Stable temperature type ultrasonic treatment head based on accurate temperature control

Abstract

The application discloses a stable temperature type ultrasonic treatment head based on accurate temperature control, which comprises a base assembly and a transducer connected to the base assembly; a semiconductor cooler for cooling the skin surface is installed on the base assembly, and the semiconductor cooler and the transducer are connected to opposite sides of the base assembly; the semiconductor cooler is formed with a cooling surface and a heating surface located at opposite sides of the semiconductor cooler, the base assembly is connected with the cooling surface, and a cooling member for cooling the heating surface is connected to the heating surface; compared with the prior art, the transducer is soaked in the cooling medium, the heat generated on the surface of the transducer during work can be quickly absorbed, the heat is prevented from being transmitted to the skin surface to affect the heat field coupling, a relatively stable temperature field can be provided under the action of the cooling medium, the temperature field generated by sound transmission absorption is more stable in coupling with the temperature field provided by the skin surface, and the treatment area and the treatment temperature can be more accurately controlled.

Description

Technical Field

[0001] This invention relates to the field of ultrasound therapy technology, and more specifically to a temperature-stable ultrasound therapy head based on precise temperature control. Background Technology

[0002] Ultrasound therapy is a non-invasive and painless physical therapy technique widely used in medicine and physiotherapy. It uses high-frequency sound waves to penetrate deep into human tissues and produce therapeutic effects through thermal, mechanical, and cavitation effects.

[0003] In ultrasound therapy, there are two types of ultrasound transducers: focused and non-focused. In non-focused ultrasound transducers, the piezoelectric ceramic is placed parallel to the skin surface. When the sound waves enter the skin, they generate heat. The heat gradually weakens from the skin surface inwards, while the part of the probe in contact with the skin is cooled to -15°C to 0°C. A low-temperature source is applied to the skin surface. After the temperature of the two is coupled, the skin surface temperature is controlled within a safe threshold, and the temperature of the required treatment area can be controlled to reach the clinically effective range.

[0004] Chinese patent CN119947793A discloses an ultrasonic device for skin treatment, including an external part consisting of a device body. An indicator light for indicating the device's operating status is installed in the middle of the device body. A switch and mechanism for turning the device on and off are also included. The mechanism consists of an energy source connected to a circuit control panel. The circuit control panel includes a short-circuit detection circuit, a Bluetooth and / or Wi-Fi receiver and transmitter, and a skin temperature monitoring circuit.

[0005] The ultrasonic device disclosed above measures skin temperature by using a temperature monitoring probe located on the side of the ultrasonic transducer. However, since the ultrasonic transducer generates heat during use, it cannot accurately determine skin temperature. Furthermore, when the ultrasonic transducer needs to be used in conjunction with a cooling module, the alternating use of the ultrasonic transducer and the cooling module can cause fluctuations in the temperature field. The temperature monitoring probe is affected by the temperature of the temperature monitoring probe and cannot accurately identify the skin surface temperature, thus affecting the temperature control effect on the skin surface. Summary of the Invention

[0006] The present invention aims to overcome the defects in the prior art and provide a stable temperature ultrasonic treatment head based on precise temperature control that is stable in temperature control, accurate in temperature measurement, and safe and reliable.

[0007] To achieve the above-mentioned objectives, the present invention employs the following technical solution: a temperature-stable ultrasonic treatment head based on precise temperature control, comprising a base assembly and a transducer connected to the base assembly; the base assembly is equipped with a semiconductor cooler for cooling the skin surface, the semiconductor cooler and the transducer being connected to opposite sides of the base assembly; the semiconductor cooler has a cooling surface and a heating surface located on opposite sides of the semiconductor cooler, the base assembly is connected to the cooling surface, and a cooling element for cooling the heating surface is connected to the heating surface; a connecting cover for the transducer is installed on the base assembly, the connecting cover having several mating grooves to facilitate the transmission of sound waves from the transducer and several temperature sensors for measuring the temperature of the skin surface; the connecting cover is filled with a cooling medium for cooling the transducer, and the surface of the connecting cover is covered with a sound-guiding membrane for sealing the cooling medium.

[0008] In a preferred embodiment of the present invention, the base assembly includes a base body and a base connecting plate connected to each other. The transducer is mounted on the base body, the cooling surface of the semiconductor cooler is in contact with the base connecting plate, and the transducer is located within the cooling range of the semiconductor cooler. The base body is filled with a temperature-stabilizing liquid for receiving the cooling capacity of the semiconductor cooler and cooling the transducer. The connecting cover is connected to the base body.

[0009] As a preferred embodiment of the present invention, the base body includes a connecting substrate and a temperature stabilizing pool connected together, the transducer is connected to the top of the temperature stabilizing pool, the temperature stabilizing liquid is filled in the temperature stabilizing pool, and a sealant for placing the transducer in a sealed environment is provided between the connecting cover and the connecting substrate.

[0010] As a preferred embodiment of the present invention, the bottom of the temperature stabilizing pool is formed with a groove for contacting the temperature stabilizing liquid with the base connecting plate.

[0011] As a preferred embodiment of the present invention, the base connecting plate is fitted to the bottom of the base body, and the cross-sectional dimensions of the base connecting plate are larger than the cross-sectional dimensions of the base body and the semiconductor cooler.

[0012] As a preferred embodiment of the present invention, the connecting cover is provided with a plurality of mounting holes for mounting a plurality of temperature sensors, and the plurality of mounting holes and a plurality of mating grooves are arranged alternately in rows, with the temperature sensors being fitted to the sound-conducting membrane.

[0013] As a preferred embodiment of the present invention, the temperature sensor includes a flexible circuit board and a thermistor mounted on the flexible circuit board, wherein the thermistor is covered with a thermally conductive sealant connected to the acoustic diaphragm.

[0014] In a preferred embodiment of the present invention, the temperature sensor is located within the cooling medium, and a heat insulation plate is provided on the back of the flexible circuit board to support the flexible circuit board. A heat insulation shell is installed on the heat insulation plate to separate the thermistor from the cooling medium.

[0015] As a preferred embodiment of the present invention, the transducer is provided with abutting ribs that abut against the inner wall of the connecting cover, and the abutting ribs are located on opposite sides of the transducer.

[0016] As a preferred embodiment of the present invention, the cooling element is filled with a heat exchange medium for exchanging heat with the heating surface, and the cooling element is provided with an inlet and an outlet for externally circulating the heat exchange medium.

[0017] Compared to existing technologies, immersing the transducer in a cooling medium can quickly remove the heat generated on the surface of the transducer during operation, preventing the heat from being transferred to the skin surface and affecting the thermal field coupling. At the same time, the cooling medium can provide a more stable temperature field, making the temperature field generated by the absorption of sound transmission more stably coupled with the temperature field provided by the skin surface, which helps to more accurately control the treatment area and treatment temperature.

[0018] The temperature sensor is placed close to the surface of human skin, and is also separated by piezoelectric ceramics under the action of heat insulation plate and protected by heat insulation material, so that the temperature sensor can measure the skin temperature more accurately.

[0019] By incorporating a semiconductor cooler, the cooling surface of the semiconductor cooler can simultaneously cool the skin and the cooling medium and transducer, ensuring the stable operation of the cooling medium and transducer. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram showing the connection between the base assembly and the transducer;

[0022] Figure 3 This is an exploded view of the present invention;

[0023] Figure 4 This is a schematic diagram showing the connection between the cover and the temperature sensor;

[0024] Figure 5 This is a schematic diagram of the main structure of the base;

[0025] Figure 6 This is a cross-sectional view of the present invention;

[0026] Figure 7 This is a side view of the present invention;

[0027] Figure 8 This is a schematic diagram of the temperature sensor installation;

[0028] Reference numerals: 1. Connecting cover; 11. Mating groove; 12. Mounting hole; 2. Base assembly; 21. Base body; 22. Base connecting plate; 23. Connecting base plate; 24. Temperature stabilizing pool; 25. Groove; 26. Abutment rib; 3. Cooling component; 31. Heat exchange medium; 32. Liquid inlet; 33. Liquid outlet; 4. Transducer; 5. Semiconductor cooler; 6. Temperature sensor; 61. Flexible circuit board; 62. Thermistor; 63. Thermally conductive sealant; 64. Heat insulation plate; 65. Heat insulation shell; 7. Cooling medium; 8. Sealant; 9. Sound guiding diaphragm. Detailed Implementation

[0029] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0030] like Figure 1-8 As shown, a temperature-stable ultrasonic treatment head based on precise temperature control includes a base assembly 2 and a transducer 4 connected to the base assembly 2. The base assembly 2 is equipped with a semiconductor cooler 5 for cooling the skin surface, and the semiconductor cooler 5 and the transducer 4 are connected to opposite sides of the base assembly 2. The semiconductor cooler 5 has a cooling surface and a heating surface located on opposite sides of the semiconductor cooler 5. The base assembly 2 is connected to the cooling surface, and a cooling element 3 for cooling the heating surface is connected to the heating surface. A connecting cover 1 covering the transducer 4 is installed on the base assembly 2. The connecting cover 1 has several mating grooves 11 to facilitate the transmission of sound waves from the transducer 4 and several temperature sensors 6 for measuring the temperature of the skin surface. The connecting cover 1 is filled with a cooling medium 7 for cooling the transducer 4, and the surface of the connecting cover 1 is covered with a sound-guiding membrane 9 for sealing the cooling medium 7.

[0031] The transducer 4 is a piezoelectric ceramic, and the cooling medium 7 is a cooling medium with high specific heat capacity.

[0032] Thermal grease or thermal silicone is applied to the cooling surface of the thermoelectric cooler 5 to reduce the thermal resistance of the contact surface of the cooling surface of the thermoelectric cooler 5 and improve heat conduction. Then the cooling surface of the thermoelectric cooler 5 is tightly attached to the bottom surface of the base assembly 2. Similarly, thermal grease or thermal silicone is also applied to the heating surface of the thermoelectric cooler 5 to reduce the thermal resistance of the contact surface of the cooling surface of the thermoelectric cooler 5 and improve heat conduction. Then the heating surface of the thermoelectric cooler 5 is tightly attached to the surface of the cooling component 3.

[0033] The cooling surface of the semiconductor cooler 5 is positioned facing the front end of the user's body, while the heating surface of the semiconductor cooler 5 is positioned facing away from the rear end of the user's body. Under the action of the cooling surface of the semiconductor cooler 5, the cold air is directed towards the user's skin during use, thereby cooling the user's skin and applying a low-temperature source to the skin surface.

[0034] Meanwhile, since the cooling surface of the semiconductor cooler 5 is positioned facing the front end of the usage direction, the cold air generated by the cooling surface of the semiconductor cooler 5 can also cool the transducer 4. Combined with the absorption of the cold air by the cooling medium 7, the cooling medium 7, which is wrapped around the transducer 4, cools the transducer 4, so that the heat generated by the transducer 4 during use is neutralized with the cold air generated by the cooling surface of the semiconductor cooler 5, preventing the heat generated by the transducer 4 from affecting the user's skin.

[0035] The cooling medium 7 needs to have low sound attenuation, high specific heat capacity, provide a relatively stable temperature field, and have little impact on sound transmission. The cooling medium can be a liquid, such as silicone oil, glycerin, ethylene glycol, propylene glycol, or an aqueous solution of one or more of the above media, or it can be a low-temperature resistant gel or a solid sound-conducting pad.

[0036] The base assembly 2 includes a base body 21 and a base connecting plate 22 connected to each other. A transducer 4 is mounted on the base body 21. The cooling surface of the thermoelectric cooler 5 is in contact with the base connecting plate 22, and the transducer 4 is located within the cooling range of the thermoelectric cooler 5. The base body 21 is filled with a temperature-stabilizing liquid for receiving the cooling capacity of the thermoelectric cooler 5 and cooling the transducer 4. A connecting cover 1 is connected to the base body 21.

[0037] The transducer 4 is connected to the base body 21, and the semiconductor cooler 5 is connected to the base connecting plate 22. The base connecting plate 22 receives the cold air from the semiconductor cooler 5 and transfers it to the transducer 4 through the base body 21 to cool the transducer 4. The transducer 4 is connected to the base body 21 facing the skin surface and is located within the cooling range of the semiconductor cooler 5. Similarly, the temperature stabilizing liquid is also located within the cooling range of the semiconductor cooler 5. Under the action of the cooling surface of the semiconductor cooler 5, the temperature of the temperature stabilizing liquid and the transducer 4 are controlled and regulated.

[0038] The base body 21 includes a connecting base plate 23 and a temperature stabilizing tank 24 connected together. The transducer 4 is connected to the top of the temperature stabilizing tank 24, and the temperature stabilizing liquid is filled in the temperature stabilizing tank 24. A sealant 8 is provided between the connecting cover 1 and the connecting base plate 23 to place the transducer 4 in a sealed environment. The sealant 8 between the connecting cover 1 and the connecting base plate 23 achieves a fixed connection between the connecting cover 1 and the connecting base plate 23. At the same time, positioning guide posts are formed on the connecting cover 1 to insert into the connecting base plate 23. The positioning guide posts are set at each corner of the connecting cover 1. The positioning guide posts achieve a pre-position between the connecting cover 1 and the connecting base plate 23, which facilitates the subsequent fixed connection between the connecting cover 1 and the connecting base plate 23 through the sealant 8.

[0039] The connecting cover 1 and the connecting substrate 23 are enclosed in a sealed structure by the sealant 8 and the sound guiding membrane 9, which meets the requirement of filling the connecting cover 1 and the connecting substrate 23 with the cooling medium 7.

[0040] The bottom of the temperature stabilizing pool 24 has a groove 25 for contacting the temperature stabilizing liquid with the base connecting plate 22. The groove 25 is an opening formed at the bottom of the temperature stabilizing pool 24. The two ends of the temperature stabilizing pool 24 are respectively connected to the base connecting plate 22 and the transducer 4. Under the action of the groove 25, the temperature stabilizing liquid in the temperature stabilizing pool 24 comes into contact with the base connecting plate 22. Thus, under the action of the cooling surface of the base connecting plate 22 receiving the semiconductor cooler 5, the transducer 4 and the temperature stabilizing liquid in the temperature stabilizing pool 24 are cooled, ensuring the cooling requirement of the temperature stabilizing liquid for the transducer 4.

[0041] The structure of the groove 25 is set according to actual needs. The groove 25 can be a curved structure to maximize the contact area between the temperature stabilizing liquid and the base connecting plate 22, thereby improving the heat exchange efficiency between the temperature stabilizing liquid and the base connecting plate 22.

[0042] The base connecting plate 22 is connected to the bottom of the temperature stabilizing pool 24. The base connecting plate 22 is used to seal the groove 25 at the bottom of the temperature stabilizing pool 24, and also enables the groove 25 to directly exchange heat with the temperature stabilizing liquid in the temperature stabilizing pool 24 under the action of the groove 25.

[0043] The base connecting plate 22 is connected to the bracket, and the bracket connects to the entire ultrasonic treatment head through the connection with the base connecting plate 22.

[0044] The connecting cover 1 has several mounting holes 12 for mounting several temperature sensors 6. The mounting holes 12 and several mating grooves 11 are arranged alternately in rows, and the temperature sensors 6 are attached to the sound guiding membrane 9.

[0045] The number of mounting holes 12 and mating grooves 11 is set according to actual needs. The mating groove 11 is a strip structure. The mating groove 11 is set to correspond to the transducer 4. The mating groove 11 is used for the sound wave transmission of the transducer 4. The mounting hole 12 is used to snap the temperature sensor 6 into the mounting hole 12.

[0046] The temperature sensor 6 includes a flexible circuit board 61 and a thermistor 62 mounted on the flexible circuit board 61. The thermistor 62 is covered with a thermally conductive sealant 63 connected to the acoustic diaphragm 9. The flexible circuit board 61 leads out the electrical signal of the thermistor 62 through a non-contact signal coupler, such as an optocoupler or a capacitive coupler.

[0047] The thermally conductive sealant 63 is used to protect the thermistor 62 while also achieving adhesion between the thermistor 62 and the acoustic diaphragm 9, ensuring that the thermistor 62 is always placed close to the acoustic diaphragm 9, thereby facilitating the control of the distance between the thermistor 62 and the skin by adjusting the position of the acoustic diaphragm 9.

[0048] Temperature sensor 6 is located inside cooling medium 7. A heat insulation plate 64 is provided on the back of flexible circuit board 61 to support flexible circuit board 61. A heat insulation shell 65 is installed on heat insulation plate 64 to separate thermistor 62 from cooling medium 7.

[0049] The heat insulation shell 65 surrounds the thermally conductive sealant 63, and the heat insulation shell 65 does not affect the connection between the thermally conductive sealant 63 and the sound-conducting membrane 9. The heat insulation plate 64 is used to support the flexible circuit board 61 and also to install the heat insulation shell 65, thereby reducing the influence of the cooling medium 7 on the thermistor 62 and enabling the thermistor 62 to more accurately measure the temperature of the skin.

[0050] The transducer 4 has abutting ribs 26 that abut against the inner wall of the connecting cover 1. The abutting ribs 26 are located on opposite sides of the transducer 4, so that the transducer 4 and the connecting cover 1 form a tight integral structure. The abutting between the transducer 4 and the connecting cover 1 can constrain radial movement and suppress stray vibration, allowing the transducer to perform pure ultrasonic vibration along the designed axis.

[0051] The cooling component 3 is filled with a heat exchange medium 31 for heat exchange with the heating surface. The cooling component 3 is provided with an inlet 32 ​​and an outlet 33 for external circulation of the heat exchange medium 31. Through the inlet 32 ​​and the outlet 33, the heat exchange medium 31 in the cooling component 3 is connected to the outside to form a circulation structure. The heat generated by the heating surface of the semiconductor cooler 5 is carried away by the external circulation of the heat exchange medium 31, thereby achieving cooling of the overall structure.

[0052] The housing of the cooling component 3 is made of copper or aluminum alloy, which meets the structural strength requirements and is used to receive the heat generated by the heating surface of the semiconductor cooler 5. The heat exchange medium 31 can be water. When the water flows into the cooling component 3 through the liquid inlet 32, it carries away the heat from the housing of the cooling component 3, thereby cooling the housing of the cooling component 3. After cooling, the housing of the cooling component 3 receives the heat generated by the heating surface of the semiconductor cooler 5, thus realizing the continuous removal of the heat generated by the heating surface of the semiconductor cooler 5 under the action of the externally circulating water flow.

[0053] In actual use, the acoustic diaphragm 9 on the surface of the connecting cover 1 is gently pressed against the skin surface. Under the action of the connecting cover 1, the distance between the transducer 4 and the skin surface is maintained at more than 1.5mm. This prevents the heat generated by the transducer 4 from directly acting on the skin. Simultaneously, the thermistor 62 of the temperature sensor 6 is positioned close to the acoustic diaphragm 9, allowing it to be more accurately measured for skin temperature.

[0054] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention; therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0055] Although this document frequently uses reference numerals from the figures, such as connecting cover 1, mating groove 11, mounting hole 12, base assembly 2, base body 21, base connecting plate 22, connecting base plate 23, temperature stabilizing pool 24, groove 25, abutment rib 26, cooling component 3, heat exchange medium 31, liquid inlet 32, liquid outlet 33, transducer 4, semiconductor cooler 5, temperature sensor 6, flexible circuit board 61, thermistor 62, thermally conductive sealant 63, heat insulation plate 64, heat insulation shell 65, cooling medium 7, sealant 8, and sound-conducting membrane 9, the possibility of using other terms is not excluded. The use of these terms is merely for the convenience of describing and explaining the essence of the invention; interpreting them as any additional limitation would contradict the spirit of the invention.

Claims

1. A temperature-stable ultrasonic therapy head based on precise temperature control, comprising a base assembly (2) and a transducer (4) connected to the base assembly (2); characterized in that, The base assembly (2) is equipped with a semiconductor cooler (5) for cooling the skin surface. The semiconductor cooler (5) and the transducer (4) are connected to opposite sides of the base assembly (2). The semiconductor cooler (5) has a cooling surface and a heating surface located on opposite sides of the semiconductor cooler (5). The base assembly (2) is connected to the cooling surface, and a cooling element (3) for cooling the heating surface is connected to the heating surface. A connecting cover (1) covering the transducer (4) is installed on the base assembly (2). The connecting cover (1) has several mating grooves (11) formed on it to facilitate the transmission of sound waves from the transducer (4) and several temperature sensors (6) installed on it for measuring the temperature of the skin surface; the connecting cover (1) is filled with a cooling medium (7) for cooling the transducer (4), and the surface of the connecting cover (1) is covered with a sound-guiding membrane (9) for sealing the cooling medium (7); the base assembly (2) includes a base body (21) and a base connecting plate (22) connected to each other, and the transducer (4) is installed on the base body. On (21), the cooling surface of the semiconductor cooler (5) is in contact with the base connecting plate (22), and the transducer (4) is located within the cooling range of the semiconductor cooler (5). The base body (21) is filled with a temperature-stabilizing liquid for receiving the cooling capacity of the semiconductor cooler (5) and cooling the transducer (4). The connecting cover (1) is connected to the base body (21). The transducer (4) is located within the cooling range of the semiconductor cooler (5), and the temperature-stabilizing liquid is also located within the cooling range of the semiconductor cooler (5), thus stabilizing the temperature. The temperature of the warm liquid and the transducer (4) is controlled and regulated; the base body (21) includes a connecting base plate (23) and a temperature stabilizing tank (24) connected to each other. The transducer (4) is connected to the top of the temperature stabilizing tank (24). The temperature stabilizing liquid is filled in the temperature stabilizing tank (24). A sealant (8) is provided between the connecting cover (1) and the connecting base plate (23) for placing the transducer (4) in a sealed environment; a groove (25) is formed at the bottom of the temperature stabilizing tank (24) for contacting the temperature stabilizing liquid with the base connecting plate (22).

2. The temperature-stable ultrasonic therapy head based on precise temperature control according to claim 1, characterized in that, The base connecting plate (22) is fitted to the bottom of the base body (21), and the cross-sectional dimensions of the base connecting plate (22) are larger than the cross-sectional dimensions of the base body (21) and the semiconductor cooler (5).

3. The temperature-stable ultrasonic therapy head based on precise temperature control according to claim 1, characterized in that, The connecting cover (1) has several mounting holes (12) for mounting several temperature sensors (6). The mounting holes (12) and several mating grooves (11) are arranged alternately in rows, and the temperature sensors (6) are attached to the sound guiding membrane (9).

4. The temperature-stable ultrasonic therapy head based on precise temperature control according to claim 1, characterized in that, The temperature sensor (6) includes a flexible circuit board (61) and a thermistor (62) mounted on the flexible circuit board (61). The thermistor (62) is covered with a thermally conductive sealant (63) connected to the acoustic diaphragm (9).

5. The temperature-stable ultrasonic therapy head based on precise temperature control according to claim 4, characterized in that, The temperature sensor (6) is located inside the cooling medium (7). A heat insulation plate (64) for supporting the flexible circuit board (61) is provided on the back of the flexible circuit board (61). A heat insulation shell (65) for separating the thermistor (62) from the cooling medium (7) is installed on the heat insulation plate (64).

6. The temperature-stable ultrasonic therapy head based on precise temperature control according to claim 1, characterized in that, The transducer (4) has abutting ribs (26) that abut against the inner wall of the connecting cover (1), and the abutting ribs (26) are located on opposite sides of the transducer (4).

7. The temperature-stable ultrasonic therapy head based on precise temperature control according to claim 1, characterized in that, The cooling component (3) is filled with a heat exchange medium (31) for exchanging heat with the heating surface, and the cooling component (3) is provided with an inlet (32) and an outlet (33) for externally circulating the heat exchange medium (31).

Images