Vertical launch assembly structure and high speed optical module

Abstract

The present application relates to the technical field of optical module, in particular to a vertical emitting assembly structure and a high-speed optical module. The vertical emitting assembly structure comprises a comb-shaped base, at least two laser assemblies and a heat dissipation assembly; the comb-shaped base is vertically fixed on a heat-conducting platform, the comb teeth of the comb-shaped base are horizontally extended, and one laser assembly is arranged on each comb tooth; wherein the comb back of the comb-shaped base is thickened by a specified parameter at each comb tooth from top to bottom; one side wall of each laser assembly abuts against the bottom of the comb tooth gap, and the other side wall of the laser assembly abuts against the heat dissipation assembly. The heat of the laser assemblies located on different comb teeth can be more effectively conducted downward, and the cross-heat crosstalk problem caused by the simple alignment stacking is avoided.

Description

Technical Field

[0001] This invention relates to the field of optical module technology, and in particular to a vertical transmitting component structure and a high-speed optical module. Background Technology

[0002] With the rapid development of large-scale artificial intelligence models, the requirements for the transmission rate of high-speed optical modules in data centers are becoming increasingly higher. In order to meet the actual needs, high-speed optical modules with speeds of 400 gigabits per second (G) or 800G are currently in mass production, while optical modules with speeds of 1.6 terabits per second (T) are in small-batch production.

[0003] In data center scenarios, the space available inside servers and switches to accommodate optical modules is limited. To fit more channels (to achieve throughput of 1.6T or even higher) within a limited area, it is necessary to make each optical component smaller, increase the packaging density of optical components, and reduce the package size of the product. Furthermore, for high-power modules, reducing the package size allows for more space to be reserved for heat dissipation devices, thus improving the overall heat dissipation performance of the device.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a vertical transmitting component structure and a high-speed optical module, thereby solving the problems of large packaging size and insufficient heat dissipation performance of existing optical components.

[0006] The present invention adopts the following technical solution: In one aspect, a vertical emission assembly structure is provided, including a comb-shaped base 6, at least two laser assemblies 3 and a heat dissipation assembly 8; The comb-shaped base 6 is vertically fixed on the heat-conducting platform 5, and the comb teeth 60 of the comb-shaped base 6 are horizontally extended. Each comb tooth 60 is provided with a laser component 3. Wherein, the thickness of the comb back of the comb base 6 increases by a specified parameter from top to bottom, each time it passes through one level of the comb teeth 60; One sidewall of each laser assembly 3 abuts against the bottom 61 of the comb teeth, and the other sidewall of the laser assembly 3 abuts against the heat dissipation assembly 8.

[0007] Furthermore, the distance from the top of each of the comb teeth 60 to the bottom 61 of the comb tooth gap is the same; the plane of the other sidewall of each laser assembly 3 coincides with the plane of the top of the comb tooth 60 that supports it.

[0008] Furthermore, the first outer envelope 90 formed by each of the comb teeth 60 on the comb base 6 and the laser assembly 3, located on the top side of the comb teeth 60, is stepped, and the kick surface extends outward from the top.

[0009] Furthermore, the heat dissipation component 8 and the heat-conducting surfaces of the comb teeth 60 and the laser component 3 in each layer form a stepped inverted second outer envelope 91, wherein the second outer envelope 91 is mutually coupled with the stepped first outer envelope 90.

[0010] Furthermore, the bottom surface of the comb back is used as the first vertical side surface 63, and the side of the heat dissipation component 8 opposite to the second outer envelope 91 is used as the second vertical side surface 64, wherein the first vertical side surface 63 and the second vertical side surface 64 are parallel to each other.

[0011] Furthermore, one of the comb-shaped bases 6 is composed of three comb teeth 60, and the three laser components 3 disposed on the three comb teeth 60, together with one laser component 3 disposed on the heat-conducting platform 5, constitute four laser components 3 under the jurisdiction of one comb-shaped base 6.

[0012] Furthermore, the number of the comb-shaped bases 6 is two or more.

[0013] Furthermore, the heat dissipation component 8 is made of a homogeneous thermally conductive material.

[0014] Furthermore, the heat dissipation component 8 is composed of m L-shaped TECs and 1 rectangular TEC, wherein m is the same as the number of comb teeth 60; The L-shaped TEC transfers heat from the vertical surface of the laser assembly 3 on the other side to the top surface of the L-shaped TEC located below it, or the L-shaped TEC transfers heat from the vertical surface of the laser assembly 3 on the other side to the top surface of the rectangular TEC located below it. The rectangular TEC transfers the vertical heat from the laser assembly 3 located at the bottom of the comb-shaped base 6, and the horizontal heat from the bottom of the adjacent L-shaped TEC above, to the heat-conducting platform 5 located below it.

[0015] Furthermore, it also includes an optical fiber array, which includes an array base 1 and an array cover 2, wherein the array base 1 is provided with at least two optical fiber positioning slots.

[0016] Furthermore, the array base 1 is provided with a first fiber positioning groove 100 and a second fiber positioning groove 110. The first fiber positioning groove 100 and the second fiber positioning groove 110 are arranged left and right according to specified parameters, and are vertically separated by the height difference of adjacent comb teeth. The first fiber positioning groove 100 is located at the bottom of the stepped channel 19 generated on the array base 1, and the second fiber positioning groove 110 is located on the first step 10; wherein, the bottom of the first step 10 and the bottom of the stepped channel 19 are vertically separated by the height difference of the adjacent comb teeth.

[0017] Furthermore, when the number of laser components 3 managed by the comb-shaped base 6 is four, the array base 1 is also provided with a third fiber positioning groove 120 and a fourth fiber positioning groove 130. The third fiber positioning groove 120 is located on the second step 11, which is vertically separated from the first step 10 by the height difference of adjacent comb teeth. The fourth fiber positioning groove 130 is located on the third step 12, which is vertically separated from the second step 11 by the height difference of adjacent comb teeth. The height difference between the first step 10, the second step 11 and the third step 12 relative to the bottom of the step channel 19 increases sequentially, and the horizontal spacing relative to the bottom of the step channel 19 increases sequentially.

[0018] Furthermore, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is processed into a stepped shape. The kick surface 210 of the first step is used to couple the first optical fiber positioning groove 100, the kick surface 211 of the second step is used to couple the second optical fiber positioning groove 110, the kick surface 212 of the third step is used to couple the third optical fiber positioning groove 120, and the substrate 20 is used to couple the fourth optical fiber positioning groove 130.

[0019] Furthermore, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is processed into a stepped shape. The kick surface 210 of the first step is used to couple the first optical fiber positioning groove 100, the kick surface 211 of the second step is used to couple the second optical fiber positioning groove 110, the kick surface 212 of the third step is used to couple the third optical fiber positioning groove 120, and the kick surface 213 of the fourth step is used to couple the fourth optical fiber positioning groove 130. The substrate 20 is used to couple the corresponding surfaces of the array base 1.

[0020] Furthermore, when the number of laser components 3 managed by the comb-shaped base 6 is two, and the number of comb-shaped bases 6 is two, the array base 1 is also provided with a third fiber positioning slot 120 and a fourth fiber positioning slot 130. The third fiber positioning slot 120 and the fourth fiber positioning slot 130 replicate the relative structural relationship of the first fiber positioning slot 100 and the second fiber positioning slot 110 on the array base 1, and form an arrangement combination with the first fiber positioning slot 100 and the second fiber positioning slot 110.

[0021] Furthermore, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is a three-dimensional square wave shape. The peak 215 of the square wave is used to abut against the second optical fiber positioning groove 110 and the fourth optical fiber positioning groove 130, and the trough 216 of the square wave is used to abut against the first optical fiber positioning groove 100 and the third optical fiber positioning groove 120.

[0022] Furthermore, on the light-incident surface side, the structure 21 extends beyond the array base 1 by a predetermined length; a lens mounting base 214 is formed on the peak 215 and the trough 216 of the square wave of the structure 21 at the predetermined length.

[0023] Furthermore, when the number of laser components 3 managed by the comb-shaped base 6 is 4, and the number of comb-shaped bases 6 is n, the array base 1 is respectively provided with n first fiber positioning slots 100, n second fiber positioning slots 110, n third fiber positioning slots 120, and n fourth fiber positioning slots 130. The plane containing the n second fiber positioning slots 110 is higher than the plane containing the n first fiber positioning slots 100 by the height difference between adjacent comb teeth; the plane containing the n third fiber positioning slots 120 is higher than the plane containing the n second fiber positioning slots 110 by the height difference between adjacent comb teeth; and the plane containing the n fourth fiber positioning slots 130 is higher than the plane containing the n third fiber positioning slots 120 by the height difference between adjacent comb teeth. The fiber array is arranged in a periodic pattern with adjacent first fiber positioning slots 100, second fiber positioning slots 110, third fiber positioning slots 120, and fourth fiber positioning slots 130.

[0024] Furthermore, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and has a comb-shaped wave. Each peak 215 of the comb-shaped wave is used to abut against the first fiber positioning groove 100, the second fiber positioning groove 110 and the third fiber positioning groove 120. The substrate 20 is used to abut against the fourth fiber positioning groove 130.

[0025] Secondly, a high-speed optical module is provided, which includes the above-mentioned vertical transmitting component structure.

[0026] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: The present invention adopts a vertical comb-shaped base to support the laser assembly, thereby improving the space utilization rate of the laser assembly in the vertical space inside the optical module, so as to reduce the packaging size. Furthermore, the comb back of the comb-shaped base is thickened by a specified parameter from top to bottom, and the structural design of the laser assemblies of adjacent channels are not on the same vertical plane, so that the heat dissipation of the laser assemblies located on different comb teeth can be more effectively conducted downward, avoiding the crosstalk problem caused by simple alignment stacking. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0028] Figure 1 This is a schematic diagram of a specific example of a 16-channel optical component provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of a specific example of a comb-shaped base provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of a specific example of a heat dissipation component and a comb-shaped base provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a specific example of a heat dissipation component and a comb-shaped base provided in an embodiment of the present invention; Figure 5 This is a schematic diagram illustrating a specific example of a first outer envelope and a second outer envelope provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of a specific example of a heat dissipation component provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of a specific example of a heat dissipation component provided in an embodiment of the present invention; Figure 8 This is a schematic diagram illustrating a specific example of a heat-conducting surface and a heat-dissipating surface provided in an embodiment of the present invention; Figure 9 This is a schematic diagram illustrating a specific example of a flexible band provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of a specific example of a 4-channel fiber optic array provided in an embodiment of the present invention; Figure 11This is a schematic diagram of a specific example of a 4-channel fiber optic array provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of a specific example of a 4-channel fiber optic array provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of a specific example of a stepped trench provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of a specific example of an array base provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of a specific example of an array cover plate provided in an embodiment of the present invention; Figure 16 This is a schematic diagram of a specific example of an array cover plate provided in an embodiment of the present invention; Figure 17 This is a schematic diagram of a specific example of a 4-channel fiber optic array provided in an embodiment of the present invention; Figure 18 This is a schematic diagram of a specific example of a 4-channel optical component provided in an embodiment of the present invention; Figure 19 This is a schematic diagram of a specific example of an array base provided in an embodiment of the present invention; Figure 20 This is a schematic diagram of a specific example of an array cover plate provided in an embodiment of the present invention; Figure 21 This is a schematic diagram illustrating a specific example of an array base and an array cover provided in an embodiment of the present invention; Figure 22 This is a schematic diagram of a specific example of a second lens provided in an embodiment of the present invention; Figure 23 This is a schematic diagram of a specific example of a lens mounting base provided in an embodiment of the present invention; Figure 24 This is a schematic diagram of a specific example of an 8-channel array base provided in an embodiment of the present invention; Figure 25 This is a schematic diagram of a specific example of an 8-channel transmitting assembly provided in an embodiment of the present invention; Figure 26 This is a schematic diagram of a specific example of a T-shaped pedestal provided in an embodiment of the present invention; Figure 27 This is a schematic diagram illustrating another specific example of the alternating arrangement of multiple fiber positioning slots provided in this embodiment of the invention; Figure 28 This is a schematic diagram of a specific example of a comb-shaped wave structure provided in an embodiment of the present invention; Figure 29 This is a schematic diagram illustrating a specific example of fiber optic array spacing provided in an embodiment of the present invention; Figure 30 This is a schematic diagram of a specific example of a 16-channel optical component provided in an embodiment of the present invention.

[0029] The reference numerals in the attached figures are as follows: Array base 1, First step 10, First fiber positioning groove 100, Second step 11, Second fiber positioning groove 110, Third step 12, Third fiber positioning groove 120, Fourth fiber positioning groove 130, Fifth fiber positioning groove 140, Sixth fiber positioning groove 150, Seventh fiber positioning groove 160, Eighth fiber positioning groove 170, Fiber 18, Step channel 19, Array cover plate 2, Substrate 20, Structure 21, Kick surface of the first step 210, Kick surface of the second step 211, Kick surface of the third step 212, Kick surface of the fourth step 213, Lens mounting base 214, Peak 215, Valley 216, Pole 217, Laser assembly 3, First laser assembly 30, Second laser assembly 31, Third laser assembly 32, Fourth laser Component 33, fifth laser component 36, sixth laser component 37, seventh laser component 38, eighth laser component 39, platform 4, first platform 40, second platform 41, third platform 42, fourth platform 43, heat-conducting platform 5, comb-shaped base 6, comb teeth 60, bottom of comb tooth gap 61, soft strip 62, first vertical side surface 63, second vertical side surface 64, first lens 70, second lens 71, heat dissipation component 8, first TEC 80, first heat-conducting surface 800, first heat transfer surface 801, second TEC 81, second heat-conducting surface 810, second heat transfer surface 811, third TEC 82, third heat-conducting surface 820, third heat transfer surface 821, fourth TEC 83, fourth heat-conducting surface 830, fourth heat transfer surface 831, first outer envelope 90, second outer envelope 91. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0031] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0032] In this invention, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0033] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "coupled" can refer to an electrical connection that enables signal transmission.

[0034] In the specific embodiments of this invention, the use of embodiment numbers is merely for the convenience of browsing the technical solutions, distinguishing different implementations that belong to the same technical solution of this invention but have obvious differences in details. When specifically determining the technical combination and scope of protection, the technical examples in each embodiment should not be physically separated and differentiated. Instead, they should be analyzed from the underlying principles and concepts, understanding each embodiment as a different means of presenting a complete technical solution. Their underlying principles and extension methods can be mutually referenced and used.

[0035] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0036] Example 1: Embodiment 1 of the present invention provides a vertical launching component structure, such as... Figure 1 and Figure 2 As shown, the vertical emission assembly structure includes a comb-shaped base 6, at least two laser assemblies 3, and a heat dissipation assembly 8. The comb-shaped base 6 is vertically fixed on a heat-conducting platform 5. The comb teeth 60 of the comb-shaped base 6 extend horizontally, and each comb tooth 60 is provided with one laser assembly 3 to form a vertical emission assembly structure. In an optional implementation, the light output port of the laser assembly 3 is typically coupled with a first lens 70 for adjusting the light spot.

[0037] To improve the integration tightness of the comb-shaped base 6 and the heat-conducting platform 5, as well as the accuracy of the assembly process, in one embodiment, the comb teeth 60 located at the bottom of the comb-shaped base 6 are removed in the design, and the bottom of the comb-shaped base 6 is vertically inserted into the heat-conducting platform 5. This not only simplifies the complexity of the installation process (i.e., only grooves adapted to the comb back of the comb-shaped base 6 need to be made on the heat-conducting platform 5), but also improves the heat dissipation characteristics of the laser component 3 located at the bottom of the comb-shaped base 6. This allows the TEC located at the bottom to better meet the heat dissipation needs of the TEC located above it when a thermoelectric cooler (TEC) is subsequently proposed as a heat dissipation component 8, thus playing a better service role.

[0038] As an optional implementation, if the bottom layer of the comb-shaped base 6 is also provided with comb teeth 60 to support the laser component 3 located at the bottom of the comb-shaped base 6, then the fixing between the corresponding comb-shaped base 6 and the heat-conducting platform 5 tends to require precise bonding or welding fixation by means of triaxial positioning.

[0039] like Figure 3 As shown, the thickness of the comb back of the comb base 6 increases by a specified parameter (i.e., from top to bottom, after each level of comb teeth 60) on the comb back. Figure 3 As shown in d1), the structural design of the laser components 3 of adjacent channels not being on the same vertical plane allows the heat dissipation of the laser components 3 located on different comb teeth 60 to be conducted downward more effectively, avoiding the cross-thermal interference problem caused by simple alignment stacking. However, if the thickness of the comb back is too large, it will lead to an increase in the structural volume of the vertical emission component, which is not conducive to the optimization of the packaging size. If the thickness of the comb back is too small, the heat generated by the laser component 3 cannot be conducted in one direction. In actual use scenarios, the specified parameters shall be determined by those skilled in the art based on the actual situation.

[0040] One sidewall of each laser assembly 3 abuts against the bottom 61 of the comb teeth, and the other sidewall of the laser assembly 3 (i.e. Figure 3 The light gray filler surface (in the image) abuts against the heat dissipation component 8. In this embodiment, the lower end of the heat dissipation component 8 is fixed to the heat conduction platform 5, so that the heat dissipation component 8 can unidirectionally conduct the heat generated by the laser component 3 to the heat conduction platform 5 for heat dissipation.

[0041] In one embodiment, to facilitate processing and reduce overall size, the comb back corresponding to the uppermost laser assembly 3 can typically be removed during the design phase, resulting in the following final effect: Figure 3As shown, it is easy to understand that the uppermost comb back itself can serve to fix the laser assembly 3 in a positioning position. However, this requires additional material, and the comb back also needs to have a certain thickness to exhibit the rigidity and resistance to deformation required for the positioning function. This increases the overall volume of the comb back. Therefore, the embodiments of the present invention further propose the following... Figure 3 The optional structure shown.

[0042] To support the laser assembly 3, the distance from the top of each comb tooth 60 to the bottom 61 of the comb tooth gap (i.e., d2 shown in Figure 3) is the same. In this embodiment, this distance is equal to the width of the laser assembly 3, ensuring that the plane of the other sidewall of each laser assembly 3 coincides with the plane of the top of the comb tooth 60 that supports it. This minimizes the volume of the comb-shaped base 6 while ensuring the fixation of the laser assembly 3. It is easy to understand that in this embodiment, the other sidewall of the laser assembly 3 and the plane of the top of the comb tooth 60 are the same concept when they are coplanar. Furthermore, the heat dissipation component 8 also coincides with the plane of the top of the comb tooth 60, and the thickness of the heat dissipation component 8 is the same as the length of the laser. This allows the other sidewall of the laser assembly 3 to completely fit against the heat dissipation component 8, maximizing the heat conduction area and improving heat conduction efficiency.

[0043] It is understandable that, since the thickness of the comb back of the comb-shaped base 6 increases from top to bottom and the distance from the tip of each comb tooth 60 to the bottom 61 of the comb tooth gap is the same, the first outer envelope 90 (i.e., the first outer envelope 90 formed by each comb tooth 60 on the comb-shaped base 6 and the laser assembly 3 on the side of the tip of the comb tooth 60) is located on the top side of the comb tooth 60. Figure 3 The bold dashed lines shown are stepped, and the kick plate extends outward from the top. The outward direction refers to the side closer to the heat dissipation component 8. The number of steps in the first outer envelope 90 is the same as the number of laser components 3. The distance the kick plate extends outward is the same as the difference in the increase in the thickness of the corresponding comb back. Taking the first laser component 30 and the second laser component 31 arranged sequentially from the bottom to the top of the comb base 6 as an example, compared to the second laser component 31, the thickness of the corresponding comb back of the first laser component 30 is increased by d1, and the distance the corresponding kick plate extends outward is also d1.

[0044] To achieve the fit between the heat dissipation component 8 and the other sidewall of the laser component 3, the heat dissipation component 8 and the heat-conducting surfaces of each layer of comb teeth 60 and the laser component 3 form a stepped, inverted second outer envelope 91 (i.e., Figure 3(As shown by the other bold dashed line), where the second outer envelope 91 is coupled to the stepped first outer envelope 90. It should be noted here that... Figure 3 The fact that the second outer envelope 91 does not coincide with the outer contour of the heat dissipation component 8 is merely to demonstrate the shape of the second outer envelope 91. It can be understood as a translation of the envelope of the outer contour of the heat dissipation component 8. Figure 3 The second outer envelope 91. In this embodiment, the number of steps in the second outer envelope 91 is also consistent with the number of laser components 3. The corresponding kick surfaces of the first outer envelope 90 and the second outer envelope 91 coincide to form a mutual coupling relationship. Figure 2 It is easy to understand that the first outer envelope 90 and the second outer envelope 91 are the same concept when they are mutually coupled. In actual implementation, in order to further improve the corresponding heat dissipation efficiency, the embodiments of the present invention also propose the following... Figure 4 and Figure 5 The preferred implementation of the first outer envelope 90 and the second outer envelope 91 shown is compared to Figure 3 In this preferred implementation, each stage of the corresponding heat dissipation component 8 (refer to...) Figure 6 The first heat-conducting surface 800, the second heat-conducting surface 810, the third heat-conducting surface 820, and the fourth heat-conducting surface 830 (each a level) not only utilize the lateral vertical surfaces to conduct heat with the lateral vertical surfaces of the laser assembly 3 and the comb teeth 60, but also extend the area of ​​each level in the heat dissipation assembly 8, so that the kick surface of the heat dissipation assembly 8 is also utilized to abut against part of the upper surface of the next level laser assembly 3. Therefore, not only is the overall volume of the heat-conducting material in the heat dissipation assembly 8 increased, but the heat-conducting contact area is also improved compared to... Figure 2 and Figure 3 The structure shown has higher thermal conductivity.

[0045] To ensure the overall stability of the structure, such as Figure 3 and Figure 6 As shown, the bottom surface of the comb back is used as the first vertical side surface 63 (e.g., Figure 6 As shown in the medium grayscale filling surface), the side of the heat dissipation component 8 opposite to the second outer envelope 91 is used as the second vertical side surface 64 (e.g. Figure 3(As shown in the medium-dark grayscale fill surface), wherein the first vertical side surface 63 and the second vertical side surface 64 are parallel to each other. In this embodiment, the first vertical side surface 63 is parallel to the plane containing the top of each comb tooth 60, and the second vertical side surface 64 is parallel to the plane containing each heat-conducting surface. Both the first vertical side surface 63 and the second vertical side surface 64 are perpendicular to the heat-conducting platform 5. The outer contours of the comb-shaped base 6, which carries the laser assembly 3, and the heat dissipation assembly 8 form an approximately rectangular shape to reduce the overall structure volume.

[0046] It should be further noted that the first vertical side surface 63 and the second vertical side surface 64 can also be processed into inclined or stepped surfaces in optional solutions. Considering that the laser components 3 associated with the comb-shaped base 6 proposed in this embodiment of the invention are preferably in groups of four, when multiple sets of comb-shaped bases 6 need to be set, they may be staggered and may also have receiving components or other circuit parts intersecting with each other. In this case, there may be space for the first vertical side surface 63 and the second vertical side surface 64 to be processed into inclined or stepped surfaces in optional solutions. This irregular surface structure design is usually also to further improve the overall heat dissipation characteristics.

[0047] In this embodiment, as Figure 6 As shown, the vertical emission assembly structure includes four laser assemblies 3, and a comb-shaped base 6 is composed of three comb teeth 60. The three laser assemblies 3 disposed on the three comb teeth 60 and the laser assembly 3 disposed on the heat-conducting platform 5 constitute the four laser assemblies 3 under the jurisdiction of the comb-shaped base 6. Specifically, from the bottom to the top of the comb-shaped base 6, a first laser assembly 30, a second laser assembly 31, a third laser assembly 32, and a fourth laser assembly 33 are sequentially arranged. The comb back corresponding to the fourth laser assembly 33 is removed in the design to reduce the packaging size. The thickness of the comb back corresponding to the third laser assembly 32, the second laser assembly 31, and the first laser assembly 30 increases by a specified parameter in sequence. One sidewall of the first laser assembly 30, the second laser assembly 31, and the third laser assembly 32 abuts against the bottom 61 of the corresponding comb teeth. The plane of one sidewall of the fourth laser assembly 33 coincides with the plane of the first vertical side surface 63 of the comb-shaped base 6. The other sidewall of the first laser assembly 30, the second laser assembly 31, the third laser assembly 32, and the fourth laser assembly 33 abuts against the heat dissipation assembly 8.

[0048] refer to Figure 3It is understood that the first outer envelope 90 formed by the three comb teeth 60 and the corresponding four laser components 3 has four steps, and the kick surfaces of the four steps from the top downwards extend outwards by a specified parameter d1, combined with... Figure 6 The heat dissipation component 8 has a first heat-conducting surface 800 that abuts against the first laser component 30, a second heat-conducting surface 810 that abuts against the second laser component 31, a third heat-conducting surface 820 that abuts against the third laser component 32, and a fourth heat-conducting surface 830 that abuts against the fourth laser component 33. The first heat-conducting surface 800, the second heat-conducting surface 810, the third heat-conducting surface 820, and the fourth heat-conducting surface 830 are parallel to each other, and the horizontal distance between adjacent heat-conducting surfaces is a specified parameter d1. Furthermore, the number of steps of the second outer envelope 91 formed by the three-layer comb teeth 60 and the first heat-conducting surface 800, the second heat-conducting surface 810, the third heat-conducting surface 820, and the fourth heat-conducting surface 830 is also four. In this embodiment of the invention, the first outer envelope 90 and the second outer envelope 91 are mutually coupled and are the same concept.

[0049] It should be noted that this embodiment represents a relatively extreme vertical load capacity under the current optical module size standard, considering the height of the chip-on-carrier (CoC) board (also described as laser assembly 3 in this embodiment) with the laser installed. With future specification modifications, if the height space of the optical module or the application scenario of this invention becomes more permissible, the number of laser assemblies 3 in the vertical direction can exceed [the specified limit]. Figure 6 The four shown.

[0050] To accommodate application scenarios with different numbers of laser components 3, the number of comb-shaped bases 6 on the heat-conducting platform 5 can be two or more. Under the condition that the planar space of the optical module or the scenario in which the present invention is applied allows, the number of comb-shaped bases 6 can be further increased to expand the number of laser components 3 and improve the transmission efficiency of the transmitting components.

[0051] To enable more effective downward conduction of heat dissipation from laser components 3 located on different comb teeth 60, in one embodiment, the heat dissipation component 8 is made of a homogeneous thermally conductive material. Specifically, the heat dissipation component 8 can be a comb-shaped heat dissipation component that matches the comb-shaped base 6. The comb-shaped heat dissipation component is vertically fixed on the thermally conductive platform 5. The outer contour of the side of the comb-shaped heat dissipation component closest to the comb-shaped base 6 conforms to the second outer envelope 91. The thermally conductive surface of the comb-shaped heat dissipation component covers the other sidewall of the corresponding laser component 3 and the top of the corresponding comb tooth 60 to achieve heat dissipation. In a preferred embodiment, the homogeneous thermally conductive material is tungsten copper.

[0052] In conjunction with the embodiments of the present invention, considering that in practical application scenarios, a homogeneous heat dissipation component 8 alone may not be sufficient to meet specific heat dissipation requirements. In particular, with the increasing trend towards higher integration requirements, it is impossible to provide sufficiently large gaps to allow for the placement of a sufficiently large heat dissipation component 8 between the comb-shaped bases 6 to achieve the desired heat dissipation effect. Therefore, the embodiments of the present invention also provide an alternative... Figure 2 The heat dissipation assembly 8 made of homogeneous material is an optional embodiment.

[0053] In optional embodiments, such as Figure 7 As shown, the heat dissipation component 8 is composed of m L-shaped TECs and 1 rectangular TEC, where m is the same as the number of comb teeth 60. The vertical surface of the L-shaped TEC that abuts against the other side wall of the laser component 3 is a heat-conducting surface, and the vertical surface of the L-shaped TEC that abuts against the lower L-shaped TEC or rectangular TEC is a heat-transfer surface. The vertical surface of the rectangular TEC that abuts against the other side wall of the lowermost laser component 3 is a heat-conducting surface, and the vertical surface of the rectangular TEC that abuts against the heat-conducting platform 5 is a heat-transfer surface. The heat-conducting surface can completely cover the other side wall of the corresponding laser component 3 to ensure heat conduction efficiency.

[0054] In one embodiment, the L-shaped TEC transfers heat from the other sidewall of the laser assembly 3 to the top surface of the L-shaped TEC located below it, or the L-shaped TEC transfers heat from the other sidewall of the laser assembly 3 to the top surface of the rectangular TEC located below it; the rectangular TEC transfers heat from the other sidewall of the laser assembly 3 located at the bottom of the comb-shaped base 6, as well as horizontal heat from the bottom of the adjacent L-shaped TEC located above it, to the heat-conducting platform 5 located below it. In an optional implementation, the bottom rectangular TEC can also adopt the same L-shaped structure as the other TECs, and the vertical part of the corresponding L-shaped structure can be directly embedded into the heat-conducting platform 5. This is also an improved design considering the consistency of corresponding procurement specifications.

[0055] Specifically, such as Figure 7 and Figure 8 As shown, taking the heat dissipation component 8, which includes three L-shaped TECs and one rectangular TEC, as an example, the rectangular TEC that abuts against the first laser component 30 is the first TEC 80, the L-shaped TEC that abuts against the second laser component 31 is the second TEC 81, the L-shaped TEC that abuts against the third laser component 32 is the third TEC 82, and the L-shaped TEC that abuts against the fourth laser component 33 is the fourth TEC 83. The heat-conducting surface of the first TEC 80 is the first heat-conducting surface 800, and the heat-conducting surface of the second TEC 81 is the second heat-conducting surface 800. The heat-conducting surface 810 of the first TEC80, the heat-conducting surface 820 of the second TEC82, and the heat-conducting surface 830 of the fourth TEC83 form a second outer envelope 91. The heat transfer surface of the first TEC80 is a first heat transfer surface 801, the heat transfer surface of the second TEC81 is a second heat transfer surface 811, the heat transfer surface of the third TEC82 is a third heat transfer surface 821, and the heat transfer surface of the fourth TEC83 is a fourth heat transfer surface 830. The heat transfer surface is the fourth heat transfer surface 831, which abuts against the top surface of the third TEC 82. Through the fourth heat transfer surface 831, the fourth TEC 83 transfers the heat of the fourth laser component 33 to the third TEC 82. The third heat transfer surface 821 abuts against the top surface of the second TEC 81, which transfers the heat of the third laser component 32 and the third TEC 82 to the second TEC 81. The second heat transfer surface 811 abuts against the top surface of the first TEC 80, which transfers the heat of the second laser component 31 and the second TEC 81 to the first TEC 80. The first heat transfer surface 801 abuts against the heat conduction platform 5, which transfers the heat of the first laser component 30 and the second TEC 81 to the heat conduction platform 5. This allows the heat generated by the four laser components 3 to be unidirectionally conducted to the heat conduction platform 5 for heat dissipation.

[0056] By comparison Figure 7 and Figure 2As can be seen, after adopting TEC as the main component of heat dissipation assembly 8, the heat-conducting surface of each TEC stage only contacts the side surface of the laser assembly 3, abandoning contact with the side surface of the comb teeth 60. This fully considers that the heat of the comb teeth 60 directly comes from the working heat of the laser assembly 3. Therefore, concentrating the contact of the heat-conducting surface of the laser assembly 3 not only reduces the difficulty of assembly and processing between devices, but also reduces the procurement cost of TEC. Furthermore, in actual implementation, the heat-conducting surfaces between the fourth TEC 83 and the third TEC 82, between the third TEC 82 and the second TEC 81, and between the second TEC 81 and the first TEC 80 are usually not strictly aligned. Figure 7 Instead of being approximately the same, the design will be differentiated according to the actual power of the purchased TEC, and the design of the heat conduction surface will be optimized through actual testing to make the temperature dissipation process of the upper-level TEC and the heat dissipation process of the laser component 3 it is responsible for as consistent as possible.

[0057] The selection of the first TEC80, second TEC81, third TEC82 and fourth TEC83 is preferably based on the number of laser components 3 they support. For example, the fourth TEC83 needs to be equipped with the heat dissipation power of 1 laser component 3, the third TEC82 needs to be equipped with the heat dissipation power of 2 laser components 3, the second TEC81 needs to be equipped with the heat dissipation power of 3 laser components 3, and the first TEC80 needs to be equipped with the heat dissipation power of 4 laser components 3.

[0058] Furthermore, in the implementation scheme employing the TEC combination, the laser component 3 is coupled with a thermistor (i.e., Figure 7 (In the shaded area), the thermistor is used to accurately detect the actual junction temperature of the laser component 3, providing a temperature feedback signal for closed-loop temperature control of the TEC. The thermistor and the TEC are coupled to the control circuit. The control circuit calculates the current temperature based on the resistance or voltage of the thermistor, compares it with the preset temperature, and drives the TEC to cool or heat, allowing the laser component 3 to operate at a constant temperature. Specifically, the first laser component 30 is coupled with a first thermistor, the second laser component 31 is coupled with a second thermistor, the third laser component 32 is coupled with a third thermistor, and the fourth laser component 33 is coupled with a fourth thermistor. The preset temperatures of the first, second, third, and fourth thermistors also need to be set according to the heat dissipation power of the corresponding TEC.

[0059] In order to make such Figure 7The stacked laser assembly layout shown enables external electrical connection, as in one embodiment, such as... Figure 9 As shown, a flexible strip 62 is provided at the tail end of the laser assembly 3.

[0060] In another embodiment, the printed circuit board (PCB) carrying the driver chip can be fabricated into a small chip and mounted vertically. Figure 9 The back side of the laser assembly 3 is shown, thereby further reducing the increased impedance matching difficulty caused by the varying lengths of the flexible strip 62 in each laser assembly 3. It should be noted that... Figure 9 The flexible strip in the middle did not have a mating position on the PCB board side. Figure 9 Accurate expression in Chinese, while Figure 9 The image shows the other ends of the soft strips stacked together as an illustration.

[0061] Example 2: To accommodate laser components 3 of varying heights, the vertical emission assembly structure also includes an optical fiber array. This invention provides... Figure 10 , Figure 11 and Figure 12 The three specific implementations of the fiber optic array shown in the figure all include an array base 1 and an array cover plate 2. The array base 1 is provided with at least two fiber positioning slots.

[0062] In the corresponding Figure 10 In the figures, the fiber optic positioning slots are all depicted as V-groove structures. However, as an optional implementation, the corresponding fiber optic positioning slots can also be made into rectangular slots, arc-shaped slots, or polygonal slots to adapt to different fiber optic application scenarios. Therefore, the fiber optic positioning slot structures in the related figures should not be over-interpreted as meaning that the present invention can only use V-groove structures.

[0063] The fiber array structure proposed in this embodiment of the invention, when applied to optical module scenarios, especially in the transmitting component, distributes optical fibers 18 in the height direction to match laser components 3 at different heights, thereby improving the space utilization of the laser components 3 in the vertical space inside the optical module.

[0064] In the application scenario of a single-sided laser module 3, in order to make full use of the internal space of the module located on one side of the PCB board after the PCB is installed inside the optical module, this embodiment provides a specific implementation method of the fiber array, as described in Implementation Method 1 below: like Figure 10As shown, in one embodiment, the array base 1 is provided with a first fiber positioning slot 100 and a second fiber positioning slot 110. The horizontal spacing between the first fiber positioning slot 100 and the second fiber positioning slot 110 is consistent with the horizontal spacing between the light output ports of adjacent laser components 3, and the vertical spacing is consistent with the vertical spacing between the light output ports of adjacent laser components 3. Specifically, when the relative positions of the lasers in adjacent laser components 3 are consistent, the horizontal spacing between the first fiber positioning slot 100 and the second fiber positioning slot 110 is consistent with the horizontal spacing between the light output ports of adjacent laser components 3. Figure 3 The specified parameters for the thickening of the comb back are the same as those described above. In an optional embodiment of an optical module application, the spacing between the left and right arrangements can be 125 micrometers; the vertical spacing between the first fiber positioning groove 100 and the second fiber positioning groove 110 is the height difference between adjacent comb teeth (i.e., Figure 3 (h1 shown in the figure). In the various optional embodiments of the present invention, the left-right arrangement and the top-bottom arrangement shown in the corresponding figures should be understood as optional arrangement methods. After understanding the innovative core of the vertical layout of the present invention, the left-right relationship and the top-bottom arrangement shown in the corresponding figures can be adapted to replace each other. The first fiber positioning slot 100 and the second fiber positioning slot 110 are used here for the convenience of subsequent feature description, and are only used to distinguish the two types of fiber positioning slots with different spatial structures.

[0065] In one embodiment, p first fiber positioning slots 100 constitute a first fiber positioning slot array, and q second fiber positioning slots 110 constitute a second fiber positioning slot array. Figure 10 The number of fiber optic positioning slots in the structure is simply replicated, evolving from a 2-channel structure to a multi-channel structure, to form a first fiber optic positioning slot array and a second fiber optic positioning slot array.

[0066] In one embodiment, the first fiber positioning groove 100 is located in the stepped channel 19 generated on the array base 1 (i.e., Figure 13 At the bottom of the shaded area, the second fiber positioning groove 110 is located on the first step 10; wherein the bottom of the first step 10 and the bottom of the step channel 19 are vertically separated by the height difference of the adjacent comb teeth.

[0067] For each pair of adjacent fiber positioning slots on the array base 1, such as the first fiber positioning slot 100 and the second fiber positioning slot 110, the first fiber positioning slot 100 and the second fiber positioning slot 110 are arranged horizontally and vertically, and are separated by the height difference between adjacent comb teeth (i.e., Figure 14 h1 in the middle, and Figure 3 (The h1 shown is the same), forming as Figure 10The stepped, staggered structure is shown. For the fiber optic positioning slots that do not involve the top surface, the fiber optic cable 18 is disposed in the space formed between the step of the array cover plate 2 and the first fiber optic positioning slot 100 and the second fiber optic positioning slot 110, as shown. Figure 14 The first and second fiber positioning slots from bottom to top are shown; the top surface is the side of the array base 1 facing the array cover plate 2. For the fiber positioning slots involving the top surface, as shown... Figure 14 As shown in the first fiber positioning slot from top to bottom, the corresponding fiber 18 is located in the space formed by the top surface and the array cover plate 2. The height difference between adjacent comb teeth is the distance between the center lines of adjacent channel fiber 18 in the vertical height component. The height difference between adjacent comb teeth is determined by those skilled in the art according to the specific application scenario. For example, in applications coupled with laser assembly 3, the height difference between adjacent comb teeth is set according to the height difference of the lasers stacked on top and bottom.

[0068] The above description of this embodiment has specifically explained the specific form of the optical fiber array when the comb-shaped base 6 includes one comb tooth 60. When the number of comb teeth 60 included in the comb-shaped base 6 is further expanded, the specific form of the optical fiber array should also be adjusted accordingly.

[0069] like Figure 14 As shown, in one embodiment, when the number of laser components 3 managed by the comb-shaped base 6 is four, the array base 1 is further provided with a third fiber positioning groove 120 and a fourth fiber positioning groove 130. The third fiber positioning groove 120 is located on the second step 11, which is vertically separated from the first step 10 by the height difference of adjacent comb teeth. The fourth fiber positioning groove 130 is located on the third step 12, which is vertically separated from the second step 11 by the height difference of adjacent comb teeth. The height difference between the first step 10, the second step 11, and the third step 12 relative to the bottom of the step channel 19 increases sequentially, and the horizontal spacing relative to the bottom of the step channel 19 increases sequentially.

[0070] The optical fibers 18 disposed in the first optical fiber positioning slot 100, the second optical fiber positioning slot 110, the third optical fiber positioning slot 120 and the fourth optical fiber positioning slot 130 are respectively coupled to the optical paths of the first laser assembly 30, the second laser assembly 31, the third laser assembly 32 and the fourth laser assembly 33 in the upper and lower four-layer layout.

[0071] like Figure 14As shown, in one embodiment, a relatively extreme vertical load capacity under the current optical module size standard, considering the height of the CoC (also described as laser assembly 3 in this embodiment) with a laser installed, is a specific example of a 4-channel fiber array, which is used to set 4 optical fibers 18. With future specification modifications, if the height space of the optical module or the scenario in which this embodiment is applied can be further permitted, then the number of fiber positioning slots in the vertical direction can also exceed [a certain limit]. Figure 14 The diagram shows four slots; however, in specific scenario requirements, the number of fiber optic positioning slots in the vertical direction can also be set to two or three. For example... Figure 14 The image shows the combined state of the array base 1 and array cover 2 after setup. This is only for showcasing the core structure; therefore, only one fiber optic array is presented. In actual optical module applications, the corresponding array will be different. Figure 14 The fiber array structure shown can be presented as 4 fiber arrays side by side (in which case the number of laser components 3 is 16) or 8 fiber arrays side by side (in which case the number of laser components 3 is 32).

[0072] like Figure 15 and Figure 16 As shown, in one embodiment, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 (the term "on" here is mainly to indicate that the structure 21 is fabricated on the substrate 20 and should not be limited to a directional description), and is processed into a stepped shape. The kick surface 210 of the first step is used to couple the first fiber positioning groove 100, the kick surface 211 of the second step is used to couple the second fiber positioning groove 110, the kick surface 212 of the third step is used to couple the third fiber positioning groove 120, and the substrate 20 is used to couple the fourth fiber positioning groove 130. The kick surface of each step refers to a surface parallel to the surface of the substrate 20; each fiber positioning groove abuts against the kick surface of the corresponding step.

[0073] In order to make Figure 15In the absence of needing to reuse the positioning plate of the uppermost fiber positioning slot to adapt to the above-mentioned array base 1, this embodiment of the invention also provides another design scheme for the array cover plate 2, adding a step to the structure 21. In one embodiment, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is processed into a step shape. The kick surface 210 of the first step is used to couple the first fiber positioning slot 100, the kick surface 211 of the second step is used to couple the second fiber positioning slot 110, the kick surface 212 of the third step is used to couple the third fiber positioning slot 120, and the kick surface 213 of the fourth step (can refer to the third step and set the fourth step between the third step and the substrate 20, such as...) Figure 17 (As shown) is used to couple the fourth fiber positioning slot 130, and the substrate 20 is used to couple the corresponding surface of the array base 1. It should be noted that, in order to improve integration, the preferred embodiment of the present invention uses... Figure 14 and Figure 15 The combination schemes described herein are for illustrative purposes only. Other alternative structural schemes that may arise when circumventing the preferred combination scheme of the present invention should be interpreted as another combination scheme that is equivalent to the preferred combination scheme of the present invention.

[0074] In this embodiment of the invention, the structural characteristics of the fiber optic array are achieved through, for example... Figure 10 The comb-shaped base 6 shown is used to define it. In reality, however, the design of both can be said to have been completed simultaneously, such as... Figure 18 As shown, the output optical path of the corresponding second laser assembly 31 is to be coupled with the end face of the optical fiber 18 in the second optical fiber positioning slot 110 on the optical fiber array. The other first laser assembly 30, third laser assembly 32, and fourth laser assembly 33 in spatial position are also to be coupled with… Figure 18 The end faces of the optical fibers 18 in the first optical fiber positioning slot 100, the third optical fiber positioning slot 120, and the fourth optical fiber positioning slot 130 are coupled one-to-one. It should be noted that... Figure 18 The text does not show, but it appears to be a fragmented collection of characters and phrases. Figure 1 The heat dissipation component 8 shown can be based on the actual use scenario. Figure 1 The heat dissipation component 8 is installed.

[0075] Understandably, in combination Figure 18In one embodiment, when the number of laser components 3 managed by the comb-shaped base 6 is 4 and the number of comb-shaped bases 6 is n, the array base 1 is respectively provided with n first fiber positioning slots 100, n second fiber positioning slots 110, n third fiber positioning slots 120 and n fourth fiber positioning slots 130, wherein the plane where the n second fiber positioning slots 110 are located is higher than the plane where the n first fiber positioning slots 100 are located by the height difference between adjacent comb teeth, the plane where the n third fiber positioning slots 120 are located is higher than the plane where the n second fiber positioning slots 110 are located by the height difference between adjacent comb teeth, and the plane where the n fourth fiber positioning slots 130 are located is higher than the plane where the n third fiber positioning slots 120 are located by the height difference between adjacent comb teeth; wherein, the fiber array is arranged in a periodic pattern with adjacent first fiber positioning slots 100, second fiber positioning slots 110, third fiber positioning slots 120 and fourth fiber positioning slots 130. Specifically, in one embodiment, the n comb-shaped bases 6 are an array formed by a simple replication of the comb-shaped base 6, and the array base is correspondingly formed with a first fiber positioning groove array formed by n first fiber positioning grooves 100, a second fiber positioning groove array formed by n second fiber positioning grooves 110, a third fiber positioning groove array formed by n third fiber positioning grooves 120, and a fourth fiber positioning groove array formed by n fourth fiber positioning grooves 130.

[0076] Because current lasers are also undergoing size optimization, the resulting beam size is smaller and coupling is more difficult. Therefore, in order to enable the placement of a second lens 71 (such as...) at the input port of the fiber array... Figure 22 As shown in the figure, this embodiment provides another specific implementation of the fiber optic array, as described in Implementation Method Two below: like Figure 19 As shown, in one embodiment, when the number of laser components 3 managed by the comb-shaped base 6 is two, and the number of comb-shaped bases 6 is two, the array base 1 is further provided with a third fiber positioning slot 120 and a fourth fiber positioning slot 130. The third fiber positioning slot 120 and the fourth fiber positioning slot 130 replicate the relative structural relationship of the first fiber positioning slot 100 and the second fiber positioning slot 110 on the array base 1, and form an arrangement with the first fiber positioning slot 100 and the second fiber positioning slot 110. To adapt to the array base 1, accordingly, as... Figure 20 and Figure 21As shown, in one embodiment, the array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and is a three-dimensional square wave shape. The peak 215 of the square wave is used to abut against the second optical fiber positioning groove 110 and the fourth optical fiber positioning groove 130, and the trough 216 of the square wave is used to abut against the first optical fiber positioning groove 100 and the third optical fiber positioning groove 120.

[0077] pass Figure 21 We can also see the change in its structural details; the structure 21 extends beyond the array base 1 by a preset length d3; lens mounting bases 214 are fabricated on the peaks 215 and troughs 216 of the square wave of the structure 21 at the preset length, and after the second lens 71 is installed, the fiber array described in this embodiment is as follows. Figure 22 As shown, the preset length is determined by those skilled in the art based on the specific application scenario. The core reason for proposing this optional implementation of the lens mount 214 is that current lasers are also undergoing size optimization, resulting in smaller light spots and greater difficulty in coupling. Therefore, placing a second lens 71 on the input port side of the fiber array has become an increasingly popular choice for design manufacturers. The reason for fabricating the lens mount 214 on the structure 21 of the array cover plate 2 instead of the array base 1 is that the array base 1 needs to support the fiber positioning slot. Introducing the lens mount 214 would not only increase the difficulty of avoiding structural conflicts in the design but also further increase the fabrication difficulty of the base.

[0078] exist Figure 23 The paper also provides another structural design idea for the lens mount 214, namely, to create a platform on the waist of the extended three-dimensional square wave crest 215. In fact, and... Figure 22 In comparison, this can be understood as removing the vertical support 217 of the corresponding I-shaped column. Figure 22 and Figure 23 By comparison, one can observe Figure 22 The lens mount 214 is more reliable, while Figure 23 While the lens mount 214 is easier to manufacture, its reliability is correspondingly reduced. However, it is still one of the optional methods for implementing this invention.

[0079] If according to Figure 24 To understand this using an example of a fiber optic array structure, it is not only the third fiber optic positioning slot 120 and the fourth fiber optic positioning slot 130 that replicate the relative structural relationship between the first fiber optic positioning slot 100 and the second fiber optic positioning slot 110 on the array base 1, but also the fifth fiber optic positioning slot 140 and the sixth fiber optic positioning slot 150, as well as the seventh fiber optic positioning slot 160 and the eighth fiber optic positioning slot 170. Figure 21 and Figure 24 The application scenarios and characteristics of each differ, among which, Figure 21 The application scenarios are suitable for situations where the number of corresponding laser components 3 is 4, or 4 components are grouped together; and the corresponding Figure 24 The application scenario is more suitable for a group of 8 laser components in 3 groups; and, through Figure 21 and Figure 24 From the perspective of the upright placement, it is not difficult to see that in the various embodiments of the present invention, the fiber optic array can be placed in a way that the array base 1 is located below and close to the substrate 20, with the array cover 2 facing upwards; or it can be placed in a way that the array cover 2 is located below and close to the substrate 20, with the array base 1 facing upwards.

[0080] Although Figure 24 The document does not show an example structure of a lens mounting base 214 on a corresponding fiber optic array, however, Figure 24 It is itself Figure 21 The number of fiber optic positioning slots was simply replicated, by Figure 21 The 4-channel structure evolved into an 8-channel structure, therefore, it can be easily replicated. Figure 21 The lens mounting bracket 214 structure in the middle Figure 24 I will not go into too much detail here.

[0081] Furthermore, regarding the Figure 24 The embodiment shown is applied to a transmitting component, and specific details are provided for the adaptation of the fiber optic array in the corresponding transmitting component. Figure 24 The fiber optic array shown has its comb-shaped base 6 adapted to a T-shaped pedestal structure, and its heat dissipation component 8 adapted to an inverted L-shaped heat conductor, as shown. Figure 25 and Figure 26 As shown, the system serving the eight laser components 3 includes four pillars 4: a first pillar 40, a second pillar 41, a third pillar 42, and a fourth pillar 43. In this embodiment, the laser component 3 located on the side of the first pillar 40 is designated as the first laser component 30, and the laser component 3 located on the top of the first pillar 40 is designated as the second laser component 31. It should be noted that this design is to demonstrate the coupling relationship between the optical fiber 18 and the laser component 3 (e.g., ...). Figure 25 (as indicated by the dashed arrow in the middle) Figure 25 The lens mounting base 214 and the second lens 71 are not shown in the diagram. It can be understood that in actual use, the lens mounting base 214 and the second lens 71 are based on... Figure 22 The settings are shown.

[0082] Furthermore, such as Figure 26As shown, the first column 40, second column 41, third column 42, and fourth column 43 are evenly spaced on the support plate. The laser assembly 3 located on the side of the second column 41 is designated as the third laser assembly 32, and the laser assembly 3 located on the top of the second column 41 is designated as the fourth laser assembly 33. The laser assembly 3 located on the side of the third column 42 is designated as the fifth laser assembly 36, and the laser assembly 3 located on the top of the third column 42 is designated as the sixth laser assembly 37. The laser assembly 3 located on the side of the fourth column 43 is designated as the seventh laser assembly 38, and the laser assembly 3 located on the top of the fourth column 43 is designated as the eighth laser assembly 39. It should be noted that, for the purpose of demonstrating the specific shape of the column 4, the heat dissipation assembly 8 is not shown at the tail of the fourth column 43. In actual use, the heat dissipation assembly 8 can be installed at the tail of the fourth column 43, referring to the other three columns 4. In fact, the column 4 and the comb-shaped base 6 with the upper and lower layers are the same concept. To adapt to the T-shaped column structure, the heat dissipation component 8 is set as an inverted L-shaped heat conductor. Similar to the aforementioned TEC, the vertical surface of the inverted L-shaped heat conductor on one side of the column 4 abuts against the tail end of the corresponding laser component 3. The lower surface of the inverted L-shaped heat conductor abuts against the heat conduction platform 5 to transfer the heat of the laser component 3 to the heat conduction platform 5 for heat dissipation.

[0083] To further utilize the space within the PCB board of the optical module, and considering that the heat-conducting platform 5 (typically made of tungsten copper) in the transmitting assembly is often fixed by slotting into the PCB board, this embodiment provides another specific implementation method for the fiber array, which involves placing the corresponding laser components 3 on the front and back sides of the heat-conducting platform 5, as described in implementation method three below: like Figures 27-30 As shown, this embodiment provides another specific structure of the optical fiber array. The array cover plate 2 includes a substrate 20 and a structure 21. The structure 21 is located on the substrate 20 and has a comb-shaped wave. Each peak 215 of the comb-shaped wave is used to abut against the first optical fiber positioning groove 100, the second optical fiber positioning groove 110 and the third optical fiber positioning groove 120. The substrate 20 is used to abut against the fourth optical fiber positioning groove 130.

[0084] It should be noted here that, as Figure 30 As shown, the laser component 3 is arranged in a manner similar to... Figure 25 The settings are similar in other cases, so I won't go into detail here. Figure 30 The structure shown is relative to Figure 25 The main difference in the structures shown is that, Figure 30The laser assembly 3 is disposed on both sides of the heat-conducting platform 5. The structure 21 adopts a comb-like structure. Based on this, the relative positions of the fiber positioning slots are redefined. The first fiber positioning slot 100 and the second fiber positioning slot 110 are disposed below the heat-conducting platform 5. The optical fibers in the first fiber positioning slot 100 and the second fiber positioning slot 110 are coupled to the laser assembly 3 disposed below the heat-conducting platform 5. Specifically, the first fiber positioning slot 100 is disposed below the top of the first column 40, and the second fiber positioning slot 110 is disposed on one side of the first column 40. The third fiber positioning slot 120 and the fourth fiber positioning slot 130 are disposed above the heat-conducting platform 5. The optical fibers in the third fiber positioning slot 120 and the fourth fiber positioning slot 130 are coupled to the laser assembly 3 disposed above the heat-conducting platform 5. Specifically, the third fiber positioning slot 120 is disposed on one side of the second column 41, and the fourth fiber positioning slot 130 is disposed above the top of the second column 41.

[0085] Furthermore, to ensure the heat dissipation efficiency of each laser component 3, based on the alternating arrangement of a first fiber positioning slots 100 and b second fiber positioning slots 110, with the a first fiber positioning slots 100 forming a first fiber positioning slot array and the b second fiber positioning slots 110 forming a second fiber positioning slot array, the corresponding positioning slots and other structures are arranged relatively evenly in an array form; furthermore, the array base 1 is also provided with c third fiber positioning slots 120 and d fourth fiber positioning slots 130, wherein the plane where the c third fiber positioning slots 120 are located is higher than the plane where the b second fiber positioning slots 110 are located by a second preset height h2, and the plane where the d fourth fiber positioning slots 130 are located is higher than the plane where the c third fiber positioning slots 120 are located by a third preset height h3; the first fiber positioning slots 100 and the second fiber positioning slots 110 are vertically separated by a first preset height h1. In this arrangement, the fiber optic array consists of a group of adjacent first fiber positioning slots 100, second fiber positioning slots 110, third fiber positioning slots 120, and fourth fiber positioning slots 130, forming a periodic arrangement. Specifically, in one embodiment, such as... Figure 30 As shown, the third preset height h3 is equal to the first preset height h1, and the second preset height h2 is determined according to the array spacing of the two adjacent laser arrays in the mirror configuration.

[0086] The corresponding combination of laser component 3 and Figure 27 The transmitting component following the fiber array structure shown is as follows: Figure 30 As shown, a heat dissipation component 8 is coupled to the rear end of the laser component 3 to transfer the heat of the laser component 3 to the heat conduction platform 5.

[0087] The present invention also provides a high-speed optical module, which may include any of the above-mentioned vertical emission component structures, without specific limitations. The vertical emission component structure improves the space utilization of the laser component 3 in the vertical space inside the high-speed optical module. Through the structural design that the laser components 3 of adjacent channels are not on the same vertical plane, the heat dissipation of the laser components 3 located on different comb teeth 60 can be more effectively conducted downward, avoiding the cross-thermal crosstalk problem caused by simple alignment stacking.

[0088] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A vertical launching assembly structure, characterized in that, It includes a comb-shaped base (6), at least two laser assemblies (3) and a heat dissipation assembly (8); The comb-shaped base (6) is vertically fixed on the heat-conducting platform (5), and the comb teeth (60) of the comb-shaped base (6) are horizontally extended. Each comb tooth (60) is provided with a laser assembly (3). Wherein, the thickness of the comb back of the comb base (6) increases by a specified parameter from top to bottom, each time it passes through a level of the comb teeth (60); One sidewall of each of the laser components (3) abuts against the bottom (61) of the comb teeth, and the other sidewall of the laser component (3) abuts against the heat dissipation component (8).

2. The vertical launching assembly structure according to claim 1, characterized in that, The distance from the top of each of the comb teeth (60) to the bottom (61) of the comb tooth gap is the same; the plane of the other sidewall of each of the laser components (3) coincides with the plane of the top of the comb tooth (60) that supports it.

3. The vertical launching assembly structure according to claim 2, characterized in that, The first outer envelope (90) located on the top side of the comb tooth (60) formed by the comb tooth (60) and the laser assembly (3) on the comb base (6) is stepped, and the kick surface extends outward from the top.

4. The vertical launching assembly structure according to claim 3, characterized in that, The heat dissipation component (8) and the heat-conducting surfaces of the comb teeth (60) and the laser component (3) of each layer form a stepped inverted second outer envelope (91), wherein the second outer envelope (91) is mutually coupled with the stepped first outer envelope (90).

5. The vertical launching assembly structure according to claim 4, characterized in that, The bottom surface of the comb back is used as the first vertical side surface (63), and the side of the heat dissipation component (8) opposite to the second outer envelope (91) is used as the second vertical side surface (64), wherein the first vertical side surface (63) and the second vertical side surface (64) are parallel to each other.

6. The vertical launching assembly structure according to claim 1, characterized in that, A comb-shaped base (6) is composed of three comb teeth (60), and the three laser assemblies (3) disposed on the three comb teeth (60) and the laser assembly (3) disposed on the heat-conducting platform (5) constitute four laser assemblies (3) under the jurisdiction of a comb-shaped base (6).

7. The vertical launching assembly structure according to claim 1, characterized in that, The number of the comb-shaped bases (6) is two or more.

8. The vertical launching assembly structure according to claim 1, characterized in that, The heat dissipation component (8) is made of a homogeneous thermally conductive material.

9. The vertical launching assembly structure according to claim 1, characterized in that, The heat dissipation component (8) is composed of m L-shaped TECs and 1 rectangular TEC, wherein m is the same as the number of comb teeth (60); The L-shaped TEC transfers heat from the vertical surface of the laser assembly (3) on the other side to the top surface of the L-shaped TEC located below it, or the L-shaped TEC transfers heat from the vertical surface of the laser assembly (3) on the other side to the top surface of the rectangular TEC located below it. The rectangular TEC transfers the vertical heat from the laser assembly (3) located at the bottom of the comb-shaped base (6) on the other side, as well as the horizontal heat from the bottom of the adjacent L-shaped TEC located above, to the heat-conducting platform (5) located below it.

10. The vertical launching assembly structure according to claim 1, characterized in that, It also includes an optical fiber array, which includes an array base (1) and an array cover (2), wherein the array base (1) is provided with at least two optical fiber positioning slots.

11. The vertical launching assembly structure according to claim 10, characterized in that, The array base (1) is provided with a first fiber positioning groove (100) and a second fiber positioning groove (110). The first fiber positioning groove (100) and the second fiber positioning groove (110) are arranged left and right according to specified parameters, and are separated by the height difference of adjacent comb teeth. The first fiber positioning groove (100) is located at the bottom of the stepped channel (19) generated on the array base (1), and the second fiber positioning groove (110) is located on the first step (10); wherein the bottom of the first step (10) and the stepped channel (19) are vertically separated by the height difference of the adjacent comb teeth.

12. The vertical launching assembly structure according to claim 11, characterized in that, When the number of laser components (3) managed by the comb-shaped base (6) is four, the array base (1) is also provided with a third fiber positioning groove (120) and a fourth fiber positioning groove (130). The third fiber positioning groove (120) is located on the second step (11) which is vertically separated from the first step (10) by the height difference of the adjacent comb teeth. The fourth fiber positioning groove (130) is located on the third step (12) which is vertically separated from the second step (11) by the height difference of the adjacent comb teeth. The height difference between the first step (10), the second step (11) and the third step (12) relative to the bottom of the step channel (19) increases sequentially, and the horizontal spacing between them relative to the bottom of the step channel (19) increases sequentially.

13. The vertical launching assembly structure according to claim 12, characterized in that, The array cover plate (2) includes a substrate (20) and a structure (21). The structure (21) is located on the substrate (20) and is processed into a stepped shape. The kick surface (210) of the first step is used to couple the first optical fiber positioning slot (100), the kick surface (211) of the second step is used to couple the second optical fiber positioning slot (110), the kick surface (212) of the third step is used to couple the third optical fiber positioning slot (120), and the substrate (20) is used to couple the fourth optical fiber positioning slot (130).

14. The vertical launching assembly structure according to claim 12, characterized in that, The array cover plate (2) includes a substrate (20) and a structure (21). The structure (21) is located on the substrate (20) and is processed into a stepped shape. The kick surface (210) of the first step is used to couple the first optical fiber positioning groove (100), the kick surface (211) of the second step is used to couple the second optical fiber positioning groove (110), the kick surface (212) of the third step is used to couple the third optical fiber positioning groove (120), and the kick surface (213) of the fourth step is used to couple the fourth optical fiber positioning groove (130). The substrate (20) is used to couple the corresponding surfaces of the array base (1).

15. The vertical launching assembly structure according to claim 11, characterized in that, When the number of laser components (3) governed by the comb-shaped base (6) is two, and the number of comb-shaped bases (6) is two, the array base (1) is also provided with a third fiber positioning slot (120) and a fourth fiber positioning slot (130). The third fiber positioning slot (120) and the fourth fiber positioning slot (130) replicate the relative structural relationship of the first fiber positioning slot (100) and the second fiber positioning slot (110) on the array base (1), and form an arrangement combination with the first fiber positioning slot (100) and the second fiber positioning slot (110).

16. The vertical launching assembly structure according to claim 15, characterized in that, The array cover plate (2) includes a substrate (20) and a structure (21). The structure (21) is located on the substrate (20). The structure (21) is a three-dimensional square wave shape, wherein the peak (215) of the square wave is used to abut against the second optical fiber positioning groove (110) and the fourth optical fiber positioning groove (130), and the trough (216) of the square wave is used to abut against the first optical fiber positioning groove (100) and the third optical fiber positioning groove (120).

17. The vertical launching assembly structure according to claim 16, characterized in that, On the light-incident side, the structure (21) extends beyond the array base (1) by a predetermined length; a lens mounting base (214) is made on the peak (215) and trough (216) of the square wave of the structure (21) of the predetermined length.

18. The vertical launching assembly structure according to claim 10, characterized in that, When the number of laser components (3) managed by the comb-shaped base (6) is 4 and the number of comb-shaped bases (6) is n, the array base (1) is respectively provided with n first fiber positioning slots (100), n second fiber positioning slots (110), n third fiber positioning slots (120), and n fourth fiber positioning slots (130), wherein the plane where the n second fiber positioning slots (110) are located is higher than the plane where the n first fiber positioning slots (100) are located by the height difference between adjacent comb teeth, and the n first fiber positioning slots (110) are higher than the plane where the n first fiber positioning slots (100) are located by the height difference between adjacent comb teeth. The plane containing the three fiber positioning slots (120) is higher than the plane containing the n second fiber positioning slots (110) by the height difference between adjacent comb teeth, and the plane containing the n fourth fiber positioning slots (130) is higher than the plane containing the n third fiber positioning slots (120) by the height difference between adjacent comb teeth; wherein, the fiber array is arranged in a periodic pattern with adjacent first fiber positioning slots (100), second fiber positioning slots (110), third fiber positioning slots (120) and fourth fiber positioning slots (130).

19. The vertical launching assembly structure according to claim 18, characterized in that, The array cover plate (2) includes a substrate (20) and a structure (21). The structure (21) is located on the substrate (20). The structure (21) is a comb-shaped wave. Each peak (215) of the comb wave is used to abut against the first fiber positioning groove (100), the second fiber positioning groove (110) and the third fiber positioning groove (120). The substrate (20) is used to abut against the fourth fiber positioning groove (130).

20. A high-speed optical module, characterized in that, The high-speed optical module includes the vertical transmission component structure as described in any one of claims 1-19.

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