A thermal conductivity continuously adjustable heat conducting assembly and a continuous thermal switch

Abstract

The present application relates to the technical field of heat management devices, and provides a heat conduction assembly with continuously adjustable thermal conductivity and a continuous heat switch, comprising a cylindrical shaft body, an upper base and a lower base; the upper base and the lower base are made of a heat-conducting material and are respectively provided with a curved groove, the curved grooves are matched with the cylindrical shaft body, and the cylindrical shaft body is clamped therein; the cylindrical shaft body is formed by alternately stacking a plurality of layers of a first material and a plurality of layers of a second material, and the extension direction of the stacking is perpendicular to the axis direction of the cylindrical shaft body; the thermal conductivity of the first material is greater than that of the second material, and the difference is at least two orders of magnitude; the cylindrical shaft body can rotate around its axis, and the thermal conductivity of the heat conduction assembly can be continuously adjusted based on different rotation angles. Meanwhile, the continuous heat switch comprising the heat conduction assembly is provided. The thermal conductivity of the heat switch is continuously adjustable, and the on-off ratio is improved.

Description

Technical Field

[0001] This invention relates to the field of thermal management device technology, specifically to a thermally conductive component with continuously adjustable thermal conductivity and a continuous thermal switch. Background Technology

[0002] Thermal transport and electrical transport, as two fundamental transport phenomena in physics, exhibit a significant asymmetry in the depth of research and the breadth of applications. Thanks to the precise manipulation of electron behavior, the field of electricity has established a mature nonlinear control theory and successfully developed a series of solid-state devices such as switches, diodes, and transistors, forming the cornerstone of modern electronics. In contrast, thermal transport processes involve multiple mechanisms, including heat conduction, heat radiation, and heat convection, and these mechanisms are often coupled and difficult to separate. This results in our ability to actively regulate heat flow lagging far behind our ability to control electric current.

[0003] Thermal switches control heat flux through changes in their thermal conductivity and are a relatively systematically developed class of nonlinear thermal devices, playing an irreplaceable role in key areas such as spacecraft thermal control and cryogenic refrigeration. For example, paraffin phase change driven on / off thermal switches can actively control the thermal connection between the radiator and the cabin, preventing the equipment from overcooling due to excessive heat dissipation under low-power conditions; this technology has been successfully applied to Mars rovers. Air-gap thermal switches achieve directional heat transport from the cold end to the hot end through periodic on / off switching, and are key components in adiabatic demagnetizing refrigeration cycles to maintain cryogenic environments. After decades of development, the control mechanisms and implementation forms of thermal switches have become increasingly diversified, with various types of thermal switches, including phase change, electrically controlled, and magnetically controlled types, constantly emerging, achieving breakthroughs in key performance indicators such as on / off ratio and response speed. However, although the above-mentioned thermal switches each have their advantages, most can only achieve discrete "on / off" bistable switching and often rely on vacuum systems, complex drive mechanisms, or specific operating temperature ranges, making it difficult to meet the dynamic thermal management requirements for continuous, wide-range, and rapid response control.

[0004] In recent years, to meet the urgent need for precise heat flux control in fields such as power batteries, energy storage and recycling, power chips, and data centers, continuous thermal switches capable of continuously adjustable heat flux have begun to attract attention. The concept of continuous thermal switches was first proposed in 2021. Researchers achieved continuous adjustment of the thermal conductivity of porous graphene materials by mechanically compressing them to change the porosity. Subsequent research applied this type of thermal switch to lithium battery thermal management, controlling battery temperature through heat flux control within a temperature range of -20°C to 40°C, effectively improving battery performance. However, for this type of pressure-controlled continuous thermal switch based on aerogel or graphene foam, the porous material cannot be compressed indefinitely to ensure the reversibility of the compression and rebound process. Therefore, the thermal conductivity of the switch in the "off" state and the thermal conductivity in the "on" state are both within the range of 10... - ² W·m- ¹·K - ¹ and 10 - ¹ W·m - ¹·K - ¹On the order of magnitude. Therefore, the on-state thermal conductivity of such continuous thermal switches is limited, typically below 1 W·m⁻¹. - ¹·K - ¹, and the switching ratio R It's not high either, usually around 8. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a heat conduction component with continuously adjustable thermal conductivity to improve the switching ratio of continuous thermal switching.

[0006] The present invention solves the above-mentioned technical problems through the following technical means:

[0007] This invention provides a heat conduction component with continuously adjustable thermal conductivity, comprising: a cylindrical shaft, an upper base, and a lower base; the upper base and the lower base are made of thermally conductive material and are respectively provided with curved grooves, the curved grooves being adapted to fit the cylindrical shaft and clamping the cylindrical shaft therein; The cylindrical shaft is formed by alternating stacking of several layers of first material and several layers of second material, with the stacking direction perpendicular to the axial direction of the cylindrical shaft; the thermal conductivity of the first material is greater than that of the second material, and the difference is at least two orders of magnitude. The cylindrical shaft can rotate around its axis, and the thermal conductivity of the heat conduction component can be continuously adjusted based on different rotation angles.

[0008] Preferably, the first material comprises an epoxy resin-based carbon fiber composite material; the second material comprises pure resin.

[0009] Preferably, the upper and lower bases are made of copper.

[0010] Preferably, the upper base and the lower base are mirror images of each other, and the vertical distances between the tangent at the bottom of the curved groove and the corresponding upper and lower surfaces of the base are respectively... and It meets the following conditions:

[0011]

[0012] in, It is the diameter of the cylindrical shaft.

[0013] Furthermore, the direction in which the first and second materials are alternately stacked is the direction of low thermal conductivity, with the lowest equivalent thermal conductivity; the direction perpendicular to the direction of low thermal conductivity is the direction of high thermal conductivity, with the highest equivalent thermal conductivity.

[0014] Furthermore, when the rotation angle θ= At 0°, the heat conduction component is in the "off" state; when the rotation angle... θ= At 90°, the heat conduction component is in the "on" state; when the rotation angle is... i The equivalent thermal conductivity of the heat conduction component is continuously adjustable between 0° and 90°; wherein, the rotation angle i The angle between the high thermal conductivity direction and the horizontal plane is denoted as .

[0015] The present invention also provides a continuous thermal switch, comprising: the aforementioned heat conduction component, servo motor, spring, first thermocouple, second thermocouple, and heat dissipation component; the lower base of the heat conduction component is in contact with the heat dissipation component; the servo motor is connected to a cylindrical shaft via a rotating shaft, and can drive the cylindrical shaft to rotate; a bolt is used to connect the upper base and the lower base through the spring, clamping the cylindrical shaft in the middle; the first thermocouple is disposed on the upper base, and the second thermocouple is disposed on the heat dissipation component.

[0016] Preferably, the continuous thermal switch further includes polyurethane foam that encloses the heat source and the upper base for heat insulation.

[0017] Preferably, the heat dissipation assembly consists of a heat sink and a cooling fan connected in contact with it.

[0018] Preferably, the heat dissipation component is a water-cooled substrate.

[0019] The advantages of this invention are: (1) The present invention processes a composite material of alternating stacked high thermal conductivity material and low thermal conductivity material into a cylindrical shaft, which rotates under the clamping of upper and lower bases; by changing the heat transfer path of the upper and lower bases, the thermal conductivity of the overall component is continuously adjustable, which solves the problem that the existing technology can only achieve discrete "on / off" dual-state switching.

[0020] (2) By rotating to mutually perpendicular on and off states corresponding to the maximum and minimum thermal conductivity, the present invention improves the on / off ratio of continuous thermal switches, which makes up for the shortcomings of pressure-controlled thermal switches in the prior art, which are limited by the fact that porous materials cannot be infinitely compressed in structure, resulting in a low on / off ratio.

[0021] (3) While achieving continuously adjustable thermal conductivity and high switching ratio, the present invention has a simple structure and switching method. Compared with the existing technology that requires a vacuum system, complex drive mechanism or specific working temperature range, it has great engineering practicality and economy.

[0022] (4) The continuous thermal switch of the structure described in this invention has a much higher equivalent thermal conductivity in the "on" state than that of the pressure-controlled thermal switch in the "on" state, and is more suitable for high energy density scenarios such as energy storage and recycling, battery thermal management, and power semiconductors. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a continuous thermal switch according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the composite material according to an embodiment of the present invention; wherein, a is a three-dimensional structural schematic diagram of the composite material; b is a cross-sectional schematic diagram of the composite material in the X and Y axis planes; c is a cross-sectional schematic diagram of the composite material in the X and Z axis planes; Figure 3 This invention relates to the structure of the heat conduction component, the evolution of the on / off ratio R with geometric dimensions, and the rotation angle. i A schematic diagram illustrating the evolution trend of heat flux dispersion and temperature gradient during change; Figure 4 This is a schematic diagram of the experimental results for verifying the performance of a continuous thermal switch according to an embodiment of the present invention; wherein, a is a schematic diagram of the experimental results of the thermal switch's ability to regulate the temperature of the heat source in the open and closed states; b is a schematic diagram of the temperature fluctuation of the experimental test environment; c is a schematic diagram of the experimental results of the thermal switch stabilizing the temperature of the heat source at 298 K by rotation at power levels of 0.72 W and 1.74 W; d is a schematic diagram of the experimental results of the thermal switch's temperature control accuracy under different power conditions; e is a schematic diagram of the experimental results of the thermal switch stabilizing the temperature of the heat source at 318 K by rotation at power levels of 2 W and 5.56 W. Figure 5 This diagram illustrates the influencing factors and optimization directions of continuous thermal switch performance in embodiments of the present invention. Specifically, a represents the simulation performance of the thermal switch under closed and ideal conditions; b represents the simulation performance of the thermal switch under closed and air-cooled conditions; c represents the simulation performance of the thermal switch under closed conditions and considering interface thermal resistance; d represents the simulation performance of the thermal switch under closed conditions and with thermal convection; e represents the simulation performance of the thermal switch under open conditions and ideal conditions; f represents the simulation performance of the thermal switch under open conditions and with air cooling; g represents the simulation performance of the thermal switch under open conditions and considering interface thermal resistance; h represents the simulation performance of the thermal switch under open conditions and with thermal convection; and i represents the simulation diagram of the on / off ratio R value of the thermal switch under ideal conditions, with interface thermal resistance, with thermal convection, and with air cooling. Reference numerals in the attached diagram: 1. Cylindrical shaft; 2. Upper base; 3. Lower base; 4. Servo motor; 5. Spring; 6. Heat sink; 7. Cooling fan. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Example 1 This embodiment provides a heat conduction component with continuously adjustable thermal conductivity, the structure of which is as follows: Figure 1 and Figure 3 As shown in Figure a, it includes: a cylindrical shaft 1, an upper base 2 and a lower base 3; the upper base 2 and the lower base 3 are made of thermally conductive material and are respectively provided with curved grooves, the curved grooves are adapted to the cylindrical shaft 1 and clamp the cylindrical shaft 1 therein; The cylindrical shaft 1 is formed by alternating stacking of several layers of first material and several layers of second material, with the stacking direction perpendicular to the axial direction of the cylindrical shaft 1; the thermal conductivity of the first material is greater than that of the second material, and the difference is at least two orders of magnitude. The cylindrical shaft 1 can rotate around its axis, and the thermal conductivity of the heat conduction component can be continuously adjusted based on different rotation angles.

[0026] The anisotropic thermal conductivity of a material determines the on / off ratio. R The key factor. In this embodiment, the first material is an epoxy resin-based carbon fiber composite material, whose thermal conductivity along the axial direction of the carbon fiber is approximately 450 W·m. - ¹·K - ¹; The second material is pure resin with a thermal conductivity of 0.27 W·m. - ¹·K - ¹; The thermal conductivity of the two materials differs by three orders of magnitude. Understandably, depending on actual accuracy requirements, other additional factors, or economic considerations, the materials can be adjusted to make the difference in thermal conductivity larger or smaller. However, for the purpose of continuous thermal switching to achieve the on / off of heat flux, it is recommended that the thermal conductivity of the first and second materials differ by at least two orders of magnitude.

[0027] Anisotropic epoxy resin-based carbon fiber composites and pure resin are alternately stacked and molded. For example... Figure 2 As shown, along the Z-axis, the two layers of material are arranged in parallel, corresponding to the direction of high thermal conductivity. k max Along the X-axis, two layers of material are stacked alternately, corresponding to the direction of low thermal conductivity κ. minThe final stacked composite material can be processed into different shapes and subjected to drilling and other operations (this is related to the excellent interfacial bonding between carbon fiber and epoxy resin). Based on the materials used in this embodiment, thermal conductivity test results show that the composite material exhibits high thermal conductivity in the high thermal conductivity direction at room temperature. k max Up to 293 W·m - ¹·K - ¹, Thermal conductivity κ in the direction of low thermal conductivity min As low as 0.41 W·m - ¹·K - ¹, Anisotropy ratio k max / k min It reached 714.

[0028] The composite material is processed into a cylindrical shaft 1, which is then clamped between a copper upper base 2 and a lower base 3 to obtain a heat conduction component. By rotating the cylindrical shaft 1, the heat conduction path between the upper base 2 and the lower base 3 is changed, allowing for continuous variation of the equivalent thermal conductivity of the heat conduction component, thereby enabling the control of the entire switching temperature field and heat flow. Definition i For high thermal conductivity direction k max The angle between the plane and the horizontal plane. It is obvious that when... θ= At 0°, the heat conduction path is parallel to the direction of low thermal conductivity, which is the "off" state of the heat conduction component, and the equivalent thermal conductivity is the lowest; when θ= At 90°, the heat conduction path is parallel to the direction of high thermal conductivity, which is the "on" state of the heat conduction component, and the equivalent thermal conductivity is the highest. When i When the temperature is between 0° and 90°, the equivalent thermal conductivity of the heat conduction component is continuously adjustable within the above range.

[0029] The upper base 2 and the lower base 3 are mirror images of each other. The vertical distances between the tangent at the bottom of the curved groove and the corresponding upper and lower surfaces of the base are respectively... and The finite element simulation results show that the diameter of cylindrical shaft 1 is... F The feature dimensions of the upper base 2 and the lower base 3 are respectively sup and arc Comparison of switches R Significant impact, such as Figure 3 As shown in b, specifically: switching ratio R along with sup / F The on / off ratio decreases and increases monotonically; R along with arc / Φ The increase first increases and then decreases and in arc / ΦThe peak value is reached at 0.23. In this embodiment, considering both simulation results and the operational and installation stability of the actual device, the value was determined. arc / Φ = 0.23、 sup / F A geometric scale of 0.43 represents the geometric dimensional parameters corresponding to excellent performance across all aspects. When the above conditions are met, the on / off ratio is obtained based on finite element simulation. R≈ 262. This demonstrates that the heat conduction component provided in this embodiment has an extremely high on / off ratio.

[0030] After determining the optimized geometric parameters of the heat transfer components, the heat flow regulation and temperature control mechanisms were further investigated using finite element simulation. Simple geometric analysis shows that, under the aforementioned geometric parameter configuration, i =32.23° is a critical value, meaning that when the rotation angle... i When this value is exceeded, a carbon fiber structure directly connecting the upper base 2 and the lower base 3 will appear inside the rotating cylindrical shaft 1. This continuous, highly thermally conductive path will gradually become the primary heat flow channel, significantly altering the heat flow pattern. This prediction was verified by finite element simulation results. Figure 3 As shown in Figure c, a constant power heat source is set on the upper base 2. When θ = At 0°C, the temperature of the upper base stabilizes at 364K; when the cylindrical shaft 1 begins to rotate, i When the angle is less than 32.23°, the heat flow passes through the contact interfaces between the cylindrical shaft 1 and the upper base 2 and the lower base 3, respectively, and preferentially flows along the composite material. k max The direction forms thermal isotherms and cold isotherms (corresponding to respectively) Figure 3 (The red and blue areas in c). The heat flow at the boundary of the thermal isotherm region further along... k min The direction is towards the boundary of the cold isothermal region, and then along... k max The heat flows in the direction of the bottom copper base, thus forming a complete heat flow path. A path is established between the hot isotherm and the cold isotherm. k min Temperature gradient region in the direction. The thicker this region, the better the insulation effect. When i At temperatures above 32.23°C, highly thermally conductive paths begin to appear directly connecting the upper base 2 and the lower base 3, allowing for efficient heat transfer. With... i With the continued increase in [the number of such high thermal conductivity paths], the number of these paths further increases, significantly improving the equivalent thermal conductivity. From [the following text is incomplete and requires further context: "from..."] Figure 3 As can be seen from c, as the cylindrical shaft 1 continues to rotate, iDuring the process from 0° to 90°, under a constant power heat source, the temperature of the upper base 2 gradually decreased from 364K to 293.42K, indicating that the heat flux gradually increased and the equivalent thermal conductivity of the heat conduction component was continuously adjustable.

[0031] Example 2 It should be further explained that, based on the same inventive concept, this embodiment provides a continuous thermal switch, such as... Figure 1 As shown, it includes: the heat conduction component described in Embodiment 1, the servo motor 4, the spring 5, the first thermocouple, the second thermocouple, and the heat dissipation component; the lower base 3 of the heat conduction component is in contact with the heat dissipation component; the servo motor 4 is connected to the cylindrical shaft 1 through a rotating shaft, which can drive the cylindrical shaft 1 to rotate; the upper base 2 and the lower base 3 are connected by bolts passing through the spring 5, and the cylindrical shaft 1 is clamped in the middle; the first thermocouple (not shown in the figure) is set on the upper base 2, and the second thermocouple (not shown in the figure) is set on the heat dissipation component.

[0032] In one embodiment, the heat conduction component described in Embodiment 1 is integrated with the servo motor 4, thermocouple, heat sink 6, and cooling fan 7 to form a continuous thermal switch. The geometric dimensions of the core heat conduction component, which determines the performance of the continuous thermal switch, are as described in Embodiment 1. In this continuous thermal switch, the first thermocouple monitors the temperature of the heat source (i.e., the thermally managed object connected to the upper base 2) in real time. Once the temperature deviates from the set temperature, the program controls the servo motor 4 to adjust the rotation angle of the cylindrical shaft 1. i The equivalent thermal conductivity of the thermal switch circuit is changed, thereby regulating the heat flux in the circuit and achieving precise temperature control of the thermally managed object. Spring 5 forms a stable clamping force between the cylindrical shaft 1, the upper base 2, and the lower base 3, reducing the clamping force changes caused by temperature fluctuations; cooling fan 7 dissipates the heat source temperature; and the second thermocouple monitors the temperature of heat sink 6 in real time.

[0033] The performance of this continuous thermal switch was further evaluated experimentally. To obtain the on / off ratio, the heat dissipation and heat preservation capabilities of the switch in both the "off" and "on" states were measured. Figure 4As shown in Figure a, when the switch is in the "off" state, the heat source temperature rises rapidly with increasing input power, with a slope of 25.9 K / W (red line). Only 0.72 W of power causes the heat source temperature to rise by 18.6 K, demonstrating good heat retention. In contrast, when the switch is in the "on" state, the heat source temperature rises slowly with increasing input power, with a slope of 2.8 K / W (blue line). At 5.56 W of power, the heat source temperature only rises by 16 K, demonstrating excellent heat dissipation. Based on these two slopes, the calculated on / off ratio is approximately 9.3. The blue background area enclosed by the blue line, red line, X-axis, and Y-axis represents the effective control area of ​​the thermal switch. Within this area, the thermal switch can be adjusted according to the heat source power. i This enables precise control of the heat source temperature. Figure 4 The pentagram data points on the green and yellow lines in diagram a represent the temperature control test results for that area.

[0034] This embodiment also provides experimental tests to verify the performance of the continuous thermal switch under fluctuating temperature environments. For example... Figure 4 As shown in b, the test was conducted in an air-conditioned room, with the indoor temperature fluctuating periodically every 1000 seconds, with an amplitude of approximately 3 K. The results show that, as... Figure 4 As shown in Figure c, when the heat source power is 0.72 W and 1.74 W, the heat switch periodically adjusts within the ranges of "32°–46°" and "52°–74°", respectively. i ;like Figure 4 As shown in d, the angle adjustment cycle is highly consistent with the room temperature fluctuation cycle, and the heat source temperature remains stable at 298 ± 0.15 K. Figure 4 As shown in Figure e, when the heat source power is 2 W and 5.56 W, the heat switch periodically adjusts within the ranges of "30°–41°" and "54°–76°", respectively. i The cycle is also approximately 1000 seconds, stabilizing the heat source temperature at 318 ± 0.17 K, such as... Figure 4 As shown in d.

[0035] Comparing the experimental results with the simulation results, it was found that the on / off ratio of the constructed continuous thermal switch was... RIt is only 1 / 28 of the simulated value. This difference should be attributed to two main factors: (1) Compared with the structural model used in the simulation, the actual thermal switch requires certain minor structural modifications to achieve device implementation. For example, there are two positioning holes on the switch material for fixing the rotating shaft, and Teflon screws for reinforcing the upper base 2 and the lower base 3. (2) The simulation is conducted under ideal conditions, ignoring heat convection, assuming no interface thermal resistance and using an extremely high heat dissipation coefficient. These conditions are difficult to fully realize in actual devices. Since the first factor stems from the practical needs of device construction, the optimization space is very limited. Therefore, heat, interface thermal resistance and cooling strategies have become the main directions for further optimization of continuous thermal switches. For this purpose, such as Figure 5 As shown in Figure ah, the impact of these three factors on switching performance was systematically evaluated through simulation. The results show that under conditions of no interface thermal resistance, vacuum environment, and water cooling (5000 W·m), the switching performance is significantly improved. - ²·K - ¹) Under relatively ideal conditions, the switching ratio R It can reach approximately 179. When interfacial thermal resistance is introduced (e.g., planar interfacial thermal resistance: 0.3 K·cm²·W),... - ¹; Thermal resistance of curved interface: 1.5 K·cm²·W - ¹) when, R It dropped rapidly to 56, as Figure 5 As shown in i. Introducing air thermal convection (e.g., 18 W·m). - ²·K - ¹) and replacing water cooling with forced air cooling (e.g., 60 W·m) - ²·K - ¹) will also make R They dropped to 54 and 37 respectively, as Figure 5 As shown in i.

[0036] Based on the above results, in one embodiment, the continuous thermal switch was optimized. Specifically, polyurethane foam was first used to insulate the heat source and the upper base 2, and the combination of heat sink 6 and cooling fan 7 was replaced with a water-cooled substrate to enhance heat dissipation. Test results show that when the switch is in the "off" state, for every 1W increase in power, the temperature rise at the heat source reaches 54.3K, and its heat preservation capacity is nearly doubled compared to before optimization; when the switch is in the "on" state, for every 1W increase in power, the temperature rise at the heat source is only 2.1K, and the switch's heat dissipation capacity is also significantly enhanced (2.1 K·W). - ¹). Ultimately, the on / off ratio increased to 25.9, which is 2.8 times that before optimization and 3.2 times that of pressure-regulated continuous thermal switches.

[0037] Furthermore, considering the heat conduction component as a cuboid consisting of a cylindrical shaft 1, air, upper base 2, and lower base 3, the equivalent thermal conductivity calculation formula for the switch under different rotational states is as follows: k =(P H) / (S) T) Where P is the power of the heat source. T represents the corresponding heat source temperature rise, S represents the surface area of ​​the upper base, and H represents the height of the cuboid; all of these parameters can be obtained experimentally. Experimental calculations in this embodiment show that the equivalent thermal conductivity corresponding to the "on" state is 57.5 W·m. - ¹·K - ¹, which is more than 60 times the equivalent thermal conductivity in the "on" state of a pressure-regulated continuous thermal switch. This demonstrates that the continuous thermal switch provided in this embodiment is more suitable for high-energy-density scenarios such as energy storage and recovery, battery thermal management, and power semiconductors.

[0038] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat conduction component with continuously adjustable thermal conductivity, characterized in that, include: Cylindrical shaft (1), upper base (2) and lower base (3); the upper base (2) and lower base (3) are made of heat-conducting material and are respectively provided with curved grooves, the curved grooves are adapted to the cylindrical shaft (1) to hold the cylindrical shaft (1) therein; The cylindrical shaft (1) is formed by alternating stacking of several layers of first material and several layers of second material, with the extension direction of the stack perpendicular to the axial direction of the cylindrical shaft (1); the thermal conductivity of the first material is greater than that of the second material, and the difference is at least two orders of magnitude. The cylindrical shaft (1) can rotate around its axis. Based on different rotation angles, the heat conduction path between the upper base (2) and the lower base (3) can be changed, so that the thermal conductivity of the heat conduction component can be continuously adjusted. The upper and lower bases are mirror images of each other. The vertical distances between the tangent at the bottom of the curved groove and the corresponding upper and lower surfaces of the base are respectively... and It meets the following conditions: wherein is the diameter of the cylindrical shaft.

2. A heat conducting assembly with continuously adjustable thermal conductivity according to claim 1, characterized in that The first material includes an epoxy resin-based carbon fiber composite material; the second material includes pure resin.

3. A heat conducting assembly with continuously adjustable thermal conductivity according to claim 1, characterized in that The upper and lower bases are made of copper.

4. A heat conducting assembly with continuously adjustable thermal conductivity according to claim 1, characterized in that The direction in which the first and second materials are stacked alternately is the direction of low thermal conductivity, with the lowest equivalent thermal conductivity; the direction perpendicular to the direction of low thermal conductivity is the direction of high thermal conductivity, with the highest equivalent thermal conductivity.

5. A heat conducting assembly with continuously adjustable thermal conductivity according to claim 4, characterized in that When rotation angle θ= At 0°, the heat conduction component is in the "off" state; when the rotation angle... θ= At 90°, the heat conduction component is in the "on" state; when the rotation angle is... θ The equivalent thermal conductivity of the heat conduction component is continuously adjustable between 0° and 90°; wherein, the rotation angle θ The angle between the high thermal conductivity direction and the horizontal plane is denoted as .

6. A continuous thermal switch, characterized by, include: The heat conduction component, servo motor (4), spring (5), first thermocouple, second thermocouple, and heat dissipation component as described in any one of claims 1-5; the lower base (3) of the heat conduction component is in contact with the heat dissipation component; the servo motor (4) is connected to the cylindrical shaft (1) through a rotating shaft and can drive the cylindrical shaft (1) to rotate; the upper base (2) and the lower base (3) are connected by bolts passing through the spring (5) to clamp the cylindrical shaft (1) in the middle; the first thermocouple is set on the upper base (2) and the second thermocouple is set on the heat dissipation component.

7. A continuous thermal switch according to claim 6, wherein, The continuous thermal switch also includes polyurethane foam, which encloses the heat source and the upper base (2) for heat insulation.

8. A continuous thermal switch according to claim 6, wherein, The heat dissipation assembly consists of a heat sink (6) and a cooling fan (7) connected to it.

9. A continuous thermal switch according to claim 6, wherein, The heat dissipation component is a water-cooled substrate.

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