Monitoring system and electronic device

Abstract

The application discloses a kind of monitoring system and electronic equipment, it is related to computer technical field, including cabinet, first sensor, second sensor and computing device;First sensor is used to generate first sensing data according to whether the equipment to be measured and first sensor contact;Second sensor is used to generate second sensing data according to the distance between the equipment to be measured and second sensor;Computing device is used to extract steady-state information from first sensing data, steady-state information characterizes the contact stability of the equipment to be measured and first sensor;Extract dynamic information from second sensing data, dynamic information characterizes the distance change between the equipment to be measured and second sensor in the process of entering the position;According to steady-state information and dynamic information, determine the in-place state of the equipment to be measured in position.The dual verification of pre-perception and actual contact detection is formed by comprehensively considering steady-state information and dynamic information, the in-place state of the equipment to be measured can be more accurately judged, and false positives are reduced.

Description

Technical Field

[0001] This application relates to the field of computer technology, and in particular to monitoring systems and electronic devices. Background Technology

[0002] Server rack units (U-bays) are the core spatial units for modern data center IT (Information Technology) equipment deployment, with the industry standard being 1U = 44.45mm. With the rapid development of cloud computing, big data, and AI (Artificial Intelligence) services, data centers are characterized by high-density deployment, rapid equipment iteration, and an exponential increase in operational complexity. Traditional U-bay management relies on manual operation, which presents challenges such as difficulty in optimizing space utilization and complex and cumbersome asset statistics, becoming a bottleneck restricting the improvement of operational efficiency and resource utilization. Summary of the Invention

[0003] This application provides a monitoring system, comprising: a cabinet including at least one compartment for accommodating a device under test (DUT); a first sensor installed on one side of the compartment for generating first sensing data based on whether the DUT is in contact with the first sensor; a second sensor installed on the other side of the compartment for generating second sensing data based on the distance between the DUT and the second sensor; and a computing device connected to the first and second sensors, the computing device being configured to: extract steady-state information from the first sensing data, the steady-state information characterizing the contact stability between the DUT and the first sensor; extract dynamic information from the second sensing data, the dynamic information characterizing the change in distance between the DUT and the second sensor during the process of entering the compartment; and determine the in-situ status of the DUT in the compartment based on the steady-state information and the dynamic information.

[0004] This application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for executing the computer program to: acquire first sensing data from a first sensor installed on one side of the compartment, and acquire second sensing data from a second sensor installed on the other side of the compartment; extract steady-state information from the first sensing data, the steady-state information characterizing the contact stability between the device under test and the first sensor; extract dynamic information from the second sensing data, the dynamic information characterizing the distance change between the device under test and the second sensor during the process of entering the compartment; and determine the in-situ state of the device under test in the compartment based on the steady-state information and the dynamic information.

[0005] By using a second sensor to anticipate the actions of the device under test (DUT) before it comes into contact with the first sensor, and outputting second sensing data containing dynamic information characterizing the actions, proactive monitoring of actions can be achieved, providing reliable data for coordinated control. Conversely, by using the first sensor to sense the contact state between the DUT and the first sensor, and outputting first sensing data containing steady-state information indicating whether contact has occurred, accurate sensing of the actual contact state between the DUT and the first sensor can be achieved. Compared to manual operation or relying solely on a probe switch output signal of 0 or 1 to determine presence, this method comprehensively considers both steady-state and dynamic information, forming a dual verification of pre-sensing and actual contact detection. This enables more accurate determination of the DUT's presence status, reduces misjudgments, improves space utilization, and simplifies the tedious process of asset statistics. Attached Figure Description

[0006] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0007] Figure 1 This is a schematic diagram of a monitoring system according to an embodiment of this application.

[0008] Figure 2 This is a schematic diagram of a monitoring system according to an embodiment of this application.

[0009] Figure 3 This is a schematic diagram illustrating the operations performed by a computing device according to an embodiment of this application.

[0010] Figure 4 This is a schematic diagram of sensor signal acquisition and complementary filtering fusion processing according to an embodiment of this application.

[0011] Figure 5 This is a schematic diagram of a fusion detection algorithm based on a capacitive sensor and a probe switch according to another embodiment of this application.

[0012] Figure 6 This is a flowchart of the complementary filtering fusion algorithm according to an embodiment of this application.

[0013] Figure 7 This is a schematic diagram of a monitoring system according to another embodiment of this application.

[0014] Figure 8 This is a top view of a compartment in a cabinet according to an embodiment of this application.

[0015] Figure 9 This is a top view of a compartment in a cabinet according to another embodiment of this application.

[0016] Figure 10 This is a front view of a compartment in a cabinet according to another embodiment of this application.

[0017] Figure 11 This is a rear view of a bay in a cabinet according to another embodiment of this application.

[0018] Figure 12 This is a top view of a compartment in a cabinet according to another embodiment of this application.

[0019] Figure 13 This is a schematic diagram of a monitoring system according to another embodiment of this application.

[0020] Figure 14 This is a flowchart illustrating the operation of a computer program according to an embodiment of this application.

[0021] Figure 15 This is a structural block diagram of an apparatus for executing a computer program according to an embodiment of the present application.

[0022] Figure 16 This is a block diagram of an electronic device suitable for executing computer programs according to embodiments of the present disclosure. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0024] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0025] Against the backdrop of data centers transforming towards high density, intelligence, and greenness, traditional U-space management methods have become a bottleneck for operational efficiency and resource utilization.

[0026] In some related technologies, the single-probe switch solution involves adding a probe switch at the rear of the server rack for U-position detection. This single-probe switch solution can only output on / off signals and cannot detect the dynamic process of server insertion / removal. It can only determine whether the server is fully inserted or not, failing to identify intermediate states such as near insertion or partial insertion. It lacks the ability to predict these states in advance and can only respond after the server is fully inserted, making it difficult to perform pre-operations such as indicator light pre-illumination and configuration pre-loading.

[0027] Meanwhile, the single-probe switch solution has a potential for false-position issues: due to factors such as guide rail deformation or obstruction by foreign objects, the server may not be properly plugged in, but the probe switch may still be active, causing the system to misjudge the server as in place. This can lead to abnormal power and data connector connections, resulting in server recognition failures or intermittent malfunctions. Troubleshooting these types of faults is difficult; maintenance personnel can only manually check each unit, which is not only inefficient but also makes it impossible to accurately pinpoint the root cause of the problem, distinguishing between specific reasons such as improper plugging, misaligned insertion, or connector damage.

[0028] Furthermore, the single probe switch solution can only provide 0 / 1 digital signals and cannot collect operational data such as insertion and removal speed and insertion depth. It does not support intelligent operation and maintenance, nor can it predict potential problems such as guide rail wear, probe aging, and connector lifespan reduction.

[0029] This application proposes a monitoring system and electronic device that uses a combination of a first sensor and a second sensor to replace the manual rack U-position management method. This not only solves the pain points of manual management, but also provides core data support for the refined operation and intelligent transformation of data centers, thereby enhancing the competitiveness of data centers and reducing operating costs.

[0030] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Figure 1 This is a schematic diagram of a monitoring system according to an embodiment of this application.

[0032] like Figure 1 As shown, the monitoring system includes a cabinet 1, a first sensor 2, a second sensor 3, and a computing device 4.

[0033] The cabinet 1 includes at least one compartment 11, which can be used to accommodate a device under test (DUT) 50. A first sensor 2 is installed on one side of the compartment 11 and generates first sensing data based on whether the DUT 50 is in contact with the first sensor 2. A second sensor 3 is installed on the other side of the compartment 11 and generates second sensing data based on the distance between the DUT 50 and the second sensor 3. A computing device 4 is connected to the first sensor 2 and the second sensor 3. The computing device 4 can extract steady-state information from the first sensing data and dynamic information from the second sensing data. The steady-state information characterizes the contact stability between the DUT 50 and the first sensor 2, and the dynamic information characterizes the change in distance between the DUT 50 and the second sensor 3 during the process of entering the compartment. The computing device 4 can determine the in-situ status of the DUT 50 in the compartment 11 based on the steady-state information and the dynamic information.

[0034] In some embodiments, the compartment has a first side, a second side, a third side, and a fourth side, wherein the first and second sides are disposed opposite each other along a first direction, and the third and fourth sides are disposed opposite each other along a second direction. The compartment is configured to allow a device under test (DUT) to be inserted from the first side to the second side along the first direction. For example, such as... Figure 1 As shown, the cabinet 1 may include multiple vertically arranged uprights and multiple horizontally arranged crossbars, which define multiple compartments 11 stacked longitudinally. Figure 1 In the example, compartment 11 has a hexahedral structure, and each compartment 11 is defined by four columns and eight crossbars located on two adjacent layers. For ease of description, the first side is also referred to as the front side, the second side as the rear side, the third side as the left side, and the fourth side as the right side.

[0035] In some embodiments, such as Figure 1 As shown, the first sensor 2 can be positioned on the second side (rear side) of the compartment 11, placing it at the end of the movement path of the device under test 50 to determine whether the device under test 50 is inserted into the compartment 11. The second sensor 3 can be positioned on the third and / or fourth side (left and / or right side) of the compartment 11, placing it halfway along the movement path of the device under test 50 to sense changes in the movement distance of the device under test 50 during insertion into the compartment 11.

[0036] According to an embodiment of this application, the first sensor 2 may be a limit sensor, which is configured to generate a first sensing value based on whether the device under test is in contact with a probe in the limit sensor. The probe in the limit sensor can provide steady-state confirmation after the server enters the compartment and is in position. For example, after the server is fully inserted into the compartment, the probe switch in the limit sensor closes, and the output value is 1; otherwise, the output value is 0.

[0037] According to an embodiment of this application, the second sensor 3 can be a capacitive sensor, configured to sense the capacitance value of the capacitance formed between the device under test and the sensing surface of the capacitive sensor, as a second sense value. The capacitive sensor can capture dynamic changes during the server insertion process. The capacitive sensor can operate based on the principle of a parallel-plate capacitor. The device under test can be a server, with its sidewalls made of metal. When the sidewall of the server passes parallel to the sensing surface of the capacitive sensor, the vertical distance between the sidewall of the server and the sensing surface of the capacitive sensor is fixed, and the capacitance only changes with the overlapping area of ​​the two.

[0038] The combination of limit sensors and capacitive sensors can solve the "black box" problem of single probes, providing a more intelligent, reliable, and efficient U-position detection capability.

[0039] According to embodiments of this application, by using a second sensor to sense the action of the device under test (DUT) before it comes into contact with the first sensor, and outputting second sensing data containing dynamic information characterizing the action, advance monitoring of the action can be achieved, providing reliable data for linkage control. By using the first sensor to sense the contact state between the DUT and the first sensor, and outputting first sensing data containing steady-state information characterizing whether contact has occurred, accurate sensing of the actual contact state between the DUT and the first sensor can be achieved. Compared to manual operation or judging presence solely based on the probe switch output signal being 0 or 1, this method comprehensively considers both steady-state and dynamic information, forming a dual verification of pre-sensing and actual contact detection, enabling more accurate judgment of the DUT's presence state and reducing misjudgments.

[0040] Figure 2 This is a schematic diagram of a monitoring system according to an embodiment of this application.

[0041] like Figure 2 As shown, in one example, a first support column A can be set at the rear window of the cabinet, and a second support column B can be set at the side of the cabinet. The first sensor 2 can be installed on the first support column A directly behind the compartment 11, and the second sensor 3 can be installed on the second support column B on the left side of the compartment 11.

[0042] According to embodiments of this application, the device under test can be a server, and the computing device can be a monitoring host.

[0043] According to an embodiment of this application, a computing device can extract first sensing values ​​at multiple times from first sensing data, and perform low-pass filtering on the first sensing values ​​at multiple times to obtain a first component as steady-state information, wherein the first sensing value indicates that the device under test is in contact with the first sensor, and the first sensing value indicates that the device under test is not in contact with the first sensor; extract second sensing values ​​at multiple times from second sensing data, and perform high-pass filtering on the second sensing values ​​at multiple times to obtain a second component as dynamic information, wherein the second sensing value indicates the distance between the device under test and the second sensor; fuse the first component and the second component to obtain a fused value; and determine the in-situ state of the device under test in the storage compartment by comparing the fused value with a preset threshold.

[0044] Figure 3 This is a schematic diagram illustrating the operations performed by a computing device according to an embodiment of this application.

[0045] like Figure 3 As shown, the operations performed by the computing device include operations S310 to S360.

[0046] In operation S310, first sensing values ​​at multiple moments are extracted from the first sensing data. In one example, the first value can be 1, and the second value can be 0. A first sensing value of 1 indicates that the device under test (DUT) is in contact with the first sensor, and a first sensing value of 0 indicates that the DUT is not in contact with the first sensor. For example, if the first sensor is a limit sensor (such as a probe switch), if the probe is in contact with the DUT, the probe switch closes and the output value is 1; otherwise, the output value is 0.

[0047] During operation of S320, the first sensed values ​​at multiple time points are low-pass filtered to obtain the first component as steady-state information. The output of the limit sensor may be affected by high-frequency noise such as mechanical bounce and electromagnetic interference. By low-pass filtering the first sensed value output by the limit sensor, interference can be filtered out.

[0048] In operation S330, second sensing values ​​at multiple moments are extracted from the second sensing data. For example, if the second sensor is a capacitive sensor, the second sensing value can be the capacitance value formed between the device under test (DUT) and the sensing plane of the capacitive sensor. As the DUT is inserted into the compartment, the distance between the DUT and the capacitive sensor gradually decreases. When the housing of the DUT overlaps with the sensing plane of the capacitive sensor, a coupling capacitance is generated. As the DUT is further inserted into the compartment, the overlap area between the housing and the sensing plane increases, and the coupling capacitance gradually increases until the DUT and the sensing plane completely overlap. Thereafter, the DUT moves further, the overlap area remains unchanged, and therefore the coupling capacitance also remains unchanged. This change in coupling capacitance reflects the change in distance between the DUT and the capacitive sensor during the insertion process, thus allowing the extraction of dynamic information about the DUT during the insertion process.

[0049] In operation S340, the second sensing values ​​at multiple times are high-pass filtered to obtain the second component as dynamic information. For example, the coupling capacitance generated by the insertion action of the device under test may be affected by some low-frequency interference from ambient temperature, humidity, and dust. By high-pass filtering the second sensing value output by the capacitance sensor, the interference can be filtered out.

[0050] In operation S350, the first and second components are fused to obtain a fused value. For example, the first and second components can be summed to obtain the fused value.

[0051] When operating the S360, the presence status of the device under test in the compartment is determined by comparing the fusion value with a preset threshold.

[0052] For example, the computing device can determine the in-place state as follows: the device under test is fully inserted into the bin when the first component is greater than a first threshold; the in-place state as follows when the fusion value is greater than a second threshold; the in-place state as follows when the fusion value is between the second and third thresholds; the in-place state as follows: the device under test has begun to insert into the bin when the fusion value is less than a third threshold; and the in-place state as follows: the device under test is not in the bin when the fusion value is less than a third threshold.

[0053] According to an embodiment of this application, multiple first sensing values ​​at different times are extracted from the first sensing data output by the first sensor, low-pass filtering is performed to extract the slow-changing parts, and steady-state information is obtained. Multiple second sensing values ​​at different times are extracted from the second sensing data output by the second sensor, high-pass filtering is performed to extract the fast-changing parts, and dynamic information is obtained. By combining the steady-state information and the dynamic information, the in-situ status of the device under test in the warehouse is determined.

[0054] Figure 4 This is a schematic diagram of sensor signal acquisition and complementary filtering fusion processing according to an embodiment of this application.

[0055] like Figure 4 As shown, in operation S401, the output of the capacitance sensor is received. The voltage signal (0V-3.3V) indicates that the second sensing data output by the second sensor is a voltage value of 0V-3.3V. In operation S402, the probe switch outputs. The digital signal (0 / 1 level) indicates that the first sensing data output by the probe switch in the limit sensor can be at a 0 / 1 level. In operation S403, capacitance signal processing is performed. Capacitance signal processing refers to processing the voltage signal output by the capacitance sensor, such as high-speed sampling and high-pass filtering, to extract the "dynamic change" feature. The "dynamic change" feature represents dynamic information. In operation S404, probe signal processing is performed. Probe signal processing refers to processing the digital signal output by the probe switch, such as low-pass filtering and delayed confirmation, to obtain the "steady-state reference" state. The "steady-state reference" state represents steady-state information. In operation S405, fusion is performed. Fusion refers to the complementary filtering fusion algorithm of this embodiment, which fuses the capacitance dynamic information and the probe steady-state information through a dynamic estimation model. The capacitance dynamic information represents the dynamic information obtained from the capacitance sensor, while the probe steady-state information represents the steady-state information obtained from the probe switch.

[0056] In operation S406, the state decision logic is executed. The computing device can make state decisions based on the results of the core fusion algorithm, such as threshold judgment / state machine transition. In operation S407, the final state and events are output. The final state represents the rack's U-position status, such as no node / approaching / in place, and the events represent server plug-in / plug-out events, such as counts and timestamps.

[0057] In one example, the monitoring system may also include a host computer. When operating S408, the final status and events are reported to the host computer. The host computer can then display, record, and store the data.

[0058] Figure 5 This is a schematic diagram of a fusion detection algorithm based on a capacitive sensor and a probe switch according to another embodiment of this application.

[0059] like Figure 5As shown, the fusion detection algorithm based on capacitive sensors and probe switches is divided into two parallel processing branches on the left. The upper branch extracts the dynamic components of the capacitive sensor, separating the dynamic signal representing insertion or removal actions through high-pass filtering. The lower branch extracts the steady-state components of the probe switch, obtaining a stable contact reference through software debouncing and low-pass filtering. The middle part complementarily fuses the dynamic and steady-state components to obtain a comprehensive fusion estimate F. Finally, on the right, a hierarchical threshold judgment logic is used to classify the system state into four levels based on the fusion estimate F and the probe low-pass component P_low: fully inserted, partially inserted, approaching, and no node state, thereby achieving accurate judgment of the server insertion state.

[0060] The first layer is the first layer of the fusion detection algorithm, namely the original signal input layer.

[0061] The raw signal input layer is used for data acquisition. In operation S501, it receives the raw signal from the probe switch, which is a discrete digital signal. In operation S502, it receives the raw signal from the capacitance sensor, which is a continuous analog signal. The computing device can simultaneously receive the continuous analog signal from the capacitance sensor and the discrete digital signal from the probe switch.

[0062] The second layer of the fusion detection algorithm is the preprocessing layer. The preprocessing layer can perform operations such as denoising on the original signal.

[0063] When operating the S504, the raw signal from the capacitive sensor is preprocessed. For example, a moving average filter is applied to smooth the signal, preserving the true distance change trend. High-pass filtering removes high-frequency electromagnetic interference and random noise, eliminating high-frequency spikes. In one example, the average of the three most recent samples can be used.

[0064] The raw signal of the probe switch can be a digital quantity represented by 0 / 1. During operation of S503, the raw signal of the probe switch is preprocessed, such as by software debouncing, for example, by continuous sampling and confirmation, and only confirming a 1 after multiple consecutive high-level readings, in order to suppress mechanical jitter and convert unstable 0 / 1 transitions into definite and clean logic signals, avoiding misjudgments due to brief poor contact.

[0065] The preprocessing layer can lay a solid foundation for subsequent precise processing.

[0066] The fourth layer of the fusion detection algorithm is the component extraction layer. The component extraction layer separates the continuous analog signal from the capacitive sensor and the discrete digital signal from the probe switch based on their different characteristics.

[0067] In operation S506, dynamic components are extracted from the pre-processed raw signal of the capacitive sensor. The raw signal of the capacitive sensor can characterize the instantaneous action of the server inserting or removing a bay. The low-pass component is calculated by estimating the static baseline of the raw signal of the capacitive sensor using a high-pass filter. Subtracting the static baseline from the raw signal yields the "dynamic component" reflecting the dynamic event. This effectively filters out the slow drift caused by ambient temperature and humidity, leaving only the rapidly changing portion representing the server's movement (insertion or removal of a bay).

[0068] In operation of S505, the steady-state component is extracted from the preprocessed raw signal of the probe switch. The raw signal of the probe switch can characterize whether the server is continuously in contact with the probe switch. The raw signal of the probe switch is converted into a floating-point quantity and smoothed and delayed by a low-pass filter with first-order hysteresis filtering. A smooth and stable "steady-state component" can be calculated, representing a reliable but slowly changing physical contact reference. When the server is in stable contact with the probe switch, the steady-state component will approach 1.0.

[0069] The filter coefficient α is the filter coefficient for both low-pass and high-pass filters. α is a positive number much less than 1, such as 0.05, and can adjust the smoothness and response speed of the filter.

[0070] The fourth layer of the fusion detection algorithm is the complementary fusion layer.

[0071] The complementary fusion layer combines dynamic and steady-state components, directly adding the dynamic component of the capacitor (representing the "action") to the steady-state component of the probe (representing the "reference"). In operation S507, complementary fusion calculations are performed, and the fused estimate is the sum of the dynamic and steady-state components. The dynamic component quickly reflects insertion or withdrawal actions, while the steady-state component ensures high reliability during stable contact. Fusion yields a sensitive and stable comprehensive state estimate. When the server is stationary, the dynamic component is approximately zero, and the output of the complementary fusion layer is entirely determined by the steady-state component, locking the system state. When the server moves, the dynamic component changes rapidly, and even if the steady-state component (probe) has not yet changed, the output of the complementary fusion layer sensitively reflects the depth change. Specifically, when the server is locked in position, the dynamic component returns to zero, the steady-state component reaches 1, and the output of the complementary fusion layer stabilizes at 1.

[0072] The fifth layer of the fusion detection algorithm is the state decision layer.

[0073] In operation S508, the state decision layer can determine the state based on hierarchical thresholds. For example, in operation S509, if the steady-state component is very high, such as greater than 0.99, the state is determined as complete insertion, i.e., the probe is in stable contact; in operation S510, if the fused estimate is greater than a partial threshold, the state is determined as partial insertion, i.e., the capacitance depth is sufficient; in operation S511, if the fused estimate F is greater than the approach threshold, the state is determined as approaching, i.e., the capacitance is in initial response; otherwise, in operation S512, the state is determined as no node. The hierarchical thresholds can be repeatedly calibrated in real-world scenarios through test nodes to match actual mechanical travel.

[0074] The complementary filtering fusion algorithm based on capacitive sensors and probe switches in this application embodiment combines the advantages of two different sensors through a clear hierarchical design. It not only has fast dynamic response capability but also high steady-state reliability. At the same time, through an effective preprocessing layer and component extraction layer, the robustness of the system in complex environments can be improved. The state decision layer also enables the system to adapt to a wider range of application scenarios.

[0075] The monitoring system of this application embodiment achieves accurate perception of four states through the setting of the first and second sensors and the complementary filtering fusion algorithm of the computing device. It can distinguish between no node, approaching, partial insertion, and complete insertion, and is suitable for refined management and automated processes, such as pre-loading configuration. It can respond faster and provide early warning. The second sensor can detect the approaching action before physical contact, and the system can prepare in advance, such as by illuminating an indicator light.

[0076] The monitoring system in this application embodiment employs a complementary filtering scheme combining probe switches and capacitive sensors. It utilizes capacitance to detect approach movements in advance, and combines this with probes to accurately determine the insertion status, achieving four-stage detection (no node / approaching / partial insertion / complete insertion). It avoids false alarms, supports pre-loaded configurations, and records data such as insertion / removal speeds, enabling intelligent diagnostics (e.g., identifying jams and predicting guide rail wear). This improves reliability and operational efficiency, making it an ideal choice for demanding environments such as data centers.

[0077] According to embodiments of this application, the filter coefficients of the low-pass filter and the high-pass filter are adjustable in the range of 0.02-0.05.

[0078] The fusion detection algorithm is executed by a computing device. The filter coefficient α can be tuned to the fusion detection algorithm. A smaller filter coefficient α, such as 0.02-0.05, can provide a stronger smoothing effect and excellent anti-jitter capability for discrete digital signals from probe switches, but slightly increases the delay in state confirmation; it can also provide a lower low-pass filter cutoff frequency for continuous analog signals from capacitive sensors, filtering out slower drifts and preserving relatively smooth dynamic changes.

[0079] The filtering coefficient α can be adjusted by combining data visualization with the host computer. For example, adjusting the filtering coefficient α from 0.05 to 0.1 makes the system respond faster to changes in the probe's state, but may be more susceptible to probe jitter interference. Adjusting the filtering coefficient α from 0.05 to 0.02 makes the system baseline more stable and more resistant to probe jitter. After the server stably inserts the warehouse position, the fused estimate F can converge smoothly and quickly to 1.0 without obvious overshoot or oscillation.

[0080] Compared to determining whether the device under test is fully inserted into the compartment using a single probe switch, the monitoring system of this application embodiment not only makes the monitoring results of whether the device under test is fully inserted into the compartment more accurate, but also provides more diverse detection results in addition to yes and no.

[0081] Figure 6 This is a flowchart of the complementary filtering fusion algorithm according to an embodiment of this application.

[0082] like Figure 6 As shown in the example, the filter coefficients for both the low-pass and high-pass filters are 0.05.

[0083] In operation S601, the first sensed value P[n] is acquired. For example, the most recent sampled value of the original signal from the probe switch can be used as the current first sensed value P[n]; alternatively, the consistency of the most recent three sampled values ​​of the probe signal can be detected, and if they are consistent, that sampled value is used as the current first sensed value P[n]. For ease of description, the currently acquired first sensed value P[n] is referred to as the first sensed value at time n, and the previously acquired first sensed value P[n-1] is referred to as the first sensed value at time n-1. The discrete digital signal from the probe switch has only two states, 0 and 1. The first sensed value P[n] can be converted into a floating-point value. A floating-point value of 0.0 indicates that the probe switch is open, and a floating-point value of 1.0 indicates that the probe switch is closed.

[0084] In operation S602, steady-state components are extracted from the first sense values ​​at multiple times according to the following equation (1):

[0085] P_low[n] = P_low [n-1] + α×(P [n] - P_low [n-1]) (1)

[0086] P_low[n] represents the steady-state component at time n, and P_low[n-1] represents the steady-state component at time n-1. The filter coefficient α can be in the range of 0.02-0.05, for example, 0.05. The initial value of the steady-state component P_low[0] can be 0.

[0087] As can be seen from equation (1), the extraction of steady-state components is based on first-order low-pass filtering. The calculation of the steady-state component P_low[n] at the current moment depends on the first sensing value at the current moment and the first sensing value at the previous moment.

[0088] In operation S603, a second sensing value C[n] is acquired. For example, the current sampled value of the original signal from the capacitive sensor can be used as the current second sensing value C[n], or the average of the three most recent sampled values ​​of the capacitive signal can be used as the current second sensing value C[n]. For ease of description, the currently acquired second sensing value C[n] will be referred to as the first sensing value at time n, and the previously acquired second sensing value C[n-1] will be referred to as the first sensing value at time n-1.

[0089] In operation S604, the low-pass component is extracted from the second sensing value at multiple times according to the following equation (2).

[0090] C_low[n] = C_low [n-1] + α×(C [n] - C_low [n-1]) (2)

[0091] C_low[n] represents the low-pass component at time n, and C_low[n-1] represents the low-pass component at time n-1. The filter coefficient α can be in the range of 0.02-0.05, for example, 0.05. The initial value of the low-pass component C_low[0] can be 0.

[0092] In operation S605, dynamic components are extracted according to the following equation (3).

[0093] C_high[n] = C[n] - C_low[n] (3)

[0094] C_high[n] represents the dynamic component at time n.

[0095] In operation S606, the fusion amount is calculated according to the following equation (4).

[0096] F[n]=P_low[n]+C_high[n] (4)

[0097] F[n] represents the fusion amount at time n.

[0098] In operation S607, determine whether P_low[n] is greater than the first threshold. If P_low[n] is greater than the first threshold, execute operation S608. If P_low[n] is less than or equal to the first threshold, execute operation S609. The first threshold can be 0.95 or 0.99.

[0099] When operating S608, the output status is: the device under test is fully inserted into the compartment.

[0100] In operation S609, determine whether F[n] is greater than the second threshold. If F[n] is greater than the second threshold, execute operation S610. If F[n] is less than or equal to the second threshold, execute operation S611. The second threshold can be 0.7.

[0101] When operating S610, the output status is: the device under test is partially inserted into the compartment.

[0102] In operation S611, determine whether F[n] is greater than the third threshold. If F[n] is greater than the third threshold, execute operation S612. If F[n] is less than or equal to the third threshold, execute operation S613. The third threshold can be 0.2.

[0103] When operating S612, the output status is: The device under test has started inserting into the storage compartment.

[0104] When operating S613, the output status is: The device under test is not in the warehouse.

[0105] Figure 7 This is a schematic diagram of a monitoring system according to another embodiment of this application.

[0106] like Figure 7 As shown, the monitoring system includes a computing device, a first sensor, and a second sensor, and may also include a host computer 6. The computing device can be a monitoring host 411, which is connected to the host computer 6 and can report the location status of the device under test in the storage area to the host computer 6. The first sensor can be a limit sensor 21, and the second sensor is a capacitive sensor 31. The output of the limit sensor 21 and the capacitive sensor 31 are connected to the monitoring host 411.

[0107] like Figure 7 As shown, the limit sensor 21 may include a probe switch 211 and a first filter 212. The probe switch 211 may be a probe-type switch. The first filter 212 may include a first resistor R1 and a first capacitor C1, and the first filter 212 is a first-order RC low-pass filter. The first end of the first resistor R1 is connected to the probe switch 211, and the second end of the first resistor R1 is connected to the output terminal of the limit sensor 21. The first end of the first capacitor C1 is connected to the second end of the first resistor R1, and the second end of the first capacitor C1 is grounded.

[0108] The first capacitor C1 has low impedance to high-frequency signals, which can bypass high-frequency noise to ground. The first capacitor C1 has high impedance to low-frequency or DC signals, which can pass through smoothly. When the probe switch 211 senses contact between the device under test and the first sensor, the closing of the probe switch 211 generates a stable DC level signal (low-frequency signal). This DC level signal passes through a low-pass filter composed of the first resistor R1 and the first capacitor C1, and can be output to the monitoring host 411. The monitoring host 411 can then confirm that the device under test is fully inserted into the compartment.

[0109] The limit sensor 21 can confirm steady-state positioning through the first filter 212. The mechanical bounce of the probe switch 211, such as multiple on / off cycles during the moment of switch closure, or electromagnetic interference such as high-frequency spikes, are all high-frequency noise. The high-frequency noise is absorbed to ground by the first capacitor C1, thus filtering out high-frequency noise interference and avoiding misjudgment of the position status of the device under test in the compartment.

[0110] like Figure 7 As shown, the capacitance sensor 31 may include a capacitance sensing device 311, a second filter 312, and an analog-to-digital converter (ADC). The capacitance sensing device 311 is a variable capacitor. The second filter 312 may include a second resistor R2 and a second capacitor C2, and the second filter 312 is a first-order RC high-pass filter. The first terminal of the second capacitor C2 is connected to the capacitance sensing device 311, the second terminal of the second capacitor C2 is connected to the input terminal of the ADC, the first terminal of the second resistor R2 is connected to the second terminal of the second capacitor C2, the second terminal of the second resistor R2 is grounded, and the output terminal of the ADC is the output terminal of the capacitance sensor 31.

[0111] The second capacitor C2 has a lower impedance to high-frequency signals; for example, the capacitance of the second capacitor C2 is... The capacitive reactance of the second capacitor C2 The frequency of the input signal The higher the capacitance, the lower the impedance, but the higher the impedance to low-frequency or DC signals. The capacitive sensing device 311 senses the server entering the bay. The capacitive sensing device 311 detects the rapidly changing capacitance value, which corresponds to a high-frequency signal. The high-frequency signal can pass smoothly through the second capacitor C2, and after being divided by the second resistor R2, it is output to the analog-to-digital converter (ADC). The ADC can perform analog-to-digital conversion on the high-frequency signal to form the second sensing data, which is then output to the monitoring host 411. The monitoring host 411 can confirm the dynamic changes in the insertion of the device under test into the bay.

[0112] The capacitive sensor 31 can achieve dynamic process detection through the second filter 312. Environmental factors such as capacitance drift and DC bias caused by slow changes in temperature and humidity are low-frequency interference signals or DC interference signals. The second capacitor C2 can block low-frequency interference signals or DC interference signals, preventing them from passing through and thus filtering out interference. This can avoid misjudging the insertion action of the device under test in the compartment.

[0113] According to embodiments of this application, the capacitance signal of a capacitive sensor captures rapid changes to detect server insertion and removal actions. The probe signal of a limit sensor confirms whether the server has completed full physical insertion. By filtering and separating the fast and slow components of the signal, interference from environmental noise and misjudgments due to improper operation can be effectively avoided. A fusion detection algorithm from a computing device is used to determine the server's U-position detection status. Combining the fast response of the capacitive sensor and the reliable confirmation of the limit sensor, complementary filtering achieves more accurate U-position detection.

[0114] like Figure 7 As shown, the device under test can be server 52, and the monitoring system can also include a high-temperature enclosure 53. The host computer 6 can first control the high-temperature enclosure 53 to work based on the insertion action of server 52 in the compartment; and then power on server 52 based on the fully inserted state of server 52 in the compartment.

[0115] According to an embodiment of this application, the compartment has a first side, a second side, a third side, and a fourth side, wherein the first side and the second side are arranged opposite to each other along a first direction, and the third side and the fourth side are arranged opposite to each other along a second direction. The compartment is configured to allow the device under test to be inserted from the first side to the second side along the first direction. A first sensor is disposed on the second side of the compartment, and a second sensor is disposed on the third side and / or the fourth side of the compartment.

[0116] Figure 8 This is a top view of a compartment in a cabinet according to an embodiment of this application.

[0117] like Figure 8 As shown, compartment 11 has a first side, a second side, a third side, and a fourth side. The device under test 50 is inserted from the first side to the second side along a first direction. The first sensor 2 is located on the second side of compartment 11, i.e., at the rear of the cabinet. The second sensor 3 is located on the third side of compartment 11.

[0118] According to an embodiment of this application, a limit sensor is installed at the end of the path through which the device under test is inserted from the first side to the second side along the first direction. This helps to determine whether the device under test has been inserted to the end point behind the compartment. A second sensor is installed on the side of the insertion path to sense the distance. This helps to determine the distance change during the insertion of the device under test into the compartment.

[0119] According to an embodiment of this application, the cabinet further includes a first column disposed on the second side of the bay, and a second column disposed on at least one of the third and fourth sides; a first sensor is disposed on the first column; and a second sensor is disposed on the second column.

[0120] like Figure 8 As shown, in one example, the cabinet has a first column 12 on the second side of the compartment 11, and a first sensor 2 is mounted on the first column 12. The cabinet has a second column 13 on the third side of the compartment 11, and a second sensor 3 is mounted on the second column 13 on the third side of the compartment 11.

[0121] According to the embodiments of this application, a first sensor is installed on a first column on the second side of the storage area, and a second sensor is installed on a second column on at least one of the third and fourth sides of the storage area. This enables multi-directional three-dimensional perception, eliminates blind spots in single-sided detection, and improves the accuracy and reliability of storage area monitoring.

[0122] According to an embodiment of this application, a first sensor is disposed on the surface of the first column facing the first side, and the probe of the first sensor faces the inside of the compartment; a second sensor is disposed on the surface of the second column facing the second side, and the sensing surface of the second sensor faces the inside of the compartment.

[0123] According to an embodiment of this application, the probe of the limit sensor is disposed on the surface of the first column facing the first side, which is beneficial for detecting whether the end point behind the "insertion" is reached; the capacitive sensor is disposed on the rear surface of the second column facing the second side, with the sensing surface facing the inside of the compartment, which can sense the movement of the server while occupying as little space inside the compartment as possible and does not affect the insertion of the server.

[0124] like Figure 8 As shown, in one example, the first sensor 2 is disposed on the surface of the first column 12 facing the first side, and the probe of the first sensor 2 faces the inside of the compartment 11; the second sensor 3 is disposed on the surface of the second column 13 facing the second side, and the sensing surface D of the second sensor 3 faces the inside of the compartment 11.

[0125] In one example, the sidewall 51 of the device under test (DUT) 50 is made of metal. When the second sensor 3 is powered on, it emits a weak electric field inside the compartment 11. As the DUT 50 is inserted into the compartment 11, it affects this electric field, causing a capacitance to form between the sidewall 51 of the DUT 50 and the sensing plane of the second sensor 3. The second sensor 3 can sense the distance between the DUT 50 and the first sensor 2 by sensing changes in this capacitance.

[0126] The sensing surface D of the second sensor 3 is parallel to the side wall 51 of the device under test 50, and there is a gap d between the sensing surface D of the second sensor 3 and the side wall 51 of the device under test 50. The gap d is an air gap, which is the channel through which the capacitive field passes, and is a pure space without any obstruction. When the side wall 51 of the device under test 50 slides parallel across the sensing surface of the capacitive sensor, the overlapping area increases and the capacitance increases. When it completely covers the sensor, the signal reaches its peak value. After the sensor slides away, the capacitance returns to its initial value. The perpendicular sensing distance (gap d) between the side wall 51 of the device under test 50 and the sensing surface of the capacitive sensor determines the detection sensitivity. If the gap d is too large, the signal will be weak, and it will be impossible to detect if the distance exceeds the rated distance. The gap must be kept stable during sliding to properly identify the workpiece. The gap d between the sensing surface D of the second sensor 3 and the side wall 51 of the device under test 50 can be in the range of 3mm to 5mm.

[0127] like Figure 8 As shown, the surface of the second column 13 facing the second side has an inwardly extending flange, and the second column 13 has square holes (square holes) with standard spacing, which can be used to install cage nuts. The bracket 14 can be in the shape of a snap-fit, hooking onto the square holes of the second column 13 for fixation. By using the existing square holes, there is no need to drill holes in the second column 13, and the structural integrity can be maintained.

[0128] The second sensor 3 is attached to the side of the bracket and secured to the bracket 14 with screws, thus fixing the second sensor 3 to the surface of the second column 13 facing the second side via the bracket 14. The second sensor 3 can be completely hidden in the gap d between the second column 13 and the device under test 50 to avoid interference. The second sensor 3 and the second column 13 are separated by the bracket 14. The bracket 14 provides electrical isolation. In one example, the bracket 14 can be a plastic insulating bracket made of plastic with a thickness ≥2mm to ensure electrical isolation.

[0129] Combination Figure 8 Table 1, through a specific embodiment, further illustrates the storage compartment of this application embodiment with a four-layer structure from the outside in. The outermost layer is the second column 13, which is a metal guide rail. The second column 13 may have a hole structure, such as a square hole, hereinafter also referred to as a square hole column, which can provide mechanical support for the second sensor 3. The isolation layer is the bracket 14, which is a plastic bracket. The bracket 14 is made of plastic and can block the interference of metal (metal guide rail) on the capacitive length. The sensing layer is the second sensor 3, which is a capacitive sensor. The second sensor 3 faces the server (device under test 50) and can detect the proximity of metal (side wall 51 of device under test 50). The target layer is the device under test 50, which is a server. The side wall of the server chassis is the metal side wall being tested (side wall 51 of device under test 50). The side wall of the server chassis is flat and continuous.

[0130] Table 1

[0131]

[0132] According to an embodiment of this application, at least one first sensor is provided on the second side of the compartment, and at least one second sensor is provided on both the third and fourth sides of the compartment.

[0133] The standard rack uprights have square holes spaced 0.5 inches apart. The standard 1U height is 1.75 inches, allowing for the installation of one or two second sensors at the center of each compartment on the second upright. Second sensors are also located on the third and fourth sides of the compartments to further improve the accuracy of the detection results.

[0134] Figure 9 This is a top view of a bay in a cabinet according to another embodiment of this application. Figure 10 This is a front view of a bay in a cabinet according to another embodiment of this application. Figure 11 This is a rear view of a bay in a cabinet according to another embodiment of this application.

[0135] like Figure 9 As shown, a second column 13 is installed on the third side of the rack 11, and a second sensor 3 is installed on the second column 13 installed on the third side of the rack. Similarly, a second sensor is installed on the second column installed on the fourth side of the rack 11.

[0136] Figure 10 and Figure 11 Two positions are used as examples for illustration.

[0137] like Figure 10 As shown, Figure 10 Positions were not drawn in the middle. Figure 10 The example includes two devices under test (DUTs) 50, with the positions of the two DUTs 50 corresponding to the positions of two compartments in the cabinet. The second side of the compartment, i.e., the rear of the cabinet, also represents the rear of the DUTs 50, is provided with a first upright 12 at the rear of the cabinet. In one example, the number of first sensors 2 can be set on the first upright 12 according to the number of compartments. In one example, the cabinet is positioned on a second upright 13 on the third side of the compartment, with two second sensors 3 installed at the corresponding compartment positions, the sensing surface D of the second sensors 3 facing the interior of the compartment. In another example, the cabinet is positioned on a second upright on the fourth side of the compartment, with two second sensors installed at the corresponding compartment positions.

[0138] Multiple second sensors 3 form a second sensor array, distributed on the second pillars 13 on the third and fourth sides. Viewed from the front, they are obscured by the second pillars 13. Figure 10 Multiple second sensors 3 are represented by dashed lines. Viewed from the rear, they are not obscured by the second pillar 13. Figure 11 Multiple second sensors 3 are represented by solid lines. Multiple first sensors 2 form a first sensor array, distributed on the first column 12 on the second side. Viewed from the front, it is obscured by two devices under test 50. Figure 10 Multiple first sensors 2 are indicated by dashed lines. The first sensors 2 are located on the surface of the first column 12 facing the first side of the storage compartment. Viewed from behind, they are obscured by the first column 12. Figure 11 Multiple first sensors 2 are represented by dashed lines.

[0139] like Figure 11 As shown, the solid-lined node wiring clearly demonstrates the connection relationship between the monitoring host 411 and the first and second sensor arrays. The first sensor 2 is fixed on the first column 12 and connected to the monitoring host 411 by a cable. The first and second sensor arrays monitor the presence status of multiple warehouses on the server's column. Relying on the column, noise can be shielded and reduced, and operational data can be collected accurately. The first and second sensor arrays are wired in separate zones with redundant networking, isolating strong and weak electrical signals, avoiding potential interference, ensuring stable monitoring transmission, and facilitating fault diagnosis.

[0140] The second sensor array is evenly distributed along the height of the U-position of the rack to detect the presence and position of the device under test 50. Combined with the first sensor array, it achieves full coverage detection and full position tracking. The first and second sensor arrays cover the entire rack height and can support servers with different U-positions.

[0141] The cables for the first and second sensor arrays are routed along the sides of the first and second posts 12 and 13, respectively. They can be secured with cable clips and then connected to the monitoring host 411. The monitoring host 411 integrates the weighted sum of the two signals for judgment. After summarizing the data, the monitoring host 411 can accurately determine the presence status of the device under test 50.

[0142] Figure 12 This is a top view of a compartment in a cabinet according to another embodiment of this application.

[0143] like Figure 12 As shown, the sensing surface D of the second sensor 3 faces the inside of the compartment 11 and slightly extends beyond the second column 13, protruding into the compartment 11. The gap d between the sensing surface D of the second sensor 3 and the side wall 51 of the device under test 50 is controlled within the range of 3mm to 5mm.

[0144] The monitoring system of this application embodiment is designed with a probe-type switch (first sensor) on the rear window of the cabinet and a capacitive sensor (second sensor) introduced behind the second column. The first sensing data and the second sensing data are output to the computing device for complementary filtering algorithm. After complementary filtering, the fused value is integrated into the monitoring host, and the monitoring host performs more accurate U-position detection.

[0145] The monitoring system of this application embodiment is used in a data center. It only requires one-time optimization deployment on existing racks and has no additional requirements for rack nodes. It can be compatible with a large number of existing servers of various brands and models. It can achieve accurate on-site detection of all rack nodes without the need for unified modification of rack nodes. It provides the data center operation and maintenance team with a visible process so as to quickly locate plug-in failures, analyze operational problems, and improve reliability and operation and maintenance efficiency.

[0146] According to an embodiment of this application, the computing device is further configured to determine whether the insertion direction of the device under test deviates from the first direction based on the difference between the second sensing data provided by the second sensors on the third and fourth sides.

[0147] Based on the difference between the second sensing data provided by the second sensors on the third and fourth sides, it is possible not only to determine whether the insertion is secure, but also to promptly identify misalignment or misalignment, thereby preventing the probe switch of the first sensor from being bent or making poor contact, and preventing the device under test from being misinstalled or the interface from being damaged. This ensures the accuracy of the connection and the reliability of the connection, and is also beneficial for maintenance by the staff.

[0148] Figure 13 This is a schematic diagram of a monitoring system according to another embodiment of this application.

[0149] like Figure 13 As shown, in addition to the server 52 located in the rack and the monitoring host 411 connected to the rack, the monitoring system may also include a power board 7, a power connector 8 and a host computer 6.

[0150] Power connector 8 is mounted on the rack and connects to power board 7. With the server fully inserted into the rack, power board 7 is electrically connected to the server via power connector 8. Host computer 6 connects to power board 7 and monitoring host 411. Power board 7 may include a CPLD (Complex Programmable Logic Device) and a 54V power supply.

[0151] When the server is inserted into the rack, the monitoring host 411 outputs an in-situ status of "server fully inserted into the rack". In response to the in-situ status of "server fully inserted into the rack" provided by the monitoring host 411, the host computer 6 controls the power board 7 to enable power output and power on the server. For example, it controls the CPLD to enable the 54V power supply output to enable the server to start up in sequence.

[0152] When the server is removed from the rack, if the monitoring host 411 outputs an in-place status that is not "server fully inserted into the rack" (e.g., server partially inserted into the rack, server starting to insert into the rack, server not in the rack at all), in response to the in-place status provided by the monitoring host 411 not being "server fully inserted into the rack", the control power board 7 shuts off the power output and does not supply power to the server, so that the server starts the power-down sequence.

[0153] The monitoring system may also include a power supply link 9, which is installed on the rack. The power connector 8 can be electrically connected to the server through the power supply link 9 to transmit power to or cut off the server.

[0154] In the monitoring system of this application embodiment, the probe switch is fixed on the column of the rear window of the cabinet, located directly behind each U-position. The capacitive sensor is fixed on the inside of the cabinet column and is used to monitor the server node insertion process. The two sensors are integrated into the monitoring host after complementary filtering, so that the monitoring host can perform more accurate U-position detection. The monitoring host 411 achieves accurate U-position detection by integrating the two filtered signals. The signal from the capacitive sensor after high-pass filtering is used to provide real-time feedback on the server insertion action and progress for dynamic process monitoring. When the server is close to being in place, the signal from the probe switch after low-pass filtering is used to confirm whether it is fully inserted, so as to confirm the steady-state result and avoid misjudgment of dynamic signals.

[0155] In another embodiment, the monitoring system of this application can also implement redundancy verification. The first sensing data and the second sensing data are mutually verified. The computing device can determine that the device under test has performed an insertion action based on the second sensing data output by the second sensor. However, if the first sensing data output by the first sensor indicates that the device is not fully inserted, the device is determined to be in position as "insertion incomplete". The computing device can also determine that the device is in position as "false trigger" based on the first sensing data output by the first sensor indicating that the device is fully inserted, but the second sensor does not output the second sensing data. For example, if the capacitive sensor detects the insertion action, but the probe switch does not output a position signal, it is determined to be "insertion incomplete"; if the probe switch outputs a position signal, but the capacitive sensor does not change dynamically, it is determined to be "mechanical failure or false trigger".

[0156] The monitoring system in this application embodiment filters out the unique interference of the first sensor and the second sensor from the first sensing data and the second sensing data respectively, thereby avoiding false alarms from a single sensor and improving anti-interference capability.

[0157] The monitoring system in this application combines dynamic processes with steady-state results to both monitor the insertion process and accurately confirm the in-place status, thereby improving detection accuracy.

[0158] The monitoring system of this application embodiment uses redundant verification of the first sensing data and the second sensing data to reduce the risk of detection failure caused by mechanical failure or environmental interference and improve reliability.

[0159] This application also proposes an electronic device.

[0160] According to an embodiment of this application, the electronic device includes: a memory for storing a computer program; and a processor for executing the computer program to: acquire first sensing data from a first sensor installed on one side of the storage compartment, and acquire second sensing data from a second sensor installed on the other side of the storage compartment; extract steady-state information from the first sensing data, the steady-state information characterizing the contact stability between the device under test and the first sensor; extract dynamic information from the second sensing data, the dynamic information characterizing the distance change between the device under test and the second sensor; and determine the in-situ state of the device under test in the storage compartment based on the steady-state information and the dynamic information.

[0161] Figure 14 This is a flowchart illustrating the operation of a computer program according to an embodiment of this application.

[0162] like Figure 14 As shown, the computer program includes operations S1410 to S1440.

[0163] In operation S1410, first sensing data is acquired from a first sensor installed on one side of the compartment, and second sensing data is acquired from a second sensor installed on the other side of the compartment.

[0164] In operation S1420, steady-state information is extracted from the first sensing data. The steady-state information characterizes the contact stability between the device under test and the first sensor.

[0165] In operation S1430, dynamic information is extracted from the second sensing data, which characterizes the change in distance between the device under test and the second sensor during the process of entering the compartment.

[0166] During operation of S1440, the on-site status of the device under test in the storage compartment is determined based on steady-state and dynamic information.

[0167] According to embodiments of this application, by using a second sensor to sense the action of the device under test (DUT) before it comes into contact with the first sensor, and outputting second sensing data containing dynamic information characterizing the action, advance monitoring of the action can be achieved, providing reliable data for linkage control. By using the first sensor to sense the contact state between the DUT and the first sensor, and outputting first sensing data containing steady-state information characterizing whether contact has occurred, accurate sensing of the actual contact state between the DUT and the first sensor can be achieved. Compared to manual operation or judging presence solely based on the probe switch output signal being 0 or 1, this method comprehensively considers both steady-state and dynamic information, forming a dual verification of pre-sensing and actual contact detection, enabling more accurate judgment of the DUT's presence state and reducing misjudgments.

[0168] According to an embodiment of this application, the processor is configured to: extract first sensing values ​​at multiple times from first sensing data, and perform low-pass filtering on the first sensing values ​​at multiple times to obtain a first component as steady-state information, wherein the first sensing value indicates that the device under test is in contact with the first sensor, and the first sensing value indicates that the device under test is not in contact with the first sensor; extract second sensing values ​​at multiple times from second sensing data, and perform high-pass filtering on the second sensing values ​​at multiple times to obtain a second component as dynamic information, wherein the second sensing value indicates the distance between the device under test and the second sensor; fuse the first component and the second component to obtain a fused value; and determine the in-situ state of the device under test in the storage compartment by comparing the fused value with a preset threshold.

[0169] The monitoring system of this application embodiment can improve the reliability of U-position detection in the cabinet and avoid false judgments. It uses a first sensor to provide an absolute reference (physical contact), a second sensor to detect insertion depth, and a complementary filtering fusion algorithm of the computing device to suppress environmental interference, thereby avoiding the risk of "false in-position" errors. It can also support intelligent operation and maintenance and accurate diagnosis. By recording insertion and removal speed and depth curves, it can automatically identify abnormal modes such as oblique insertion, jamming, and slow insertion, and predict potential faults such as guide rail wear and probe aging.

[0170] According to an embodiment of this application, the processor is further configured to: determine the in-place state as follows in response to a first component being greater than a first threshold: the device under test is fully inserted into the compartment; determine the in-place state as follows in response to a fusion value being greater than a second threshold: the device under test is partially inserted into the compartment; determine the out-of-place state as follows in response to a fusion value being between the second threshold and a third threshold: the device under test begins to be inserted into the compartment; and determine the in-place state as follows in response to a fusion value being less than a third threshold: the device under test is not in the compartment.

[0171] Figure 15 This is a structural block diagram of an apparatus for executing a computer program according to an embodiment of the present application.

[0172] like Figure 15As shown, the device 1500 for executing a computer program includes an acquisition module 1510, a first extraction module 1520, a second extraction module 1530, and a determination module 1540.

[0173] The acquisition module 1510 is used to acquire first sensing data from a first sensor installed on one side of the compartment and second sensing data from a second sensor installed on the other side of the compartment.

[0174] The first extraction module 1520 is used to extract steady-state information from the first sensing data. The steady-state information characterizes the contact stability between the device under test and the first sensor.

[0175] The second extraction module 1530 is used to extract dynamic information from the second sensing data. The dynamic information represents the change in distance between the device under test and the second sensor during the process of entering the compartment.

[0176] The determination module 1540 is used to determine the in-situ status of the device under test in the storage location based on steady-state information and dynamic information.

[0177] Figure 16 This is a block diagram of an electronic device suitable for executing computer programs according to embodiments of the present disclosure.

[0178] like Figure 16 As shown, an electronic device 1600 according to an embodiment of the present disclosure includes a processor 1601, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1602 or a program loaded from a storage portion 1608 into a random access memory (RAM) 1603. The processor 1601 may include, for example, a general-purpose microprocessor (e.g., a CPU), an instruction set processor and / or an associated chipset and / or a special-purpose microprocessor (e.g., an application-specific integrated circuit (ASIC)), etc. The processor 1601 may also include onboard memory for caching purposes. The processor 1601 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present disclosure.

[0179] RAM 1603 stores various programs and data required for the operation of electronic device 1600. Processor 1601, ROM 1602, and RAM 1603 are interconnected via bus 1604. Processor 1601 performs various operations of the method flow according to embodiments of the present disclosure by executing programs in ROM 1602 and / or RAM 1603. It should be noted that the programs may also be stored in one or more memories other than ROM 1602 and RAM 1603. Processor 1601 may also perform various operations of the method flow according to embodiments of the present disclosure by executing programs stored in said one or more memories.

[0180] According to embodiments of this disclosure, the electronic device 1600 may further include an input / output (I / O) interface 1605, which is also connected to a bus 1604. The electronic device 1600 may also include one or more of the following components connected to the input / output (I / O) interface 1605: an input section 1606 including a keyboard, mouse, etc.; an output section 1607 including a cathode ray tube (CRT), liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 1608 including a hard disk, etc.; and a communication section 1609 including a network interface card such as a LAN card, modem, etc. The communication section 1609 performs communication processing via a network such as the Internet. A drive 1610 is also connected to the input / output (I / O) interface 1605 as needed. A removable medium 1611, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on the drive 1610 as needed so that computer programs read from it can be installed into the storage section 1608 as needed.

[0181] This disclosure also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or it may exist independently and not assembled into the device / apparatus / system. The computer-readable storage medium carries one or more programs that, when executed, implement the method according to the embodiments of this disclosure.

[0182] According to embodiments of this disclosure, the computer-readable storage medium may be a non-volatile computer-readable storage medium, such as including, but not limited to: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this disclosure, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. For example, according to embodiments of this disclosure, the computer-readable storage medium may include ROM 1602 and / or RAM 1603 and / or one or more memories other than ROM 1602 and RAM 1603 described above.

[0183] Embodiments of this disclosure also include a computer program product comprising a computer program containing program code for performing the methods shown in the flowchart. When the computer program product is run on a computer system, the program code is used to cause the computer system to implement the computer program provided in the embodiments of this disclosure.

[0184] When the computer program is executed by the processor 1601, it performs the functions defined in the system / apparatus of this disclosure embodiments. According to embodiments of this disclosure, the systems, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0185] In one embodiment, the computer program may rely on a tangible storage medium such as an optical storage device or a magnetic storage device. In another embodiment, the computer program may also be transmitted and distributed in the form of signals over a network medium, and may be downloaded and installed via the communication section 1609, and / or installed from a removable medium 1611. The program code contained in the computer program can be transmitted using any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination thereof.

[0186] In such an embodiment, the computer program can be downloaded and installed from a network via the communication section 1609, and / or installed from the removable medium 1611. When the computer program is executed by the processor 1601, it performs the functions defined in the system of this disclosure embodiment. According to embodiments of this disclosure, the systems, devices, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0187] Embodiments of this application also provide a computer-readable storage medium storing a computer program.

[0188] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0189] Embodiments of this application also provide a computer program product, which includes a computer program.

[0190] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program.

[0191] Any of the components, modules, units, parts, methods, and operations described herein can be implemented using software, firmware, hardware (e.g., fixed logic circuitry), manual processing, or any combination thereof. Alternatively or additionally, any functionality described herein can be executed at least in part by one or more hardware logic components, such as, but not limited to, a central processing unit (CPU), a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), an application-specific standard product (ASSP), a system-on-a-chip (SoC), a complex programmable logic device (CPLD), a microprocessor (MCU), etc. The terms "system," "computing device," or "apparatus" as used herein encompass various means, devices, and machines for processing data, including, for example, one or more programmable processors, computers, SoCs, or combinations thereof. The apparatus may also include code that creates an execution environment for the computer program in question, such as code constituting processor firmware, a protocol stack, a database management system, an operating system, a cross-platform runtime environment, a virtual machine, or one or more combinations thereof. The aforementioned computer program (also known as a program, software, software application, app, script, or code) can be written in any form of programming language, including compiled or interpreted languages, declarative or procedural languages, and can be deployed in any form, including as a standalone program or as a module, component, subroutine, object, or other unit suitable for a computing environment.

[0192] The units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Different methods can be used to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0193] The monitoring system and electronic device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A monitoring system, characterized in that, include: A cabinet includes at least one compartment for accommodating the device under test. The first sensor is installed on one side of the compartment and is used to generate first sensing data based on whether the device under test is in contact with the first sensor. The second sensor, installed on the other side of the compartment, is used to generate second sensing data based on the distance between the device under test and the second sensor; A computing device, connected to the first and second sensors, is used for: First sensing values ​​at multiple times are extracted from the first sensing data, and low-pass filtering is applied to the first sensing values ​​at multiple times to obtain the first component as steady-state information. The first sensing value indicates that the device under test is in contact with the first sensor, and the first sensing value indicates that the device under test is not in contact with the first sensor. The steady-state information characterizes the contact stability between the device under test and the first sensor. Second sensing values ​​at multiple times are extracted from the second sensing data. High-pass filtering is applied to the second sensing values ​​at multiple times to obtain the second component as dynamic information. The second sensing value represents the distance between the device under test and the second sensor. The dynamic information characterizes the change in the distance between the device under test and the second sensor during the process of entering the warehouse. The first and second components are fused to obtain the fused value; The presence status of the device under test in the compartment is determined by comparing the fusion value with a preset threshold. The in-position status includes not in a position, starting to insert into a position, partially inserting into a position, and fully inserting into a position.

2. The monitoring system according to claim 1, characterized in that, The first sensor is a limit sensor, which is configured to generate a first sensing value based on whether the device under test is in contact with a probe in the limit sensor.

3. The monitoring system according to claim 1, characterized in that, The second sensor is a capacitive sensor, which is configured to sense the capacitance value of the capacitance formed between the device under test and the sensing surface of the capacitive sensor, as the second sense value.

4. The monitoring system according to claim 1, characterized in that, The filter coefficients of the low-pass filter and the high-pass filter are adjustable within the range of 0.02-0.

05.

5. The monitoring system according to claim 1, characterized in that, Computing devices are also used for: In response to the first component being greater than the first threshold, the in-position status will be determined as: the device under test is fully inserted into the compartment. If the fusion value is greater than the second threshold, the in-place status will be determined as: the device under test is partially inserted into the compartment; In response to a fusion value between the second and third thresholds, the state will be determined as: the device under test begins insertion into the compartment; If the fusion value is less than the third threshold, the in-place status will be determined as: the device under test is not in the warehouse.

6. The monitoring system according to claim 1, characterized in that, The compartment has a first side, a second side, a third side, and a fourth side, wherein the first side and the second side are arranged opposite each other along a first direction, and the third side and the fourth side are arranged opposite each other along a second direction. The compartment is configured to allow the device under test to be inserted from the first side to the second side along the first direction. The first sensor is located on the second side of the compartment, and the second sensor is located on the third and / or fourth side of the compartment.

7. The monitoring system according to claim 6, characterized in that, The cabinet also includes a first upright provided on the second side of the bay, and a second upright provided on at least one of the third and fourth sides; The first sensor is mounted on the first column; The second sensor is mounted on the second column.

8. The monitoring system according to claim 7, characterized in that, The first sensor is disposed on the surface of the first column facing the first side, and the probe of the first sensor faces the inside of the compartment; The second sensor is installed on the surface of the second column facing the second side, with the sensing surface of the second sensor facing the inside of the compartment.

9. The monitoring system according to claim 6, characterized in that, At least one first sensor is provided on the second side of the compartment, and at least one second sensor is provided on the third and fourth sides of the compartment.

10. The monitoring system according to claim 9, characterized in that, The computing device is also used to determine whether the insertion direction of the device under test deviates from the first direction based on the difference between the second sensing data provided by the second sensors on the third and fourth sides.

11. The monitoring system according to any one of claims 1 to 10, characterized in that, The device under test is a server, and the computing device is a monitoring host.

12. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor, used to execute the computer program, implements: First sensing data is acquired from a first sensor installed on one side of the compartment, and second sensing data is acquired from a second sensor installed on the other side of the compartment. First sensing values ​​at multiple times are extracted from the first sensing data, and low-pass filtering is applied to the first sensing values ​​at multiple times to obtain the first component as steady-state information. The first sensing value indicates that the device under test is in contact with the first sensor, and the first sensing value indicates that the device under test is not in contact with the first sensor. The steady-state information characterizes the contact stability between the device under test and the first sensor. Second sensing values ​​at multiple times are extracted from the second sensing data. High-pass filtering is applied to the second sensing values ​​at multiple times to obtain the second component as dynamic information. The second sensing value represents the distance between the device under test and the second sensor. The dynamic information characterizes the change in distance between the device under test and the second sensor during the process of entering the warehouse. The first and second components are fused to obtain the fused value; The presence status of the device under test in the compartment is determined by comparing the fusion value with a preset threshold. The in-position status includes not in a position, starting to insert into a position, partially inserting into a position, and fully inserting into a position.

13. The electronic device according to claim 12, characterized in that, The processor is also used for: In response to the first component being greater than the first threshold, the in-position status will be determined as: the device under test is fully inserted into the compartment. If the fusion value is greater than the second threshold, the in-place status will be determined as: the device under test is partially inserted into the compartment; In response to a fusion value between the second and third thresholds, the state will be determined as: the device under test begins insertion into the compartment; If the fusion value is less than the third threshold, the in-place status will be determined as: the device under test is not in the warehouse.

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