A magnetron sputtering system with high uniformity

Abstract

This invention discloses a high-uniformity magnetron sputtering system applied in the field of magnetron sputtering technology. Through the dual-flow assembly, it achieves simultaneous water intake and drainage on both sides. Each side serves as both the water intake and drainage side, allowing their temperatures to influence each other, effectively reducing the local temperature difference in the corresponding runway area and improving coating uniformity. Simultaneously, the drainage end is elevated, preventing the cooling water on the drainage side, which has absorbed higher heat, from participating in heat exchange in the runway area. Compared to existing technologies, this further reduces the temperature difference between the runway area and the water intake runway area caused by the higher temperature of the drainage side cooling water and poor heat exchange with the runway area, further improving coating uniformity. Furthermore, the variable-chamber unit allows the space of the effective heat exchange cavity inside the heat exchange fins to be adaptively adjusted according to actual needs, thereby improving the utilization rate of cooling water and reducing the cost of cooling the runway area during coating.

Description

Technical Field

[0001] This invention relates to the field of magnetron sputtering technology, and in particular to a magnetron sputtering system with high uniformity. Background Technology

[0002] In magnetron sputtering deposition of semiconductor surfaces, the water cooling system is a critical element for maintaining process stability. During magnetron sputtering, the plasma is confined by a magnetic field to a ring-shaped region (racetrack region) on the target surface. This region experiences intense ion bombardment and has a significantly higher temperature than other areas. Traditional water cooling systems typically have serpentine cooling channels, leading to uneven distribution of cooling water flow rates. Areas with strong magnetic fields experience direct heat exchange in some areas, while others, not directly connected to the flow channels, experience slower heat exchange. This results in target surface temperature fluctuations exceeding 50°C and localized temperature differences, causing cracking, warping, and other abnormalities in the target, affecting the uniformity and stability of the deposition process. Examples include a magnetron sputtering region cooling device disclosed in Chinese Patent Specification CN214218841U and a magnetron sputtering deposition equipment disclosed in Chinese Patent Specification CN214496461U.

[0003] To overcome the above problem, some water-cooling systems directly set the flow channels horizontally, so that the entire runway area can be covered by the flow channels, making heat exchange uniform. By continuously exchanging the inlet and outlet, the local temperature difference is reduced, further improving the heat exchange uniformity of the runway area. For example, Chinese patent CN120555973B discloses a semiconductor thin film physical vapor deposition device. However, although this design of exchanging inlets and outlets can reduce the local temperature difference, for a certain fixed area (such as the inlet), the lowest temperature reached when it is the inlet and the highest temperature reached when it is the outlet remain unchanged. Only the duration of the low temperature or the duration of the high temperature are reduced, resulting in a certain temperature difference in this area, which affects the coating uniformity. Summary of the Invention

[0004] The core of this invention lies in the dual-flow component configuration, where one side serves as both the inlet and outlet, allowing their temperatures to influence each other and effectively reducing local temperature differences within the corresponding runway area. Simultaneously, it elevates the outlet end, preventing the cooling water on the outlet side from directly contacting the runway area, ensuring consistently efficient heat exchange and effectively preventing issues such as poor heat dissipation and higher temperatures in areas close to the outlet.

[0005] To solve the above problems, the present invention adopts the following technical solution.

[0006] A highly uniform magnetron sputtering system includes a control cabinet with a controller, a feed end, a sputtering end, and a discharge end arranged sequentially at the top of the control cabinet. The feed end is provided with multiple target material assemblies, which are fixedly inserted through the sputtering end and extend into the interior of the sputtering end. Each target material assembly is provided with a cooling component at its top. The cooling component includes two intersecting dual-flow components and an outer protective cover covering the dual-flow components. The outer protective cover is fixedly connected to the upper end of the target material assembly by bolts. The dual-flow assembly includes a heat exchange plate, a heat dissipation plate, an extension plate fixedly connected to the end of the heat exchange plate near the heat dissipation plate, and multiple liquid guide pipes fixedly connected between the upper end of the extension plate and the heat dissipation plate. The multiple liquid guide pipes on the two dual-flow assemblies are distributed in an alternating manner. The ends of the heat exchange plate and the heat dissipation plate on the same dual-flow assembly that are far apart from each other are respectively connected to a liquid inlet assembly and a liquid outlet pipe. The liquid inlet assembly and the liquid outlet pipe are both fixedly penetrated through the outer protective cover and extended to the outside of the outer protective cover.

[0007] Furthermore, the two extension plates are in contact with each other, and the height of the extension plates is not less than half the height of the heat dissipation plate.

[0008] Furthermore, the liquid inlet assembly includes a main liquid inlet pipe located outside the outer protective cover and multiple liquid inlet branch pipes fixedly connected between the main liquid inlet pipe and the heat exchange fins, and each of the multiple liquid inlet branch pipes is equipped with a solenoid valve.

[0009] Furthermore, the heat exchange plates on both dual-flow components are in contact with the upper surface of the target component, and the heat dissipation plate of one dual-flow component is located on the heat exchange plate of the other dual-flow component.

[0010] Furthermore, a variable compartment unit is also provided inside the outer cover. The variable compartment unit includes an electromagnetic plate fixedly connected to the top of the outer cover, a partition plate disposed inside the heat exchange plate, and a control frame connected between the inner wall of the heat exchange plate and the outer end of the partition plate. When a positive current is applied, the electromagnetic plate generates a magnetic repulsion force on the partition plate.

[0011] Furthermore, the partition plate divides the inner cavity of the heat exchange plate into two spaces: an effective heat exchange cavity and an empty cavity, and the liquid inlet assembly and the extension plate are both connected to the effective heat exchange cavity.

[0012] Furthermore, the control frame includes a positioning layer fixedly connected to the top wall of the heat exchange plate, a limiting layer that is interference-fitted with the side wall of the heat exchange plate, and a follower layer connected between the positioning layer and the limiting layer. The follower layer is made of a highly elastic material, and the positioning layer is made of a sealing material.

[0013] Furthermore, a miniature laser rangefinder is installed on the top of the heat exchange plate. The detection end of the miniature laser rangefinder faces the partition plate, and the maximum thickness of the miniature laser rangefinder is less than the thickness of the positioning layer.

[0014] Compared with the prior art, the advantages of this invention are: (1) This scheme achieves the effect of simultaneous water intake and drainage on both sides by setting up dual-flow components. For one side, it is both the water intake side and the drainage side, so that the temperature of the two sides can affect each other and effectively reduce the local temperature difference in the corresponding runway area.

[0015] (2) At the same time, due to the cross arrangement of the two dual-flow components, the position of the drain end is raised, so that the cooling water on the drain side that has absorbed a higher heat does not participate in the heat exchange of the runway area, so that the runway area always presents an efficient heat exchange with the cooling water on the inlet side. Compared with the existing technology, this further reduces the temperature difference between the runway area and the runway area on the inlet side due to the higher temperature of the cooling water on the drain side and the poor heat exchange effect with the runway area, and further improves the coating uniformity.

[0016] (3) By setting up the variable chamber unit, the space of the effective heat exchange cavity inside the heat exchange plate can be adaptively adjusted according to the actual heat exchange situation, thereby effectively improving the utilization rate of cooling water and reducing the cost of cooling energy for runway area heat dissipation during coating. Attached Figure Description

[0017] Figure 1 This is a perspective view of the present invention; Figure 2 This is a perspective view of the target assembly of the present invention; Figure 3 This is an exploded view of the cooling component of the present invention; Figure 4 This is a perspective view of the two dual-flow components of the present invention; Figure 5 This is a schematic diagram of the cooling water flow in the two dual-flow components of the present invention; Figure 6 This is a schematic diagram of the dynamic water inlet at the heat exchange plate of the present invention; Figure 7 This is a front view of the two dual-flow components after the addition of the variable compartment unit in this invention; Figure 8 A front view of the heat exchanger plate of the present invention with the addition of variable compartment plates; Figure 9 This is a schematic diagram showing the changes in the effective heat exchange cavity inside the heat exchanger plate of the present invention before and after.

[0018] Explanation of the labels in the diagram: 1 Control cabinet, 2 Feed end, 3 Sputtering end, 4 Discharge end, 5 Target assembly, 6 Cooling assembly, 61 Outer cover, 621 Heat exchange plate, 622 Heat dissipation plate, 623 Extension plate, 624 Liquid guide pipe, 601 Effective heat exchange chamber, 602 Empty chamber, 7 Liquid inlet assembly, 71 Main liquid inlet pipe, 72 Branch liquid inlet pipe, 73 Drain pipe, 81 Electromagnetic plate, 82 Divider plate, 83 Control frame, 831 Follow-up layer, 832 Positioning layer, 833 Limiting layer. Detailed Implementation

[0019] The technical solutions will now be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention.

[0020] First implementation method: like Figure 1 A highly uniform magnetron sputtering system includes a control cabinet 1 with a controller, a feed end 2, a sputtering end 3 and a discharge end 4 arranged sequentially on the upper end of the control cabinet 1. The feed end 2 is provided with multiple target material components 5, which are fixedly inserted through the sputtering end 3 and extend into the interior of the sputtering end 3.

[0021] It is worth noting that the conveyor belt for transporting semiconductors or wafers is jointly arranged inside the feed end 2, sputtering end 3, and discharge end 4, as well as the specific arrangement of the target assembly 5 and the strong magnetic plate (with the cooling assembly 6 located directly above it) on top of the target, are all existing technologies and therefore not described in detail. In use, the semiconductor or wafer to be coated is first placed in the feed end 2, then transported by the conveyor belt to the sputtering end 3 for magnetron sputtering coating, and finally transported to the discharge end 4 for discharge, thus completing the entire magnetron sputtering process.

[0022] like Figures 2-3Each target assembly 5 is topped with a cooling assembly 6. The cooling assembly 6 includes two intersecting dual-flow assemblies and an outer protective cover 61 covering the dual-flow assemblies. The outer protective cover 61 is fixedly connected to the upper end of the target assembly 5 by bolts. Each dual-flow assembly includes a heat exchange plate 621, a heat dissipation plate 622, an extension plate 623 fixedly connected to the end of the heat exchange plate 621 near the heat dissipation plate 622, and multiple liquid guide pipes 624 fixedly connected between the upper end of the extension plate 623 and the heat dissipation plate 622. The heat exchange plates 621 on both dual-flow assemblies are in contact with the upper surface of the target assembly 5, and the heat dissipation plate 622 of one dual-flow assembly is located on the heat exchange plate 621 of the other dual-flow assembly. The multiple liquid guide pipes 624 on the two dual-flow assemblies are staggered. The ends of the heat exchange plate 621 and the heat dissipation plate 622 on the same dual-flow assembly, which are furthest from each other, are respectively connected to an inlet assembly 7 and a drain pipe 73. Both the 7 and the drain pipe 73 are fixedly inserted through the outer protective cover 61 and extend to the outside of the outer protective cover 61. During the coating process, cooling water can be simultaneously introduced into the two heat exchange plates 621 through the two liquid inlet components 7. Since the heat exchange plate 621 is located above the strong magnetic plate, the cooling water can directly exchange heat with the strong magnetic plate. The cooling water that has absorbed heat passes through the extension plate 623 and the liquid guide pipe 624 in sequence and enters the heat dissipation plate 622 away from the strong magnetic plate. The cooling water in it does not directly contact the strong magnetic plate and is discharged in the raised heat dissipation plate 622. Compared with the prior art, where the cooling water after absorbing heat still undertakes the heat exchange work with the strong magnetic plate, resulting in poor heat exchange effect at the drain end and high temperature in the corresponding runway area, the drain end of this solution is raised and does not undertake the heat exchange work, thereby effectively overcoming the problem of high runway area temperature on the drain side in the prior art, effectively reducing the overall temperature difference and improving the coating uniformity.

[0023] The two extension plates 623 are in contact with each other, and the height of the extension plates 623 is not less than half the height of the heat dissipation plate 622. The two dual-flow components can completely cover the top of the strong magnetic plate and can fully exchange heat with it, so that the runway area is less likely to have local high temperature and difficulty in heat dissipation.

[0024] like Figure 6 The liquid inlet assembly 7 includes a main liquid inlet pipe 71 located outside the outer protective cover 61 and multiple liquid inlet branch pipes 72 fixedly connected between the main liquid inlet pipe 71 and the heat exchange plate 621. Each of the multiple liquid inlet branch pipes 72 is equipped with a solenoid valve. When cooling water is introduced, multiple solenoid valves can be opened in turn to make the liquid inlet point of the heat exchange plate 621 dynamically change, thereby effectively disturbing the cooling water in the heat exchange plate 621, effectively assisting the circulation of cooling water, and reducing the occurrence of local stagnant water. In addition, when the heat dissipation demand is high, two or more solenoid valves can be opened at the same time to increase the liquid inlet volume per unit time, allowing more cooling water to participate in heat exchange and ensuring the heat exchange effect.

[0025] It is worth noting that, in order to ensure precise temperature control of the runway area, distributed temperature sensors can be installed to monitor the temperature of the runway area in real time, so as to adjust the flow rate of cooling water in the dual-flow components in a timely manner to improve the heat exchange effect.

[0026] In summary, as Figure 5 This solution achieves simultaneous water intake and drainage on both sides through the dual-flow component setup. For one side, it is both the water intake and drainage side, allowing their temperatures to influence each other and effectively reducing the local temperature difference in the corresponding runway area. At the same time, due to the cross-setting of the two dual-flow components, the position of the drainage end is raised, thus preventing the cooling water on the drainage side, which has absorbed more heat, from participating in the heat exchange of the runway area. This ensures that the runway area always maintains efficient heat exchange with the cooling water on the water intake side. Compared with existing technologies, this further reduces the temperature difference between the runway area and the runway area on the water intake side caused by the higher temperature of the cooling water on the drainage side and the poor heat exchange effect with the runway area, thereby further improving the coating uniformity.

[0027] Second implementation method: This embodiment adds a variable compartment component to the first embodiment, while the rest remains the same as the first embodiment.

[0028] like Figures 7-8 The outer cover 61 is also equipped with a variable compartment unit. The variable compartment unit includes an electromagnetic plate 81 fixedly connected to the top of the outer cover 61, a partition plate 82 disposed inside the heat exchange plate 621, and a control frame 83 connected between the inner wall of the heat exchange plate 621 and the outer end of the partition plate 82. When a positive current is applied, the electromagnetic plate 81 generates a magnetic repulsion force on the partition plate 82.

[0029] The partition plate 82 divides the inner cavity of the heat exchange plate 621 into two spaces: an effective heat exchange cavity 601 and an empty cavity 602. The liquid inlet assembly 7 and the extension plate 623 are both connected to the effective heat exchange cavity 601. A miniature laser rangefinder is also installed on the top of the heat exchange plate 621. The detection end of the miniature laser rangefinder faces the partition plate 82. Through the miniature laser rangefinder, the span of the empty cavity 602 can be monitored, thereby realizing the monitoring of the span of the effective heat exchange cavity 601. It is convenient to adjust the magnetic attraction force of the electromagnetic plate 81 as needed. Moreover, the maximum thickness of the miniature laser rangefinder is less than the thickness of the positioning layer 832, so that the miniature laser rangefinder is not easily affected when the partition plate 82 moves up and down.

[0030] The control frame 83 includes a positioning layer 832 fixedly connected to the top wall of the heat exchange plate 621, a limiting layer 833 that is interference-fitted with the side wall of the heat exchange plate 621, and a follower layer 831 connected between the positioning layer 832 and the limiting layer 833. The follower layer 831 is made of a highly elastic material, and the positioning layer 832 is made of a sealing material, so that the empty cavity 602 and the effective heat exchange cavity 601 above and below the partition plate 82 can be sealed independently, and the cooling water of the effective heat exchange cavity 601 is not easy to enter the empty cavity 602.

[0031] During the coating process, by controlling the magnitude of the positive current flowing through the electromagnetic plate 81, the magnitude of its repulsive force on the partition plate 82 can be changed. This, in turn, controls the rise of the partition plate 82 relative to the electromagnetic plate 81 when it is not energized, thereby increasing or decreasing the space of the effective heat exchange cavity 601 and thus changing the amount of cooling water that can be accommodated in the heat exchange plate 621.

[0032] like Figure 9 When the heat dissipation demand is high, the forward current is reduced. At this time, the magnetic repulsion force on the partition plate 82 decreases, and the partition plate 82 can rise under the water pressure of the cooling water, thereby increasing the space of the effective heat exchange cavity 601 and allowing more cooling water to participate in heat exchange per unit time. When the partition plate 82 rises to a suitable position, the current can be increased so that the magnetic repulsion force on the partition plate 82 is equivalent to the pressure of the cooling water, thus maintaining balance. Conversely, when the heat dissipation demand is low, the space span of the effective heat exchange cavity 601 can be reduced by increasing the current, allowing less cooling water to participate in heat exchange per unit time. This achieves the goal of improving the utilization rate of cooling water while ensuring the heat dissipation effect. Compared with the constant effective heat exchange space in the first embodiment, the cost of cold energy input during coating is significantly reduced.

[0033] In addition, due to the setting of the empty cavity 602, there is an air layer between the heat dissipation plate 622 and the heat exchange plate 621, which makes the heat exchange between the two relatively poor. This effectively prevents the cooling water that has absorbed heat on the drain side from affecting the cooling water in the heat exchange plate 621, effectively avoiding the loss of cold energy and improving the utilization rate of cooling water.

[0034] It is worth noting that, in order to reduce the mutual influence between the strong magnetic plate and the electromagnetic plate 81, a layer of high magnetic permeability material can be laid at the bottom of the cooling component 6; or, the driving form of the partition plate 82 can be modified to be driven by an electric push rod. Specifically, the electric push rod is installed between the upper end of the partition plate 82 and the inner fixed wall of the heat exchange plate 621. In specific implementation, a suitable implementation method can be selected according to actual needs.

[0035] In summary, by setting up the variable chamber unit, the space of the effective heat exchange cavity inside the heat exchange fins can be adaptively adjusted according to the actual heat exchange situation, thereby effectively improving the utilization rate of cooling water and reducing the cost of cooling energy for runway area heat dissipation during coating.

[0036] The above description is merely a preferred embodiment of the present invention; it encompasses all the protection scope of the present invention. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in the present invention, based on the technical solutions and improved concepts of the present invention, should be covered within the protection scope of the present invention.

Claims

1. A high-uniformity magnetron sputtering system, comprising a control cabinet (1) with a controller, a feeding end (2), a sputtering end (3) and a discharging end (4) arranged in sequence on the upper end of the control cabinet (1), characterized in that: The feed end (2) is provided with a plurality of target material components (5), the plurality of target material components (5) are fixedly penetrated through the sputtering end (3) and extend into the interior of the sputtering end (3), and a cooling component (6) is provided on the top of each target material component (5). The cooling component (6) includes two intersecting dual-flow components and an outer protective cover (61) covering the dual-flow components. The outer protective cover (61) is fixedly connected to the upper end of the target material component (5) by bolts. The dual-flow assembly includes a heat exchange plate (621), a heat dissipation plate (622), an extension plate (623) fixedly connected to the end of the heat exchange plate (621) near the heat dissipation plate (622), and a plurality of liquid guide pipes (624) fixedly connected between the upper end of the extension plate (623) and the heat dissipation plate (622). The plurality of liquid guide pipes (624) on the two dual-flow assemblies are staggered. The ends of the heat exchange plate (621) and the heat dissipation plate (622) on the same dual-flow assembly are respectively connected to a liquid inlet assembly (7) and a liquid outlet pipe (73). The liquid inlet assembly (7) and the liquid outlet pipe (73) are both fixedly penetrated through the outer protective cover (61) and extended to the outside of the outer protective cover (61). The two extension plates (623) are in contact with each other, and the height of the extension plate (623) is not less than half the height of the heat dissipation plate (622).

2. A high-uniformity magnetron sputtering system as defined in claim 1, wherein: The liquid inlet assembly (7) includes a main liquid inlet pipe (71) located outside the outer protective cover (61) and a plurality of liquid inlet branch pipes (72) fixedly connected between the main liquid inlet pipe (71) and the heat exchange plate (621), and each of the plurality of liquid inlet branch pipes (72) is equipped with a solenoid valve.

3. A high-uniformity magnetron sputtering system as defined in claim 1, wherein: The heat exchange plates (621) on both dual-flow components are in contact with the upper surface of the target assembly (5), and the heat dissipation plate (622) of one dual-flow component is located on the heat exchange plate (621) of the other dual-flow component.

4. A high-uniformity magnetron sputtering system as defined in claim 1, wherein: The outer cover (61) is also provided with a variable compartment unit. The variable compartment unit includes an electromagnetic plate (81) fixedly connected to the top of the outer cover (61), a partition plate (82) disposed inside the heat exchange plate (621), and a control frame (83) connected between the inner wall of the heat exchange plate (621) and the outer end of the partition plate (82). When a positive current is applied, the electromagnetic plate (81) generates a magnetic repulsion force on the partition plate (82).

5. The high-uniformity magnetron sputtering system according to claim 4, characterized in that: The partition plate (82) divides the inner cavity of the heat exchange plate (621) into two spaces: an effective heat exchange cavity (601) and an empty cavity (602), and the liquid inlet assembly (7) and the extension plate (623) are both connected to the effective heat exchange cavity (601).

6. The high-uniformity magnetron sputtering system according to claim 5, characterized in that: The control frame (83) includes a positioning layer (832) fixedly connected to the top wall of the heat exchange plate (621), a limiting layer (833) that is interference-fitted with the side wall of the heat exchange plate (621), and a follower layer (831) connected between the positioning layer (832) and the limiting layer (833). The follower layer (831) is made of a highly elastic material, and the positioning layer (832) is made of a sealing material.

7. The high-uniformity magnetron sputtering system according to claim 6, characterized in that: A miniature laser rangefinder is also installed on the top of the heat exchange plate (621). The detection end of the miniature laser rangefinder faces the compartment plate (82), and the maximum thickness of the miniature laser rangefinder is less than the thickness of the positioning layer (832).

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