A test apparatus for integrated circuits

Abstract

This invention discloses a testing device for integrated circuits, relating to the technical field of integrated circuit testing. It includes a host and a base, as well as a limiting mechanism, multiple support rods, a gas guide cavity, and a fixing mechanism. The limiting mechanism is mounted on the host, and the multiple support rods are mounted on the upper end of the base. Each support rod includes a movable rod. The gas guide cavity is located inside the base and communicates with the driving end of each movable rod. The base has an interface for introducing pressurized gas into the gas guide cavity to drive all movable rods to extend synchronously. The fixing mechanism is mounted on the base and is used to selectively lock the position of each movable rod after it extends. This invention solves the problem that existing integrated circuit testing devices, which use rigid support platforms as support structures, cannot adapt to the uneven structure of the lower surface of the integrated circuit board, easily causing localized stress concentration, bending, or internal damage to the integrated circuit board. Furthermore, the support force cannot be automatically adjusted according to the unevenness of the lower surface, resulting in uneven force during testing.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit testing technology, specifically to a testing device for integrated circuits. Background Technology

[0002] After integrated circuit manufacturing is completed, its electrical performance needs to be tested using testing equipment to screen out qualified products and reject defective ones. Existing integrated circuit testing equipment typically includes a main unit, a base mounted on the main unit, and a test head positioned above the main unit, with multiple probes located below the test head. During testing, the integrated circuit board is placed on the base, and a limiting mechanism initially fixes the horizontal position of the integrated circuit board. Then, the test head is driven downwards, causing the probes to contact the contacts on the side or top surface of the integrated circuit board, thereby completing the testing of various electrical parameters. To prevent the integrated circuit board from bending or shifting during probe pressing, some testing equipment also have a support structure on the base, such as a rigid support platform, to support the integrated circuit board from below. The limiting mechanism often uses a screw-driven slot structure, and the width of the slot and the height of the pressure bar can be adjusted to accommodate integrated circuit boards of different sizes.

[0003] However, existing integrated circuit testing devices have the following drawbacks during use. The support structure above the base is mostly a rigid support platform. This rigid support platform, being a continuous planar structure, cannot accommodate uneven surfaces on the lower surface of the integrated circuit board (such as protrusions like surface-mount resistors and solder joints). When the integrated circuit board is pressed against the rigid support platform, the protruding parts of the lower surface experience concentrated pressure, easily leading to localized stress concentration and causing bending or internal damage to the integrated circuit board. Furthermore, the rigid support platform applies the same supporting force to all contact points, failing to automatically adjust the supporting force at each point according to the unevenness of the lower surface. This results in uneven stress on the integrated circuit board during testing, affecting the stability and reliability of the test. Therefore, to solve the aforementioned problems, an integrated circuit testing device is provided. Summary of the Invention

[0004] The purpose of this invention is to provide a testing device for integrated circuits, in order to solve the problems mentioned in the background art, that existing integrated circuit testing devices use rigid support platforms as support structures, which cannot adapt to the uneven structure of the lower surface of the integrated circuit board, easily causing local stress concentration, bending or internal damage to the integrated circuit board, and the support force cannot be automatically adjusted according to the unevenness of the lower surface, resulting in uneven force during the testing process.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a testing device for integrated circuits, comprising a host and a base mounted on top of the host, and further comprising a limiting mechanism, multiple support rods, an air guide cavity and a fixing mechanism; The limiting mechanism is installed on the host and is used to initially position the opposite sides of the integrated circuit board. Multiple support rods are installed on the upper end of the base. Each support rod includes a telescopic movable rod that extends upward to contact and support the lower surface of the integrated circuit board. The air guide chamber is located inside the base and is connected to the drive end of the movable rod of each support rod. The base is provided with an interface for introducing pressurized gas into the air guide chamber to drive all movable rods to extend synchronously. The fixing mechanism is installed on the base and is used to selectively lock the position of each movable rod after it extends.

[0006] In a further embodiment, the base is equipped with an air nozzle for connecting an air pump, through which pressurized gas is introduced into the air chamber.

[0007] In a further embodiment, two limiting mechanisms are provided and symmetrically arranged on both sides of the base. Each limiting mechanism includes a side box, a slot and a lead screw. The side box is fixed to the upper end of the main unit, the slot is slidably installed on the upper end of the side box, and the lead screw is rotatably installed on the side box. The lower end of the slot is threadedly connected to the lead screw, and the slot can be moved by rotating the lead screw.

[0008] In a further embodiment, the slot includes a sliding bar, a pressure bar, and an adjusting screw. The sliding bar is slidably mounted on the side box and its lower end is threaded to a screw. The pressure bar is slidably mounted above the sliding bar. The adjusting screw is rotatably connected to the sliding bar and one side of the pressure bar is threaded to the adjusting screw. The distance between the pressure bar and the sliding bar can be adjusted by rotating the adjusting screw.

[0009] In a further embodiment, the support rod also includes a sleeve, a mounting head, and a contact. The sleeve is fixedly inserted into the upper end of the base and is sealed to the base. The lower end of the sleeve communicates with the air guide cavity. The movable rod is slidably inserted into the upper end of the sleeve, and a sealing ring for sealing is sleeved on the outer side wall of the movable rod. The mounting head is fixedly connected to the upper end of the movable rod, and the contact is connected to the upper end of the mounting head. The contact can be replaced as needed, and the contact is used to contact the lower part of the integrated circuit board.

[0010] In a further embodiment, the movable rod initially slides downwards under its own weight to the bottom of the sleeve.

[0011] In a further embodiment, the fixing mechanism includes two fixing frames, a fixing screw, and a gear. The two fixing frames are centrally symmetrically arranged, and the crossbars of the two fixing frames are respectively clamped on the opposite sides of each movable rod. The fixing frames are provided with toothed grooves. The gear is rotatably installed on both sides of the upper end of the base. The gear meshes with the toothed grooves of the fixing frames and simultaneously meshes with the toothed grooves of both fixing frames. The fixing screw is rotatably installed on the upper end of the base, and the fixing frame located above is threadedly connected to the fixing screw.

[0012] In a further embodiment, when one fixed frame slides, it drives another fixed frame to slide synchronously and in the opposite direction via gears, so that the crossbars of the two fixed frames synchronously clamp or release the outer walls of each movable rod, and the movable rod is fixed by damping.

[0013] In a further embodiment, the inner wall of the fixing frame is provided with a rubber strip to prevent the fixing frame from abrading the outer wall of the movable rod, while increasing the damping force between the fixing frame and the movable rod.

[0014] In a further embodiment, a pressure detection device is also included, which is connected to the base and used to control the gas pressure inside the air guide cavity to prevent the movable rod from rising too forcefully, causing the contact to exert too much force on the integrated circuit board and thus bend the integrated circuit board.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention is a testing device for integrated circuits. By setting up multiple support rods and a gas guide cavity located inside the base and connected to the driving end of the movable rod of each support rod, when pressurized gas is introduced into the gas guide cavity, all movable rods extend synchronously and independently contact the lower surface of the integrated circuit board. Since the driving force on all movable rods is equal, each contact applies almost the same supporting force to the integrated circuit board. This solves the problem that the existing rigid support platform cannot adapt to the uneven structure of the lower surface of the integrated circuit board, which easily leads to local stress concentration and causes the integrated circuit board to bend or suffer internal damage. 2. By setting a fixing mechanism installed on the base and selectively locking the position of each movable rod after it extends, all movable rods can be locked in their current position after the equal pressure support is established. This avoids the movable rods from retracting or shifting due to air pressure fluctuations or vibrations during the test. At the same time, by setting a limiting mechanism installed on the host for preliminary positioning of the opposite sides of the integrated circuit board, the limiting mechanism and the support rod are coordinated to achieve stable constraint of the integrated circuit board in both the horizontal and vertical directions. This solves the problems of existing devices not being able to automatically adjust the support force according to the unevenness of the lower surface and uneven force during the test. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of an integrated circuit testing device proposed in this invention; Figure 2 This is a schematic diagram of the rear view structure of the base of an integrated circuit testing device proposed in this invention; Figure 3 This is a schematic diagram of the base structure of a test device for an integrated circuit proposed in this invention. Figure 4 This is a partial cross-sectional view of the base structure of a test device for integrated circuits proposed in this invention. Figure 5 This is a schematic diagram of the support rod and fixing mechanism installation structure of an integrated circuit testing device proposed in this invention; Figure 6 This is a schematic diagram of the fixing mechanism structure of an integrated circuit testing device proposed in this invention; Figure 7 This is an exploded view of the fixing mechanism of a test device for integrated circuits proposed in this invention. Figure 8 This is a schematic diagram of the support rod structure of an integrated circuit testing device proposed in this invention; Figure 9 This is an exploded view of the support rod structure of an integrated circuit testing device proposed in this invention. Figure 10 This is a cross-sectional view of the support rod of an integrated circuit testing device proposed in this invention; Figure 11 This is a schematic diagram of the limiting mechanism structure of an integrated circuit testing device proposed in this invention; Figure 12 This is a partial structural diagram of the limiting mechanism of an integrated circuit testing device proposed in this invention; Figure 13 This is an exploded view of the limiting mechanism of a test device for integrated circuits proposed in this invention.

[0017] In the diagram: 1. Main unit; 2. Base; 21. Air guide chamber; 22. Air nozzle; 3. Limiting mechanism; 31. Side box; 32. Slot; 321. Sliding bar; 322. Pressure bar; 323. Adjusting screw; 33. Lead screw; 4. Support rod; 41. Sleeve; 42. Movable rod; 421. Sealing ring; 43. Mounting head; 431. Contact; 5. Fixing mechanism; 51. Fixing frame; 52. Fixing screw; 53. Gear. Detailed Implementation

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figures 1-13 This embodiment provides a testing device for integrated circuits, including a host 1, such as... Figure 1As shown, a base 2 is mounted on top of the host 1. Two limiting mechanisms 3 are also mounted on the host 1, located symmetrically on both sides of the base 2. The limiting mechanisms 3 are used for preliminary positioning of the relative sides of the integrated circuit board. This preliminary positioning ensures that the horizontal position of the integrated circuit board is basically determined, creating favorable conditions for subsequent precise support and testing. Each limiting mechanism 3 includes a side box 31, a slot 32, and a lead screw 33. The side box 31 is fixedly connected to the upper end of the host 1, and the two side boxes 31 are symmetrically arranged on both sides of the base 2, providing a stable mounting base for the entire limiting mechanism 3. The slots 32 are slidably mounted on the upper end of the side box 31, and are used to clamp the sides of the integrated circuit board, thereby fixing the horizontal position of the integrated circuit board. The lead screw 33 is rotatably mounted on the side box 31, and the lower end of the slot 32 is threadedly connected to the lead screw 33. The slot 32 can be moved by rotating the lead screw 33. This lead screw 33 driving method has the advantages of easy operation and precise adjustment. The operator only needs to rotate the lead screw 33 to make the slot 32 move smoothly inward or outward, thereby adapting to integrated circuit boards of different widths.

[0020] like Figure 12 and Figure 13 As shown, the slot 32 includes a sliding bar 321, a pressure bar 322, and an adjusting screw 323. The sliding bar 321 is slidably mounted on the side box 31, and its lower end is threadedly connected to a lead screw 33. When the lead screw 33 rotates, it drives the sliding bar 321 to slide horizontally along the upper surface of the side box 31. The pressure bar 322 is slidably mounted above the sliding bar 321. The pressure bar 322 can move vertically above the sliding bar 321, thereby changing the vertical distance between it and the sliding bar 321. The adjusting screw 323 is rotatably connected to the sliding bar 321, and one side of the pressure bar 322 is threadedly connected to the adjusting screw 323. The distance between the pressure bar 322 and the sliding bar 321 can be adjusted by rotating the adjusting screw 323. The advantage of this structure is that the operator can adjust the height of the pressure strip 322 by rotating the adjusting screw 323 according to the actual thickness of the integrated circuit board, so that the pressure strip 322 is just pressed on the side of the integrated circuit board, which ensures the fixing effect without damaging the integrated circuit board due to excessive pressure. In use, the operator first rotates the lead screw 33 to move the sliding strip 321 closer to the base 2, and puts both sides of the integrated circuit board into the slots 32, that is, into the gap between the sliding strip 321 and the pressure strip 322. Then, by tightening the adjusting screw 323, the pressure strip 322 is moved downward, so that the pressure strip 322 presses on the side of the integrated circuit board, thus clamping one side of the integrated circuit board. The two slots 32 are used to fix the two sides of the integrated circuit board respectively, thereby completing the initial positioning of the integrated circuit board in the horizontal direction.

[0021] like Figure 2As shown, multiple support rods 4 are installed on the upper end of the base 2. These support rods 4 are arranged in a rectangular array. This array layout provides evenly distributed multi-point support for the integrated circuit board, effectively preventing bending or cracking due to excessive local stress during testing. Each support rod 4 includes a sleeve 41, a movable rod 42, a mounting head 43, and a contact 431. The sleeve 41 is fixedly inserted into the upper end of the base 2 and is sealed to the base 2. The lower end of the sleeve 41 communicates with the air guide chamber 21. This sealed connection ensures smooth gas flow between the air guide chamber 21 and the sleeve 41 without leakage. The movable rod 42 is slidably inserted into the upper end of the sleeve 41. The movable rod 42 can slide freely in the vertical direction within the sleeve 41. A sealing ring 421 is fitted onto the outer wall of the movable rod 42 for sealing. The sealing ring 421 ensures airtightness between the movable rod 42 and the sleeve 41, preventing pressurized gas from leaking out from the gap between the movable rod 42 and the sleeve 41. Mounting head 43 is fixedly connected to the upper end of movable rod 42, providing a mounting base for contact 431. Contact 431 is connected to the upper end of mounting head 43 and can be replaced as needed. Contact 431 is used to contact the underside of integrated circuit board and is mostly made of hard and insulating material. This replaceable contact 431 design has significant advantages. When testing different types of integrated circuit boards, operators can select the appropriate contact 431 shape and material according to the specific structure on the back of the integrated circuit board (such as whether there are surface mount resistors, whether there are protrusions, etc.), thereby achieving flexible contact with the integrated circuit board and avoiding damage to the electronic components on the back of the integrated circuit board by hard contact 431. In the initial state, movable rod 42 slides downward under its own weight to the bottom of sleeve 41. At this time, movable rod 42 is in the retracted state, and contact 431 is lower than the upper surface of base 2. The advantage of this design is that the support rod 4 will not interfere with the integrated circuit board when placing and removing it.

[0022] like Figure 2 and Figure 4As shown, the base 2 has an internal air guiding chamber 21, which is a sealed cavity capable of holding pressurized gas and connected to the lower end of the sleeve 41 of each support rod 4. An air nozzle 22 is connected to one side of the base 2, which is used to connect an air pump to inject gas into the air guiding chamber 21. When the air pump injects gas into the air guiding chamber 21 through the air nozzle 22, the pressure inside the air guiding chamber 21 gradually increases. Since the air guiding chamber 21 is connected to the lower end of each sleeve 41, the pressurized gas simultaneously enters the interior of each sleeve 41, pushing the movable rod 42 to slide upwards. All movable rods 42 slide upwards synchronously under the drive of gas pressure, driving the contact 431 upwards via the mounting head 43, ultimately contacting the lower end of the integrated circuit board. Because all movable rods 42 have equal piston areas and share the same air guiding chamber 21, the gas pressure inside the air guiding chamber 21 acts evenly on each movable rod 42, resulting in almost identical force applied to all contacts 431 when they contact the integrated circuit board. This characteristic of equal pressure support is one of the core innovations of this invention. Its beneficial effect is that regardless of whether the lower surface of the integrated circuit board is flat (e.g., there are surface mount resistors, solder joints or other protruding structures), each contact 431 can independently adapt to the local contour of the lower surface of the integrated circuit board and apply almost equal support force to the integrated circuit board. This avoids bending or internal stress concentration of the integrated circuit board due to excessive local support force, effectively protecting the integrity of the integrated circuit board and the stability of testing.

[0023] After the integrated circuit board is fixed by the two limiting mechanisms 3, the integrated circuit board is located above the base 2. At this time, the air pump is started to inject air into the air chamber 21 through the air nozzle 22. After the air chamber 21 is pressurized, it drives all the movable rods 42 to slide upward, so that each contact 431 contacts the lower end of the integrated circuit board. Since the same air chamber 21 is used for pressurization, the supporting force of all contacts 431 on the integrated circuit board is almost the same. This equal pressure support method is particularly suitable for integrated circuit boards with uneven structures such as surface mount resistors on the lower surface, and can provide stable and reliable support without damaging electronic components.

[0024] The base 2 is connected to a pressure detection device, which controls the gas pressure inside the air guide chamber 21 to prevent excessive force from the contact 431 on the integrated circuit board due to excessive upward force of the movable rod 42, which could cause the integrated circuit board to bend. The pressure detection device can monitor the pressure value inside the air guide chamber 21 in real time. When the pressure reaches a preset safety threshold, the pressure detection device sends a signal or automatically shuts off the air supply, thereby ensuring that the support force is always within a safe range. The advantage of this pressure control mechanism is that operators can preset appropriate air pressure values ​​according to the thickness, material, and structural characteristics of different integrated circuit boards, so that the support force is just enough to stabilize the integrated circuit board without causing any damage, achieving adaptive support for different types of integrated circuit boards.

[0025] A fixing mechanism 5 is installed on the base 2. The fixing mechanism 5 includes two fixing frames 51, fixing screws 52, and multiple gears 53. The two fixing frames 51 are centrally symmetrically arranged, and the crossbars of the two fixing frames 51 clamp the opposite sides of each movable rod 42. Specifically, multiple crossbars are arranged in the middle of the fixing frames 51, and the multiple crossbars are arranged in a manner corresponding to the array of movable rods 42. Each crossbar clamps the side of a row of movable rods 42. The fixing frames 51 are provided with toothed grooves, and the gears 53 are rotatably installed on both sides of the upper end of the base 2. The gears 53 mesh with the toothed grooves of the fixing frames 51, and the gears 53 mesh with the toothed grooves of both fixing frames 51 simultaneously. The fixing screws 52 are rotatably installed on the upper end of the base 2, and the fixing frames 51 located above are threadedly connected to the fixing screws 52. The beneficial effect of this gear 53 synchronous transmission mechanism is that when the operator rotates the fixing screw 52, ​​the fixing screw 52 drives a fixed bracket 51 threadedly connected to it to slide. When the fixed bracket 51 slides, it drives another fixed bracket 51 to slide synchronously and in the opposite direction through the gear 53. This allows the crossbars of the two fixed brackets 51 to synchronously clamp or release the outer walls of each movable rod 42, fixing the movable rod 42 through damping. The crossbars of the two fixed brackets 51 clamp on both sides of the movable rod 42. This double-sided clamping method makes the clamping force on the movable rod 42 more uniform, avoiding the deflection that may be caused by single-sided clamping.

[0026] The inner wall of the fixing frame 51 is provided with rubber strips. The beneficial effects of the rubber strips are: firstly, they prevent the fixing frame 51 from directly abrading the outer wall of the movable rod 42, extending the service life of the movable rod 42. Secondly, the rubber strips have a high coefficient of friction, which increases the damping force between the fixing frame 51 and the movable rod 42, allowing the movable rod 42 to remain stably in its current position after being clamped without slipping due to gravity or vibration. The fixing mechanism 5 performs the locking operation only after the movable rod 42 extends and contacts the integrated circuit board. This "support first, lock later" sequential design ensures that the movable rod 42 first adaptively contacts the lower surface of the integrated circuit board under gas pressure and establishes equal pressure support, and then the fixing mechanism 5 locks the position of each movable rod 42. In this way, even if the gas source is cut off or gas pressure fluctuations occur during the test, the movable rod 42 will not retract, thus always maintaining stable support for the integrated circuit board.

[0027] In use, the operator places the integrated circuit board above the base 2, with both sides of the board resting on the two sliding bars 321, positioning the sides of the board between the sliding bars 321 and the pressure bar 322. Then, the operator rotates the lead screw 33, moving the two sliding bars 321 inwards to position the sides of the integrated circuit board appropriately. Next, the operator rotates the adjusting screw 323, moving the pressure bar 322 downwards and pressing down on the sides of the integrated circuit board, completing the initial fixation of the board. Next, the operator starts the air pump, injecting pressurized gas into the air chamber 21 through the air nozzle 22. The increased pressure inside the air chamber 21 drives all the movable rods 42 to slide upwards synchronously, causing each contact 431 to contact the lower surface of the integrated circuit board. Because all contacts 431 experience equal driving force, the supporting force on the integrated circuit board is almost identical, maintaining stability under multi-point equal pressure support. The operator monitors the pressure value inside the air chamber 21 using a pneumatic pressure detection device to ensure the supporting force is within a safe range. Then, the operator rotates the fixing screw 52, ​​which drives the upper fixing bracket 51 to slide. The upper fixing bracket 51, through the gear 53, drives the lower fixing bracket 51 to slide synchronously in the opposite direction, so that the crossbars of the two fixing brackets 51 clamp all the movable rods 42 from both sides. The damping force provided by the rubber strip locks the movable rods 42 in the current position. At this time, the integrated circuit board is stably supported on multiple equal pressure contacts 431, and the probes and other testing equipment set on the host 1 can perform various electrical performance tests on the integrated circuit board. After the test is completed, the operator rotates the fixing screw 52 in the opposite direction, so that the two fixing brackets 51 release the movable rods 42. Then, the air pump is turned off and the pressure in the air guide chamber 21 is released through the pressure relief valve. The movable rods 42 slide down to the bottom of the sleeve 41 under their own gravity. Finally, the adjusting screw 323 is rotated in the opposite direction to release the pressure bar 322 from the integrated circuit board, and the lead screw 33 is rotated in the opposite direction to move the sliding bar 321 outward, so that the tested integrated circuit board can be removed.

[0028] Compared to existing integrated circuit testing equipment, which mostly uses rigid platforms or spring-loaded floating supports to support the integrated circuit board, rigid platforms cannot adapt to the uneven structure of the lower surface of the integrated circuit board, easily leading to local stress concentration and causing the integrated circuit board to bend or suffer internal damage. Although spring-loaded floating supports have a certain degree of self-adaptation, the supporting force of the spring is directly proportional to its compression. When there is an uneven structure on the lower surface of the integrated circuit board, the spring compression is large and the supporting force is large at the protrusions, while the spring compression is small and the supporting force is small at the depressions. This characteristic of the supporting force being positively correlated with the unevenness actually amplifies the adverse effects of the unevenness, thus increasing the risk of the integrated circuit board bending. This invention uses a structure in which a gas guide cavity 21 connects multiple support rods 4. Utilizing the principle of gas isobaric transmission, all contacts 431 apply almost equal supporting force to the integrated circuit board. Regardless of how uneven the lower surface of the integrated circuit board is, each contact 431 can independently adapt to the local contour and provide a consistent supporting force, fundamentally solving the technical problem of integrated circuit board bending caused by local overpressure.

[0029] Meanwhile, this invention also includes a gear 53 synchronous clamping and fixing mechanism 5 that cooperates with the array of movable rods 42. This mechanism locks all movable rods 42 in their current positions after the equal pressure support is established, ensuring the stability of the support force during testing and preventing support failure due to air pressure fluctuations or air source cutoff. Furthermore, this invention uses a slot 32-type limiting mechanism 3 driven by a lead screw 33 for initial positioning of the integrated circuit board. Used in conjunction with the equal pressure support rods 4, this achieves dual stable constraints on the integrated circuit board in both the horizontal and vertical directions, effectively improving the reliability and repeatability of the test. In summary, this invention achieves equal pressure adaptive support and stable locking of the integrated circuit board through a purely mechanical structure, offering outstanding advantages such as reliable structure, simple operation, no damage to the integrated circuit board, and high test stability.

[0030] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A testing device for integrated circuits, comprising a host (1) and a base (2) mounted above the host (1), characterized in that: It also includes a limiting mechanism (3), multiple support rods (4), an air guide chamber (21), and a fixing mechanism (5); The limiting mechanism (3) is installed on the host (1) and is used to initially position the opposite sides of the integrated circuit board. The multiple support rods (4) are installed on the upper end of the base (2). Each support rod (4) includes a telescopic movable rod (42) which is used to extend upward to contact and support the lower surface of the integrated circuit board. The air guide cavity (21) is located inside the base (2) and is connected to the driving end of the movable rod (42) of each support rod (4). The base (2) is provided with an interface for introducing pressurized gas into the air guide cavity (21) to drive all movable rods (42) to extend synchronously. The fixing mechanism (5) is installed on the base (2) and is used to selectively lock the position of each movable rod (42) after the movable rod (42) extends.

2. The integrated circuit testing apparatus according to claim 1, characterized in that: The base (2) is equipped with a nozzle (22), which is used to connect an air pump and introduce pressurized gas into the air chamber (21) through the air pump.

3. The integrated circuit testing apparatus according to claim 2, characterized in that: The limiting mechanism (3) is provided in two symmetrical arrangements on both sides of the base (2). Each limiting mechanism (3) includes a side box (31), a slot (32) and a screw (33). The side box (31) is fixed to the upper end of the host (1). The slot (32) is slidably installed on the upper end of the side box (31). The screw (33) is rotatably installed on the side box (31). The lower end of the slot (32) is threadedly connected to the screw (33). The slot (32) can be moved by rotating the screw (33).

4. The integrated circuit testing apparatus according to claim 3, characterized in that: The slot (32) includes a sliding bar (321), a pressure bar (322), and an adjusting screw (323). The sliding bar (321) is slidably mounted on the side box (31), and the lower end of the sliding bar (321) is threadedly connected to the screw (33). The pressure bar (322) is slidably mounted above the sliding bar (321). The adjusting screw (323) is rotatably connected to the sliding bar (321), and one side of the pressure bar (322) is threadedly connected to the adjusting screw (323). The distance between the pressure bar (322) and the sliding bar (321) can be adjusted by rotating the adjusting screw (323).

5. The integrated circuit testing apparatus according to claim 4, characterized in that: The support rod (4) also includes a sleeve (41), a mounting head (43), and a contact (431). The sleeve (41) is fixedly inserted into the upper end of the base (2) and the sleeve (41) is sealed to the base (2). The lower end of the sleeve (41) is connected to the air guide chamber (21). The movable rod (42) is slidably inserted into the upper end of the sleeve (41) and a sealing ring (421) for sealing is sleeved on the outer side wall of the movable rod (42). The mounting head (43) is fixedly connected to the upper end of the movable rod (42). The contact (431) is connected to the upper end of the mounting head (43) and the contact (431) can be replaced as needed. The contact (431) is used to contact the bottom of the integrated circuit board.

6. The integrated circuit testing apparatus according to claim 5, characterized in that: The movable rod (42) slides downwards under its own weight in the initial state and is located at the bottom of the sleeve (41).

7. The integrated circuit testing apparatus according to claim 6, characterized in that: The fixing mechanism (5) includes two fixing frames (51), a fixing screw (52), and a gear (53). The two fixing frames (51) are centrally symmetrically arranged, and the crossbars of the two fixing frames (51) are respectively clamped on the opposite sides of each movable rod (42). The fixing frames (51) are provided with tooth grooves. The gear (53) is rotatably installed on both sides of the upper end of the base (2). The gear (53) meshes on the tooth grooves of the fixing frames (51) and the gear (53) meshes on the tooth grooves of both fixing frames (51) at the same time. The fixing screw (52) is rotatably installed on the upper end of the base (2), and the fixing frame (51) located above is threadedly connected to the fixing screw (52).

8. The integrated circuit testing apparatus according to claim 7, characterized in that: When one of the fixed frames (51) slides, it drives the other fixed frame (51) to slide synchronously and in the opposite direction through the gear (53), so that the crossbars of the two fixed frames (51) synchronously clamp or release the outer wall of each movable rod (42), and fix the movable rod (42) through damping.

9. The integrated circuit testing apparatus according to claim 8, characterized in that: The inner wall of the fixing frame (51) is provided with a rubber strip to prevent the fixing frame (51) from abrading the outer wall of the movable rod (42) and to increase the damping force between the fixing frame (51) and the movable rod (42).

10. The integrated circuit testing apparatus according to claim 9, characterized in that: It also includes a pressure detection device, which is connected to the base (2) and used to control the gas pressure inside the air guide cavity (21) to prevent the movable rod (42) from rising too force, causing the contact (431) to exert too much force on the integrated circuit board and causing the integrated circuit board to bend.

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