical path coupling efficiency and avoiding crosstalk between channels, in one implementation, such as... Figure 23 As shown, the optical path component 3 includes at least one 90° angled prism 5, at least one lens array 7, and a set of fiber arrays 6.

[0085] Among them, the light-emitting surface of the 90° angle turning prism 5, the lens array 7, and the fiber array 6 are coupled sequentially along the optical path.

[0086] The lens array 7 is adapted one-to-one with the two rows of staggered laser components 1. The core design point is that the lens array 7 also adopts a staggered arrangement corresponding to the laser components 1. In one implementation, such as Figure 24 As shown, the lens array 7 includes two rows of lenses, corresponding to the first row of laser components 1 and the second row of laser components 1, respectively. The arrangement of the lenses in the first row corresponds one-to-one with the light output port position of the first row of laser components 1, and the arrangement of the lenses in the second row corresponds one-to-one with the light output port position of the second row of laser components 1. The arrangement of the two rows of lenses is consistent with the staggered arrangement of the two rows of laser components 1. That is, the gap position between two adjacent lenses in the first row corresponds to the arrangement position of the lenses in the second row, so that the two rows of lenses are staggered in the horizontal direction. This ensures that the light output port of each laser component 1 can be accurately aligned with the corresponding lens in the lens array 7, avoiding problems such as optical path offset and coupling deviation caused by the staggered arrangement of lasers.

[0087] Each lens in the lens array 7 is a collimating lens, and its central axis is coaxially aligned with the output optical path of the corresponding laser component 1. It is used to collimate the horizontal light signal after it has been deflected by the 90° angle prism 5, convert it into a parallel light signal, and then transmit it to the fiber array 6.

[0088] It should be noted that the misalignment of the lens array 7 is not limited to a fixed spacing. The misalignment spacing is adapted to the misalignment spacing of the two rows of laser components 1. It can be adaptively adjusted according to the size of the laser components 1, the distance between the light output ports and the overall layout of the module. As long as it can achieve precise alignment with the two rows of misaligned laser components 1 and ensure the optical path coupling efficiency, such structural adjustments should fall within the protection scope of this invention.

[0089] The staggered arrangement of each lens in the lens array 7 described above is determined based on the arrangement of the two rows of laser components 1. For example... Figure 25As shown, the staggered arrangement of the two rows of lenses has another advantage: the lenses are fixed by adhesive bonding, which is the preferred solution for assembling the lens array 7 and the PCB board 4 in this embodiment. This method is simple in process, low in cost, and can ensure the relative positional accuracy between the lenses and the PCB board 4, which is suitable for the mass production needs of high-speed emission modules. The staggered arrangement design of the lenses solves the problem of glue overflow interference that is easy to occur when adhesive bonding is used in the traditional aligned arrangement method.

[0090] In this embodiment, the two rows of lenses and the two rows of laser components 1 are arranged in a staggered manner, which effectively increases the distance between two adjacent lenses (including adjacent lenses in the same row and two rows of intersecting adjacent lenses), thereby forming sufficient glue overflow space at the bottom of the lens. Figure 25 (As shown in the shaded area). During the lens bonding process, the adhesive applied to the bottom of the lens, apart from the part used to fix the lens, allows excess adhesive to freely diffuse into the overflow space at the bottom of the lens. This prevents the adhesive from accumulating, contaminating the lens surface, or sticking to adjacent lenses. This ensures both the firmness of the lens bonding and the flatness and positional accuracy of the lens installation, avoiding optical path deviation and optical signal loss caused by adhesive overflow.

[0091] It should be noted that the size of the adhesive overflow space at the bottom of the lens can be adjusted adaptively according to the lens size, misalignment distance, and amount of adhesive used. The core purpose is to provide space for excess adhesive and prevent adhesive overflow from affecting the lens assembly accuracy and optical performance. However, the primary consideration should be that the lens installation position matches the arrangement of laser component 1 to ensure stable and accurate transmission of optical signals in each optical path.

[0092] In summary, this embodiment, by vertically arranging the laser component 1 in the fixing slot 2 and setting the fixing slot 2 in the through slot 40 on the PCB board 4, and keeping the electrodes of the laser component 1 and the gold fingers at the edge of the through slot 40 on the PCB board 4 at the same horizontal plane, enables the laser component 1 to emit light in the vertical direction. The vertical light emission method is conducive to the coupling of the subsequent optical path component 3, which can reduce the overall length of the module in the horizontal direction and is conducive to reducing the arrangement spacing between the laser components 1, thereby improving the overall integration density of the module, making the overall structure of the high-speed emission module more compact, effectively improving the integration of the product, and meeting the needs of high-density integration and miniaturization application scenarios.

[0093] Example 2: This embodiment proposes a high-speed optical module, which includes the high-speed transmission module described in Embodiment 1.

[0094] In this embodiment, by vertically arranging the laser component 1 in the fixing slot 2 and setting the fixing slot 2 in the through slot 40 on the PCB board 4, and keeping the electrodes of the laser component 1 and the gold fingers at the edge of the through slot 40 on the PCB board 4 at the same horizontal plane, the laser component 1 can emit light in the vertical direction. The vertical light emission method is conducive to the coupling of the subsequent optical path component 3, which can reduce the overall length of the module in the horizontal direction and is conducive to reducing the arrangement spacing between the laser components 1, thereby improving the overall integration density of the module, making the overall structure of the high-speed emission module more compact, effectively improving the integration of the product, and meeting the needs of high-density integration and miniaturization application scenarios.

[0095] The specific structure of the high-speed transmission module is described in Example 1 and will not be repeated in this example.

[0096] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-speed transmission module, characterized in that, It includes multiple laser components (1), mounting slots (2), optical path components (3) and PCB boards (4); The laser assembly (1) is vertically disposed in the fixed groove (2); wherein the electrode of the laser assembly (1) is disposed at the top; the light output path of the laser assembly (1) faces the plane where the top is located; The fixing groove (2) is disposed in a through groove (40) on the PCB board (4) that is adapted to the outline size of the fixing groove (2); wherein, the depth of the fixing groove (2) is such that the top electrode of the laser assembly (1) and the gold finger at the edge of the through groove (40) are on the same horizontal plane. The optical path component (3) is coupled to the output optical path of the plurality of laser components (1).

2. The high-speed transmission module according to claim 1, characterized in that, The laser assembly (1) is arranged in two rows in the fixing groove (2). The bottom surface of the laser assembly (1) in each row is in thermal contact with the bottom surface of the fixing groove (2). Each laser assembly (1) in each row has a side on which the laser is installed. The back side of the laser assembly (1) opposite to this side is in thermal contact with the inner wall of the fixing groove (2).

3. The high-speed transmission module according to claim 2, characterized in that, The top electrodes on the first row of laser assemblies (1) and the top electrodes on the second row of laser assemblies (1) are electrically connected to the gold fingers on the PCB board (4) adjacent to the inner wall of their respective fixing grooves (2) via gold wire bonding.

4. The high-speed transmission module according to claim 2, characterized in that, When the light output ports of the first row of laser components (1) are aligned with the straight line of the light output ports of the second row of laser components (1), the light output ports of the two rows of laser components (1) are arranged alternately.

5. The high-speed transmission module according to claim 4, characterized in that, The optical path component (3) includes at least one 90° angle prism (5) and a set of fiber arrays (6).

6. The high-speed transmission module according to claim 5, characterized in that, The incident surface of the 90° angle prism (5) receives the vertically emitted light from the two rows of laser components (1) and couples the two rows of horizontal light formed by the 90° angle refraction into the fiber array (6).

7. The high-speed transmission module according to claim 5, characterized in that, The fiber array (6) has a row of first fiber positioning slots (600) of first depth and a row of second fiber positioning slots (601) on the surface of the array base (60).

8. The high-speed transmission module according to claim 7, characterized in that, The array cover plate (61) of the fiber array (6) includes a substrate (610) and a structure (611). The structure (611) is located on the substrate (610) and is a three-dimensional square wave shape. The peak of the square wave is used to abut the optical fiber in the first optical fiber positioning slot (600), and the trough of the square wave is used to abut the optical fiber in the second optical fiber positioning slot (601).

9. The high-speed transmission module according to claim 1, characterized in that, The laser assembly (1) is arranged in two rows in the fixing groove (2). The bottom surface of the laser assembly (1) in each row is in thermal contact with the bottom surface of the fixing groove (2). Each laser assembly (1) in each row has a side on which a laser is provided. The adjacent side of the laser assembly (1) opposite to this side is in thermal contact with the inner wall of the fixing groove (2).

10. The high-speed transmission module according to claim 9, characterized in that, When the light output ports of the first row of laser components (1) are aligned with the straight line of the light output ports of the second row of laser components (1), the light output ports of the two rows of laser components (1) are arranged alternately.

11. The high-speed transmission module according to claim 9, characterized in that, The first electrodes of each laser assembly (1) in the first row are electrically connected to the gold fingers on the PCB board (4) adjacent to the inner wall of the fixing groove (2) by gold wire bonding. The second electrodes of each laser assembly (1) in the first row are electrically connected to the gold fingers on the PCB opposite to the inner wall of the fixing groove (2) via gold wire bonding.

12. The high-speed transmission module according to claim 9, characterized in that, The adjacent areas of the laser components (1) in the first row and the laser components (1) in the second row are stacked at a predetermined distance; wherein the predetermined distance avoids the location of each laser and prevents them from touching.

13. The high-speed transmission module according to claim 9, characterized in that, The optical path component (3) includes at least one 90° angle prism (5) and a set of fiber arrays (6).

14. The high-speed transmission module according to claim 13, characterized in that, The incident surface of the 90° angle prism (5) receives the vertically emitted light from the two rows of laser components (1) and couples the two rows of horizontal light formed by the 90° angle refraction into the fiber array (6).

15. The high-speed transmission module according to claim 13, characterized in that, The fiber array (6) has a row of first fiber positioning slots (600) of first depth and a row of second fiber positioning slots (601) on the surface of the array base (60).

16. The high-speed transmission module according to claim 15, characterized in that, The array cover plate (61) of the fiber array (6) includes a substrate (610) and a structure (611). The structure (611) is located on the substrate (610) and has a comb-shaped wave shape. Each peak of the comb-shaped wave is used to abut the fiber in the first fiber positioning groove (600), and the substrate (610) is used to abut the fiber in the second fiber positioning groove (601).

17. The high-speed transmission module according to claim 1, characterized in that, The optical path assembly (3) includes at least one 90° angle prism (5), at least one lens array (7), and a set of fiber arrays (6).

18. The high-speed transmission module according to claim 1, characterized in that, The space between the laser components (1) in the fixing groove (2) is filled with thermally conductive adhesive.

19. The high-speed transmission module according to claim 1, characterized in that, The material constituting the fixing groove (2) is tungsten copper or ceramic.

20. A high-speed optical module, characterized in that, The high-speed optical module includes the high-speed transmission module as described in any one of claims 1-19.

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