Method for automatic adjustment of the flow rate of a coolant in a liquid-cooled ageing environment

Abstract

The present application relates to the technical field of data acquisition and monitoring control, in particular to a kind of automatic regulation method of coolant flow in liquid cooling aging environment, comprising the following steps, obtain temperature control boundary, heat exchange parameter, pump valve response parameter, flow deviation and candidate execution record, obtain chip temperature and coolant temperature flow data according to sampling interval, calculate temperature rise rate, residual controllable time, heat absorption capacity and response length, determine flow regulation state, screen candidate execution record and write pump valve instruction, in the present application, by the temperature rise trend, heat transfer capacity, delivery delay, chip heat capacity and candidate flow are uniformly involved in judgment, make flow selection be simultaneously constrained by safety temperature boundary, test temperature lower limit and temperature uniformity, and closed-loop correction according to actual flow and stable flow deviation, reduce the risk of overheating, supercooling deviation and local temperature difference expansion, improve the stability of coolant flow regulation in long-term aging test.

Description

Technical Field

[0001] This invention relates to the field of data acquisition and monitoring control technology, and in particular to an automatic adjustment method for refrigerant flow rate in a liquid-cooled aging environment. Background Technology

[0002] The field of data acquisition and monitoring control technology encompasses the hardware and software architecture for reading and parsing data from underlying physical devices and for real-time centralized monitoring of their operational status. This field includes data acquisition terminals, communication networks, and centralized monitoring centers. Its main purpose is to collect operational parameters of the target environment or equipment in real time through sensor networks and transmit them to a host computer for centralized monitoring and logic control processing.

[0003] The automatic adjustment method of refrigerant flow rate in liquid-cooled aging environment refers to the operation process of changing the fluid flow rate in the refrigerant delivery pipeline according to the real-time operating conditions in the scenario of liquid-cooled aging test of electronic equipment or components. This is used to maintain the temperature of the target object in the aging test environment within the set safety and test index requirements to prevent the test object from being damaged due to overheating.

[0004] Existing liquid-cooled aging tests mostly rely on fixed flow rates or manual experience to adjust the refrigerant flow rate. The speed-regulating pump and proportional valve have lag in response, and the temperature of the chip under test continues to rise before the refrigerant reaches the heat exchange section. The control action lags behind the temperature change rhythm. Fixed adjustment makes it difficult to balance the safe temperature boundary and the lower limit of the test temperature. When the heat distribution is uneven at multiple temperature measurement locations, the local temperature difference widens. There is no timely correction when the actual flow rate deviates from the set flow rate. Overheating risk, undercooling deviation, thermal shock fluctuations and insufficient temperature uniformity are likely to occur during long-term aging. Summary of the Invention

[0005] To address the technical problems existing in the prior art, embodiments of the present invention provide an automatic adjustment method for the refrigerant flow rate in a liquid-cooled aging environment, comprising the following steps: S1: Obtain the upper limit of safe temperature of the chip under test, the lower limit of test temperature, the sampling interval, the heat absorption capacity of the refrigerant volume, the internal volume of the heat exchange section tube, the response time of the speed regulating pump, the response time of the proportional valve, the equivalent heat capacity of the chip under test, the temperature uniformity range, the allowable deviation of the flow rate, and the candidate execution records. The candidate execution records include the speed regulating pump speed command, the proportional valve opening command, and the stable flow rate. S2: Obtain the current temperature of the chip under test, the previous sampling temperature, the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate according to the sampling interval. Calculate the temperature rise rate and remaining controllable time from the upper limit of the safe temperature of the chip under test, the current temperature of the chip under test, and the previous sampling temperature. S3: Calculate the current heat absorption capacity of the refrigerant based on the refrigerant outlet temperature, the refrigerant inlet temperature, the current refrigerant flow rate, and the refrigerant volume heat absorption capacity; calculate the total execution response time based on the internal volume of the heat exchange section pipe, the response time of the speed regulating pump, and the response time of the proportional valve. S4: The flow regulation state of the chip under test is determined by the temperature rise rate, the total execution response time, the lower limit of the test temperature, the temperature uniformity range, and the current temperature of the chip under test; and the candidate execution record is selected by screening the candidate execution record, the current heat absorption capacity of the refrigerant, and the equivalent heat capacity of the chip under test. S5: Write the speed control pump speed command and the proportional valve opening command from the selected candidate execution record into the corresponding register area, obtain the actual flow rate, and determine the refrigerant flow control result based on the actual flow rate, the stable flow rate, and the flow rate allowable deviation.

[0006] As a further aspect of the present invention, the steps of obtaining the upper limit of the safe temperature of the chip under test, the lower limit of the test temperature, the sampling interval, the heat absorption capacity of the refrigerant volume, the internal volume of the heat exchange section tube, the response time of the speed-regulating pump, the response time of the proportional valve, the equivalent heat capacity of the chip under test, the temperature uniformity range, the allowable flow deviation, and the candidate execution record include: reading aging test task configuration data, extracting the upper limit of the safe temperature of the chip under test, the lower limit of the test temperature, the sampling interval, the temperature uniformity range, and the allowable flow deviation from the aging test task configuration data, obtaining the refrigerant density and the refrigerant specific heat capacity, calculating the heat absorption capacity of the refrigerant volume based on the refrigerant density and the refrigerant specific heat capacity, obtaining the heat exchange channel cross-sectional dimensions and the effective length of the heat exchange channel of the liquid-cooled heat exchange structure, and calculating the internal volume of the heat exchange section tube based on the heat exchange channel cross-sectional dimensions and the effective length of the heat exchange channel; Calibration commands are written to the speed-regulating pump and the proportional valve respectively. The pump and valve action time between the command writing time and the time when the refrigerant flow rate enters a stable state is recorded. The response time of the speed-regulating pump and the response time of the proportional valve are determined based on the pump and valve action time. The calibration heating power and calibration temperature rise curve of the chip under test are obtained. The equivalent heat capacity of the chip under test is calculated based on the calibration heating power and calibration temperature rise curve of the chip under test. The candidate execution record list that matches the aging test task configuration data is read, and the candidate execution record is obtained from the candidate execution record list.

[0007] As a further aspect of the present invention, the process of obtaining the candidate execution record includes: reading the speed command range that can be received by the speed regulating pump control register area and the opening command range that can be received by the proportional valve controller opening register area; comparing the speed regulating pump speed command in the candidate execution record with the speed command range; comparing the proportional valve opening command with the opening command range; retaining the records that fall within both the speed command range and the opening command range to obtain the candidate execution record.

[0008] As a further aspect of the present invention, the steps of obtaining the current temperature of the chip under test, the previous sampling temperature, the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate according to the sampling interval include: triggering temperature sampling at the temperature measurement position attached to the chip under test according to the sampling interval, obtaining the sensor output value and converting it into the current temperature of the chip under test, reading the temperature data cached at the previous sampling time and determining the previous sampling temperature, synchronously obtaining the inlet temperature sensor output value, the outlet temperature sensor output value, and the flow meter output value, and generating the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate.

[0009] As a further aspect of the present invention, the process of calculating the temperature rise rate and the remaining controllable time includes: comparing the current temperature of the chip under test with the previous sampling temperature and obtaining the sampling temperature difference; when the sampling temperature difference is not greater than zero, determining the temperature rise rate as zero and determining the remaining controllable time as the sampling interval; when the sampling temperature difference is greater than zero, calculating the temperature rise rate based on the sampling temperature difference and the sampling interval; and calculating the remaining controllable time based on the remaining temperature between the upper limit of the safe temperature of the chip under test and the current temperature of the chip under test, as well as the temperature rise rate.

[0010] As a further aspect of the present invention, the process of calculating the current heat absorption capacity of the refrigerant and the total duration of the response includes: comparing the refrigerant outlet temperature with the refrigerant inlet temperature to obtain the refrigerant temperature rise value, and calculating the current heat absorption capacity of the refrigerant based on the refrigerant temperature rise value, the current flow rate of the refrigerant, and the volume heat absorption capacity of the refrigerant. The refrigerant delivery lag time is calculated based on the internal volume of the heat exchange section tube and the current flow rate of the refrigerant. The refrigerant delivery lag time, the speed regulating pump response time, and the proportional valve response time are added together to obtain the total execution response time.

[0011] As a further aspect of the present invention, the process of determining the flow regulation state of the chip under test includes: calculating the temperature increment during the execution response based on the temperature rise rate and the total execution response duration; merging the current temperature of the chip under test with the temperature increment during the execution response to obtain a predicted temperature; comparing the predicted temperature with the upper limit of the safe temperature of the chip under test and the lower limit of the test temperature; and comparing the temperature difference between the current temperatures of the chip under test at multiple temperature measurement locations with the temperature uniformity range to generate the flow regulation state of the chip under test.

[0012] As a further specific step of the present invention, the process of generating the flow regulation state of the chip under test includes: when the predicted temperature is not lower than the upper limit of the safe temperature of the chip under test, the flow regulation state of the chip under test is determined as a safe boundary flow boosting state; when the temperature difference between the current temperatures of the chip under test corresponding to multiple temperature measurement positions exceeds the temperature uniformity range, the flow regulation state of the chip under test is determined as a temperature difference suppression flow boosting state; when the predicted temperature is lower than the upper limit of the safe temperature of the chip under test but not lower than the lower limit of the test temperature, the flow regulation state of the chip under test is determined as a test lower limit constraint state.

[0013] As a further aspect of the present invention, the process of writing the speed control pump speed command and the proportional valve opening command from the selected candidate execution record into the corresponding register area includes: reading the speed control pump speed command, the proportional valve opening command, and the stable flow rate from the selected candidate execution record; writing the speed control pump speed command into the pump driver control register area; and after confirming that the pump driver control register area has been written, writing the proportional valve opening command into the proportional valve controller opening register area; obtaining the writing completion flag; and generating the pump valve execution command status.

[0014] As a further aspect of the present invention, after generating the pump valve execution command state, the actual flow rate output by the flow meter is obtained according to the sampling interval, and the actual flow rate is compared with the stable flow rate. When the flow rate difference between the actual flow rate and the stable flow rate does not exceed the allowable flow rate deviation, the speed control pump speed command and the proportional valve opening command are maintained, and the pump valve execution command state is determined as the refrigerant flow control result.

[0015] Compared with the prior art, the advantages and positive effects of the present invention are as follows: In this invention, by obtaining the upper limit of safe temperature, the lower limit of test temperature, the sampling interval, the heat absorption capacity of the refrigerant volume, the internal volume of the heat exchange section tube, and the pump and valve response time, and combining the current temperature, inlet temperature, outlet temperature, and current flow rate to calculate the temperature rise rate, remaining controllable time, refrigerant heat absorption capacity, and total execution response time, the temperature rise trend, transmission hysteresis, and candidate execution records are all incorporated into the flow rate screening to form a flow rate adjustment state corresponding to the thermal state of the chip under test. The flow rate is then corrected based on the deviation between the actual flow rate and the stable flow rate, so that the refrigerant flow rate changes in a closed loop with the aging chemical conditions, reducing the risk of overheating and overcooling deviations and improving temperature uniformity. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall architecture for automatic refrigerant flow regulation of the present invention; Figure 2 This is a diagram showing the acquisition of basic parameters and candidate execution records for this invention. Figure 3 This is a diagram illustrating temperature and flow rate sampling and temperature rise determination in this invention. Figure 4 This is a calculation diagram showing the heat absorption capacity and response time of the refrigerant in this invention; Figure 5 This is a diagram showing the flow regulation status and candidate record screening of the present invention; Figure 6 This is a diagram confirming the pump valve writing and flow control results of the present invention. Detailed Implementation

[0018] The technical solution of the present invention will now be described with reference to the accompanying drawings.

[0019] This embodiment provides an automatic adjustment method for the refrigerant flow rate in a liquid-cooled aging environment. During the actual operation of the liquid-cooled aging environment, the chip under test is continuously subjected to an aging test load. The temperature of the chip under test changes with the test load and the liquid-cooled heat exchange state. The refrigerant carries away heat through the heat exchange section. The speed-regulating pump and the proportional valve jointly change the refrigerant flow rate, so that the chip under test is in a test state defined by the upper limit of the safe temperature, the lower limit of the test temperature, and the temperature uniformity range. This includes an automatic adjustment method for the refrigerant flow rate in a liquid-cooled aging environment.

[0020] During liquid-cooled aging, directly changing the refrigerant flow rate based solely on a single temperature value can easily lead to issues such as pump and valve lag, refrigerant delivery delays in the heat exchange section, and failure to simultaneously consider the chip's temperature rise inertia. This embodiment addresses these issues by acquiring data on temperature, flow rate, refrigerant heat absorption capacity, pump and valve response time, heat exchange section tube volume, and candidate execution records. Within the sampling period, it determines the flow rate regulation state of the chip under test and selects the speed control pump speed command and proportional valve opening command that match the current thermal state from the candidate execution records. This ensures that the refrigerant flow rate regulation is executed according to defined rules within the constraints of safety boundaries, temperature difference suppression, and the lower limit of the test.

[0021] Please see Figure 1 and Figure 2 S1: Obtain the upper limit of safe temperature of the chip under test, the lower limit of test temperature, the sampling interval, the heat absorption capacity of the refrigerant volume, the internal volume of the heat exchange section tube, the response time of the speed regulating pump, the response time of the proportional valve, the equivalent heat capacity of the chip under test, the temperature uniformity range, the allowable deviation of the flow rate, and the candidate execution records. The candidate execution records include the speed regulating pump speed command, the proportional valve opening command, and the stable flow rate.

[0022] The upper limit of the safe temperature of the chip under test (DUT) refers to the highest temperature boundary for sustainable testing of the DUT as defined in the aging test task configuration data. It is determined by the DUT's test safety requirements and is invoked during subsequent predicted temperature comparisons and determination of remaining controllable time. The lower limit of the test temperature refers to the lowest temperature boundary for maintaining the effectiveness of the aging test as defined in the aging test task configuration data. It is used to prevent refrigerant flow regulation from causing the DUT temperature to deviate from the required test state. The sampling interval refers to the time interval between two adjacent temperature and flow rate samples, serving as the time reference for determining the temperature rise rate and triggering the next sampling. The temperature uniformity range refers to the permissible temperature difference boundary between the current temperatures of the DUT at multiple temperature measurement locations, used to identify the state where temperature difference inhibits flow increase. The permissible flow rate deviation refers to the permissible difference boundary between the actual flow rate and the stable flow rate, used to determine whether the refrigerant flow control result has been achieved.

[0023] The heat absorption capacity of the refrigerant refers to the ability of a unit volume of refrigerant to withstand changes in heat during a temperature rise, and is determined by both the refrigerant density and specific heat capacity. The refrigerant density and specific heat capacity are obtained from the refrigerant material data and converted into a heat absorption capacity field for the same volume diameter, which is then used to determine the current refrigerant heat absorption capacity. The internal volume of the heat exchange section tube refers to the internal volume in the liquid-cooled heat exchange structure where the refrigerant participates in removing heat from the chip within the heat exchange channel. It is obtained from the cross-sectional dimensions and effective length of the heat exchange channel and is used to determine the refrigerant delivery lag time when determining the total response time.

[0024] The speed-regulating pump response time refers to the pump-side action time during which the refrigerant flow rate transitions from its initial state to a steady state after a calibration command is written to the speed-regulating pump. The proportional valve response time refers to the valve-side action time during which the refrigerant flow rate transitions from its initial state to a steady state after a calibration command is written to the proportional valve. Both the speed-regulating pump response time and the proportional valve response time are generated during the calibration process and are not set temporarily during sampling. The equivalent thermal capacity of the chip under test (DUT) refers to the thermal inertia field exhibited when the DUT forms a temperature rise curve under the calibrated heating power. It is obtained from the calibrated heating power and the calibrated temperature rise curve of the DUT and is used to determine whether the flow rate change corresponding to the candidate execution record matches the temperature change characteristics of the DUT.

[0025] Among them, candidate execution records refer to executable record items that match the aging test task configuration data. Each candidate execution record simultaneously carries the speed control pump speed command, the proportional valve opening command, and the stable flow rate. The speed control pump speed command refers to the command data that can be written into the pump driver control register and used to change the speed control pump speed state. The proportional valve opening command refers to the command data that can be written into the proportional valve controller opening register and used to change the proportional valve opening state. The stable flow rate refers to the flow rate field corresponding to the refrigerant flow rate entering a stable state after the combined action of the speed control pump speed command and the proportional valve opening command, which is compared with the actual flow rate in S5.

[0026] In one embodiment, the steps in S1 to obtain the upper limit of the safe temperature of the chip under test, the lower limit of the test temperature, the sampling interval, the heat absorption capacity of the refrigerant volume, the internal volume of the heat exchange section tube, the response time of the speed-regulating pump, the response time of the proportional valve, the equivalent heat capacity of the chip under test, the temperature uniformity range, the allowable flow deviation, and the candidate execution record include: reading the aging test task configuration data, and extracting the upper limit of the safe temperature of the chip under test, the lower limit of the test temperature, the sampling interval, the temperature uniformity range, and the allowable flow deviation from the aging test task configuration data. The aging test task configuration data refers to the configuration data item corresponding to the current aging test task of the chip under test, which at least carries the temperature boundary, the sampling trigger aperture, the temperature uniformity judgment boundary, and the flow control judgment boundary. After reading, it forms the basic parameters continuously called in S2 to S5.

[0027] In one embodiment, after obtaining the refrigerant density and specific heat capacity in S1, the volumetric heat absorption capacity of the refrigerant is calculated based on these two parameters. This process does not employ a publicly available formula; instead, it treats the refrigerant density as a mass attribute per unit volume and the specific heat capacity as an attribute of the heat carried by the refrigerant as temperature changes. These two parameters are combined into a single field representing the volumetric heat absorption capacity of the refrigerant. This allows for the determination of the current refrigerant heat absorption capacity once the current refrigerant flow rate and temperature rise value are obtained.

[0028] In one embodiment, in step S1, the cross-sectional dimensions and effective length of the heat exchange channel of the liquid-cooled heat exchange structure are obtained, and the internal volume of the heat exchange section is calculated based on these dimensions and length. The cross-sectional dimensions describe the lateral space through which the refrigerant passes within the heat exchange section, and the effective length describes the flow path related to heat exchange between the refrigerant and the chip under test. These dimensions, along with the geometric diameter of the heat exchange section, form the internal volume field of the heat exchange section. This field is not used for temperature boundary determination but is used in step S3 in conjunction with the current refrigerant flow rate to determine the refrigerant delivery lag time.

[0029] In one embodiment, in step S1, calibration commands are written to the speed-regulating pump and the proportional valve, respectively. The pump and valve action times between the command writing time and the time when the refrigerant flow rate enters a steady state are recorded. The response times of the speed-regulating pump and the proportional valve are determined based on the pump and valve action times. The refrigerant flow rate entering a steady state means that the flowmeter output remains stable within the fluctuation boundaries allowed by the calibration judgment rule, which is derived from the calibration process rather than a temporary setting during the sampling process. By recording the response times of the speed-regulating pump and the proportional valve separately, step S3 can then incorporate the pump-side action, valve-side action, and refrigerant delivery lag into the total execution response time.

[0030] In one embodiment, in S1, the calibrated heating power and calibrated temperature rise curve of the chip under test (DUT) are acquired, and the equivalent thermal capacity of the DUT is calculated based on these parameters. The calibrated temperature rise curve of the DUT refers to the curve data recording the temperature change with the sampling sequence under the calibrated heating power. The equivalent thermal capacity of the DUT is used to represent the degree of sluggishness of the DUT's temperature response to changes in heat input. This field is invoked in S4 when filtering candidate execution records, ensuring that the stable flow rate of the candidate execution records is not solely determined by the current temperature, but is also constrained by the thermal inertia of the DUT.

[0031] In one embodiment, in step S1, a list of candidate execution records matching the aging test task configuration data is read, and candidate execution records are obtained from this list. Before entering step S4, the records in the candidate execution record list need to undergo acceptable range filtering. Specifically, this involves reading the acceptable speed command range from the speed pump control register and the acceptable opening command range from the proportional valve controller opening register. The speed pump speed command in the candidate execution records is compared with the speed command range, and the proportional valve opening command is compared with the opening command range. Records that fall within both the speed command range and the opening command range are retained, thus obtaining the candidate execution records. Falling within the speed command range means that the speed pump speed command can be received by the pump driver control register; falling within the opening command range means that the proportional valve opening command can be received by the proportional valve controller opening register. Records that do not simultaneously meet these conditions are not included in subsequent filtering.

[0032] In this embodiment, by first obtaining the temperature boundary, flow rate boundary, refrigerant endothermic properties, heat exchange section hysteresis properties, pump valve response properties, thermal inertia properties of the chip under test, and candidate execution records in S1, the subsequent temperature rise judgment, response time judgment, candidate screening, and execution confirmation all have the source of the preceding fields, thereby avoiding the need to rely solely on a single temperature sampling value to form the adjustment command when adjusting the flow rate.

[0033] Please see Figure 1 and Figure 3 S2: Obtain the current temperature of the chip under test, the previous sampling temperature, the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate according to the sampling interval. Calculate the temperature rise rate and remaining controllable time from the upper limit of the safe temperature of the chip under test, the current temperature of the chip under test, and the previous sampling temperature.

[0034] The current temperature of the chip under test (DUT) refers to the temperature data obtained at the current sampling moment from the temperature sampling location attached to the DUT. When multiple temperature sampling locations exist, the current temperature of the DUT simultaneously includes the temperature data corresponding to each sampling location, and the current temperature caliber used for safety boundary comparison is determined according to the aging test task configuration data. The previous sampling temperature refers to the temperature data cached at the previous sampling moment, which uses the same temperature sampling location caliber as the current temperature of the DUT, so that the temperature rise rate can be determined by the temperature change of the same caliber. The refrigerant inlet temperature refers to the temperature data of the refrigerant before entering the heat exchange section, the refrigerant outlet temperature refers to the temperature data of the refrigerant after flowing out of the heat exchange section, and the current refrigerant flow rate refers to the refrigerant flow rate data output by the flow meter at the current sampling moment.

[0035] In one embodiment, the step of obtaining the current temperature of the chip under test, the previous sampling temperature, the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate in step S2 according to the sampling interval includes: triggering temperature sampling at the temperature measurement position attached to the chip under test according to the sampling interval; obtaining the sensor output value and converting it into the current temperature of the chip under test; reading the temperature data cached at the previous sampling time and determining the previous sampling temperature; synchronously obtaining the inlet temperature sensor output value, the outlet temperature sensor output value, and the flow meter output value; and generating the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate. Synchronous acquisition means that the inlet temperature, outlet temperature, and flow rate use the same sampling trigger caliber to enter the current sampling cycle, avoiding the mixing of data from different sampling times for the same determination of heat absorption capacity.

[0036] In one embodiment, when S2 is executed for the first time, if the temperature data cached from the previous sampling time does not yet exist, the current temperature of the chip under test obtained from the first valid sample is written to the cache, and this sampling period is marked as the temperature rise rate initialization state. In the temperature rise rate initialization state, candidate execution record filtering is not performed directly; instead, the cached temperature data is read as the previous sampling temperature in the next sampling period. This process ensures that the input to the temperature rise rate always comes from the same temperature measurement aperture in adjacent sampling periods, avoiding the formation of a temperature rise state without a source when historical temperatures are insufficient.

[0037] In one embodiment, the process of calculating the temperature rise rate and remaining controllable time in S2 includes: comparing the current temperature of the chip under test with the previous sampling temperature and obtaining the sampling temperature difference. When the sampling temperature difference is not greater than zero, the temperature rise rate is determined to be zero and the remaining controllable time is determined as the sampling interval. This indicates that the chip under test does not show a temperature rise trend within the current sampling period, and the remaining controllable time uses the sampling interval as the control reference time before the next judgment, so that the subsequent S4 will not generate a false emergency current boost judgment due to the lack of a temperature rise trend.

[0038] In one embodiment, when the sampled temperature difference is greater than zero, the temperature rise rate is calculated based on the sampled temperature difference and the sampling interval. The remaining controllable time is calculated based on the remaining temperature between the upper limit of the safe temperature of the chip under test and its current temperature, as well as the temperature rise rate. This process uses textual execution rules, where the sampled temperature difference represents the magnitude of the temperature rise of the chip under test within adjacent sampling periods, the sampling interval represents the time frame of this temperature rise, and the temperature rise rate represents the current temperature rise trend. The remaining temperature represents the remaining temperature space between the current temperature of the chip under test and its upper limit of the safe temperature, and the remaining controllable time represents the time available for pump and valve operation and refrigerant delivery before reaching the upper limit of the safe temperature while the current temperature rise trend continues.

[0039] In one embodiment, the sensor output values, inlet temperature sensor output values, outlet temperature sensor output values, and flow meter output values ​​acquired in S2 are evaluated for validity before proceeding to subsequent processing. Validity evaluation includes whether the sampling trigger corresponds to the current sampling period, whether the output value can be converted into the corresponding temperature or flow rate field, and whether the inlet temperature, outlet temperature, and current flow rate coexist within the same sampling period. Sampling periods that do not meet the validity evaluation criteria are not processed for temperature rise rate and current refrigerant heat absorption capacity; instead, the previous valid state is maintained and the system waits for re-acquisition in the next sampling period. The previous valid state serves only as a hold-up state during abnormal periods and does not replace the generation of a new temperature rise rate.

[0040] In this embodiment, the temperature of the chip under test, the inlet temperature of the coolant, the outlet temperature of the coolant, and the current flow rate of the coolant are synchronously acquired by S2 at sampling intervals. The temperature rise rate and the remaining controllable time are formed based on adjacent sampling temperatures, so that the subsequent S4 can simultaneously obtain the current temperature status and the temperature change trend, thereby making the flow rate adjustment status not limited to a single point judgment of the current temperature.

[0041] Please see Figure 1 and Figure 4 S3: The current heat absorption capacity of the refrigerant is calculated from the refrigerant outlet temperature, refrigerant inlet temperature, current refrigerant flow rate, and refrigerant volume heat absorption capacity. The total execution response time is calculated from the internal volume of the heat exchange section pipe, the response time of the speed regulating pump, and the response time of the proportional valve.

[0042] The current refrigerant heat absorption capacity refers to the ability of the refrigerant to remove heat from the chip under test as it passes through the heat exchange section during the current sampling period. It is determined by the refrigerant outlet temperature, refrigerant inlet temperature, current refrigerant flow rate, and refrigerant volumetric heat absorption capacity. The refrigerant temperature rise refers to the increase in refrigerant outlet temperature relative to refrigerant inlet temperature, representing the temperature performance of the refrigerant after absorbing heat through the heat exchange section. The total execution response time refers to the comprehensive time required from the writing of the speed control pump speed command and the proportional valve opening command to the flow regulation having a stable impact on the heat exchange section. This includes the refrigerant delivery lag time, the speed control pump response time, and the proportional valve response time.

[0043] In one embodiment, the process of calculating the current refrigerant heat absorption capacity and the total execution response time in S3 includes: comparing the refrigerant outlet temperature with the refrigerant inlet temperature to obtain the refrigerant temperature rise value; and calculating the current refrigerant heat absorption capacity based on the refrigerant temperature rise value, the current refrigerant flow rate, and the refrigerant volumetric heat absorption capacity. This process uses the inlet temperature, outlet temperature, and current flow rate within the same sampling period. The refrigerant temperature rise value represents the heat absorption performance of the refrigerant after a single pass through the heat exchange section. The current refrigerant flow rate represents the amount of refrigerant passing through the heat exchange section per unit time. The refrigerant volumetric heat absorption capacity is used to convert the flow rate change and temperature rise state into a heat absorption capacity field.

[0044] In one embodiment, when the refrigerant outlet temperature is not higher than the refrigerant inlet temperature, the refrigerant temperature rise is determined to be a state of no effective heat rise. The current refrigerant heat absorption capacity is then processed according to this state, and this state is passed to the candidate execution record screening in S4. This process is used to avoid directly treating abnormal temperature relationships as normal heat absorption capacity when the inlet temperature sensor output value, outlet temperature sensor output value, or flow meter output value are inconsistent. The state of no effective heat absorption does not change the temperature rise rate already obtained in S2, but rather serves as a constraint state when screening candidate execution records in S4.

[0045] In one embodiment, in step S3, the refrigerant delivery lag time is calculated based on the internal volume of the heat exchange section pipe and the current refrigerant flow rate. The refrigerant delivery lag time, the speed-regulating pump response time, and the proportional valve response time are then summed to obtain the total execution response time. This process uses a textual execution rule for disclosure: the internal volume of the heat exchange section pipe represents the internal space within the heat exchange section where the refrigerant needs to be replaced or form a flow influence; the current refrigerant flow rate represents the flow state of the refrigerant through the heat exchange section during the current sampling period; both together determine the refrigerant delivery lag time. The speed-regulating pump response time and the proportional valve response time represent the time required for the pump-side and valve-side actions to reach a stable state, respectively. These three types of durations together form the total execution response time, which is used by step S4 to predict the temperature and determine the regulation state.

[0046] In one embodiment, when the current refrigerant flow rate cannot form a valid flow field, no new refrigerant delivery lag time is generated. The current sampling period is marked as an invalid flow state, and the total execution response time of the previous valid sampling period is used as a temporary reference. This temporary reference is only used to avoid input interruption in S4 and is not used as a new pump valve action calibration result. After obtaining a valid current refrigerant flow rate in the next sampling period, the refrigerant delivery lag time and the total execution response time are re-determined.

[0047] In this embodiment, the current heat absorption capacity of the refrigerant is formed by S3 by combining the refrigerant temperature rise state, the current flow rate state, and the refrigerant volume heat absorption capacity, and the total execution response time is formed by combining the internal volume of the heat exchange section pipe, the pump-side response, and the valve-side response. This allows S4 to consider both the current heat exchange capacity and the execution lag when screening candidate execution records, thereby making the flow rate regulation more consistent with the actual causal sequence of the liquid cooling heat exchange process.

[0048] Please see Figure 1 and Figure 5 S4: The flow regulation state of the chip under test is determined by the temperature rise rate, total execution response time, lower limit of the test temperature, temperature uniformity range and the current temperature of the chip under test. Candidate execution records are selected by screening candidate execution records, current heat absorption capacity of the refrigerant and equivalent heat capacity of the chip under test.

[0049] The "DUT flow regulation status" refers to a status field used to constrain the candidate execution record selection direction within the current sampling period. It includes at least three statuses: safety boundary flow increase status, temperature difference suppression flow increase status, and test lower limit constraint status. The safety boundary flow increase status indicates the flow increase direction corresponding to when the predicted temperature has reached or is close to the upper limit of the DUT's safety temperature. The temperature difference suppression flow increase status indicates that the temperature difference between multiple temperature measurement locations exceeds the temperature uniformity range, requiring increased refrigerant flow to suppress local temperature differences. The test lower limit constraint status indicates that the predicted temperature is below the upper limit of the DUT's safety temperature but not below the lower limit of the test temperature; excessive flow increase during candidate selection should be avoided to prevent the DUT's temperature from deviating from the lower limit of the test temperature.

[0050] In one embodiment, the process of determining the flow regulation state of the chip under test (DUT) in S4 includes: calculating the temperature increment during the execution response based on the temperature rise rate and the total execution response duration; merging the current temperature of the DUT with the temperature increment during the execution response to obtain a predicted temperature; comparing the predicted temperature with the upper limit of the safe temperature of the DUT and the lower limit of the test temperature; and comparing the temperature difference and temperature uniformity range between the current temperatures of the DUT at multiple temperature measurement locations to generate the flow regulation state of the DUT. This process uses a textual execution rule disclosure, where the temperature rise rate represents the current temperature upward trend, and the total execution response duration represents the time state that needs to be covered before the pump valve action and refrigerant delivery form a stable influence. Both together determine the temperature increment during the execution response. The predicted temperature represents the temperature state that the DUT may reach within the total execution response duration and is used for comparison with the upper limit of the safe temperature and the lower limit of the test temperature.

[0051] In one embodiment, the process of generating the flow regulation state of the chip under test includes: when the predicted temperature is not lower than the upper limit of the safe temperature of the chip under test, the flow regulation state of the chip under test is determined to be a safe boundary flow increase state. When the temperature difference between the current temperatures of the chip under test corresponding to multiple temperature measurement locations exceeds the temperature uniformity range, the flow regulation state of the chip under test is determined to be a temperature difference suppression flow increase state. When the predicted temperature is lower than the upper limit of the safe temperature of the chip under test but not lower than the lower limit of the test temperature, the flow regulation state of the chip under test is determined to be a test lower limit constraint state. The above states are executed in the order of safe boundary, temperature uniformity, and test lower limit constraint. When the predicted temperature has already met the safe boundary flow increase state, the safe boundary flow increase state is entered first; when the predicted temperature has not triggered the safe boundary flow increase state but the temperature difference between multiple temperature measurement locations exceeds the temperature uniformity range, the temperature difference suppression flow increase state is entered; when neither of the above two types of flow increase states is triggered and the predicted temperature is still within the lower limit constraint range of the test temperature, the test lower limit constraint state is entered.

[0052] In one embodiment, in step S4, candidate execution records are selected by filtering based on candidate execution records, the current refrigerant heat absorption capacity, and the equivalent thermal capacity of the chip under test. The selected candidate execution record refers to the record item determined from the candidate execution records for execution and writing in the current sampling cycle, which still includes the speed control pump speed command, the proportional valve opening command, and the stable flow rate. During filtering, the stable flow rate in the candidate execution record is first read, and compared with the current heat exchange state corresponding to the current refrigerant flow rate to determine the direction of change in the refrigerant heat absorption capacity of the candidate execution record. Then, based on the current refrigerant heat absorption capacity, it is determined whether the current heat exchange capacity meets the requirements corresponding to the flow rate regulation state of the chip under test. Finally, based on the equivalent thermal capacity of the chip under test, the urgency of the chip under test's temperature response to the flow rate change is determined. Through this process, the selection result of the candidate execution record is simultaneously constrained by the flow rate stability target, the current heat absorption capacity, and the thermal inertia of the chip under test.

[0053] In one embodiment, when the flow regulation state of the chip under test is in a safe boundary flow-increasing state, the candidate execution record screening prioritizes records that can cause the stable flow rate to form an increasing flow direction relative to the current flow rate. The screening also considers the current refrigerant's heat absorption capacity to determine whether this increasing flow direction can improve the heat transfer section's heat-carrying capacity after the total execution response time. If the thermal inertia state corresponding to the chip under test's equivalent heat capacity shows a sluggish temperature response, records with abrupt changes that do not match the current heat absorption capacity change are avoided during screening. If the thermal inertia state corresponding to the chip under test's equivalent heat capacity shows a sensitive temperature response, records that can form a stable flow increase within the allowable flow deviation threshold are prioritized during screening. This process does not set specific numerical levels but is determined by the matching relationship between the calibrated thermal inertia state and the stable flow rate in the candidate execution record list.

[0054] In one embodiment, when the flow rate regulation state of the chip under test is in the temperature difference suppression and flow increase state, the candidate execution record screening prioritizes records that can improve the heat-carrying capacity of the refrigerant flow equilibrium, and uses whether the temperature difference between multiple temperature measurement locations exceeds the temperature uniformity range as the screening direction. The current refrigerant heat absorption capacity is used to determine whether the existing heat-carrying capacity of the heat exchange section is insufficient, and the equivalent heat capacity of the chip under test is used to determine the degree of sluggishness of the overall temperature change of the chip under test during the temperature difference suppression process. Through this screening rule, the selected candidate execution record does not only pursue an increase in flow rate, but also ensures that the stable flow rate is consistent with the temperature difference suppression state, the current heat absorption capacity, and the thermal inertia of the chip under test.

[0055] In one embodiment, when the flow regulation state of the chip under test (DUT) is under test lower limit constraint, the candidate execution record screening avoids selecting records that would cause the DUT temperature to continue to deviate beyond the lower limit of the test temperature, and selects records from the candidate execution records whose stable flow rate matches the current refrigerant heat absorption capacity. If the current refrigerant heat absorption capacity is sufficient to maintain the predicted temperature above the lower limit of the test temperature, records that maintain or fine-tune the direction are preferentially selected during screening; if the current refrigerant heat absorption capacity is insufficient to maintain the safe space between the predicted temperature and the upper limit of the safe temperature, records with the flow increase direction but constrained by the lower limit of the test temperature are retained during screening. This process ensures that the test lower limit constraint state neither cancels flow regulation nor allows unconstrained flow increase.

[0056] In one embodiment, if no record simultaneously satisfies the matching rules of the flow regulation state of the chip under test, the current heat absorption capacity of the refrigerant, and the equivalent thermal capacity of the chip under test after screening the candidate execution records, no new selected candidate execution record is generated, and the current sampling period is marked as an unselected candidate execution record state. While in the unselected candidate execution record state, no new speed control pump speed command and proportional valve opening command are written to the corresponding register area. Instead, S2 to S4 are re-executed after re-acquiring the current temperature of the chip under test, the refrigerant temperature, and the current refrigerant flow rate in the next sampling period. This anomaly handling ensures that missing candidate records do not lead to unfounded pump and valve actions.

[0057] In this embodiment, S4 first generates the flow regulation state of the chip under test based on the temperature rise rate, total execution response time, lower limit of the test temperature, temperature uniformity range, and the current temperature of the chip under test. Then, candidate execution records are selected by screening candidate execution records, current refrigerant heat absorption capacity, and equivalent heat capacity of the chip under test. This ensures that the selection of pump valve commands is simultaneously constrained by safety boundaries, temperature difference suppression, test lower limit, current heat exchange capacity, and thermal inertia of the chip under test, thereby forming a refrigerant flow regulation path that matches the liquid cooling aging environment.

[0058] Please see Figure 1 and Figure 6 S5: Write the speed control pump speed command and proportional valve opening command from the selected candidate execution record into the corresponding register area, obtain the actual flow rate, and determine the refrigerant flow control result from the actual flow rate, stable flow rate, and flow allowable deviation.

[0059] The actual flow rate refers to the flow data output by the flow meter after the speed control pump speed command and proportional valve opening command are written, and is used to verify the execution effect. The refrigerant flow control result refers to the flow control confirmation status of this sampling period, which is determined by the actual flow rate, stable flow rate, and allowable flow deviation. The pump and valve execution command status refers to the execution status identifier formed after the speed control pump speed command and proportional valve opening command are written, which is used to indicate whether subsequent actual flow rate acquisition and flow deviation judgment can proceed.

[0060] In one embodiment, the process of writing the speed-regulating pump speed command and proportional valve opening command from the selected candidate execution record into the corresponding register area in S5 includes: reading the speed-regulating pump speed command, proportional valve opening command, and stable flow rate from the selected candidate execution record; writing the speed-regulating pump speed command into the pump driver control register area; and after confirming that the pump driver control register area has been completely written, writing the proportional valve opening command into the proportional valve controller opening register area, obtaining the writing completion flag, and generating the pump valve execution command status. This writing order ensures that the speed-regulating pump speed command first forms the basic flow driving condition, and then the proportional valve opening command forms the flow regulation coordination condition. The stable flow rate remains the target for subsequent flow rate verification during the writing process.

[0061] In one embodiment, if the pump driver control register has not generated a completion write confirmation, the proportional valve opening command will not be written further, and the current sampling period will be marked as a pump-side write unconfirmed state. If the pump driver control register has been written but the proportional valve controller opening register has not generated a write completion flag, the control result confirmation for actual flow and stable flow will not proceed, and the current sampling period will be marked as a valve-side write unconfirmed state. None of these states change the selected candidate execution records already filtered in S4; they are only used to limit whether the sampling period proceeds to flow control result confirmation.

[0062] In one embodiment, after generating the pump valve execution command status, the actual flow rate output by the flow meter is acquired according to the sampling interval, and the actual flow rate is compared with the stable flow rate. When the flow difference between the actual flow rate and the stable flow rate does not exceed the allowable flow deviation, the speed control pump speed command and the proportional valve opening command are maintained, and the pump valve execution command status is determined as the refrigerant flow control result. This process uses a textual execution rule for disclosure, that is, the stable flow rate is used as the target flow rate status of the selected candidate execution record, the actual flow rate is used as the flow rate status fed back by the flow meter after being written, and the allowable flow deviation is used as the boundary for determining whether the difference between the two is acceptable. When the allowable flow deviation is not exceeded, it means that the pump valve command corresponding to the selected candidate execution record has formed a control result consistent with the target stable flow rate.

[0063] In one embodiment, when the flow difference between the actual flow rate and the stable flow rate exceeds the allowable flow deviation, the current pump valve execution command state is not determined as a completed refrigerant flow control result. Instead, the actual flow rate, stable flow rate, allowable flow deviation, and write completion flag are retained as input states for reassessment in the next sampling cycle. If the allowable flow deviation judgment is still not met in the next sampling cycle, S2 to S4 are re-executed, and candidate execution records are re-selected based on the new current temperature of the chip under test, the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate. Through this process, mismatched control results will not be continuously used when the flow rate does not reach the stable target.

[0064] In one embodiment, after S5 determines the refrigerant flow control result, it records the current temperature of the chip under test (DUT), the previous sampling temperature, the refrigerant inlet temperature, the refrigerant outlet temperature, the current refrigerant flow rate, the current refrigerant heat absorption capacity, the total execution response time, the DUT flow adjustment status, the selected candidate execution record, the actual flow rate, and the refrigerant flow control result for the current sampling cycle. This record is used to read the previous sampling temperature in the next sampling cycle, maintain the previous valid state, and provide a traceable source of status when a candidate execution record is not selected, the pump-side write is not confirmed, the valve-side write is not confirmed, or the flow deviation is not met. The recorded content does not change the execution order of S1 to S5; it is only used to ensure data continuity between adjacent sampling cycles.

[0065] In this embodiment, the speed control pump speed command and the proportional valve opening command are written sequentially according to the selected candidate execution record by S5, and the refrigerant flow control result is confirmed by the actual flow rate, stable flow rate and flow allowable deviation. This makes the flow regulation not only stop at the candidate record screening stage, but also form a closed loop through writing confirmation and flow feedback. This enables the automatic adjustment of the refrigerant flow rate to be continuously executed according to the temperature state of the chip under test and the heat exchange state of the refrigerant in the liquid cooling aging environment.

[0066] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An automatic adjustment method for refrigerant flow rate in a liquid-cooled aging environment, characterized in that, Includes the following steps: The upper limit of the safe temperature of the chip under test, the lower limit of the test temperature, the sampling interval, the heat absorption capacity of the refrigerant volume, the internal volume of the heat exchange section tube, the response time of the speed regulating pump, the response time of the proportional valve, the equivalent heat capacity of the chip under test, the temperature uniformity range, the allowable deviation of the flow rate, and the candidate execution records are obtained. The candidate execution records include the speed regulating pump speed command, the proportional valve opening command, and the stable flow rate. The current temperature, previous sampling temperature, refrigerant inlet temperature, refrigerant outlet temperature, and current refrigerant flow rate of the chip under test are obtained according to the sampling interval. The temperature rise rate and remaining controllable time are calculated from the upper limit of the safe temperature of the chip under test, the current temperature of the chip under test, and the previous sampling temperature. The current heat absorption capacity of the refrigerant is calculated from the refrigerant outlet temperature, the refrigerant inlet temperature, the current refrigerant flow rate, and the refrigerant volume heat absorption capacity. The total execution response time is calculated from the internal volume of the heat exchange section pipe, the response time of the speed regulating pump, and the response time of the proportional valve. The flow regulation state of the chip under test is determined by the temperature rise rate, the total execution response time, the lower limit of the test temperature, the temperature uniformity range, and the current temperature of the chip under test. Candidate execution records are selected by filtering the candidate execution records, the current heat absorption capacity of the refrigerant, the equivalent heat capacity of the chip under test, and the flow regulation state of the chip under test. Write the speed control pump speed command and the proportional valve opening command from the selected candidate execution record into the corresponding register area, obtain the actual flow rate, and determine the refrigerant flow control result by the actual flow rate, the stable flow rate and the flow rate allowable deviation. The steps for obtaining the upper limit of safe temperature of the chip under test, the lower limit of test temperature, the sampling interval, the heat absorption capacity of the refrigerant volume, the internal volume of the heat exchange section tube, the response time of the speed-regulating pump, the response time of the proportional valve, the equivalent heat capacity of the chip under test, the temperature uniformity range, the allowable flow deviation, and the candidate execution record include: reading aging test task configuration data, extracting the upper limit of safe temperature of the chip under test, the lower limit of test temperature, the sampling interval, the temperature uniformity range, and the allowable flow deviation from the aging test task configuration data, obtaining the refrigerant density and the specific heat capacity of the refrigerant, calculating the heat absorption capacity of the refrigerant volume based on the refrigerant density and the specific heat capacity of the refrigerant, obtaining the heat exchange channel cross-sectional dimensions and the effective length of the heat exchange channel of the liquid-cooled heat exchange structure, and calculating the internal volume of the heat exchange section tube based on the heat exchange channel cross-sectional dimensions and the effective length of the heat exchange channel; Calibration commands are written to the speed-regulating pump and the proportional valve respectively. The pump and valve action time between the command writing time and the time when the refrigerant flow rate enters a stable state is recorded. The response time of the speed-regulating pump and the response time of the proportional valve are determined based on the pump and valve action time. The calibration heating power and calibration temperature rise curve of the chip under test are obtained. The equivalent heat capacity of the chip under test is calculated based on the calibration heating power and calibration temperature rise curve of the chip under test. The candidate execution record list that matches the aging test task configuration data is read, and the candidate execution record is obtained from the candidate execution record list.

2. The method for automatically adjusting the refrigerant flow rate in a liquid-cooled aging environment according to claim 1, characterized in that, The process of obtaining the candidate execution record includes: reading the speed command range that can be received by the speed regulating pump control register and the opening command range that can be received by the proportional valve controller opening register; comparing the speed regulating pump speed command in the candidate execution record with the speed command range; comparing the proportional valve opening command with the opening command range; retaining the records that fall within both the speed command range and the opening command range to obtain the candidate execution record.

3. The method for automatically adjusting the refrigerant flow rate in a liquid-cooled aging environment according to claim 1, characterized in that, The steps of obtaining the current temperature of the chip under test, the previous sampling temperature, the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate according to the sampling interval include: triggering temperature sampling at the temperature measurement position attached to the chip under test according to the sampling interval, obtaining the sensor output value and converting it into the current temperature of the chip under test, reading the temperature data cached at the previous sampling time and determining the previous sampling temperature, synchronously obtaining the inlet temperature sensor output value, the outlet temperature sensor output value, and the flow meter output value, and generating the refrigerant inlet temperature, the refrigerant outlet temperature, and the current refrigerant flow rate.

4. The method for automatically adjusting the refrigerant flow rate in a liquid-cooled aging environment according to claim 3, characterized in that, The process of calculating the temperature rise rate and remaining controllable time includes: comparing the current temperature of the chip under test with the previous sampling temperature and obtaining the sampling temperature difference; when the sampling temperature difference is not greater than zero, determining the temperature rise rate as zero and determining the remaining controllable time as the sampling interval; when the sampling temperature difference is greater than zero, calculating the temperature rise rate based on the sampling temperature difference and the sampling interval; and calculating the remaining controllable time based on the remaining temperature between the upper limit of the safe temperature of the chip under test and the current temperature of the chip under test, as well as the temperature rise rate.

5. The method for automatically adjusting the refrigerant flow rate in a liquid-cooled aging environment according to claim 1, characterized in that, The process of calculating the current heat absorption capacity of the refrigerant and the total execution response time includes: comparing the refrigerant outlet temperature with the refrigerant inlet temperature to obtain the refrigerant temperature rise value, and calculating the current heat absorption capacity of the refrigerant based on the refrigerant temperature rise value, the current flow rate of the refrigerant, and the volume heat absorption capacity of the refrigerant. The refrigerant delivery lag time is calculated based on the internal volume of the heat exchange section tube and the current flow rate of the refrigerant. The refrigerant delivery lag time, the speed regulating pump response time, and the proportional valve response time are added together to obtain the total execution response time.

6. The method for automatically adjusting the refrigerant flow rate in a liquid-cooled aging environment according to claim 1, characterized in that, The process of determining the flow regulation state of the chip under test includes: calculating the temperature increment during the execution response based on the temperature rise rate and the total execution response duration; merging the current temperature of the chip under test with the temperature increment during the execution response to obtain a predicted temperature; comparing the predicted temperature with the upper limit of the safe temperature of the chip under test and the lower limit of the test temperature; and comparing the temperature difference between the current temperatures of the chip under test at multiple temperature measurement locations with the temperature uniformity range to generate the flow regulation state of the chip under test.

7. The method for automatically adjusting the refrigerant flow rate in a liquid-cooled aging environment according to claim 6, characterized in that, The process of generating the flow regulation state of the chip under test includes: when the predicted temperature is not lower than the upper limit of the safe temperature of the chip under test, the flow regulation state of the chip under test is determined as a safe boundary flow boosting state; when the temperature difference between the current temperatures of the chip under test corresponding to multiple temperature measurement positions exceeds the temperature uniformity range, the flow regulation state of the chip under test is determined as a temperature difference suppression flow boosting state; when the predicted temperature is lower than the upper limit of the safe temperature of the chip under test but not lower than the lower limit of the test temperature, the flow regulation state of the chip under test is determined as a test lower limit constraint state.

8. The method for automatically adjusting the refrigerant flow rate in a liquid-cooled aging environment according to claim 1, characterized in that, The process of writing the speed control pump speed command and the proportional valve opening command from the selected candidate execution record into the corresponding register area includes: reading the speed control pump speed command, the proportional valve opening command and the stable flow rate from the selected candidate execution record; writing the speed control pump speed command into the pump driver control register area; and after confirming that the pump driver control register area has been written, writing the proportional valve opening command into the proportional valve controller opening register area; obtaining the writing completion flag; and generating the pump valve execution command status.

9. The method for automatically adjusting the refrigerant flow rate in a liquid-cooled aging environment according to claim 8, characterized in that, After generating the pump valve execution command status, the actual flow rate output by the flow meter is obtained according to the sampling interval. The actual flow rate is compared with the stable flow rate. When the flow rate difference between the actual flow rate and the stable flow rate does not exceed the allowable flow rate deviation, the speed control pump speed command and the proportional valve opening command are maintained, and the pump valve execution command status is determined as the refrigerant flow control result.

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