A heat dissipation device

Abstract

The application relates to a heat dissipation device, which comprises a micro-channel layer, a first manifold layer, a second manifold layer and a third manifold layer arranged in layers from bottom to top. When the local heat power on the chip is increased, the cooling liquid flow at the position can be adaptively increased to improve the heat dissipation efficiency at the position and match the increased heat power; when the local heat power on the chip is decreased, the cooling liquid flow at the position is adaptively decreased, so that the cooling liquid is more concentrated to flow to other positions with higher temperatures. Thus, the heat dissipation effect obtained by each position on the chip can better match the actual temperature of each position, so that the heat dissipation effect obtained by the whole chip is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of chip heat dissipation, and in particular to a heat dissipation device. Background Technology

[0002] With the rapid development of AI technology, chip power and surface heat flux are increasing. To ensure chip performance, the requirements for heat dissipation are also becoming more stringent. In actual chip operation, the actual operating power varies at different locations on the chip surface, resulting in different heat dissipation requirements for different locations. Furthermore, these differences change as the chip's operating state changes.

[0003] For existing heat sinks, the distribution of internal coolant channels or fins is relatively uniform, so the heat dissipation efficiency for different parts of the chip is generally consistent. This inevitably leads to poor heat dissipation in some parts of the chip. Summary of the Invention

[0004] Therefore, it is necessary to provide a heat dissipation device to address the problem of insufficient heat dissipation in localized areas of the chip.

[0005] A heat dissipation device includes a microchannel layer, a first manifold layer, a second manifold layer and a third manifold layer arranged in layers from bottom to top;

[0006] The upper surface of the microchannel layer is provided with at least two heat dissipation channels, which extend along a first direction and are arranged side by side and spaced apart in a second direction, wherein the second direction is perpendicular to the first direction.

[0007] The first manifold layer is provided with at least two first distribution channels and at least two second distribution channels. The first distribution channels and the second distribution channels extend along a second direction. The first distribution channels and the second distribution channels are staggered and spaced apart in a first direction. Each heat dissipation channel connects at least two first distribution channels and at least one second distribution channel.

[0008] The second manifold layer is made of a thermosensitive metal, and a first jet hole and a second jet hole are provided on the second manifold layer, with the first jet hole and the second jet hole extending along a second direction;

[0009] Each of the first distribution channels corresponds to at least one first jet orifice, and the first distribution channel is connected to the corresponding first jet orifice; each of the second distribution channels corresponds to at least one second jet orifice, and the second distribution channel is connected to the corresponding second jet orifice.

[0010] The third manifold layer includes a frame and a barrier rib. The two ends of the barrier rib are fixed to the inner edge of the frame to divide the inner side of the frame into an inlet area and an outlet area. The first jet hole is connected to the inlet area, and the second jet hole is connected to the outlet area.

[0011] In some embodiments of this application, the second manifold layer partially blocks the first distribution channel so that the second manifold layer is isolated between the first distribution channel and the liquid outlet area.

[0012] In some embodiments of this application, the second manifold layer partially blocks the second distribution channel so that the second manifold layer is isolated between the second distribution channel and the liquid inlet area.

[0013] In some embodiments of this application, the heat dissipation device further includes a cover plate, on which a liquid inlet and a liquid outlet are provided. The liquid inlet and the liquid outlet extend along a first direction and are arranged side by side in a second direction.

[0014] The barrier ribs are S-shaped, and the cover plate covers the barrier ribs so that the liquid inlet is connected to the liquid inlet area and the liquid outlet is connected to the liquid outlet area.

[0015] In some embodiments of this application, the heat dissipation device further includes a sealing cover, on the side wall of which a liquid inlet and a liquid outlet are provided. The sealing cover is disposed on the cover plate so that the liquid inlet is connected to the liquid inlet and the liquid outlet is connected to the liquid outlet.

[0016] In some embodiments of this application, each of the heat dissipation channels connects all the first distribution channels and all the second distribution channels.

[0017] In some embodiments of this application, each of the first distribution channels corresponds to at least two of the first jet holes.

[0018] In some embodiments of this application, each of the second distribution channels corresponds to at least two second jet holes.

[0019] In some embodiments of this application, the second manifold layer is pressed between the third manifold layer and the first manifold layer.

[0020] In some embodiments of this application, the first jet hole and the second jet hole are located in the middle of the second manifold layer, the edge of the second manifold layer is fixed to the edge of the first manifold layer, and the edge of the second manifold layer is fixed to the edge of the third manifold layer.

[0021] The beneficial effects of this invention are as follows:

[0022] The portion of the heat dissipation channel that connects to the first distribution channel is the liquid inlet, and the portion of the heat dissipation channel that connects to the second distribution channel is the liquid outlet.

[0023] The coolant flows from the inlet section to each of the first jet holes, and then flows into the corresponding first distribution channel through the first jet holes. Each first distribution channel will distribute the coolant to the corresponding inlet position in each heat dissipation channel. The coolant will flow from the inlet position to the adjacent outlet position, and then flow back to the corresponding second distribution channel. After that, it will flow to the second jet hole and the outlet area in sequence to be discharged, thus completing the coolant circulation.

[0024] When the heat distribution on the chip changes, heat conduction causes deformation of the sidewalls of the first and second jet orifices, altering their dimensions. This, in turn, changes the coolant flow rate in the first and second distribution channels, further altering the coolant flow rate between adjacent inlet and outlet points within the heat dissipation channels. Consequently, the heat dissipation power at corresponding locations on the chip is adaptively adjusted. Specifically, when the local heat output on the chip increases, the coolant flow rate at that location increases accordingly, improving the heat dissipation efficiency to match the increased heat output. Conversely, when the local heat output decreases, the coolant flow rate at that location decreases, causing the coolant to flow more concentratedly to other higher-temperature areas. This allows the heat dissipation effect at each location on the chip to better match the actual temperature at that location, effectively improving the overall heat dissipation performance of the chip. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the heat dissipation device in an embodiment of the present invention;

[0026] Figure 2 This is a three-dimensional structural diagram of the cover plate in an embodiment of the present invention;

[0027] Figure 3 This is a three-dimensional structural diagram of the third manifold layer in an embodiment of the present invention;

[0028] Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle;

[0029] Figure 5 This is a three-dimensional structural diagram of the second manifold layer in an embodiment of the present invention;

[0030] Figure 6 This is a three-dimensional structural diagram of the first manifold layer in an embodiment of the present invention;

[0031] Figure 7This is a schematic diagram of the three-dimensional structure of the microchannel layer in an embodiment of the present invention;

[0032] Figure 8 This is an assembly diagram of the third manifold layer and the cover plate in an embodiment of the present invention;

[0033] Figure 9 This is an assembly diagram of the second manifold layer and the third manifold layer in an embodiment of the present invention;

[0034] Figure 10 for Figure 9 Enlarged structural diagram at point B;

[0035] Figure 11 This is an assembly relationship diagram of the first manifold layer and the second manifold layer in an embodiment of the present invention;

[0036] Figure 12 for Figure 11 Enlarged structural diagram at point C;

[0037] Figure 13 This is an assembly diagram of the microchannel layer and the first manifold layer in an embodiment of the present invention;

[0038] Figure 14 for Figure 13 Enlarged structural diagram at point D.

[0039] Figure label:

[0040] 1. Microchannel layer; 11. Heat dissipation channel; 111. Liquid inlet position; 112. Liquid outlet position; 2. First manifold layer; 21. First distribution channel; 22. Second distribution channel; 3. Second manifold layer; 31. First jet hole; 32. Second jet hole; 4. Third manifold layer; 41. Frame; 42. Barrier rib; 43. Liquid inlet area; 44. Liquid outlet area; 5. Cover plate; 51. Liquid inlet; 52. Liquid outlet; 6. Encapsulation cover; 61. Liquid inlet interface; 62. Liquid outlet interface. Detailed Implementation

[0041] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0042] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0045] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0047] Example:

[0048] like Figure 1 As shown, this embodiment provides a heat dissipation device, including a microchannel layer 1, a first manifold layer 2, a second manifold layer 3, a third manifold layer 4, a cover plate 5, and an encapsulation cover 6. The microchannel layer 1, the first manifold layer 2, the second manifold layer 3, and the third manifold layer 4 are arranged in layers from bottom to top. The cover plate 5 covers the third manifold layer 4, and the encapsulation cover 6 covers the cover plate 5.

[0049] like Figure 7 As shown, at least two heat dissipation channels 11 are provided on the upper surface of the microchannel layer 1. The heat dissipation channels 11 do not extend to the lower surface of the microchannel layer 1. The lower surface of the microchannel layer 1 is used to contact the chip. The coolant carries away the heat generated by the chip by flowing within the heat dissipation channels 11. The heat dissipation channels 11 extend along a first direction, and all the heat dissipation channels 11 are arranged side by side and spaced apart in a second direction. The second direction is perpendicular to the first direction, and both the first and second directions are parallel to the microchannel layer 1.

[0050] like Figure 6 As shown, at least two first distribution channels 21 and at least two second distribution channels 22 are provided on the first manifold layer 2. The first distribution channels 21 extend to the upper and lower surfaces of the first manifold layer 2, and the second distribution channels 22 also extend to the upper and lower surfaces of the first manifold layer 2. The first distribution channels 21 and the second distribution channels 22 extend along a second direction, are arranged side-by-side in a first direction, and are also staggered and spaced apart in the first direction.

[0051] Specifically, such as Figure 7 , Figure 13 and Figure 14As shown, after the first manifold layer 2 is disposed above the microchannel layer 1, each heat dissipation channel 11 will connect to at least two first distribution channels 21 and at least one second distribution channel 22. The portion of the heat dissipation channel 11 that connects to the first distribution channel 21 is the liquid inlet position 111, and the portion of the heat dissipation channel 11 that connects to the second distribution channel 22 is the liquid outlet position 112. Corresponding to the above structural design, each heat dissipation channel 11 has at least two liquid inlet positions 111 and at least one liquid outlet position 112. Within the same heat dissipation channel 11, the liquid inlet positions 111 and the liquid outlet positions 112 are staggered in the first direction.

[0052] Preferably, in this embodiment, any heat dissipation channel 11 is connected to all first distribution channels 21 and all second distribution channels 22. This design allows each heat dissipation channel 11 to have a greater number of inlet positions 111 and outlet positions 112. Since the length of the heat dissipation channel 11 is fixed, increasing the number of inlet positions 111 and outlet positions 112 in the heat dissipation channel 11 reduces the spacing between adjacent inlet positions 111 and outlet positions 112.

[0053] like Figure 5 As shown, the second manifold layer 3 is provided with a first jet hole 31 and a second jet hole 32, and the material of the second manifold layer 3 is a thermosensitive metal. When the temperature at the location of the first jet hole 31 and the second jet hole 32 changes, the edges of the first jet hole 31 and the second jet hole 32 will also undergo corresponding deformation, thereby causing the dimensions of the first jet hole 31 and the second jet hole 32 to change accordingly.

[0054] The first jet hole 31 extends along the second direction so that the shape of the first jet hole 31 matches the shape of the first distribution channel 21, and the second jet hole 32 also extends along the second direction so that the shape of the second jet hole 32 matches the shape of the second distribution channel 22.

[0055] Further as Figure 11 and Figure 12 As shown, each first distribution channel 21 corresponds to at least one first jet orifice 31, and the first distribution channel 21 is connected to the corresponding first jet orifice 31. Each second distribution channel 22 corresponds to at least one second jet orifice 32, and the second distribution channel 22 is connected to the corresponding second jet orifice 32.

[0056] For example, in this embodiment, each first distribution channel 21 corresponds to two first jet holes 31, and each second distribution channel 22 corresponds to two second jet holes 32.

[0057] like Figure 3 and Figure 4As shown, the third manifold layer 4 includes a frame 41 and a barrier rib 42. The two ends of the barrier rib 42 are fixed to the inner edge of the frame 41 to divide the inner side of the frame 41 into an inlet area 43 and an outlet area 44.

[0058] For example, in this embodiment, there are two barrier ribs 42, the liquid outlet area 44 is located between the two barrier ribs 42, and there are two liquid inlet areas 43, with the two barrier ribs 42 located between the two liquid inlet areas 43.

[0059] Specifically, such as Figure 9 and Figure 10 As shown, a portion of the first jet holes 31 are connected to one of the liquid inlet zones 43, the remaining first jet holes 31 are connected to another liquid inlet zone 43, and the second jet holes 32 are connected to the liquid outlet zone 44.

[0060] like Figure 2 and Figure 8 As shown, the cover plate 5 is provided with an inlet 51 and an outlet 52. After the cover plate 5 is closed on the barrier rib 42, the inlet 51 is connected to the inlet area 43, and the outlet 52 is connected to the outlet area 44. See again. Figure 1 The side wall of the encapsulation cover 6 is provided with a liquid inlet 61 and a liquid outlet 62. After the encapsulation cover 6 is placed on the cover plate 5, the liquid inlet 61 is connected to the liquid inlet 51, and the liquid outlet 62 is connected to the liquid outlet 52.

[0061] The coolant flows from the inlet port 61 to the outlet port 51, then to the inlet area 43, and then is distributed to each first jet hole 31. The coolant flows through the first jet hole 31 into the corresponding first distribution channel 21. Each first distribution channel 21 distributes the coolant to the corresponding inlet position 111 in each heat dissipation channel 11. The coolant flows from the inlet position 111 to the adjacent outlet position 112, and then flows back to the corresponding second distribution channel 22. After that, it flows sequentially to the second jet hole 32, the outlet area 44, and the outlet port 52, and finally is discharged from the outlet port 62, thus completing the coolant circulation.

[0062] When the heat distribution on the chip changes, heat conduction causes deformation of the sidewalls of the first jet holes 31 and the second jet holes 32, thereby altering their dimensions. This changes the coolant flow rate at the first distribution channels 21 and the second distribution channels 22, further changing the coolant flow rate between adjacent inlet positions 111 and outlet positions 112 within the heat dissipation channel 11. This results in an adaptive change in the heat dissipation power at corresponding locations on the chip. Specifically, when the local heat generation on the chip increases, the coolant flow rate at that location increases accordingly, improving the heat dissipation efficiency to match the increased heat generation. Conversely, when the local heat generation decreases, the coolant flow rate decreases accordingly, allowing the coolant to flow more concentratedly to other higher-temperature locations. In this way, the heat dissipation effect at each location on the chip better matches the actual temperature at that location, effectively improving the overall heat dissipation effect of the chip.

[0063] To prevent a decrease in the seal between the second manifold layer 3 and the third manifold layer 4, as well as between the second manifold layer 3 and the first manifold layer 2, when the second manifold layer 3 deforms due to heat, methods such as screws or adhesive can be used to ensure that the second manifold layer 3 is always pressed between the third manifold layer 4 and the first manifold layer 2. Specifically, the first jet hole 31 and the second jet hole 32 are located in the middle of the second manifold layer 3. The edges of the second manifold layer 3 and the first manifold layer 2 are fixed by screws, adhesive, or welding, and the edges of the second manifold layer 3 and the third manifold layer 4 are fixed by screws, adhesive, or welding. This avoids restricting the thermal deformation of the first jet hole 31 and the second jet hole 32.

[0064] Based on the foregoing, this embodiment increases the number of liquid inlet positions 111 and liquid outlet positions 112 in the heat dissipation channel 11, and reduces the spacing between adjacent liquid inlet positions 111 and liquid outlet positions 112. This enables control of heat dissipation efficiency over a smaller area on the chip and improves the spatial accuracy of the chip temperature regulation process.

[0065] See you again Figures 9-12 and Figure 6In this embodiment, the second manifold layer 3 partially blocks the first distribution channel 21, thus blocking the coolant in the outlet area 44 from flowing back into the first distribution channel 21 and re-entering the heat dissipation channel 11, thereby ensuring the heat dissipation effect on the chip. Similarly, the second manifold layer 3 partially blocks the second distribution channel 22, thus blocking the coolant in the inlet area 43 from flowing directly into the outlet area 44 through the second distribution channel 22 and the second jet hole 32 without flowing into the heat dissipation channel 11, ensuring the effective utilization of the low-temperature coolant.

[0066] For example, in this embodiment, the barrier rib 42 is S-shaped. The inlet 51 and outlet 52 extend along a first direction and are arranged side-by-side in a second direction. Thus, the cover plate 5 can shield the entire top of the barrier rib 42, thereby better separating the inlet 51 and outlet 52, preventing low-temperature coolant from flowing into the outlet 52 when low-temperature coolant is injected into the inlet 51, and preventing high-temperature coolant from flowing into the inlet 51 when high-temperature coolant is drawn from the outlet 52.

[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A heat dissipation device, characterized in that, It includes a microchannel layer (1), a first manifold layer (2), a second manifold layer (3) and a third manifold layer (4) arranged in layers from bottom to top; The upper surface of the microchannel layer (1) is provided with at least two heat dissipation channels (11), the heat dissipation channels (11) extend along a first direction, and the heat dissipation channels (11) are arranged side by side and spaced apart in a second direction, wherein the second direction is perpendicular to the first direction; The first manifold layer (2) is provided with at least two first distribution channels (21) and at least two second distribution channels (22). The first distribution channels (21) and the second distribution channels (22) extend along a second direction. The first distribution channels (21) and the second distribution channels (22) are staggered and spaced apart in a first direction. Each heat dissipation channel (11) connects at least two first distribution channels (21) and at least one second distribution channel (22). The second manifold layer (3) is made of a thermosensitive metal. The second manifold layer (3) is provided with a first jet hole (31) and a second jet hole (32). The first jet hole (31) and the second jet hole (32) extend along the second direction. Each of the first distribution channels (21) corresponds to at least one first jet hole (31), and the first distribution channel (21) is connected to the corresponding first jet hole (31). Each of the second distribution channels (22) corresponds to at least one second jet hole (32), and the second distribution channel (22) is connected to the corresponding second jet hole (32). The third manifold layer (4) includes a frame (41) and a barrier rib (42). The two ends of the barrier rib (42) are fixed to the inner edge of the frame (41) to divide the inner side of the frame (41) into an inlet area (43) and an outlet area (44). The first jet hole (31) is connected to the inlet area (43), and the second jet hole (32) is connected to the outlet area (44).

2. The heat dissipation device according to claim 1, characterized in that, The second manifold layer (3) partially blocks the first distribution channel (21) so that the second manifold layer (3) is blocked between the first distribution channel (21) and the liquid outlet area (44).

3. The heat dissipation device according to claim 2, characterized in that, The second manifold layer (3) partially blocks the second distribution channel (22) so that the second manifold layer (3) is blocked between the second distribution channel (22) and the liquid inlet area (43).

4. The heat dissipation device according to claim 3, characterized in that, The heat dissipation device also includes a cover plate (5), on which a liquid inlet (51) and a liquid outlet (52) are provided. The liquid inlet (51) and the liquid outlet (52) extend along a first direction, and the liquid inlet (51) and the liquid outlet (52) are arranged side by side in a second direction. The barrier rib (42) is S-shaped, and the cover plate (5) covers the barrier rib (42) so that the liquid inlet (51) is connected to the liquid inlet area (43) and the liquid outlet (52) is connected to the liquid outlet area (44).

5. The heat dissipation device according to claim 4, characterized in that, The heat dissipation device also includes a sealing cover (6), on which a liquid inlet (61) and a liquid outlet (62) are provided. The sealing cover (6) covers the cover plate (5) so that the liquid inlet (61) is connected to the liquid inlet (51) and the liquid outlet (62) is connected to the liquid outlet (52).

6. The heat dissipation device according to claim 1, characterized in that, Each of the heat dissipation channels (11) connects all the first distribution channels (21) and all the second distribution channels (22).

7. The heat dissipation device according to claim 1, characterized in that, Each of the first distribution channels (21) corresponds to at least two of the first jet holes (31).

8. The heat dissipation device according to claim 7, characterized in that, Each of the second distribution channels (22) corresponds to at least two of the second jet holes (32).

9. The heat dissipation device according to claim 1, characterized in that, The second manifold layer (3) is squeezed between the third manifold layer (4) and the first manifold layer (2).

10. The heat dissipation device according to claim 9, characterized in that, The first jet hole (31) and the second jet hole (32) are located in the middle of the second manifold layer (3). The edge of the second manifold layer (3) is fixed to the edge of the first manifold layer (2), and the edge of the second manifold layer (3) is fixed to the edge of the third manifold layer (4).

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