A multi-ion beam serial processing method and system based on a robot system

Abstract

The present application relates to the technical field of optical processing, and particularly provides a multi-ion beam serial processing method and system based on a robot system, a workpiece is installed on a vacuum processing table, a processing cabin is vacuumized, two robots are used to carry a low-frequency correction ion source and a medium-high frequency correction ion source respectively, a processing track of each robot is planned on a surface to be processed of the workpiece, a residence time of each ion source at each residence point on the processing track is calculated according to a surface error of the workpiece and a removal function of each ion source, and the two robots are serially controlled to carry the low-frequency correction ion source and the medium-high frequency correction ion source to remove low-frequency large-size material and polish high-frequency high-precision from the mirror surface. The present application improves the flexibility of multi-ion source cooperative processing, improves the polishing precision of the mirror surface while improving the high processing efficiency.

Description

Technical Field

[0001] This invention belongs to the field of optical processing technology, and in particular relates to a multi-ion beam serial processing method and system based on a robot system. Background Technology

[0002] With the development of optical science, large-aperture optical elements are widely used in astronomical telescopes, laser systems, and precision optical devices for aerospace applications. These optical elements can reach diameters of hundreds of millimeters or even meters, requiring extremely high precision in surface morphology, flatness, and roughness. Traditional high-precision machining methods mainly rely on mechanical polishing, magnetorheological polishing, and triaxial or five-axis ion beam processing. In traditional ion beam polishing, the machine tool serves as a platform supporting the ion source, and a precise CNC system scans the ion beam to complete the surface finishing of the optical element. Traditional ion beam processing methods can provide high processing accuracy, but they also have certain limitations.

[0003] First, traditional machine tools have limited beam width for ion beam processing, typically requiring multiple scans to cover the entire optical surface to achieve uniform material removal, which leads to extended processing time. While this method performs well in processing small-sized and single workpieces, for processing large-aperture optical elements, the coverage of a single ion beam is limited, and the surfaces of large-aperture optical elements usually have large curvatures, making it difficult for the motion trajectory of traditional machine tools to adapt to these complex surfaces.

[0004] Furthermore, traditional ion beam processing methods lack the flexibility of robotic systems, typically employing fixed machine tool paths. Consequently, their adaptability to path planning and continuous coverage is poor when dealing with complex curved surfaces. Even adjusting the machine tool's motion trajectory or scanning sequence cannot achieve optimal processing efficiency and uniformity. These issues indicate that traditional end-efficiency ion source-carrying processing methods still suffer from limitations such as low efficiency, long processing cycles, and poor surface uniformity when handling large-aperture optical components. Summary of the Invention

[0005] In view of this, the present invention aims to provide a multi-ion beam serial processing method and system based on a robot system. By using a robot to drive the ion source, the drawbacks of the traditional fixed machine tool path ion beam processing method are avoided. Furthermore, by using multiple robots and multiple ion sources in a coordinated manner, the processing efficiency is improved, and the mirror polishing accuracy is also enhanced.

[0006] To achieve the above objectives, the technical solution created by this invention is implemented as follows: This invention provides a multi-ion beam serial processing method based on a robotic system, comprising: Measure the surface shape error of the workpiece; The workpiece is mounted on the vacuum processing table, and the processing chamber is evacuated. Set up at least two robots, and install ion sources with different frequencies and beam widths at the end of each robot, and measure the removal function of each ion source; The machining trajectory of each robot is planned on the surface of the workpiece to be machined, and dwell points are evenly set on the machining trajectory; Based on the surface shape error of the workpiece and the removal function of each ion source, the dwell time of each ion source at each dwell point on the machining trajectory is calculated; The processing sequence of each robot is set, and the start time of two robots in adjacent processing sequences is set with a time difference, so that the processing positions of the ion sources carried by the two robots are always in a non-overlapping state.

[0007] Preferably, the air pressure inside the processing chamber is not higher than [the specified value]. Pa.

[0008] Preferably, the processing trajectory is a grating trajectory, a circular trajectory, or a spiral trajectory.

[0009] Preferably, two robots are set up, one equipped with a low-frequency correction ion source and the other with a mid-to-high frequency correction ion source. The beam width of the low-frequency correction ion source is greater than that of the mid-to-high frequency correction ion source, and the power of the low-frequency correction ion source is higher than that of the mid-to-high frequency correction ion source.

[0010] Preferably, the ion beam current density distribution of each ion source is obtained by Faraday cup scanning, and the current density distribution is converted into the material removal distribution per unit time as the removal function; based on the surface error of the workpiece and the removal function of each ion source, the dwell time of each ion source at each dwell point on the processing trajectory is solved by deconvolution operation.

[0011] Preferably, the removal function of the modified low-frequency ion source for: ; in, To correct the peak ion beam removal rate provided by the low-frequency ion source. This indicates a correction to the ion beam current density distribution provided by a low-frequency ion source. Indicates the coordinates of the position of the ion beam center on the workpiece surface. Correction of removal function of mid-to-high frequency ion source for: ; in, To correct the peak ion beam removal rate provided by the mid-to-high frequency ion source. This indicates the distribution of ion beam current density provided by the corrected medium-to-high frequency ion source.

[0012] Preferably, each robot is a six-degree-of-freedom vacuum robotic arm.

[0013] Preferably, the workpiece is an optical lens.

[0014] This invention provides a multi-ion beam serial machining system based on a robot system, which processes workpieces using a multi-ion beam serial machining method based on a robot system. The system includes: The processing chamber is used to house the workpiece and ion source, providing a vacuum processing environment; A workpiece fixing device installed in the processing chamber is used to fix the workpiece. At least two robots, each equipped with an ion source of different frequency and beam width at its end; And a controller, which is connected to each robot and each ion source respectively, to control each robot to drive the corresponding ion source to move, and to control each ion source to process the workpiece.

[0015] Compared with the prior art, the present invention can achieve the following beneficial effects: This invention employs multiple robots driving multiple ion sources with different frequencies and beam widths for collaborative processing. Low-frequency, wide-beam ion sources are used for rough mirror finishing, while medium-to-high-frequency, narrow-beam ion sources are used for fine mirror finishing, achieving efficient and high-precision processing of large-aperture optical components. Compared to traditional single-beam machine tools, the robot system's spatial coordination and path planning improve processing flexibility and continuity, adapting to processing tasks involving various materials and workpiece sizes. The sequential strategy of low-frequency rough finishing and medium-to-high-frequency fine finishing allows for efficient removal of large-sized materials using low-frequency, wide-beam ion sources, while simultaneously enabling fine finishing using medium-to-high-frequency, narrow-beam ion sources, ensuring surface accuracy meets processing requirements and resolving the inherent trade-off between efficiency and precision with a single ion source. Furthermore, the six-degree-of-freedom robot's end effector carries an ion source, allowing for flexible adaptation to spherical, aspherical, and free-form surfaces, avoiding the trajectory limitations of traditional machine tools.

[0016] This invention achieves an automated processing procedure through Faraday cup calibration removal function, dwell time deconvolution, and velocity modulation, and avoids spatial interference and collisions between robots due to the serial time difference between them. Attached Figure Description

[0017] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a structural diagram of a multi-ion beam serial processing system based on a robot system provided in an embodiment of the present invention; Figure 2This is a flowchart of a multi-ion beam serial processing method based on a robot system provided according to an embodiment of the present invention.

[0018] The reference numerals in the figures include: Processing chamber 1, workpiece 2, low-frequency correction ion source 3, medium-high frequency correction ion source 4, first robot 5, second robot 6. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and do not constitute a limitation thereof. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the invention. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the invention are not shown or described in the specification. This is to avoid obscuring the core parts of the invention with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; the relevant operations can be fully understood based on the description in the specification and general technical knowledge in the art.

[0020] It should be noted that, unless otherwise specified, the embodiments and features described in this invention can be combined to form various implementations. Furthermore, the order of the steps or actions in the method description can be changed or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various orders in the specification and drawings are merely for the clear description of a particular embodiment and do not imply a mandatory order, unless otherwise stated that a particular order must be followed.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] Please see Figure 1 In one embodiment of the present invention, a multi-ion beam serial processing system based on a robot system is provided, comprising: a processing chamber 1, a workpiece 2, a workpiece fixing device, a low-frequency corrected ion source 3, a mid-to-high frequency corrected ion source 4, a first robot 5, a second robot 6, and a controller (not shown in the figure); wherein, the processing chamber 1 is a sealed device used to accommodate the workpiece 2, the low-frequency corrected ion source 3, the mid-to-high frequency corrected ion source 4, the first robot 5, and the second robot 6, etc. The processing chamber 1 is provided with an air extraction port, and a vacuum pump can be used to evacuate the chamber to provide a vacuum environment for ion beam polishing. Under normal circumstances, in order to ensure that the ion beam transmission is free from scattering and oxidation, the internal air pressure of the processing chamber 1 needs to be no higher than Pa.

[0025] Workpiece 2 is fixed by a workpiece fixing device, which can generally be a vacuum fixture or a mechanical fixture. The workpiece fixing device stably holds workpiece 2, ensuring that workpiece 2 remains stable and does not shift during the processing.

[0026] The surface shape error of workpiece 2 exists in multiple frequency bands. Among them, the low-frequency error is the overall deviation of the "surface shape", the mid-frequency error is the periodic fluctuation of "ripples", and the high-frequency error is the microscopic "roughness". Different diameters have different frequency error ranges.

[0027] The first robot 5 is equipped with a low-frequency, wide-beam-width modified low-frequency ion source 3 at its end, which is used to generate a low-frequency, wide-beam-spot ion beam suitable for efficient material removal in the roughing stage.

[0028] The end of the second robot 6 is equipped with a medium-to-high frequency, small beam width modified medium-to-high frequency ion source 4, which is used to generate a medium-to-high frequency, small beam spot ion beam, suitable for high-precision surface finishing in the fine-finishing stage.

[0029] Both the low-frequency ion source 3 and the mid-to-high-frequency ion source 4 are electrically connected to the controller, which allows for independent adjustment of their current density and power. Furthermore, the first robot 5 and the second robot 6 are also electrically connected to the controller, which controls their movement and orientation to achieve serial processing. Both robots 5 and 6 are six-degree-of-freedom vacuum robotic arms, possessing high positioning accuracy and flexibility, enabling them to drive the low-frequency ion source 3 and the mid-to-high-frequency ion source 4 along preset processing trajectories for roughing and finishing.

[0030] For the above systems, such as Figure 2 As shown, this embodiment of the invention also proposes a multi-ion beam serial processing method based on a robot system suitable for the above-mentioned system, the method comprising the following steps: Step S1: First, the surface shape error of workpiece 2 needs to be measured. Workpiece 2 is a circular optical lens. Specifically, the initial surface shape of the workpiece before processing can be measured using equipment such as a coordinate measuring machine or an interferometer. This initial surface shape includes a series of discrete data points on the lens surface, representing the surface shape of the lens to be processed. Furthermore, the target surface shape to be achieved after processing is set, also represented by discrete data points. The difference between the initial surface shape and the target surface shape is obtained for each data point. The differences between all data points constitute the surface shape error of workpiece 2, which is the final amount of material removed during subsequent processing.

[0031] Step S2: Install workpiece 2 inside the processing chamber 1 and clamp it using a workpiece fixing device to ensure stability and prevent displacement during processing. After installation, workpiece 2 needs to be positioned along its edges, and the collected point set is fitted to the edge contour of workpiece 2. This involves scanning along the edge of workpiece 2 using the robot's motion system to ensure alignment between the workpiece's edge and the processing system, and recording the edge information for subsequent precise scanning and path planning.

[0032] Step S3: After workpiece 2 is installed and positioned, initiate the vacuuming process in processing chamber 1 to remove air from the chamber to the specified vacuum level, thus eliminating scattering of the ion beam and energy loss by gas molecules. Vacuuming requires ensuring that the air pressure inside processing chamber 1 does not exceed [a certain value]. Pa, and the vacuum level inside the processing chamber 1 can be effectively maintained.

[0033] Step S4: Set up a first robot 5 and a second robot 6. Install a modified low-frequency ion source 3 at the end of the first robot 5. The modified low-frequency ion source 3 is used to provide a low-frequency, wide-beam ion beam. The modified low-frequency ion source 3 is mainly used in the roughing stage of the processing flow. Under the premise of ensuring a certain surface convergence, it prioritizes high-efficiency material removal and quickly reduces the overall unevenness of the workpiece 2 surface. Install a modified medium-high frequency ion source 4 at the end of the second robot 6. The modified medium-high frequency ion source 4 is used to provide a medium-high frequency, narrow-beam ion beam. The modified medium-high frequency ion source 4 is mainly used in the fine-finishing stage of the processing flow. It is mainly used to remove the small protrusions remaining after roughing, improve surface roughness, and make the final surface accuracy of the workpiece 2 meet the design requirements. The beam width of the modified low-frequency ion source 3 is greater than that of the modified medium-high frequency ion source 4, and the power of the modified low-frequency ion source 3 is higher than that of the modified medium-high frequency ion source 4.

[0034] The ion beam processing of workpiece 2 using a modified low-frequency ion source 3 and a modified medium-to-high-frequency ion source 4 is a surface processing technique that removes trace amounts of material by bombarding the surface of workpiece 2 with charged ions. This process needs to be carried out in a vacuum environment to reduce the influence of impurities in the air on the ion beam. In this embodiment of the invention, the ion beam processing is performed at an air pressure of [insert pressure here]. The process is carried out in a vacuum environment to ensure high-precision and efficient material removal. The energy, beam width, and feed rate of the ion beam are all affected by the vacuum environment.

[0035] To facilitate subsequent calculations of the residence time distribution, it is also necessary to determine the removal functions of the modified low-frequency ion source 3 and the modified mid-to-high-frequency ion source 4. The ion beam removal rates of the modified low-frequency ion source 3 and the modified mid-to-high-frequency ion source 4 can be described by a Gaussian distribution function. Specifically, the removal function of the modified low-frequency ion source 3 is set... for: ; in, To correct the peak ion beam removal rate provided by the low-frequency ion source 3. The distribution of the ion beam current density provided by the low-frequency ion source 3 determines the range of material removal. This indicates the coordinates of the ion beam center on the workpiece surface.

[0036] Set the removal function of the high-frequency ion source 4 for correction. for: ; in, To correct the peak ion beam removal rate provided by the medium-to-high frequency ion source 4. The distribution of the ion beam current density provided by the modified high-frequency ion source 4 determines the distribution range of material removal.

[0037] Step S5: During ion beam processing, the trajectory planning for correcting the low-frequency ion source 3 and the mid-to-high-frequency ion source 4 is crucial. When processing the surface of large-aperture optical components, the trajectory planning of the first robot 5 and the second robot 6 needs to be rationally designed based on the shape, curvature, and regional differences of the workpiece 2. To ensure uniform removal across the entire surface, the path needs to be optimized based on parameters such as removal rate, beam current density, and beam width, so that the removal amount at each point is as close as possible to the ideal value.

[0038] In the process of machining trajectory planning, the residence time distribution and removal function are key machining parameters, which determine the time the ion beam stays on the workpiece surface, thus affecting the amount of material removed. The residence time is calculated using Faraday cup scanning. The Faraday cup is used to measure the ion beam current. By scanning the surface of workpiece 2 in real time, the ion beam current density distribution at each residence point on each machining trajectory can be calculated. This yields the actual removal function on the surface of workpiece 4 for the corrected low-frequency ion source 3 and the corrected mid-to-high-frequency ion source 4. Specifically, it yields the peak removal rate and current density distribution in the removal function of the corrected low-frequency ion source, and the peak removal rate and current density distribution in the removal function of the high-frequency ion source. Specifically, before the first robot 5 and the second robot 6 carry the modified low-frequency ion source 3 and the modified mid-to-high-frequency ion source 4 for processing, a Faraday cup scan is required to measure the current change during ion beam bombardment in real time. The Faraday cup can feed back the output signal to the controller, calculate the material removal distribution per unit time based on the current density distribution, and then infer the required dwell time. According to the actual processing requirements, the power and beam width of the ion beam emitted by the modified low-frequency ion source 3 and the modified mid-to-high-frequency ion source 4 can be dynamically adjusted, thereby adjusting the removal function and optimizing the processing path and dwell time distribution. This process can determine the dwell time and removal function of the modified low-frequency ion source 3 at each dwell point during the low-frequency roughing process, as well as the traveling speed of the first robot 5 carrying the modified low-frequency ion source 3. This travel speed is actually calculated by converting the dwell time. Since the ion beam does not stay at each dwell point for a period of time before jumping directly to the next dwell point for processing, but is a continuous processing method, the dwell time at each dwell point is converted into the time required for the ion beam to move from the current dwell point to the next dwell point. In fact, the distance between two dwell points is divided by the dwell time, which gives the travel speed of the robot (or ion source).

[0039] Similarly, during the mid-to-high frequency refinement process, the residence time and removal function of the mid-to-high frequency ion source 4 at each residence point can be determined, as well as the travel speed of the second robot 6 carrying the refined mid-to-high frequency ion source 4.

[0040] Step S6: After the processing parameters for the modified low-frequency ion source 3, the modified medium-high frequency ion source 4, the first robot 5, and the second robot 6 are determined, the controller generates a low-frequency roughing machining program and a medium-high frequency fineing machining program. Machining is then performed according to these two programs.

[0041] Before performing low-frequency roughing and medium-to-high-frequency fine finishing, the processing sequence of the first robot 5 and the second robot 6, as well as their start-up times, need to be set. The processing sequence of the first robot 5 and the second robot 6 is to perform low-frequency roughing first, followed by medium-to-high-frequency fine finishing. A time difference is set between the start-up times of the first robot 5 and the second robot 6. This time difference needs to ensure that the ion sources carried by the two robots remain in a non-overlapping state throughout the entire processing time. The design of the start-up time difference is mainly to avoid interference between the robots when performing serial processing on the same workpiece 2, effectively preventing collisions between the two robots during processing. If the second robot 6 is started only after the first robot 5 has completed all low-frequency roughing, the processing time would be too long. Therefore, in this embodiment of the invention, a delay of 0.1 seconds to several seconds is set between the start-up times of the first robot 5 and the second robot 6 to ensure that the two ion beams do not act simultaneously in the same area.

[0042] After the planning is completed, the first robot 5, carrying the low-frequency ion source 3, begins rough shaping of the optical surface of workpiece 2. The low-frequency ion beam has high energy and a large beam width, suitable for rapidly removing large areas of material. The first robot 5 scans the optical surface along the planned processing trajectory to remove protruding material. During the low-frequency rough shaping process, the processing program presets adjustments to the ion beam width and power parameters at different dwell points, ensuring a uniform distribution of material removal and avoiding localized over-removal or uneven processing.

[0043] After a preset delay, the second robot 6 is activated. Carrying a modified mid-to-high frequency ion source 4, the second robot 6 begins fine-tuning the optical surface of the workpiece 2. The mid-to-high frequency ion beam has a smaller beam width and lower power, making it suitable for precisely removing trace amounts of material from the surface, improving surface finish and microscopic precision. The machining trajectory of the second robot 6 is typically staggered or intersected with that of the first robot 5 to ensure that the fine-tuning covers all areas and eliminates any minor defects that may have been left during the low-frequency rough-tuning stage.

[0044] After the first robot 5 and the second robot 6 complete their work, the vacuum in the processing chamber 1 is gradually released to restore it to normal air pressure, ensuring that the workpiece 2 can be safely removed and processed.

[0045] This completes the dual-ion-beam serial processing task based on a dual-robot system. Through reasonable trajectory planning, time difference control, and spatial staggering strategies, the first robot 5 and the second robot 6 can work safely and efficiently in the same area, avoiding collisions, while ensuring that the removal rate and surface accuracy meet the expected goals.

[0046] In summary, the above description is merely a preferred embodiment of this specification and is not intended to limit the scope of protection of this specification. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of protection of this specification.

[0047] The systems, apparatuses, modules, or units described in one or more of the above embodiments may be implemented by a computer chip or entity, or by a product having a certain function. A typical implementation device is a computer. Specifically, a computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smartphone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or any combination of these devices.

[0048] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0049] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

Claims

1. A multi-ion beam serial processing method based on a robot system, characterized in that, include: Measure the surface shape error of the workpiece; The workpiece is mounted on a vacuum processing table, and the processing chamber is evacuated. Set up at least two robots, and install ion sources with different frequencies and beam widths at the end of each robot, and measure the removal function of each ion source; Two robots are set up, one equipped with a low-frequency correction ion source and the other with a mid-to-high frequency correction ion source. The beam width of the low-frequency correction ion source is greater than that of the mid-to-high frequency correction ion source, and the power of the low-frequency correction ion source is higher than that of the mid-to-high frequency correction ion source. Correcting the removal function of low-frequency ion sources for: ； in, To correct the peak ion beam removal rate provided by the low-frequency ion source. This indicates a correction to the ion beam current density distribution provided by a low-frequency ion source. Indicates the coordinates of the ion beam center on the workpiece surface; Correction of removal function of mid-to-high frequency ion source for: ； in, To correct the peak ion beam removal rate provided by the mid-to-high frequency ion source. This indicates the distribution of ion beam current density provided by a mid-to-high frequency ion source. A machining trajectory for each robot is planned on the surface of the workpiece to be machined, and dwell points are evenly set on the machining trajectory; Based on the surface shape error of the workpiece and the removal function of each ion source, the dwell time of each ion source at each dwell point on the processing trajectory is calculated; The ion beam current density distribution of each ion source is obtained by Faraday cup scanning. The current density distribution is converted into a material removal distribution per unit time as a removal function. Based on the surface error of the workpiece and the removal function of each ion source, the dwell time of each ion source at each dwell point on the processing trajectory is solved by deconvolution operation. The processing sequence of each robot is set, and the start time of two robots in adjacent processing sequences is set with a time difference, so that the processing positions of the ion sources carried by the two robots are always in a non-overlapping state.

2. The multi-ion beam serial processing method based on a robot system according to claim 1, characterized in that, The air pressure inside the processing chamber is not higher than Pa.

3. The multi-ion beam serial processing method based on a robot system according to claim 1, characterized in that, The processing trajectory is a grating trajectory, a circular trajectory, or a spiral trajectory.

4. The multi-ion beam serial processing method based on a robot system according to claim 1, characterized in that, Each robot is a six-degree-of-freedom vacuum robotic arm.

5. The multi-ion beam serial processing method based on a robot system according to claim 1, characterized in that, The workpiece is an optical lens.

6. A multi-ion beam serial processing system based on a robot system, characterized in that, The workpiece is processed using the multi-ion beam serial processing method based on a robot system as described in any one of claims 1 to 5, the system comprising: The processing chamber is used to house the workpiece and ion source, providing a vacuum processing environment; The workpiece fixing device, installed in the processing chamber, is used to fix the workpiece; At least two robots, each equipped with an ion source of different frequency and beam width at its end; The system includes a controller connected to each robot and each ion source, which controls each robot to move the corresponding ion source and controls each ion source to process the workpiece.

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