An integrated molding method for preparing a particle-damped multilayer composite sound-absorbing and sound-insulating panel.

Abstract

This invention relates to the field of composite sound-absorbing and sound-insulating panel preparation and hot-pressing curing process control technology, and particularly to an integrated molding preparation method for a particle-damped multilayer composite sound-absorbing and sound-insulating panel. The method includes: receiving preparation task data and acquiring material state parameters of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle-damped vibration-damping layer to generate basic preparation data; determining layer thickness parameters, bonding parameters, and hot-pressing curing windows based on the basic preparation data to generate a preparation parameter set; performing positioning, laying, gluing, pre-pressing, and hot-pressing curing on a continuous production line to generate a hot-pressed composite panel blank and determining the curing state; and based on the curing state, performing sound-absorbing hole forming, frame splicing structure processing, cooling and shaping, cutting, and inspection to generate standard-sized panels, inspection results, and process correction data. This invention enables the preparation parameters, curing state, subsequent processing, and inspection to form a continuous process chain.

Description

Technical Field

[0001] This invention relates to the field of composite sound-absorbing and sound-insulating board preparation and hot-press curing process control technology, and particularly to an integrated molding preparation method for a particle-damped multilayer composite sound-absorbing and sound-insulating board. Background Technology

[0002] In the field of composite sound-absorbing and sound-insulating panel manufacturing technology, existing solutions for particle-damped multilayer composite sound-absorbing and sound-insulating panels typically employ a combination of a waterproof layer, a fireproof layer, a constrained damping layer, a sound-absorbing layer, a particle-damped vibration-damping layer, and a sound-insulating panel to form a layered structure. Panel manufacturing is then completed through processes such as bonding, pressing, assembly, punching, frame processing, and inspection. While this approach can accomplish multilayer material composites, sound-absorbing hole placement, and frame splicing in conventional scenarios, it is prone to limitations in continuous production line manufacturing of multilayer heterogeneous material panels, including inconsistencies in material properties and layer thickness distribution, mismatches between bonding conditions and hot-pressing curing conditions, and discontinuous connections in post-hot-pressing processing.

[0003] Existing solutions often rely on fixed layer sequences, preset thicknesses, manually set adhesive parameters, and fixed hot-pressing processes. When the material thickness, compression ratio, resilience, bonding surface condition, or adhesive condition of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping shock absorption layer change, there is a lack of stable connection between the front-end material condition record and subsequent positioning, laying, adhesive application, pre-pressing, and hot-pressing curing. This can easily lead to inconsistencies in the interlayer condition of the composite preform to be hot-pressed and a lag in determining the curing state of the hot-pressed composite board.

[0004] Regarding the joint processing of basic data, curing state of hot-pressed composite slabs, sound-absorbing hole forming, frame splicing structure processing, and test results, existing technologies still suffer from common shortcomings in parameter generation, state determination, processing integration, and record writing. Therefore, it is necessary to address the issue of generating a set of preparation parameters based on basic data and linking sound-absorbing hole forming, frame processing, and process correction through the continuous preparation process of particle-damped multilayer composite sound-absorbing and sound-insulating panels. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides an integrated molding method for preparing a particle-damped multilayer composite sound-absorbing and sound-insulating panel, comprising:

[0006] S1. Receive the preparation task data of the particle damping multilayer composite sound-absorbing and sound-insulating panel, obtain the material state parameters of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer and particle damping vibration reduction layer, associate the preparation task data with the material state parameters, and generate preparation basic data.

[0007] S2. Based on the aforementioned preparation data, determine the layer thickness parameters, bonding parameters, and hot-press curing window, and generate a preparation parameter set;

[0008] S3. Based on the preparation parameter set, the waterproof layer, the fireproof layer, the constraint damping layer, the sound-absorbing layer and the particle damping shock absorption layer are positioned, laid, glued and pre-pressed on a continuous production line according to the target layer sequence to generate a composite blank to be hot-pressed;

[0009] S4. Based on the hot-press curing window, the temperature, molding pressure and curing time of the composite blank to be hot-pressed are controlled in a coordinated manner to generate a hot-pressed composite blank, and the curing state of the hot-pressed composite blank is determined.

[0010] S5. Based on the solidification state, the hot-pressed composite blank is processed to form sound-absorbing holes and frame splicing structure to generate a shaped blank; the shaped blank is cooled, shaped, cut and inspected to generate standard-sized plates and inspection results, and the inspection results are associated with the preparation parameter group to generate process correction data for subsequent preparation tasks.

[0011] Furthermore, the preparation task data includes target plate size, target layer sequence, target plate thickness, target sound-absorbing hole parameters, target frame splicing structure, and testing items; the material state parameters include material batch, material thickness, compression ratio, resilience, bonding surface state, and adhesive state.

[0012] Furthermore, the generation of the basic preparation data includes: writing the material batch, material thickness, compression ratio, resilience, and bonding surface condition into the functional layer identifiers of the corresponding waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer; and writing the target board size, target layer sequence, target board thickness, target sound-absorbing hole parameters, and target frame splicing structure into the same preparation batch to generate the basic preparation data.

[0013] Furthermore, the generation of the preparation parameter set includes: determining the layer thickness parameter based on the target plate thickness, material thickness, and compression ratio in the preparation basic data; determining the bonding parameter based on the bonding surface state and adhesive state of adjacent functional layers; and determining the hot-press curing window based on the layer thickness parameter, the bonding parameter, and the resilience.

[0014] Furthermore, the positioning, laying, adhesive application, and pre-pressing include: laying the waterproof layer, the fireproof layer, the constraint damping layer, the sound-absorbing layer, and the particle damping vibration reduction layer according to the target layer sequence; applying adhesive between adjacent functional layers according to the bonding parameters; pre-pressing the multiple functional layers after applying the adhesive, collecting the blank thickness and the layup position deviation, and writing the blank thickness and the layup position deviation into the composite blank to be hot-pressed.

[0015] Furthermore, the hot-press curing window includes curing temperature, molding pressure, curing time, and production line speed; the determination of the curing state includes: collecting the slab temperature, slab thickness, and springback state during the hot-press curing process, matching the slab temperature, slab thickness, and springback state with the hot-press curing window to generate the curing state.

[0016] Furthermore, the sound-absorbing hole forming includes: when the curing state meets the hole processing triggering conditions, punching holes in the hot-pressed composite blank according to the target sound-absorbing hole parameters to generate a hot-pressed composite blank with sound-absorbing holes; collecting hole position deviation and interlayer peeling state around the hole, and writing the hole position deviation and interlayer peeling state around the hole into the detection results.

[0017] Furthermore, the processing of the frame splicing structure includes: based on the target frame splicing structure, processing protrusions and grooves on the edge of the hot-pressed composite plate blank to generate a hot-pressed composite plate blank with a frame splicing structure; collecting the frame size deviation and writing the frame size deviation into the detection result.

[0018] Furthermore, the test results include one or more of the following: plate thickness deviation, interlayer bonding state, hole position deviation, frame size deviation, sound insulation performance, moisture resistance test results, and fire resistance test results; the test results are associated with material batch, layer thickness parameters, bonding parameters, and hot-press curing window to generate process correction data for correcting the layer thickness parameters, bonding parameters, hot-press curing window, stamping parameters, or frame processing parameters.

[0019] Furthermore, after generating the process correction data, the process correction data is returned as part of the subsequent preparation task data to execute S2, generating the preparation parameter set corresponding to the subsequent preparation task; the preparation parameter set corresponding to the subsequent preparation task is used for the positioning, laying, gluing, pre-pressing and hot-pressing curing of the subsequent particle damping multilayer composite sound-absorbing and sound-insulating board.

[0020] The key innovations of this invention include:

[0021] (1) The preparation task data is correlated with the material state parameters of the waterproof layer, fireproof layer, constraint damping layer, sound absorption layer and particle damping shock absorption layer to generate preparation basic data, and a preparation parameter group with constraint layer thickness parameters, bonding parameters and hot pressing curing window is formed based on the preparation basic data.

[0022] (2) Based on the preparation parameter set, multiple functional layers are positioned, laid, coated and pre-pressed on a continuous production line according to the target layer sequence to generate a hot-pressed composite blank. The temperature, molding pressure and curing time of the hot-pressed composite blank are controlled in a coordinated manner based on the hot-pressing curing window to generate a hot-pressed composite blank and its curing state.

[0023] (3) Based on the curing state of the hot-pressed composite blank, the hot-pressed composite blank is processed to form sound-absorbing holes and frame splicing structure to generate a shaped blank. The test results formed after cooling, shaping, cutting and testing are associated with the preparation parameter group to generate process correction data for subsequent preparation tasks.

[0024] The following are its main beneficial effects:

[0025] (1) In view of the problem that the material state and layer thickness distribution, bonding state and hot pressing curing conditions are not sufficiently connected in the existing scheme, by associating the preparation task data with the material state parameters and generating a preparation parameter group, the layer thickness parameters, bonding parameters and hot pressing curing window are made to correspond within the same preparation batch, thereby reducing the inconsistency of preparation parameters caused by changes in material state.

[0026] (2) To address the problem of discontinuous connection between the positioning, placement, gluing, pre-pressing and hot-pressing curing of multi-layer heterogeneous materials in a continuous production line, the laying, bonding and hot-pressing curing processes of multiple functional layers are constrained by the preparation parameter set, so that the composite blank to be hot-pressed and the hot-pressed composite slab form a continuous state record in the same process link.

[0027] (3) To address the lack of linkage between the sound-absorbing hole forming, frame splicing structure processing and test results after hot pressing, the sound-absorbing hole forming and frame splicing structure processing are triggered by the curing state, and the test results are associated with the preparation parameter group to form process correction data, so that subsequent preparation tasks can call the test records and process parameter records of the previous board. Attached Figure Description

[0028] Figure 1 A schematic flowchart illustrating an integrated molding process for a particle-damped multilayer composite sound-absorbing and sound-insulating panel provided in this application embodiment;

[0029] Figure 2 This is a structural block diagram of an integrated molding preparation method for a particle-damped multilayer composite sound-absorbing and sound-insulating panel provided in an embodiment of this application. Detailed Implementation

[0030] Example 1: Refer to Figure 1 This is a schematic flowchart of an integrated molding method for a particle-damped multilayer composite sound-absorbing and sound-insulating panel provided in an embodiment of the present invention. The process may include at least steps S1-S5:

[0031] S1. Receive the preparation task data of the particle damping multilayer composite sound-absorbing and sound-insulating panel, obtain the material state parameters of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer and particle damping vibration reduction layer, associate the preparation task data with the material state parameters, and generate preparation basic data.

[0032] S2. Based on the aforementioned preparation data, determine the layer thickness parameters, bonding parameters, and hot-press curing window, and generate a preparation parameter set;

[0033] S3. Based on the preparation parameter set, the waterproof layer, the fireproof layer, the constraint damping layer, the sound-absorbing layer and the particle damping shock absorption layer are positioned, laid, glued and pre-pressed on a continuous production line according to the target layer sequence to generate a composite blank to be hot-pressed;

[0034] S4. Based on the hot-press curing window, the temperature, molding pressure and curing time of the composite blank to be hot-pressed are controlled in a coordinated manner to generate a hot-pressed composite blank, and the curing state of the hot-pressed composite blank is determined.

[0035] S5. Based on the solidification state, the hot-pressed composite blank is processed to form sound-absorbing holes and frame splicing structure to generate a shaped blank; the shaped blank is cooled, shaped, cut and inspected to generate standard-sized plates and inspection results, and the inspection results are associated with the preparation parameter group to generate process correction data for subsequent preparation tasks.

[0036] S1. Receive the preparation task data of the particle damping multilayer composite sound-absorbing and sound-insulating panel, obtain the material state parameters of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer and particle damping vibration reduction layer, and associate the preparation task data with the material state parameters to generate preparation basic data.

[0037] In practical implementation, S1 can be jointly executed by the controller, material feeding unit, and material status acquisition device of the continuous production line. The controller can be an industrial control computer, programmable controller, or process control equipment connected to the continuous production line. The material feeding unit is connected to the feeding positions of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer, respectively. The material status acquisition device is set at the position before each functional layer enters the positioning and laying station, and is used to read the material batch and collect the material thickness, compression rate, resilience, adhesive surface condition, and adhesive condition.

[0038] The preparation task data can come from production task sheets, board design documents, or the human-machine interface of a continuous production line. The preparation task data includes target board dimensions, target layer sequence, target board thickness, target sound-absorbing hole parameters, target frame splicing structure, and testing items. The target board dimensions record the length, width, and thickness specifications of the boards in this batch. The target layer sequence records the laying order of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer in the thickness direction of the board. The target sound-absorbing hole parameters record the hole position, diameter, spacing, and depth direction of the sound-absorbing holes. The target frame splicing structure records the position, direction, and dimensional reference of the protrusions and grooves to be processed on the edge of the board. The testing items record the board thickness deviation, interlayer bonding status, hole position deviation, frame size deviation, sound insulation performance, moisture resistance test results, and fire resistance test results that subsequent testing units need to output.

[0039] The material state parameters are not simply records of material names, but rather state fields directly related to the preparation process. For the waterproof layer, the material state parameters may include the material batch, material thickness, loading direction, surface cleanliness, and bonding surface condition of the waterproof membrane. For the fireproof layer, the material state parameters may include the material batch, material thickness, compression ratio, resilience, and moisture content of the fireproof material. For the constrained damping layer, the material state parameters may include the material batch, material thickness, compression ratio, resilience, and bonding surface condition of the rubber material. For the sound-absorbing layer, the material state parameters may include the material thickness, compression ratio, resilience, and laying direction of the sound-absorbing material. For the particle damping vibration reduction layer, the material state parameters may include the material batch, material thickness, compression ratio, resilience, damping particle filling state, and outer surface bonding state of the particle damper or particle damping body. The adhesive state may include the adhesive batch, adhesive viscosity state, opening time record, and coating adaptation record.

[0040] In one embodiment, the material state parameters are formed by a loading and scanning device, a thickness detection device, a compression and rebound detection device, and a surface condition detection device. The loading and scanning device reads the material batch of each functional layer material; the thickness detection device collects the material thickness of each functional layer material before entering the continuous production line; the compression and rebound detection device loads and unloads the sampling section and outputs the compression rate and rebound rate; and the surface condition detection device collects the bonding surface condition before adhesive application. The controller writes the above-mentioned collection results into the material state parameters according to the functional layer identifier. The functional layer identifier is used to distinguish between waterproof layers, fireproof layers, constraint damping layers, sound-absorbing layers, and particle damping vibration reduction layers, and is used for the generation of layer thickness parameters, bonding parameters, and hot-press curing windows in subsequent step S2.

[0041] In another implementation, some material condition parameters are derived from a material batch database. This database pre-stores the material thickness, compression ratio, resilience, and adhesive surface condition for the same material batch. During material loading on the continuous production line, the controller reads the material batch, retrieves the corresponding record from the database, and overwrites the current batch record with the material thickness or adhesive condition collected on-site. For fields where on-site acquisition fails, the controller retains the original field from the material batch database and generates a verification flag. For functional layers where material batches cannot be matched, the controller generates a material batch anomaly flag and suspends the functional layer from proceeding to the subsequent positioning and placement station.

[0042] The triggering conditions for S1 can be: writing preparation task data to the controller, completing the loading of multiple functional layer materials, completing the registration of adhesive status, and the continuous production line being in a ready-to-be-prepared state. After receiving the preparation task data, the controller first parses the target board size, target layer sequence, target board thickness, target sound-absorbing hole parameters, and target frame splicing structure. Then, it calls the material status parameters corresponding to each functional layer according to the target layer sequence. If the material status parameters of a certain functional layer are missing, the controller writes the functional layer identifier into the anomaly flag data and keeps the current preparation task in a pending data entry state. If the target layer sequence is inconsistent with the loading position, the controller generates a layup sequence anomaly flag and prompts for re-matching of the loading position and functional layer identifier.

[0043] Specifically, in the implementation of an engineering project, a continuous production line receives preparation task data for a batch of particle-damped multilayer composite sound-absorbing and sound-insulating panels. This preparation task data records the target panel dimensions, target layer sequence, target sound-absorbing hole parameters, and target frame splicing structure. Personnel feed the waterproof layer roll, fireproof layer panel, constraint damping layer panel, sound-absorbing layer panel, and particle-damped vibration-damping layer into the corresponding material feeding units. The controller reads the material batches for each functional layer, and a thickness detection device collects the material thickness. A compression and rebound detection device outputs the compression rate and rebound rate, and a surface condition detection device outputs the adhesive surface condition. The controller writes the target panel dimensions, target layer sequence, target panel thickness, target sound-absorbing hole parameters, and target frame splicing structure into the same preparation batch; simultaneously, it writes the material batch, material thickness, compression rate, rebound rate, and adhesive surface condition into the corresponding functional layer identifier, forming the basic preparation data.

[0044] The basic preparation data includes preparation batch identifier, target sheet size, target layer sequence, target sheet thickness, target sound-absorbing hole parameters, target frame splicing structure, testing items, functional layer identifier, material batch, material thickness, compression ratio, resilience, bonding surface condition, and adhesive condition. After the basic preparation data is generated, it is transmitted by the controller to S2 for use. Based on the target sheet thickness, material thickness, compression ratio, resilience, bonding surface condition, and adhesive condition from the basic preparation data, S2 generates layer thickness parameters, bonding parameters, and a hot-pressing curing window. Therefore, the output of S1 not only records the material source and task content but also provides an input basis for the subsequent generation of preparation parameter sets within the same preparation batch.

[0045] S2. Based on the prepared basic data, determine the layer thickness parameters, bonding parameters and hot-press curing window, and generate a set of prepared parameters.

[0046] In practice, S2 receives the basic preparation data generated by S1 and executes it via the controller or a process parameter generation unit connected to the controller. The process parameter generation unit can be integrated into the continuous production line controller or configured as a process processing device communicating with the continuous production line. When S2 starts, the process parameter generation unit reads the target plate thickness, target layer sequence, material thickness, compression ratio, resilience, bonding surface condition, and adhesive condition from the basic preparation data, and aligns the input fields of each functional layer according to the preparation batch identifier.

[0047] The layer thickness parameters are used to guide the positioning, placement, and pre-compression in S3. These parameters may include the thickness of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, particle damping and vibration-damping layer, and the target preform thickness after pre-compression. The process parameter generation unit calculates the thickness changes of each functional layer during pre-compression and hot-pressing curing based on the target plate thickness, the material thickness of each functional layer, and the compression ratio, generating the layer thickness parameters. If the material thickness of a functional layer exceeds the placement range corresponding to the current target plate thickness, the process parameter generation unit writes that functional layer into the anomaly marker data and returns the preparation baseline data to S1 for material verification.

[0048] The bonding parameters are used to guide the application of adhesive in S3. These parameters may include the adhesive ratio, application amount, application position, application width, and application interval between adjacent functional layers. The process parameter generation unit generates bonding parameters between adjacent functional layers based on the bonding surface condition and adhesive condition. Specifically, corresponding bonding parameters can be configured between the waterproof layer and the fireproof layer, between the fireproof layer and the restraint damping layer, between the restraint damping layer and the sound-absorbing layer, and between the sound-absorbing layer and the particle damping vibration reduction layer. If the bonding surface condition is to be cleaned, the process parameter generation unit generates an abnormal bonding surface marker and writes a field to be reviewed into the preparation parameter group. Before starting S3, the continuous production line suspends the adhesive application of the corresponding functional layer based on this field.

[0049] The hot-press curing window is a combination of process parameters used to guide the S4 hot-press curing process. The hot-press curing window includes curing temperature, molding pressure, curing time, and production line speed. The process parameter generation unit determines the hot-press curing window based on the layer thickness parameter, the adhesion parameter, and the springback rate. Specifically, the layer thickness parameter provides a baseline for the blank thickness before and after hot pressing, the adhesion parameter provides the adhesive layer state between adjacent functional layers, and the springback rate provides the thickness recovery state of the functional layer after compression. The process parameter generation unit combines the above fields to generate the curing temperature, molding pressure, curing time, and production line speed corresponding to the current batch, and writes these fields into the preparation parameter group.

[0050] In one embodiment, the hot-press curing window is generated through a process rule table. The process rule table configures corresponding curing temperatures, molding pressures, curing times, and production line speeds according to the target plate thickness, material thickness, compression ratio, resilience, and adhesive state. After reading the basic preparation data, the process parameter generation unit first matches the layer thickness parameters according to the target plate thickness and target layer sequence, then matches the bonding parameters according to the bonding surface state and adhesive state, and subsequently calls the corresponding hot-press curing window based on the layer thickness parameters and the bonding parameters. In another embodiment, the process parameter generation unit can also read process correction data generated in the previous preparation batch and write the correction fields in the process correction data into the layer thickness parameters, bonding parameters, or hot-press curing window corresponding to the current preparation batch.

[0051] The trigger condition for S2 is that the basic preparation data output by S1 has been written, and there are no abnormal material batch markers or abnormal layup sequence markers in the basic preparation data. If there are markers to be verified, the process parameter generation unit retains the original basic preparation data and generates a parameter generation pause marker. If the target plate thickness, material thickness, and compression ratio cannot form corresponding layer thickness parameters, the process parameter generation unit generates a layer thickness parameter abnormality marker. If the adhesive state does not match the adhesive surface state of adjacent functional layers, the process parameter generation unit generates an adhesive parameter abnormality marker. If there are version inconsistencies between the curing temperature, molding pressure, curing time, and production line speed, the process parameter generation unit calls the hot-press curing window version under the same preparation batch and retains the replaced version record.

[0052] During an engineering process, after reading the basic preparation data generated by S1, the controller matches the target board thickness with the material thicknesses of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer. The process parameter generation unit generates corresponding layer thickness parameters based on the compression ratio of each functional layer, and generates the coating amount and coating position based on the bonding surface state and adhesive state of adjacent functional layers. Subsequently, the process parameter generation unit matches the curing temperature, molding pressure, curing time, and production line speed according to the layer thickness parameters, bonding parameters, and resilience, generating the preparation parameter set for the current batch. The preparation parameter set is written into the process control queue of the continuous production line and transmitted to the positioning layup unit, adhesive application unit, pre-pressing unit, and hot-pressing curing unit.

[0053] The preparation parameter set includes a batch identifier, target layer sequence, layer thickness parameters, bonding parameters, hot-pressing curing window, production line speed, anomaly marker data, and parameter version records. After the preparation parameter set is generated, it proceeds to step S3. In S3, the positioning layup unit performs layup according to the target layer sequence and layer thickness parameters, the adhesive application unit performs coating according to the bonding parameters, and the pre-pressing unit performs pre-pressing according to the layer thickness parameters and production line speed. The hot-pressing curing window is simultaneously transmitted to step S4 and is invoked when the composite preform to be hot-pressed enters the hot-pressing curing unit.

[0054] S3. Based on the preparation parameter set, the waterproof layer, the fireproof layer, the constraint damping layer, the sound-absorbing layer and the particle damping shock absorption layer are positioned, laid, glued and pre-pressed on a continuous production line according to the target layer sequence to generate a composite blank to be hot-pressed.

[0055] In practice, S3 receives the preparation parameter set generated by S2 and executes it through the material feeding unit, positioning and layup unit, adhesive application unit, pre-pressing unit, and controller in the continuous production line. The material feeding unit provides the positioning and layup unit with a waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer. The positioning and layup unit reads the target layer sequence and layer thickness parameters from the preparation parameter set and sequentially transports each functional layer to the layup station according to the target layer sequence. The adhesive application unit reads the bonding parameters and applies adhesive between adjacent functional layers. The pre-pressing unit reads the layer thickness parameters and the production line speed and pre-presses the multiple functional layers after adhesive application.

[0056] The target layer sequence serves as the order reference for each functional layer to enter the layup station in S3. The target layer sequence originates from the preparation task data in S1 and is written into the preparation parameter group in S2. The positioning layup unit matches the positions of the waterproof layer, the fireproof layer, the constraint damping layer, the sound-absorbing layer, and the particle damping vibration reduction layer to form a layup reference in the same width and length directions of the slab. In one embodiment, the positioning layup unit positions the sides of each functional layer using an edge positioning mechanism and feeds each functional layer into the same layup path using a conveyor roller group. In another embodiment, the positioning layup unit can also collect layup position deviations and write these deviations into the process record of the composite slab to be hot-pressed.

[0057] The adhesive application unit applies adhesive between adjacent functional layers according to the bonding parameters. These bonding parameters include the adhesive mixing ratio or application amount and correspond to the bonding positions between adjacent functional layers. The adhesive application unit first reads the identifier of the functional layer currently entering the adhesive application station, and then calls the corresponding bonding parameters based on the functional layer identifier. Specifically, when the waterproof layer and fireproof layer enter the adhesive application station, the adhesive application unit calls the bonding parameters between the waterproof layer and the fireproof layer; when the fireproof layer and the constraint damping layer enter the adhesive application station, the adhesive application unit calls the bonding parameters between the fireproof layer and the constraint damping layer. After coating is completed, the adhesive application unit writes the coating amount, coating position, and coating time into the process record corresponding to the preparation batch.

[0058] The pre-pressing unit pre-presses multiple functional layers after the adhesive is applied. The pre-pressing unit controls the position of the pre-pressing roller or pre-pressing plate according to the layer thickness parameters and the production line speed, and collects the thickness of the preform after pre-pressing. The preform thickness is used to record the thickness state of the composite preform before hot pressing and curing, and the layup position deviation is used to record the positional offset of each functional layer in the length and width directions of the preform. The controller writes the preform thickness and the layup position deviation into the composite preform to be hot-pressed, so that the composite preform to be hot-pressed includes not only the physically layered preform but also the corresponding batch record and process status.

[0059] The trigger condition for S3 is that the preparation parameter set is completed and the material feeding unit is in a feeding state. If there is an abnormal mark for the layer thickness parameter or the adhesion parameter in the preparation parameter set, the controller pauses the positioning and laying action and returns the abnormal mark to S2. If a material batch of a functional layer is inconsistent with the preparation parameter set during the feeding process, the controller generates a material batch conflict mark and stops the functional layer from entering the laying station. If the coating amount is inconsistent with the adhesion parameter, the glue application unit marks the current slab section as needing re-inspection and writes the coating amount deviation into the process record. If the thickness of the pre-pressed slab does not match the layer thickness parameter, the pre-pressing unit generates a slab thickness deviation mark and writes the slab thickness deviation mark into the hot-pressed composite slab.

[0060] In one engineering process, the continuous production line, following the target layer sequence in the preparation parameter set, first sends the waterproof layer to the laying station, then sequentially sends the fireproof layer, restraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer into the same laying path. The adhesive application unit applies adhesive between adjacent functional layers according to their bonding parameters. After multiple functional layers are aligned by the positioning layup unit, they enter the pre-pressing unit. The pre-pressing unit applies pre-pressure to the adhesive-coated functional layers, and a thickness detection device collects the blank thickness, while a position detection device collects the layup position deviation. The controller writes the blank thickness, layup position deviation, coating amount, and functional layer identification into the current preparation batch, forming a composite blank ready for hot pressing.

[0061] The preform to be hot-pressed includes a waterproof layer, a fireproof layer, a constraint damping layer, a sound-absorbing layer, and a particle damping vibration reduction layer that have been positioned, coated, and pre-pressed, as well as the preform thickness, layup position deviation, coating amount, target layer sequence, and preparation batch identifier corresponding to the preform. After the preform is formed, it proceeds to step S4. Step S4 calls the hot-pressing curing window in the preparation parameter group, using the preform thickness and layup position deviation in the preform as the state input before hot-pressing curing. Thus, the output product of step S3 and the input object of step S4 are continuously connected at both the physical preform and process record levels.

[0062] S4. Based on the hot-press curing window, the temperature, molding pressure and curing time of the composite blank to be hot-pressed are controlled in a coordinated manner to generate a hot-pressed composite blank, and the curing state of the hot-pressed composite blank is determined.

[0063] In practical implementation, S4 receives the composite preform to be hot-pressed formed in S3 and calls the hot-pressing curing window in the preparation parameter group generated in S2. S4 can be jointly executed by a hot-pressing curing unit, a hot press, a temperature detection device, a pressure control device, a thickness detection device, a springback state acquisition device, and a controller. After receiving the composite preform to be hot-pressed, the hot-pressing curing unit reads the preparation batch identifier and calls the corresponding curing temperature, molding pressure, curing time, and production line speed according to the preparation batch identifier.

[0064] The hot-press curing window serves as the control reference for the hot-press curing process in S4. The curing temperature is used to configure the temperature of the heating components of the hot press; the molding pressure is used to configure the pressure applied by the hot press to the composite preform; the curing time is used to configure the time the composite preform is in the hot-press curing state; and the production line speed is used to configure the cycle time of the composite preform passing through the hot-press curing unit. The hot-press curing unit performs coordinated control of the temperature, molding pressure, and curing time of the composite preform based on the above fields, and continuously records the preform temperature, preform thickness, and springback state during the hot-press curing process.

[0065] The slab temperature can be collected by temperature detection devices at the inlet, hot pressing zone, and outlet of the hot press. The slab thickness can be collected by a thickness detection device at the outlet of the hot pressing curing unit. The springback state can be formed by recording the short-term thickness recovery after hot pressing or the thickness change after depressurization. The controller matches the slab temperature, slab thickness, and springback state with the hot pressing curing window to generate the curing state of the hot-pressed composite slab. The curing state can be recorded as: hole processing trigger condition reached, hole processing trigger condition not reached, awaiting cooling verification, or awaiting re-inspection. The curing state is used as the entry condition for sound-absorbing hole forming and frame splicing structure processing in S5.

[0066] In one embodiment, the hot-pressing curing unit employs a continuous hot press. After the composite preform to be hot-pressed enters the continuous hot press from the continuous production line, the controller controls the heating zone temperature, the pressing zone forming pressure, and the conveying zone production line speed according to the hot-pressing curing window. The composite preform to be hot-pressed is cured to form a hot-pressed composite slab. When the hot-pressed composite slab leaves the hot-pressing curing unit, a temperature detection device collects the slab temperature, a thickness detection device collects the slab thickness, and a springback state acquisition device records the thickness change after pressure release. The controller writes these records into the curing status field.

[0067] In another embodiment, the hot-press curing unit employs a segmented hot-pressing method. The controller allocates the hot-press curing window to multiple hot-pressing segments according to the preparation parameter set. Each hot-pressing segment records its corresponding curing temperature, molding pressure, and curing time. After the hot-pressed composite preform sequentially enters multiple hot-pressing segments, the controller merges the preform temperature, preform thickness, and springback status collected from each segment into a curing state for the same preparation batch. If the temperature or molding pressure of a certain hot-pressing segment does not match the hot-press curing window, the controller generates a hot-pressing temperature deviation mark or a molding pressure deviation mark and writes the corresponding preform segment into a pending inspection status.

[0068] The trigger condition for S4 is that the hot-pressed composite preform reaches the inlet of the hot-press curing unit, and the preform thickness and layup position deviation in the hot-pressed composite preform have not been written to the pause flag. If the coating amount deviation flag in the hot-pressed composite preform is not processed, the controller can cache the preform segment to the check queue. If the preform temperature acquisition fails during the hot-press curing process, the controller retains the current hot-press curing window version and generates a preform temperature acquisition anomaly flag. If the preform thickness acquisition result is missing, the controller marks the corresponding preform segment as pending inspection and prohibits it from directly entering the sound-absorbing hole forming station. If the springback state does not match the hot-press curing window, the controller writes the springback state to the curing state and restricts the preform segment's entry into the hole processing trigger condition in S5.

[0069] In one engineering process, the preform to be hot-pressed via S3 is conveyed into the hot-pressing curing unit. The controller reads the hot-pressing curing window of the current batch and drives the hot press to hot-press the preform according to the curing temperature, molding pressure, and curing time. After passing through the hot-pressing zone, the preform is formed into a hot-pressed composite slab. When the hot-pressed composite slab leaves the hot-pressing curing unit, a temperature detection device collects the slab temperature, a thickness detection device collects the slab thickness, and a springback state acquisition device records the springback state after depressurization. The controller matches the slab temperature, slab thickness, and springback state with the hot-pressing curing window to generate a curing state and binds the curing state to the batch identifier of the hot-pressed composite slab.

[0070] The hot-pressed composite slab includes a layered slab that has undergone hot-press curing, and slab temperature, slab thickness, springback state, hot-press curing window version, and curing state bound to the hot-pressed composite slab. After the curing state is generated, the process proceeds to S5. S5 reads the curing state and determines the execution method for sound-absorbing hole forming and frame splicing structure processing based on the curing state. Thus, S4 converts the slab state generated during the hot-press curing process into the processing trigger input in S5, enabling continuous connection between hot-press curing and subsequent processing within the same production batch.

[0071] S5. Based on the solidification state, the hot-pressed composite blank is processed to form sound-absorbing holes and frame splicing structure to generate a shaped blank; the shaped blank is cooled, shaped, cut and inspected to generate standard-sized plates and inspection results, and the inspection results are associated with the preparation parameter group to generate process correction data for subsequent preparation tasks.

[0072] In practice, S5 receives the hot-pressed composite blank and its cured state formed in S4, and the process is executed by the stamping and hole-forming unit, the frame processing unit, the cooling and shaping unit, the cutting unit, the detection unit, and the controller. The controller first reads the batch identifier corresponding to the hot-pressed composite blank, then calls the target sound-absorbing hole parameters and the target frame splicing structure from S1, and reads the cured state generated in S4. If the cured state meets the hole processing triggering conditions, the stamping and hole-forming unit forms the sound-absorbing holes in the hot-pressed composite blank according to the target sound-absorbing hole parameters. If the cured state does not meet the hole processing triggering conditions, the controller writes the hot-pressed composite blank into a state awaiting re-inspection or a state awaiting cooling verification.

[0073] The hole processing triggering conditions are formed by matching the slab temperature, slab thickness, springback state, and hot-pressing curing window. The target sound-absorbing hole parameters include the hole position, hole diameter, hole spacing, and hole depth direction. After reading the target sound-absorbing hole parameters, the stamping hole-forming unit stamps holes in the hot-pressed composite slab to generate a hot-pressed composite slab with sound-absorbing holes. After hole formation, the detection unit collects the hole position deviation and the interlayer peeling state around the hole, and writes the hole position deviation and the interlayer peeling state around the hole into the detection results. If the hole position deviation does not match the target sound-absorbing hole parameters, the controller generates a hole position deviation mark; if the interlayer peeling state around the hole is collected, the controller marks the corresponding slab segment as pending re-inspection and writes the interlayer peeling state around the hole into the input record of subsequent process correction data.

[0074] The processing of the frame splicing structure is performed based on the target frame splicing structure. The target frame splicing structure includes the position, orientation, and size references of the protrusions and grooves. After reading the target frame splicing structure, the frame processing unit processes the protrusions and grooves on the edge of the hot-pressed composite slab blank to generate a hot-pressed composite slab blank with the frame splicing structure. After the frame processing is completed, the detection unit collects the frame size deviation and writes the frame size deviation into the detection result. If the frame size deviation exceeds the processing record range corresponding to the current batch, the controller generates a frame size deviation mark and writes the slab segment into the pending re-inspection state.

[0075] In one implementation, the sound-absorbing hole forming is performed before the frame splicing structure processing. The controller first calls the target sound-absorbing hole parameters to complete the punching hole forming in the panel area, and then calls the target frame splicing structure to complete the protrusion and groove processing on the edge of the panel. In another implementation, for a blank that requires the edge reference to be fixed first, the frame processing unit first processes the positioning reference on one side edge of the blank, and then the punching hole forming unit performs the sound-absorbing hole forming, followed by the completion of the protrusion and groove processing on other edges. Both of the above implementations use the solidification state as the trigger input for entering processing, and the hole position deviation, the interlayer peeling state around the hole, and the frame size deviation after processing are written into the detection results.

[0076] The formed slab is an intermediate product of a hot-pressed composite slab after sound-absorbing hole forming and frame splicing. After formation, the formed slab enters a cooling and shaping unit. This unit cools and shapes the slab, recording its thickness and surface condition after cooling. After cooling and shaping, the cutting unit cuts the slab according to the target sheet size, generating standard-sized panels. After cutting, the inspection unit inspects the standard-sized panels according to inspection items and generates inspection results. These results may include one or more of the following: thickness deviation, interlayer bonding state, hole position deviation, frame size deviation, sound insulation performance, moisture resistance test results, and fire resistance test results.

[0077] The trigger condition for S5 is that the solidification state generated in S4 is completed and the hot-pressed composite blank reaches the entrance of the stamping hole forming unit or the frame processing unit. If the solidification state is a state awaiting cooling and verification, the controller first sends the hot-pressed composite blank to the cooling waiting position and rewrites the solidification state after verification. If the solidification state is a state awaiting re-inspection, the controller pauses the sound-absorbing hole forming and frame splicing structure processing and writes abnormal marker data to the corresponding blank segment. If the stamping hole forming unit reports abnormal stamping parameters, the controller records the stamping parameters and generates a stamping parameter abnormality marker. If the frame processing unit reports abnormal frame processing parameters, the controller records the frame processing parameters and generates a frame processing parameter abnormality marker.

[0078] In one engineering process, before the hot-pressed composite blank output by S4 enters the punching and hole-forming unit, the controller reads its curing state. When the curing state meets the hole processing trigger conditions, the punching and hole-forming unit punches and forms holes in the hot-pressed composite blank according to the target sound-absorbing hole parameters. After the hole forming is completed, the detection unit collects the hole position deviation and the interlayer peeling state around the hole. Subsequently, the frame processing unit processes protrusions and grooves on the edge of the blank according to the target frame splicing structure and collects the frame size deviation. The blank after sound-absorbing hole forming and frame splicing structure processing enters the cooling and shaping unit as a formed blank. After cooling and shaping is completed, the cutting unit cuts according to the target sheet size, and the detection unit generates detection results according to the detection items. The controller associates the detection results with the material batch, layer thickness parameters, bonding parameters, and hot-pressing curing window in the preparation parameter group to generate process correction data.

[0079] The process correction data is used to record correction fields for layer thickness parameters, bonding parameters, hot-press curing windows, stamping parameters, or border processing parameters. Specifically, when the detection result includes a plate thickness deviation, the controller associates the plate thickness deviation with the layer thickness parameters and the hot-press curing window to generate correction fields for the layer thickness parameters or the hot-press curing window. When the detection result includes an interlayer bonding state, the controller associates the interlayer bonding state with the bonding parameters and the hot-press curing window to generate correction fields for the bonding parameters or curing time. When the detection result includes a hole position deviation or a hole peri-layer delamination state, the controller associates the hole position deviation or a hole peri-layer delamination state with the stamping parameters and the curing state to generate correction fields for the stamping parameters or hole processing trigger conditions. When the detection result includes a border size deviation, the controller associates the border size deviation with the border processing parameters to generate correction fields for the border processing parameters.

[0080] After generating the process correction data, the controller returns it to S2 as part of the subsequent preparation task data. When the subsequent preparation task starts, S2 reads the process correction data and uses it to generate the preparation parameter set corresponding to the subsequent preparation task. The preparation parameter set corresponding to the subsequent preparation task is then used in the subsequent positioning, placement, gluing, pre-pressing, and hot-pressing curing processes of the particle-damped multilayer composite sound-absorbing and sound-insulating panel. Thus, the standard-sized panel output by S5 is the physical product of this batch, and the test results and process correction data output by S5 are the input records for the subsequent preparation tasks, forming a continuous connection between preparation batches with S1 to S4.

[0081] Example 2: Figure 2 A structural block diagram is shown illustrating an integrated molding method for preparing a particle-damped multilayer composite sound-absorbing and sound-insulating panel according to an embodiment of the present invention. Figure 2 As shown, the structure may include:

[0082] The basic data generation module 01 is used to receive the preparation task data of the particle-damped multilayer composite sound-absorbing and sound-insulating board, obtain the material state parameters of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration damping layer, and associate the preparation task data with the material state parameters to generate basic preparation data. Specifically, the basic data generation module receives the preparation task data from the preparation task input terminal and the material state parameters from the material feeding position on the continuous production line. The preparation task data includes the target board size, target layer sequence, target board thickness, target sound-absorbing hole parameters, target frame splicing structure, and inspection items. The material state parameters include the material batch, material thickness, compression ratio, resilience, bonding surface condition, and adhesive condition corresponding to the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration damping layer. The preparation basic data generation module writes the preparation task data according to the preparation batch and collects the material state parameters according to the functional layer identifier. When the material batch is inconsistent with the target layer sequence, the corresponding functional layer identifier is written into the anomaly marker data. When the material thickness, compression ratio, resilience, or adhesive surface state is missing, the corresponding field is kept in a pending verification state. The preparation basic data generation module encapsulates the target plate size, target layer sequence, target plate thickness, target sound-absorbing hole parameters, target frame splicing structure, test items, and material state parameters of each functional layer into preparation basic data, and provides the preparation basic data to the preparation parameter group generation module, so that the preparation parameter group generation module can call the target plate thickness, material thickness, compression ratio, resilience, adhesive surface state, and adhesive state.

[0083] The preparation parameter group generation module 02, connected to the preparation basic data generation module, is used to determine layer thickness parameters, bonding parameters, and hot-press curing windows based on the preparation basic data, and generate a preparation parameter group. Specifically, the preparation parameter group generation module receives preparation basic data from the preparation basic data generation module and reads the target plate thickness, target layer sequence, material thickness, compression ratio, resilience, bonding surface condition, and adhesive condition from the preparation basic data. The preparation parameter group generation module generates layer thickness parameters corresponding to the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer based on the target plate thickness, material thickness, and compression ratio; generates bonding parameters based on the bonding surface condition and adhesive condition of adjacent functional layers; and generates a hot-press curing window based on the layer thickness parameters, the bonding parameters, and the resilience. The hot-press curing window includes curing temperature, molding pressure, curing time, and production line speed. When generating the preparation parameter set, the module binds the layer thickness parameter to the target layer sequence, the adhesion parameter to the adhesive application position between adjacent functional layers, and the hot-pressing curing window to the preparation batch. When the target plate thickness does not match the material thickness and compression ratio of multiple functional layers, the basic preparation data is written to a pending review status. When the adhesive state does not match the adhesive surface state, the adhesion parameter is written to anomaly marker data. The module then transmits the generated preparation parameter set to the continuous composite molding module and provides the hot-pressing curing window within it for the hot-pressing curing module to use.

[0084] The continuous composite molding module 03, connected to the preparation parameter set generation module, is used to position, lay out, apply adhesive to, and pre-press the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration damping layer according to the target layer sequence on a continuous production line, based on the preparation parameter set, to generate a composite preform to be hot-pressed. Specifically, the continuous composite molding module receives the preparation parameter set from the preparation parameter set generation module and reads the target layer sequence, layer thickness parameters, bonding parameters, and production line speed from the preparation parameter set. The continuous composite molding module delivers the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration damping layer to the positioning and laying positions according to the target layer sequence on the continuous production line, and records the laying status of each functional layer according to the layer thickness parameters. The continuous composite molding module applies adhesive between adjacent functional layers according to the bonding parameters, and writes the coating amount, coating position, and coating time into the corresponding preparation batch. After the adhesive is applied, the continuous composite molding module pre-presses multiple functional layers and collects the preform thickness and layup position deviation. When the layup position deviation does not match the layup position corresponding to the target layer sequence, the corresponding preform segment is written into the abnormal marker data. When the coating amount does not match the bonding parameters, the corresponding adhesive application record is written into the pending review status. The continuous composite molding module forms a preform to be hot-pressed after positioning, laying, adhesive application, and pre-pressing of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer. The preform to be hot-pressed, along with the preform thickness, layup position deviation, coating amount, and preparation batch, is transferred to the hot-pressing curing module.

[0085] The hot-press curing module 04, connected to the continuous composite molding module, is used to coordinately control the temperature, molding pressure, and curing time of the composite preform to be hot-pressed based on the hot-press curing window, generate a hot-pressed composite slab, and determine the curing state of the hot-pressed composite slab. Specifically, the hot-press curing module receives the composite preform to be hot-pressed from the continuous composite molding module and calls the hot-press curing window from the preparation parameter group generation module. The hot-press curing module reads the curing temperature, molding pressure, curing time, and production line speed in the hot-press curing window, and performs hot-press curing on the composite preform according to the curing temperature, molding pressure, and curing time. During the hot-press curing process, the hot-press curing module records the slab temperature, slab thickness, and springback state, and matches the slab temperature, slab thickness, and springback state with the hot-press curing window to form a curing state. The curing state includes hole processing trigger conditions, a state awaiting cooling verification, and a state awaiting re-inspection. When the hot-press curing module receives a composite preform with abnormal marker data, it keeps the corresponding preform segment in a state awaiting re-inspection. If the acquisition of slab temperature, slab thickness, or springback status fails, the acquisition failure field is written to the corresponding preparation batch. The hot-press curing module forms the hot-pressed composite preform into a hot-pressed composite slab after hot-press curing and transmits the hot-pressed composite slab, curing status, slab temperature, slab thickness, and springback status to the forming detection write-back module.

[0086] The molding detection and write-back module 05, connected to the hot-press curing module and the preparation parameter group generation module, is used to perform sound-absorbing hole molding and frame splicing structure processing on the hot-pressed composite blank based on the curing state, generating a molded blank; cooling, shaping, cutting, and inspecting the molded blank to generate standard-sized plates and inspection results, and associating the inspection results with the preparation parameter group to generate process correction data for subsequent preparation tasks. Specifically, the molding detection and write-back module receives the hot-pressed composite blank and curing state from the hot-press curing module, and receives the preparation parameter group from the preparation parameter group generation module. The molding detection and write-back module reads the target sound-absorbing hole parameters, the target frame splicing structure, and the curing state; when the curing state meets the hole processing triggering condition, sound-absorbing hole molding is performed on the hot-pressed composite blank, and hole position deviation and interlayer peeling state around the hole are collected; when the curing state is written to the state to be cooled for verification or the state to be re-inspected, the corresponding blank segment is kept in the abnormal marking data. The molding inspection and write-back module processes the edges of the hot-pressed composite slab with protrusions and grooves based on the target frame splicing structure, and collects the frame size deviation. After the sound-absorbing hole molding and frame splicing structure processing are completed, the molding inspection and write-back module generates a molded slab, and cools, shapes, cuts, and inspects the molded slab to generate standard-sized plates and inspection results. The inspection results include one or more of the following: plate thickness deviation, interlayer bonding state, hole position deviation, frame size deviation, sound insulation performance, moisture resistance test results, and fire resistance test results. The molding inspection and write-back module associates the inspection results with material batch, layer thickness parameters, bonding parameters, and hot-pressing curing window to generate process correction data; the process correction data is returned to the preparation parameter group generation module and used as the data object for subsequent preparation tasks.

Claims

1. A method for integrally molding and preparing a particle-damped multilayer composite sound-absorbing and sound-insulating panel, characterized in that, include: S1. Receive the preparation task data of the particle damping multilayer composite sound-absorbing and sound-insulating panel, obtain the material state parameters of the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer and particle damping vibration reduction layer, associate the preparation task data with the material state parameters, and generate preparation basic data. S2. Based on the aforementioned preparation data, determine the layer thickness parameters, bonding parameters, and hot-press curing window, and generate a preparation parameter set; S3. Based on the preparation parameter set, the waterproof layer, the fireproof layer, the constraint damping layer, the sound-absorbing layer and the particle damping shock absorption layer are positioned, laid, glued and pre-pressed on a continuous production line according to the target layer sequence to generate a composite blank to be hot-pressed; S4. Based on the hot-press curing window, the temperature, molding pressure and curing time of the composite blank to be hot-pressed are controlled in a coordinated manner to generate a hot-pressed composite blank, and the curing state of the hot-pressed composite blank is determined. S5. Based on the solidified state, the hot-pressed composite board blank is processed to form sound-absorbing holes and frame splicing structure to generate a shaped board blank; The formed slab is cooled, shaped, cut, and inspected to generate standard-sized plates and inspection results. The inspection results are then associated with the preparation parameter set to generate process correction data for subsequent preparation tasks.

2. The method according to claim 1, characterized in that, The preparation task data includes target plate size, target layer sequence, target plate thickness, target sound-absorbing hole parameters, target frame splicing structure, and testing items; the material state parameters include material batch, material thickness, compression ratio, resilience, bonding surface state, and adhesive state.

3. The method according to claim 2, characterized in that, The generation of the preparation basic data includes: writing the material batch, material thickness, compression ratio, resilience, and bonding surface condition into the functional layer identifiers of the corresponding waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer; and writing the target board size, target layer sequence, target board thickness, target sound-absorbing hole parameters, and target frame splicing structure into the same preparation batch to generate the preparation basic data.

4. The method according to claim 1, characterized in that, The generation of the preparation parameter set includes: determining the layer thickness parameter based on the target plate thickness, material thickness, and compression ratio in the preparation basic data; determining the bonding parameter based on the bonding surface state and adhesive state of adjacent functional layers; and determining the hot-press curing window based on the layer thickness parameter, the bonding parameter, and the resilience.

5. The method according to claim 1, characterized in that, The positioning, laying, gluing, and pre-pressing process includes: laying the waterproof layer, fireproof layer, constraint damping layer, sound-absorbing layer, and particle damping vibration reduction layer according to the target layer sequence; applying adhesive between adjacent functional layers according to the bonding parameters; pre-pressing the multiple functional layers after applying the adhesive; collecting the blank thickness and layup position deviation; and writing the blank thickness and layup position deviation into the composite blank to be hot-pressed.

6. The method according to claim 1, characterized in that, The hot-press curing window includes curing temperature, molding pressure, curing time, and production line speed; The determination of the curing state includes: collecting the slab temperature, slab thickness, and springback state during the hot-press curing process, matching the slab temperature, slab thickness, and springback state with the hot-press curing window to generate the curing state.

7. The method according to claim 1, characterized in that, The sound-absorbing hole forming process includes: when the curing state meets the hole processing triggering conditions, punching holes in the hot-pressed composite blank according to the target sound-absorbing hole parameters to generate a hot-pressed composite blank with sound-absorbing holes; collecting hole position deviation and interlayer peeling state around the hole, and writing the hole position deviation and interlayer peeling state around the hole into the detection results.

8. The method according to claim 1, characterized in that, The processing of the frame splicing structure includes: based on the target frame splicing structure, processing protrusions and grooves on the edge of the hot-pressed composite plate blank to generate a hot-pressed composite plate blank with a frame splicing structure; collecting the frame size deviation and writing the frame size deviation into the detection result.

9. The method according to claim 1, characterized in that, The test results include one or more of the following: plate thickness deviation, interlayer bonding state, hole position deviation, frame size deviation, sound insulation performance, moisture resistance test results, and fire resistance test results; the test results are associated with material batch, layer thickness parameters, bonding parameters, and hot pressing curing window to generate process correction data for correcting the layer thickness parameters, bonding parameters, hot pressing curing window, stamping parameters, or frame processing parameters.

10. The method according to claim 1, characterized in that, After generating the process correction data, the process correction data is returned as part of the subsequent preparation task data to execute S2, generating the preparation parameter set corresponding to the subsequent preparation task; the preparation parameter set corresponding to the subsequent preparation task is used for the positioning, laying, gluing, pre-pressing and hot-pressing curing of the subsequent particle damping multilayer composite sound-absorbing and sound-insulating board.

Images