Micro-channel heat exchanger with triangular micro-ribs and heat dissipation system

Abstract

This invention discloses a microchannel heat exchanger and heat dissipation system with triangular microribs, belonging to the field of microchannel heat dissipation technology. The heat exchanger includes a cover plate, a triangular microrib microchannel layer, and a base layer. The cover plate has a cooling medium inlet and a cooling medium outlet. The triangular microrib microchannel layer includes several parallel microchannels. Multiple triangular microribs are periodically arranged on the opposite side walls of the microchannels along the cooling medium flow direction, and the triangular microribs on the opposite side walls are staggered. The base layer is preferably made of silicon material, and the microchannels and triangular microrib structures are fabricated on the base layer. This invention, by setting a geometrically optimized, staggered triangular microrib structure on the microchannel walls, can enhance fluid turbulence and near-wall mixing, improve the uniformity of the heating surface temperature distribution by more than 50%, and simultaneously enhance heat transfer while controlling flow resistance, achieving a comprehensive performance index of 1.6, making it suitable for heat dissipation of high heat flux density electronic devices.

Description

Technical Field

[0001] This invention belongs to the field of microchannel heat dissipation technology, specifically relating to a microchannel heat sink and heat dissipation system with triangular microribs. Background Technology

[0002] With the rapid development of technologies such as 5G, artificial intelligence, big data, and high-performance computing, chip systems are continuously evolving towards higher integration, higher power density, and miniaturization. The heat flux density generated during chip operation is constantly increasing, with some areas showing a trend towards hundreds of watts per square centimeter or even higher. At the same time, increased device temperature significantly increases the failure rate of electronic devices. Traditional heat dissipation methods such as air cooling, heat pipes, and conventional liquid cooling are limited by heat exchange capacity, structural compactness, and energy consumption, making it difficult to meet the high-efficiency and stable heat dissipation requirements of high heat flux density chips. Therefore, developing novel enhanced heat dissipation technologies suitable for high heat flux density electronic devices has become an important research direction in this field.

[0003] Microchannel heat exchangers, with their advantages of large specific surface area, short heat transfer path, strong heat transfer capacity, and ease of integration, have shown promising application prospects in the field of high heat flux density chip heat dissipation. Existing research indicates that introducing microstructures such as microribs into the microchannel walls can effectively improve the heat transfer performance of microchannel heat exchangers by enhancing fluid turbulence, disrupting the thermal boundary layer, and promoting fluid mixing, while also improving wall temperature distribution and addressing localized hotspots. However, the geometry, size parameters, and arrangement of the microribs significantly affect the balance between flow resistance and heat transfer enhancement. Inappropriate design may also lead to excessive pressure drop or a decline in overall performance. Therefore, it is necessary to systematically optimize the specific shape and distribution of the microribs.

[0004] Patent application CN119997434A discloses a novel open-type microchannel radiator structure and method. By improving the cover plate structure, it increases the inlet liquid collection area, outlet liquid collection area, and converging manifold of the cover plate to ensure uniform flow of the cooling medium and efficient heat exchange. Its microchannels are traditional uniformly distributed parallel straight channels. Patent application CN121829203A discloses a microchannel heat exchanger and its working method with a flow stabilization structure. A progressive flow stabilization structure is symmetrically arranged on the inner walls of both sides of the microchannel, including a base and multiple protrusions. The protrusions have a sloping profile and a top arc-shaped profile, which gradually rise along the flow direction to suppress refrigerant backflow, reduce flow eddies, elongate bubbles, and provide space for liquid to rewet the wall surface. Summary of the Invention

[0005] To address the challenges of existing microchannel heat sinks in balancing heat transfer capacity and flow resistance during high heat flux density chip cooling, including difficulty in suppressing localized hot spots and insufficient wall temperature uniformity, this invention provides a triangular microribbed microchannel heat exchanger. This heat exchanger enhances fluid turbulence and near-wall mixing by incorporating triangular microribs of a specific shape and arrangement on the microchannel wall, disrupting the thermal boundary layer. This results in improved heat transfer while simultaneously enhancing the temperature distribution on the heating surface and controlling flow resistance.

[0006] To achieve the above objectives, in a first aspect, the present invention provides a triangular microrib microchannel heat exchanger, comprising a cover plate, a triangular microrib microchannel layer, and a base layer stacked sequentially; the triangular microrib microchannel layer is integrally formed on the base layer, and the base layer and the cover plate are sealed together to form a closed flow channel; the cover plate is provided with a cooling medium inlet and a cooling medium outlet; the triangular microrib microchannel layer includes a plurality of parallel microchannels, and the opposite side walls of the microchannels are periodically provided with a plurality of triangular microribs along the cooling medium flow direction, and the triangular microribs on the opposite side walls of the microchannels are staggered.

[0007] Furthermore, the microchannel is a straight microchannel or an S-shaped channel, and the sidewalls and triangular microribs of the microchannel are provided with enhanced heat exchange structures.

[0008] Furthermore, the cross-section of the triangular microrib is an isosceles triangle.

[0009] Furthermore, the geometric parameters of the triangular microrib include the hydraulic diameter. D h Base-to-height ratio A and the offset rate of the side ribs R dis , wherein the hydraulic diameter D h The base-to-height ratio is used to characterize the feature scale of the triangular microrib. A The offset rate of the opposite ribs is used to characterize the geometric shape features of the triangular microribs. R dis Used to characterize the relative misalignment of the microribs on both sides of the microchannel; the hydraulic diameter of the triangular microrib. D h It is 55μm, and the bottom-to-height ratio is... A The offset rate is 3.5 for the side ribs. R dis The value is 1.

[0010] Furthermore, the microchannel has a length of 20,000 μm, a flow channel height of 750 μm, and a flow channel width of 350 μm; the microchannels are separated by fins with a width of 200 μm and a base layer height of 200 μm; the spacing between the microribs on the same side is 1,000 μm.

[0011] Furthermore, buffer regions are provided at both ends of the triangular microrib microchannel layer, and the buffer regions are cavities.

[0012] Furthermore, the substrate layer is made of silicon.

[0013] Furthermore, the cover plate and the substrate are connected by a silicon wafer bonding sealing process.

[0014] Furthermore, the cooling medium is deionized water.

[0015] Secondly, the present invention provides a heat dissipation system for electronic devices, which employs the aforementioned triangular micro-ribbed microchannel heat exchanger, with the substrate layer in heat transfer contact with the heat-generating device in the heat dissipation system.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects: The present invention introduces a triangular microrib structure on the opposite side walls of the microchannel, which can significantly enhance fluid disturbance and boundary layer renewal capabilities, improve the heat dissipation performance of the microchannel heat exchanger, and effectively reduce the maximum temperature of the heating surface; the triangular microrib microchannel layer is integrally formed in the base layer, eliminating the contact thermal resistance between the microrib and the base plate, ensuring the integrity of the structure and the continuity of thermal conduction; the triangular microribs arranged alternately on both sides can periodically disrupt the development of the thermal boundary layer and induce strong mixing of the fluid in the mainstream region and the near-wall region, significantly improving the convective heat transfer coefficient at the cost of lower flow resistance; the closed flow channel combined with the inlet and outlet design on the cover plate realizes the directional and controllable flow of the cooling medium, which is convenient for system integration; therefore, the present invention adopts an alternating triangular microrib structure, which, compared with a simple opposing arrangement, can improve the flow organization in the flow channel, reduce the local flow blockage effect, improve the uniformity of the temperature distribution on the heating surface, and reduce the risk of local hot spots.

[0017] Furthermore, the S-shaped channel generates secondary flow by changing the flow direction, which further enhances the turbulence and mixing of the fluid, making it suitable for scenarios with higher requirements for heat transfer uniformity. Adding reinforcement structures to the micro-ribs and sidewall surfaces can increase the effective heat transfer area and induce local micro-vortices, making the heat transfer capacity in laminar flow approach that of turbulent flow. At the same time, this composite reinforcement method can improve the overall thermal performance without significantly increasing pump power.

[0018] Furthermore, the isosceles triangular cross section has a streamlined frontal surface and a relatively steep backal surface. The frontal surface can gently split the flow and reduce shape drag, while the backal surface forms a stable backflow zone after the fluid passes the apex. This helps to prolong the residence time of the fluid near the heated wall and promote vortex shedding, thus achieving a balance between drag reduction and enhanced heat transfer.

[0019] Furthermore, the 55μm hydraulic diameter ensures extremely low thermal resistance and high specific surface area at the microscale; the bottom-to-height ratio of 3.5 optimizes the slenderness of the ribs, enabling them to have sufficient height to extend into the mainstream core area to disturb the fluid, while maintaining reasonable structural stiffness and fabrication feasibility; the offset rate of the ribs on both sides is set to 1, which means that the microribs on both sides are arranged in a completely staggered array. At this time, the flow channel forms a periodic contraction-expansion wave-shaped path, which makes the synergy between the fluid velocity field and the temperature field optimal, the heat transfer enhancement effect is most significant, and the pressure drop increase is relatively gradual.

[0020] Furthermore, the 20,000 μm long channel design allows the fluid to fully develop and accumulate heat transfer during flow, suitable for the heat dissipation requirements of high heat flux density chips; the 750 μm height and 350 μm width constitute a large aspect ratio, increasing the heat transfer surface area per unit projected area; the 200 μm fin width ensures low thermal resistance of the heat conduction path and provides sufficient mechanical support strength to prevent channel collapse; the 200 μm base layer height serves as a heat diffusion layer, effectively reducing local hot spot temperatures; and the 1000 μm same-side micro-rib spacing avoids a sharp increase in pressure drop caused by excessive rib density, maintaining a reasonable level of flow resistance.

[0021] Furthermore, the buffer cavity, serving as a distribution and confluence cavity for the inlet and outlet, can evenly distribute the cooling medium into each microchannel, reducing local eddy current losses caused by jet impact or contraction and expansion, ensuring uniform flow distribution in all parallel channels, thereby suppressing overheating failure of some channels due to flow deviation.

[0022] Furthermore, silicon has an extremely high thermal conductivity, which can rapidly spread heat from the heat source laterally and conduct it longitudinally to the root of the microrib; at the same time, silicon microfabrication technology is mature and can achieve high-precision processing of micron-level triangular microribs and channel structures.

[0023] Furthermore, silicon wafer bonding enables atomic-level sealed connections, withstands high pressure, and is free from organic adhesive contamination, ensuring the sealing reliability of microchannels under long-term high-temperature and high-pressure operation; deionized water, as a cooling medium, has a large specific heat capacity, good insulation, and is chemically compatible with silicon materials, and its high thermal conductivity can fully utilize the potential of single-phase forced convection heat transfer at the microscale. Attached Figure Description

[0024] To more intuitively and clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments are briefly described below. Obviously, the following drawings are only some embodiments of the invention; those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0025] Figure 1This is a schematic diagram of the structure of a triangular microrib microchannel heat exchanger provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of a partial top view of the microchannel structure provided in an embodiment of the present invention; Figure 3 This is a comparison graph of the bottom wall temperature uniformity of the embodiments of the present invention and the smooth straight channel under different Reynolds numbers. The curve shows the temperature distribution difference between the parallel straight channel and the channel with triangular microribs under the same working conditions. It can be seen that the temperature non-uniformity of the channel with triangular microribs is significantly reduced. Figure 4 The curves showing the variation of the comprehensive performance coefficient of the heat sink of the present invention under different Reynolds numbers indicate that the PEC of the heat sink with triangular micro-ribbed channels increases with the Reynolds number, which shows that the triangular micro-ribbed channels can improve heat transfer efficiency and obtain better comprehensive performance under reasonable pressure drop. Throughout the accompanying drawings and the entire specification, the same reference numerals refer to the same elements. The drawings may not be drawn to scale, and for clarity and convenience, the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated.

[0026] Legend: 1. Cover plate; 2. Triangular microrib microchannel layer; 3. Base layer; 101. Cooling medium inlet; 102. Cooling medium outlet; 201. Isosceles triangular microrib; 202. Relative arrangement of microribs on both sides of the wall. Detailed Implementation

[0027] To make the technical solutions and advantages of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings: To address the issue of how the geometry, dimensions, and arrangement of microfins affect the balance between flow resistance and heat transfer enhancement in traditional microchannel heat exchanger design, and how inappropriate design can lead to increased flow resistance or reduced heat transfer performance, thus impacting the system's thermal management efficiency, the imbalance between flow resistance and heat transfer enhancement directly restricts the applicability of microchannel heat exchangers under high heat flux density conditions. Figure 1 and Figure 2As shown, this embodiment provides a triangular microribbed microchannel heat exchanger, including a cover plate 1, a triangular microribbed microchannel layer 2, and a base layer 3. Specifically, a cooling medium inlet 101 and a cooling medium outlet 102 are provided on the cover plate 1, located at the two furthest points on the cover plate 1, for cooling the working medium flowing into and out of the triangular microribbed microchannel layer 2. The triangular microribbed microchannel layer 2 includes several parallel microchannels, and isosceles triangular microribs 201 are periodically arranged on the opposite side walls of each microchannel along the flow direction. The cross-section of the isosceles triangular microribs 201 is an isosceles triangle. When the cooling medium flows through the microchannel, it not only conducts heat exchange with the channel wall, but the disturbance effect of the triangular microribs 201 and the fluid mixing caused by the staggered arrangement also improve the convective heat transfer coefficient. Heat is transferred from the electronic device to the base layer 3, and then transferred to the cooling medium through the integrally formed microchannel layer 2. After absorbing heat, the temperature of the cooling medium rises and is eventually discharged from the heat exchanger through the cooling medium outlet 102, completing the heat dissipation cycle and achieving effective cooling of high heat flux density electronic devices. This solves the problems of insufficient heat dissipation efficiency and local hot spots in traditional heat dissipation solutions. The triangular micro-rib microchannel layer 2 is integrally formed on the substrate layer 3, ensuring that the heat conduction path from the heat source to the cooling medium is the shortest and the thermal resistance is the smallest.

[0028] As an optional embodiment, the microchannel can be designed as a straight-channel microchannel or an S-shaped channel. Straight-channel microchannels have a simple structure and can effectively reduce the pressure drop of the fluid passing through the heat exchanger, making them suitable for applications with strict requirements on pump power consumption. S-shaped channels, through their periodic bending geometry, induce secondary flows and eddies during fluid flow, enhancing fluid mixing, disrupting the boundary layer, and thus improving the convective heat transfer coefficient. Furthermore, enhanced heat transfer structures are provided on the sidewalls and triangular microribs 201. These enhanced heat transfer structures can further increase the heat transfer surface area or disturb the fluid boundary layer at a microscale, promoting heat exchange between the fluid and the wall. Triangular microrib microchannel heat exchangers can significantly improve heat transfer efficiency. The choice of microchannel shape (straight-channel or S-shaped channel) provides flexibility to adapt to different application scenarios; S-shaped channels, in particular, can enhance fluid mixing by inducing secondary flows. Providing enhanced heat transfer structures on the sidewalls and triangular microribs 201 of the microchannel can increase the heat transfer surface area at a microscale and effectively disturb the fluid boundary layer, improving the local heat transfer coefficient. The combination of multiple heat exchange enhancement mechanisms enables the heat exchanger to exhibit superior performance when handling high heat flux densities, effectively solving the problem of insufficient heat exchange efficiency of a single triangular micro-rib structure under certain operating conditions.

[0029] Preferably, buffer regions with cavities are provided at both ends of the triangular microrib microchannel layer 2. By providing cavities at both ends of the triangular microrib microchannel layer 2, the cooling medium first enters the buffer region at the inlet end before entering the triangular microrib microchannel layer 2. Since this buffer region is a cavity, the cooling medium can fully diffuse and redistribute within this space, thereby effectively mitigating the impact when the fluid suddenly enters the narrow microchannel and helping to achieve uniform distribution of the cooling medium among the parallel microchannels. When the cooling medium flows out of the triangular microrib microchannel layer 2, it enters the buffer region at the outlet end. This outlet buffer region is also a cavity, allowing the cooling medium to smoothly collect and flow to the cooling medium outlet 102, avoiding local pressure fluctuations or backflow phenomena that may be caused by the fluid suddenly leaving the microchannel. The design of providing cavities at both ends, in conjunction with the microchannels and triangular microribs 201 in the triangular microrib microchannel layer 2, ensures stable and uniform flow of the cooling medium throughout the heat exchanger.

[0030] Based on the above embodiments, the triangular microrib is an isosceles triangular microrib, and its geometric parameters include at least the hydraulic diameter. D h Base-to-height ratio A and the offset rate of the side ribs R dis Wherein, the hydraulic diameter D h The base-to-height ratio is used to characterize the feature scale of the triangular microrib. A The offset rate of the opposite ribs is used to characterize the geometric shape features of the triangular microribs. R dis This is used to characterize the relative misalignment of microribs on both sides of a microchannel; a larger bottom-to-height ratio may make the microribs flatter, reducing resistance to the fluid; a smaller bottom-to-height ratio may make the microribs sharper, enhancing the turbulence effect. Appropriate misalignment can effectively break the boundary layer, promote fluid mixing, improve heat transfer performance, and avoid excessive flow resistance. Through... D h , A and R dis Collaborative design enables comprehensive control over pressure drop, heat transfer performance, and temperature uniformity within microchannels. Specifically, in this embodiment of the invention, the specific geometric dimensions of the isosceles triangular microrib 201 are: hydraulic diameter... D h =55μm, bottom-to-height ratio A =3.5. The isosceles triangular microribs 201 are arranged in a relative arrangement 202 on both sides of the wall. Preferably, in this embodiment, the offset rate of the opposite ribs, representing the degree of misalignment, is... R dis =1 indicates that the micro-ribs on both sides are arranged in a completely staggered manner.

[0031] Hydraulic diameter D h The microchannel is 55 μm in diameter, ensuring a sufficiently small feature size to provide a large heat transfer area within a limited space and promote the formation of a thinner boundary layer within the microchannel, which is beneficial for heat transfer from the wall to the fluid. (Bottom-to-height ratio) A A value of 3.5 gives the isosceles triangular microribs a specific shape, effectively disturbing the fluid, breaking the boundary layer, enhancing fluid mixing, and increasing the convective heat transfer coefficient, while avoiding excessive local pressure drop due to overly sharp microribs. (Regarding the side rib offset rate...) R dis With a value of 1, the completely staggered arrangement can maximize the guidance of fluid to generate periodic eddies and secondary flows within the microchannels, further enhancing the contact between the fluid and the micro-rib surface. The synergistic optimization of the three parameters enables the heat exchanger to achieve efficient heat transfer while ensuring low flow resistance, effectively resolving the contradiction between heat exchange efficiency and pressure drop in traditional microchannel heat exchangers.

[0032] The microchannels are straight-channel microchannels. The microchannel length, channel height, channel width, fin width, and substrate thickness are set according to the chip's heat dissipation requirements. The channel height directly affects the fluid flow cross-sectional area and boundary layer development. An appropriate channel height helps maintain laminar flow, reduces flow resistance, and ensures that the cooling medium can fully contact the microchannel walls for heat exchange. The channel width and channel height together determine the cross-sectional shape and size of the microchannel, thus affecting the fluid velocity distribution and heat transfer coefficient. Precise control of the channel width helps optimize the uniformity of fluid distribution within the microchannel, avoiding dead zones or localized high-speed zones. Fins are the solid structures located between adjacent microchannels. The main function of the fins is to provide structural support and act as heat conduction paths, transferring heat from the substrate layer to the cooling medium within the microchannel. The presence of fins increases the overall rigidity of the heat exchanger and contributes to uniform heat dissipation. Fin width refers to the horizontal dimension of the fin. Fin width affects its heat conduction capacity and its obstruction of the flow channel. Wider fins can provide better heat conduction but reduce the flow channel area. The 200μm width is designed to optimize the balance between heat transfer efficiency and fluid flow area. The substrate height refers to the vertical dimension of the solid layer at the bottom of the heat exchanger. The substrate is the primary path for heat transfer from the heat source to the microchannel heat exchanger. The substrate height affects the length of the heat transfer path and the thermal resistance. An appropriate substrate height helps ensure efficient heat transfer from the heat source to the microchannel layer. The microfin spacing on the same side refers to the distance between adjacent triangular microfins on the same microchannel wall. This spacing directly affects the intensity and periodicity of fluid disturbance as it flows through the microfins. A reasonable microfin spacing can effectively induce secondary flow or eddies in the fluid, thereby disrupting the boundary layer, enhancing convective heat transfer, and avoiding excessive flow resistance.

[0033] Preferably, in this embodiment, the microchannel length is 20000 μm, the channel height is 750 μm, the channel width is 350 μm, the fin width is 200 μm, and the base layer height is 200 μm; the spacing between the microribs on the same side is 1000 μm; the spaces between the microchannels are fins, with a fin width of 200 μm and a base layer height of 200 μm. (Reference) Figure 3 and Figure 4 This invention enhances fluid turbulence and near-wall mixing by setting staggered, geometrically optimized triangular microrib structures on the walls of microchannels, improving the uniformity of temperature distribution on the heating surface by more than 50%, and simultaneously enhancing heat transfer while controlling flow resistance, achieving a comprehensive performance index of 1.6, making it suitable for heat dissipation of high heat flux density electronic devices.

[0034] This application precisely defines the key geometric dimensions of a triangular micro-ribbed microchannel heat exchanger. The combination of a microchannel length of 20,000 μm, a channel height of 750 μm, and a channel width of 350 μm determines the flow path of the cooling medium and the effective heat transfer area within the heat exchanger. Precise control ensures sufficient residence time for the cooling medium to absorb heat within the microchannels, while maintaining suitable flow velocity and pressure drop. The strictly defined dimensions and the coordinated interaction between the structures enable the heat exchanger to achieve efficient heat transfer and maintain stable hydrodynamic performance, thereby overcoming the performance fluctuation problems that may occur in traditional microchannel heat exchangers under dimensional uncertainties.

[0035] Furthermore, in this embodiment, the substrate layer is made of silicon material, and the microchannels and triangular microrib structures can be directly formed on the silicon substrate through an etching process. Since the microchannels and substrate can be formed in an integrated manner, the adverse effects of interfacial contact thermal resistance on heat transfer performance in traditional split-assembly structures can be effectively reduced. After processing, the cover plate is connected to the substrate with the microchannel structure using a silicon wafer bonding sealing process, thereby forming a closed microchannel liquid cooling structure. By using a silicon wafer bonding sealing process to connect the cover plate 1 to the substrate layer 3, the sealing performance of the internal flow channels of the microchannel heat exchanger is ensured, forming a reliable fluid channel. Silicon wafer bonding sealing provides excellent sealing performance at the microscale, preventing leakage of the cooling medium and resisting internal fluid pressure.

[0036] In the triangular microribbed microchannel heat exchanger described in this application, the cooling medium is deionized water. The high purity of deionized water minimizes the risk of corrosion, scaling, or blockage of the microchannel's internal structure. The microchannels are extremely small, and any deposits of impurities can severely affect fluid flow and heat exchange efficiency. The use of deionized water ensures the long-term unobstructed flow of the microchannels and the cleanliness of the heat exchange surfaces, allowing the triangular microribbed microchannel layer 2 to continuously maintain its high-efficiency heat exchange performance.

[0037] This application may also provide an electronic device heat dissipation system, which uses the above-mentioned triangular micro-rib microchannel heat exchanger. The substrate layer is in heat transfer contact with the heat-generating device in the electronic device heat dissipation system. The connection can be made by device bonding or by coating the connection surface of the two with a thermally conductive material.

[0038] The specific embodiments described above further illustrate the technical problems solved by the present invention, the technical solutions, and the beneficial effects. It should be understood that the above descriptions are merely embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can be modified and varied in various ways. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A triangular micro-ribbed microchannel heat exchanger, characterized in that, It includes a cover plate (1), a triangular microrib microchannel layer (2) and a base layer (3) stacked in sequence; the triangular microrib microchannel layer (2) is integrally formed on the base layer (3), and the base layer (3) is sealed to the cover plate (1) to form a closed flow channel; the cover plate (1) is provided with a cooling medium inlet (101) and a cooling medium outlet (102); the triangular microrib microchannel layer (2) includes a number of parallel microchannels, and the opposite side walls of the microchannels are periodically provided with a number of triangular microribs (201) along the cooling medium flow direction, and the triangular microribs on the opposite side walls of the microchannels are staggered.

2. The triangular microribbed microchannel heat exchanger according to claim 1, characterized in that, The microchannel is a straight channel or an S-shaped channel, and the sidewalls and triangular microribs (201) of the microchannel are provided with enhanced heat exchange structures.

3. The triangular microribbed microchannel heat exchanger according to claim 1, characterized in that, The cross-section of the triangular microrib is an isosceles triangle.

4. The triangular microribbed microchannel heat exchanger according to claim 3, characterized in that, The geometric parameters of the triangular microrib include the hydraulic diameter. D h Base-to-height ratio A and the offset rate of the side ribs R dis , wherein the hydraulic diameter D h The base-to-height ratio is used to characterize the feature scale of the triangular microrib. A The offset rate of the opposite ribs is used to characterize the geometric shape features of the triangular microribs. R dis Used to characterize the relative misalignment of the microribs on both sides of the microchannel; the hydraulic diameter of the triangular microrib. D h It is 55μm, and the bottom-to-height ratio is... A The offset rate is 3.5 for the side ribs. R dis The value is 1.

5. The triangular micro-ribbed microchannel heat exchanger according to claim 1, characterized in that, The microchannel has a length of 20,000 μm, a height of 750 μm, and a width of 350 μm; the microchannels are separated by fins with a width of 200 μm and a base layer height of 200 μm; the spacing between the microribs on the same side is 1,000 μm.

6. The triangular microribbed microchannel heat exchanger according to claim 1, characterized in that, Both ends of the triangular microrib microchannel layer (2) are provided with buffer regions, which are cavities.

7. The triangular micro-ribbed microchannel heat exchanger according to claim 1, characterized in that, The substrate (3) is made of silicon material.

8. The triangular micro-ribbed microchannel heat exchanger according to claim 1, characterized in that, The cover plate (1) and the substrate layer (3) are connected by a silicon wafer bonding sealing process.

9. The triangular micro-ribbed microchannel heat exchanger according to claim 1, characterized in that, The cooling medium is deionized water.

10. A heat dissipation system for electronic devices, characterized in that, The triangular micro-ribbed microchannel heat exchanger described in any one of claims 1 to 9 is used, wherein the base layer (3) is in heat transfer contact with the heat-generating device in the heat dissipation system of the electronic device.

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