A deposition apparatus and a deposition method

Abstract

The application belongs to the technical field of PSL deposition equipment, and particularly relates to a deposition equipment and a deposition method. The deposition equipment comprises a mounting structure, a plurality of atomization and drying assemblies and a deposition assembly. The plurality of atomization and drying assemblies are used for corresponding passing of particle suspensions with different particle sizes and atomization and drying. The deposition assembly comprises a deposition box body and a carrier assembly. The deposition box body is in communication with the atomization and drying assemblies, and a side edge thereof is open to allow the carrier assembly to extend into or move out. The carrier assembly comprises a bottom plate, a cover plate and a plurality of adapter plates. The bottom plate is provided with a first wafer placing groove and a plurality of layer adapter placing grooves. The outer diameters of the adapter placing grooves decrease from top to bottom to place the adapter plates. The adapter plates are provided with a second wafer placing groove. The cover plate is provided with a deposition hole in communication with the first wafer placing groove. The application can realize rapid switching of particle deposition with different particle sizes, rapid switching of multiple size wafers, and meet the large-scale and standardized preparation requirements of PSL calibration wafers.

Description

Technical Field

[0001] This application belongs to the technical field of PSL deposition equipment, specifically relating to a deposition equipment and deposition method. Background Technology

[0002] Wafer surface defect inspection equipment (such as wafer surface particle inspectors and optical scanning inspection systems) is a key piece of equipment for ensuring chip yield. To ensure inspection accuracy, particle size identification accuracy, and consistency between equipment, it is necessary to use standard calibration wafers for regular calibration and verification.

[0003] PSL (polystyrene latex microspheres) is currently the industry-recognized standard calibration particle. Because PSL itself consists of micro- and nano-sized spheres, it cannot be used directly for equipment calibration. It must be uniformly and controllably deposited onto the surface of a silicon wafer to create PSL calibration wafers (standard wafers) before it can be used as a reference scale. Furthermore, different testing equipment requires calibration of defects of different sizes; therefore, it is necessary to deposit PSL of different particle sizes on wafers of different sizes to create calibration wafers of different specifications.

[0004] Currently, dedicated PSL deposition equipment is scarce, expensive, and generally suffers from the following problems: 1. It cannot simultaneously meet the deposition requirements of PSL with multiple particle sizes. Switching between particle sizes requires frequent disassembly and cleaning, which is inefficient and prone to cross-contamination. 2. Switching between different wafer sizes (such as 6-inch and 8-inch) is inconvenient and has poor versatility.

[0005] Existing multi-cavity chemical vapor deposition equipment is mainly geared towards thin film preparation and has not been optimized for PSL particle atomization deposition, multi-particle-size parallel processing, and rapid shape change, thus failing to meet the requirements for efficient, stable, and large-scale preparation of PSL standard wafers. Summary of the Invention

[0006] The purpose of this application is to solve at least one of the technical problems existing in the prior art, and to provide a deposition device and deposition method, which realizes rapid switching of deposition of particles of different sizes and is compatible with rapid switching of multi-size wafers by setting up multiple sets of atomizing and drying components and adding a transition plate structure on the base plate, thereby meeting the needs of large-scale and standardized preparation of PSL calibration wafers. It is also simple in structure, easy to operate and has high preparation efficiency.

[0007] The technical solution adopted by this application to solve its technical problem is: In a first aspect, a deposition apparatus includes: Installation structure; Multiple sets of atomizing and drying components are installed on the mounting structure. Different sets of atomizing and drying components are used to atomize and dry particle suspensions of different particle sizes. A deposition assembly is installed on the mounting structure. The deposition assembly includes a deposition chamber and a stage assembly. The deposition chamber is connected to the atomizing and drying assembly. The side of the deposition chamber has a side opening that communicates with the outside, allowing the stage assembly to extend into or move out of the deposition chamber. The stage assembly includes a base plate, a cover plate, and several adapter plates. The cover plate covers the top of the base plate. The base plate has a first wafer placement slot and several adapter placement slots connected below the first wafer placement slot. The adapter placement slots are distributed sequentially from top to bottom, with their maximum outer diameter decreasing sequentially. The adapter placement slots are used to place the adapter plates. The adapter plates have second wafer placement slots. The cover plate has deposition holes that communicate with the first wafer placement slots.

[0008] In conjunction with the first aspect, some implementations of the first aspect further include a gas source regulating component. The atomizing and drying component includes a piezoelectric atomizing component and a dryer. The piezoelectric atomizing component is used to atomize the particle suspension. The dryer is provided with an atomizing interface, a gas drying inlet, a particle flow outlet, and a liquid flow outlet. The atomizing interface is connected to the outlet end of the piezoelectric atomizing component. The gas source regulating component is connected to the gas drying inlet to supply gas to the dryer. The particle flow outlet is connected to the deposition chamber.

[0009] In combination with the first aspect and the above-described implementations, in some implementations of the first aspect, the dryer is provided with an electric heating module, which is used to heat the airflow inside the dryer.

[0010] In conjunction with the first aspect and the above-described implementations, in some implementations of the first aspect, the deposition assembly further includes a conveying assembly for reciprocatingly conveying the stage assembly between the inner cavity and the outer side of the deposition chamber. The conveying assembly includes a drawer rail, the base plate is mounted on the drawer rail, and the drawer rail extends into or out of the deposition chamber through the side opening.

[0011] In conjunction with the first aspect and the above-described implementations, in some implementations of the first aspect, a waste gas treatment device is provided below the sedimentation tank. The waste gas treatment device includes a waste gas collection hopper communicating with the sedimentation tank and a waste gas treatment tank located below the waste gas collection hopper. A filter component is provided at the top of the waste gas collection hopper, and an exhaust fan is provided at the bottom of the waste gas collection hopper. The waste gas treatment tank is used to hold liquid, and the exhaust fan is used to send waste gas into the liquid in the waste gas treatment tank.

[0012] In conjunction with the first aspect and the above-described implementations, in some implementations of the first aspect, the installation structure includes an installation box, which has interconnected deposition chamber, atomization chamber, exhaust gas chamber, and air supply chamber. The deposition assembly is located in the deposition chamber, the atomization chamber is located on the side of the deposition chamber and is used to install the atomization drying assembly, the exhaust gas chamber is located below the atomization chamber and is used to install the exhaust gas treatment device, the deposition box has a top opening and an openable top cover at the top opening, and the air supply chamber is located above the deposition chamber and has an air supply unit, which is used to supply air to the deposition box through the top opening.

[0013] In combination with the first aspect and the above-mentioned implementation methods, in some implementation methods of the first aspect, the base plate is provided with an adsorption placement groove, the side of the base plate is provided with an operation port that communicates with the adsorption placement groove, the adsorption placement groove is connected to the outside through the operation port, the adsorption placement groove is used to place a wafer adsorption tool, the top of the adsorption placement groove is connected to the bottommost adapter placement groove, and the adapter plate is provided with a through hole in the vertical direction at the bottom of the second wafer placement groove.

[0014] In combination with the first aspect and the above-mentioned implementation methods, in some implementation methods of the first aspect, the bottom of the cover plate is provided with a sealing rib, and the top of the bottom plate is provided with a corresponding sealing groove, wherein the sealing rib and the sealing groove are fitted together to form a sealing fit.

[0015] In a second aspect, a deposition method applied to a deposition apparatus according to any implementation of the first aspect, comprising: Suspensions of particles of different sizes are passed into corresponding atomizing and drying components for atomization and drying, forming a dry particle airflow. According to the size of the wafer to be deposited, select the corresponding adapter plate and place it in the adapter placement slot. Place the wafer in the first wafer placement slot or the second wafer placement slot and cover it with the cover plate. The stage assembly is fed into the deposition chamber, and the dry particles are air-flowed into the deposition chamber, so that the particles fall through the deposition holes of the cover plate and are deposited on the wafer surface. After deposition is complete, the stage assembly is removed and the wafer is taken out.

[0016] In conjunction with the second aspect, in some implementations of the second aspect, after deposition is completed, the top cover of the deposition chamber is opened, and the blower unit and exhaust fan unit are started to blow and clean the deposition chamber with airflow.

[0017] One of the above technical solutions has at least one of the following advantages or beneficial effects: By setting up multiple sets of atomizing drying components, this application can simultaneously process particle suspensions of different particle sizes, avoiding frequent disassembly and cleaning when switching particle sizes, realizing rapid switching of particle deposition of different particle sizes, improving preparation efficiency and reducing cross-contamination; by setting up multi-layer transfer placement grooves and transfer plates on the base plate, it can quickly adapt to wafers of different sizes, improving the equipment's versatility; the stage assembly can extend into or out of the deposition chamber through the side opening, with a simple structure and convenient loading and unloading; the simple structure, compact overall layout, and convenient operation can meet the needs of efficient, stable, and large-scale preparation of PSL calibration wafers, which is conducive to reducing production costs. Attached Figure Description

[0018] The following description, in conjunction with the accompanying drawings, further illustrates this application: Figure 1 This is a first-view structural schematic diagram of an embodiment of the deposition apparatus of this application; Figure 2 yes Figure 1 The diagram shown is a structural schematic from a second perspective of one embodiment. Figure 3 yes Figure 1 The diagram shows a structural schematic of an embodiment of a waste gas treatment device; Figure 4 yes Figure 1 The diagram shows a structural schematic of the platform assembly and drawer rails in one embodiment. Figure 5 yes Figure 1 The diagram shown is a schematic of a structure in which the base plate has a first wafer placement slot and a transfer placement slot. Figure 6 yes Figure 5 The diagram shows a schematic representation of a structure in which a wafer is placed in a first wafer placement slot. Figure 7 yes Figure 5 The diagram shows a structural schematic of an embodiment in which an adapter plate is placed in an adapter placement slot; Figure 8 yes Figure 7 The diagram shows a schematic of a structure in which a wafer is placed in the second wafer placement slot of an adapter plate, according to one embodiment.

[0019] Explanation of icon numbers: 1-Installation structure; 11-Deposition chamber; 12-Atomization chamber; 13-Exhaust gas chamber; 14-Air supply chamber; 21-Piezoelectric atomizing component; 22-Dryer; 221-Atomization interface; 222-Gas drying inlet; 223-Particle flow outlet; 224-Liquid outlet; 23-Electrothermal module; 31-Sedimentation tank; 311-Side opening; 312-Top cover; 32-Stage assembly; 321-Base plate; 3211-First wafer placement slot; 3212-Transfer placement slot; 3213-Adsorption placement slot; 3214-Operation port; 322-Cover plate; 3221-Deposition hole; 323-Transfer plate; 3231-Second wafer placement slot; 324-Sealing groove; 33-Drawer slide; 331-Fixed slide; 332-Sliding slide; 333-Drawer door; 4-Gas source regulating component; 41-Power button; 42-Gas source switch; 43-Pressure regulating valve; 44-Pressure gauge; 45-Static neutralizer; 46-Precision filter; 5-Waste gas treatment device; 51-Waste gas collection hopper; 52-Filter component; 53-Exhaust fan; 54-Waste gas treatment tank; 6-Air supply unit; 7-Wafer adsorption tool; 8-Wafer. Detailed Implementation

[0020] This section will describe in detail the specific embodiments of this application. Preferred embodiments of this application are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of this application, but they should not be construed as limiting the scope of protection of this application.

[0021] In this application, when directions (up, down, left, right, front, and back) are described, it is only for the purpose of describing the technical solution of this application, and does not indicate or imply that the technical features referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on this application.

[0022] In this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," "exceeding," etc. are understood to exclude the stated number; "above," "below," "within," etc. are understood to include the stated number. In the description of this application, the terms "first" and "second" are used only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0023] In this application, unless otherwise explicitly defined, the terms "setup," "installation," and "connection" should be interpreted broadly. For example, they can refer to direct connection or indirect connection through an intermediate medium; they can refer to fixed connection, detachable connection, or integral molding; they can refer to mechanical connection, electrical connection, or connection capable of mutual communication; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can reasonably determine the specific meaning of the above terms in this application based on the specific content of the technical solution.

[0024] See Figures 1 to 8 This application provides a deposition device, including an installation structure 1, multiple sets of atomizing and drying components, and a deposition component.

[0025] Multiple sets of atomizing and drying components are installed in mounting structure 1. Different sets of atomizing and drying components are used to introduce particle suspensions of different particle sizes and to complete atomization and drying respectively. By using multiple independently set atomizing and drying components, particles of different sizes can be processed independently, avoiding frequent disassembly and cleaning when switching particle sizes, improving preparation efficiency and reducing the risk of cross-contamination.

[0026] The deposition assembly is mounted on the mounting structure 1 and includes a deposition chamber 31 and a stage assembly 32. The deposition chamber 31 is connected to the atomizing and drying assembly to provide a sealed space for particle deposition. The deposition chamber 31 has a side opening 311 on its side, through which the stage assembly 32 can extend into or move out of the deposition chamber 31, facilitating the placement and removal of the wafer 8.

[0027] The stage assembly 32 includes a base plate 321, a cover plate 322, and several adapter plates 323. The cover plate 322 is placed on top of the base plate 321 to cover and seal the top of the base plate 321 to ensure directional particle deposition.

[0028] The base plate 321 is provided with a first wafer placement slot 3211 and several transition placement slots 3212. The first wafer placement slot 3211 is the largest size slot and is directly used to place large-size wafers 8 (such as 8-inch or 12-inch wafers) without the need for an adapter board 323.

[0029] The adapter placement slot 3212 is located below the first wafer placement slot 3211. It is distributed from top to bottom and the maximum outer diameter decreases sequentially, forming a multi-layer stepped adapter structure that can match adapter boards 323 with different outer diameter specifications.

[0030] When it is necessary to place a small-sized wafer 8 (such as a 6-inch or smaller wafer), select the corresponding specification of the adapter board 323 according to the actual size of the wafer, and place the adapter board 323 smoothly into the matching adapter placement slot 3212 so that the adapter board 323 fits and is positioned with the adapter placement slot 3212; then place the small-sized wafer 8 into the second wafer placement slot 3231 of the adapter board 323 to complete the quick positioning and installation of the small-sized wafer 8.

[0031] With the combination of the stepped groove and the replaceable adapter plate 323, wafers of different sizes can be quickly switched on the same stage assembly 32 without replacing the entire stage. This makes the operation simple, versatile, and meets the needs of rapid preparation of multi-specification calibration wafers.

[0032] The cover plate 322 is provided with a deposition hole 3221, which is connected to the first wafer placement groove 3211, so that particles can be deposited on the surface of the wafer 8 through the deposition hole 3221.

[0033] In this embodiment, the particles to be atomized are PSL particles, namely polystyrene latex microspheres.

[0034] The deposition equipment of this application, by setting up multiple sets of atomizing and drying components, can simultaneously process particle suspensions of different particle sizes, avoiding frequent disassembly and cleaning when switching particle sizes, realizing rapid switching of particle deposition for different particle sizes, improving preparation efficiency and reducing cross-contamination; by setting up multi-layer transfer placement grooves and transfer plates on the base plate, it can quickly adapt to wafers of different sizes, improving the equipment's versatility; the stage assembly can extend into or out of the deposition chamber through the side opening, with a simple structure and convenient loading and unloading; the simple structure, compact overall layout, and convenient operation can meet the needs of efficient, stable, and large-scale preparation of PSL calibration wafers, which is conducive to reducing production costs.

[0035] See Figures 5 to 8 In some embodiments, the base plate 321 is provided with an adsorption placement groove 3213 for placing the wafer adsorption tool 7. The side of the base plate 321 is provided with an operation port 3214 communicating with the adsorption placement groove 3213. The adsorption placement groove 3213 communicates with the outside through the operation port 3214, allowing operators to place or remove the wafer 8 from the side. The top of the adsorption placement groove 3213 communicates with the lowest transition placement groove 3212. The transition plate 323 is provided with a through hole running vertically through the bottom of the second wafer placement groove 3231, allowing the wafer 8 in the second wafer placement groove 3231 to communicate with the adsorption placement groove 3213, facilitating the adsorption and fixation of the wafer 8 by the wafer adsorption tool 7. The wafer adsorption tool 7 may include an adsorption pen, etc., and is not limited thereto.

[0036] Further, see Figure 1 and Figure 2The deposition equipment also includes a gas source regulating component 4. The atomizing and drying component includes a piezoelectric atomizing component 21 and a dryer 22.

[0037] The piezoelectric atomizing component 21 is used to atomize the particle suspension prepared by adding a certain amount of pure water, breaking and vibrating the liquid particle suspension to form tiny, uniform particle droplets; the particle droplets then enter the dryer 22, which dries the particle droplets by introducing airflow, removing the moisture from the particle droplets and forming a dry solid particle airflow.

[0038] The dryer 22 is equipped with an atomization interface 221, a gas drying inlet 222, a particle flow outlet 223, and a liquid outlet 224. The atomization interface 221 is connected to the outlet end of the piezoelectric atomization assembly 21, allowing the atomized particle droplets to enter the dryer 22. The gas source regulating assembly 4 is connected to the gas drying inlet 222 and is used to supply gas into the dryer 22, providing an airflow carrier for the drying of the particle droplets. Specifically, the gas source regulating component 4 integrates six functional components: a power button 41, a gas source switch 42, a pressure regulating valve 43, a pressure gauge 44, an electrostatic neutralizer 45, and a precision filter 46. The overall gas routing path is as follows: external gas first passes through the gas source switch 42 to complete the on / off control, and the gas flows through the pressure regulating valve 43 in sequence to achieve gas supply pressure regulation. The pressure gauge 44 displays the pipeline gas pressure in real time. After pressure regulation, the gas passes through the precision filter 46 and the electrostatic neutralizer 45 in sequence to filter out tiny solid impurities in the gas and eliminate static electricity in the airflow. Finally, clean, stable-pressure, and static-free process gas is output and sent into the dryer 22.

[0039] The particle flow outlet 223 is connected to the deposition chamber 31, allowing the dried solid particles to be fed into the deposition chamber 31. The liquid outlet 224 is used to discharge any unatomized liquid that may accumulate in the dryer 22, preventing liquid accumulation from affecting drying and particle transport.

[0040] The number of air source regulating components 4 and atomizing drying components can be set and controlled according to actual needs, and can be configured in a one-to-one, one-to-many, or many-to-many manner. For example, a single air source regulating component 4 can be used to branch out multiple air paths, which are respectively connected to multiple atomizing drying components. The valve body can be used to control the on / off of each path individually, thereby selecting the atomizing unit with the corresponding particle size to work as needed.

[0041] Furthermore, see Figure 2 The dryer 22 is equipped with an electric heating module 23, which is used to heat the airflow inside the dryer 22 to accelerate the flow and drying of the particle airflow and improve the drying efficiency.

[0042] In some embodiments, see Figure 1 , Figure 4The deposition assembly also includes a transport assembly for reciprocatingly transporting the stage assembly 32 between the interior and exterior of the deposition chamber 31.

[0043] The conveying assembly includes a drawer guide rail 33, with a base plate 321 mounted on it. Specifically, the drawer guide rail 33 includes a fixed rail 331, a sliding rail 332, and a drawer door 333. The fixed rail 331 is fixedly installed on the inner wall of the deposition chamber 31, the sliding rail 332 slides in conjunction with the fixed rail 331, and the drawer door 333 is used to cover the side opening 311, ensuring that the deposition operation can be carried out in a sealed environment. The base plate 321 is fixedly installed on the sliding rail 332, and the drawer guide rail 33 can extend into or retract from the deposition chamber 31 through the side opening 311, enabling the smooth pulling and guiding positioning of the stage assembly 32.

[0044] The drawer guide rail 33 can also be driven by a motor, synchronous belt, gear rack or linear module, etc., to drive the sliding rail 332 to move relative to the fixed rail 331, so as to realize the automated conveying of the platform component 32; it can also be understood that the conveying component can also use a built-in robot to directly complete the transportation and positioning of the platform component 32, without any restrictions.

[0045] Further, see Figures 1 to 3 Below the sedimentation chamber 31 is a waste gas treatment device 5, which is used to collect and purify the waste gas containing polystyrene latex microspheres generated during the sedimentation process, to prevent the particles from leaking out and polluting the air and harming human health, and to improve the environmental protection and safety of the equipment.

[0046] The waste gas treatment device 5 includes a waste gas collection hopper 51 and a waste gas treatment tank 54. The waste gas collection hopper 51 is connected to the sedimentation tank 31 and is used to collect waste gas inside the sedimentation tank 31. The top of the waste gas collection hopper 51 is equipped with a filter element 52, which can perform initial filtration and interception of polystyrene latex microsphere solid particles in the waste gas, preventing large-diameter particles from entering subsequent pipelines and causing blockages. The bottom of the waste gas collection hopper 51 is equipped with an exhaust fan 53, which provides suction power for the flow of waste gas.

[0047] The exhaust gas treatment tank 54 is used to hold tap water or other absorbent liquids. The exhaust fan 53 sends the exhaust gas that has undergone primary filtration into the liquid in the exhaust gas treatment tank 54, so that the trace particles remaining in the exhaust gas are fully adsorbed and dissolved by the liquid, achieving secondary deep purification of the exhaust gas. After the dual purification of primary filtration and liquid absorption, the polystyrene latex microsphere particles in the exhaust gas can be completely removed, ensuring that the discharged gas is clean and environmentally friendly. At the same time, the filter component 52 adopts a pull-out and replaceable structure, which is convenient for regular maintenance and replacement.

[0048] Furthermore, see Figure 1 and Figure 2The installation structure 1 includes an interconnected deposition chamber 11, atomization chamber 12, exhaust gas chamber 13, and air supply chamber 14. The overall structure adopts a modular layout with independent zones and vertical connections, making the structure more compact and the space utilization rate higher. At the same time, it achieves physical isolation between the atomization area, deposition area, and exhaust gas treatment area, avoiding mutual interference between the workstations.

[0049] The deposition assembly is located inside the deposition chamber 11, and the atomization chamber 12 is located on the side of the deposition chamber 11 for installing the atomization drying assembly. The exhaust gas chamber 13 is located below the atomization chamber 12 for installing the exhaust gas treatment device 5. The deposition chamber 31 has a top opening, and the top opening is equipped with an openable and closable top cover 312. The air supply chamber 14 is located above the deposition chamber 11 and contains an air supply unit 6, which supplies air to the deposition chamber 31 through the top opening.

[0050] When switching particle sizes after deposition, the top cover 312 is opened. With the suction force of the exhaust gas treatment device 5 below, a stable airflow from top to bottom can be formed in the deposition chamber 31. This enables rapid blowing, replacement and cleaning of residual particles inside the chamber, shortens the cleaning time, avoids cross-contamination of particles of different sizes, and meets the usage requirements for rapid switching of multiple sizes and particle sizes.

[0051] Further, see Figure 4 , Figure 5 The bottom of the cover plate 322 is provided with a sealing rib, and the top of the bottom plate 321 is provided with a corresponding sealing groove 324. The sealing rib and the sealing groove 324 are fitted together to form a sealing fit, thereby improving the sealing performance of the deposition area.

[0052] This application also proposes a deposition method applied to the above-mentioned deposition equipment, including: A measured amount of purified water is added to the PSL particle suspension to prepare a particle suspension of a specified concentration. Specifically, the operators precisely control the number of particles finally deposited on the surface of wafer 8 by adjusting three process parameters: the concentration of the particle suspension, the gas pressure used to dry the particle droplets, and the deposition time. (For example, under the condition that the concentration of the particle suspension and the pressure of the drying gas remain unchanged, 100 PSL particles can be deposited in 1 minute, 205 PSL particles can be deposited in 2 minutes, and so on. By controlling the deposition time, the number of particles deposited on the surface of wafer 8 can be ensured to meet the production requirements.) Suspensions of particles of different sizes are passed into corresponding atomizing and drying components for atomization and drying, forming a dry particle airflow. Select the corresponding adapter plate 323 according to the size of the wafer 8 to be deposited and place it in the adapter placement slot 3212. Place the wafer 8 in the first wafer placement slot 3211 or the second wafer placement slot 3231 and cover it with the cover plate 322. The stage assembly 32 is fed into the deposition chamber 31, and the dry particles are airflowed into the deposition chamber 31, so that the particles fall through the deposition holes 3221 and are deposited on the surface of the wafer 8. After deposition is complete, the stage assembly 32 is removed and the wafer 8 is taken out.

[0053] Furthermore, after deposition is completed, the top cover 312 of the deposition chamber 31 is opened, and the blower unit 6 and the exhaust fan 53 are started to blow and clean the inside of the deposition chamber 31, quickly replacing the air inside the deposition chamber 31 and avoiding cross-contamination caused by residual particles.

[0054] In the description of this specification, references to terms such as "example," "embodiment," or "some embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] Of course, the present invention is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of this application, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A deposition apparatus, characterized in that, include: Installation structure; Multiple sets of atomizing and drying components are installed on the mounting structure. Different sets of atomizing and drying components are used to atomize and dry particle suspensions of different particle sizes. A deposition assembly is installed on the mounting structure. The deposition assembly includes a deposition chamber and a stage assembly. The deposition chamber is connected to the atomizing and drying assembly. The side of the deposition chamber has a side opening that communicates with the outside, allowing the stage assembly to extend into or move out of the deposition chamber. The stage assembly includes a base plate, a cover plate, and several adapter plates. The cover plate covers the top of the base plate. The base plate has a first wafer placement slot and several adapter placement slots connected below the first wafer placement slot. The adapter placement slots are distributed sequentially from top to bottom, with their maximum outer diameter decreasing sequentially. The adapter placement slots are used to place the adapter plates. The adapter plates have second wafer placement slots. The cover plate has deposition holes that communicate with the first wafer placement slot. The base plate is provided with an adsorption placement groove, and the side of the base plate is provided with an operation port that communicates with the adsorption placement groove. The adsorption placement groove is connected to the outside through the operation port. The adsorption placement groove is used to place a wafer adsorption tool. The top of the adsorption placement groove is connected to the bottommost adapter placement groove. The adapter plate is provided with a through hole in the vertical direction at the bottom of the second wafer placement groove.

2. The deposition apparatus according to claim 1, characterized in that, It also includes a gas source regulating component. The atomizing and drying component includes a piezoelectric atomizing component and a dryer. The piezoelectric atomizing component is used to atomize the particle suspension. The dryer is provided with an atomizing interface, a gas drying inlet, a particle flow outlet, and a liquid flow outlet. The atomizing interface is connected to the outlet end of the piezoelectric atomizing component. The gas source regulating component is connected to the gas drying inlet to supply gas to the dryer. The particle flow outlet is connected to the deposition chamber.

3. The deposition apparatus according to claim 2, characterized in that, The dryer is equipped with an electric heating module, which is used to heat the airflow inside the dryer.

4. The deposition apparatus according to claim 1, characterized in that, The deposition assembly further includes a conveying assembly for reciprocatingly conveying the stage assembly between the inner cavity and the outer side of the deposition chamber. The conveying assembly includes a drawer rail, the base plate is mounted on the drawer rail, and the drawer rail extends into or out of the deposition chamber through the side opening.

5. The deposition apparatus according to claim 1, characterized in that, Below the sedimentation tank is a waste gas treatment device, which includes a waste gas collection hopper connected to the sedimentation tank and a waste gas treatment tank located below the waste gas collection hopper. The top of the waste gas collection hopper is equipped with a filter component, and the bottom of the waste gas collection hopper is equipped with an exhaust fan. The waste gas treatment tank is used to hold liquid, and the exhaust fan is used to send waste gas into the liquid in the waste gas treatment tank.

6. The deposition apparatus according to claim 5, characterized in that, The installation structure includes an installation box, which has interconnected deposition chamber, atomization chamber, exhaust gas chamber, and air supply chamber. The deposition assembly is located in the deposition chamber. The atomization chamber is located on the side of the deposition chamber and is used to install the atomization drying assembly. The exhaust gas chamber is located below the atomization chamber and is used to install the exhaust gas treatment device. The deposition box has a top opening and an openable top cover at the top opening. The air supply chamber is located above the deposition chamber and has an air supply unit. The air supply unit is used to supply air to the deposition box through the top opening.

7. The deposition apparatus according to claim 1, characterized in that, The bottom of the cover plate is provided with a sealing rib, and the top of the base plate is provided with a corresponding sealing groove. The sealing rib and the sealing groove are fitted together to form a sealing fit.

8. A deposition method, applied to the deposition apparatus according to any one of claims 1-7, characterized in that, include: Suspensions of particles of different sizes are passed into corresponding atomizing and drying components for atomization and drying, forming a dry particle airflow. According to the size of the wafer to be deposited, select the corresponding adapter plate and place it in the adapter placement slot. Place the wafer in the first wafer placement slot or the second wafer placement slot and cover it with the cover plate. The stage assembly is fed into the deposition chamber, and the dry particles are air-flowed into the deposition chamber, so that the particles fall through the deposition holes of the cover plate and are deposited on the wafer surface. After deposition is complete, the stage assembly is removed and the wafer is taken out.

9. The deposition method according to claim 8, characterized in that, After deposition is complete, open the top cover of the deposition chamber and start the air supply and exhaust units to purge and clean the inside of the deposition chamber with airflow.

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