High temperature resistant adhesive tape and preparation method thereof

By preparing a high-temperature resistant tape comprising a substrate layer, an adhesive layer, and a release film, the problem of unstable fixation of irregularly shaped or small components under high-temperature conditions was solved, achieving stable adhesion and effective fixation at high temperatures, thereby improving welding quality and production efficiency.

CN122483709APending Publication Date: 2026-07-31CHANGZHOU SHUANGLIAN TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHANGZHOU SHUANGLIAN TECH CO LTD
Filing Date
2026-05-20
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

Existing high-temperature resistant tapes cannot effectively fix irregularly shaped or small components in high-temperature environments, causing components to shift or fall off during reflow soldering, affecting soldering quality and production efficiency.

Method used

The high-temperature resistant tape structure includes a substrate layer, an adhesive layer, and a release film. The adhesive layer is composed of acrylic glue, hydrogenated petroleum resin, curing agent, antioxidant, and solvent. It is prepared through a specific mixing and bonding process to increase the material's high-temperature resistance and cohesion.

Benefits of technology

It maintains stable adhesion at a high temperature of 260℃, effectively fixing irregularly shaped or small components, preventing displacement, and ensuring welding quality and production efficiency.

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Abstract

This invention relates to the field of adhesive tape technology, and in particular to a high-temperature resistant adhesive tape. The tape includes a heat-resistant layer, which comprises a substrate layer. Adhesive layers are respectively attached to both sides of the substrate layer, and a release film is attached to the outer side of each adhesive layer. The adhesive layers comprise the following components by weight: 100 parts acrylic adhesive, 1-10 parts hydrogenated petroleum resin, 1-3 parts curing agent, 0.1-0.3 parts antioxidant, and 15-25 parts solvent. Compared with conventional high-temperature resistant acrylic adhesives, this invention increases the high-temperature resistance and cohesive strength of the material by adding high-Tg hydrogenated petroleum resin and antioxidant.
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Description

Technical Field

[0001] This invention relates to the field of adhesive tape technology, and in particular to a high-temperature resistant adhesive tape and its preparation method. Background Technology

[0002] High-temperature resistant tape is mainly used in the electronic manufacturing process to fix components and protect sensitive areas. Its core value lies in its ability to maintain stable adhesion and leave no residue in a high-temperature environment of around 260℃, ensuring welding quality and production efficiency.

[0003] In the SMT (Surface Mount Technology) assembly process, high-temperature resistant tape is used to temporarily secure small or irregularly shaped components, preventing them from shifting or falling off due to hot air impact during reflow soldering. This is especially important for FPC (Flexible Printed Circuit) SMT mounting, where the FPC must first be precisely fixed to the carrier board before being secured with tape. For some irregularly shaped or small components, traditional solder paste may not be able to provide complete fixation. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a high-temperature resistant tape and its preparation method, which can effectively fix irregular or small components.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a high-temperature resistant tape, the tape comprising a heat-resistant layer, the heat-resistant layer comprising a substrate layer, adhesive layers respectively connected to both sides of the substrate layer, and a release film connected to the outer side of the adhesive layer; the adhesive layer comprises the following components in parts by weight: 100 parts acrylic glue 1-10 parts of hydrogenated petroleum resin 1-3 parts of curing agent Antioxidant 0.1-0.3 parts Solvent 15-25 parts.

[0006] As a further embodiment of the present invention, the substrate layer is LCP nonwoven fabric with a thickness of 8-12 μm.

[0007] As a further embodiment of the present invention, the release film is a single-sided release film with a thickness of 45-55 μm and a release force of 8-12 g / inch.

[0008] As a further embodiment of the present invention, the curing agent is an isocyanate curing agent.

[0009] As a further embodiment of the present invention, the antioxidant is pentaerythritol ester.

[0010] As a further embodiment of the present invention, the solvent is toluene or ethyl acetate.

[0011] A method for preparing a high-temperature resistant adhesive tape, the specific steps of which are as follows: Step 1: Dilute the antioxidant with ethyl acetate and add it to the acrylic adhesive, then stir and mix thoroughly at 500 rpm. Step 2: Dilute the hydrogenated petroleum resin with toluene and add it to the mixture from Step 1, then stir thoroughly until homogeneous. Step 3: Add the curing agent to the mixture from Step 2 and stir thoroughly. Step 4: After stopping stirring, filter the mixture through a double layer using a 300-mesh filter, then use a vacuum machine to perform a vacuuming operation, and let it stand to obtain the adhesive. Step 5: After applying the adhesive to the release film, pass it through the oven at a speed of 2m / min and heat it to 80°C to bond it with the secondary nonwoven fabric. Then, use the forward winding to form side A. Place the wound side A on the secondary unwinding side and heat it to 80°C to bond it with the coated film. Then, cure it. Step 6: Lay the two rolls together to make high-temperature resistant tape.

[0012] As a further embodiment of the present invention, in step one, the antioxidant and ethyl acetate are diluted at a ratio of 1:3, and in step two, the hydrogenated petroleum resin is diluted with toluene to a solid content of 50%.

[0013] As a further embodiment of the present invention, in step five, the oven temperature is set to 60℃-80℃-100℃-105℃-105℃-90℃; the unwinding tension is 45N and the winding tension is 50N.

[0014] As a further embodiment of the present invention, the curing temperature in step five is 55°C and the time is 24 hours.

[0015] A high-temperature resistant tape is used for SMT assembly of FPC.

[0016] Because the present invention adopts the above technical solution, the advantages and positive effects of the present invention are: compared with the usual high temperature resistant acrylic adhesives, the present invention increases the high temperature resistance and cohesiveness of the material by adding high Tg hydrogenated petroleum resin and antioxidant. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a high-temperature resistant tape according to the present invention.

[0018] In the diagram: 1 is the substrate layer, 2 is the adhesive layer, and 3 is the release film. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Example

[0020] like Figure 1As shown, the present invention provides a high-temperature resistant tape, the tape comprising a heat-resistant layer, the heat-resistant layer comprising a substrate layer 1, adhesive layers 2 respectively connected to both sides of the substrate layer 1, and a release film 3 connected to the outer side of the adhesive layer 2. The adhesive layer comprises the following components in parts by weight: 100 parts acrylic glue 1 part hydrogenated petroleum resin 1 part curing agent 0.1 parts antioxidant 15 parts solvent; The LCP nonwoven fabric has a thickness of 8µm; the single-sided release film has a thickness of 45µm and a release force of 8g / inch; the curing agent is an isocyanate curing agent; the antioxidant is pentaerythritol ester; and the solvent is toluene or ethyl acetate.

[0021] The present invention discloses a method for preparing a high-temperature resistant adhesive tape, the specific steps of which are as follows: Step 1: Dilute tetrapentaerythritol ester with ethyl acetate at a ratio of 1:3 and add it to the acrylic adhesive. Stir at 500 rpm until well mixed. Step 2: Dilute the hydrogenated petroleum resin with toluene to a solid content of 50%, then add it to Step 1 and stir thoroughly. Step 3: Add the isocyanate curing agent to the mixture from Step 2 and stir thoroughly. Step 4: After stopping stirring, filter the mixture through a double layer using a 300-mesh filter, then use a vacuum machine to perform a vacuuming operation, and let it stand to obtain the adhesive. Step 5: After applying the adhesive to the release film, pass it through the oven at a speed of 2 m / min at an oven temperature of 60℃-80℃-100℃-105℃-105℃-90℃, and heat it to 80℃ with the second-layer nonwoven fabric. Then, use a winding tension of 50N to wind it in the forward direction to form side A. Place the wound side A on the second layer and unwind it in the reverse direction. Use a winding tension of 45N to heat it to 80℃ with the coated film, and then cure it at 55℃ for 24 hours. Step 6: Lay the two rolls together to make high-temperature resistant tape. Example

[0022] like Figure 1 As shown, the present invention provides a high-temperature resistant tape, the tape comprising a heat-resistant layer, the heat-resistant layer comprising a substrate layer 1, adhesive layers 2 respectively connected to both sides of the substrate layer 1, and a release film 3 connected to the outer side of the adhesive layer 2. The adhesive layer comprises the following components in parts by weight: 100 parts acrylic glue 5 parts hydrogenated petroleum resin 2 parts of curing agent Antioxidant 0.2 parts 20 parts solvent; The LCP nonwoven fabric has a thickness of 10µm; the single-sided release film has a thickness of 50µm and a release force of 10g / inch; the curing agent is an isocyanate curing agent; the antioxidant is pentaerythritol ester; and the solvent is toluene or ethyl acetate.

[0023] The present invention discloses a method for preparing a high-temperature resistant adhesive tape, the specific steps of which are as follows: Step 1: Dilute tetrapentaerythritol ester with ethyl acetate at a ratio of 1:3 and add it to the acrylic adhesive. Stir at 500 rpm until well mixed. Step 2: Dilute the hydrogenated petroleum resin with toluene to a solid content of 50%, then add it to Step 1 and stir thoroughly. Step 3: Add the isocyanate curing agent to the mixture from Step 2 and stir thoroughly. Step 4: After stopping stirring, filter the mixture through a double layer using a 300-mesh filter, then use a vacuum machine to perform a vacuuming operation, and let it stand to obtain the adhesive. Step 5: After applying the adhesive to the release film, pass it through the oven at a speed of 2 m / min at an oven temperature of 60℃-80℃-100℃-105℃-105℃-90℃, and heat it to 80℃ with the second-layer nonwoven fabric. Then, use a winding tension of 50N to wind it in the forward direction to form side A. Place the wound side A on the second layer and unwind it in the reverse direction. Use a winding tension of 45N to heat it to 80℃ with the coated film, and then cure it at 55℃ for 24 hours. Step 6: Lay the two rolls together to make high-temperature resistant tape. Example

[0024] like Figure 1 As shown, the present invention provides a high-temperature resistant tape, the tape comprising a heat-resistant layer, the heat-resistant layer comprising a substrate layer 1, adhesive layers 2 respectively connected to both sides of the substrate layer 1, and a release film 3 connected to the outer side of the adhesive layer 2. The adhesive layer comprises the following components in parts by weight: 100 parts acrylic glue 10 parts hydrogenated petroleum resin 3 parts of curing agent Antioxidant 0.3 parts Solvent 25 parts.

[0025] The LCP nonwoven fabric has a thickness of 12µm; the single-sided release film has a thickness of 55µm and a release force of 12g / inch; the curing agent is an isocyanate curing agent; the antioxidant is pentaerythritol ester; and the solvent is toluene or ethyl acetate.

[0026] The present invention discloses a method for preparing a high-temperature resistant adhesive tape, the specific steps of which are as follows: Step 1: Dilute tetrapentaerythritol ester with ethyl ester at a ratio of 1:3 and add it to the acrylic adhesive. Stir at 500 rpm until well mixed. Step 2: Dilute the hydrogenated petroleum resin with toluene to a solid content of 50%, then add it to Step 1 and stir thoroughly until homogeneous. Step 3: Add the isocyanate curing agent to the mixture from Step 2 and stir thoroughly. Step 4: After stopping stirring, filter the mixture through a double layer using a 300-mesh filter, then use a vacuum machine to perform a vacuuming operation, and let it stand to obtain the adhesive. Step 5: After applying the adhesive to the release film, pass it through the oven at a speed of 2 m / min at an oven temperature of 60℃-80℃-100℃-105℃-105℃-90℃, and heat it to 80℃ with the second-layer nonwoven fabric. Then, use a winding tension of 50N to wind it in the forward direction to form side A. Place the wound side A on the second layer and unwind it in the reverse direction. Use a winding tension of 45N to heat it to 80℃ with the coated film, and then cure it at 55℃ for 24 hours. Step 6: Lay the two rolls together to make high-temperature resistant tape.

[0027] Comparative Example 1 The difference from Example 1 is that no hydrogenated petroleum resin and antioxidant were added.

[0028] Comparative Example 2 The difference from Example 2 is that no hydrogenated petroleum resin and antioxidant were added.

[0029] Comparative Example 3 The difference from Example 3 is that no hydrogenated petroleum resin and antioxidant were added.

[0030] test Adhesive tape with a thickness of 0.03±0.005mm was applied to SUS, aluminum plate and PET respectively, and the peel strength, holding power and ring initial adhesion were tested. A high temperature baking test at 265℃ was also conducted. The test results are shown in Table 1.

[0031] Table 1 shows the performance tests of Examples 1-3 and Comparative Examples 1-3. Peel force (against SUS) 4 6 10 3 5 7 Peel force (on aluminum plate) 3 5 7 2 3 5 Peel strength (for PET) 4 5 7 2 3 4 Adhesion >10000min >10000min >10000min >10000min >10000min >10000min Ring-shaped initial adhesion 4 6 7 2 5 6 High-temperature baking Not curled Not curled Not curled Curling Curling Curling , As shown in Table 1, compared with conventional high-temperature resistant acrylic adhesives, the present invention increases the high-temperature resistance and cohesive strength of the material by adding high-Tg hydrogenated petroleum resin and antioxidants. While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and various changes or modifications can be made to these embodiments without departing from the principles and essence of the present invention. The scope of protection of the present invention is defined only by the appended claims.

Claims

1. A high temperature resistant adhesive tape, characterized by: The tape includes a heat-resistant layer, which includes a substrate layer (1). Adhesive layers (2) are connected to both sides of the substrate layer (1), and a release film (3) is connected to the outer side of the adhesive layer (2). The adhesive layer (2) comprises the following components by weight: 100 parts acrylic glue 1-10 parts of hydrogenated petroleum resin 1-3 parts of curing agent Antioxidant 0.1-0.3 parts Solvent 15-25 parts.

2. The high temperature resistant adhesive tape according to claim 1, characterized in that: The substrate layer (1) is LCP nonwoven fabric with a thickness of 8-12 μm.

3. The high temperature resistant adhesive tape according to claim 1, characterized in that: The release film (3) is a single-sided release film with a thickness of 45-55 μm and a release force of 8-12 g / inch.

4. The high temperature resistant adhesive tape according to claim 1, characterized in that: A transparent, viscous liquid, wherein the curing agent is an isocyanate curing agent.

5. The high-temperature resistant tape according to claim 1, characterized in that: White crystalline particles, the antioxidant being pentaerythritol ester.

6. The high-temperature resistant tape according to claim 1, characterized in that: A transparent liquid, wherein the solvent is toluene or ethyl acetate.

7. A method for preparing a high-temperature resistant adhesive tape according to any one of claims 1-6, characterized in that: Detailed steps as follows: Step 1: Dilute the antioxidant with ethyl acetate and add it to the acrylic adhesive, then stir and mix thoroughly at 500 rpm. Step 2: Dilute the hydrogenated petroleum resin with toluene and add it to the mixture from Step 1, then stir thoroughly until homogeneous. Step 3: Add the curing agent to the mixture from Step 2 and stir thoroughly. Step 4: After stopping stirring, filter the mixture through a double layer using a 300-mesh filter, then use a vacuum machine to perform a vacuuming operation, and let it stand to obtain the adhesive. Step 5: After applying the adhesive to the release film, pass it through the oven at a speed of 2m / min and heat it to 80°C to bond it with the secondary nonwoven fabric. Then, use the forward winding to form side A. Place the wound side A on the secondary unwinding side and heat it to 80°C to bond it with the coated film. Then, cure it. Step 6: Lay the two rolls together to make high-temperature resistant tape.

8. The method for preparing a high-temperature resistant adhesive tape according to claim 7, characterized in that: In step one, the antioxidant and ethyl acetate are diluted at a ratio of 1:3, and in step two, the hydrogenated petroleum resin is diluted with toluene and has a solid content of 50%.

9. The method for preparing a high-temperature resistant adhesive tape according to claim 7, characterized in that: In step five, the oven temperature is set to 60℃-80℃-100℃-105℃-105℃-90℃; the unwinding tension is 45N and the winding tension is 50N.

10. The method for preparing a high-temperature resistant adhesive tape according to claim 7, characterized in that: In step five, the curing temperature is 55℃ and the time is 24 hours.