A power chip injection molding device with overflow guide and air-cooled shaping

Abstract

This invention discloses a power chip injection molding device with overflow guidance and air cooling shaping, belonging to the technical field of power chip injection molding equipment. It includes a frame, with an upper mold fixedly mounted on the top of the frame. A support frame is bolted to the outside of the frame, and a liftable lower mold is connected to the lower end of the support frame. Several overflow guide channels are provided on the upper surface edge and at the mold joint of the lower mold, and a detachable waste collection box is connected to the end of each overflow guide channel. An air-cooling cooling channel is integrated inside the lower mold, including an air duct and an air outlet. A spiral-shaped air duct is also provided inside the lower mold. A liftable ejector pin is mounted at the lower end of the lower mold, and the ejector pin's ejection end can extend into the mold cavity. A blown film assembly is mounted at the end of the ejector pin. This invention integrates overflow collection, spiral air cooling, and air film demolding structure, effectively reducing mold flash, while providing a large cooling heat exchange area, short molding cycle, reduced demolding friction, and improved yield.

Description

Technical Field

[0001] This invention relates to the field of power chip injection molding equipment technology, and in particular to a power chip injection molding apparatus with overflow diversion and air cooling for shaping. Background Technology

[0002] In the packaging process of power chips, injection molding is a key process that fixes the chip and lead frame by encapsulating them with molten plastic. At present, relevant injection molding equipment in the industry has been optimized for basic processes such as feeding and mold closing. Some semiconductor molding devices have improved the conveying efficiency of molten plastic by improving the structure of the material tank and stirring mechanism. The existing patent (publication number CN115056417B) discloses an injection molding equipment and its operation method for power chip production. The injection molding equipment and its operation method for power chip production facilitate the sequential injection molding of the chip body and pins by setting a first type groove and a second type groove. At the same time, the movable plate separates them to avoid mutual interference during injection molding. Its design is reasonable. While existing technologies have achieved the basic functions of injection molding, the following technical challenges remain: First, during injection molding, molten plastic tends to overflow from the mold edges and seams, forming burrs and flash on the mold surface. This not only wastes raw materials but also requires additional grinding and finishing processes, impacting production efficiency and product yield. Second, after injection molding, the process relies mainly on natural cooling or single water cooling for solidification, resulting in a slow cooling rate and a long injection cycle, making it difficult to meet the demands of efficient continuous production. Third, the molded shell tends to adhere to the inner wall of the mold cavity, and scratches and deformation are likely to occur during demolding, affecting the molding quality of the power chip shell. Summary of the Invention

[0003] The present invention proposes a power chip injection molding device with overflow guidance and air cooling and shaping, which solves the problems of overflow residue, slow cooling and shaping, and easy damage during demolding of existing power chip injection molding devices.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A power chip injection molding apparatus with overflow diversion and air cooling shaping includes a frame, an upper mold fixedly installed on the top of the frame, and a support frame installed on the outside of the frame by bolts. The lower end of the support frame is connected to a liftable lower mold, and the upper mold and the lower mold are arranged opposite to each other to form at least one mold cavity for molding power chips when the mold is closed. The upper surface edge and the mold joint of the lower mold are provided with several overflow guide grooves, and the end of the overflow guide groove is connected to a detachable waste collection box. The lower mold is integrated with an air-cooled cooling air passage. The air-cooled cooling air path includes an air duct and an air outlet, and the lower mold has a spiral meandering air duct inside, with the end of the air duct passing through the side of the lower mold and forming an air outlet. The lower mold is equipped with a liftable ejector pin at its lower end, and the ejector end of the ejector pin can extend into the mold cavity. The ejector pin end is equipped with a blown film assembly.

[0005] As a preferred embodiment of the present invention, a first cylinder is installed on the top of the support frame, and the movable end of the first cylinder is fixedly connected to the top of the upper mold.

[0006] As a preferred embodiment of the present invention, sliding rods are fixedly connected at the four corners of the upper mold, and sliding holes matching the sliding rods are opened inside the support frame, and an injection port is opened at the upper end of the upper mold.

[0007] As a preferred embodiment of the present invention, a waste collection cavity is provided inside the lower mold and at the end of the overflow guide groove, and the waste collection box is adapted to be inserted into the waste collection cavity.

[0008] As a preferred embodiment of the present invention, an air inlet pipe is connected to the outside of the air duct.

[0009] As a preferred embodiment of the present invention, a partition is fixedly connected to the middle of the frame, and a top plate is placed on the top of the partition. Multiple sets of ejector pins are connected to the top of the top plate, and multiple sets of ejector openings adapted to the ejector pins are opened inside the lower end of the lower mold.

[0010] As a preferred embodiment of the present invention, a lifting frame is movably installed inside the partition, and a second cylinder is fixedly connected to the top of the frame. The movable end of the second cylinder is fixedly connected to the lifting frame, and a top plate is connected to the top of the lifting frame.

[0011] As a preferred embodiment of the present invention, the blown film assembly includes an air outlet and a hose, and multiple sets of air outlets are opened inside the side end of the ejector pin. The air outlet is connected to the hose, and the end of the hose is connected to the air inlet pipe.

[0012] Compared with the prior art, the beneficial effects of the present invention are: 1. This power chip injection molding device with overflow diversion and air cooling shaping features overflow diversion channels at the lower mold closing joint and the upper surface edge. During the injection molding process, excess material overflowing from the molten plastic under pressure can quickly collect along the diversion channels and ultimately be stored in the removable waste collection box. This effectively prevents overflow from adhering and solidifying on the mold edge to form burrs and flash, reducing subsequent processing steps. At the same time, overflow can be centrally recycled, reducing plastic raw material loss and saving production costs.

[0013] 2. A spiral-shaped air duct is set inside the lower mold to extend the cooling airflow heat exchange stroke. The cold air can wrap around the mold cavity in all directions and evenly to complete the heat exchange. The heat dissipation coverage is large and the cooling uniformity is strong. It can quickly remove the heat inside the mold and accelerate the curing and shaping of the plastic. At the same time, an ejector pin structure and a blown film assembly are added. The same air inlet pipe can realize the air supply for air cooling and blown demolding. While the ejector pin ejects the chip, an isolation air film is formed between the chip and the cavity wall through the air outlet, which reduces the adhesion and adsorption force and demolding friction resistance. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention.

[0015] Figure 2 This is a schematic diagram of the exploded structure of the present invention.

[0016] Figure 3 This is a cross-sectional structural diagram of the present invention.

[0017] Figure 4 This is a cross-sectional schematic diagram of the air duct structure of the present invention.

[0018] Figure 5 This is a schematic diagram of the ejector pin and air outlet structure of the present invention.

[0019] Figure 6 For the present invention Figure 2 Enlarged view of point A in the middle.

[0020] The following are the labels in the diagram: 1. Frame; 2. Upper mold; 3. Lower mold; 4. Support frame; 5. Mold cavity; 6. Overflow channel; 7. Waste collection box; 8. Air duct; 9. Air outlet; 10. Ejector pin; 11. First cylinder; 12. Sliding rod; 13. Sliding hole; 14. Collection chamber; 15. Air inlet pipe; 16. Partition plate; 17. Top plate; 18. Top opening; 19. Lifting frame; 20. Second cylinder; 21. Air outlet; 22. Hose; 23. Injection port. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0022] Example 1: Refer to Figures 1-6This invention provides a technical solution: a power chip injection molding device with overflow diversion and air cooling shaping, including a frame 1, an upper mold 2 fixedly installed on the top of the frame 1, and a support frame 4 installed on the outside of the frame 1 by bolts. The lower end of the support frame 4 is connected to a liftable lower mold 3, and the upper mold 2 and the lower mold 3 are arranged opposite to each other, forming at least one mold cavity 5 for molding power chips when the mold is closed. The upper surface edge and the mold closing joint of the lower mold 3 are provided with a plurality of overflow diversion channels 6, and the end of the overflow diversion channels 6 is connected to a detachable waste collection box 7. The lower mold 3 integrates an air cooling channel, which includes an air duct 8 and an air outlet 9. The lower mold 3 has a spiral meandering air duct 8, the end of the air duct 8 passes through the side of the lower mold 3 and forms an air outlet 9, and the outside of the air duct 8 is connected to an air inlet pipe 15.

[0023] Reference Figure 1 , Figure 2 The support frame 4 is equipped with a first cylinder 11, and the movable end of the first cylinder 11 is fixedly connected to the top of the upper mold 2. Sliding rods 12 are fixedly connected at the four corners of the upper mold 2, and sliding holes 13 matching the sliding rods 12 are opened inside the support frame 4. An injection port 23 is opened at the upper end of the upper mold 2.

[0024] Reference Figure 6 A waste collection cavity 14 is provided inside the lower mold 3 and at the end of the overflow guide channel 6, and the waste collection box 7 is adapted to be inserted into the waste collection cavity 14.

[0025] In practice, when the power chip injection molding device with overflow guide and air-cooling shaping is undergoing injection cooling, the first cylinder 11 is activated first, driving the upper mold 2 to move vertically downward. The sliding rod 12 slides smoothly along the sliding hole 13, realizing the closing of the upper mold 2 and the lower mold 3. After the mold is closed, the mold cavity 5 forms a sealed molding space. Then, molten plastic is injected into the mold cavity 5 through the injection port 23 to complete the chip injection molding process. The excess overflow generated during the injection process is squeezed and flows rapidly along the overflow guide groove 6 at the joint and edge of the lower mold 3, eventually flowing into the waste collection cavity 14 and being collected in the detachable waste collection box 7, realizing the centralized collection of overflow. To prevent overflow residue from sticking to the mold and affecting chip molding accuracy, after injection molding, an external air supply device introduces cooling air into the air duct 8 through the air inlet pipe 15. The cooling air flows uniformly along the spiral meandering air duct 8, extending the air cooling heat exchange time and carrying away heat from the inside of the lower mold 3 in all directions. Finally, the hot air is discharged from the air outlet 9, achieving uniform air cooling and shaping of the power chip inside the mold cavity 5 and accelerating the plastic curing speed. Through the above operations, this device uses the spiral air duct 8 to improve the uniformity of air cooling heat dissipation, and at the same time relies on the overflow guide groove 6 to complete the overflow guide collection, keeping the mold closing surface clean, and greatly improving the yield and processing efficiency of power chip injection molding.

[0026] Example 2: Refer to Figure 2 , Figure 4 This embodiment is an optimization based on the first embodiment. The lower mold 3 is equipped with a liftable ejector pin 10, and the ejector end of the ejector pin 10 can extend into the mold cavity 5. The ejector pin 10 is equipped with a blown film assembly. A partition plate 16 is fixedly connected in the middle of the frame 1, and a top plate 17 is placed on the top of the partition plate 16. Multiple sets of ejector pins 10 are connected to the top of the top plate 17, and multiple sets of ejector openings 18 adapted to the ejector pins 10 are opened inside the lower end of the lower mold 3.

[0027] Reference Figure 3 , Figure 5 The partition 16 is equipped with a lifting frame 19, and the top of the frame 1 is fixedly connected to a second cylinder 20. The movable end of the second cylinder 20 is fixedly connected to the lifting frame 19, and the top of the lifting frame 19 is connected to a top plate 17. The blown film assembly includes an air outlet 21 and a hose 22. Multiple air outlets 21 are opened inside the side end of the ejector pin 10. The air outlets 21 are connected to the hoses 22, and the end of the hoses 22 is connected to the air inlet pipe 15.

[0028] In practice, when the power chip injection molding device with overflow guide and air-cooling shaping is demolded, after the chip air-cooling shaping is completed, the first cylinder 11 is first controlled to move the upper mold 2 upward to complete the mold opening. Then, the second cylinder 20 is started. The second cylinder 20 drives the lifting frame 19 to move vertically upward along the inside of the partition plate 16, which drives the top plate 17 to rise synchronously. The top plate 17 pushes multiple sets of ejector pins 10 to slide upward along the top opening 18, so that the top of the ejector pins 10 extends into the mold cavity 5 and evenly lifts the molded power chip. During the ejection process of the ejector pins 10, the air inlet pipe 15 diverts part of the cooling air and delivers it to the air outlet 2 on the side of the ejector pin 10 through the hose 22. 1. The air outlet 21 continuously blows air towards the gap between the chip and the mold, forming an air film between the chip surface and the inner wall of the mold cavity 5. This reduces the friction between the chip and the inner wall of the mold, eliminating demolding jamming and sticking problems. At the same time, the air blowing can help disperse the trace dust and debris remaining inside the mold, keeping the mold cavity 5 clean. Through the above operations, using a structure with multiple sets of ejector pins 10 to eject synchronously and air film to assist demolding, the power chip can be demolded without extrusion, scratches, or damage. Moreover, the air cooling circuit shares the same air inlet pipe 15, eliminating the need for additional air supply equipment, reducing the production cost and energy consumption of the device, and further improving the integrity and production continuity of chip injection molding.

[0029] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A power chip injection molding apparatus with overflow diversion and air cooling shaping, comprising a frame (1), characterized in that, The top of the frame (1) is fixedly installed with an upper mold (2), and a support frame (4) is installed on the outside of the frame (1) by bolts. The lower end of the support frame (4) is connected to a liftable lower mold (3), and the upper mold (2) and the lower mold (3) are arranged opposite to each other, forming at least one mold cavity (5) for molding power chips when the mold is closed. The upper surface edge and the mold joint of the lower mold (3) are provided with several overflow guide grooves (6), and the end of the overflow guide groove (6) is connected to a detachable waste collection box (7). The lower mold (3) is integrated with an air-cooled cooling air passage. The air-cooled cooling air path includes an air duct (8) and an air outlet (9), and the lower mold (3) has a spiral meandering air duct (8) inside, the end of the air duct (8) passes through the side of the lower mold (3) and forms an air outlet (9). The lower mold (3) is equipped with a liftable ejector pin (10) at its lower end, and the ejector end of the ejector pin (10) can extend into the mold cavity (5). The ejector pin (10) is equipped with a blown film assembly at its end.

2. The power chip injection molding apparatus with overflow diversion and air cooling as described in claim 1, characterized in that, The support frame (4) is equipped with a first cylinder (11) on its top, and the movable end of the first cylinder (11) is fixedly connected to the top of the upper mold (2).

3. The power chip injection molding apparatus with overflow diversion and air cooling shaping according to claim 2, characterized in that, The upper mold (2) is fixedly connected to the four corners of the upper mold (2), and the support frame (4) has a sliding hole (13) that matches the sliding rod (12) inside. The upper mold (2) has an injection port (23) at the top.

4. The power chip injection molding apparatus with overflow diversion and air cooling as described in claim 1, characterized in that, The lower mold (3) has a waste collection cavity (14) inside and at the end of the overflow guide groove (6), and the waste collection box (7) is adapted to be inserted into the waste collection cavity (14).

5. The power chip injection molding apparatus with overflow diversion and air cooling as described in claim 1, characterized in that, The air duct (8) is connected to an air inlet pipe (15) on its outer side.

6. The power chip injection molding apparatus with overflow diversion and air cooling as described in claim 1, characterized in that, A partition (16) is fixedly connected in the middle of the frame (1), and a top plate (17) is placed on the top of the partition (16). Multiple sets of ejector pins (10) are connected to the top of the top plate (17), and multiple sets of top openings (18) adapted to the ejector pins (10) are opened inside the lower end of the lower mold (3).

7. The power chip injection molding apparatus with overflow diversion and air cooling as described in claim 1, characterized in that, The partition (16) is movably connected to the lifting frame (19), and the top of the frame (1) is fixedly connected to the second cylinder (20). The movable end of the second cylinder (20) is fixedly connected to the lifting frame (19), and the top of the lifting frame (19) is connected to the top plate (17).

8. The power chip injection molding apparatus with overflow diversion and air cooling shaping according to claim 1, characterized in that, The blown film assembly includes a blower (21) and a hose (22), and multiple blowers (21) are opened inside the side end of the ejector pin (10). The blower (21) is connected to the hose (22), and the end of the hose (22) is connected to the air inlet pipe (15).

Images