A K-type thermocouple connection architecture and testing method with integrated temperature channel detection

Abstract

This application relates to the field of temperature detection and data acquisition technology, and discloses a K-type thermocouple connection architecture and testing method integrating temperature channel detection. The architecture includes a housing with a thermocouple input interface and a rear-end output interface, an internal local temperature acquisition module and a state switching unit, and an external local digital display module. The thermocouple input interface leads to a shunt node, connecting to a first branch and a second branch respectively. The first branch connects to the local temperature acquisition module, and the second branch connects to the rear-end output interface. The state switching unit performs mutual exclusion control on the conduction states of the first and second branches. This invention, through mutual exclusion switching, electrically disconnects the bias circuit inside the local temperature acquisition module from the temperature measurement loop in the remote direct-through mode, preventing bias current from flowing to the remote system and causing errors. Combined with the comparison of local and remote data, it achieves fault segmentation isolation and location of the entire temperature measurement link.

Description

Technical Field

[0001] This invention relates to the field of temperature detection and data acquisition technology, specifically to a K-type thermocouple connection architecture and testing method for integrated temperature channel detection. Background Technology

[0002] In dynamic temperature rise testing in industrial applications, type K thermocouples are widely used for internal temperature measurement of components such as motor stators and battery pack modules. Due to the complex operating conditions at the testing site, the weak thermoelectric potential generated by the thermocouple sensor usually needs to be transmitted to the remote master data acquisition system in the main control room via a long flexible extension cable. In order to monitor the physical connection status of the front-end sensor in real time during the test, existing technologies often connect local monitoring nodes in series between the testing site and the remote equipment to form a multi-channel parallel temperature measurement network.

[0003] In this traditional parallel monitoring architecture, local monitoring equipment typically injects a weak bias current into the temperature measurement main circuit to detect line open circuits. Due to the lack of an effective physical isolation mechanism, this bias current flows along the conductor to the remote main data acquisition system, which has a high input impedance. This bias current flowing into the remote system generates a common-mode error voltage at the receiving end. This error voltage superimposed on the actual thermoelectric potential at the microvolt level severely compromises the accuracy of the remote high-precision temperature acquisition. Furthermore, conventional local monitoring equipment often uses external mains power, which easily creates complex common ground impedances between the local system and the device under test. This causes common-mode noise generated by high-power equipment in the field to flow back to the temperature measurement circuit through the grounding loop, further deteriorating the signal acquisition environment.

[0004] Furthermore, existing multi-channel temperature measurement systems lack cross-node spatial state comparison logic when dealing with complex long-distance series-parallel hybrid wiring harnesses. When the remote acquisition system triggers a channel no-response or data exceeding limit alarm, the system can only output an alarm indicating overall link failure. Because the link states of different physical segments cannot be decoupled, testers find it difficult to accurately distinguish whether the fault stems from a detached probe of the front-end sensor, misaligned pins in the intermediate extension harness, or an incorrect channel configuration of the remote device itself. This coupling of fault states leads to low on-site troubleshooting efficiency. Testers are often forced to blindly disassemble and retest front-end sensors that are already deeply embedded or bundled inside the component under test, increasing testing time costs and potentially causing secondary damage to the structure of the component under test. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a K-type thermocouple connection architecture and testing method with integrated temperature channel detection, which solves the problems of interference caused by the bias current of local open circuit detection in multi-channel thermocouple temperature measurement systems to remote data acquisition, and the inability to perform segmented location when a fault occurs in a long-distance temperature measurement link.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] The first aspect of the present invention provides a K-type thermocouple connection architecture for integrated temperature channel detection, including a housing, on which a thermocouple input interface and a rear output interface are provided. The thermocouple input interface is used to connect to a front-end thermocouple sensor, and the rear output interface is used to connect to a rear-end remote master data acquisition system.

[0008] The housing contains a local temperature acquisition module and a status switching unit, and the outer surface of the housing contains a local digital display module, which is electrically connected to the local temperature acquisition module.

[0009] The thermocouple input interface extends into the housing and leads out a shunt node. The shunt node is connected to a first branch and a second branch respectively. The first branch extends and connects to the local temperature acquisition module, and the second branch extends and connects to the back-end output interface.

[0010] The state switching unit is connected to the first branch and the second branch respectively, and is used to mutually exclude the conduction state of the first branch and the second branch.

[0011] Furthermore, the state switching unit is configured with two mutually exclusive electrical operating modes, specifically: when in local diagnostic mode, the state switching unit controls the first branch to be turned on and the second branch to be turned off, so that the thermoelectric potential generated by the thermocouple sensor only enters the local temperature acquisition module, driving the local digital display module to output temperature values ​​or open circuit fault codes; when in remote direct-through mode, the state switching unit controls the second branch to be turned on and the first branch to be turned off, so that the bias circuit inside the local temperature acquisition module is electrically disconnected from the temperature measurement circuit, and the thermoelectric potential is transmitted to the remote main data acquisition system via the second branch and the back-end output interface.

[0012] Furthermore, the local temperature acquisition module integrates a micro-current source and a digital conversion chip. In local diagnostic mode, the micro-current source injects bias current into the temperature measurement circuit. When a physical break in the thermocouple sensor is detected, a trigger signal is output to the local digital display module to display the open circuit fault code. The bias current is isolated from the remote main data acquisition system because the second branch is disconnected.

[0013] This solution achieves time-division multiplexing and physical topology reconstruction of the temperature measurement loop through shunt nodes and state switching units in its hardware architecture. In local diagnostic mode, the first branch closes to form a closed loop for open circuit detection and local temperature measurement. In remote pass-through mode, the system disconnects the first branch and closes the second branch, electrically disconnecting the local temperature acquisition module and its internal micro-current source from the main loop. This physical isolation structure cuts off the path of bias current to the remote system, prevents impedance voltage division and signal backflow, and ensures that the thermoelectric potential acquired by the remote main data acquisition system is in a purely passive zero-load state.

[0014] Furthermore, the housing also has a built-in power supply, which is electrically connected to the local temperature acquisition module, the local digital display module, and the status switching unit. The thermocouple input interface and the rear output interface are respectively arranged on the front panel and the rear panel of the housing, and the local digital display module is embedded in the top operation panel of the housing.

[0015] Furthermore, the local digital display module is divided into multiple independent display areas, each of which independently displays the data status collected by each thermocouple input interface.

[0016] Furthermore, a microcontroller is also installed inside the casing. The state switching unit includes a solid-state analog switch array. The control terminal of the solid-state analog switch array is connected to the microcontroller. The solid-state analog switch array is connected in series in the main circuits of the first branch and the second branch, respectively. The microcontroller is used to output logic level signals and perform the mutual exclusion control on the conduction state of the first branch and the second branch.

[0017] The second aspect of the present invention provides a test method for a K-type thermocouple connection architecture with integrated temperature channel detection based on the first aspect of the technical solution described above, comprising the following steps: placing the measuring ends of each thermocouple sensor on the component under test, and connecting the cold junction plug of the thermocouple sensor to the thermocouple input interface;

[0018] The control state switching unit enters the local diagnostic mode, making the first branch conductive and the second branch disconnected, and judges the connection status of the thermocouple sensor by observing the output characteristics of the local digital display module.

[0019] Connect the back-end output interface to the remote master data acquisition system and control the state switching unit to enter the remote direct mode, so that the second branch is turned on and the first branch is turned off.

[0020] Read the remote temperature values ​​obtained from the remote master data acquisition system and combine them with the status results observed in the local diagnostic mode to perform fault isolation and consistency verification of the front-end and back-end links.

[0021] After the link verification is passed, maintain the remote pass-through mode, start the dynamic temperature rise test of the component under test, and record the collected data through the remote master data acquisition system.

[0022] Furthermore, the specific operation for determining the connection status of the thermocouple sensor in the local diagnostic mode is as follows: If the local digital display module displays an open circuit fault code, it is determined that the front-end thermocouple sensor connected to the corresponding channel has an internal open wire or a loose plug connection, and it is physically replaced in place.

[0023] If the local digital display module displays a stable reading within the reasonable room temperature range of the current test environment, it is determined that the physical medium from the temperature measuring end of the front-end thermocouple sensor to the data acquisition terminal is in good condition, and the temperature value displayed by the local digital display module at this time is recorded as the local reference temperature.

[0024] Furthermore, the specific logic for fault isolation and consistency verification of the front-end and back-end links is as follows: compare the absolute value of the actual temperature difference between the remote temperature value and the local reference temperature;

[0025] If the absolute value of the actual temperature difference is less than or equal to the maximum comprehensive temperature drift error preset by the system, then the entire signal link consisting of the front-end thermocouple sensor, the K-type thermocouple connection architecture with integrated temperature channel detection, and the remote main data acquisition system is determined to be correctly matched and in good working order.

[0026] If the absolute value of the actual temperature difference is greater than the maximum comprehensive temperature drift error, or if the channel of the remote master data acquisition system is continuously in a dead zone state with no data reporting, and assuming that the front-end sensor is undamaged, the suspected fault is isolated in the back-end network, and the pin misalignment of the extension harness or the channel configuration mapping table of the master device is directly checked.

[0027] Furthermore, after checking the back-end network, powering it back on, and triggering the system's secondary verification, the remote temperature value obtained by the remote master data acquisition system is read again, and the absolute value of the actual temperature difference between the remote temperature value and the local reference temperature is calculated; until it is determined that the absolute value of the actual temperature difference is less than or equal to the maximum comprehensive temperature drift error, the dynamic temperature rise test of the component under test is initiated.

[0028] This solution's testing method leverages the mutually exclusive switching characteristics of the connectivity architecture to achieve cross-node spatial domain state comparison. The system utilizes state switching units to reconstruct the physical topology and extract link truth values ​​in both local diagnostic mode and remote pass-through mode. When the local end confirms that the front-end physical medium is intact, but the remote end still experiences data loss or excessive temperature differences, a logical exclusion method is used to confine the fault range to the downstream network after the splitter node. This segmented isolation mechanism overcomes the problem of state superposition in serial networks and avoids accidental disassembly of non-destructive front-end sensors in the field.

[0029] The above solution achieves the following beneficial technical effects:

[0030] This application establishes a shunt node after the thermocouple input interface and utilizes a state switching unit to implement mutual exclusion control between the first branch connecting the local temperature acquisition module and the second branch connecting the remote main data acquisition system. In remote pass-through mode, the first branch is disconnected, electrically isolating the micro-current source inside the local temperature acquisition module from the temperature measurement circuit. This structure blocks the path of the local diagnostic bias current to the remote device, maintaining the local open-circuit detection function while preventing the bias current from inducing common-mode error voltage at the high input impedance end of the remote system, thus ensuring the accuracy of long-distance transmission and acquisition of weak thermoelectric potentials.

[0031] The testing method in this application relies on the mutually exclusive operating modes of the hardware, extracting the temperature reference state in local diagnostic mode and the remote temperature value in remote direct-through mode. By calculating the absolute value of the actual temperature difference between the two ends and logically comparing it with the maximum comprehensive temperature drift error, when the local front-end status is confirmed to be intact but the remote end shows data exceeding limits or dead zones, the system uses a logical elimination method to directly isolate the fault point in the downstream network such as the extension harness. This method realizes segmented fault location of long-distance serial temperature measurement links, avoiding the need for blindly disassembling and checking the front-end sensors embedded inside the component under test on-site.

[0032] The hardware architecture of this application employs a built-in power supply to provide independent DC operating voltages for the local temperature acquisition module, the state switching unit, and the local digital display module. This independent power supply configuration disconnects the common ground connection between the relay measurement device and the external AC power grid, establishing a floating ground measurement environment at the signal flow front end. This physical isolation measure blocks grounding loops, preventing common-mode noise generated by high-power devices under test on the test bench from flowing back to the weak signal measurement loop through the ground network, and reducing interference from the complex external electrical environment on the thermoelectric potential signal analysis. Attached Figure Description

[0033] Figure 1 A schematic diagram of the architecture and system topology provided for embodiments of the present invention;

[0034] Figure 2 This is an external view of the K-type thermocouple connection architecture provided in an embodiment of the present invention;

[0035] Figure 3 This is a partial cross-sectional view of the K-type thermocouple connection architecture provided in an embodiment of the present invention;

[0036] Figure 4 An internal perspective view of the K-type thermocouple connection architecture provided in an embodiment of the present invention;

[0037] Figure 5A flowchart illustrating the method provided in this embodiment of the invention;

[0038] Figure 6 A comparison curve of measurement errors between the traditional parallel architecture and the isolated architecture of this solution under steady-state conditions, provided by an embodiment of the present invention;

[0039] Figure 7 The diagram shows the state flag step response and timing evolution of the end-to-end segmented diagnostic logic provided in this embodiment of the invention under complex operating conditions.

[0040] The components include: 1. Thermocouple input interface; 2. Housing; 3. Local digital display module; 4. Local temperature acquisition module; 5. First branch; 6. Second branch. Detailed Implementation

[0041] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] See attached document Figure 1 , Figure 1 This is a schematic diagram of the K-type thermocouple connection architecture and system topology for integrated temperature channel detection according to an embodiment of the present invention.

[0043] This invention provides a K-type thermocouple connection architecture with integrated temperature channel detection. In this embodiment, the architecture is physically manifested as an independently operating data acquisition relay terminal.

[0044] As a specific engineering implementation method, its overall mechanical structure is attached to a portable shell 2, which is integrally molded from insulating and flame-retardant plastic material, and has a closed cavity inside for accommodating various electronic components and wiring networks.

[0045] Based on the connection requirements of the test site, thermocouple input interface 1 and rear output interface are distributed on the housing 2. Specifically, thermocouple input interface 1 is located on the front panel of housing 2 and adopts a K-type standard miniature thermocouple female structure to receive the front-end thermocouple sensor;

[0046] Correspondingly, the back-end output interface is located on the rear panel of housing 2, using a multi-core aviation socket for connecting to the remote master data acquisition system via an external flexible extension cable. To achieve intuitive human-machine interaction, a local digital display module 3 is embedded in the top operation panel of housing 2.

[0047] The local digital display module 3 preferably uses a low-power liquid crystal display or a self-emissive organic light-emitting diode display. Its display interface is divided into multiple independent display areas to synchronously map the digital temperature readings of each channel or the system's internal preset open circuit fault codes.

[0048] In terms of microscopic electrical wiring layout, the internal cavity of the outer casing 2 highly integrates a microcontroller, a built-in power supply, a local temperature acquisition module 4, and a state switching unit. The built-in power supply constitutes the energy hub of the entire relay terminal, providing a stable DC operating voltage for the microcontroller, local temperature acquisition module 4, local digital display module 3, and state switching unit. The microcontroller maintains an electrical connection with the control terminal of the state switching unit, responsible for outputting high and low logic level signals to directly drive the contact action of the state switching unit. At the same time, a serial peripheral interface bus is established between the local digital display module 3 and the local temperature acquisition module 4 to ensure low latency in data interaction.

[0049] To achieve signal shunt control at a single physical interface, after the thermocouple input interface 1 is connected to the front-end thermocouple sensor, its internal conductive pins extend into the printed circuit board inside the housing 2, and a shunt node is led out on the trace. This shunt node presents a hard-wired physical branching structure, leading out a first branch 5 and a second branch 6 respectively. The first branch 5 extends directionally on the circuit board and terminates at the analog signal input pin of the local temperature acquisition module 4; the second branch 6 is connected across the internal wiring terminal of the rear output interface.

[0050] As the core design element for preventing signal crosstalk in this architecture, the state switching unit is connected in series in the main circuits of the first branch 5 and the second branch 6, respectively. In practical selection, the state switching unit includes a solid-state analog switch array with low on-resistance or a miniature relay array with high insulation impedance. The logic level signal issued by the microcontroller performs absolutely mutually exclusive Boolean logic control on the conduction state of the first branch 5 and the second branch 6, thereby ensuring that within any time slice, only one link between the first branch 5 and the second branch 6 is in a closed conduction state.

[0051] Based on the aforementioned hardware topology and electrical interlocking mechanism, the system follows a rigorous segmented collaborative diagnostic logic when executing test tasks. This macro-level workflow specifically encompasses the following operational and computational steps:

[0052] S101, attach or pre-embed the measuring ends of each thermocouple sensor to the internal measuring points of the components to be measured, such as the motor stator and battery pack module. Due to the complexity of the wiring on site, the operator directly inserts the cold junction plug of each thermocouple sensor into the thermocouple input interface 1 on the front of the housing 2 to complete the initial physical blind connection.

[0053] S102, the microcontroller sends an initial diagnostic control level to the state switching unit, triggering the system to enter the local diagnostic mode. At this time, the state switching unit performs the action of closing the first branch 5 and forcibly disconnecting the second branch 6, so that the weak thermoelectric potential generated by the front-end thermocouple sensor only flows within the local closed loop and enters the local temperature acquisition module 4.

[0054] Operators perform the first level of logic troubleshooting by observing the output characteristics of the local digital display module 3. If the screen displays an open circuit fault code, it indicates that the thermocouple sensor of the corresponding measurement point channel has an internal open circuit or a loose connection, and physical replacement must be performed immediately at the original location of the component under test;

[0055] If the displayed value falls within the reasonable room temperature range of the current test environment, it can be inferred that the physical medium between the temperature measuring end of the front-end sensor and the data acquisition terminal is in good condition. The system then stores the stable reading parsed by the local digital display module 3 at this time and defines it as the local reference temperature.

[0056] S103: After confirming that all front-end probes are undamaged, the operator connects the back-end output interface to the remote main data acquisition system in the main control room via a multi-core extension cable. After completing the construction of the entire physical communication link, the microcontroller performs a level flip, switching the control system to remote pass-through mode.

[0057] In this mode, the state switching unit closes the second branch 6 and disconnects the first branch 5. The physical meaning of this action is to electrically disconnect the bias circuit inside the local temperature acquisition module 4 from the temperature measurement circuit, so that the pure thermoelectric potential generated by the thermocouple probe is in a zero-load state and is directly connected to the remote main data acquisition system via the second branch 6.

[0058] S104, it should be noted that the above-mentioned verification and comparison step for static deviation is set to be performed under a thermally stable environment before the component under test officially starts the dynamic heating / operation program (e.g., the test bench environment is in a state of room temperature equilibrium). At this time, the actual physical temperature of the front-end sensor has not changed drastically, thereby ensuring that the local reference temperature is consistent with... The comparison has an objective physical benchmark.

[0059] After receiving the direct thermoelectric potential, the remote master data acquisition system independently executes its internal analog-to-digital conversion and cold junction compensation mechanism to analyze and output the remote temperature value. For the specific circuitry and underlying conversion algorithm of the cold junction compensation within the remote master data acquisition system, those skilled in the art can employ conventional data acquisition instrument underlying processing mechanisms.

[0060] After acquiring remote data, the system enters the core verification and comparison phase. Generally, due to voltage drop attenuation caused by parasitic resistance of the relay extension harness, and the accuracy reference deviation of the cold junction compensation chips of the local module and the remote system, the temperature resolved by the remote end will have a static deviation from the reference temperature recorded locally.

[0061] In addition, to avoid the collapse of the judgment logic caused by the extreme value of a single sampling due to electromagnetic interference in the test bench environment, this embodiment introduces a sliding time window smoothing processing logic before comparison and adopts a multi-source data alignment strategy based on time-dimension weighted averaging.

[0062] The calculation model for verification and judgment is given by the following mathematical formula:

[0063] ;

[0064] In the formula, Characterizes the absolute value of the actual temperature difference between the front-end and back-end systems after eliminating high-frequency transient noise; Represents the remote master data acquisition system in time slices The acquired remote temperature value in a single measurement; The system presets the total number of frames sampled in the sliding window (e.g., setting...). To obtain smoothed data within 1 second); This is the single-point local reference temperature locked in step S102.

[0065] Based on this, the system introduces the maximum allowable overall temperature drift error. This serves as a rigid decision threshold. The value is determined by a comprehensive static calibration based on the resistivity of the system conductor material, the estimated cable length, and the nominal tolerance of the A / D converters at both ends. Its engineering value range is usually constrained to between 1.5℃ and 3.0℃.

[0066] If the system solves If the output is true, it indicates that the entire signal link, consisting of the front-end thermocouple sensor, the device in this architecture, and the remote master data acquisition system, is correctly matched and is in good working order.

[0067] Conversely, if the solution yields... Alternatively, if the remote channel remains in a dead zone with no data reporting, based on the physical proof of the front-end sensor's non-destructive nature established in step S102, the system uses logical mutual exclusion principles to directly isolate the suspected fault in the back-end network. Operators no longer need to return to the test bench to disassemble the front-end components; instead, they can go directly to the control room to check for pin misalignment in the extension harness or the channel configuration mapping table of the main equipment.

[0068] S105, after completing the backend network check, powering back on, and triggering a secondary system check until the requirements are met. Subsequently, the system maintains the state machine's locking anchor point in the remote direct-through mode. As the dynamic temperature rise test program of the component under test is officially launched, the millivolt-level thermoelectric potential generated by the temperature measurement loop is continuously fed into the remote master data acquisition system along the interference-free direct-through link, thereby ensuring the authenticity and integrity of the data under high-intensity, long-term test cycles.

[0069] See attached document Figure 2 , Figure 2 This is a schematic diagram of the mechanical spatial layout and internal structure of a K-type thermocouple connection architecture for integrated temperature channel detection according to an embodiment of the present invention.

[0070] In this embodiment, based on the aforementioned overall system topology, the K-type thermocouple connection architecture integrating temperature channel detection is designed with partitioned isolation in its physical structure. The outer shell 2 has a polyhedral structure in space, and its interior is divided by supporting ribs into a main chamber for fixing the printed circuit board and a power isolation chamber for accommodating the battery pack.

[0071] As a preferred layout, in order to effectively avoid the entanglement interference caused by dense wire harnesses at the test site, the external interfaces of the housing 2 are arranged separately according to the unidirectional flow path of the signal.

[0072] When discussing the physical connection mechanism of the signal, the thermocouple input interface 1 is arranged in a linear array on the front side panel of the housing 2. The internal conductive pins of the thermocouple input interface 1 are made of nickel-chromium alloy and nickel-silicon alloy material that matches the polarity of the K-type thermocouple. The engineering purpose of this material matching is to strictly maintain the consistency of the Seebeck effect in the temperature measurement circuit, so as to avoid introducing additional parasitic thermoelectric potential at the dissimilar metal connection of the connector. For the selection of the same material metal contacts and the cold junction error avoidance mechanism of the standard thermocouple connector, those skilled in the art can directly use commercially available matching components for assembly.

[0073] When a weak external signal enters the device, the metal pins of thermocouple input interface 1 pass through the front panel and are directly soldered to the printed circuit board inside the housing 2. Here, the shunt node is physically implemented as a copper branch trace on the printed circuit board.

[0074] Specifically, corresponding to the positive and negative pin pads of each input channel, the copper traces on the printed circuit board form geometric branches at the nodes. To reduce the microvolt-level voltage attenuation caused by the impedance asymmetry between the two branches at the temperature measurement node, the copper traces preferably adopt symmetrical Y-shaped routing at the branching points, and the line widths of the first branch 5 and the second branch 6 are consistent. One end of the branch of the copper trace extends towards the area where the local temperature acquisition module 4 is located, forming the physical carrier of the first branch 5;

[0075] The other end of the branch extends into the area where the state switching unit is located, forming the physical carrier of the second branch 6. Through this printed circuit board-level hard-wired shunt structure, the system achieves the underlying physical distribution of the signal link at the input end.

[0076] To achieve clear spatial isolation from the input side, the rear output interfaces are uniformly arranged on the rear panel of the housing 2. In this embodiment, the rear output interfaces use multi-core aviation sockets with metal shielding housing 2, and each of the internal terminals is soldered to the tail end of the second branch 6 of each channel. In actual motor testing, the leads of the front-end thermocouple sensors converge on the front panel, while the extension harnesses leading to the remote main data acquisition system are led out from the rear panel. This front-to-back through-layout spatial wiring layout can reduce the wiring complexity around the test bench in a physical sense.

[0077] For the engineering implementation of the human-computer interaction interface, the local digital display module 3 is flatly embedded in the top operation panel of the housing 2. This top-view design allows testers to read data without obstruction whether the device is flat or suspended.

[0078] As a specific implementation, the local digital display module 3 uses a high-contrast TFT LCD panel or OLED display module. The microcontroller has embedded display driving logic that divides the display interface of the local digital display module 3 into multiple independent display areas at the pixel level. Each independent display area is arranged in the form of a rectangular grid array, and the physical position of each grid has a one-to-one mapping relationship with the channel number of each thermocouple input interface 1 on the front side panel.

[0079] When the system performs status monitoring tasks, each independent display area independently displays the data status collected by each thermocouple input interface 1. This independent partitioning design can support status monitoring during multi-channel concurrent testing. When a physical disconnection occurs at the front end of a certain channel's sensor, only its corresponding independent display area will output a preset open-circuit fault code, while the adjacent independent display areas continue to output normal temperature values.

[0080] Regarding the underlying physical architecture of the power supply network, a built-in power supply is located in the power isolation compartment at the bottom of the outer casing 2. This built-in power supply specifically includes a rechargeable lithium-ion battery pack and a cascaded DC-DC multi-channel buck regulator circuit. The output of the built-in power supply is electrically connected to the analog power supply pins of the local temperature acquisition module 4, the logic power supply pins of the local digital display module 3, and the drive power supply pins of the state switching unit via traces on the inner power plane of the printed circuit board. This embodiment uses an independent battery power supply to prevent ground loops.

[0081] Traditional methods of powering the system via an AC adapter can easily create complex common ground impedances between the remote master data acquisition system and the high-power device under test. By adopting a built-in battery power supply solution, the ground connection between the system and the external AC power grid is disconnected, thereby creating a floating ground measurement environment at the front end of the test system. This physically prevents common-mode noise generated by the device under test from flowing back to the local temperature acquisition module 4.

[0082] See attached document Figure 3 , Figure 3 This is a schematic diagram of the electrical interaction between a state switching unit and a microcontroller according to an embodiment of the present invention.

[0083] In this embodiment, based on the aforementioned physical space layout, the system's internal circuit network uses a microcontroller as its core to implement signal splitting control logic. The microcontroller, acting as the logic processing hub of this relay architecture, has its general-purpose input / output pins directly hardwired to the control terminal of the state switching unit. To achieve lossless switching along the transmission path of the microvolt-level thermoelectric potential, the state switching unit preferably employs a solid-state analog switch array manufactured using complementary metal-oxide-semiconductor (CMOS) technology in its specific lower-level circuitry.

[0084] As a specific engineering implementation basis, traditional electromagnetic mechanical relays generate a small contact thermoelectric potential when the contacts are engaged, and are easily affected by the high-frequency vibration environment of the test site, causing microscopic fluctuations in contact impedance. To overcome this technical deficiency, the solid-state analog switch array selected in this embodiment has low on-resistance and picoampere-level turn-off leakage current, which can maintain the impedance continuity of the temperature measurement circuit. For the cascaded structure of insulated gate bipolar transistors and the threshold conduction mechanism inside the solid-state analog switch, those skilled in the art can refer to the technical manuals of conventional low-voltage analog switch chips for construction.

[0085] To ensure that no transient crosstalk occurs during the dynamic switching of the two signal branches, the microcontroller executes strict dead-time control logic for the solid-state analog switch array, which is to disconnect before turning on.

[0086] Specifically, the microcontroller assigns two independent control pins, which are respectively connected to the enable pins of the switching chips on the first branch 5 and the second branch 6. At the firmware level, the state transition subroutine is forced to have a time span of... Dead-time delay. When the system needs to reconfigure its state, the microcontroller first sends a disconnect instruction to the currently closed branch, then starts an internal timer, waiting for... After the cycle is exhausted, a closing command is sent to the target branch.

[0087] Dead Time The value of is determined based on the junction capacitance discharge time of the selected solid-state analog switch, and in this embodiment, it is preferably set between 500ns and 2μs. By injecting this dead-time timing, the system eliminates the risk of overlapping conduction of the first branch 5 and the second branch 6 within a micrometer-level time slice due to component response time differences.

[0088] Based on the aforementioned mutual exclusion control logic, when the system enters the local diagnostic mode, the microcontroller sends a closed-circuit level to the first branch 5 and keeps the second branch 6 off. At this time, the millivolt-level thermoelectric potential generated by the front-end thermocouple sensor flows only directionally into the local temperature acquisition module 4 along the first branch 5. Since the second branch 6 exhibits high impedance characteristics, the input channel of the remote main data acquisition system and the local temperature measurement circuit currently undergoing diagnostics are physically isolated.

[0089] During the subsequent testing process, when the system switches to remote pass-through mode in response to an external trigger command, the microcontroller executes the aforementioned disconnect-before-connect logic, causing the switch array on the first branch 5 to disconnect, and then the switch array on the second branch 6 to close. Because the local signal link is severed, the weak voltage signal generated by the thermocouple sensor no longer enters the local processing unit, but instead is connected to the back-end output interface via the closed second branch 6, ultimately reaching the remote main data acquisition system.

[0090] To verify the effectiveness of this anti-interference bypass circuit in remote shoot-through mode from a theoretical derivation perspective, a parasitic error voltage evaluation model based on switch leakage current was constructed. Under the premise that the remote main data acquisition system is in a high input impedance state, the calculation model for the parasitic error voltage caused by the local open-circuit branch follows the following mathematical relationship:

[0091] ;

[0092] In the formula, This refers to the static parasitic error voltage introduced into the second branch 6 (i.e., the remote direct link) when the first branch 5 is in the open state; The off-state leakage current of the solid-state analog switch connected in series in the first branch 5 to the temperature measurement circuit in the off state; It is the equivalent series internal resistance formed by the front-end thermocouple sensor and the connecting cable.

[0093] The physical meaning of this formula lies in quantifying the electromagnetic interference effect that remains after the parallel branch circuit is turned off. In actual industrial environments, the Seebeck coefficient of a type K thermocouple is approximately 41 μV / ℃, which means that the accuracy of remote temperature resolution is extremely sensitive to microvolt-level noise. In this embodiment, the off-state leakage current... The maximum nominal value is affected by ambient temperature drift. Based on semiconductor characteristics, within the testing range of 25°C (room temperature) to 85°C (high temperature), its value is strictly controlled to be between 10pA and 150pA. This is in line with the typical equivalent distributed resistance of industrial thermocouples, which is usually between 50Ω and 200Ω. The calculated maximum parasitic error voltage The voltage is limited to within 0.03 μV. This nanovolt-level static error voltage has no substantial impact on the analytical results of the remote system.

[0094] Based on this leakage isolation design and timing mutual exclusion mechanism, this architecture supports clean switching between different modes at the electrical level, avoiding impedance voltage division and signal backflow caused by conventional parallel schemes.

[0095] See attached document Figure 4 , Figure 4 This is a schematic diagram of the underlying quantization closed loop and bias isolation principle of the local temperature acquisition module 4 according to an embodiment of the present invention.

[0096] In this embodiment, the local temperature acquisition module 4 not only undertakes the basic thermoelectric potential analog-to-digital conversion task, but also has the function of actively detecting the integrity of the front-end physical link. To support this composite function, in the specific lower-level physical implementation, the local temperature acquisition module 4 preferably adopts a thermocouple-specific digital conversion chip with integrated cold junction compensation and disconnection detection logic. For the specific algorithm of cold junction compensation and temperature lookup table mapping process inside this module, those skilled in the art can use the hard-wired logic built into commercially available dedicated temperature measurement chips.

[0097] Before delving into specific signal quantization calculations, it's necessary to clarify the underlying general physical principles of circuit breaker detection. A thermocouple itself acts as a passive micro-voltage source. When the physical circuit is intact, it exhibits low impedance characteristics on the order of hundreds of ohms. However, once a cable break occurs, the circuit loses its DC path, and the temperature sensing node will be in an uncertain floating state. Based on this physical causal relationship, the system uses a micro-current injection method to induce a voltage drop jump for state identification. Based on the aforementioned hardware foundation, the system executes a set of active detection and false alarm isolation sub-processes based on bias current at the underlying level. The specific steps are as follows:

[0098] S201, when the microcontroller issues a command to put the system into local diagnostic mode, the analog input front end of the local temperature acquisition module 4 is activated. This module internally contains a micro-current source that continuously injects a diagnostic bias current into the first branch 5 to detect line integrity. Since the front-end thermocouple sensor and the external cable are physically equivalent to a closed impedance network, this weak bias current will generate a corresponding bias voltage drop at the input pin node, which is linearly superimposed on the actual thermoelectric potential. At this time, the physical model of the mixed node voltage captured at the input pin follows the following formula:

[0099] ;

[0100] In the formula, Characterizes the hybrid node voltage actually sampled at the analog input pin of the local temperature acquisition module 4; The pure thermoelectric potential generated by the front-end thermocouple sensor based on the actual temperature difference at the measuring point; Diagnostic bias current actively injected by the internal microcurrent source.

[0101] To ensure that a measurable open-circuit voltage drop can be generated without increasing the base voltage during normal measurements and introducing static errors, The output range is typically precisely constrained to the order of 10nA to 100nA.

[0102] S202, Open-circuit saturation transition and multi-dimensional disturbance rejection determination. When the temperature measurement network is intact... It exhibits low impedance and negligible bias voltage drop. The value is mainly composed of Decision. If the front-end thermocouple sensor experiences a physical break or severe oxidation and loose connection of the connector, the equivalent impedance of the temperature sensing circuit will be affected. At the physical level, it presents an open circuit state that approaches infinity (∞).

[0103] After losing the low-impedance discharge circuit, the output of the microcurrent source... The equivalent parasitic capacitance at the input node will be directly charged with a constant current, resulting in a voltage drop at the input node. It was quickly pulled up to near the saturation level of the module's power supply rail.

[0104] Considering the extremely strong transient electromagnetic interference (EMI) present in the testing environment of high-power motors or battery packs, directly determining an open circuit based solely on a single sample exceeding the limit can easily lead to frequent false alarms due to nanosecond-level voltage spikes. Therefore, this embodiment introduces time-based state confirmation filtering logic at the microcontroller level, based on the hardware comparator, to avoid one-sided judgments relying solely on a single extreme value. Its comprehensive judgment logic model is as follows:

[0105] ;

[0106] In the formula, This is the final output and effective current channel status flag of the local temperature acquisition module 4; for Dynamic input voltage at any given time; The system's preset open-circuit detection hardware threshold is determined based on the module's simulated power supply voltage. The value is usually taken as ; This is the trigger point when the voltage over-limit is first detected; The anti-shake confirmation time window set for the system.

[0107] Introduction The technical objective is to establish multi-frame verification in the time dimension and filter out high-frequency transient noise. As a preferred method, The engineering values ​​were set between 10ms and 50ms to ensure coverage and filtering of typical 50Hz / 60Hz power frequency interference cycles. Only when the node voltage remains above the threshold for the full duration... When the window is open, the microcontroller will intercept the normal temperature value output and instead drive the local digital display module 3 to throw out a preset ERR open circuit fault code.

[0108] S203, introduces diagnostic bias current This is a physical prerequisite for achieving circuit breaker location, but it also constitutes a source of interference for the failure of parallel temperature measurement of multiple devices. In a conventional parallel topology without the physical isolation of this architecture, the continuous injection of local modules... The current will be shunted along the conductor to the remote main data acquisition system. At this point, the dynamic error voltage model introduced by the parallel network is:

[0109] ;

[0110] In the formula, Characterizes the common-mode error voltage of the remote system caused by bias current intrusion under normal parallel conditions; This is the equivalent input impedance of the remote master data acquisition system. In the limit condition completeness analysis of the algorithm logic, since the remote system has a high impedance input (…), (Typically greater than 10MΩ), and the physical impedance of the conductor is always a positive real number; the denominator in the division operation of this formula... It is strictly greater than zero, and there are no computational singularities that approach zero.

[0111] Furthermore, if the front-end probe is unexpectedly disconnected in parallel operation, the mathematical limit of the above error formula evolves into: At this time, due to With extremely high resistance, the weak bias current that enters will generate a false voltage drop of up to several volts at the far end, overwhelming the real microvolt-level thermoelectric potential and causing the far-end channel to overflow at full scale.

[0112] To eliminate the interference trap caused by the parallel architecture at its physical source, this system relies on a microcontroller to control the state switching unit to execute actions. When entering the remote pass-through mode, the first branch 5 is cut off, and the local temperature acquisition module 4, along with its internal micro-current source, is physically separated from the main temperature measurement circuit. The aforementioned bias current loses its hard-wired path to the remote main data acquisition system, thus ensuring that the thermoelectric potential acquired by the remote system presents a passive zero-load state at the underlying circuit level. Through this mechanism of hard isolation in timing between the quantitative diagnostic closed loop and the data pass-through link, this solution allows micro-current active detection technology and high-precision remote passive acquisition to coexist in the same system.

[0113] See attached document Figure 5 , Figure 5 This is a logical flowchart of a bidirectional comparison-based end-to-end segmented diagnostic method according to an embodiment of the present invention.

[0114] In this embodiment, the system can not only perform basic circuit breaker detection on a single node, but also implement cross-node spatial domain state comparison based on the underlying topology reconstruction mechanism. Traditional single-point monitoring, when faced with complex series-parallel hybrid wiring harnesses, often cannot distinguish whether a fault alarm is triggered by a damaged front-end probe, a broken extension cable, or a hardware failure in the acquisition device itself. To overcome this technical blind spot, this invention introduces a time-division multiplexing-based topology reconstruction mechanism at the algorithm level. By extracting the link truth values ​​under different physical isolation states, spatial-level decoupling and segmented location of the fault point are achieved.

[0115] Before delving into the specific logical matrix derivation, it is necessary to clarify the underlying physical causal relationship of the bidirectional comparison mechanism. The system's physical hardware architecture determines that the local temperature acquisition module 4 and the remote master data acquisition system are in a cascade relationship in terms of physical signal flow. However, due to the existence of anti-interference mutual exclusion switching, the state acquisition of the two is mutually exclusive and misaligned in time series. This inherent spatiotemporal asymmetry requires that strict data timing alignment must be performed before multi-source state comparison to avoid misjudgments caused by sudden changes in operating conditions. Based on this general principle, the specific segmented diagnostic logic is refined into the following execution steps:

[0116] S301, during the period when the microcontroller scheduling state switching unit puts the system into local diagnostic mode, the local temperature acquisition module 4 completes the parsing of the input node voltage according to the internal bias mechanism, thereby generating the local channel status flag. To establish a time reference system, the system synchronously calls its internal high-frequency clock to capture and record the reference timestamp of this flag. In this definition, A logic value of 0 indicates that the local detection loop is at low resistance and normal, while a logic value of 1 indicates that the detection loop is at high resistance and open. This step provides a basic state anchor point for subsequent logic comparisons.

[0117] S302, based on the latching operation of the aforementioned local state, the microcontroller then executes the dead-time control logic of disconnect-before-connect, reconstructing the system's physical link to the remote pass-through mode. While receiving the thermoelectric potential signal, the remote master data acquisition system's built-in bias scanning mechanism also generates a remote channel status flag. The microcontroller reads the flag via an external communication bus and records its arrival timestamp. .

[0118] Considering that local diagnostics and remote pass-through are mutually exclusive in physical space, the acquisition of these two sets of multi-source state data inherently involves communication and physical switching lags. If, within the millisecond interval of mode switching, the test bench experiences severe vibration causing the sensor to transiently detach, the two samplings will map to drastically different physical facts. To prevent erroneous localization caused by such spatiotemporal misalignment, the system enforces time-dimensional cleaning and alignment checks before the data enters the logical comparison matrix. Its alignment determination model follows these constraints:

[0119] ;

[0120] If absolute time difference The system then recognizes and Strict alignment in terms of time and environmental conditions allows this set of data to flow into the next level of the comparison matrix;

[0121] like If the data is found to be out of place in time and space, the current data group will be discarded and the diagnostic process will be restarted.

[0122] In the formula, This represents the maximum allowable synchronization deviation time for the system. As a preferred approach, it comprehensively considers both the typical transmission delay of the fieldbus and the fundamental frequency period of the test bench's mechanical vibration. The value range is limited to between 200ms and 500ms.

[0123] S303, after confirming data source timing alignment, the system will and The results are projected onto a pre-defined segmented diagnostic status comparison matrix. To avoid missing latent faults due to relying solely on a single level logic, the output result incorporates the temperature change rate. The multidimensional weighted logic. The specific formula for calculating the rate of temperature change is:

[0124] ;

[0125] In the formula, and These are the valid temperature values ​​obtained at the current time and in the previous sampling period, respectively. In this embodiment, the valid temperature value is preferably the steady-state temperature sequence continuously parsed by the remote master data acquisition system in remote pass-through mode. Furthermore, this calculation is performed only under the premise that the hardware anti-jitter disconnection threshold is not triggered (i.e., in a non-saturated overflow state) to ensure the physical validity of the slope calculation.

[0126] To ensure the completeness of the division operation logic and prevent floating-point arithmetic overflow and system crashes caused by the denominator approaching 0 under extremely high-frequency sampling, the microcontroller's hardware timer imposes a mandatory lower limit constraint on the sampling period, ensuring that the time interval between any two adjacent valid samples strictly meets the requirement. .

[0127] Based on the above parameters, the system performs the following multidimensional cross-validation and segmented localization:

[0128] (1) When and ,at the same time At that time, the system determined that the physical state of the entire link was normal. Among them, This is a reasonable temperature rise rate threshold set based on the thermal capacity characteristics of the physical test object. In this embodiment, based on the stator heat accumulation rate of a typical high-power motor,... The speed is typically set to 50℃ / s. This multi-dimensional determination, which combines temperature and physical inertia, effectively eliminates the possibility of a hidden failure where the probe lead is not broken but has been accidentally detached from the temperature measuring surface.

[0129] (2) When and At this time, the system determines that a physical break has occurred in the common input lead before the front-end sensor body or the shunt node. The physical causal relationship for this determination is that the front-end section constitutes the only signal source shared by the local and remote ends, and the source impedance tending to infinity will inevitably lead to a simultaneous over-limit jump in bidirectional diagnosis.

[0130] (3) When and At this point, the system determines that the back-end extension harness is disconnected or the back-end multi-core aviation connector is detached. Under this combination of conditions, a normal local link confirms the absolute integrity of the front-end probe; while a remote flag error is detected, logical elimination is used to precisely pinpoint the fault location to the physical interval after the splitter node and before the remote data collector. This ability to accurately locate specific line segments is the core technical effect brought about by the physical isolation mechanism of this architecture.

[0131] (4) When and At this point, the system encountered a typical combination of logical conflicts. An open circuit at the front end should have resulted in no signal at the remote end, but the remote end reported that the link was normal. In response to this singularity of the state matrix that violates the conventional physical series connection rules, the system ruled out the possibility of external wiring harness failure through a logical troubleshooting mechanism, directly mapping the fault source to a broken physical conduction link in the first branch 5 (such as a damaged solid-state analog switch), or damage to the internal micro-current source of the local temperature acquisition module 4 or a failure of the analog-to-digital conversion channel.

[0132] By performing closed-loop analysis of this singular matrix, this architecture achieves and extends the self-checking function for the health status of the underlying components of the device without adding extra hardware.

[0133] Specific application examples:

[0134] To further assist those skilled in the art in understanding the operational mechanism of the present invention in actual engineering and its advancements compared to existing technologies, a specific application embodiment is provided below, supplemented by experimental verification data for detailed explanation.

[0135] In this embodiment, the K-type thermocouple connection architecture with integrated temperature channel detection is deployed on a durability test bench for a new energy vehicle drive motor with a rated power of 150kW. The test task requires 500 hours of alternating load thermal cycling monitoring at 16 key temperature measurement points inside the motor stator winding. The test site is filled with high-frequency PWM electromagnetic interference from the dynamometer and motor controller, and the bench experiences severe low-frequency mechanical vibration under extreme speed conditions.

[0136] During the thermal equilibrium phase before the test was started (i.e., the test bench environment was at a steady-state room temperature of 25°C and the motor was not powered on and generating heat), the system first performed a benchmark comparison experiment on measurement accuracy and isolation effect.

[0137] See attached document Figure 6 , Figure 6 This is a graph comparing the measurement errors of a traditional parallel architecture and the isolated architecture of this solution under steady-state conditions according to an embodiment of the present invention (Note: This graph is a smooth curve of time and temperature fluctuations).

[0138] To establish a rigorous control group, the experiment connected a data acquisition terminal using a traditional direct parallel detection topology and a relay architecture using the physical segmented isolation topology of this invention at the same measurement point. In the traditional parallel architecture, the microcurrent continuously injected by the local diagnostic chip... (Set at 100nA) Inevitably, interference will seep into the remote network. Based on the aforementioned error model formula:

[0139] ;

[0140] In actual measurements, the equivalent internal resistance of the front-end K-type thermocouple is... Remote data acquisition unit input impedance Calculations show that this parallel network introduces approximately The static common-mode error voltage. Combined with a type K thermocouple. The Seebeck coefficient directly caused the far-end resolution temperature curve of the traditional architecture to rise by about 0.3°C, accompanied by sawtooth fluctuations due to environmental electromagnetic noise.

[0141] In stark contrast, after the architecture of this invention is controlled to enter the remote pass-through mode, the first branch 5 is completely cut off by the dead-zone logic of first-break then-connect. According to the leakage current parasitic error model of this invention:

[0142] ;

[0143] The turn-off leakage current of the solid-state analog switch was measured at a room temperature of 25°C. Only about 50pA. The calculated static error voltage. As low as Magnitude. For example... Figure 6 Experimental data show that the temperature baseline presented by this scheme in the remote master data acquisition system is extremely smooth, eliminating the 0.3℃ static drift caused by the bias current. Its true output value is highly consistent with the calibration data of the standard high-precision platinum resistance thermometer, verifying its superiority in achieving lossless data transmission at the electrical level.

[0144] After completing the static calibration, the test bench was officially started with the dynamic thermal cycling program. To verify the effectiveness of the dynamic fault diagnosis logic and state matrix of this invention, three typical destructive conditions were artificially introduced during the experiment.

[0145] See attached document Figure 7 , Figure 7 This is a diagram showing the state flag step response and timing evolution of the full-link segmented diagnostic logic under complex operating conditions according to an embodiment of the present invention (Note: This diagram is represented by a multi-channel Boolean logic square wave and slope trigger pulse that unfolds along the time axis).

[0146] Test Condition 1: Verification of immunity to intermittent connections caused by severe mechanical vibration.

[0147] The test bench is running until When the exciter is started, a transient mechanical shock is generated, causing the thermocouple connector to experience a continuous shock lasting approximately [time period missing]. Physical disconnection. Input pin voltage. The temperature spiked rapidly to the open circuit threshold the instant it disengaged. However, the system's underlying anti-shake confirmation time window... The timeframe is rigidly constrained to 30ms. This is because the voltage over-limit condition does not fully cover the entire [timeframe / period]. The microcontroller intercepted the alarm, and the system's underlying status flags remained normal. Experimental results show that this debouncing logic successfully filtered out extremely severe mechanical vibration glitches, preventing unexpected shutdowns during bench testing due to false alarms.

[0148] Test Condition 2: Verification of latent failure due to accidental probe detachment.

[0149] exist At this time, the thermocouple probe, which was at a high temperature (120°C), was manually detached from the surface of the stator winding using an external device, exposing it to the cooling air duct of the test bench. At this point, the probe's physical connections were completely normal (equivalent impedance). (It is in a low-resistivity state), but the sampling temperature drops sharply.

[0150] When the system captures status flags, local diagnostics are performed. Remote diagnosis However, the system backend calculates, based on the aforementioned temperature change rate formula, that the current... The temperature instantly spiked to 85℃ / s, far exceeding the preset threshold for the physical temperature rise rate of a high-power motor stator. ).

[0151] Based on the cross-validation of the multi-dimensional weighted logic in step S303, the system discarded the single-dimensional conclusion that the electrical network was normal and instead triggered a customized alarm for thermal coupling failure of the temperature sensing node. This experimental result demonstrates the important role of introducing physical inertial parameters in supplementing diagnostic blind spots.

[0152] Test Condition 3: Precise positioning of physical segments in the bidirectional comparison matrix.

[0153] exist During the stable heating phase, the testers used insulated scissors to forcibly cut the flexible extension cable harness connecting the rear panel of the relay terminal to the remote acquisition system.

[0154] After the fault occurred, the system immediately initiated a time-sharing bidirectional comparison process. Local status. Locked timestamp for The read value is logical. (Because the physical link from the front-end probe to the relay device was not damaged); subsequently, after a solid-state switchover, the remote status... Arrival Timestamp for Because the remote system detected an input circuit break, the read value was logical. The system first performs a timing alignment check:

[0155] ;

[0156] The absolute time difference of 0.16s is strictly less than the set maximum synchronization deviation time. ( The system determined that the two sets of data environmental conditions were effectively aligned. Subsequently, the system analyzed the state matrix combination ( Based on the preset logical causal mapping, the local digital display module 3 accurately outputs the fault location code of the back-end extension harness detachment, rather than a general channel error.

[0157] Following the clear positioning instructions, the on-site operators bypassed the difficult-to-disassemble front motor housing and completed the wiring harness replacement and testing restoration in just 2 minutes from behind the control room.

[0158] In summary, the experimental and engineering application comparisons demonstrate that the integrated temperature channel detection architecture and method proposed in this invention not only achieves an order-of-magnitude leap in signal transmission fidelity, but also endows the system with the ability to eliminate blind spots and achieve precise spatial positioning throughout the entire chain through multi-source asynchronous data alignment and state matrix cross-validation. This provides extremely reliable technical support for the automated operation and maintenance of large-scale complex industrial testing sites.

[0159] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A K-type thermocouple connection architecture with integrated temperature channel detection, characterized in that, Includes a housing (2), on which a thermocouple input interface (1) and a rear output interface are provided. The thermocouple input interface (1) is used to connect to the front-end thermocouple sensor, and the rear output interface is used to connect to the rear-end remote master data acquisition system. The housing (2) is provided with a local temperature acquisition module (4) and a state switching unit inside, and a local digital display module (3) is provided on the outer surface of the housing (2). The local digital display module (3) is electrically connected to the local temperature acquisition module (4). The thermocouple input interface (1) extends into the housing (2) and leads out a shunt node. The shunt node is connected to a first branch (5) and a second branch (6). The first branch (5) extends and connects to the local temperature acquisition module (4), and the second branch (6) extends and connects to the back-end output interface. The state switching unit is connected to the first branch (5) and the second branch (6) respectively, and is used to perform mutual exclusion control on the conduction state of the first branch (5) and the second branch (6).

2. The K-type thermocouple connection architecture with integrated temperature channel detection according to claim 1, characterized in that, The state switching unit is configured with two mutually exclusive electrical operating modes, specifically including: When in local diagnostic mode, the state switching unit controls the first branch (5) to be turned on and controls the second branch (6) to be turned off, so that the thermoelectric potential generated by the thermocouple sensor only enters the local temperature acquisition module (4) and drives the local digital display module (3) to output temperature value or open circuit fault code. When in remote direct mode, the state switching unit controls the second branch (6) to be turned on and controls the first branch (5) to be turned off, so that the bias circuit inside the local temperature acquisition module (4) is electrically disconnected from the temperature measurement circuit, and the thermoelectric potential is transmitted to the remote master data acquisition system via the second branch (6) and the back-end output interface.

3. The K-type thermocouple connection architecture for integrated temperature channel detection according to claim 2, characterized in that, The local temperature acquisition module (4) integrates a micro current source and a digital conversion chip. In the local diagnostic mode, the microcurrent source injects bias current into the temperature measurement circuit. When the thermocouple sensor is detected to have a physical break, a trigger signal is output to the local digital display module (3) to display the open circuit fault code. The bias current is isolated from the remote master data acquisition system because the second branch (6) is disconnected.

4. The K-type thermocouple connection architecture for integrated temperature channel detection according to claim 1, characterized in that, The housing (2) is also equipped with a built-in power supply, which is electrically connected to the local temperature acquisition module (4), the local digital display module (3) and the state switching unit respectively. The thermocouple input interface (1) and the rear output interface are respectively arranged on the front panel and the rear panel of the housing (2), and the local digital display module (3) is embedded in the top operation panel of the housing (2).

5. The K-type thermocouple connection architecture for integrated temperature channel detection according to claim 4, characterized in that, The local digital display module (3) is divided into multiple independent display areas, and each of the independent display areas corresponds to the independent display of the data status collected by each of the thermocouple input interfaces (1).

6. The K-type thermocouple connection architecture for integrated temperature channel detection according to claim 1, characterized in that, The housing (2) is also equipped with a microcontroller. The state switching unit includes a solid-state analog switch array. The control terminal of the solid-state analog switch array is connected to the microcontroller. The solid-state analog switch array is connected in series in the main circuits of the first branch (5) and the second branch (6). The microcontroller is used to output logic level signals and to control the mutual exclusion of the conduction states of the first branch (5) and the second branch (6).

7. A test method for a K-type thermocouple connection architecture with integrated temperature channel detection, characterized in that, The K-type thermocouple connection architecture for integrated temperature channel detection as described in any one of claims 1-6 includes the following steps: The measuring ends of each thermocouple sensor are arranged on the component to be tested, and the cold junction plug of the thermocouple sensor is connected to the thermocouple input interface (1). The state switching unit is controlled to enter the local diagnostic mode, so that the first branch (5) is turned on and the second branch (6) is turned off. The connection status of the thermocouple sensor is determined by observing the output characteristics of the local digital display module (3). Connect the back-end output interface to the remote master data acquisition system and control the state switching unit to enter the remote direct mode, so that the second branch (6) is turned on and the first branch (5) is turned off; Read the remote temperature value obtained by the remote master data acquisition system, and combine it with the status results observed in the local diagnostic mode to perform fault isolation and consistency verification of the front-end and back-end links; After the link verification is passed, the remote pass-through mode is maintained, the dynamic temperature rise test of the component under test is started, and the collected data is recorded through the remote master data acquisition system.

8. The test method for a K-type thermocouple connection architecture with integrated temperature channel detection according to claim 7, characterized in that, The specific steps for determining the connection status of the thermocouple sensor in the local diagnostic mode are as follows: If the local digital display module (3) displays a circuit breaker fault code, it is determined that the front-end thermocouple sensor connected to the corresponding channel has an internal open circuit or a loose plug connection, and it is physically replaced in place. If the local digital display module (3) displays a stable reading that falls within the reasonable room temperature range of the current test environment, it is determined that the physical medium from the temperature measuring end of the front-end thermocouple sensor to the data acquisition terminal is in good condition, and the temperature value displayed by the local digital display module (3) at this time is recorded as the local reference temperature.

9. The test method for a K-type thermocouple connection architecture with integrated temperature channel detection according to claim 8, characterized in that, The specific logic for fault isolation and consistency verification of the front-end and back-end links is as follows: Compare the absolute value of the actual temperature difference between the remote temperature value and the local reference temperature; If the absolute value of the actual temperature difference is less than or equal to the maximum comprehensive temperature drift error preset by the system, then it is determined that the entire signal link consisting of the front-end thermocouple sensor, the K-type thermocouple connection architecture with integrated temperature channel detection, and the remote master data acquisition system is correctly matched and has good conductivity. If the absolute value of the actual temperature difference is greater than the maximum comprehensive temperature drift error, or if the channel of the remote master data acquisition system is continuously in a dead zone state with no data reporting, and provided that the front-end sensor has been determined to be undamaged, the fault point will be isolated in the back-end network, and the pin misalignment of the extension harness or the channel configuration mapping table of the master device will be directly checked.

10. The test method for a K-type thermocouple connection architecture with integrated temperature channel detection according to claim 9, characterized in that, After checking the back-end network, powering it back on, and triggering a second system verification, the remote temperature value obtained by the remote master data acquisition system is read again, and the absolute value of the actual temperature difference between the remote temperature value and the local reference temperature is calculated. The dynamic temperature rise test of the component under test is initiated when the absolute value of the actual temperature difference is determined to be less than or equal to the maximum comprehensive temperature drift error.

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