A rapid temperature rising and falling bonding vacuum chuck and a preparation method thereof

Abstract

This invention discloses a rapid heating and cooling bonding vacuum chuck and its preparation method. The rapid heating and cooling bonding vacuum chuck includes a pressure block, a ceramic body, a support layer, and a support layer base. The ceramic body includes, from top to bottom, an alumina top plate, a heat-conducting plate, a heating element, a first heat insulation plate, a sealing plate, and a second heat insulation plate. The first heat insulation plate, the heating element, and the heat-conducting plate are stacked on the sealing plate from bottom to top. The alumina top plate abuts against the upper end face of the sealing plate. The second heat insulation plate is connected below the sealing plate. The support layer is connected below the second heat insulation plate. The support layer base is connected below the support layer. The pressure block is fixed above the ceramic body and is used to lock and fix the alumina top plate and the sealing plate. It can effectively solve the problems of slow heating and cooling speed, poor temperature uniformity, large temperature difference, poor thermal expansion, and poor thermal shock matching of existing vacuum chucks.

Description

Technical Field

[0001] This invention relates to the field of vacuum chucks, and in particular to a rapid heating and cooling bonding vacuum chuck and its preparation method. Background Technology

[0002] Ceramic vacuum chucks are ultra-high precision workpiece carrier platforms based on the principle of vacuum adsorption. The core is made of advanced ceramic materials, and its main structure includes a porous ceramic adsorption surface and a precision base. The porous ceramic plate is assembled into the countersunk holes of the base and sealed around the perimeter. The base is made of precision ceramic or metal materials and features an internal precision air channel design. By introducing negative pressure, the workpiece can be smoothly and stably adsorbed. Its adsorption surface uses ceramic materials such as alumina and aluminum nitride, and is connected to an external vacuum system through precision-machined vacuum channels or porous structures to form a uniform negative pressure field. As a core component of precision manufacturing, it is widely used in high-end fields such as semiconductors, display panels, and photovoltaics, playing a crucial role in semiconductor lithography, display panel substrate transport, and photovoltaic silicon wafer handling.

[0003] To prevent wafers from cracking due to sudden temperature rises or falls during bonding, temperature control is typically required during the process, providing either cooling or heating capabilities. However, existing vacuum chucks mostly use liquid cooling or other methods to cool the chuck base, lacking heating functionality and thus offering limited range of features. Some vacuum chucks achieve heating by adding heating devices, but these often suffer from uneven temperature distribution, slow heating and cooling rates, thermal expansion, and poor thermal shock matching, requiring further improvement.

[0004] Therefore, a new technology needs to be developed to solve the above problems. Summary of the Invention

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a rapid heating and cooling bonding vacuum chuck and its preparation method, which can effectively solve the problems of slow heating and cooling speed, poor temperature uniformity, large temperature difference, thermal expansion, and poor thermal shock matching of existing vacuum chucks.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A rapid heating and cooling bonding vacuum chuck includes a pressure block, a ceramic body, a support layer, and a support layer base. The ceramic body comprises, from top to bottom, an alumina top plate, a heat-conducting plate, a heating element, a first heat insulation plate, a sealing plate, and a second heat insulation plate. The first heat insulation plate, the heating element, and the heat-conducting plate are stacked on the sealing plate from bottom to top. The alumina top plate abuts against the upper surface of the sealing plate. The second heat insulation plate is connected below the sealing plate. The support layer is connected below the second heat insulation plate. The base of the support layer is connected below the support layer. The pressure block is fixed above the ceramic body and is used to lock and fix the alumina top plate and the sealing plate.

[0007] As a preferred embodiment, multiple pressure blocks are provided, and the multiple pressure blocks are arranged at uniform intervals along the circumference above the ceramic body. Each pressure block has a main body and a pressing part connected to the main body. The main body abuts against the upper end face of the sealing plate, and the pressing part presses against the upper end face of the alumina top plate.

[0008] As a preferred embodiment, the pressure block is used to achieve elastic locking and fixing between the alumina top plate and the sealing plate, and the pressure block is connected to the sealing plate by bolts.

[0009] As a preferred embodiment, a telescopic spring is fitted onto the bolt; there is a gap between the telescopic spring and the bolt, allowing the telescopic spring to swing left and right; the telescopic spring has a compression amount, allowing it to swing up and down.

[0010] As a preferred embodiment, the lower end of the bolt passes through the sealing plate and the second heat insulation plate in sequence and is threaded into the threaded connection hole of the support layer. The upper end of the bolt is located in the relief hole of the pressure block and the lower end face is restricted by the limiting step formed by the bottom wall of the relief hole. The upper and lower ends of the telescopic spring are respectively restricted by the lower end face of the upper end of the bolt and the upper end face of the support layer.

[0011] As a preferred embodiment, the lower surface of the alumina top plate is provided with an annular air channel, which includes an annular adsorption air channel and an annular cooling air channel. The annular air channel is provided with pores and adsorption ports that penetrate the upper and lower surfaces of the alumina top plate. The pores are used to adsorb workpieces.

[0012] As a preferred embodiment, the adsorption air duct and the cooling air duct are arranged concentrically, and there are multiple adsorption air ducts and cooling air ducts, which are arranged alternately at intervals along the radial direction. The outermost cooling duct in the radial direction is circular; in the radial direction, all the cooling ducts inside the outermost cooling duct form several discontinuous zones arranged at intervals in the circumferential direction, so that all the cooling ducts inside are arranged discontinuously in the circumferential direction; the outermost cooling duct in the radial direction is connected to all the cooling ducts inside through a cooling connection channel extending radially. The cooling connection channel arranges the adsorption air passages intermittently in the circumferential direction.

[0013] As a preferred embodiment, the heat-conducting plate, heating element, first heat insulation plate, and sealing plate are all provided with vent holes. The vent holes on the heat-conducting plate, heating element, first heat insulation plate, and sealing plate are correspondingly connected and connected to the adsorption port. Metal tubes are provided in the corresponding vent holes on the heat-conducting plate, heating element, first heat insulation plate, and sealing plate.

[0014] As a preferred embodiment, the upper end of the sealing plate is recessed to form an installation cavity. The first heat insulation plate, the heating element, and the heat conducting plate are stacked sequentially from bottom to top in the installation cavity. The upper end of the heat conducting plate is flush with the upper end of the sealing plate. The alumina top plate covers the installation cavity, and the upper end of the heat conducting plate abuts against the lower end of the alumina top plate.

[0015] A method for preparing the aforementioned alumina top plate includes the following steps: Step 1: Slurry preparation: Mix the raw materials for preparing the alumina top plate. The components are Al2O3, SiO2, CeO2, and MgO, with a particle size of 0.2-3μm. Accurately weigh each raw material and, based on the powder mass, add 45-55 parts by weight of solvent and 0.5-2.5 parts by weight of dispersant. Put the mixture into a ball mill containing 200-300 parts by weight of alumina balls with a particle size of 5-15mm. Process at a speed of 40-70 r / min for 12-24 hours. Then add 7-11 parts by weight of binder and 4-8 parts by weight of plasticizer to the ball mill and continue ball milling for 12-24 hours to obtain a uniformly mixed alumina granulated slurry. Step 2, Granulation: The prepared alumina granulation slurry is shaped using a granulation drying tower to obtain granulated powder with a particle size of 50-100μm, which is then sieved and batched using a vibrating screen. Step 3, Dry pressing: Use a hydraulic press to pour the granulated powder into the metal mold, and hold it under 500T pressure for 10 minutes to obtain the alumina blank; Step 4, Cold Isostatic Pressing: The dry-pressed alumina blanks are vacuum-sealed using a vacuum packaging machine, then placed on a rigid pad, put into a plastic bag, and vacuum-sealed; the sealed stacked sheets are then placed into an isostatic press and pressed at 150-200MPa for 10-30 minutes to obtain ceramic green porcelain structural parts. Step 5, Debinding: Place the ceramic green porcelain structural component on a corundum mullite firing plate, load it into an atmosphere resistance furnace, and slowly heat it to 450-650℃ at a heating rate of 0.3-1℃ / min, and hold it at that temperature for 3-6 hours to obtain the ceramic debinding structural component. Step 6, Sintering: The ceramic debonded structural parts are placed into a high-temperature sintering furnace and sintered at 1300-1500℃ for 2-4 hours to obtain sintered ceramic structural parts; Step 7, Machining: The sintered ceramic structural parts are finally machined using double-sided grinding and machining equipment to obtain an alumina top plate with a flatness of <5μm and a surface roughness of less than 0.1μm.

[0016] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution: Compared with conventional vacuum chucks, the vacuum chuck of this invention is equipped with a heating element, enabling rapid heating and cooling. Due to the presence of the heat-conducting plate, temperature transfer is more uniform, resulting in better temperature uniformity. Simultaneously, the design of the number and structure of the heat insulation plates effectively reduces heat transfer, preventing the vacuum chuck support layer from overheating and transferring heat to the marble or metal worktable on which the vacuum chuck is placed, thus avoiding thermal deformation, affecting overall flatness, and causing quality defects in the processed wafer. Therefore, this vacuum chuck can be used for wafer bonding, with a wider range of applications. It effectively solves the problems of slow heating and cooling speed, poor temperature uniformity, large temperature difference, thermal expansion, and poor thermal shock matching of existing vacuum chucks.

[0017] II. The vacuum suction cup of this invention is composed of a multi-layered ceramic composite, wherein each ceramic layer is connected by bolts and telescopic springs. Compared with other vacuum suction cups, the manufacturing process of this vacuum suction cup uses a layered processing method for the ceramic body, which is then assembled. If one layer fails, it can be replaced individually. At the same time, the connection method used for the ceramic layers is less expensive to manufacture than the elastic connection of the silicone layer, and the disassembly and replacement method is simpler. Therefore, it can save more time and costs in manufacturing and maintenance, thereby improving the use value of the components, and achieving high interchangeability, thus achieving the goal of low-cost production.

[0018] To more clearly illustrate the structural features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 This is a three-dimensional schematic diagram of the overall structure from another angle of an embodiment of the present invention; Figure 3 This is a cross-sectional schematic diagram of an embodiment of the present invention; Figure 4 This is a partial structural cross-sectional schematic diagram of an embodiment of the present invention; Figure 5 This is a partial structural cross-sectional schematic diagram of an embodiment of the present invention; Figure 6 This is an exploded view of an embodiment of the present invention; Figure 7 This is a three-dimensional schematic diagram of an embodiment of the present invention after the alumina top plate has been removed; Figure 8 This is a perspective view of an alumina top plate according to an embodiment of the present invention; Figure 9 This is a three-dimensional schematic diagram of the alumina top plate according to an embodiment of the present invention from another angle.

[0020] Explanation of reference numerals in the attached diagram: 10; 11; 111; 12; 13; 20. Alumina top plate; 21. Relief groove; 22. Pressing step; 23. Adsorption air channel; 231. Air hole; 232. Adsorption air port; 24. Cooling air channel; 25. Intermittent zone; 26. Cooling connection channel; 27. Relief clearance groove. Heat-conducting plate 30; sealing groove 31; heating element 40; first heat insulation plate 50; sealing plate 60; mounting cavity 61; second heat insulation plate 70; Support layer 80; threaded connection hole 81; support column 82; grid clearance 83; Support layer base 90; bolt 101; connecting bolt 102; vent hole 201; metal pipe 202. Detailed Implementation

[0021] In the description of this invention, it should be noted that if terms such as "center," "upper," "lower," "left," "right," "front," "back," "vertical," "horizontal," "inner," and "outer" appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0022] Please refer to Figures 1 to 9 As shown, it illustrates the specific structure of the rapid heating and cooling bonding vacuum chuck provided in an embodiment of the present invention.

[0023] The rapid heating and cooling bonding vacuum chuck includes a pressure block 10, a ceramic body, a support layer 80, and a support layer base 90. The ceramic body, from top to bottom, includes an alumina top plate 20, a heat-conducting plate 30, a heating element 40, a first heat insulation plate 50, a sealing plate 60, and a second heat insulation plate 70. The first heat insulation plate 50, the heating element 40, and the heat-conducting plate 30 are stacked on the sealing plate 60 from bottom to top. The alumina top plate 20 abuts against the upper end face of the sealing plate 60. The second heat insulation plate 70 is connected below the sealing plate 60. The support layer 80 is connected below the second heat insulation plate 70. The support layer base 90 is connected below the support layer 80. The pressure block 10 is fixed above the ceramic body and is used to lock and fix the alumina top plate 20 and the sealing plate 60.

[0024] The pressure block 10 is used to elastically lock and fix the alumina top plate 20 and the sealing plate 60. The pressure block 10 is connected to the sealing plate 60 by bolts 101. A telescopic spring (not shown in the figure) is sleeved on the bolts 101. There is a gap between the telescopic spring and the bolts 101 so that the telescopic spring can swing left and right. The telescopic spring has a compression so that the telescopic spring can swing up and down. When the vacuum suction cup is working, the ceramic sheet will expand due to the increase in temperature. This swing space can prevent cracking failure caused by the mismatch of the thermal expansion coefficients of ceramic sheets of different materials.

[0025] The lower end of the bolt 101 passes through the sealing plate 60 and the second heat insulation plate 70 in sequence and is threaded into the threaded connection hole 81 of the support layer 80. The upper end of the bolt 101 is located in the relief hole 11 of the pressure block 10 and the lower end face is restricted by the limiting step 111 formed by the bottom wall of the relief hole 11. The upper and lower ends of the telescopic spring are respectively restricted by the lower end face of the upper end of the bolt 101 and the upper end face of the support layer 80.

[0026] The sealing plate 60, the second heat insulation plate 70 and the support layer 80 are connected by multiple connecting bolts 102 in addition to the bolts 101, and springs may also be fitted on the connecting bolts 102.

[0027] Multiple pressure blocks 10 are provided, arranged at uniform intervals along the circumference above the ceramic body. The number of pressure blocks 10 is 4-8. A locking structure, using evenly distributed bolts 101 and telescopic springs, ensures a high degree of flatness and seamless fit between the alumina top plate 20 and the sealing plate 60. Furthermore, precision-machined positioning holes can be provided on the top surface of the pressure blocks 10, serving as mechanical references for the equipment's vision system. These holes are used for calibrating the suction cup origin, coordinate system calibration, and providing precise positional references for the wafer center, edges, and notches.

[0028] The pressing block 10 has a main body 12 and a pressing part 13 integrally connected to the main body 12. The main body 12 abuts against the upper end face of the sealing plate 60, and the pressing part 13 presses against the upper end face of the alumina top plate 20. A relief groove 21 is recessed on the upper end face of the alumina top plate 20 corresponding to each pressing block 10. The relief groove 21 penetrates the upper and lower sides of the alumina top plate 20 and penetrates the outer peripheral sidewall of the alumina top plate 20. A pressing step 22 is formed in the relief groove 21. The main body 12 is positioned in the relief groove 21, and the pressing part 13 presses against the upper end face of the pressing step 22. The upper end faces of the main body 12, the pressing part 13, and the alumina top plate 20 are flush. Furthermore, in this embodiment, the alumina top plate 20 is generally circular, the pressing block 10 is generally annular, and the main body 12, pressing part 13, relief groove 21 and pressing step 22 are all annular.

[0029] The clearance hole 11 is provided on the main body 12, and two clearance holes 11 are provided at intervals along the circumferential direction on the main body 12 of each pressure block 10. The lower end of the bolt 101 passes through the main body 12, the sealing plate 60, and the second heat insulation plate 70 from top to bottom and is threaded to the threaded connection hole 81 of the support layer 80. The upper end of the bolt 101 is recessed into the clearance hole 11 of the pressure block 10.

[0030] The lower surface of the alumina top plate 20 is provided with an annular air channel. The annular air channel is divided into an annular adsorption air channel 23 and an annular cooling air channel 24 according to its function. The annular air channel is provided with air holes 231 penetrating the upper and lower surfaces of the alumina top plate 20 and adsorption air inlets 232 of the same depth as the annular air channel. The air holes 231 are used to adsorb workpieces. The adsorption air channel 23 and the cooling air channel 24 are arranged concentrically. There are several adsorption air channels 23 and cooling air channels 24. The adsorption air channels 23 and cooling air channels 24 are arranged alternately in the radial direction. The adsorption air channel 23 adopts a multi-ring concentric partitioned air path design, which can be equipped with a sealing ring structure. The vacuum circuit can be controlled in partitions according to the wafer size, and the air path can be flexibly switched to switch on and off, perfectly compatible with the adsorption needs of 4-12 inch wafers.

[0031] The outermost cooling air passage 24 in the radial direction is annular; in the radial direction, all the cooling air passages 24 inside the outermost cooling air passage 24 form several intermittent areas 25 arranged at intervals in the circumferential direction, so that all the cooling air passages 24 inside are arranged intermittently in the circumferential direction; the outermost cooling air passage 24 in the radial direction is connected to all the cooling air passages 24 inside through a cooling connection channel 26 extending radially, so that the cooling air passages 24 are connected from the inside to the outside as a whole; and the cooling connection channel 26 arranges the adsorption air passage 23 intermittently in the circumferential direction.

[0032] The upper surface of the alumina top plate 20 is provided with a plurality of clearance grooves 27 arranged sequentially along the circumferential direction. The clearance grooves 27 are used to make way for the wall fork (gripper), allowing the wall fork to be smoothly inserted into the groove to complete the wafer picking and placing. The clearance grooves 27 extend radially through the circumferential wall of the alumina top plate 20.

[0033] Ventilation holes 201 are provided on the heat-conducting plate 30, heating element 40, first heat insulation plate 50, and sealing plate 60. The ventilation holes 201 on the heat-conducting plate 30, heating element 40, first heat insulation plate 50, and sealing plate 60 are correspondingly connected to the adsorption port 232. Metal tubes 202 are provided in the corresponding ventilation holes 201 on the heat-conducting plate 30, heating element 40, first heat insulation plate 50, and sealing plate 60.

[0034] The upper end of the sealing plate 60 is recessed into an installation cavity 61. The first heat insulation plate 50, the heating element 40, and the heat-conducting plate 30 are stacked sequentially from bottom to top within the installation cavity 61. The upper end surface of the heat-conducting plate 30 is flush with the upper end surface of the sealing plate 60. The alumina top plate 20 covers the installation cavity 61, and the upper end surface of the heat-conducting plate 30 abuts against the lower end surface of the alumina top plate 20. Thus, the heat-conducting plate 30, the heating element 40, and the first heat insulation plate 50 are placed inside the sealing plate 60. The ceramic plates are stacked due to their high flatness and are limited by the metal tube 202 inside the vent 201.

[0035] The heat-conducting plate 30 can be made of one of the ceramic or metal materials with high thermal conductivity, such as beryllium oxide, aluminum nitride, silicon carbide, silicon nitride, polycrystalline diamond, or aluminum metal heat-conducting plate 30. The heat-conducting plate 30 has a sealing groove 31 on its front side for installing the aforementioned sealing ring. The function of the heat-conducting plate 30 is to separate the alumina top plate 20 from the heating element 40, and at the same time, to uniformly transfer the heat of the heating element 40, preventing the alumina top plate 20 from directly contacting the heating element 40 and deforming due to excessive local temperature, which would result in poor overall flatness of the vacuum chuck and affect the flatness of the wafer processing.

[0036] The heating element 40 can be made of polyimide (PI), mica, or etched sheet. The heating element 40 is embedded with a K-type thermocouple, which has an operating temperature of Rt-1200 degrees. The heating element 40 has advantages such as good linearity, large thermoelectric potential, high sensitivity, good stability and uniformity, strong oxidation resistance, and low price.

[0037] The first heat insulation plate 50 can be made of inorganic non-metallic materials or organic materials with low thermal conductivity, such as microcrystalline glass, cordierite, mullite, and PBI (polybenzimidazole). Its main function is to provide heat insulation and reduce the downward transfer of heat from the heating element 40.

[0038] The thermal conductivity of the sealing plate 60 is lower than that of the heat-conducting plate 30; the material of the sealing plate 60 can be a ceramic material with low thermal conductivity such as alumina or aluminum nitride; the sealing plate 60 has a flat-bottomed circular recessed structure with the recessed surface facing upwards; the function of the sealing plate 60 is to fix the first heat insulation plate 50, the heating element 40, and the heat-conducting plate 30, and to seal the gap between the fixed and moving parts to prevent gas leakage.

[0039] The material of the second heat insulation plate 70 can be organic materials with low thermal conductivity, such as microcrystalline glass, cordierite, mullite, and PBI (polybenzimidazole). The structure of the second heat insulation plate 70 is annular, which can effectively reduce the contact surface with the sealing plate 60. Its main function is to isolate the heat transfer in a secondary manner, prevent the support layer 80 from deforming due to excessive heat, and thus prevent the worktable from thermally deforming, resulting in poor processing accuracy.

[0040] The support layer 80 is made of stainless steel and has a structure of four-sided pillars 82. The connection surface between the pillars 82 and the second heat insulation plate 70 is a grid-like opening 83. Since the product requires the ceramic body to have a heating function, the pillars 82 need to be at room temperature. The grid-like opening 83 on the connection surface can reduce the contact area between the support layer 80 and the ceramic body, lower the support temperature, and reduce heat conduction.

[0041] The support base 90 is made of stainless steel. The support base 90 can be a circular or square structure and is fixedly connected to the support layer 80 by bolts 101. Its main function is to increase the contact area between the support structure and the workbench, and avoid the problem of small contact area and easy overturning caused by direct placement of the support column 82, thereby achieving stable support and placement of the workpiece.

[0042] The method for preparing the alumina top plate 20 includes the following steps: Step 1: Slurry Preparation: The raw materials for preparing the alumina top plate 20 (alumina ceramic structural component) are mixed in a certain proportion. The components are Al2O3, SiO2, CeO2 and MgO, with a particle size of 0.2-3μm. The raw materials are accurately weighed in a certain proportion. Based on the powder mass, 45-55 parts by weight of solvent and 0.5-2.5 parts by weight of dispersant are added and fed into a ball mill containing 200-300 parts by weight of alumina balls with a particle size of 5-15mm. The mixture is processed at a speed of 40-70r / min for 12-24 hours. Then, 7-11 parts by weight of binder and 4-8 parts by weight of plasticizer are added to the ball mill, and the mixture is ball-milled for another 12-24 hours to obtain a uniformly mixed alumina granulated slurry. Step 2, Granulation: The prepared alumina granulation slurry is shaped using a granulation drying tower to obtain granulated powder with a particle size of 50-100μm, which is then sieved and batched using a vibrating screen. Step 3, Dry pressing: Use a hydraulic press to pour the granulated powder into the metal mold, and hold it under 500T pressure for 10 minutes to obtain the alumina blank; Step 4, Cold Isostatic Pressing: The dry-pressed alumina blanks are vacuum-sealed using a vacuum packaging machine, then placed on a rigid pad, put into a plastic bag, and vacuum-sealed; the sealed stacked sheets are then placed into an isostatic press and pressed at 150-200MPa for 10-30 minutes to obtain ceramic green porcelain structural parts. Step 5, Debinding: Place the ceramic green porcelain structural component on a corundum mullite firing plate, load it into an atmosphere resistance furnace, and slowly heat it to 450-650℃ at a heating rate of 0.3-1℃ / min, and hold it at that temperature for 3-6 hours to obtain the ceramic debinding structural component. Step 6, Sintering: The ceramic debonded structural parts are placed into a high-temperature sintering furnace and sintered at 1300-1500℃ for 2-4 hours to obtain sintered ceramic structural parts; Step 7, Machining: The sintered ceramic structural parts are finally machined by double-sided grinding and machining equipment to obtain an alumina top plate 20 (alumina ceramic structural parts) with a flatness of <5μm and a surface roughness of less than 0.1μm.

[0043] In summary, the key design feature of this invention is that, compared to conventional vacuum chucks, this vacuum chuck incorporates a heating element, enabling rapid heating and cooling. Due to the presence of the heat-conducting plate, temperature transfer is more uniform, resulting in better temperature uniformity. Simultaneously, the design of the number and structure of the heat insulation plates effectively reduces heat transfer, preventing excessively high temperatures in the vacuum chuck support layer. This prevents heat transfer to the marble or metal worktable on which the vacuum chuck is placed, which could lead to thermal deformation, affecting the overall flatness and causing quality defects in the processed wafer. Therefore, this vacuum chuck can be used for wafer bonding, broadening its application range. It effectively solves the problems of slow heating and cooling speeds in existing vacuum chucks. The present invention addresses issues such as poor temperature uniformity, large temperature differences, thermal expansion, and poor thermal shock matching. The vacuum suction cup of this invention is composed of a multi-layered ceramic composite, with each ceramic layer connected by bolts and telescopic springs. Compared to other vacuum suction cups, the manufacturing process of this vacuum suction cup involves layered processing and final assembly. If one layer fails, it can be replaced individually. Furthermore, the connection method used for the ceramic layers is less expensive to manufacture and easier to disassemble and replace compared to the elastic connection of silicone layers. Therefore, it saves time and costs in manufacturing and maintenance, thereby increasing the usability of the components, providing high interchangeability, and achieving low-cost production.

Claims

1. A rapid heating and cooling bonding vacuum chuck, characterized in that: It includes a pressing block, a ceramic body, a support layer, and a support layer base; The ceramic body comprises, from top to bottom, an alumina top plate, a heat-conducting plate, a heating element, a first heat insulation plate, a sealing plate, and a second heat insulation plate. The first heat insulation plate, the heating element, and the heat-conducting plate are stacked on the sealing plate from bottom to top. The alumina top plate abuts against the upper surface of the sealing plate. The second heat insulation plate is connected below the sealing plate. The support layer is connected below the second heat insulation plate. The base of the support layer is connected below the support layer. The pressure block is fixed above the ceramic body and is used to lock and fix the alumina top plate and the sealing plate.

2. The rapid heating and cooling bonding vacuum chuck according to claim 1, characterized in that: Multiple pressure blocks are provided, and the multiple pressure blocks are arranged at uniform intervals along the circumference above the ceramic body. Each pressure block has a main body and a pressing part connected to the main body. The main body abuts against the upper end face of the sealing plate, and the pressing part presses against the upper end face of the alumina top plate.

3. The rapid heating and cooling bonding vacuum chuck according to claim 1, characterized in that: The pressure block is used to achieve elastic locking and fixation between the alumina top plate and the sealing plate, and the pressure block is connected to the sealing plate by bolts.

4. The rapid heating and cooling bonding vacuum chuck according to claim 3, characterized in that: A telescopic spring is fitted onto the bolt; there is a gap between the telescopic spring and the bolt so that the telescopic spring can swing left and right; the telescopic spring has a compression amount so that the telescopic spring can swing up and down.

5. The rapid heating and cooling bonding vacuum chuck according to claim 4, characterized in that: The lower end of the bolt passes through the sealing plate and the second heat insulation plate in sequence and is threaded into the threaded connection hole of the support layer. The upper end of the bolt is located in the relief hole of the pressure block and the lower end face is restricted by the limiting step formed by the bottom wall of the relief hole. The upper and lower ends of the telescopic spring are respectively restricted by the lower end face of the upper end of the bolt and the upper end face of the support layer.

6. The rapid heating and cooling bonding vacuum chuck according to claim 1, characterized in that: The lower surface of the alumina top plate is provided with an annular air channel, which includes an annular adsorption air channel and an annular cooling air channel. The annular air channel is provided with pores and adsorption air ports that penetrate the upper and lower surfaces of the alumina top plate. The pores are used to adsorb workpieces.

7. A rapid heating and cooling bonding vacuum chuck according to claim 6, characterized in that: The adsorption air passage and the cooling air passage are arranged at the same center, and there are several adsorption air passages and cooling air passages. The adsorption air passages and cooling air passages are arranged alternately at intervals along the radial direction. The outermost cooling duct in the radial direction is circular; in the radial direction, all the cooling ducts inside the outermost cooling duct form several discontinuous zones arranged at intervals in the circumferential direction, so that all the cooling ducts inside are arranged discontinuously in the circumferential direction; the outermost cooling duct in the radial direction is connected to all the cooling ducts inside through a cooling connection channel extending radially. The cooling connection channel arranges the adsorption air passages intermittently in the circumferential direction.

8. A rapid heating and cooling bonding vacuum chuck according to claim 6, characterized in that: Ventilation holes are provided on the heat-conducting plate, heating element, first heat insulation plate, and sealing plate. The ventilation holes on the heat-conducting plate, heating element, first heat insulation plate, and sealing plate are correspondingly connected and connected to the adsorption port. Metal tubes are provided in the corresponding ventilation holes on the heat-conducting plate, heating element, first heat insulation plate, and sealing plate.

9. A rapid heating and cooling bonding vacuum chuck according to claim 1, characterized in that: The upper end of the sealing plate is recessed to form an installation cavity. The first heat insulation plate, the heating element, and the heat conducting plate are stacked in the installation cavity from bottom to top. The upper end of the heat conducting plate is flush with the upper end of the sealing plate. The alumina top plate covers the installation cavity, and the upper end of the heat conducting plate abuts against the lower end of the alumina top plate.

10. A method for preparing an alumina top plate as described in any one of claims 1 to 9, characterized in that: Includes the following steps: Step 1: Slurry preparation: Mix the raw materials for preparing the alumina top plate. The components are Al2O3, SiO2, CeO2, and MgO, with a particle size of 0.2-3μm. Accurately weigh each raw material and, based on the powder mass, add 45-55 parts by weight of solvent and 0.5-2.5 parts by weight of dispersant. Put the mixture into a ball mill containing 200-300 parts by weight of alumina balls with a particle size of 5-15mm. Process at a speed of 40-70 r / min for 12-24 hours. Then add 7-11 parts by weight of binder and 4-8 parts by weight of plasticizer to the ball mill and continue ball milling for 12-24 hours to obtain a uniformly mixed alumina granulated slurry. Step 2, Granulation: The prepared alumina granulation slurry is shaped using a granulation drying tower to obtain granulated powder with a particle size of 50-100μm, which is then sieved and batched using a vibrating screen. Step 3, Dry pressing: Use a hydraulic press to pour the granulated powder into the metal mold, and hold it under 500T pressure for 10 minutes to obtain the alumina blank; Step 4, Cold Isostatic Pressing: The dry-pressed alumina blanks are vacuum-sealed using a vacuum packaging machine, then placed on a rigid pad, put into a plastic bag, and vacuum-sealed; the sealed stacked sheets are then placed into an isostatic press and pressed at 150-200MPa for 10-30 minutes to obtain ceramic green porcelain structural parts. Step 5, Debinding: Place the ceramic green porcelain structural component on a corundum mullite firing plate, load it into an atmosphere resistance furnace, and slowly heat it to 450-650℃ at a heating rate of 0.3-1℃ / min, and hold it at that temperature for 3-6 hours to obtain the ceramic debinding structural component. Step 6, Sintering: The ceramic debonded structural parts are placed into a high-temperature sintering furnace and sintered at 1300-1500℃ for 2-4 hours to obtain sintered ceramic structural parts; Step 7, Machining: The sintered ceramic structural parts are finally machined using double-sided grinding and machining equipment to obtain an alumina top plate with a flatness of <5μm and a surface roughness of less than 0.1μm.

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