Electronic product shell polishing device and polishing method

Abstract

This invention relates to the technical field of processing casings for electronic products, and more particularly to a grinding device and method for electronic product casings. The device includes a support frame symmetrically arranged with guide grooves on its inner side. A drive motor is mounted on one side of the bottom of the support frame, and a lead screw is mounted at the output end of the drive motor. A limit rod is fixedly mounted at the bottom of the support frame. A movable frame is located outside the lead screw, and a rotary motor is mounted on its top. A placement plate is mounted on the top of the rotary motor. The slag inlet grooves on the surface of the grinding block are symmetrically designed and run in opposite directions. When the rotary motor rotates clockwise, one slag inlet groove primarily functions to collect and guide slag. When the rotary motor rotates counterclockwise for reverse grinding, the symmetrically arranged slag inlet groove on the other side performs the same function. This bidirectional rotary grinding effectively eliminates the periodic textures produced by unidirectional grinding, resulting in a more uniform surface finish and more even abrasion distribution on the sandpaper, thus extending its service life.

Description

Technical Field

[0001] This invention relates to the technical field of processing casings for electronic products, and more particularly to a grinding device and grinding method for casings of electronic products. Background Technology

[0002] After molding, the circular casings of electronic products (such as smartwatch cases and wireless earphone casings) require surface polishing to remove burrs and achieve a uniform surface finish. Existing cylindrical workpiece polishing equipment suffers from the following problems in practical applications: Existing devices typically drive the workpiece to rotate in one direction while the sandpaper remains stationary. This unidirectional rotation leaves a uniform circumferential grinding texture on the workpiece surface, easily generating periodic ripples that affect surface finish and product aesthetics. Simultaneously, the sandpaper's contact path with the workpiece always repeats the same route, leading to uneven wear on the sandpaper and shortening its lifespan.

[0003] The large amount of debris generated during the grinding process, if not removed in time, will be repeatedly pressed onto the workpiece surface by the sandpaper, causing scratches. Existing devices usually rely on natural shedding or external air blowing for chip removal. External air blowing can only perform "surface cleaning" and cannot penetrate deep into the contact area between the sandpaper and the workpiece, resulting in limited chip removal efficiency.

[0004] Some devices use a motor to reverse for bidirectional grinding to improve texture uniformity, but sandpaper surface structure is usually designed for one direction. When rotating in the opposite direction, the chip removal effect will decrease significantly, resulting in an imbalance between grinding quality and chip removal efficiency in the two directions.

[0005] After grinding, debris and dust remain on the surface of the workpiece. Existing equipment usually requires manual cleaning with a brush or air gun, which increases the number of operation steps and labor intensity. Summary of the Invention

[0006] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0007] In view of the problems existing in the above-mentioned electronic product casing polishing equipment and polishing methods, the present invention is proposed.

[0008] Therefore, the purpose of this invention is to provide a grinding device and grinding method for the casing of electronic products, with the aim of improving the efficiency of grinding debris handling.

[0009] To solve the above technical problems, the present invention provides the following technical solution: a support frame, wherein the support frame is symmetrically arranged and has a guide groove on its inner side, a drive motor is provided on one side of the bottom of the support frame, a lead screw is provided at the output end of the drive motor, and a limit rod is fixedly provided at the bottom of the support frame; A movable frame is disposed outside the lead screw, and a rotary motor is disposed on its top, and a placement plate is disposed on the top of the rotary motor; An air intake component is fixedly mounted on the top side of the support frame. The air intake component includes a movable rod, a second spring is provided on one side of the movable rod, an air intake shell is provided on the outside of the second spring, and an air intake hole is provided through the outside of the air intake shell. The top side of the support frame is provided with a limiting component, which includes a cylinder, and a limiting top block is provided on one side of the cylinder.

[0010] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, the outer side of the placement tray is provided with a protrusion, the outer side of the placement tray is fixedly connected with a support ring, and the outer side of the support ring is slidably connected with a support frame.

[0011] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, the support frame is provided in two sets, with another set fixedly arranged on both sides of the movable frame, and long blocks are fixedly arranged at both ends of the support frame, the long blocks being slidably connected to the guide groove.

[0012] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, the top of the support frame is connected to a cleaning brush via a rotating shaft, and two sets of the cleaning brush are provided.

[0013] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, the top of the support frame is provided with a polishing component, the polishing component includes a polishing block, and a slag inlet groove is provided on one side of the polishing block. The slag inlet groove is inclined and symmetrically arranged.

[0014] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, the top of the slag inlet is connected to an air inlet, the other side of the polishing part is provided with a moving groove, and a reset spring is provided inside the moving groove.

[0015] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, wherein: the top of the air inlet is connected to an air inlet pipe, a movable push rod is provided on one side of the movable groove, a limiting plate is provided on one side of the movable push rod, and the limiting plate is slidably connected to the inside of the movable groove.

[0016] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, wherein: an extrusion block is provided on the outer side of the movable push rod, and a limiting member is slidably connected to the outer side of the movable push rod, the limiting member including limiting rings disposed on both sides of the extrusion block.

[0017] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, wherein: a first spring is provided on one side of the extrusion block, and a slag storage box is connected to the bottom side of the polishing block.

[0018] As a preferred embodiment of the electronic product casing polishing equipment and polishing method of the present invention, the electronic product circular casing is placed inside the placement tray, the drive motor is started to drive the lead screw to rotate, so that the moving frame moves as a whole and the casing is transported to the area to be polished; The outer shell contacts the polishing block, the polishing block pushes the moving push rod to move, the squeezing block compresses the first spring, and the limiting ring restricts the movement stroke of the polishing block, so that the polishing block fits the surface of the outer shell with appropriate pressure; The rotary motor is started to drive the placement plate to rotate, and the outer shell rotates with the placement plate and is polished by the friction of the polishing block; When the placement disc rotates, the outer protrusion intermittently squeezes the moving rod, compresses the second spring, and sends the internal air into the air inlet through the air outlet and air inlet pipes. The airflow flows along the slag inlet groove on the surface of the grinding block, blowing out the debris collected in the groove. Start the rotary motor to rotate in the opposite direction. The slag inlets are symmetrically set and in opposite directions to maintain the same slag removal effect when grinding in the opposite direction. After grinding, move the placement tray to the cleaning brush, start the motor to rotate the placement tray, and the cleaning brush removes residual debris from the surface of the workpiece.

[0019] The beneficial effects of this invention are as follows: The slag inlet grooves on the surface of the grinding block are symmetrically designed and in opposite directions. When the rotary motor rotates forward, one side of the slag inlet groove plays a major role in collecting and guiding chips; when the rotary motor rotates in reverse for reverse grinding, the symmetrically arranged slag inlet groove on the other side performs the same function. Bidirectional rotary grinding effectively eliminates the periodic textures produced by unidirectional grinding, resulting in a more uniform surface finish and more even distribution of sandpaper wear, thus extending its service life. Most of the chips generated during grinding fall naturally into the slag inlet grooves and are temporarily "collected," preventing them from being repeatedly squeezed onto the workpiece surface by the grinding block and causing scratches. When the grinding block contacts the workpiece, the grooves are in a closed state, forming micro-air channels. Compressed air blown in from the top air inlet flows at high speed along the grooves, thoroughly blowing out the chips collected in the grooves. This method of transforming external airflow "surface cleaning" into deep "line cleaning" inside the grinding block significantly improves chip removal efficiency. As the placement disc rotates, protrusions on its outer side intermittently press against the moving rod, compressing the second spring and squeezing the internal air, which is then sent into the air inlet through the air outlet and inlet pipes. The protrusions rotate continuously with the placement disc, generating a continuous pulsed airflow. This pulsed airflow is more effective at cleaning debris from the groove than a continuous airflow, and the airflow is entirely driven by the rotation of the placement disc itself, eliminating the need for a separate air pump or external air source. After grinding, the placement disc is moved to the cleaning brush, where a motor drives the disc to rotate, and the cleaning brush removes any remaining debris from the workpiece surface. Grinding and cleaning are completed on the same equipment, eliminating the need for manual workpiece transfer and manual cleaning, achieving integrated grinding and cleaning operations. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 This is a partial schematic diagram provided for the present invention.

[0022] Figure 3 Provided by the present invention Figure 2 Enlarged diagram of point A in the middle.

[0023] Figure 4 This is a schematic diagram of the overall structure provided by the present invention from another perspective.

[0024] Figure 5 Provided by the present invention Figure 4 Enlarged diagram of point B in the middle.

[0025] Figure 6This is a schematic diagram of the internal structure of the air intake component provided by the present invention.

[0026] Figure 7 This is a schematic diagram of one side of the grinding block provided by the present invention.

[0027] Figure 8 This is a schematic diagram showing the interaction between the grinding block and the movable push rod provided by the present invention. Detailed Implementation

[0028] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0029] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0030] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0031] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0032] Example 1

[0033] Reference Figures 1-8 This is the first embodiment of the present invention, which provides a method for polishing the casing of electronic products.

[0034] The operator places the circular casing of the electronic product inside the placement tray 22. The drive motor 12 rotates the lead screw 13, thereby moving the entire moving frame 2 to the polishing area. The circular casing of the electronic product presses against the polishing block 41, which in turn moves the moving push rod 43. The pressing block 432 compresses the first spring 45, and the limiting ring 441 restricts the travel of the polishing block 41, ensuring that the polishing block 41 always adheres to the surface of the casing with appropriate pressure.

[0035] The rotating motor 21 is started to drive the placement plate 22 to rotate. The placement plate 22 and the circular shell of the electronic product will rotate, and the circular shell of the electronic product will be continuously rubbed and polished by the polishing block 41.

[0036] When the placement disc 22 rotates, the protrusion 23 on its outer side intermittently presses the moving rod 51, thereby compressing the second spring 52 and forcing the internal air to be delivered to the air outlet 54, which then flows into the air inlet 412 through the air inlet pipe 42. The airflow flows along the slag inlet groove 411 on the surface of the grinding block 41, blowing out the debris collected in the groove.

[0037] The rotary motor 21 is started to rotate in the opposite direction. The slag inlet troughs 411 are symmetrically arranged and in opposite directions, maintaining the same slag removal effect during reverse rotation grinding. The cylinder 61 is started, which drives the limit block 62 to limit the moving frame 2, ensuring the stability of grinding.

[0038] After grinding, move the placement plate 22 to the cleaning brush 3, start the motor to drive the placement plate 22 to rotate, and the cleaning brush 3 brushes away the residual debris on the surface of the workpiece.

[0039] Example 2

[0040] Reference Figures 1-8 This is the second embodiment of the present invention, which provides a device for polishing the casing of electronic products.

[0041] Specifically, the support frame 1 is symmetrically arranged and has a guide groove 11 on its inner side. A drive motor 12 is provided on one side of the bottom of the support frame 1, and a lead screw 13 is provided at the output end of the drive motor 12. A limit rod 14 is fixedly provided at the bottom of the support frame 1. The movable frame 2 is located outside the lead screw 13, and a rotary motor 22 is provided on its top. A placement plate 22 is provided on the top of the rotary motor 22. The air inlet 5 is fixedly provided on the top side of the support frame 1. The air inlet 5 includes a moving rod 51. A second spring 52 is provided on one side of the moving rod 51. An air inlet shell 53 is provided on the outside of the second spring 52. An air inlet hole 531 is provided through the outside of the air inlet shell 53. A limit member 6 is provided on the top side of the support frame 1. The limit member 6 includes a cylinder 61. A limit block 62 is provided on one side of the cylinder 61. The outer side of the placement tray 22 is provided with protrusions 23, and a support ring 24 is fixedly connected to the outer side of the placement tray 22. A support frame 25 is slidably connected to the outer side of the support ring 24. Two sets of support frames 25 are provided, with another set fixedly provided on both sides of the movable frame 2. Long blocks 26 are fixedly provided at both ends of the support frame 25, and the long blocks 26 are slidably connected to the guide groove 11. A cleaning brush 3 is connected to the top of the support frame 1 via a rotating shaft, and two sets of cleaning brushes 3 are provided. A grinding component 4 is provided on the top of the support frame 1. The grinding component 4 includes a grinding block 41. A slag inlet groove 411 is provided on one side of the grinding block 41. The slag inlet groove 411 is inclined and symmetrically arranged. An air inlet 412 is connected to the top of the slag inlet groove 411. A moving groove 413 is opened on the other side of the grinding component 4. A return spring 414 is provided inside the moving groove 413. An air inlet 412 is connected to an air inlet pipe 42 at its top. A moving push rod 43 is provided on one side of the moving groove 413, and a limiting plate 431 is provided on one side of the moving push rod 43. The limiting plate 431 is slidably connected to the inside of the moving groove 413. An extrusion block 432 is provided on the outside of the moving push rod 43, and a limiting member 44 is slidably connected to the outside of the moving push rod 43. The limiting member 44 includes limiting rings 441 provided on both sides of the extrusion block 432. A first spring 45 is provided on one side of the extrusion block 432, and a slag storage box 46 is connected to the bottom side of the grinding block 41.

[0042] The operator places the circular casing of the electronic product inside the placement tray 22, and drives the lead screw 13 to rotate through the drive motor 12, thereby moving the entire moving frame 2 to move the circular casing of the electronic product to the polishing area. Since the circular casing of the electronic product will squeeze the polishing block 41, the polishing block 41 will cause the moving push rod 43 to move, and then the squeezing block 432 will squeeze the first spring 45. The limiting ring 441 further restricts the movement stroke of the polishing block 41, ensuring that the polishing block 41 always adheres to the surface of the casing with appropriate pressure. Start the rotary motor 21 to drive the placement tray 22 to rotate, so that the placement tray 22 and the circular shell of the electronic product will rotate, and the circular shell of the electronic product will be continuously rubbed by the grinding block 41. When the placement plate 22 rotates, the protrusion 23 on its outer side intermittently squeezes the moving rod 51, thereby squeezing the second spring 52 and squeezing the internal air to the air outlet pipe 54 and into the air inlet 412 through the air inlet pipe 42.

[0043] Ideally, during grinding, most of the debris falls into the slag inlet 411 and is temporarily "collected," preventing it from being repeatedly squeezed onto the workpiece surface by the grinding block 41 and causing scratches. This is equivalent to setting up multiple tiny "debris refuges" on the surface of the grinding block 41. When the grinding block 41 contacts the workpiece, these channels are closed, forming tiny air ducts. At this time, air is blown from the top air inlet 412, and the compressed air flows at high speed along these channels, completely blowing out the debris collected in the channels. This transforms the external "surface cleaning" into a deep "line cleaning" inside the sandpaper, which is more efficient.

[0044] The start cylinder 61 drives the limit block 62 to limit the movement frame 2, thereby ensuring the stability of grinding.

[0045] Ideally, unidirectional rotary grinding leaves a uniform circumferential grinding texture on the workpiece surface, which easily generates periodic ripples and affects surface finish. Simultaneously, unidirectional rotation causes the sandpaper and workpiece to always repeat the same contact path, resulting in uneven wear of the sandpaper. Therefore, this solution activates the rotary motor 21 to rotate in the opposite direction, and the slag inlet troughs 411 are symmetrically arranged in opposite directions, thus achieving a suitable slag removal effect even with reverse rotary grinding.

[0046] After polishing, the placement disc 22 is moved to the other side so that the workpiece surface comes into contact with the cleaning brush 3. The motor drives the placement disc 22 to rotate, thereby brushing away the residual debris on the surface.

[0047] In summary: This solution uses a drive motor 12 to rotate a lead screw 13, causing the moving frame 2 to transport the circular electronic product casing on the placement tray 22 to the grinding area. The casing presses against the grinding block 41, the moving push rod 43 compresses the first spring 45, and the limiting ring 441 restricts the stroke, ensuring the grinding block 41 adheres to the workpiece with appropriate pressure. The rotary motor 21 drives the placement tray 22 to rotate for grinding, while the protrusion 23 intermittently presses the moving rod 51 to generate a pulsed airflow, which is sent to the air inlet 412 through the air outlet pipe 54 and the air inlet pipe 42. The airflow blows out the debris from the symmetrically arranged slag inlet grooves 411. The rotary motor 21 can rotate in both directions, and the symmetrical slag inlet grooves maintain effective chip collection and removal in both directions. The cylinder 61 drives the limiting top block 62 to limit the moving frame 2, ensuring stable grinding. After grinding, the placement tray 22 is moved to the cleaning brush 3 for rotational cleaning, achieving integrated grinding-chip removal-cleaning processing.

[0048] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible without substantially departing from the novelty and advantages of the subject matter described in this application. For example, variations in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​such as temperature, pressure, etc., installation arrangements, use of materials, color, orientation, etc. For instance, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise changed, and the nature or number or position of discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure performing the function described herein, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims. Furthermore, for the purpose of providing a concise description of exemplary embodiments, not all features of the actual embodiments may be omitted, i.e., those features not relevant to the currently considered best mode for carrying out the invention, or those features not relevant to implementing the invention.

[0049] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A device for polishing the casing of electronic products, characterized in that: include, Support frame (1), the support frame (1) is symmetrically arranged and has a guide groove (11) on the inner side. A drive motor (12) is provided on one side of the bottom of the support frame (1). A lead screw (13) is provided at the output end of the drive motor (12). A limit rod (14) is fixedly provided at the bottom of the support frame (1). A movable frame (2) is located outside the lead screw (13), and a rotary motor (22) is provided on its top. A placement plate (22) is provided on the top of the rotary motor (22). An air intake component (5) is fixedly installed on the top side of the support frame (1). The air intake component (5) includes a moving rod (51). A second spring (52) is provided on one side of the moving rod (51). An air intake shell (53) is provided on the outside of the second spring (52). An air intake hole (531) is provided through the outside of the air intake shell (53). The support frame (1) is provided with a limiting member (6) on its top side. The limiting member (6) includes a cylinder (61) and a limiting top block (62) is provided on one side of the cylinder (61).

2. The electronic product casing polishing equipment according to claim 1, characterized in that: The outer side of the placement tray (22) is provided with a protrusion (23), and a support ring (24) is fixedly connected to the outer side of the placement tray (22). A support frame (25) is slidably connected to the outer side of the support ring (24).

3. The electronic product casing polishing equipment according to claim 1 or 2, characterized in that: The support frame (25) is provided in two sets, with the other set fixedly installed on both sides of the movable frame (2), and long blocks (26) are fixedly installed at both ends of the support frame (25), and the long blocks (26) are slidably connected to the guide groove (11).

4. The electronic product casing polishing equipment according to claim 1, characterized in that: The top of the support frame (1) is connected to a cleaning brush (3) via a pivot, and two sets of the cleaning brush (3) are provided.

5. The electronic product casing polishing equipment according to claim 1, characterized in that: The top of the support frame (1) is provided with a grinding component (4), which includes a grinding block (41). A slag inlet groove (411) is provided on one side of the grinding block (41). The slag inlet groove (411) is inclined and symmetrically arranged.

6. The electronic product casing polishing equipment according to claim 5, characterized in that: The top of the slag inlet (411) is connected to an air inlet (412), and a moving groove (413) is provided on the other side of the grinding part (4). A reset spring (414) is provided inside the moving groove (413).

7. The electronic product casing polishing equipment according to claim 6, characterized in that: The top of the air inlet (412) is connected to an air inlet pipe (42), and a moving push rod (43) is provided on one side of the moving groove (413). A limiting plate (431) is provided on one side of the moving push rod (43), and the limiting plate (431) is slidably connected to the inside of the moving groove (413).

8. The electronic product casing polishing equipment according to claim 7, characterized in that: An extrusion block (432) is provided on the outer side of the movable push rod (43), and a limiting member (44) is slidably connected to the outer side of the movable push rod (43). The limiting member (44) includes limiting rings (441) provided on both sides of the extrusion block (432).

9. The electronic product casing polishing equipment according to claim 7, characterized in that: A first spring (45) is provided on one side of the extrusion block (432), and a slag storage box (46) is connected to the bottom side of the grinding block (41).

10. A method for polishing the casing of an electronic product, characterized in that: The electronic product casing polishing apparatus according to any one of claims 1 to 9 includes, Place the round casing of the electronic product inside the placement tray (22), start the drive motor (12) to drive the lead screw (13) to rotate, so that the moving frame (2) moves as a whole and transports the casing to the polishing area; The outer shell contacts the polishing block (41), the polishing block (41) pushes the moving push rod (43) to move, the squeezing block (432) compresses the first spring (45), and the limiting ring (441) restricts the movement stroke of the polishing block (41), so that the polishing block (41) adheres to the surface of the outer shell with appropriate pressure. Start the rotary motor (21) to drive the placement plate (22) to rotate, and the outer shell rotates with the placement plate (22) and is rubbed and polished by the polishing block (41); When the placement plate (22) rotates, the protrusion (23) on its outer side intermittently squeezes the moving rod (51), compresses the second spring (52), and sends the internal air into the air inlet (412) through the air outlet (54) and the air inlet (42). The airflow flows along the slag inlet groove (411) on the surface of the grinding block (41) and blows out the debris collected in the groove. Start the rotary motor (21) to rotate in the opposite direction. The slag inlet trough (411) is symmetrically set and in opposite directions. When grinding in the opposite direction, the same slag removal effect is maintained. After grinding, move the placement plate (22) to the cleaning brush (3), start the motor to drive the placement plate (22) to rotate, and the cleaning brush (3) brushes away the residual debris on the surface of the workpiece.

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