Semiconductor die attach system and method
By using image recognition and parameter management in the semiconductor die bonding system, the problems of uneven dispensing and difficulty in controlling the amount of adhesive are solved, achieving a high-precision, high-uniformity, and high-efficiency bonding process, which is suitable for semiconductor die assembly processes involving small chips and high-viscosity adhesives.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ZHEJIANG DAGUI ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2026-03-26
- Publication Date
- 2026-07-31
AI Technical Summary
In the current semiconductor chip and substrate lead frame assembly process, uneven dispensing, difficulty in controlling the amount of adhesive, and insufficient compatibility with high-viscosity adhesives lead to low production efficiency and poor product quality.
The semiconductor solder pad adhesive spraying system includes an image acquisition device, adjustment mechanism, dispensing machine, thickness gauge and controller. Through image recognition, position calibration and parameter library management, it achieves precise positioning and uniform adhesive spraying. It supports multiple sets of standardized parameters and combines visual positioning and mechanical positioning to detect adhesive layer thickness and perform secondary adhesive replenishment.
It achieves good adhesive uniformity, precise adhesive quantity control, and synchronous adhesive spraying and positioning, thereby improving production efficiency and product quality. It is suitable for small chips and high-viscosity adhesives, and can be adapted to existing die-loading machines without hardware modification, resulting in low modification costs.
Smart Images
Figure CN122479933A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip technology, and more specifically to a semiconductor solder pad spraying system and method. Background Technology
[0002] In the process of assembling semiconductor chips and substrate lead frames, a dispensing process is required. Existing traditional dispensing methods often suffer from uneven dispensing due to low air pressure when handling small chips (less than 0.2µm). When handling larger chips, especially those less than 100µm thick, controlling the amount of adhesive applied becomes difficult, as does controlling the adhesive thickness and resulting in uneven dispensing and voids. Furthermore, the dispensing speed is slow and the processing capacity (UPH) is low, impacting production efficiency and product quality. Summary of the Invention
[0003] To overcome the shortcomings of existing technologies, a semiconductor die bonding adhesive spraying system and method are provided to solve the problems of poor adhesive layer uniformity, low adhesive quantity control accuracy, asynchronous spraying and positioning, insufficient compatibility with high-viscosity adhesives, and low production capacity in current semiconductor die bonding adhesive spraying processes.
[0004] To achieve the above objectives, a semiconductor soldering adhesive spraying system is provided, comprising: an image acquisition device for acquiring images of a substrate to be processed located at a workstation, an adjustment mechanism, a dispensing machine, a thickness gauge, and a controller. The controller includes a control module, a storage module for storing a spraying parameter library, an image recognition module for identifying the contour of the substrate to be processed and multiple first reference points in the image, a calibration module for calculating the positional deviation value of the substrate to be processed based on the contour, the first reference points, and a second reference point at the workstation, and a chip size to which the substrate to be processed is adapted based on the multiple first reference points, and for retrieving a corresponding set of standardized parameters from the spraying parameter library based on the chip size. The control module is connected to the image acquisition device, the thickness gauge, the dispensing machine, and the adjustment mechanism. The storage module, the image recognition module, the calibration module, and the call module are respectively connected to the control module. The control module adjusts the position of the substrate to be processed to the workstation through the adjustment mechanism. After the control module sends out a set of standardized parameters, the dispensing machine obtains the set of standardized parameters and performs corresponding dispensing actions on the substrate to be processed. The thickness gauge detects the thickness of the adhesive layer on the substrate to be processed to obtain the location information of the defect area. The control module receives the location information to instruct the dispensing machine to perform secondary adhesive replenishment in the defect area.
[0005] Furthermore, the glue spraying parameter library stores multiple sets of standardized parameters corresponding to chips of different sizes. The standardized parameter sets include glue spraying amount, glue spraying speed, and glue spraying trajectory.
[0006] Furthermore, the image acquisition device is a CCD camera.
[0007] This invention provides a method for applying adhesive to a semiconductor solder pad spraying system, comprising the following steps: A glue spraying parameter library is constructed in the storage module of the controller. The glue spraying parameter library stores multiple sets of standardized parameters corresponding to chips of different sizes. The standardized parameter sets include glue spraying amount, glue spraying speed and glue spraying trajectory. The image acquisition device acquires images of the substrate to be processed located at the workstation; The controller's control module acquires the image so that the controller's image recognition module can identify the outline of the substrate to be processed and multiple first reference points in the image; The calibration module of the controller calculates the positional deviation value of the substrate to be processed based on the contour, the first reference point, and the second reference point of the workstation. The control module adjusts the position of the substrate to be processed to the workstation by adjusting the mechanical components. The controller's calling module determines the chip size to which the substrate to be processed is adapted based on multiple first reference points, and retrieves a set of standardized parameters from the adhesive spraying parameter library based on the chip size. The control module sends the set of standardized parameters to the outside. The dispensing machine acquires the set of standardized parameters and performs dispensing on the substrate to be processed using the set of standardized parameters. A thickness gauge is used to detect the thickness of the adhesive layer on the substrate to be processed in order to obtain the location information of the defect area. The control module receives the location information and sends it outwards; The dispensing machine uses the location information to perform secondary glue application in the defective area.
[0008] Furthermore, before the image acquisition device acquires an image of the substrate to be processed at the workstation, the substrate to be processed is pre-processed, including plasma cleaning and cleaning agent wiping.
[0009] The beneficial effects of this invention are that the semiconductor solder pad spraying system of this invention aims to solve the technical pain points in current semiconductor solder pad spraying processes, such as poor adhesive uniformity, low adhesive quantity control precision, asynchronous spraying and positioning, insufficient adaptability to high-viscosity adhesives, and low production capacity. The semiconductor solder pad spraying method of this invention provides a solder pad spraying process that balances high precision, high uniformity, high adaptability, and high efficiency.
[0010] The semiconductor soldering die spraying system and method of the present invention can be directly adapted to existing fully automatic die-loading machines. Only the spraying controller, firmware and parameter library need to be upgraded. No hardware modification is required, the modification cost is low, and it is suitable for small and medium-sized semiconductor packaging companies to quickly introduce mass production. Attached Figure Description
[0011] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the semiconductor solder pad spraying system according to an embodiment of the present invention.
[0012] Figure label: Image acquisition device 1; Adjustment mechanism 2; Dispensing machine 3; Thickness gauge 4; Controller 5, control module 51, storage module 52, image recognition module 53, calibration module 54, and recall module 55. Detailed Implementation
[0013] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.
[0014] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.
[0015] Reference Figure 1 As shown, the present invention provides a semiconductor solder pad spraying system, comprising: an image acquisition device 1, an adjustment mechanism 2, a dispensing machine 3, a thickness gauge 4, and a controller 5. The system includes a control module 51, a storage module 52, an image recognition module 53, a calibration module 54, and a recall module 55.
[0016] The control module 51 is connected to the image acquisition device 1, the thickness gauge 4, the dispensing machine 3, and the adjustment mechanism 2. The storage module 52, image recognition module 53, calibration module 54, and recall module 55 are all connected to the control module 51. The image recognition module is connected to the calibration module. The storage module and the image recognition module are both connected to the recall module.
[0017] In this embodiment, the image acquisition device 1 is a CCD camera. The image acquisition device 1 is used to acquire images of the substrate to be processed located at the workstation.
[0018] Adjustment mechanism 2 is used to adjust the substrate to be processed at the work station so that the substrate to be processed is within the work station.
[0019] The dispensing machine 3 is used to perform the dispensing action on the substrate to be processed according to the dispensing parameters.
[0020] Thickness gauge 4 is used to detect the thickness of the adhesive layer sprayed by the dispensing machine on the substrate to be processed, in order to determine the defect area of the adhesive layer.
[0021] The control module 51 in the controller 5 is used to interact with the image acquisition device 1, the thickness gauge 4, the dispensing machine 3 and the adjustment mechanism 2.
[0022] Storage module 52 is used to construct a glue spraying parameter library. The glue spraying parameter library stores multiple sets of standardized parameters corresponding to chips of different sizes. The standardized parameter sets include glue spraying amount, glue spraying speed, and glue spraying trajectory.
[0023] The image recognition module 53 is used to identify the outline of the substrate to be processed and multiple first reference points in the image.
[0024] The calibration module 54 is used to calculate the positional deviation value of the substrate to be processed based on the contour, the first reference point, and the second reference point of the station.
[0025] The calling module 55 is used to determine the chip size to which the substrate to be processed is adapted based on multiple first reference points, and to retrieve a set of standardized parameters from the spray adhesive parameter library based on the chip size.
[0026] The control module 51 adjusts the position of the substrate to be processed to the work station by adjusting the mechanical device 2.
[0027] After the control module 51 sends out a set of standardized parameters, the dispensing machine 3 acquires the set of standardized parameters and performs the corresponding dispensing action on the substrate to be processed. The thickness gauge 4 detects the thickness of the adhesive layer on the substrate to be processed to obtain the location information of the defect area. The control module 51 receives the location information and instructs the dispensing machine 3 to perform secondary adhesive replenishment in the defect area.
[0028] This invention provides a method for applying adhesive to a semiconductor solder pad spraying system, comprising the following steps: a. Construct a glue spraying parameter library in the storage module 52 of the controller 5. The glue spraying parameter library stores multiple sets of standardized parameters corresponding to chips of different sizes. The standardized parameter sets include glue spraying amount, glue spraying speed, and glue spraying trajectory.
[0029] The adhesive spraying parameter library is stored in the controller's storage module and archived according to "workpiece type - adhesive type - substrate material". It has multiple sets of preset standardized parameters to cover core application scenarios, and supports adding, modifying and saving parameters to adapt to new workpieces and adhesive types.
[0030] b. Image acquisition device 1 acquires images of the substrate to be processed located at the workstation.
[0031] Before the image acquisition device 1 acquires an image of the substrate to be processed at the workstation, the substrate to be processed is pre-processed, including plasma cleaning and cleaning agent wiping.
[0032] Specifically, the PCB board (substrate) is first pre-treated, namely plasma cleaning at 120W for 60 seconds, and then wiped and dried with a special cleaning agent.
[0033] After pretreatment, the substrate to be processed is placed at the work station for adhesive spraying, and the image acquisition device 1 acquires images of the substrate to be processed at the work station.
[0034] c. The control module 51 of the controller 5 acquires an image so that the image recognition module 53 of the controller 5 can recognize the outline of the substrate to be processed and multiple first reference points in the image.
[0035] d. The calibration module 54 of the controller 5 calculates the positional deviation value of the substrate to be processed based on the contour, the first reference point and the second reference point of the station.
[0036] e. The control module 51 adjusts the position of the substrate to be processed to the work station by adjusting the mechanical device 2.
[0037] In the positioning of the substrate to be processed, a dual positioning method combining visual positioning and mechanical positioning structure is adopted. The image acquisition device captures the outline and reference point information of the substrate to be processed and feeds it back to the control module. The control module achieves precise fixation of the substrate to be processed by adjusting the mechanical positioning, with a positioning error ≤ ±0.1μm.
[0038] f. The calling module 55 of the controller 5 determines the chip size to which the substrate to be processed is adapted based on multiple first reference points, and retrieves a set of standardized parameters from the glue spraying parameter library based on the chip size.
[0039] The glue spraying parameter library has management permissions, allowing only authorized personnel to add or modify parameters to avoid accidental operations.
[0040] After the parameters are called, they can be fine-tuned within a range of ±10% according to the actual working conditions on site (such as changes in ambient temperature and humidity, and minor deviations in workpiece dimensions). After fine-tuning, they can be saved as a new parameter group to enrich the parameter library.
[0041] g. The control module 51 sends a set of standardized parameters to the outside world.
[0042] h. Dispensing machine 3 acquires a set of standardized parameters and performs dispensing on the substrate to be processed using the set of standardized parameters.
[0043] The system employs a visual positioning and adhesive spraying linkage mechanism, where the nozzle of the dispensing machine dynamically compensates for positioning deviations and the adhesive spraying path is corrected in real time to ensure that the center of the adhesive residue is aligned with the center of the chip pad.
[0044] In this embodiment, the position and size information of the workpiece are captured by an image acquisition device, and the glue spraying parameters (glue amount, glue spraying speed, glue spraying trajectory) are adjusted in real time to achieve uniform and controllable glue layer thickness, avoid glue overflow or insufficient glue, and especially achieve nano-level and micro-level glue layer control to meet the requirements of precision mounting.
[0045] i. Thickness gauge 4 detects the thickness of the adhesive layer on the substrate to be processed to obtain the location information of the defect area.
[0046] After the adhesive is sprayed, the thickness gauge is started simultaneously to detect the thickness of the adhesive layer and identify defects. The defect area is automatically marked by the laser thickness gauge.
[0047] j. The control module 51 receives location information and sends it outwards.
[0048] k. The dispensing machine provides 3 location information and performs secondary glue application in the defective area.
[0049] The semiconductor soldering adhesive spraying system of the present invention relates to semiconductor chip and substrate lead frame assembly, and is particularly suitable for thin chips, small chips with a thickness of less than 100um, chip size of less than 0.5um, wafer-level integration and high-yield mass production scenarios. It can be adapted to assembly adhesives with a viscosity range of 5000-50000cps, such as epoxy resin, silver paste, and UV adhesive.
[0050] The semiconductor soldering adhesive spraying system of the present invention aims to solve the technical pain points in the current semiconductor soldering adhesive spraying process, such as poor adhesive layer uniformity, low adhesive quantity control accuracy, asynchronous spraying and positioning, insufficient compatibility with high viscosity adhesives, and low production capacity.
[0051] The semiconductor solder pad spraying method of the present invention provides a solder pad spraying process that takes into account high precision, high uniformity, high adaptability and high efficiency.
[0052] The semiconductor soldering die coating system and method of this invention can be directly adapted to existing fully automatic die-loading machines. Only the coating controller, firmware, and parameter library need to be upgraded, without modifying the main hardware. The modification cost is less than or equal to 5% of the original equipment value. The process parameters of the semiconductor soldering die coating system of this invention can be preset and stored via a touch screen, with more than 200 sets of schemes adaptable to different chips and package types, making it suitable for small and medium-sized semiconductor packaging companies to quickly implement mass production.
[0053] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.
Claims
1. A semiconductor solder pad adhesive spraying system, characterized in that, include: An image acquisition device, adjustment mechanism, dispensing machine, thickness gauge, and controller are used to acquire images of the substrate to be processed located at the workstation. The controller includes a control module, a storage module for storing a dispensing parameter library, an image recognition module for identifying the outline of the substrate to be processed and multiple first reference points in the image, a calibration module for calculating the positional deviation value of the substrate to be processed based on the outline, the first reference points, and the second reference point of the workstation, and a calling module for determining the chip size to which the substrate to be processed is adapted based on multiple first reference points and retrieving a set of standardized parameters corresponding to the dispensing parameter library based on the chip size. The control module is connected to... The image acquisition device, the thickness gauge, the dispensing machine, and the adjustment mechanism are connected to the control module. The storage module, the image recognition module, the calibration module, and the recall module are respectively connected to the control module. The control module adjusts the position of the substrate to be processed to the workstation through the adjustment mechanism. After the control module sends the set of standardized parameters to the outside, the dispensing machine obtains the set of standardized parameters and performs the corresponding dispensing action on the substrate to be processed. The thickness gauge detects the thickness of the adhesive layer on the substrate to be processed to obtain the location information of the defect area. The control module receives the location information to instruct the dispensing machine to perform secondary adhesive replenishment in the defect area.
2. The semiconductor die attach adhesive dispensing system of claim 1, wherein, The glue spraying parameter library stores multiple sets of standardized parameters corresponding to chips of different sizes. The standardized parameter sets include glue spraying amount, glue spraying speed, and glue spraying trajectory.
3. The semiconductor die attach adhesive dispensing system of claim 1, wherein, The image acquisition device is a CCD camera.
4. A method for applying flux to a semiconductor soldering tab according to any one of claims 1 to 3, wherein Includes the following steps: A glue spraying parameter library is constructed in the storage module of the controller. The glue spraying parameter library stores multiple sets of standardized parameters corresponding to chips of different sizes. The standardized parameter sets include glue spraying amount, glue spraying speed and glue spraying trajectory. The image acquisition device acquires images of the substrate to be processed located at the workstation; The controller's control module acquires the image so that the controller's image recognition module can identify the outline of the substrate to be processed and multiple first reference points in the image; The calibration module of the controller calculates the positional deviation value of the substrate to be processed based on the contour, the first reference point, and the second reference point of the workstation. The control module adjusts the position of the substrate to be processed to the workstation by adjusting the mechanical components. The controller's calling module determines the chip size to which the substrate to be processed is adapted based on multiple first reference points, and retrieves a set of standardized parameters from the adhesive spraying parameter library based on the chip size. The control module sends the set of standardized parameters to the outside world; The dispensing machine acquires the set of standardized parameters and performs dispensing on the substrate to be processed using the set of standardized parameters. A thickness gauge is used to detect the thickness of the adhesive layer on the substrate to be processed in order to obtain the location information of the defect area. The control module receives the location information and sends it outwards; The dispensing machine uses the location information to perform secondary glue application in the defective area.
5. The method of claim 1, wherein, Before the image acquisition device acquires an image of a substrate to be processed located at a station, the substrate to be processed is pre-processed, the pre-processing comprising plasma cleaning and cleaner wiping.