Wafer assembly stage

Abstract

This application provides a wafer assembly stage. Multiple friction pads, which work in conjunction with support components, are arranged on the stage body and elastically connected to the stage body via an elastic connection mechanism. This allows the friction pads to elastically displace during wafer compression, thereby adjusting the contact state between the wafer and the stage. This application transforms the support structure from a single rigid support to a composite support structure combining rigidity and flexibility. This ensures support stability while reducing localized stress concentration. Simultaneously, the elastic displacement allows the friction pads to adapt to differences in wafer surface morphology and thickness, improving contact uniformity. Furthermore, the friction pads provide adjustable contact pressure, shifting the contact from localized to surface contact, and reducing localized pressure while ensuring anti-slip properties. Therefore, this application achieves a synergistic balance between support stability and contact flexibility, making it suitable for thinner wafer support applications and improving reliability.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more particularly to a wafer assembly stage. Background Technology

[0002] In semiconductor manufacturing, wafers typically require support and positioning via a stage during thinning, handling, and subsequent processing. Especially after wafer thinning, the thickness is significantly reduced and rigidity weakened, making them susceptible to warping, deformation, or even breakage under external forces. Therefore, higher requirements are placed on the support structure and contact method of the stage.

[0003] In existing technologies, common wafer mounts primarily employ rigid support structures, such as directly supporting the wafer through multiple support points or surfaces. In this type of structure, the contact between the wafer and the mount is typically rigid, with a limited contact area, easily leading to stress concentration in localized areas and consequently damage to the thinned wafer. Furthermore, some mounts incorporate rubber pads or friction layers to increase friction and prevent wafer slippage; however, these structures are mostly fixed as a whole, lacking adaptive adjustment capabilities. When the wafer exhibits slight warping or uneven thickness, it is difficult to balance contact uniformity and support stability.

[0004] Furthermore, existing support stages often struggle to simultaneously meet the following requirements during the support process: on the one hand, they need to ensure the stable positioning of the wafer during processing to prevent slippage; on the other hand, they need to reduce contact stress and avoid local pressure damage, especially in wafer thinning scenarios, where the above contradictions are even more prominent. Summary of the Invention

[0005] The technical problem to be solved by this application is to provide a wafer assembly stage to solve the problems in the prior art where the wafer has a single contact method during the support process, which is prone to local stress concentration and makes it difficult to balance support stability and contact uniformity.

[0006] To address the aforementioned technical problems, this application provides a wafer assembly stage, including a stage body, wherein the stage body is provided with a plurality of support members for supporting wafers, the plurality of support members being slidably disposed along the axial direction of the stage body, and the plurality of support members being evenly spaced along the circumferential direction of the stage body; further comprising: Multiple friction pads are arranged in an array on the side of the stage body where the support member is located, for supporting the wafer together with the support member; An elastic connection mechanism is disposed between the friction plate and the platform body, and is used to elastically connect the friction plate to the platform body, so that the friction plate can generate elastic displacement relative to the platform body. An adjustment mechanism is used to drive the edge portion of the wafer away from the friction pad to form a press fit with the pressure ring, so as to limit the edge of the wafer and provide elastic support for the wafer in conjunction with the friction pad; The friction pad can generate elastic displacement relative to the stage body when the wafer is pressed, so as to adjust the contact state between the wafer and the stage body.

[0007] Optionally, the plurality of friction pads are evenly spaced along the circumference or radial direction of the platform body, and an interval region is formed between any two adjacent friction pads.

[0008] Optionally, the side of the friction pad facing the wafer is flush with or lower than the side of the support member facing the wafer.

[0009] Optionally, the friction pad includes: Matrix layer; An elastic buffer layer is disposed in the substrate layer; A microstructure layer is disposed on the side of the elastic buffer layer opposite to the substrate layer for bonding with the wafer.

[0010] Optionally, the microstructure layer has multiple protrusion structures or microgroove structures on the side facing the wafer.

[0011] Optionally, the friction plate is provided with a receiving cavity, the elastic connecting mechanism is received in the receiving cavity, and extends out of the receiving cavity to connect with the platform body.

[0012] Optionally, the resilient connection mechanism includes: An elastic sheet, one end of which is connected to the accommodating cavity, and the other end of which is connected to the stage body.

[0013] Optionally, the resilient connection mechanism includes: Guide component, connected to the platform body; A spring is sleeved on the outside of the guide member, with one end of the spring connected to the receiving cavity and the other end of the spring connected to the platform body.

[0014] Optionally, it further includes an adjustment mechanism, the adjustment mechanism comprising: The drive motor is equipped with a drive screw. A wedge-shaped transmission component is threadedly connected to the drive screw and located inside the platform body. The wedge-shaped transmission component moves radially along the platform body under the drive of the drive screw, and the wedge-shaped transmission component is provided with an inclined surface structure. The top plate slides relative to the stage body along the axial direction of the stage body and cooperates with the inclined structure. The top plate is connected to the side of the friction pad away from the wafer. The elastic connection mechanism is located between the top plate and the friction plate.

[0015] Optionally, a roller is rotatably connected to the side of the top plate away from the friction plate, and the roller is in rolling engagement with the inclined structure.

[0016] The beneficial effects of this application are as follows: Compared with the prior art, this application sets multiple friction pads that work in conjunction with the support members on the stage body, and elastically connects the friction pads to the stage body through an elastic connection mechanism. This allows the friction pads to generate elastic displacement during wafer compression, thereby adjusting the contact state between the wafer and the stage. This application uses multiple friction pads and the support members to jointly support the wafer, transforming the wafer from a single rigid support to a rigid-flexible combined support structure during stress, ensuring support stability while reducing local stress concentration. Simultaneously, the elastic connection mechanism allows the friction pads to generate elastic displacement relative to the stage body, enabling them to adaptively adjust according to the wafer surface during compression, improving the fit between the wafer and the stage and enhancing contact uniformity. Furthermore, the friction pads provide adjustable contact pressure when in contact with the wafer, shifting the contact between the wafer and the stage from localized contact to a more uniform surface contact, and reducing localized pressure on the wafer while ensuring friction to prevent slippage. Therefore, this application can achieve a synergistic balance between support stability and contact flexibility during wafer support, and is particularly suitable for support applications of thinned wafers, effectively reducing the risk of wafer damage and improving the reliability of the processing. Attached Figure Description

[0017] Figure 1 A schematic diagram of the circular assembly platform provided in this application; Figure 2 This is a schematic diagram of the structure of a spring-loaded connecting mechanism provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a spring-loaded connecting mechanism provided in another embodiment of this application; Figure 4 This is a schematic diagram showing the positional relationship between the support member and the friction plate according to another embodiment of this application; Figure 5 This is a schematic diagram of the structure of the friction plate provided in this application; Figure 6 This is a schematic diagram of the adjustment mechanism provided in this application.

[0018] Explanation of reference numerals in the attached figures: 10. Platform body; 11. Support component; 20. Friction plate; 21. Base layer; 211. Receiving cavity; 22. Elastic buffer layer; 23. Microstructure layer; 231. Protruding structure; 30. Elastic connection mechanism; 31. Elastic plate; 32. Guide component; 33. Spring; 40. Adjustment mechanism; 41. Drive component; 42. Wedge-shaped transmission component; 421. Inclined surface structure; 422. Guide protrusion; 43. Top plate; 44. Lead screw; 45. Guide groove; 46. Roller. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this application pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0020] Furthermore, it should be understood that the orientations or positional relationships indicated by terms such as "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" in this document are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first" and "second" in this document are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0021] Please refer to the following: Figures 1 to 6 The wafer assembly stage provided in this application will now be described.

[0022] To address the problems existing in the prior art, embodiments of this application provide a wafer assembly stage. Please refer to [link to relevant documentation]. Figures 1 to 4The wafer assembly stage includes a stage body 10, which is provided with a plurality of support members 11 for supporting wafers. The plurality of support members 11 are slidably arranged along the axial direction of the stage body 10 and are evenly spaced along the circumference of the stage body 10. It also includes a plurality of friction pads 20 and an elastic connection mechanism 30.

[0023] Multiple friction pads 20 are arranged in an array on the side of the stage body 10 where the support member 11 is located, and are used together with the support member 11 to support the wafer. An elastic connection mechanism 30 is disposed between the friction pads 20 and the stage body 10, and is used to elastically connect the friction pads 20 to the stage body 10, allowing the friction pads 20 to elastically displace relative to the stage body 10. Specifically, when the wafer is pressed and in contact with the friction pads 20, the contact pressure between the wafer and the stage body 10 is adjusted by the contact pressure of the friction pads 20.

[0024] Specifically, the stage body 10 serves as the basic structure for supporting the wafer, and multiple support members 11 are provided on it for supporting the wafer. The multiple support members 11 are slidably arranged relative to the stage body 10 along the axial direction of the stage body 10, so that the support members 11 can move in the axial direction of the stage body 10 to separate the wafer from the stage body 10, which facilitates the picking and placing of the wafer by the robot arm. At the same time, the multiple support members 11 are evenly spaced along the circumference of the stage body 10, so that the support points form a uniformly distributed support layout in the circumferential direction, thereby improving the balance of wafer support.

[0025] The stage body 10 is provided with multiple friction pads 20, which are arranged in an array on the side of the stage body 10 where the support member 11 is located. The multiple friction pads 20 and the multiple support members 11 jointly support the wafer, so that the wafer can be simultaneously supported by the support member 11 and contacted by the friction pads 20 when under load. Thus, the wafer is synergistically supported by the support member 11 and the friction pads 20 through their cooperative action.

[0026] Furthermore, the friction pad 20 is disposed between the stage body 10 and the friction pad 20 via an elastic connection mechanism 30. The elastic connection mechanism 30 is used to elastically connect the friction pad 20 to the stage body 10, allowing the friction pad 20 to elastically displace relative to the stage body 10. Therefore, when the wafer comes into contact with and is pressed against the friction pad 20, the friction pad 20 can undergo a slight displacement under the action of the elastic connection mechanism 30, thus giving its contact state with the wafer a certain degree of adaptive adjustment capability.

[0027] During the process of the wafer being pressed and coming into contact with the friction pad 20, the friction pad 20 adjusts the overall contact state between the wafer and the stage body 10 through the contact pressure formed between it and the wafer. Specifically, through the elastic deformation and displacement of the friction pad 20, the contact between the wafer and the stage body 10 gradually transitions from an initial local contact to a relatively uniform contact state, thereby improving the force distribution of the wafer during the support process.

[0028] Through the above structural cooperation, the support member 11 and the friction plate 20 form a synergistic relationship during the wafer support process: the support member 11 provides basic support and positioning, and the friction plate 20 provides contact adjustment and pressure buffering. The two work together on the wafer, thereby ensuring the stability of wafer support while achieving adaptive adjustment of the contact state.

[0029] The adjustment mechanism 40 is used to drive the edge of the wafer away from the friction plate 20 to form a press fit with the pressure ring, so as to limit the edge of the wafer and provide elastic support for the wafer in conjunction with the friction plate 20, thereby improving the positioning stability of the wafer during the processing, reducing the risk of wafer slippage, and improving the contact uniformity between the wafer and the stage.

[0030] Compared with the prior art, this application provides multiple friction pads 20 that work in conjunction with the support member 11 on the stage body 10, and elastically connects the friction pads 20 to the stage body 10 through the elastic connection mechanism 30, so that the friction pads 20 can generate elastic displacement during the wafer being pressed, thereby adjusting the contact state between the wafer and the stage. This application utilizes multiple friction pads 20 and a support member 11 to jointly support the wafer, transforming the wafer support from a single rigid structure to a composite support structure combining rigidity and flexibility during stress. This ensures support stability while reducing localized stress concentration. Simultaneously, the elastic connection mechanism 30 allows the friction pads 20 to elastically displace relative to the stage body 10, enabling them to adaptively adjust according to differences in wafer surface morphology or thickness during wafer compression, thus improving the fit between the wafer and the stage and enhancing contact uniformity. Furthermore, the friction pads 20 provide adjustable contact pressure when in contact with the wafer, shifting the contact between the wafer and the stage from localized to more uniform surface contact. This reduces localized pressure on the wafer while maintaining friction to prevent slippage, thereby addressing both anti-slip and stress relief requirements. Therefore, this application achieves a synergistic balance between support stability and contact flexibility during wafer support, making it particularly suitable for wafer thinning applications, effectively reducing wafer damage risk and improving process reliability.

[0031] It should be noted that, in this embodiment, the friction pads 20 are connected to the stage body 10 via the elastic connection mechanism 30 and act together with the support member 11 on the wafer surface, thereby adjusting the contact state of the wafer. Specifically, multiple friction pads 20 participate in contact during the wafer being pressed, gradually expanding the effective contact area between the wafer and the stage from initial point or line contact to surface contact, thereby increasing the actual bearing area. At the same time, the friction pads 20 can undergo elastic displacement under the action of the elastic connection mechanism 30, giving them buffering and adaptive adjustment capabilities for the force applied to the wafer, thus making the contact pressure distribution between the wafer and the stage more uniform and reducing local stress concentration. Furthermore, the elastic displacement and multi-point distributed friction pad structure of the friction pads 20 help improve the fit between the wafer and the stage, reducing the generation of local gaps or suspended areas. In addition, the contact interface formed between the friction pads 20 and the wafer can provide stable friction, thereby improving the wafer's anti-slip capability during support or movement.

[0032] In this application, a plurality of friction pads 20 are evenly spaced along the circumference or radial direction of the platform body 10, and an interval region is formed between any two adjacent friction pads 20.

[0033] In one embodiment of this application, please refer to Figure 1 Multiple friction pads 20 are evenly spaced along the circumference of the platform body 10 and distributed in multiple rings on the surface of the platform body 10, so that the multiple friction pads 20 form a covering array structure on the surface of the platform body 10. The friction pads 20 in each ring are arranged sequentially in the radial direction, with different rings spaced apart in the radial direction. The friction pads 20 in the same ring are evenly distributed in the circumference, so that the multiple friction pads 20 form a continuous partitioned support area on the surface of the platform body 10.

[0034] Through the above-mentioned multi-ring distributed friction pads 20 structure, the wafer can obtain relatively uniform contact support in both the radial and circumferential directions during the contact process with the stage body 10. The support areas cooperate with each other to ensure the overall support coverage while maintaining the independent adjustment capability of each local contact area, thereby improving the contact uniformity between the wafer and the stage and the overall force distribution.

[0035] In another embodiment of this application, a plurality of friction pads 20 are evenly spaced along the radial direction of the platform body 10 and are arranged in multiple rows along the radial direction on the surface of the platform body 10, so that the plurality of friction pads 20 form a radial array-type covering structure on the surface of the platform body 10. Each row of friction pads 20 is arranged sequentially along the radial direction, with a gap region formed between adjacent rows of friction pads 20 in the radial direction, while each friction pad 20 in the same row is evenly distributed in the circumferential direction, thereby forming a covering support layout of friction pads 20 on the surface of the platform body 10.

[0036] By using the aforementioned radial array arrangement, the wafer can form a hierarchical support and layer-by-layer contact structure in the radial direction during the contact process with the stage body 10. Each radially arranged friction pad 20 can participate in different degrees of contact adjustment during the wafer being pressed, thereby gradually transitioning the contact between the wafer and the stage from local concentrated contact to distributed contact, so as to improve the uniformity of contact pressure distribution in the radial direction and enhance the overall wafer bonding effect and support stability.

[0037] A gap is formed between any two adjacent friction pads 20 to avoid a continuous rigid connection between them. This allows each friction pad 20 to undergo relatively independent elastic deformation and displacement during wafer compression, thereby improving the overall contact compliance and self-adaptability. Simultaneously, the gap provides spatial compensation for the deformation of the friction pads 20 under stress, ensuring that the compressive deformation of a single friction pad 20 is not constrained by adjacent friction pads 20. This allows each contact point to adjust independently according to local wafer morphology differences, improving the bonding consistency between the wafer and the stage. Furthermore, by setting a gap between adjacent friction pads 20, the additional stress caused by mutual compression or interference between the friction pads 20 can be reduced, making the contact pressure more dispersed and uniform, thereby reducing the risk of local stress concentration and improving the stability and reliability of the wafer during support.

[0038] In this application, the side of the friction pad 20 facing the wafer is flush with or lower than the side of the support 11 facing the wafer.

[0039] In one embodiment of this application, please refer to Figure 2 and Figure 3 The side of the friction plate 20 facing the wafer is flush with the side of the support member 11 facing the wafer. That is, the side of the friction plate 20 facing the wafer and the side of the support member 11 facing the wafer are located on the same plane. By aligning the side of the friction plate 20 facing the wafer with the side of the support member 11 facing the wafer, the friction plate 20 and the support member 11 are at the same contact height reference plane when the wafer is not under pressure or in initial contact. This allows the wafer to simultaneously or nearly synchronously contact the support member 11 and the friction plate 20 during the descent contact process. Therefore, during wafer pressure, the support member 11 and the friction plate 20 can jointly participate in supporting the wafer, distributing the wafer load between the support member 11 and the friction plate 20, avoiding a single structure bearing the contact load, and thus reducing localized contact pressure concentration. Meanwhile, by aligning the side of the friction pad 20 facing the wafer with the side of the support 11 facing the wafer, the initial contact uniformity between the wafer and the stage is improved, so that the wafer forms a relatively stable force distribution state in the initial contact stage, thereby improving the overall wafer bonding effect and support stability.

[0040] In another embodiment of this application, please refer to Figure 4 The side of the friction pad 20 facing the wafer is lower than the side of the support member 11 facing the wafer. This height difference allows the support member 11 to preferentially contact the wafer and bear the initial support load during the wafer's descent, while the friction pad 20 gradually participates in contact as the wafer continues to be compressed or deformed, thus making the contact process between the wafer and the stage exhibit a staged contact characteristic.

[0041] Specifically, during the initial wafer contact stage, the support member 11 provides primary support and positioning for the wafer to ensure its overall stability. As the wafer is further compressed or undergoes minor deformation, the friction pad 20 gradually contacts the wafer and participates in load sharing, thereby compensating for and adjusting the local stress state of the wafer. This allows the contact load on the wafer to gradually transition from initial concentrated support to a state shared by the support member 11 and the friction pad 20, reducing instantaneous contact impact and localized stress concentration on the wafer. Simultaneously, this structural design also enables the friction pad 20 to provide additional contact adjustment during wafer bonding, improving the uniformity of bonding between the wafer and the stage, and enhancing the overall stability and reliability of the support process.

[0042] In some embodiments of this application, please refer to Figure 5 The friction pad 20 includes a substrate layer 21, an elastic buffer layer 22, and a microstructure layer 23. The elastic buffer layer 22 is disposed on the substrate layer 21, and the microstructure layer 23 is disposed on the side of the elastic buffer layer 22 opposite to the substrate layer 21, for bonding with the wafer.

[0043] The substrate layer 21 is used to connect with the stage body 10 to ensure the overall installation strength and structural stability of the friction pad 20. In the clean environment of semiconductor wafer processing, the substrate layer 21 is preferably made of a material with low particle generation and low precipitation characteristics, such as stainless steel, aluminum alloy, or PEEK or PPS engineering-grade polymer materials, to meet the structural stability and cleanliness requirements during long-term use.

[0044] An elastic buffer layer 22 is disposed between the substrate layer 21 and the microstructure layer 23. During wafer compression, it works in conjunction with the elastic connection mechanism 30 to further provide elastic deformation capability and load buffering, allowing the contact pressure acting on the wafer to be dispersed and absorbed, thereby reducing localized stress concentration. The elastic buffer layer 22 is preferably made of a low-volatility, low-exudation elastic material that meets the requirements of semiconductor clean environments, such as fluorosilicone rubber, low-volatility silicon-based elastomers, or other polymeric elastic materials with cleanliness level compatibility, to avoid the risk of wafer contamination.

[0045] The microstructure layer 23 is disposed on the side of the elastic buffer layer 22 opposite to the substrate layer 21 and is used for direct contact with the wafer to regulate the wafer contact interface through its surface microstructure. The microstructure layer 23 is preferably made of a material with wear resistance, structure retention capability and low pollution properties, such as PEEK material or polyimide (PI material), and its surface can be structurally shaped or stabilized as needed to ensure the stability of the microstructure under long-term contact and cyclic loading.

[0046] By adopting the above structure and materials, the friction plate 20 can meet the requirements of cleanliness, low pollution and stable contact performance in the semiconductor wafer processing process while having structural support and elastic buffering capabilities, thereby ensuring the reliability of the wafer support process.

[0047] In this application, the microstructure layer 23 has a plurality of protrusion structures 231 or microgroove structures on the side facing the wafer.

[0048] In one embodiment of this application, please refer to Figure 5 The microstructure layer 23 has multiple protrusions 231 on the side facing the wafer. The multiple protrusions 231 are arranged in an array along the surface of the microstructure layer 23 so that the side of the microstructure layer 23 facing the wafer forms an undulating contact interface.

[0049] Specifically, the protrusion structure 231 forms multiple independent contact points or contact areas, transforming the contact between the wafer and the microstructure layer 23 from a continuous surface contact to a multi-point contact consisting of multiple dispersed contact points. When the wafer contacts and is pressed by the friction pad 20, each protrusion structure 231 undergoes compression deformation under the cooperation of the elastic buffer layer 22, thereby dispersing and regulating the local contact pressure and distributing the load acting on the wafer surface among multiple contact points.

[0050] Through the above structural arrangement, a distributed contact relationship is formed between the wafer and the friction pad 20, thereby increasing the effective contact area between the wafer and the microstructure layer 23 and improving the overall bonding uniformity. At the same time, the elastic deformation of each protrusion structure 231 can buffer and homogenize the local contact pressure, reducing local stress concentration. In addition, since the contact interface is transformed from a continuous surface contact to a discrete contact point structure, the local suspension phenomenon caused by the difference in surface micromorphology can be released to a certain extent, improving the interface bonding reliability. Furthermore, the micro gaps formed between each protrusion structure 231 help to adjust the friction state of the contact interface, so that the wafer maintains relatively stable friction characteristics during force or movement, thereby reducing the risk of slippage.

[0051] In this application, please refer to Figure 5The friction plate 20 is provided with a receiving cavity 211, the elastic connecting mechanism 30 is housed in the receiving cavity 211, and extends out of the receiving cavity 211 to connect with the platform body 10.

[0052] Specifically, a receiving cavity 211 is disposed in the substrate layer 21. The receiving cavity 211 has an opening located on the side of the substrate layer 21 facing the stage body 10. The receiving cavity 211 is formed by an inward recess from the interior of the substrate layer 21 to accommodate the elastic connecting mechanism 30, so that the elastic connecting mechanism 30 can be partially housed inside the substrate layer 21, and the elastic connecting mechanism 30 can extend to the outside of the substrate layer 21 through the opening and connect with the stage body 10, thereby forming an elastic connection relationship between the friction plate 20 and the stage body 10.

[0053] In one embodiment of this application, please refer to Figure 2 The elastic connection mechanism 30 includes an elastic sheet 31, one end of which is connected to the accommodating cavity 211, and the other end of which is connected to the stage body 10.

[0054] The elastic sheet 31 is a connecting member capable of generating elastic deformation. One end of it is fixed inside the accommodating cavity 211 to form a connection with the friction sheet 20; the other end extends to the outside of the accommodating cavity 211 and is fixedly connected to the platform body 10, thereby forming an elastic connection between the friction sheet 20 and the platform body 10.

[0055] When the wafer contacts the friction pad 20 and a pressing action is generated, the elastic pad 31 can undergo elastic deformation under stress, causing the friction pad 20 to undergo slight displacement or attitude adjustment relative to the stage body 10, thereby buffering and adjusting the contact pressure between the wafer and the stage.

[0056] In another embodiment of this application, please refer to Figure 3 and Figure 4 The elastic connection mechanism 30 includes a guide member 32 and a spring 33. The guide member 32 is connected to the platform body 10. The spring 33 is sleeved on the outside of the guide member 32, and one end of the spring 33 is connected to the receiving cavity 211, while the other end of the spring 33 is connected to the platform body 10.

[0057] Specifically, the guide member 32 is fixedly mounted on the platform body 10 along the axial direction and is coaxially arranged with the spring 33. The spring 33 is sleeved on the outside of the guide member 32 so that the guide member 32 guides and limits the radial position and axial compression path of the spring 33. When the spring 33 is in its natural state, its axial length is greater than the axial length of the guide member 32, so that the spring 33 at least partially extends out of the end region of the guide member 32.

[0058] When the wafer contacts the friction pad 20 and a pressing action is generated, the spring 33 undergoes elastic compression deformation under axial compression and is stably deformed along the axial direction under the guidance of the guide 32, thereby preventing the spring 33 from deflecting, bending or becoming unstable, so that the friction pad 20 can generate a stable and controllable elastic displacement relative to the platform body 10, so as to achieve buffering and adjustment of the wafer contact pressure.

[0059] For some examples in this application, please refer to Figure 6 The adjustment mechanism 40 includes a drive component 41, a wedge-shaped transmission component 42, and a top plate 43.

[0060] The wedge-shaped transmission component 42 is slidably disposed on the stage body 10 along the radial direction and has an inclined surface structure 421. The top plate 43 slides relative to the stage body 10 along the axial direction and cooperates with the inclined surface structure 421. The top plate 43 is connected to the side of the friction plate 20 opposite to the wafer. The elastic connection mechanism 30 is located between the top plate 43 and the friction plate 20.

[0061] The wedge-shaped transmission member 42 is slidably disposed within the platform body 10 along the radial direction and has an inclined surface structure 421 extending along the radial direction of the platform body 10. The driving member 41 is used to drive the wedge-shaped transmission member 42 to move radially, thereby changing the position of the inclined surface structure 421.

[0062] The top plate 43 is slidably disposed relative to the stage body 10 along the axial direction and cooperates with the inclined surface structure 421 of the wedge-shaped transmission member 42, so that the radial movement of the wedge-shaped transmission member 42 is converted into the axial lifting movement of the top plate 43. The top plate 43 is connected to the side of the friction plate 20 opposite to the wafer, and is used to transmit the axial displacement of the top plate 43 to the elastic connection mechanism 30 and the friction plate 20.

[0063] During the contact process between the wafer and the friction plate 20, the drive component 41 drives the wedge-shaped transmission component 42 to move, causing the top plate 43 to undergo axial displacement, which further drives the friction plate 20 to move towards or away from the wafer, thereby adjusting the contact pressure of the friction plate 20 on the wafer. Using the above technical solution, by setting the adjustment mechanism 40, the contact height and pressure of the friction plate 20 can be controllably adjusted.

[0064] In this application, the driving component 41 is a servo motor, and the driving component 41 is fixedly connected to the platform body 10, and the driving component 41 drives the wedge-shaped transmission component 42 through the lead screw 44.

[0065] Specifically, the output end of the drive unit 41 is connected to the lead screw 44, which in turn engages with the wedge-shaped transmission component 42 to convert the rotational motion of the drive unit 41 into linear motion of the wedge-shaped transmission component 42 along the radial direction of the stage body 10, thereby adjusting the position of the wedge-shaped transmission component 42. During the contact process between the wafer and the friction plate 20, by controlling the rotation of the drive unit 41, the contact height and pressure of the friction plate 20 relative to the stage body 10 can be precisely adjusted, thereby changing the contact pressure state between the wafer and the stage.

[0066] In one embodiment of this application, the wedge-shaped transmission member 42 is slidably connected to the platform body 10 via a guide structure.

[0067] The guide structure is used to constrain the motion trajectory of the wedge-shaped transmission component 42 during radial movement, so that the wedge-shaped transmission component 42 can slide stably along the preset radial direction, thereby avoiding deflection, jamming or attitude deviation.

[0068] In one embodiment, the guide structure includes a guide groove 45 disposed in the platform body 10 and a guide protrusion 422 that cooperates with the wedge-shaped transmission member 42. The guide groove 45 extends in the radial direction, and the guide protrusion 422 is slidably fitted in the guide groove 45 to limit the movement direction of the wedge-shaped transmission member 42.

[0069] By setting up the above-mentioned guiding structure, when the wedge-shaped transmission component 42 moves radially under the action of the drive component 41 and the lead screw 44, its movement path is effectively constrained, thereby ensuring the stability and repeatability of displacement during the wedge transmission process, thereby improving the accuracy of the axial displacement from the wedge-shaped transmission component 42 to the top plate 43, and improving the control reliability of the overall adjustment mechanism 40.

[0070] In one embodiment of this application, a roller 46 is rotatably connected to the side of the top plate 43 away from the friction plate 20. That is, the part of the top plate 43 that mates with the inclined surface structure 421 on the wedge-shaped transmission member 42 is rotatably connected to the roller 46, and the roller 46 and the inclined surface structure 421 are in rolling contact.

[0071] Specifically, the roller 46 is positioned on the side of the top plate 43 facing the wedge-shaped transmission member 42 and located in the contact area corresponding to the inclined structure 421. The roller 46 can rotate around its own axis, so that when the wedge-shaped transmission member 42 moves radially, the roller 46 rolls along the inclined structure 421. By replacing the original sliding contact with rolling contact, the friction mode between the top plate 43 and the wedge-shaped transmission member 42 is changed from sliding friction to rolling friction, thereby reducing contact resistance and the wear of the mating surfaces. At the same time, the roller 46 enables the wedge-shaped transmission member 42 to convert radial displacement into axial displacement of the top plate 43 during the driving process, thereby improving the smoothness of displacement transmission.

[0072] The above are merely specific embodiments of this application, but the protection scope of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the scope of the claims.

Claims

1. A wafer assembly stage, comprising a stage body, wherein the stage body is provided with a plurality of support members for supporting wafers, the plurality of support members being slidably disposed along the axial direction of the stage body, and the plurality of support members being uniformly spaced along the circumferential direction of the stage body; characterized in that, Also includes: Multiple friction pads are arranged in an array on the side of the stage body where the support member is located, for supporting the wafer together with the support member; An elastic connection mechanism is disposed between the friction plate and the platform body, and is used to elastically connect the friction plate to the platform body, so that the friction plate can generate elastic displacement relative to the platform body. An adjustment mechanism is used to drive the edge portion of the wafer away from the friction pad to form a press fit with the pressure ring, so as to limit the edge of the wafer and provide elastic support for the wafer in conjunction with the friction pad; The friction pad can generate elastic displacement relative to the stage body when the wafer is pressed, so as to adjust the contact state between the wafer and the stage body.

2. The wafer assembly stage according to claim 1, characterized in that, The plurality of friction pads are evenly spaced along the circumference or radial direction of the platform body, and an interval region is formed between any two adjacent friction pads.

3. The wafer assembly stage according to claim 2, characterized in that, The side of the friction pad facing the wafer is flush with or lower than the side of the support member facing the wafer.

4. The wafer assembly stage according to claim 1, characterized in that, The friction pad includes: Matrix layer; An elastic buffer layer is disposed in the substrate layer; A microstructure layer is disposed on the side of the elastic buffer layer opposite to the substrate layer for bonding with the wafer.

5. The wafer assembly stage according to claim 4, characterized in that, The microstructure layer has multiple protrusions or microgrooves on the side facing the wafer.

6. The wafer assembly stage according to claim 1, characterized in that, The friction plate is provided with a receiving cavity, the elastic connecting mechanism is housed in the receiving cavity, and extends out of the receiving cavity to connect with the platform body.

7. The wafer assembly stage according to claim 6, characterized in that, The elastic connection mechanism includes: An elastic sheet, one end of which is connected to the accommodating cavity, and the other end of which is connected to the stage body.

8. The wafer assembly stage according to claim 6, characterized in that, The elastic connection mechanism includes: Guide component, connected to the platform body; A spring is sleeved on the outside of the guide member, with one end of the spring connected to the receiving cavity and the other end of the spring connected to the platform body.

9. The wafer assembly stage according to claim 1, characterized in that, The adjustment mechanism includes: The drive motor is equipped with a drive screw. A wedge-shaped transmission component is threadedly connected to the drive screw and located inside the platform body. The wedge-shaped transmission component moves radially along the platform body under the drive of the drive screw, and the wedge-shaped transmission component is provided with an inclined surface structure. The top plate slides relative to the stage body along the axial direction of the stage body and cooperates with the inclined structure. The top plate is connected to the side of the friction pad away from the wafer. The elastic connection mechanism is located between the top plate and the friction plate.

10. The wafer assembly stage according to claim 9, characterized in that, The top plate is rotatably connected to a roller on the side away from the friction plate, and the roller is in rolling engagement with the inclined structure.

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