A semiconductor crystal bar taking and placing device and method based on high-precision and AGV docking

Abstract

This application provides a semiconductor ingot handling device and method based on high-precision docking with an AGV, relating to the field of semiconductor manufacturing automation equipment technology. It includes a frame with a three-axis moving mechanism and a gripper assembly. The frame houses an AGV docking and positioning mechanism and a stacking rack. The AGV docking and positioning mechanism includes a guide table with two side plates forming a channel. The width at both ends of the side plates is smaller than the width in the middle, and the transition is smooth, forming a flared guide structure. Limiting components are provided on both side plates. A camera is also provided on the gripper assembly. A fixing frame is provided on the AGV, and a positioning mark is provided on the top of the AGV. This application features high handling efficiency and a simple structure.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing automation equipment technology, and in particular to a semiconductor ingot picking and placing device and method based on high-precision docking with AGV. Background Technology

[0002] In the semiconductor manufacturing process, semiconductor ingots are a core raw material, and their transfer process requires extremely high precision and stability. Traditional ingot handling often relies on manual assistance with robotic arms, which suffers from low handling accuracy, easy damage to the ingots from bumps and knocks, and low work efficiency. While existing automated handling equipment has achieved basic mechanical handling, it generally suffers from large positioning deviations, poor coordination between the frame and the AGV, and insufficient smoothness of the gripper assembly movement when docking with Automated Guided Vehicles (AGVs), failing to meet the demands of high-precision semiconductor manufacturing.

[0003] Meanwhile, existing gripper assemblies are mostly rigid clamping structures, which cannot be adapted to semiconductor crystal rods of different diameters and lack clamping force feedback and buffer protection mechanisms, which can easily lead to scratches on the surface of the crystal rods or damage from internal stress. The docking between the frame and the AGV mostly relies on a single guiding structure, without deviation compensation and reliable positioning functions. When the AGV stops and fluctuates, docking misalignment is likely to occur, affecting the safety and efficiency of the transfer.

[0004] To address the aforementioned issues, semiconductor ingot handling devices urgently need to possess high-precision positioning and stable AGV docking capabilities. Summary of the Invention

[0005] To address the aforementioned issues, this application provides a semiconductor ingot handling device and method based on high-precision docking with AGV.

[0006] The semiconductor ingot handling device and method based on high-precision docking with AGV provided in this application adopts the following technical solution: A semiconductor ingot handling device based on high-precision docking with an AGV includes a frame with a three-axis moving mechanism and a gripper assembly. The frame has a cavity containing an AGV docking and positioning mechanism and a stacking rack. Ingots are placed on the stacking rack. The AGV docking and positioning mechanism includes a guide platform located at the bottom of the frame. The guide platform has two side plates forming a channel for the AGV to pass through. The gap between the channel and the AGV is 0.1-0.2 mm. The width of the two ends of the side plates is smaller than the width of the middle portion, and the transition is smooth, forming a flared guide structure. One side plate is fixed to the guide platform. The bottom of the guide platform has a sliding guide rail and an adjusting screw. Another side plate is mounted on a sliding guide rail. Both side plates are equipped with limiting components, each including a bracket. Each bracket has a second cylinder at both ends, and the output end of the second cylinder has a limiting block. The limiting block is arc-shaped, with the arc-shaped groove facing the center of the channel. The inner side of the limiting block is equipped with a silicone protective pad. The gripper assembly is also equipped with a camera. The AGV is equipped with a fixing frame for placing crystal rods, and the top of the AGV is also equipped with a positioning mark. The gripper assembly includes a gripper base, with a first hook-shaped gripper at the bottom of the gripper base and a first cylinder at the top. The output end of the first cylinder is equipped with a second hook-shaped gripper. The first hook-shaped gripper hooks the crystal rod from the bottom, and the second hook-shaped gripper fixes the crystal rod from the top.

[0007] Optionally, the three-axis moving mechanism includes a first guide rail, which is disposed on the top of the frame. A crossbar is slidably disposed on the first guide rail. A first driving member is provided on the frame to drive the crossbar to slide. A second guide rail is provided on the crossbar, which is perpendicular to the first guide rail. A connecting frame is slidably disposed on the second guide rail. A second driving member is provided on the crossbar to drive the connecting frame to slide. A boom is slidably disposed on the connecting frame. A third guide rail is provided on the boom, which is vertically disposed. The connecting frame is slidably disposed on the third guide rail. A third driving member is provided on the boom to drive the boom to slide. A gripper assembly is provided at the lowest end of the boom.

[0008] Optionally, the first drive component, the second drive component, and the third drive component can all be lead screw and nut assemblies.

[0009] A method for handling semiconductor ingots based on high-precision docking with AGVs includes the following steps: S1. The three-axis moving mechanism drives the gripper assembly to return to the origin, and the second cylinder retracts. S2. Semiconductor ingots are placed on the stack rack manually or by external equipment; S3, the AGV enters the channel through the horn-shaped opening of the guide platform, travels along the channel to the center of the guide platform, and completes the initial limit; S4. The four second cylinders move synchronously to push the limit blocks to fit the four corners of the AGV to achieve initial positioning. The second cylinders push the four corners of the AGV again to apply buffering force, complete the stable fixing of the AGV and avoid damage through the silicone protective pad. S5. The three-axis moving mechanism drives the gripper assembly to the stack rack crystal rod and grips the crystal rod. After gripping, the gripper assembly moves to the top of the guide table. S6. The camera on the gripper assembly collects the positioning marks on the AGV, and the three-axis moving mechanism fine-tunes the movement of the gripper assembly to achieve high-precision alignment between the crystal rod and the fixed frame on the AGV. S7. The gripper assembly descends to place the crystal rod onto the fixed frame on the AGV. After the gripper assembly moves laterally away from the fixed frame, it rises to a safe height. S8. After the crystal rod is placed, the four second cylinders retract, releasing the AGV from its fixed position. After receiving the unlock signal, the AGV drives away from the docking area, and the gripper assembly returns to its original position, waiting for the next operation instruction.

[0010] In summary, this application includes at least one of the following beneficial technical effects: The device automates the entire process of crystal rod positioning and detection, AGV docking and positioning, and pick-up and transfer without manual intervention, thus improving work efficiency. It meets the high-precision semiconductor crystal rod transfer requirements through a three-axis moving mechanism. It adopts an integrated positioning and fixing structure of a second cylinder and an arc-shaped limit block, which simplifies the positioning structure while improving stability and reducing the failure rate. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the three-axis moving mechanism and gripper assembly of the present invention; Figure 3 This is a schematic diagram of the AGV docking and positioning mechanism of the present invention.

[0012] Explanation of reference numerals in the attached drawings: 1. Frame; 2. Three-axis moving mechanism; 21. First guide rail; 22. Crossbar; 23. Second guide rail; 24. Connecting frame; 25. Boom; 26. Third guide rail; 27. Gripper base; 271. First hook-shaped gripper; 272. First cylinder; 273. Second hook-shaped gripper; 3. Gripper assembly; 5. AGV docking and positioning mechanism; 51. Guide table; 52. Side plate; 53. Channel; 54. Second cylinder; 55. Limit block; 6. Stacking rack; 7. Crystal rod; 8. AGV; 81. Fixing frame. Detailed Implementation

[0013] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0014] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0015] The following is in conjunction with the appendix Figure 1-3 The present invention will be described in further detail below.

[0016] This application discloses a semiconductor ingot handling device based on high-precision docking with AGV, referring to... Figure 1 and Figure 2The system includes a frame with a three-axis moving mechanism and a gripper assembly. The frame has a cavity containing an AGV docking and positioning mechanism and a stacking rack. Crystal rods are placed on the stacking rack. The three-axis moving mechanism includes a first guide rail located at the top of the frame. A crossbar slides on the first guide rail. A first driving component on the frame drives the crossbar to slide. A second guide rail, perpendicular to the first guide rail, slides on the second guide rail. A connecting frame, also on the crossbar, slides on the connecting frame. A boom slides on the connecting frame. A third guide rail, vertically positioned, is also on the boom. The connecting frame slides on the third guide rail. On the three guide rails, the boom is equipped with a third driving component to drive the boom to slide. The first, second and third driving components can all be lead screw and nut assemblies. The bottom of the boom is equipped with a gripper assembly, which includes a gripper base. The bottom of the gripper base is equipped with a first hook-shaped gripper, the top of the gripper base is equipped with a first cylinder, and the output end of the first cylinder is equipped with a second hook-shaped gripper. The first hook-shaped gripper hooks the crystal rod from the bottom, and the second hook-shaped gripper fixes the crystal rod from the top. A camera is also equipped on the gripper base. The AGV is equipped with a fixed frame for placing the crystal rod. The top of the AGV is also equipped with a positioning mark. When the camera on the gripper base detects the positioning mark, the gripper assembly is located directly above the fixed assembly.

[0017] Reference Figure 1 and Figure 3 The AGV docking and positioning mechanism includes a guide platform located at the bottom of the frame. Two side plates are mounted on the guide platform, forming a passage for the AGV. One side plate is fixed to the guide platform. A sliding guide rail and adjusting screw are located at the bottom of the guide platform. The other side plate is mounted on the sliding guide rail. The width of the passage is adjusted by the adjusting screw to maintain a gap of 0.1-0.2mm between the passage and the AGV. The width at both ends of the side plate is smaller than the width in the middle, and the transition is smooth, forming a flared guide structure. This ensures smooth entry of AGVs of different specifications while limiting lateral offset, achieving stable entry and initial positioning. Limiting components are located on both side plates. Each limiting component includes a bracket with a second cylinder at each end. A limiting block is located at the output end of each second cylinder. The limiting block is arc-shaped, with the arc-shaped groove facing the center of the passage. A silicone protective pad is located inside the limiting block. A total of four limiting blocks on the two side plates constrain the four corners of the AGV, achieving precise positioning and fixation of the AGV.

[0018] A method for handling semiconductor ingots based on high-precision docking with AGVs includes the following steps: S1. The three-axis moving mechanism drives the gripper assembly to return to the origin, and the second cylinder retracts. S2. Semiconductor ingots are placed on the stack rack manually or by external equipment; S3, the AGV enters the channel through the horn-shaped opening of the guide platform, travels along the channel to the center of the guide platform, and completes the initial limit; S4. The four second cylinders move synchronously to push the limit blocks to fit the four corners of the AGV to achieve initial positioning. The second cylinders push the four corners of the AGV again to apply buffering force, complete the stable fixing of the AGV and avoid damage through the silicone protective pad. S5. The three-axis moving mechanism drives the gripper assembly to the stack rack crystal rod and grips the crystal rod. After gripping, the gripper assembly moves to the top of the guide table. S6. The camera on the gripper assembly collects the positioning marks on the AGV, and the three-axis moving mechanism fine-tunes the movement of the gripper assembly to achieve high-precision alignment between the crystal rod and the fixed frame on the AGV. S7. The gripper assembly descends to place the crystal rod onto the fixed frame on the AGV. After the gripper assembly moves laterally away from the fixed frame, it rises to a safe height. S8. After the crystal rod is placed, the four second cylinders retract, releasing the AGV from its fixed position. After receiving the unlock signal, the AGV drives away from the docking area, and the gripper assembly returns to its original position, waiting for the next operation instruction.

[0019] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. Any equivalent modifications or variations made by those skilled in the art based on the content disclosed in the present invention should be included within the scope of protection set forth in the claims.

Claims

1. A semiconductor ingot picking and placing device based on high-precision docking with AGV, comprising a frame (1), a three-axis moving mechanism (2) provided on the frame (1), a gripper assembly (3) provided on the three-axis moving mechanism (2), a cavity inside the frame (1), an AGV docking positioning mechanism (5) and a stacking rack (6) provided inside the cavity, and ingots (7) placed on the stacking rack (6), characterized in that: The AGV docking and positioning mechanism (5) includes a guide platform (51), which is located at the bottom of the frame (1). The guide platform (51) has two side plates (52), which form a channel (53) for the AGV (8) to pass through. The width of the two ends of the side plates (52) is smaller than the width of the middle part and the transition is smooth to form a flared guide structure. Both side plates (52) are provided with limiting components. The limiting components include a bracket. Each end of the bracket is provided with a second cylinder (54). The output end of the second cylinder (54) is provided with a limiting block (55). The limiting block (55) is arc-shaped. The arc-shaped groove faces the center of the channel (53). The inner side of the limiting block (55) is provided with a silicone protective pad. One of the side plates (52) is fixed on the guide platform (51). The bottom of the guide platform (51) is provided with a sliding guide rail and a... Adjusting screw, another side plate (52) is set on sliding guide rail, the gap between the channel (53) and AGV (8) is 0.1-0.2mm, the gripper assembly (3) is also equipped with a camera, the AGV (8) is equipped with a fixing frame (81) for placing crystal rod (7), the AGV (8) is also equipped with a positioning mark on the top; the gripper assembly (3) includes a gripper base (27), the bottom of the gripper base (27) is equipped with a first hook-shaped gripper (271), the top of the gripper base (27) is equipped with a first cylinder (272), the output end of the first cylinder (272) is equipped with a second hook-shaped gripper (273), the first hook-shaped gripper (271) hooks the crystal rod (7) from the bottom, the second hook-shaped gripper (273) fixes the crystal rod (7) from the top, the camera is used to collect the positioning mark to realize the fine adjustment and alignment of the three-axis moving mechanism (2).

2. The semiconductor ingot handling device based on high-precision docking with AGV according to claim 1, characterized in that: The three-axis moving mechanism (2) includes a first guide rail (21), which is set on the top of the frame (1). A crossbar (22) is slidably arranged on the first guide rail (21). A first driving member is provided on the frame (1) to drive the crossbar (22) to slide. A second guide rail (23) is provided on the crossbar (22). The second guide rail (23) is perpendicular to the first guide rail (21). A connecting frame (24) is slidably arranged on the second guide rail (23). A second driving member is provided on the crossbar (22) to drive the connecting frame (24) to slide. A boom (25) is slidably arranged on the connecting frame (24). A third guide rail (26) is provided on the boom (25). The third guide rail (26) is set vertically. The connecting frame (24) is slidably arranged on the third guide rail (26). A third driving member is provided on the boom (25) to drive the boom (25) to slide. A gripper assembly (3) is provided at the bottom of the boom (25).

3. The semiconductor ingot handling device based on high-precision docking with AGV according to claim 2, characterized in that: The first driving component, the second driving component, and the third driving component can all be lead screw and nut assemblies.

4. A method for picking up and placing semiconductor crystal rods based on high-precision docking with AGV, characterized in that, Using the semiconductor ingot handling device based on high-precision docking with AGV as described in any one of claims 1-3, the method includes the following steps: S1. The three-axis moving mechanism drives the gripper assembly to return to the origin, and the second cylinder retracts. S2. Semiconductor ingots are placed on the stack rack manually or by external equipment; S3, the AGV enters the channel through the horn-shaped opening of the guide platform, travels along the channel to the center of the guide platform, and completes the initial limit; S4. The four second cylinders move synchronously to push the limit blocks to fit the four corners of the AGV to achieve initial positioning. The second cylinders push the four corners of the AGV again to apply buffering force, complete the stable fixing of the AGV and avoid damage through the silicone protective pad. S5. The three-axis moving mechanism drives the gripper assembly to the stack rack crystal rod and grips the crystal rod. After gripping, the gripper assembly moves to the top of the guide table. S6. The camera on the gripper assembly collects the positioning marks on the AGV. The three-axis moving mechanism fine-tunes the action of the gripper assembly according to the collection results to achieve high-precision alignment between the crystal rod and the fixed frame on the AGV. S7. The gripper assembly descends to place the crystal rod onto the fixed frame on the AGV. After the gripper assembly moves laterally away from the fixed frame, it rises to a safe height. S8. After the crystal rod is placed, the four second cylinders retract, releasing the AGV from its fixed position. After receiving the unlock signal, the AGV drives away from the docking area, and the gripper assembly returns to its original position, waiting for the next operation instruction.

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