A manifold type double micro-channel heat exchange plate, heat exchange device and heat exchange method
By combining a manifold-type dual-microchannel heat exchange plate with a phase change microcapsule suspension, the problems of large pressure drop, poor temperature uniformity, and low volume utilization in existing technologies are solved, achieving efficient and uniform heat dissipation, which is suitable for high-power heat-generating components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
- Filing Date
- 2026-03-19
- Publication Date
- 2026-07-31
AI Technical Summary
Existing heat dissipation technologies for lithium-ion batteries, industrial equipment, and electronic devices suffer from problems such as large voltage drop, poor temperature uniformity, and low volume utilization, making it difficult to meet the heat dissipation requirements for high-rate discharge and high integration.
The design employs a manifold-type dual-microchannel heat exchange plate, which combines the microgroove array of the cover plate and the bottom plate with the manifold structure to form a through-type microchannel array. Combined with phase change microcapsule suspension, it achieves uniform distribution of the working fluid and efficient heat dissipation.
It improves heat dissipation efficiency, reduces pressure drop, enhances temperature uniformity and volume utilization, and meets the thermal management requirements of high-power heat-generating components.
Smart Images
Figure CN122486401A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat exchange technology, and in particular to a manifold-type dual microchannel heat exchange plate, heat exchange device, and heat exchange method. Background Technology
[0002] In modern industrial production, new energy applications, electronic technology, and transportation, the large amount of heat generated by heating elements during operation, if not dissipated in time, can cause their operating temperature to exceed the optimal range, leading to performance degradation, shortened lifespan, and even safety hazards. For example, lithium-ion batteries, with their advantages of high specific energy and long cycle life, have become the core power source for new energy vehicles and energy storage technologies. However, they generate Joule heat and polarization heat during charging and discharging, especially at high discharge rates of 2C and above, where the heat generation increases dramatically. If this heat cannot be dissipated in time, the battery temperature can exceed the optimal operating range of 25-40°C, not only reducing battery capacity and cycle life but also potentially causing thermal runaway. In industrial production, the large amount of heat generated by kilns, motors, and other equipment during high-load operation can affect the stability of equipment operation. Furthermore, as the integration of components such as chips in electronic devices continues to increase, the pressure on heat dissipation is also growing.
[0003] Currently, liquid cooling with heat exchange plates is widely used due to its superior heat dissipation efficiency compared to air cooling and other methods. However, traditional liquid cooling technology, which achieves heat dissipation through straight channels or serpentine channels, still has three major drawbacks that urgently need to be addressed: First, it is difficult to balance pressure drop and heat dissipation capacity. Although conventional channel heat exchange plates have low resistance along the flow path, their limited heat exchange area results in insufficient heat exchange power. Second, traditional microchannel heat exchange plates increase the heat dissipation area to 3-5 times that of conventional channels by refining the flow channels, significantly enhancing heat exchange capacity. However, their resistance along the flow path increases dramatically, with inlet and outlet pressure drops reaching up to those of the manifold. First, the flow rate is 5 to 10 times that of conventional structures, directly increasing system pump consumption and energy costs. Second, the temperature uniformity is poor, and the fluid is prone to uneven distribution in the conventional channel. Local flow rate differences cause hot spots to form on the surface of the heating element, with a maximum temperature difference of more than 5°C, which seriously affects the consistency and service life of the equipment. Third, the volume utilization rate is low. In the traditional solution, the channel and the flow collection structure are designed separately, which not only increases the assembly complexity and contact thermal resistance, but also occupies additional internal space of the equipment, resulting in limited overall volume utilization and making it difficult to adapt to the equipment requirements of high integration and compact layout.
[0004] While existing manifold microchannel technology has improved pressure drop and temperature uniformity, it often employs a single-sided microchannel design, resulting in insufficient heat exchange area. Furthermore, the complex connection structure between the manifold and microchannel leads to uneven fluid distribution and localized resistance losses, failing to fully realize the heat dissipation potential of the microchannels. In addition, some liquid cooling plates utilize multi-layer channels or composite structures, but these are structurally complex, difficult to manufacture, and fail to effectively balance the relationship between heat dissipation efficiency, pressure drop, and volume utilization. Therefore, developing a microchannel heat exchanger with low pressure drop, high temperature uniformity, and high volume utilization has become crucial for solving the heat dissipation challenges of heat-generating components in various fields. Summary of the Invention
[0005] The purpose of this invention is to provide a manifold-type dual-microchannel heat exchange plate, heat exchange device, and heat exchange method, which solves the problems of large pressure drop, poor temperature uniformity, low volume utilization, and insufficient adaptability to high-rate discharge in existing lithium-ion battery heat dissipation technologies. Through the synergistic design of manifold structure and microchannel, the heat dissipation efficiency, pressure drop characteristics, and volume utilization are comprehensively improved, meeting the thermal management requirements of high-power heat-generating components.
[0006] To achieve the above objectives, the present invention provides the following technical solution: A manifold-type dual microchannel heat exchange plate includes a cover plate, a sealing gasket, a manifold structure, and a base plate arranged sequentially from top to bottom. The sealing gasket is tightly fitted between the cover plate and the base plate and surrounds the manifold structure. One end of the cover plate and the base plate encloses an inlet collection area along a first direction, and the other end of the cover plate and the base plate encloses an outlet collection area along the first direction. Both the inlet collection area and the outlet collection area are sealed spaces.
[0007] The lower end face of the cover plate has multiple cover plate microgrooves extending along a first direction and spaced apart along a second direction. The cover plate has a cover plate working fluid inlet at the inlet collection area and a cover plate working fluid outlet at the outlet collection area. The upper end face of the bottom plate has multiple bottom plate microgrooves extending along a first direction and spaced apart along a second direction. The bottom plate microgrooves correspond one-to-one with the cover plate microgrooves and are vertically connected to form a bi-symmetrical through-channel array. The bottom plate has a bottom plate working fluid inlet at the inlet collection area and a bottom plate working fluid outlet at the outlet collection area. The manifold structure includes multiple inflow channels and multiple outflow channels. The multiple inflow channels and multiple outflow channels are alternately arranged along the first direction and all extend along the second direction. The cover plate working fluid inlet and the bottom plate working fluid inlet are both connected to the inflow channels. The cover plate working fluid outlet and the bottom plate working fluid outlet are both connected to the outflow channels.
[0008] Furthermore, the first direction and the second direction are arranged to intersect.
[0009] Furthermore, the first direction and the second direction are set perpendicular to each other.
[0010] Furthermore, all of the multiple inflow channels have a wide-inflow-narrow-outflow gradient structure, with the internal width of the multiple inflow channels gradually decreasing along the second direction. All of the multiple outflow channels have a narrow-inflow-wide-outflow gradient structure, with the internal width of the multiple outflow channels gradually increasing along the second direction.
[0011] Furthermore, the working fluid inlet of the cover plate and the working fluid inlet of the bottom plate are coaxially corresponding, and the working fluid outlet of the cover plate and the working fluid outlet of the bottom plate are coaxially corresponding.
[0012] A heat exchange device includes a plurality of manifold-type dual microchannel heat exchange plates as described in any one of claims 1-5. The plurality of manifold-type dual microchannel heat exchange plates are arranged side by side in a vertical direction, and heat exchange components are placed between adjacent manifold-type dual microchannel heat exchange plates.
[0013] Furthermore, the working fluid inlet of the cover plate of the adjacent manifold dual microchannel heat exchanger is connected to the working fluid inlet of the bottom plate, and the working fluid outlet of the cover plate of the adjacent manifold dual microchannel heat exchanger is connected to the working fluid outlet of the bottom plate.
[0014] A heat exchange method for a heat exchange device includes the following steps: Step S1. Fix the heat exchange components between adjacent manifold dual microchannel heat exchange plates.
[0015] Step S2. Inject the heat exchange medium into the manifold dual microchannel heat exchange plate through the bottom plate working medium inlet.
[0016] Step S3. The heat exchange medium enters the inlet collection area through the bottom plate working medium inlet. After the flow velocity is uniformized in the inlet collection area, it flows through each inlet channel of the manifold structure and is evenly distributed to the cover plate micro-groove and the bottom plate micro-groove to exchange heat with the surface of the heat exchange components.
[0017] Step S4. The heat exchange working fluid after heat exchange flows into the outlet collection area through each outflow channel, and flows out from the working fluid outlet of the cover plate after converging in the outlet collection area.
[0018] Further, in step S2, the heat exchange medium is a phase change microcapsule suspension, which is a mixed solution of phase change microcapsules and water. The core material of the phase change microcapsules is n-octadecane or 1-bromohexadecane, and the shell material of the phase change microcapsules is melamine resin.
[0019] Advantages of this invention: 1. In this invention, array-type microgrooves are formed on the lower end face of the cover plate and the upper end face of the bottom plate. The microgrooves on the bottom plate correspond one-to-one with the microgrooves on the cover plate and are connected vertically to form a double-sided symmetrical through-type microchannel array. It can simultaneously and tightly fit with the heat exchange components on both sides to achieve bidirectional synchronous heat dissipation. The heat exchange area is more than doubled compared with the traditional single-sided microchannel.
[0020] 2. In this invention, the manifold structure does not require an independent outer shell. It forms a seamless flow path with the inlet collection area, the outlet collection area, the working fluid inlet, and the working fluid outlet. With the guiding effect of the inlet and outlet channels arranged alternately along the first direction, the working fluid is accurately and evenly distributed in the microchannels on both sides, so that the heat transfer coefficient of each heat exchange unit tends to be consistent, thus improving the pain point of poor temperature uniformity in traditional liquid cooling technology.
[0021] 3. The heat exchange medium in this invention is a phase change microcapsule suspension, which can enhance liquid cooling and further improve heat dissipation efficiency. Attached Figure Description
[0022] Figure 1 This is an exploded view of the manifold-type dual-microchannel heat exchange plate in this invention.
[0023] Figure 2 This is a schematic diagram of the cover plate in this invention.
[0024] Figure 3 This is a schematic diagram of the sealing gasket structure in this invention.
[0025] Figure 4 This is a schematic diagram of the manifold structure in this invention.
[0026] Figure 5 This is a schematic diagram of the structure of the base plate in this invention.
[0027] Figure 6 This is a schematic diagram of the manifold structure and the base plate in this invention.
[0028] Figure 7 This is a schematic diagram of the structure of multiple manifold-type dual microchannel heat exchange plates arranged in parallel along the vertical direction for cooling heat exchange components in this invention.
[0029] Figure 8 This is a schematic diagram of the flow path of the heat exchange medium in the heat exchange device of the present invention.
[0030] In the diagram: 1. Cover plate, 101. Cover plate microgroove, 102. Cover plate working fluid inlet, 103. Cover plate working fluid outlet, 2. Sealing gasket, 3. Manifold structure, 31. Inflow channel, 32. Outflow channel, 4. Base plate, 401. Base plate microgroove, 402. Base plate working fluid inlet, 403. Base plate working fluid outlet, 5. Inlet collector area, 6. Outlet collector area, 7. Heat exchange components. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.
[0032] like Figure 1 and Figure 3 As shown, a manifold-type dual-microchannel heat exchange plate includes a cover plate 1, a sealing gasket 2, a manifold structure 3, and a base plate 4 arranged sequentially from top to bottom. The sealing gasket 2 is made of a temperature-resistant and corrosion-resistant elastic material, such as nitrile rubber or EPDM rubber. The sealing gasket 2 is tightly fitted between the cover plate 1 and the base plate 4 and surrounds the manifold structure 3 to achieve a leak-proof seal for the heat exchange medium. Figure 5 As shown, one end of the cover plate 1 and the bottom plate 4 encloses the inlet collection area 5 along the first direction, and the other end of the cover plate 1 and the bottom plate 4 encloses the outlet collection area 6 along the first direction. Both the inlet collection area 5 and the outlet collection area 6 are closed spaces. Both the inlet collection area 5 and the outlet collection area 6 are used to realize the convergence and diversion of the heat exchange working fluid, and avoid pressure fluctuations caused by the impact of the working fluid.
[0033] like Figure 2 As shown, the lower end face of the cover plate 1 has a plurality of cover plate microgrooves 101 extending along a first direction and spaced apart along a second direction. The cover plate 1 has a cover plate working medium inlet 102 corresponding to the inlet collection area 5, and a cover plate working medium outlet 103 corresponding to the outlet collection area 6. Figure 5 As shown, the upper surface of the base plate 4 has multiple base plate microgrooves 401 extending along a first direction and spaced apart along a second direction. The base plate microgrooves 401 correspond one-to-one with the cover plate microgrooves 101 and are vertically connected, forming a bi-laterally symmetrical through-channel array. The base plate 4 has a base plate working fluid inlet 402 at the inlet collection area 5 and a base plate working fluid outlet 403 at the outlet collection area 6. Figure 4 and Figure 6As shown, the manifold structure 3 includes multiple inflow channels 31 and multiple outflow channels 32. The multiple inflow channels 31 and multiple outflow channels 32 are alternately arranged along a first direction and all extend along a second direction, forming a compact layout of alternating inflow and outflow. This significantly shortens the flow distance of the heat exchange medium within the microchannel, thereby effectively reducing the local resistance loss of the heat exchange medium flow. Furthermore, the design of the outflow channels 32 gradually widening along the second direction further weakens the frictional resistance along the flow path, balancing the contradiction between high heat dissipation capacity and low pressure drop, and improving the core problems of high pump consumption and high energy cost in traditional technologies. The cover plate working medium inlet 102 and the bottom plate working medium inlet 402 are both connected to the inflow channels 31, and the cover plate working medium outlet 103 and the bottom plate working medium outlet 403 are both connected to the outflow channels 32.
[0034] In a preferred embodiment of the present invention, the first direction and the second direction are arranged to intersect.
[0035] In a preferred embodiment of the present invention, the first direction and the second direction are arranged perpendicular to each other to ensure a compact microgroove layout and a reasonable heat exchange path. Figure 1 As shown, the first direction is the Y direction, and the second direction is the X direction.
[0036] In a preferred embodiment of the present invention, the plurality of inflow channels 31 are all of a gradually decreasing structure with a wide inlet and a narrow outlet, and the internal width of the plurality of inflow channels 31 gradually decreases along the second direction. Similarly, the plurality of outflow channels 32 are all of a gradually decreasing structure with a narrow inlet and a wide outlet, and the internal width of the plurality of outflow channels 32 gradually increases along the second direction. Under constant flow conditions, this design can increase the velocity gradient of the heat exchange medium, significantly enhancing the convective heat transfer intensity. This gradually decreasing design, optimized through fluid dynamics principles, can increase the velocity gradient of the heat exchange medium under constant flow conditions, enhancing the convective heat transfer intensity while reducing frictional resistance along the flow path, achieving a balance between high heat dissipation capacity and low pressure drop. Simultaneously, the cover plate microgrooves 101 and the bottom plate microgrooves 401 are precisely connected in an array. Under the action of the gradually decreasing inflow channels 31, this ensures uniform flow distribution in each microchannel unit, resulting in uniform convective heat transfer intensity across the entire plate and preventing the generation of localized high temperatures.
[0037] In a preferred embodiment of the present invention, the working fluid inlet 102 of the cover plate and the working fluid inlet 402 of the bottom plate are coaxially corresponding, and the working fluid outlet 103 of the cover plate and the working fluid outlet 403 of the bottom plate are coaxially corresponding, to ensure that there is no flow deviation when the heat exchange working fluid is introduced and exported.
[0038] The manifold-type dual microchannel heat exchange plate is adapted to the heat dissipation needs of high-power heat-generating components in various scenarios such as electric vehicles, energy storage power stations, and portable electronic devices.
[0039] A heat exchange device, such as Figure 7As shown, it includes multiple manifold-type dual microchannel heat exchange plates as described in any one of claims 1-5. The multiple manifold-type dual microchannel heat exchange plates are arranged side by side in the vertical direction. The space between adjacent manifold-type dual microchannel heat exchange plates is used to place heat exchange components 7. The heat exchange components 7 are positioned and fixed by a limiting structure to ensure that the heat exchange components 7 are in close contact with the manifold-type dual microchannel heat exchange plates. It achieves bidirectional synchronous heat dissipation and significantly increases the heat exchange area compared with traditional single-sided microchannel.
[0040] In a preferred embodiment of the present invention, the working fluid inlet 102 of the cover plate of the adjacent manifold dual microchannel heat exchange plate is connected to the working fluid inlet 402 of the bottom plate, and the working fluid outlet 103 of the cover plate of the adjacent manifold dual microchannel heat exchange plate is connected to the working fluid outlet 403 of the bottom plate, thereby realizing the series connection of each adjacent manifold dual microchannel heat exchange plate. The pipe joint adopts a sealing structure to ensure no leakage of heat exchange working fluid.
[0041] A heat exchange method for a heat exchange device, such as Figure 8 As shown, it includes the following steps: Step S1. Fix the heat exchange components 7 between adjacent manifold dual microchannel heat exchange plates.
[0042] Step S2. Inject heat exchange medium into the manifold-type dual microchannel heat exchange plate through the bottom plate working medium inlet 402.
[0043] Step S3. The heat exchange medium enters the inlet collection area 5 through the bottom plate working medium inlet 402. After the flow velocity is uniformized in the inlet collection area 5, it flows through each inlet channel 31 of the manifold structure 3 and is evenly distributed to the double-sided symmetrical through-channel formed by the cover plate microgroove 101 and the bottom plate microgroove 401 under the action of the gradually narrowing structure of the inlet channel 31, and exchanges heat with the surface of the heat exchange element 7. The heat exchange medium quickly removes the heat generated by the heat exchange element 7 through the dual action of convective heat transfer and latent heat absorption of phase change. The heat exchange medium undergoes phase change at the appropriate temperature and continuously absorbs a large amount of heat.
[0044] Step S4. The heat exchange medium after heat exchange flows into the outlet collection area 6 through each outflow channel 32. After converging in the outlet collection area 6, it flows out from the cover plate working medium outlet 103 and flows back to the external cooling system for cooling and recycling.
[0045] In a preferred embodiment of the present invention, in step S2, the heat exchange medium is a phase change microcapsule suspension, which is a mixed solution of phase change microcapsules and water. The core material of the phase change microcapsules is n-octadecane or 1-bromohexadecane, whose phase change temperature precisely matches the optimal operating range of 25-40℃ for lithium-ion batteries. It can efficiently absorb battery heat through the latent heat of phase change, significantly improving heat exchange efficiency compared to traditional water-cooled mediums, while avoiding the leakage risk of pure phase change materials, thus balancing heat exchange performance and system safety. The shell material of the phase change microcapsules is melamine resin. The phase change microcapsules can be prepared by in-situ polymerization or interfacial polymerization.
[0046] In this embodiment, the manifold dual microchannel heat exchange plate can cool down components by introducing a low-temperature heat exchange medium or heat up components by introducing a high-temperature heat exchange medium, adapting to the component temperature control management needs in different environmental scenarios. For example, for lithium-ion battery temperature control, in a low-temperature environment, the battery temperature can be increased by introducing a heated heat exchange medium, thereby improving the battery cycle performance and ensuring its normal operation.
[0047] The heat exchange device uses a combination design of multiple manifold dual microchannel heat exchange plates, which can flexibly adjust the heat exchange area and heat dissipation power according to the capacity, size and heat generation power of the heat exchange components, and adapt to the heat dissipation needs of high-power components in different scenarios such as electric vehicles, energy storage power stations, and portable electronic devices. The combined device has a high volume utilization rate and good temperature consistency of each manifold dual microchannel heat exchange plate, which can effectively improve the overall life and safety performance of high-power heat exchange components.
[0048] This invention solves the core pain points of traditional liquid cooling technology, such as difficulty in balancing pressure drop and heat dissipation capacity, poor temperature uniformity, and low volume utilization, through the integrated design of "bilaterally symmetrical microchannels + gradient manifolds + microcapsule phase change suspension". The heat exchange plate has a compact structure and is easy to process. The heat exchange device has strong expandability and wide adaptability, which can meet the precise temperature control requirements of high-power heat exchange components under various extreme conditions and significantly improve the power density of the thermal management system.
[0049] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art can still adjust the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Therefore, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.
Claims
1. A manifolded dual microchannel heat exchanger plate characterized by: The device includes a cover plate (1), a sealing gasket (2), a manifold structure (3), and a base plate (4) arranged sequentially from top to bottom. The sealing gasket (2) is tightly fitted between the cover plate (1) and the base plate (4) and surrounds the manifold structure (3). One end of the cover plate (1) and the base plate (4) encloses an inlet collection area (5) along a first direction, and the other end of the cover plate (1) and the base plate (4) encloses an outlet collection area (6) along a first direction. Both the inlet collection area (5) and the outlet collection area (6) are closed spaces. The lower end face of the cover plate (1) is provided with a plurality of cover plate microgrooves (101) extending in a first direction and spaced apart in a second direction. The cover plate (1) is provided with a cover plate working medium inlet (102) at the inlet collection area (5) and a cover plate working medium outlet (103) at the outlet collection area (6). The upper end face of the bottom plate (4) is provided with a plurality of bottom plate microgrooves (401) extending in a first direction and spaced apart in a second direction. The bottom plate microgrooves (401) correspond one-to-one with the cover plate microgrooves (101) and are vertically connected to form a bi-laterally symmetrical through-type microchannel array. The bottom plate (4) is provided with a plurality of bottom plate microgrooves (401) extending in a first direction and spaced apart in a second direction. A bottom plate working medium inlet (402) is provided at the inlet collection area (5), and a bottom plate working medium outlet (403) is provided at the outlet collection area (6) corresponding to the bottom plate (4). The manifold structure (3) includes multiple inlet channels (31) and multiple outlet channels (32). The multiple inlet channels (31) and multiple outlet channels (32) are arranged alternately along the first direction and all extend along the second direction. The cover plate working medium inlet (102) and the bottom plate working medium inlet (402) are both connected to the inlet channel (31), and the cover plate working medium outlet (103) and the bottom plate working medium outlet (403) are both connected to the outlet channel (32).
2. The manifold-type dual-microchannel heat exchange plate according to claim 1, characterized in that: The first direction and the second direction are intersecting.
3. The manifold-type dual-microchannel heat exchange plate according to claim 2, characterized in that: The first direction and the second direction are set perpendicular to each other.
4. The manifold-type dual-microchannel heat exchange plate according to claim 3, characterized in that: The plurality of inflow channels (31) are all of a wide-inflow-narrow-outflow gradient structure, and the internal width of the plurality of inflow channels (31) gradually decreases along the second direction. The plurality of outflow channels (32) are all of a narrow-inflow-wide-outflow gradient structure, and the internal width of the plurality of outflow channels (32) gradually increases along the second direction.
5. A manifold-type dual-microchannel heat exchange plate according to claim 4, characterized in that: The working medium inlet (102) of the cover plate and the working medium inlet (402) of the bottom plate are coaxially corresponding, and the working medium outlet (103) of the cover plate and the working medium outlet (403) of the bottom plate are coaxially corresponding.
6. A heat exchange device, characterized by: It includes multiple manifold dual microchannel heat exchange plates as described in any one of claims 1-5, the multiple manifold dual microchannel heat exchange plates are arranged side by side in the vertical direction, and heat exchange components are placed between adjacent manifold dual microchannel heat exchange plates (7).
7. A heat exchange device according to claim 6, characterized in that: The working fluid inlet (102) of the cover plate of the adjacent manifold dual microchannel heat exchange plate is connected to the working fluid inlet (402) of the bottom plate, and the working fluid outlet (103) of the cover plate of the adjacent manifold dual microchannel heat exchange plate is connected to the working fluid outlet (403) of the bottom plate.
8. A heat exchange method of a heat exchange device, characterized by, Includes the following steps: Step S1. Fix the heat exchange components (7) between adjacent manifold dual microchannel heat exchange plates; Step S2. Inject heat exchange medium into the manifold-type dual microchannel heat exchange plate through the bottom plate working medium inlet (402); Step S3. The heat exchange medium enters the inlet collection area (5) through the bottom plate working medium inlet (402). After the flow velocity is uniformized in the inlet collection area (5), it flows through each inlet channel (31) of the manifold structure (3) and is evenly distributed to the cover plate microgroove (101) and the bottom plate microgroove (401) to exchange heat with the surface of the heat exchange components (7). Step S4. The heat exchange medium after heat exchange flows into the outlet collection area (6) through each outflow channel (32), and flows out from the cover plate working medium outlet (103) after converging in the outlet collection area (6).
9. The heat exchange method of the heat exchange device according to claim 8, characterized in that: In step S2, the heat exchange medium is a phase change microcapsule suspension, which is a mixed solution of phase change microcapsules and water. The core material of the phase change microcapsules is n-octadecane or 1-bromohexadecane, and the shell material of the phase change microcapsules is melamine resin.