Copper liquid bond cleaning method, apparatus, and computer readable storage medium

Abstract

This invention discloses a method, apparatus, and computer-readable storage medium for cleaning copper molten metal adhesion. The method includes: acquiring images of the chute opening in real time during the copper molten metal casting interval; performing feature detection on the images; and if copper molten metal adhesion is detected at the chute opening, controlling a lever in a lever motion mechanism to swing and remove the copper molten metal adhesion from the chute opening. This invention can automatically and promptly clean copper molten metal adhesion, reducing safety risks and costs.

Description

Technical Field

[0001] This invention relates to the field of casting slag removal technology, and in particular to a method, apparatus, and computer-readable storage medium for cleaning copper melt adhesion. Background Technology

[0002] High-temperature molten copper flows from the outlet of the anode furnace, passes through a movable chute and a fixed chute, and then flows into the tundish. The tundish pours the molten copper into the casting ladle (placed on an electronic weighing mechanism). When the molten copper in the casting ladle reaches the set mass, the tundish returns, stops pouring molten copper, and begins pouring into the casting ladle on the other side. The casting ladle then begins pouring molten copper into the copper mold according to a set program. When the pouring volume reaches the standard, the casting ladle stops pouring. Then the disc rotates, and the copper mold filled with molten copper enters the spray cooling zone for cooling. The tundish and casting ladle repeat the previous operation. After a large number of repetitive operations, the molten copper will adhere to the chute opening, forming "copper whiskers" (i.e., molten copper adhesion). Copper adhesion can have a significant impact on anode plate production, including: 1. Deterioration in the physical specifications and quality of the anode plate (1) Surface defects: Copper molten metal adhesion can lead to uneven flow of copper molten metal at the casting ladle, causing problems such as flash, burrs, and bulges on the surface of the anode plate. These defects may cause uneven current distribution during electrolysis, reduce current efficiency, or even lead to short circuits.

[0003] (2) Weight fluctuation: Adhesive may clog the casting port, affecting the stability of the copper liquid flow rate and causing the weight of the anode plate to exceed the process requirements. For example, if the adhesive partially blocks the casting port, it may cause insufficient initial casting volume, and overflow due to sudden pressure increase in the later stage, resulting in weight deviation.

[0004] 2. Low production efficiency (1) Casting interruption and cold copper formation: When adhesion is severe, the machine needs to be stopped for cleaning, interrupting the production process. At the same time, copper molten splashing during the casting process will increase the amount of cold copper formed, which needs to be recycled and treated, extending the furnace time and increasing fuel consumption.

[0005] (2) Increased equipment maintenance frequency: Frequent cleaning of adhesives increases the intensity of manual labor, and traditional cleaning methods (such as oxygen ablation) pose safety hazards.

[0006] 3. Damage to equipment and process stability (1) Decreased control accuracy of casting system: Adhesives may interfere with the weighing sensor signal of the casting ladle, affecting the accuracy of the automatic quantitative system. For example, if the center of gravity of the casting ladle shifts due to adhesions, it may affect the zero-point balance of the sensor.

[0007] (2) Shortened lifespan of casting ladle: Long-term scouring of the bonding area by molten copper will accelerate the wear of the lining material of the casting ladle, leading to the problem of brick falling off or copper running off at the front edge of the ladle, further aggravating the bonding risk.

[0008] 4. Increased safety risks and costs (1) Operational safety hazards: When cleaning copper liquid adhesion, the hot copper liquid splash may cause burns, and the traditional manual cleaning method has a high risk.

[0009] (2) Waste of materials and energy: Increased scrap rate due to bonding, cold copper recycling and frequent maintenance will increase production costs.

[0010] Currently, the main method for cleaning copper molten metal adhesion is manual. When copper molten metal adhesion is found at the chute opening, on-site workers use a specially made stick to manually knock it off. However, manually knocking off copper molten metal adhesion with a stick poses a safety hazard. Because the temperature of the copper molten metal on-site is extremely high, when the adhesion is knocked off, it may fall into the copper mold filled with hot copper, and the hot copper may splash and cause burns. Summary of the Invention

[0011] The technical problem to be solved by the present invention is to provide a method, apparatus and computer-readable storage medium for cleaning copper liquid adhesion, which can automatically and timely clean copper liquid adhesion, and reduce safety risks and costs.

[0012] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a method for cleaning copper liquid adhesion, comprising: During the intervals between copper molten casting, images of the chute opening are acquired in real time; Perform feature detection on the image; When copper liquid is detected adhering to the chute opening, the lever in the control lever mechanism swings to remove the copper liquid adhering to the chute opening.

[0013] The present invention also proposes a copper liquid adhesion cleaning device, comprising: The image acquisition module is used to acquire images of the chute opening in real time when the casting ladle stops pouring molten copper into the copper mold. The detection module is used to perform feature detection on the image. When copper liquid adhesion is detected at the chute opening, a first control signal is sent to the lever motion mechanism. A lever motion mechanism includes a lever that can swing in the horizontal direction; the lever motion mechanism is used to control the lever to swing after receiving the first control signal, so as to remove the copper liquid adhesion at the chute opening.

[0014] The present invention also proposes a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described above.

[0015] The beneficial effects of this invention are as follows: by real-time imaging to determine whether there is copper liquid adhering to the chute opening of the casting ladle, if so, the control lever movement mechanism is used to clean it, which can clean the copper liquid adhering in a timely manner, thereby improving the casting quality of the anode plate, ensuring production efficiency, protecting equipment and process stability, and reducing safety risks and costs. Attached Figure Description

[0016] Figure 1 This is a flowchart of a copper liquid adhesion cleaning method according to the present invention; Figure 2 This is a flowchart of the method according to Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of the chute opening (with copper liquid adhering to it) in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of a normal sample (without copper liquid adhesion) in Embodiment 1 of the present invention; Figure 5 From Figure 3 Edge features extracted from; Figure 6 From Figure 4 Edge features extracted from; Figure 7 This is a schematic diagram showing the relative position of the lever motion mechanism and the chute opening in Embodiment 1 of the present invention; Figure 8 This is a schematic diagram of the structure of a copper liquid adhesion cleaning device according to the present invention.

[0017] Label Explanation: 10. Sluice opening; 20. Lever mechanism; 21. Lever; 200. Copper liquid adhesion cleaning device; 201. Image acquisition module; 202. Detection module; 203. Lever motion mechanism; 204. Cropping module. Detailed Implementation

[0018] To explain in detail the technical content, objectives, and effects of the present invention, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0019] Please refer to Figure 1 A method for cleaning copper liquid adhesion, comprising: During the intervals between copper molten casting, images of the chute opening are acquired in real time; Perform feature detection on the image; When copper liquid is detected adhering to the chute opening, the lever in the control lever mechanism swings to remove the copper liquid adhering to the chute opening.

[0020] As can be seen from the above description, the beneficial effects of the present invention are: it can clean the copper liquid adhesion in a timely manner, thereby improving the casting quality of the anode plate, ensuring production efficiency, protecting equipment and process stability, and reducing safety risks and costs.

[0021] Furthermore, the real-time acquisition of images of the chute opening during the copper molten casting interval includes: When the casting ladle stops pouring molten copper into the copper mold, the image acquisition device captures the image of the chute opening in real time.

[0022] As described above, the adhesion of molten copper at the chute opening is only checked and cleaned during the gap between pouring the molten copper from the casting ladle, to avoid the lever affecting the casting process.

[0023] Furthermore, prior to performing feature detection on the image, the process further includes: The image is cropped according to a preset region of interest, which includes the chute opening and its surrounding area.

[0024] As can be seen from the above description, it can reduce interference from background pixels.

[0025] Further, the feature detection of the image includes: Edge extraction is performed on the image to obtain the edge features of the image; The edge features of the image are compared with the edge features of a normal sample, which is a chute opening image without copper liquid adhesion. If the edge features of the image have redundant edge contours, it is determined that copper liquid adhesion exists in the image.

[0026] As described above, the adhesion of copper liquid can be determined quickly and accurately.

[0027] Furthermore, after detecting copper liquid adhesion at the chute opening and controlling the lever in the lever movement mechanism to swing to remove the copper liquid adhesion at the chute opening, the process further includes: When it is detected that the copper liquid adhesion at the chute opening has been removed, the control lever stops swinging and resets.

[0028] As described above, it is important to avoid stopping the lever on the copper molten casting path, which could affect the casting process.

[0029] The present invention also proposes a copper liquid adhesion cleaning device, comprising: The image acquisition module is used to acquire images of the chute opening in real time when the casting ladle stops pouring molten copper into the copper mold. The detection module is used to perform feature detection on the image. If copper liquid adhesion is detected at the chute opening, a first control signal is sent to the lever motion mechanism. A lever motion mechanism includes a lever that can swing in the horizontal direction; the lever motion mechanism is used to control the lever to swing after receiving the first control signal, so as to remove the copper liquid adhesion at the chute opening.

[0030] Furthermore, it also includes: The cropping module is used to crop the image according to a preset region of interest, the region of interest including the chute opening and its surrounding area.

[0031] Furthermore, the detection module is specifically used to extract edges from the image to obtain the edge features of the image; compare the edge features of the image with the edge features of a normal sample, wherein the normal sample is a chute opening image without copper liquid adhesion; if the edge features of the image have redundant edge contours, it is determined that copper liquid adhesion exists in the image.

[0032] Furthermore, the detection module is also used to send a second control signal to the lever movement mechanism when it is detected that the copper liquid adhesion at the chute opening has been removed; The lever mechanism is also used to control the lever to stop swinging and reset after receiving the second control signal.

[0033] The present invention also proposes a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described above.

[0034] Example 1 Please refer to Figure 2-7 Embodiment 1 of the present invention is: a method for cleaning copper liquid adhesion, which can be applied to the anode plate casting scenario. By using an automatic cleaning device to replace manual operation, it can effectively prevent operational safety hazards.

[0035] like Figure 2 As shown, this method includes the following steps: S1: Real-time acquisition of images of the chute opening during the intermittent period of copper molten casting.

[0036] Specifically, when the casting ladle stops pouring molten copper into the copper mold, a high-definition industrial camera captures images of the chute opening in real time. In other words, the adhesion of molten copper at the chute opening is only detected and cleaned during the intervals between pours (in practical applications, there is an 18-23 second interval between two consecutive pours). Cleaning is not performed when the casting ladle is pouring molten copper, to avoid the lever interfering with the casting process.

[0037] In this embodiment, the camera is located on the side of the chute opening. When copper liquid adheres to the chute opening, the image it captures is as follows: Figure 3 As shown, Figure 3The middle part is the chute opening, and the copper mold is below the chute opening.

[0038] S2: Crop the image according to the preset region of interest.

[0039] In this embodiment, the region of interest includes the chute opening and its surrounding area.

[0040] By cropping out meaningless background areas in the image, and only processing the ROI (Region of Interest) containing the object to be detected, interference from background pixels is fundamentally reduced.

[0041] S3: Perform feature detection on the image to determine whether copper liquid adhesion is detected at the chute opening. If so, proceed to step S4.

[0042] Specifically, object detection is first performed using a trained deep learning model, such as YOLO (You Only Look Once). Then, edge detection algorithms are used to extract edges from the detected objects to obtain edge features. The deep learning model incorporates standard refinement, labeling only the detection region and omitting any background regions, allowing the model to ignore background interference to the greatest extent possible, thereby improving the accuracy of image feature extraction.

[0043] Next, this edge feature is compared with the edge features of normal samples. If redundant contours are found, it is considered that copper melt adhesion has been detected. Normal samples are images of the chute opening where no copper melt adhesion is present, such as... Figure 4 As shown.

[0044] For example, suppose from Figure 3 The extracted edge features are as follows Figure 5 As shown, the edge features of normal samples are as follows: Figure 6 As shown, it can be seen that Figure 5 compared to Figure 6 There are redundant contours, namely the contours of copper liquid bonding, so it can be determined that copper liquid bonding has been detected.

[0045] S4: Control the lever in the lever movement mechanism to swing to remove the copper liquid adhering to the chute opening.

[0046] Specifically, when copper liquid adhesion is detected at the chute opening, the lever is triggered to move, that is, a signal is sent to the control cabinet of the lever movement mechanism to start the lever movement mechanism, so that the lever swings in the horizontal direction, thereby peeling the copper liquid adhesion into the copper mold copper liquid.

[0047] like Figure 7As shown, in this embodiment, the lever motion mechanism 20 is located on the side of the chute opening 10, and the lever 21 extends to the bottom of the chute opening 10. The lever 21 can reciprocate in the horizontal direction, thereby removing the copper liquid adhesion below the chute opening 10.

[0048] In some embodiments, the camera may be integrated into the lever motion mechanism.

[0049] In some embodiments, a cabinet air conditioner is also installed on the frame of the lever motion mechanism to cool the lever motion mechanism and the camera, ensuring that they can operate normally in high-temperature environments.

[0050] S5: When it is detected that the copper liquid adhesion has been removed, control the lever to stop swinging and reset.

[0051] If it is detected that the copper liquid adhering to the chute opening has been knocked off by the lever, the lever is controlled to stop swinging and reset, so as to prevent the lever from stopping on the copper liquid casting path and affecting the casting process.

[0052] In practical applications, combined with the anode plate casting process, the overall workflow is as follows: First, the casting disc copper mold rotates into position, and the casting ladle begins pouring molten copper into the mold according to the set program. When the injection volume reaches the standard, the casting ladle stops pouring. Then, the above steps are used to detect and clean any copper molten metal adhering to the chute opening. The disc then continues to rotate, repeating the above actions.

[0053] This embodiment uses a 2D camera to take real-time photos to determine whether there is copper liquid adhering to the chute opening of the casting ladle. If so, it is cleaned in time, thereby improving the casting quality of the anode plate, ensuring production efficiency, protecting equipment and process stability, and reducing safety risks and costs.

[0054] Example 2 like Figure 8 As shown, this embodiment is a copper liquid adhesion cleaning device 200, comprising: Image acquisition module 201 is used to acquire images of the chute opening in real time when the casting ladle stops pouring molten copper into the copper mold; The detection module 202 is used to perform feature detection on the image. When copper liquid adhesion is detected at the chute opening, a first control signal is sent to the lever motion mechanism 203. The lever motion mechanism 203 includes a lever that can swing in the horizontal direction; the lever motion mechanism 203 is used to control the lever to swing after receiving the first control signal, so as to remove the copper liquid adhesion at the chute opening.

[0055] Furthermore, it also includes: The cropping module 204 is used to crop the image according to a preset region of interest, wherein the region of interest includes the chute opening and its surrounding area.

[0056] Further, the detection module 202 is specifically used to extract the edge of the image to obtain the edge features of the image; compare the edge features of the image with the edge features of a normal sample, wherein the normal sample is a chute opening image without copper liquid adhesion; if the edge features of the image have redundant edge contours, it is determined that copper liquid adhesion exists in the image.

[0057] Furthermore, the detection module 202 is also used to send a second control signal to the lever motion mechanism 203 when it is detected that the copper liquid adhesion at the chute opening has been removed; The lever motion mechanism 203 is also used to control the lever to stop swinging and reset after receiving the second control signal.

[0058] Example 3 This embodiment is a computer-readable storage medium corresponding to the above embodiments, which stores a computer program. When the program is executed by a processor, it implements the various steps of the copper liquid adhesion cleaning method in the above embodiments and can achieve the same technical effect, which will not be repeated here.

[0059] In summary, the present invention provides a method, apparatus, and computer-readable storage medium for cleaning copper molten material adhesion. By real-time imaging to determine whether there is copper molten material adhesion at the chute opening of the casting ladle, and if so, controlling the movement mechanism of the lever to clean it, the copper molten material adhesion can be cleaned in a timely manner, thereby improving the casting quality of the anode plate, ensuring production efficiency, protecting equipment and process stability, and reducing safety risks and costs.

[0060] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A copper liquid-bonded cleaning method characterized by, include: During the intervals between copper molten casting, images of the chute opening are acquired in real time; Perform feature detection on the image; When copper liquid is detected adhering to the chute opening, the lever in the control lever mechanism swings to remove the copper liquid adhering to the chute opening.

2. The copper liquid-bonded cleaning method according to claim 1, characterized by, The real-time acquisition of images of the chute opening during the copper molten casting interval includes: When the casting ladle stops pouring molten copper into the copper mold, the image acquisition device captures the image of the chute opening in real time.

3. The copper liquid-bonded cleaning method according to claim 1, characterized by, Before performing feature detection on the image, the process further includes: The image is cropped according to a preset region of interest, which includes the chute opening and its surrounding area.

4. The copper liquid-bonded cleaning method according to claim 1, characterized by, The feature detection of the image includes: Edge extraction is performed on the image to obtain the edge features of the image; The edge features of the image are compared with the edge features of a normal sample, which is a chute opening image without copper liquid adhesion. If the edge features of the image have redundant edge contours, it is determined that copper liquid adhesion exists in the image.

5. The copper liquid-bonded cleaning method according to claim 1, characterized by, After detecting copper liquid adhesion at the chute opening and controlling the lever in the lever movement mechanism to swing to remove the copper liquid adhesion at the chute opening, the process further includes: When it is detected that the copper liquid adhesion at the chute opening has been removed, the control lever stops swinging and resets.

6. A copper liquid bond cleaning apparatus characterized by, include: The image acquisition module is used to acquire images of the chute opening in real time when the casting ladle stops pouring molten copper into the copper mold. The detection module is used to perform feature detection on the image. When copper liquid adhesion is detected at the chute opening, a first control signal is sent to the lever motion mechanism. A lever motion mechanism includes a lever that can swing in the horizontal direction; the lever motion mechanism is used to control the lever to swing after receiving the first control signal, so as to remove the copper liquid adhesion at the chute opening.

7. The copper liquid-bonded cleaning device according to claim 6, characterized by Also includes: The cropping module is used to crop the image according to a preset region of interest, the region of interest including the chute opening and its surrounding area.

8. The copper liquid bond cleaning apparatus of claim 6, wherein, The detection module is specifically used to extract edges from the image to obtain the edge features of the image; compare the edge features of the image with the edge features of a normal sample, wherein the normal sample is a chute opening image without copper liquid adhesion; if the edge features of the image have redundant edge contours, it is determined that copper liquid adhesion exists in the image.

9. The copper liquid bond cleaning apparatus of claim 6, wherein, The detection module is also used to send a second control signal to the lever mechanism when it detects that the copper liquid adhesion at the chute opening has been removed. The lever mechanism is also used to control the lever to stop swinging and reset after receiving the second control signal.

10. A computer-readable storage medium having stored thereon a computer program, characterized in that, When the program is executed by the processor, it implements the method as described in any one of claims 1-5.

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