Electrode sheet manufacturing method, apparatus, and storage medium

Abstract

This application discloses an electrode sheet preparation method, equipment, and storage medium. The method includes: acquiring a first surface image of a copper sheet laminate to identify the non-welded and welded areas of the copper sheet laminate; marking one of the welded areas as a target area, and using a metal shielding baffle to shield other areas of the copper sheet laminate, then sending it to a pressure welding device for pressure welding to fuse the target areas into a single, rigid connection segment; marking another welded area as a new target area and re-shielding and pressure welding it, dynamically adjusting the pressure welding parameters of the current pressure welding device based on the fusion result of the previous target area; punching the copper sheet laminate according to the target shape to obtain an electrode sheet blank, and silver-plating all rigid connection segments to obtain the finished electrode sheet. This application can improve the pressure welding quality of copper sheet laminates and ensure the consistency of electrode sheet forming and its reliability in use.

Description

Technical Field

[0001] This application relates to the field of automated production technology, and in particular to a method, equipment and storage medium for preparing electrode sheets. Background Technology

[0002] Electrode sheets are often made by stacking multiple layers of copper sheets. During the manufacturing process, the end connection areas of the copper sheet stack need to be pressure welded to form a stable conductive connection structure. The middle area remains independent between layers to adapt to the assembly and electrical use requirements of the electrode sheet. This segmented molding method is also a common manufacturing method for multi-layer copper sheet electrodes.

[0003] In the current process of pressure welding the connection section of multi-layer copper electrode sheets, it is difficult to achieve stable control of the overall processing quality. The positioning accuracy of the welding position and the parameter control of the welding process are prone to deviation. Excessive welding can easily lead to over-welding due to excessive welding amount or welding time, causing workpiece deformation. Insufficient welding amount or incomplete welding can also lead to substandard connection strength, making it difficult to ensure the consistency of electrode sheet forming and the reliability of use. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an electrode sheet preparation method, equipment, and storage medium, which can improve the pressure welding quality of copper sheet laminates and ensure the forming consistency and reliability of the electrode sheets.

[0005] In a first aspect, this application provides a method for preparing an electrode sheet, comprising: Multi-layer copper sheets are pre-cleaned and stacked to form a copper sheet composite. A first surface image of the copper sheet laminate is acquired, and based on the first surface image, the non-welded area and at least two welded areas of the copper sheet laminate are identified. One of the welding areas is marked as the target area, and a metal shielding baffle is used to shield the non-welded areas and other welding areas of the copper sheet assembly so that the target area is exposed outside the metal shielding baffle. The shielded copper sheet composite is fed into a pressure welding device, and the pressure welding device is controlled to perform pressure welding on the target area to fuse the target area into a whole to form a rigid connection segment. Another welding area is marked as a new target area. The copper sheet composite is then re-shielded and pressure-welded using the metal shielding baffle. The pressure-welding parameters of the current pressure-welding device are dynamically adjusted based on the fusion result of the previous target area until all welding areas on the copper sheet composite are pressure-welded. According to the target shape of the preset electrode sheet, the copper sheet stack is punched to obtain the electrode sheet blank; All the hard-state connecting segments in the electrode blank are silver-plated to obtain the finished electrode sheet.

[0006] The electrode sheet preparation method according to the first aspect of this application has at least the following beneficial effects: By pre-cleaning and stacking multiple layers of copper sheets to form a copper sheet composite, a first surface image of the copper sheet composite is acquired to identify non-welding areas and at least two welding areas. After masking the corresponding areas using a metal shielding baffle, each welding area is sequentially pressure-welded to form a hardened connection segment. During the pressure-welding process, the pressure-welding parameters of the current pressure-welding device are dynamically adjusted based on the fusion result of the previous target area. After welding is completed in all welding areas, an electrode sheet blank is punched according to the preset target shape of the electrode sheet. Then, the hardened connection segment of the electrode sheet blank is silver-plated to obtain the finished electrode sheet. Image recognition standardizes the positioning of welding-related areas, and the dynamic adjustment of pressure-welding parameters based on the previous fusion result effectively avoids over-welding or insufficient welding, improves the pressure-welding quality of the copper sheet composite, and ensures the consistency of electrode sheet forming and its reliability.

[0007] According to some embodiments of the first aspect of this application, the pre-cleaning process of multilayer copper sheets and the stacking to form a copper sheet composite includes: The multi-layer copper sheets are sequentially placed into an ultrasonic alkaline cleaning tank, a first pure water cleaning tank, a weak acid activation cleaning tank, and a second pure water cleaning tank for cleaning, in order to remove impurities from the surface of the copper sheets and etch away the oxide film on the surface of the copper sheets. The cleaned copper sheet is placed in a vacuum drying oven for low-temperature drying. After the copper sheets have been dried at low temperature, they are taken out and stacked according to the preset number of layers to form a copper sheet composite.

[0008] According to some embodiments of the first aspect of this application, the step of identifying the non-welded area and at least two welded areas of the copper sheet composite based on the first surface image includes: The first surface image is subjected to noise reduction and grayscale processing. Based on the changes in pixel grayscale values ​​after processing, it is divided into a foreground region and a background region. The background region is removed and the foreground region is retained. Contour features are extracted from the image of the foreground region to obtain image contour features; A preset electrode area feature template is invoked, and the image contour features are compared with the electrode area feature template to determine the non-welded area and at least two welded areas of the copper sheet composite.

[0009] According to some embodiments of the first aspect of this application, marking one of the welded areas as a target area and shielding the non-welded areas and other welded areas of the copper sheet assembly with a metal shielding baffle, so that the target area is exposed outside the metal shielding baffle, includes: Obtain the preset welding sequence, determine the next welding area to be welded in the copper sheet composite, and mark it as the target area; Based on the first surface image, the number and size of the corresponding metal shielding baffles are determined according to the position and size of the non-welded area and other welded areas of the copper sheet stack; The corresponding metal shielding baffle is covered on the non-welded area and other welded areas of the copper sheet stack, and a second surface image of the copper sheet stack after the shielding process is completed is acquired. Based on the second surface image, the target contour features of the target area are extracted, and the corresponding positions of the target contour features and the preset electrode area feature template are compared. The metal shielding baffle is then finely adjusted so that the target area is exposed outside the metal shielding baffle.

[0010] According to some embodiments of the first aspect of this application, the step of dynamically adjusting the pressure welding parameters of the current pressure welding device based on the fusion result of the previous target region includes: After the target area is pressure welded as described above, the target area is scanned and detected by the ultrasonic penetration depth detection probe built into the pressure welding device, and penetration depth data at several different points in the target area are collected. After filtering the melting depth data, the average melting depth value, maximum melting depth value and minimum melting depth value corresponding to the target area are obtained, and the melting depth deviation is calculated based on the maximum melting depth value and the minimum melting depth value. Obtain the preset standard range and deviation threshold for melting depth; When the average penetration value is less than the minimum value of the penetration standard range, increase at least one of the pressure welding temperature, pressure welding pressure, or holding time of the pressure welding device; When the average penetration depth value is greater than the maximum value of the standard penetration depth range, reduce at least one of the pressure welding temperature, pressure welding pressure, or holding time of the pressure welding device; When the average penetration value is within the penetration standard range and the penetration deviation is greater than the deviation threshold, maintain the welding temperature and welding pressure of the pressure welding device, adjust the pressure distribution of the welding head of the pressure welding device, and increase the holding time of the pressure welding device; When the average penetration value is within the penetration standard range and the penetration deviation is less than or equal to the deviation threshold, the pressure welding parameters of the pressure welding device are not adjusted.

[0011] According to some embodiments of the first aspect of this application, before the step of punching the copper sheet stack according to the target shape of the preset electrode sheet to obtain the electrode sheet blank, the method further includes: The hard-state connection section of the copper sheet stack after all pressure welding processes are scanned by an ultrasonic scanning head, and the corresponding ultrasonic echo signal is received. Image acquisition is performed on the copper sheet composite after all pressure welding processes are completed to obtain a third surface image; Based on the echo amplitude and echo time of the ultrasonic echo signal, and the third surface image, the defect type and corresponding defect location of the copper sheet composite are determined; wherein, the defect type includes delamination defect, cold solder joint defect, bubble defect and bump defect.

[0012] According to some embodiments of the first aspect of this application, the step of punching the copper sheet stack according to the target shape of the preset electrode sheet to obtain the electrode sheet blank includes: Based on the target shape of the preset electrode sheet and the third surface image, determine the initial punching position on the copper sheet stack; Obtain the defect score for each defect type, and calculate the total defect score for the initial punching position based on the defect score and the defect position; Based on the constraint relationship between the wiring terminals of the preset electrode sheet and the rigid connection section, the initial punching position is adjusted according to the defect type and the defect location, and the total defect score is calculated. The position with the lowest total defect score is selected as the target punching position, and the copper sheet assembly is punched according to the target punching position to obtain the electrode blank.

[0013] According to some embodiments of the first aspect of this application, before the step of silver plating all the hardened connecting segments in the electrode blank to obtain the finished electrode sheet, the method further includes: Based on the target hole positions of the preset electrode sheet, a number of corresponding construction points are located on the electrode sheet blank. According to the construction points, the electrode blank is drilled, and the two sides of the drilling points are polished.

[0014] Secondly, this application also provides an electrode sheet fabrication apparatus, comprising: At least one memory; At least one processor; At least one program; The program is stored in the memory, and the processor executes at least one of the programs to implement the electrode sheet preparation method as described in any embodiment of the first aspect.

[0015] Thirdly, this application also provides a computer-readable storage medium storing a computer-executable program for performing the electrode sheet preparation method as described in any embodiment of the first aspect.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] Additional aspects and advantages of this application will become apparent and readily understood in conjunction with the following description of the embodiments, in which: Figure 1 Flowcharts of electrode sheet preparation methods provided in some embodiments of this application; Figure 2 For this application Figure 1 The flowchart for step S110 is shown below; Figure 3 For this application Figure 1 The flowchart for step S120 is shown below; Figure 4 For this application Figure 1 The flowchart for step S130 is shown below; Figure 5 For this application Figure 1 The flowchart for step S150 is shown below; Figure 6 For this application Figure 1 The flowchart above refers to the steps preceding S160; Figure 7 For this application Figure 1 The flowchart for step S160 is shown below; Figure 8 For this application Figure 1 The flowchart for step S170. Detailed Implementation

[0018] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0019] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] In the description of this application, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0021] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0022] Electrode sheets are often made by stacking multiple layers of copper sheets. During the manufacturing process, the end connection areas of the copper sheet stack need to be pressure welded to form a stable conductive connection structure. The middle area remains independent between layers to adapt to the assembly and electrical use requirements of the electrode sheet. This segmented molding method is also a common manufacturing method for multi-layer copper sheet electrodes.

[0023] In the current process of pressure welding the connection section of multi-layer copper electrode sheets, it is difficult to achieve stable control of the overall processing quality. The positioning accuracy of the welding position and the parameter control of the welding process are prone to deviation. Excessive welding can easily lead to over-welding due to excessive welding amount or welding time, causing workpiece deformation. Insufficient welding amount or incomplete welding can also lead to substandard connection strength, making it difficult to ensure the consistency of electrode sheet forming and the reliability of use.

[0024] Based on this, this application provides an electrode sheet preparation method, equipment, and storage medium to solve the above-mentioned technical problems. The technical solutions provided by this application will be described in detail below.

[0025] Reference Figure 1 This application provides a method for preparing an electrode sheet, which may include, but is not limited to, the following steps: Step S110: Pre-clean the multi-layer copper sheets and stack them to form a copper sheet composite.

[0026] Step S120: Acquire a first surface image of the copper sheet laminate and, based on the first surface image, identify the non-welded area and at least two welded areas of the copper sheet laminate.

[0027] Step S130: Mark one of the welding areas as the target area, and use a metal shielding baffle to shield the non-welded areas and other welding areas of the copper sheet assembly so that the target area is exposed outside the metal shielding baffle.

[0028] Step S140: The shielded copper sheet composite is fed into the pressure welding device, and the pressure welding device is controlled to perform pressure welding on the target area to fuse the target area into a whole to form a hard connection segment.

[0029] Step S150: Mark another welding area as a new target area, re-mask and pressure weld the copper sheet composite using a metal shielding baffle, and dynamically adjust the pressure welding parameters of the current pressure welding device according to the fusion result of the previous target area until all welding areas on the copper sheet composite are pressure welded.

[0030] Step S160: According to the target shape of the preset electrode sheet, the copper sheet stack is punched to obtain the electrode sheet blank.

[0031] Step S170: Silver plating is performed on all hard-state connecting sections in the electrode blank to obtain the finished electrode sheet.

[0032] In steps S110 to S170, multi-layer copper sheets are pre-cleaned and stacked to form a copper sheet composite. A first surface image of the composite is acquired to identify non-welding areas and at least two welding areas. These areas are then masked using metal shielding plates. Each welding area is then sequentially pressure-welded to form a hardened connection segment. During the pressure-welding process, the pressure-welding parameters of the current pressure-welding device are dynamically adjusted based on the fusion result of the previous target area. After welding is completed in all welding areas, an electrode blank is punched according to the preset target shape of the electrode sheet. The hardened connection segment of the electrode blank is then silver-plated to obtain the finished electrode sheet. Image recognition standardizes the positioning of welding-related areas, and the dynamic adjustment of pressure-welding parameters based on the previous fusion result effectively avoids over-welding or insufficient welding, improving the pressure-welding quality of the copper sheet composite and ensuring the consistency and reliability of the electrode sheet forming.

[0033] It is understood that step S110 may include, but is not limited to, the following steps: Step S210: The multi-layer copper sheets are sequentially placed into an ultrasonic alkaline cleaning tank, a first pure water cleaning tank, a weak acid activation cleaning tank, and a second pure water cleaning tank for cleaning, in order to remove impurities on the surface of the copper sheets and etch away the oxide film on the surface of the copper sheets.

[0034] Step S220: Place the cleaned copper sheet into a vacuum drying oven for low-temperature drying.

[0035] Step S230: Take out the copper sheets after the multi-layer low-temperature drying is completed, and stack the copper sheets according to the preset number of layers to form a copper sheet composite.

[0036] In steps S210 to S230, by sequentially immersing multiple layers of copper sheets in an ultrasonic alkaline cleaning tank, a first pure water cleaning tank, a weak acid activation cleaning tank, and a second pure water cleaning tank, impurities on the surface of the copper sheets are reliably removed and the oxide film on the surface of the copper sheets is etched away, avoiding adverse effects of impurities and oxide film on the subsequent pressure welding fusion process. The cleaned copper sheets are then placed in a vacuum drying oven for low-temperature drying, which prevents secondary oxidation and water stains on the surface of the copper sheets while drying them, ensuring a clean and stable surface condition. Finally, the low-temperature dried copper sheets are stacked according to a preset number of layers to form a copper sheet composite. The pre-cleaning step ensures that the copper sheet composite has a regular interlayer bonding state, thus providing a good processing foundation for the subsequent pressure welding process to form a hard connection segment and improving the overall fabrication quality of the electrode sheet.

[0037] It should be noted that when placing the copper sheets in the ultrasonic alkaline cleaning tank, the ultrasonic vibration function should be activated to generate high-frequency vibration in the cleaning solution. Simultaneously, multiple layers of copper sheets should be laid flat within a slowly rotating fixture to ensure that the surface of the copper sheets and the gaps between layers are fully in contact with the ultrasonic alkaline cleaning solution, ensuring thorough removal of surface impurities and preventing localized residue. After entering the first pure water cleaning tank, high-pressure pure water spray combined with gentle vibration of the fixture is used to rinse both sides of the copper sheets. The vibration quickly removes any residual alkaline cleaning solution adhering to the surface of the copper sheets, while the spray precisely washes the edges and gaps of the copper sheets, reducing blind spots. In the weak acid activation cleaning tank, low-frequency ultrasonic vibration is activated to allow the weak acid cleaning solution to penetrate evenly to the surface of the copper sheets. Simultaneously, the fixture is controlled to move the copper sheets slowly back and forth, ensuring that every surface of the copper sheets is fully in contact with the weak acid solution, ensuring uniform etching of the surface oxide film and preventing localized oxide film residue. After entering the second pure water cleaning tank, the copper sheet is continuously refreshed by overflow rinsing combined with gentle stirring. The stirring action causes the copper sheet to shake slightly, which accelerates the removal of residual weak acid cleaning solution from the surface, ensuring that there are no chemical residues on the surface of the copper sheet, thus laying the foundation for the subsequent vacuum low-temperature drying process.

[0038] It is understood that step S120 may include, but is not limited to, the following steps: Step S310: Denoise and grayscale processing is performed on the first surface image. The image is divided into foreground and background regions based on the changes in pixel grayscale values ​​after processing. The background region is removed and the foreground region is retained.

[0039] Step S320: Extract contour features from the image of the foreground region to obtain image contour features.

[0040] Step S330: Call the preset electrode area feature template, and compare the image contour features with the electrode area feature template to determine the non-welded area and at least two welded areas of the copper sheet composite.

[0041] In steps S310 to S330, by performing noise reduction and grayscale processing on the first surface image, and then dividing the foreground and background regions based on pixel grayscale value changes and removing irrelevant backgrounds, environmental interference can be effectively eliminated, highlighting the effective image information of the copper sheet laminate. After extracting the contour features of the foreground region, it is compared with the preset electrode sheet region feature template, which can accurately distinguish the non-welded areas and at least two welded areas of the copper sheet laminate. The overall recognition process is accurate and stable, avoiding process deviations caused by region recognition errors, providing a reliable basis for the subsequent masking and pressure welding processes of the metal masking baffle, thereby ensuring the fabrication accuracy of the electrode sheet.

[0042] It is understood that step S130 may include, but is not limited to, the following steps: Step S410: Obtain the preset welding planning sequence, determine the next welding area in the copper sheet composite, and mark it as the target area.

[0043] Step S420: Based on the first surface image, determine the number and size of the corresponding metal shielding baffles according to the position and size of the non-welded area and other welded areas of the copper sheet stack.

[0044] Step S430: Cover the non-welded areas and other welded areas of the copper sheet stack with the corresponding metal shielding baffle, and acquire the second surface image of the copper sheet stack after the shielding process is completed.

[0045] Step S440: Based on the second surface image, extract the target contour features of the target area, compare the corresponding positions of the target contour features with the preset electrode area feature template, and fine-tune the metal shielding baffle so that the target area is exposed outside the metal shielding baffle.

[0046] In steps S410 to S440, the target welding area is determined according to the preset welding plan sequence, allowing the masking and pressure welding processes to proceed in an orderly manner. Matching the position and size of the non-welding area and other welding areas with the corresponding number and size of metal masking baffles ensures the adaptability of the masking coverage. By acquiring a second surface image and comparing the target contour features with a preset electrode sheet area feature template, the metal masking baffles are fine-tuned, ensuring that the target area is accurately exposed outside the metal masking baffles, effectively preventing non-welding areas and other welding areas from being incorrectly processed during pressure welding. This masking method is precise and controllable, providing a guarantee for the stable execution of subsequent pressure welding processes and further improving the quality of electrode sheet fabrication.

[0047] It should be noted that the welding sequence can be determined based on the tooling positioning of each welding area on the copper sheet composite, prioritizing welding of areas closer to the tooling's fixed end. Alternatively, it can be determined by considering the heat impact of each welding area on the intermediate non-welded areas, prioritizing welding areas with lower heat impact. Furthermore, the welding sequence can be set according to the assembly and usage requirements of the finished electrode sheet, based on the functional priority of the rigid connection section. This application does not impose specific limitations on the determination of the welding sequence.

[0048] It is understood that the step of dynamically adjusting the pressure welding parameters of the pressure welding device in step S150 may include, but is not limited to, the following steps: Step S510: After the previous target area is pressure welded, the target area is scanned and detected by the ultrasonic penetration depth detection probe built into the pressure welding device, and penetration depth data of several different points in the target area are collected.

[0049] Step S520: After filtering the melting depth data, the average melting depth value, maximum melting depth value and minimum melting depth value corresponding to the target area are obtained, and the melting depth deviation is calculated based on the maximum melting depth value and the minimum melting depth value.

[0050] Step S530: Obtain the preset melting depth standard range and deviation threshold.

[0051] Step S540: When the average penetration depth is less than the minimum value of the standard penetration depth range, increase at least one of the pressure welding temperature, pressure welding pressure, or holding time of the pressure welding device.

[0052] Step S550: When the average penetration depth is greater than the maximum value of the standard penetration depth range, reduce at least one of the pressure welding temperature, pressure welding pressure, or holding time of the pressure welding device.

[0053] Step S560: When the average penetration value is within the standard penetration range and the penetration deviation is greater than the deviation threshold, maintain the welding temperature and welding pressure of the pressure welding device, adjust the pressure distribution of the welding head of the pressure welding device, and increase the holding time of the pressure welding device.

[0054] Step S570: When the average penetration value is within the standard penetration range and the penetration deviation is less than or equal to the deviation threshold, the pressure welding parameters of the pressure welding device are not adjusted.

[0055] In steps S510 to S570, the weld depth data of the previous target area is collected using an ultrasonic weld depth detection probe. After processing, the average weld depth value and weld depth deviation are obtained. Combined with a preset weld depth standard range and deviation threshold, the pressure welding parameters are adjusted differentially to achieve precise adaptation to the pressure welding process. By dynamically adjusting based on the actual fusion results, problems such as insufficient weld depth, excessive weld depth, and uneven weld depth can be avoided, ensuring a stable and consistent fusion effect in each welding area. This guarantees the forming quality of the hardened connection section and improves the overall structural reliability and operational stability of the electrode sheet.

[0056] It should be noted that the inspection points are evenly distributed according to the outline of the target area. The center and symmetrical positions of the target area are selected as inspection points. At the same time, a number of points are selected in a matrix pattern within the target area to ensure that the points fully cover the welding range of the target area. The average penetration depth is calculated by summing the penetration depth data of all points and dividing by the total number of inspection points. The penetration depth deviation is calculated by the difference between the maximum and minimum penetration depth values.

[0057] In step S530, the standard fusion depth range is a pre-set fusion depth interval that ensures the qualified welding of the hardened joint section. It is used to determine whether the overall fusion depth of the current welding area meets the basic requirements of structural strength and electrical conductivity. The deviation threshold is a critical value used to measure the uniformity of fusion depth at different points within the welding area. By comparing the actual fusion depth deviation with this threshold, it can be determined whether there are problems such as excessive or insufficient fusion depth in some areas, thus providing a basis for the fine adjustment of welding parameters.

[0058] It is understood that, prior to step S160, the following steps may also be included, but are not limited to: Step S610: Scan the hard connection section of the copper sheet laminate that has undergone all pressure welding processes using an ultrasonic scanning head, and receive the corresponding ultrasonic echo signal.

[0059] Step S620: Image acquisition is performed on the copper sheet composite that has completed all pressure welding processes to obtain the third surface image.

[0060] Step S630: Based on the echo amplitude and echo time of the ultrasonic echo signal, as well as the third surface image, determine the defect type and corresponding defect location of the copper sheet composite; wherein, the defect types include delamination defects, cold solder joint defects, bubble defects and bump defects.

[0061] In steps S610 to S630, an ultrasonic scanning head scans the hardened connection section of the copper sheet laminate after all pressure welding processes are completed, and the corresponding ultrasonic echo signals are received. Simultaneously, an image of the third surface is acquired from the copper sheet laminate. By combining the ultrasonic echo amplitude, echo time, and the third surface image, delamination defects, cold solder joint defects, bubble defects, bump defects, and their corresponding locations are accurately determined in the copper sheet laminate. This detection step can identify various defects generated during the pressure welding process before the punching process, providing a substantial reference for the subsequent punching process, thereby improving the yield and overall quality of the finished electrode sheet.

[0062] It should be noted that, for the above-mentioned defect detection, when the ultrasonic echo shows abnormally strong reflection and the echo time undergoes a step-like abrupt change, and interlayer contour misalignment or gap features appear at the corresponding position in the third surface image, it is judged as a delamination defect; when the ultrasonic echo amplitude shows significant attenuation and the echo time distribution is disordered, but the third surface image shows no significant appearance abnormalities, it is judged as a cold solder joint defect; when the ultrasonic echo has local peak reflections and the echo time is discontinuous, and there is a slight bulge at the corresponding position in the third surface image, it is judged as a bubble defect; when the ultrasonic echo does not show internal signal abnormalities, but there are obvious bulges or overflow contours in the third surface image, it is judged as a protrusion defect.

[0063] It is understood that step S160 may include, but is not limited to, the following steps: Step S710: Determine the initial punching position on the copper sheet stack based on the target shape of the preset electrode sheet and the third surface image.

[0064] Step S720: Obtain the defect score for each defect type, and calculate the total defect score for the initial punching position based on the defect score and defect position.

[0065] Step S730: Based on the constraint relationship between the wiring terminals of the preset electrode sheet and the hard connection section, adjust the initial punching position according to the defect type and defect location, and calculate the total defect score.

[0066] Step S740: Select the position with the lowest total defect score as the target punching position, and punch the copper sheet stack according to the target punching position to obtain the electrode sheet blank.

[0067] In steps S710 to S740, the initial punching position is determined by combining the target shape of the preset electrode sheet with the third surface image. The total defect score of the initial punching position is calculated based on the defect scores and locations of different defect types. Simultaneously, the initial punching position is adjusted and optimized based on the constraint relationship between the wiring terminal and the rigid connection section. By selecting the position with the lowest total defect score as the target punching position, various defects on the copper sheet laminate can be avoided to the greatest extent possible. This satisfies the structural constraints of the electrode sheet while reducing the impact of defects on the quality of the electrode sheet blank, effectively improving the pass rate of the final electrode sheet product.

[0068] It should be noted that the constraint relationship between the terminals of the preset electrode sheet and the rigid connection section means that each terminal of the electrode sheet must be set in the effective area of ​​the rigid connection section, and each terminal must meet the minimum overlap area requirement on the rigid connection section.

[0069] In one embodiment, after ultrasonic and visual inspection, a copper sheet laminate was found to have a cold solder joint near the hardened connection section on its right side and a bump defect in the middle region. The pre-set scores for delamination defects (5 points), cold solder joint defects (4 points), bubble defects (3 points), and bump defects (2 points) were determined. The system first determines an initial punching position based on the target shape of the electrode sheet and the third surface image. This position's contour passes precisely through the areas containing the cold solder joint and bump defects, and the total defect score for this initial punching position is calculated to be 6 points. Then, while ensuring the relative position of the electrode sheet's terminal and the hardened connection section remains unchanged, the system slightly shifts the punching contour to the left, ensuring the punching boundary avoids the cold solder joint defect, leaving only the bump defect within the punching contour's range. The total defect score for this adjusted position is recalculated to be 2 points. The system compares the total defect scores of different punching positions and selects the adjusted position with the lowest total defect score as the target punching position. The copper sheet laminate is then punched at this position to obtain an electrode sheet blank that avoids severe defects.

[0070] It is understood that, prior to step S170, the following steps may also be included, but are not limited to: Step S810: Based on the target hole positions of the preset electrode sheet, locate several corresponding construction points on the electrode sheet blank.

[0071] Step S820: According to the construction point, drill holes in the electrode blank and grind both sides of the drilling point.

[0072] In steps S810 to S820, several corresponding construction points are located on the electrode blank according to the preset target hole positions of the electrode sheet. This ensures that the drilling positions accurately match the actual usage requirements of the electrode sheet, guaranteeing the stability of subsequent assembly and connection. After drilling, the two sides of the drilling points are polished to effectively remove burrs from the hole edges, preventing burrs from affecting the silver plating effect of the subsequent hardened connection section.

[0073] Secondly, this application also provides an electrode sheet preparation apparatus, comprising: at least one memory, at least one processor and at least one program, wherein the program is stored in the memory and the processor executes one or more programs to implement the above-described electrode sheet preparation method.

[0074] In this electrode fabrication equipment, multi-layer copper sheets are pre-cleaned and stacked to form a copper sheet composite. An image of the first surface of the composite is acquired to identify non-welding areas and at least two welding areas. These areas are then masked using metal shielding plates. Each welding area is sequentially pressure-welded to form a hardened connection segment. During the pressure-welding process, the welding parameters are dynamically adjusted based on the fusion results of the previous target area. After welding is completed in all areas, an electrode blank is punched according to the preset target shape. The hardened connection segments of the electrode blank are then silver-plated to obtain the finished electrode sheet. Image recognition standardizes the positioning of welding-related areas, and the dynamic adjustment of welding parameters based on the previous fusion results effectively avoids over-welding or insufficient welding, improving the welding quality of the copper sheet composite and ensuring the consistency and reliability of the electrode sheet.

[0075] The memory may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store relevant data regarding the electrode preparation method described above. Furthermore, the memory may include high-speed random access memory and non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processing module via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0076] One or more signals are stored in a memory, and when executed by one or more processors, the electrode preparation method in any of the above method embodiments is performed.

[0077] Thirdly, embodiments of this application provide a computer-readable storage medium storing a computer program that is executed by one or more processors, causing the one or more processors to perform the electrode sheet preparation method in the above method embodiments.

[0078] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0079] Based on the above description of the embodiments, those skilled in the art will understand that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which may include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable signals, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible by a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable signals, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0080] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0081] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0082] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0083] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0084] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0085] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A method of making an electrode sheet, characterized by, include: Multi-layer copper sheets are pre-cleaned and stacked to form a copper sheet composite. A first surface image of the copper sheet laminate is acquired, and based on the first surface image, the non-welded area and at least two welded areas of the copper sheet laminate are identified. One of the welding areas is marked as the target area, and a metal shielding baffle is used to shield the non-welded areas and other welding areas of the copper sheet assembly so that the target area is exposed outside the metal shielding baffle. The shielded copper sheet composite is fed into a pressure welding device, and the pressure welding device is controlled to perform pressure welding on the target area to fuse the target area into a whole to form a rigid connection segment. Another welding area is marked as a new target area. The copper sheet composite is then re-shielded and pressure-welded using the metal shielding baffle. The pressure-welding parameters of the current pressure-welding device are dynamically adjusted based on the fusion result of the previous target area until all welding areas on the copper sheet composite are pressure-welded. According to the target shape of the preset electrode sheet, the copper sheet stack is punched to obtain the electrode sheet blank; All the hard-state connecting segments in the electrode blank are silver-plated to obtain the finished electrode sheet.

2. The method of claim 1, wherein The process of pre-cleaning and stacking multiple layers of copper sheets to form a copper sheet composite includes: The multi-layer copper sheets are sequentially placed into an ultrasonic alkaline cleaning tank, a first pure water cleaning tank, a weak acid activation cleaning tank, and a second pure water cleaning tank for cleaning, in order to remove impurities from the surface of the copper sheets and etch away the oxide film on the surface of the copper sheets. The cleaned copper sheet is placed in a vacuum drying oven for low-temperature drying. After the copper sheets have been dried at low temperature, they are taken out and stacked according to the preset number of layers to form a copper sheet composite.

3. The method of claim 1, wherein The step of identifying the non-welded area and at least two welded areas of the copper sheet composite based on the first surface image includes: The first surface image is subjected to noise reduction and grayscale processing. Based on the changes in pixel grayscale values ​​after processing, it is divided into a foreground region and a background region. The background region is removed and the foreground region is retained. Contour features are extracted from the image of the foreground region to obtain image contour features; A preset electrode area feature template is invoked, and the image contour features are compared with the electrode area feature template to determine the non-welded area and at least two welded areas of the copper sheet composite.

4. The method of claim 1, wherein The step of marking one of the welded areas as the target area and using a metal shielding baffle to shield the non-welded areas and other welded areas of the copper sheet assembly, so that the target area is exposed outside the metal shielding baffle, includes: Obtain the preset welding sequence, determine the next welding area to be welded in the copper sheet composite, and mark it as the target area; Based on the first surface image, the number and size of the corresponding metal shielding baffles are determined according to the position and size of the non-welded area and other welded areas of the copper sheet stack; The corresponding metal shielding baffle is covered on the non-welded area and other welded areas of the copper sheet stack, and a second surface image of the copper sheet stack after the shielding process is completed is acquired. Based on the second surface image, the target contour features of the target area are extracted, and the corresponding positions of the target contour features and the preset electrode area feature template are compared. The metal shielding baffle is then finely adjusted so that the target area is exposed outside the metal shielding baffle.

5. The method of claim 1, wherein The step of dynamically adjusting the pressure welding parameters of the current pressure welding device based on the fusion result of the previous target area includes: After the target area is pressure welded as described above, the target area is scanned and detected by the ultrasonic penetration depth detection probe built into the pressure welding device, and penetration depth data at several different points in the target area are collected. After filtering the melting depth data, the average melting depth value, maximum melting depth value and minimum melting depth value corresponding to the target area are obtained, and the melting depth deviation is calculated based on the maximum melting depth value and the minimum melting depth value. Obtain the preset standard range and deviation threshold for melting depth; When the average penetration value is less than the minimum value of the penetration standard range, increase at least one of the pressure welding temperature, pressure welding pressure, or holding time of the pressure welding device; When the average penetration depth value is greater than the maximum value of the standard penetration depth range, reduce at least one of the pressure welding temperature, pressure welding pressure, or holding time of the pressure welding device; When the average penetration value is within the penetration standard range and the penetration deviation is greater than the deviation threshold, maintain the welding temperature and welding pressure of the pressure welding device, adjust the pressure distribution of the welding head of the pressure welding device, and increase the holding time of the pressure welding device; When the average penetration value is within the penetration standard range and the penetration deviation is less than or equal to the deviation threshold, the pressure welding parameters of the pressure welding device are not adjusted.

6. The method of claim 1, wherein Before the step of punching the copper sheet stack according to the preset target shape of the electrode sheet to obtain the electrode sheet blank, the method further includes: The hard-state connection section of the copper sheet stack after all pressure welding processes are scanned by an ultrasonic scanning head, and the corresponding ultrasonic echo signal is received. Image acquisition is performed on the copper sheet composite after all pressure welding processes are completed to obtain a third surface image; Based on the echo amplitude and echo time of the ultrasonic echo signal, and the third surface image, the defect type and corresponding defect location of the copper sheet composite are determined; wherein, the defect type includes delamination defect, cold solder joint defect, bubble defect and bump defect.

7. The method of claim 6, wherein the step of applying the adhesive is performed after the step of applying the conductive material. The step of punching the copper sheet stack according to the preset target shape of the electrode sheet to obtain the electrode sheet blank includes: Based on the target shape of the preset electrode sheet and the third surface image, determine the initial punching position on the copper sheet stack; Obtain the defect score for each defect type, and calculate the total defect score for the initial punching position based on the defect score and the defect position; Based on the constraint relationship between the wiring terminals of the preset electrode sheet and the rigid connection section, the initial punching position is adjusted according to the defect type and the defect location, and the total defect score is calculated. The position with the lowest total defect score is selected as the target punching position, and the copper sheet assembly is punched according to the target punching position to obtain the electrode blank.

8. The method of claim 1, wherein Before the step of silver plating all the hardened connecting segments in the electrode blank to obtain the finished electrode sheet, the method further includes: Based on the target hole positions of the preset electrode sheet, a number of corresponding construction points are located on the electrode sheet blank. According to the construction points, the electrode blank is drilled, and the two sides of the drilling points are polished.

9. An electrode sheet manufacturing apparatus characterized by comprising: include: At least one memory; At least one processor; At least one program; The program is stored in the memory, and the processor executes at least one of the programs to implement the electrode sheet preparation method as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer-executable program for performing the electrode sheet preparation method as described in any one of claims 1 to 8.

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