Computing device

Abstract

This application provides a computing device. The computing device includes a computing board, a fixed cold plate, and a floating cold plate. A first surface of the computing board is provided with a first type of device and a second type of device, where the heat flux density of the first type of device is lower than that of the second type of device. The fixed cold plate and the floating cold plate are opposite to the first surface. The fixed cold plate is fixedly connected to the computing board, and the floating cold plate is connected to the fixed cold plate via an elastic connection structure, allowing the floating cold plate to float relative to the fixed cold plate along the thickness direction of the computing board. The first type of device is disposed between the fixed cold plate and the first surface, and the fixed cold plate is used for liquid cooling of the first type of device. The second type of device is disposed between the floating cold plate and the first surface, and the floating cold plate is pressed against the second type of device, also used for liquid cooling of the second type of device. This facilitates efficient heat dissipation of the computing device when there are many types and numbers of devices on the computing board requiring efficient heat dissipation.

Description

Technical Field

[0001] This application relates to the field of computing technology, and more particularly to a computing device. Background Technology

[0002] Computing devices such as servers include computing boards used for computation. As the performance of computing devices continues to improve, the variety and number of components on these boards requiring efficient heat dissipation are increasing. How to achieve efficient heat dissipation for computing devices when there are many such components on the board has become a pressing problem in the field of computing device design. Summary of the Invention

[0003] This application provides a computing device that facilitates efficient heat dissipation when there are many types and numbers of devices on the computing board that require efficient heat dissipation.

[0004] This application provides a computing device, which includes a computing board and a heat dissipation assembly. The computing board includes a first surface and a second surface located on both sides of the thickness direction of the computing board. The first surface is provided with a first type of device and a second type of device, wherein the heat flux density of the first type of device is less than the heat flux density of the second type of device.

[0005] The heat dissipation assembly includes a fixed cold plate and a floating cold plate. The fixed and floating cold plates face the first surface. The fixed cold plate is fixedly connected to the computing board, and the floating cold plate is connected to the fixed cold plate via an elastic connection structure, allowing it to float relative to the fixed cold plate along the thickness direction of the computing board. A first type of device is disposed between the fixed cold plate and the first surface, with the fixed cold plate providing liquid cooling for this device. A second type of device is disposed between the floating cold plate and the first surface, with the floating cold plate pressed against it, also providing liquid cooling for this device.

[0006] The heat dissipation assembly of the computing device provided in this application uses a floating cold plate to apply greater pressure to the second type of device with higher heat dissipation requirements, ensuring better thermal contact between the floating cold plate and the second type of device, thereby meeting the efficient heat dissipation needs of the second type of device. Simultaneously, since the first type of device has lower heat dissipation requirements, a fixed cold plate is used to dissipate heat from it, applying less pressure and ensuring that the first type of device is not easily damaged by excessive pressure. This solution can simultaneously meet the efficient heat dissipation needs of both the first type of device with lower heat flux density and the second type of device with higher heat flux density. Furthermore, the fixed and floating cold plates can provide different cooling capacities to the first and second types of devices, which helps to reduce heat waste while simultaneously meeting the efficient heat dissipation needs of both types of devices, resulting in high heat dissipation efficiency of the heat dissipation assembly. Thus, the heat dissipation assembly can meet the efficient heat dissipation needs of devices arranged on the same side of the computing board with different heat flux densities, facilitating efficient full liquid cooling of devices located on the first surface.

[0007] In some possible implementations, the first surface is provided with a plurality of first-type devices. The heat dissipation assembly also includes a first heat sink, which is disposed between the fixed cold plate and the plurality of first-type devices. The first heat sink is fixedly connected to the computing board and is pressed against the plurality of first-type devices. The fixed cold plate is pressed against the first heat sink and is used to perform liquid cooling heat dissipation on the plurality of first-type devices through the first heat sink.

[0008] In this way, when maintaining the second type of device, the fixed cold plate and the floating cold plate, it is only necessary to disassemble and assemble between the first heat sink and the fixed cold plate, instead of disassembling and assembling multiple first type devices. The number of disassembly and assembly steps required is small, and the positional accuracy requirements of the heat-conducting medium between the fixed cold plate and the first heat sink are low. This can achieve efficient heat dissipation for multiple first type devices while making the maintenance of the second type of device, the fixed cold plate and the floating cold plate more convenient.

[0009] In some possible implementations, at least one of the surfaces of the first heat sink facing the fixed cold plate and the fixed cold plate facing the first heat sink has a groove, and a first spring is provided in the groove. The two ends of the first spring abut against the first heat sink and the fixed cold plate, respectively, and the first spring is compressed between the first heat sink and the fixed cold plate.

[0010] In this way, the compressed first spring generates an elastic force opposite to the pressing direction of the first heat sink and the fixed cold plate. This elastic force makes it easier to separate the first heat sink from the fixed cold plate, and the floating cold plate from the second type of device, thus facilitating the maintenance of the computing device. Furthermore, placing the first spring within a groove facilitates the pressing of the fixed cold plate against the first heat sink.

[0011] In some possible implementations, the fixed cold plate is connected to the first heat sink via a first fastener passing through a groove along the thickness direction of the computing board, so that the fixed cold plate is pressed against the first heat sink, and a first spring is sleeved on the outside of the first fastener.

[0012] In this way, the first fastener can be used to fix the connection between the cold plate and the first heat sink, and it can also be used to position the first spring, making the structure between the cold plate and the first heat sink relatively simple and compact. In addition, the first spring is located at the first fastener that connects the cold plate and the first heat sink, which can make the connection between the cold plate and the first heat sink more stable and easier to assemble and disassemble.

[0013] In some possible implementations, the second surface is provided with a third type of device. The heat dissipation assembly also includes a second heat sink, which is opposite to the second surface and fixedly connected to the computing board. The third type of device is disposed between the second heat sink and the second surface, and the second heat sink is pressed against the third type of device. The second heat sink is used to dissipate heat from the third type of device.

[0014] In this way, the third type of device located on the second surface can dissipate heat through the second heat sink. Through the floating cold plate, the fixed cold plate, and the second heat sink, the devices located on both sides of the computing board can be efficiently cooled, which is conducive to achieving full liquid cooling of the devices located on the first and second surfaces.

[0015] In some possible implementations, the computing device also includes a liquid inlet pipe that is connected to the liquid inlet of the fixed cold plate via a conduit to supply liquid to the fixed cold plate, and the liquid inlet pipe is also connected to the liquid inlet of the floating cold plate via a flexible conduit to supply liquid to the floating cold plate.

[0016] The heat dissipation assembly also includes a heat-conducting component, which is connected to the surface of the second heat sink and the liquid inlet pipe, so that the liquid inlet pipe can perform liquid cooling heat dissipation on the third type of device through the heat-conducting component and the second heat sink.

[0017] In this way, the second heat sink can be extended to the liquid inlet pipe through the heat-conducting component, and liquid cooling can be carried out using the liquid inlet pipe. This makes the structure for liquid cooling of the third type of device relatively simple and easy to set up.

[0018] In some possible implementations, the computing device also includes a chassis, a computing board, and a heat dissipation assembly housed within the chassis. A fixed cold plate and a floating cold plate are positioned relative to the computing board near the chassis's base plate.

[0019] This design allows for full utilization of the space within the chassis along the thickness of the computing board to accommodate the heat dissipation components, making their placement easier and facilitating efficient heat dissipation for the components on both sides of the computing board. Furthermore, maintenance can be performed by removing the computing board; there is no need to disassemble the fixed and floating cold plates during servicing, making maintenance of the computing device more convenient.

[0020] In some possible implementations, the fixed cold plate is fixedly connected to the base plate, and the computing board is fixed to the base plate through the fixed cold plate, which makes it easier to disassemble and assemble the computing board and facilitates the maintenance of the computing device.

[0021] In some possible implementations, the heat dissipation assembly includes multiple floating cold plates, each of which is connected to a fixed cold plate via an independent elastic connection structure, such that each floating cold plate can float independently relative to the fixed cold plate along the thickness direction of the computing board.

[0022] In this way, different floating cold plates can be independently press-fitted to the second type of components with different heights and pressure requirements, thereby meeting the efficient heat dissipation needs of these components. Furthermore, when there are multiple floating cold plates and second type of components, each component can be maintained independently.

[0023] In some possible implementations, the fixed cold plate has a first clearance opening for accommodating at least one of the floating cold plate and the second type of device, so that the floating cold plate can be pressed against the second type of device.

[0024] This allows for a more flexible arrangement of the first and second types of devices, facilitating the liquid cooling of a larger area of ​​the first type of devices while simultaneously pressing the second type of devices, located between multiple first type devices, against the floating cold plate.

[0025] In some possible implementations, the resilient connection structure includes a second fastener and a second spring. The rod of the second fastener passes through a floating cold plate and is fixedly connected to a fixed cold plate. The floating cold plate can slide relative to the second fastener along the thickness direction of the computing board. The second spring is sleeved on the outside of the rod of the second fastener, with its two ends abutting against the floating cold plate and the head of the second fastener, respectively, allowing the floating cold plate to float relative to the fixed cold plate along the thickness direction of the computing board. The second spring is used to press the floating cold plate against the second type of device.

[0026] This makes it easy to connect the floating cold plate to the fixed cold plate in a floating manner. The head of the second fastener can be used to limit the floating range of the floating cold plate in the thickness direction of the calculation plate. The rod of the second fastener can be used to connect with the fixed cold plate and guide the second spring. The elastic connection structure is relatively simple and compact.

[0027] In some possible implementations, the surface of the fixed cold plate away from the computing board has a connecting hole. The floating cold plate includes a connecting portion located on the side of the fixed cold plate away from the first surface. The connecting portion has a communicating hole opposite the connecting hole, which extends through the connecting portion along the thickness direction of the computing board. The shank of a second fastener passes through the connecting hole and the communicating hole, and the head of the second fastener is located on the side of the connecting portion away from the fixed cold plate and spaced apart from the connecting portion.

[0028] This facilitates the connection between the fixed cold plate and the floating cold plate.

[0029] In some possible implementations, the computing device includes multiple computing boards and multiple sets of heat dissipation assemblies corresponding to each computing board. The heat dissipation assemblies are connected to the corresponding computing boards and are used to dissipate heat from the devices mounted on the corresponding computing boards.

[0030] In this way, when maintenance is required on a certain computing board, only that computing board and its corresponding heat dissipation components need to be disassembled and reassembled, without having to disassemble and reassemble other computing boards, making the maintenance of computing equipment more convenient. Attached Figure Description

[0031] Figure 1 A schematic diagram of a computing device provided in an embodiment of this application;

[0032] Figure 2 A schematic diagram of yet another computing device provided in an embodiment of this application;

[0033] Figure 3 A schematic diagram of yet another computing device provided in an embodiment of this application;

[0034] Figure 4 An exploded view of a computing device provided in an embodiment of this application;

[0035] Figure 5 A schematic diagram of yet another computing device provided in an embodiment of this application;

[0036] Figure 6 A schematic diagram of yet another computing device provided in an embodiment of this application;

[0037] Figure 7 This is an exploded view of another computing device provided in an embodiment of this application;

[0038] Figure 8 This is an exploded view of another computing device provided in an embodiment of this application;

[0039] Figure 9 A cross-sectional schematic diagram of a computing device provided in an embodiment of this application;

[0040] Figure 10 This is an exploded view of another computing device provided in an embodiment of this application;

[0041] Figure 11 A schematic diagram of yet another computing device provided in an embodiment of this application;

[0042] Figure 12 This is an exploded view of another computing device provided in an embodiment of this application.

[0043] Explanation of reference numerals in the attached figures:

[0044] 10. Chassis; 11. Base plate; 20. Computing module; 30. Manifold; 31. Liquid inlet pipe;

[0045] 100. Calculation board; 110. First surface; 120. Second surface;

[0046] 200, Heat dissipation assembly; 210, Fixed cold plate; 211, Fixed plate liquid pipe; 220, Floating cold plate; 220a, First floating cold plate; 220b, Second floating cold plate; 220c, Third floating cold plate; 220d, Fourth floating cold plate; 220e, Fifth floating cold plate; 220f, Sixth floating cold plate; 221, Connecting part; 230, First heat dissipation plate; 240, Second heat dissipation plate; 250, Heat-conducting component;

[0047] 310. First spring; 320. First fastener; 330. Third fastener;

[0048] 400. Elastic connection structure; 410. Second fastener; 420. Second spring;

[0049] D1, Class 1 device; D2, Class 2 device; D2a, Class 1 device; D2b, Class 2 device; D2c, Class 3 device; D2d, Class 4 device; D2e, Class 5 device; D2f, Class 6 device; D3, Class 3 device;

[0050] G, groove;

[0051] N1, First Escape Route; N2, Second Escape Route;

[0052] H1, connecting hole; H2, communicating hole;

[0053] x, first direction; y, second direction; z, third direction. Detailed Implementation

[0054] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0055] This application provides a computing device that can be applied to scenarios such as artificial intelligence, big data analysis, deep learning, and high-performance computing.

[0056] In some examples, the computing device may include, but is not limited to, servers, edge computing devices, micro data centers, cloud computing devices, artificial intelligence training devices, data processing devices, and industrial IoT devices. In some examples, the computing device may be a node; for example, it may be a GPU-accelerated node. For instance, the height of the computing device may be 1U.

[0057] Figure 1 This is a schematic diagram of a computing device provided in an embodiment of this application. In the diagram, the x-direction is a first direction, the y-direction is a second direction, and the z-direction is a third direction. The first direction can be the length direction of the computing device, the second direction can be the width direction of the computing device, and the third direction can be the height direction of the computing device.

[0058] like Figure 1 As shown, the computing device includes a chassis 10 and a computing module 20. The computing module 20 is housed inside the chassis 10 and fixedly connected to the chassis 10. The computing module 20 is used to provide computing power to realize computing functions.

[0059] For example, computing module 20 may include, but is not limited to, a motherboard module, a computing acceleration module, etc. For instance, computing module 20 may be an Open Accelerator (OCP) module (OAM) module.

[0060] For example, a computing device may include one or more computing modules 20.

[0061] like Figure 1 As shown, the computing device also includes a manifold 30, which is connected to the computing module 20 through a pipe to allow cooling medium to enter and exit the computing module 20, thereby enabling liquid cooling of the computing module 20.

[0062] For example, the manifold 30 includes an inlet pipe 31 and an outlet pipe (not shown), which are connected to the computing module 20. The inlet pipe 31 is used to supply liquid to the computing module 20, and the cooling medium flowing out of the computing module 20 flows into the outlet pipe.

[0063] Figure 2 This is a schematic diagram of yet another computing device provided in an embodiment of this application. Figure 3 This is a schematic diagram of yet another computing device provided in an embodiment of this application. Figure 2 and Figure 3 The perspectives are different.

[0064] like Figure 2 , Figure 3 As shown, the computing module 20 includes a computing board 100 for computing, which is disposed within the chassis 10. For example, the computing board 100 can be a motherboard or an OAM board, etc. The first direction is the length direction of the computing board 100, the second direction is the width direction of the computing board 100, and the third direction is the thickness direction of the computing board 100.

[0065] The computing board 100 includes a first surface 110 and a second surface 120 located on both sides of the thickness direction of the computing board 100. The first surface 110 is provided with a first type of device D1 and a second type of device D2, wherein the heat flux density of the first type of device D1 is less than the heat flux density of the second type of device D2.

[0066] For example, the first type of device D1 may include, but is not limited to, a power supply module, a voltage regulator module, a switching transistor, memory, a network card, etc. The second type of device D2 may include, but is not limited to, a GPU acceleration chip, a central processing unit, etc. For instance, when the computing board 100 is an OAM board, the first type of device D1 may be a power supply module, a switching transistor, memory, etc., and the second type of device D2 may be a GPU acceleration chip, etc. As another example, when the computing board 100 is a motherboard, the first type of device D1 may be a voltage regulator module, memory, a network card, etc., and the second type of device D2 may be a central processing unit, etc.

[0067] For example, the first surface 110 may be provided with a plurality of first-type devices D1.

[0068] For example, the first surface 110 may be provided with a plurality of second-type devices D2. For instance, the first surface 110 may be provided with six second-type devices D2, namely a first device D2a, a second device D2b, a third device D2c, a fourth device D2d, a fifth device D2e, and a sixth device D2f. The first device D2a, the second device D2b, the fourth device D2d, and the fifth device D2e may be bare chips, while the third device D2c and the sixth device D2f may be SOC chips.

[0069] In some examples, the second surface 120 is provided with a third type of device D3, that is, both the first surface 110 and the second surface 120 of the computing board 100 are provided with devices, so that the computing board 100 can have a high device arrangement density.

[0070] For example, the third type of device D3 can be memory, etc.

[0071] For example, the second surface 120 may be provided with a plurality of third-class devices D3.

[0072] Figure 4 This is an exploded view of a computing device provided in an embodiment of this application.

[0073] like Figure 4 As shown, the computing module 20 also includes a heat dissipation assembly 200, which is located inside the chassis 10. The heat dissipation assembly 200 is connected to the computing board 100 and is used to dissipate heat from the devices on the computing board 100.

[0074] For example, the heat dissipation component 200 is used to dissipate heat for at least one of the first type of device D1, the second type of device D2, and the third type of device D3.

[0075] In some examples where the computing device includes multiple computing modules 20, each computing module 20 includes a computing board 100 and a corresponding heat dissipation assembly 200. That is, the computing device includes multiple computing boards 100 and multiple sets of heat dissipation assemblies 200 corresponding one-to-one with each computing board 100. The heat dissipation assembly 200 is connected to the corresponding computing board 100 and is used to dissipate heat from the devices disposed on the corresponding computing board 100.

[0076] In this way, when maintenance is required on a certain computing board 100, only that computing board 100 and the corresponding heat dissipation component 200 need to be disassembled and reassembled, without needing to disassemble and reassemble other computing boards 100, making the maintenance of computing equipment more convenient.

[0077] In some examples, the computing board 100 is provided with an inter-board connector (not shown), and different computing boards 100 are connected through the inter-board connector and flexible connection components to realize signal interaction between different computing boards 100. In this way, different computing boards 100 do not need to realize signal interaction through circuit boards stacked in the thickness direction of the computing board 100, which helps to save space in the thickness direction of the computing board 100 and facilitates the arrangement of the heat dissipation component 200.

[0078] For example, flexible connection components may include, but are not limited to, cables, flexible circuit boards, etc.

[0079] like Figure 4 As shown, the heat dissipation assembly 200 includes a fixed cold plate 210 and a floating cold plate 220.

[0080] The fixed cold plate 210 and the floating cold plate 220 are opposite to the first surface 110. The fixed cold plate 210 is fixedly connected to the calculation board 100, and the floating cold plate 220 is connected to the fixed cold plate 210 through the elastic connection structure 400. The floating cold plate 220 can float relative to the fixed cold plate 210 along the thickness direction of the calculation board 100.

[0081] The first type of device D1 is disposed between the fixed cold plate 210 and the first surface 110, and the fixed cold plate 210 is used to perform liquid cooling heat dissipation on the first type of device D1. The second type of device D2 is disposed between the floating cold plate 220 and the first surface 110, and the floating cold plate 220 is pressed onto the second type of device D2, and the floating cold plate 220 is used to perform liquid cooling heat dissipation on the second type of device D2.

[0082] In this way, the heat dissipation assembly 200 applies greater pressure to the second type of device D2, which has a higher heat dissipation demand, through the floating cold plate 220, ensuring better thermal contact between the floating cold plate 220 and the second type of device D2, thereby meeting the efficient heat dissipation requirements of the second type of device D2. Simultaneously, since the first type of device D1 has a lower heat dissipation demand, the fixed cold plate 210 dissipates heat from the first type of device D1, applying less pressure to it, ensuring that the first type of device D1 is not easily damaged by excessive pressure. This solution can simultaneously meet the efficient heat dissipation requirements of both the first type of device D1 (lower heat flux density) and the second type of device D2 (higher heat flux density). Furthermore, the fixed cold plate 210 and the floating cold plate 220 can provide different amounts of cooling to the first type of device D1 and the second type of device D2, which helps to reduce the waste of cooling capacity while simultaneously meeting the efficient heat dissipation requirements of both devices, resulting in higher heat dissipation efficiency of the heat dissipation assembly 200. In this way, the heat dissipation component 200 can meet the high-efficiency heat dissipation requirements of devices arranged on the same side of the computing board 100 and with different heat flux densities, which is conducive to achieving efficient full liquid cooling heat dissipation of devices located on the first surface 110.

[0083] For example, manifold 30 is connected to fixed cold plate 210 via a pipe to allow cooling medium to enter and exit fixed cold plate 210, thereby achieving liquid cooling heat dissipation for the first type of device D1. Manifold 30 is also connected to floating cold plate 220 via a flexible pipe to allow cooling medium to enter and exit floating cold plate 220, thereby achieving liquid cooling heat dissipation for the second type of device D2.

[0084] Specifically, the inlet pipe 31 is connected to the inlet of the fixed cold plate 210 via a pipeline to supply liquid to the fixed cold plate 210, and the outlet pipe is connected to the outlet of the fixed cold plate 210 via a pipeline, allowing the cooling medium flowing out of the fixed cold plate 210 to flow into the outlet pipe. The inlet pipe 31 is also connected to the inlet of the floating cold plate 220 via a flexible pipeline to supply liquid to the floating cold plate 220, and the outlet pipe is connected to the outlet of the floating cold plate 220 via a flexible pipeline, allowing the cooling medium flowing out of the floating cold plate 220 to flow into the outlet pipe.

[0085] For example, the manifold 30 can be connected to the fixed cold plate 210 through a flexible pipe. That is, the liquid inlet pipe 31 can be connected to the liquid inlet of the fixed cold plate 210 through a flexible pipe, and the liquid outlet pipe can be connected to the liquid outlet of the fixed cold plate 210 through a flexible pipe.

[0086] For example, flexible piping may include, but is not limited to, hoses, corrugated pipes, etc.

[0087] For example, the floating cold plate 220 can be pressed onto the second type of device D2 via a first thermally conductive medium. For example, the first thermally conductive medium may include, but is not limited to, a phase change film, a thermal pad, or silicone grease.

[0088] For example, the floating cold plate 220 can be connected to the fixed cold plate 210 through multiple elastic connection structures 400, so that the floating cold plate 220 has good floating stability. For example, the floating cold plate 220 can be a rectangular structure, and the floating cold plate 220 can be connected to the fixed cold plate 210 through four elastic connection structures 400 located at the four corners of the floating cold plate 220.

[0089] In some exemplary cases where a plurality of first-type devices D1 are provided on the first surface 110, the heat dissipation assembly 200 further includes a first heat sink 230. The first heat sink 230 is disposed between the fixed cold plate 210 and the plurality of first-type devices D1. The first heat sink 230 is fixedly connected to the computing board 100. The first heat sink 230 is pressed against the plurality of first-type devices D1. The fixed cold plate 210 is pressed against the first heat sink 230. The fixed cold plate 210 is used to perform liquid cooling heat dissipation on the plurality of first-type devices D1 through the first heat sink 230.

[0090] In this way, when maintaining the second type of device D2, the fixed cold plate 210 and the floating cold plate 220, it is only necessary to disassemble and assemble between the first heat sink 230 and the fixed cold plate 210, instead of disassembling and assembling multiple first type of devices D1. The number of disassembly and assembly steps is reduced, and the positional accuracy requirements of the heat-conducting medium between the fixed cold plate 210 and the first heat sink 230 are lower. This can achieve efficient heat dissipation for multiple first type of devices D1 while making the maintenance of the second type of device D2, the fixed cold plate 210 and the floating cold plate 220 more convenient.

[0091] When the first heat sink 230 is provided, the heat generated by the first type of device D1 is transferred to the fixed cold plate 210 through the first heat sink 230.

[0092] For example, the first heat sink 230 is pressed onto the first type of device D1 through the second thermal conductive medium. That is, each first type of device D1 and the first heat sink 230 are provided with a corresponding second thermal conductive medium, and each first type of device D1 is pressed onto the first heat sink 230 through the corresponding second thermal conductive medium.

[0093] For example, the second thermally conductive medium may include, but is not limited to, a phase change film, a thermal pad, or silicone grease.

[0094] For example, first-type devices D1 of different heights can be pressed together with the first heat sink 230 by a second thermally conductive medium of different thicknesses to meet the high-efficiency heat dissipation requirements of first-type devices D1 of different heights.

[0095] For example, the surface of the first heat sink 230 facing the computing board 100 has multiple pressing surfaces of different heights. The pressing surfaces of different heights are pressed with the first type of device D1 of different heights to meet the high-efficiency heat dissipation requirements of the first type of device D1 of different heights.

[0096] For example, the fixed cold plate 210 is pressed onto the first heat dissipation plate 230 through a third heat-conducting medium.

[0097] For example, the third thermally conductive medium may include, but is not limited to, a phase change film, a thermal pad, or silicone grease.

[0098] When maintaining the second type of device D2, the fixed cold plate 210 and the floating cold plate 220, only the third heat-conducting medium between the fixed plate and the first heat sink 230 needs to be replaced, without replacing the second heat-conducting medium on the first type of device D1. The number of third heat-conducting media is small and the positional accuracy requirement is low, which makes the maintenance of the second type of device D2, the fixed cold plate 210 and the floating cold plate 220 more convenient.

[0099] In some examples, the fixed cold plate 210 can also be pressed onto the first type of device D1.

[0100] like Figure 4 As shown, in some possible embodiments, the heat dissipation assembly 200 further includes a second heat dissipation plate 240. The second heat dissipation plate 240 is opposite to the second surface 120 and is fixedly connected to the computing board 100. The third type device D3 is disposed between the second heat dissipation plate 240 and the second surface 120. The second heat dissipation plate 240 is pressed onto the third type device D3, and the second heat dissipation plate 240 is used to dissipate heat from the third type device D3.

[0101] In this way, the third type of device D3 located on the second surface 120 can dissipate heat through the second heat sink 240. Through the floating cold plate 220, the fixed cold plate 210 and the second heat sink 240, the devices located on both sides of the computing board 100 can be efficiently cooled, which is conducive to realizing full liquid cooling of the devices located on the first surface 110 and the second surface 120.

[0102] For example, the second heat sink 240 can be press-fitted to the third type of device D3 via a fourth thermally conductive medium.

[0103] For example, the fourth thermally conductive medium may include, but is not limited to, a phase change film, a thermal pad, or silicone grease.

[0104] For example, the second heat sink 240 is pressed onto a plurality of third-type devices D3, and the second heat sink 240 is used to dissipate heat from the plurality of third-type devices D3.

[0105] For example, the second surface 120 may also be provided with a fourth type of device. The fourth type of device is not opposite to the second heat sink 240. That is, the fourth type of device is located outside the orthographic projection of the second heat sink 240 on the second surface. The fourth type of device can dissipate heat through natural heat dissipation or air cooling.

[0106] Figure 5 This is a schematic diagram of another computing device provided in an embodiment of this application.

[0107] like Figure 5 As shown, in some possible implementations, the heat dissipation assembly 200 includes a plurality of floating cold plates 220, each floating cold plate 220 being connected to a fixed cold plate 210 via an independent elastic connection structure 400, such that each floating cold plate 220 can float independently relative to the fixed cold plate 210 along the thickness direction of the computing board 100.

[0108] In this way, different floating cold plates 220 can be independently pressed onto the second type of device D2 with different heights and pressure requirements to meet the efficient heat dissipation requirements of the second type of device D2 with different heights and pressure requirements. In addition, when there are multiple floating cold plates 220 and second type of device D2, the floating cold plates 220 and the second type of device D2 can be maintained independently.

[0109] For example, the floating cold plate 220 corresponds one-to-one with the second type device D2. The second type device D2 is disposed between the corresponding floating cold plate 220 and the first surface 110. The floating cold plate 220 is pressed against the corresponding second type device D2. The floating cold plate 220 is used to perform liquid cooling heat dissipation on the corresponding second type device D2, so as to apply appropriate pressure to each second type device D2 and provide appropriate cooling capacity.

[0110] For example, at least some of the floating cold plates 220 can be connected by flexible pipes, so that while the utilization rate of the cold energy in the cooling medium is high, each floating cold plate 220 can float independently.

[0111] In some examples where a first device D2a, a second device D2b, a third device D2c, a fourth device D2d, a fifth device D2e, and a sixth device D2f are provided on the first surface 110, the heat dissipation assembly 200 includes six floating cold plates 220. The six floating cold plates 220 are respectively the first floating cold plate 220a corresponding to the first device D2a, the second floating cold plate 220b corresponding to the second device D2b, the third floating cold plate 220c corresponding to the third device D2c, the fourth floating cold plate 220d corresponding to the fourth device D2d, the fifth floating cold plate 220e corresponding to the fifth device D2e, and the sixth floating cold plate 220f corresponding to the sixth device D2f.

[0112] A first device D2a is disposed between a first floating cold plate 220a and a first surface 110, with the first floating cold plate 220a pressed against it. The first floating cold plate 220a is used for liquid cooling of the first device D2a. A second device D2b is disposed between a second floating cold plate 220b and a first surface 110, with the second floating cold plate 220b pressed against it. The second floating cold plate 220b is used for liquid cooling of the second device D2b. A third device D2c is disposed between a third floating cold plate 220c and a first surface 110, with the third floating cold plate 220c pressed against it. The third floating cold plate 220c is used for liquid cooling of the third device D2c. A fourth device D2d is disposed between a fourth floating cold plate 220d and a first surface 110, with the fourth floating cold plate 220d pressed against it. The fourth floating cold plate 220d is used for liquid cooling of the fourth device D2d. The fifth device D2e is disposed between the fifth floating cold plate 220e and the first surface 110. The fifth floating cold plate 220e is pressed against the fifth device D2e and is used for liquid cooling of the fifth device D2e. The sixth device D2f is disposed between the sixth floating cold plate 220f and the first surface 110. The sixth floating cold plate 220f is pressed against the sixth device D2f and is used for liquid cooling of the sixth device D2f.

[0113] Figure 6 This is a schematic diagram of another computing device provided in an embodiment of this application.

[0114] like Figure 5 , Figure 6As shown, in some examples, the liquid inlet of the first floating cold plate 220a and the liquid inlet of the second floating cold plate 220b are respectively connected to the liquid inlet pipe 31 via flexible pipes, and the liquid outlet of the first floating cold plate 220a and the liquid outlet of the second floating cold plate 220b are respectively connected to the liquid inlet of the third floating cold plate 220c via flexible pipes. That is, the first floating cold plate 220a and the second floating cold plate 220b are connected in parallel between the third floating cold plate 220c and the liquid inlet pipe 31, and the liquid outlet of the third floating cold plate 220c is connected to the liquid outlet pipe via flexible pipes. In this way, the temperature difference of the cooling medium flowing into the first floating cold plate 220a and the second floating cold plate 220b can be smaller, which is beneficial to meeting the heat dissipation requirements of the small temperature difference between the first device D2a and the second device D2b. Furthermore, the cooling medium flowing out from the first floating cold plate 220a and the second floating cold plate 220b enters the third floating cold plate 220c to dissipate heat from the third device D2c. This results in a high utilization rate of the cooling medium's cooling capacity. In addition, the flow rate of the cooling medium flowing through the third floating cold plate 220c is relatively large, which is beneficial for the efficient heat dissipation of the third device D2c.

[0115] In some examples, the liquid inlets of the first floating cold plate 220a, the second floating cold plate 220b, the fourth floating cold plate 220d, and the fifth floating cold plate 220e are connected to the liquid inlet pipe 31 via flexible pipes. The liquid outlets of the first floating cold plate 220a and the second floating cold plate 220b are connected to the liquid inlet of the third floating cold plate 220c via flexible pipes. The liquid outlets of the fourth floating cold plate 220d and the fifth floating cold plate 220e are connected to the liquid inlet of the sixth floating cold plate 220f via flexible pipes. The liquid outlets of the third floating cold plate 220c and the sixth floating cold plate 220f are connected to the liquid outlet pipe via flexible pipes. In other words, the first floating cold plate 220a and the second floating cold plate 220b are connected in parallel between the third floating cold plate 220c and the inlet pipe 31, and the fourth floating cold plate 220d and the fifth floating cold plate 220e are connected in parallel between the sixth floating cold plate 220f and the inlet pipe 31. The flow path formed by the first floating cold plate 220a, the second floating cold plate 220b and the third floating cold plate 220c and the flow path formed by the fourth floating cold plate 220d, the fifth floating cold plate 220e and the sixth floating cold plate 220f are connected in parallel between the inlet pipe 31 and the outlet pipe.

[0116] This design allows for a smaller temperature difference between the cooling media flowing into the first floating cold plate 220a, the second floating cold plate 220b, the fourth floating cold plate 220d, and the fifth floating cold plate 220e, thus facilitating the heat dissipation of the smaller temperature difference between the first device D2a, the second device D2b, the fourth device D2d, and the fifth device D2e. Furthermore, the cooling media flowing out from the first floating cold plate 220a and the second floating cold plate 220b enters the third floating cold plate 220c to dissipate heat from the third device D2c, and the cooling media flowing out from the fourth floating cold plate 220d and the fifth floating cold plate 220e enters the sixth floating cold plate 220f to dissipate heat from the sixth device D2f. This results in a high utilization rate of the cooling medium's cooling capacity. Additionally, the larger flow rate of the cooling medium flowing through the third floating cold plate 220c and the sixth floating cold plate 220f further facilitates efficient heat dissipation for the third device D2c and the sixth device D2f. Furthermore, the flow path formed by the first floating cold plate 220a, the second floating cold plate 220b, and the third floating cold plate 220c, and the flow path formed by the fourth floating cold plate 220d, the fifth floating cold plate 220e, and the sixth floating cold plate 220f, are connected in parallel between the liquid inlet pipe 31 and the liquid outlet pipe. This reduces the flow resistance of the cooling medium, resulting in higher energy efficiency of liquid cooling and better liquid cooling effect on the second type of device D2.

[0117] Figure 7 This is an exploded view of another computing device provided in an embodiment of this application.

[0118] like Figure 7 As shown, for example, the fixed cold plate 210 has a first clearance opening N1, which is used to avoid at least one of the floating cold plate 220 and the second type of device D2, so that the floating cold plate 220 can be pressed against the second type of device D2. In this way, the arrangement of the first type of device D1 and the second type of device D2 can be more flexible, which makes it convenient to arrange a larger fixed cold plate 210 to perform liquid cooling heat dissipation on a larger area of ​​the first type of device D1, while pressing the second type of device D2 located between multiple first type of devices D1 against the floating cold plate 220.

[0119] For example, at least one of the floating cold plate 220 and the second type of device D2 can be inserted into the first clearance opening N1.

[0120] In some examples where the heat dissipation assembly 200 includes multiple floating cold plates 220, the fixed cold plate 210 has multiple first clearance openings N1 corresponding one-to-one with the floating cold plate 220. The first clearance openings N1 are used to avoid at least one of the corresponding floating cold plate 220 and the second type of device D2 pressed by the corresponding floating cold plate 220.

[0121] For example, the fixed cold plate 210 surrounds the first clearance N1, that is, the first clearance N1 is surrounded by the fixed cold plate 210, which makes the fixed cold plate 210 have good structural strength.

[0122] Figure 8 This is an exploded view of another computing device provided in an embodiment of this application. Figure 8 The fixed cold plate 210 in the middle has been made transparent.

[0123] like Figure 8 As shown, for example, the fixed cold plate 210 includes a fixed plate liquid pipe 211, which forms a flow channel for the fixed cold plate 210. The fixed plate liquid pipe 211 surrounds the fixed cold plate 210 to facilitate the cooling medium flowing through the fixed plate liquid pipe 211 to fully remove the heat from the fixed cold plate 210.

[0124] For example, the first clearance port N1 and the floating cold plate 220 are located inside the annular structure formed by the fixed plate liquid pipe 211, and the arrangement of the first clearance port N1 and the floating cold plate 220 is not likely to interfere with the fixed plate liquid pipe 211.

[0125] For example, the fixed plate liquid pipe 211 includes a first pipe and a second pipe. The liquid inlet of the fixed cold plate 210 is provided with a liquid separator, and the liquid outlet of the fixed cold plate 210 is provided with a liquid combiner. The first pipe and the second pipe are connected in parallel between the liquid separator and the liquid combiner. The first pipe and the second pipe respectively surround different halves of the fixed cold plate 210. The liquid separator is connected to the liquid inlet pipe 31, and the liquid combiner is connected to the liquid outlet pipe. In this way, the temperature of the fixed cold plate 210 can be more uniform, which is beneficial for the even heat dissipation of multiple first-type devices D1.

[0126] In some examples where the heat dissipation assembly 200 includes a first heat dissipation plate 230, the first heat dissipation plate 230 has a second clearance opening N2. The second clearance opening N2 is used to avoid at least one of the floating cold plate 220 and the second type device D2, so that the floating cold plate 220 can be pressed against the second type device D2. In this way, it is convenient to arrange a larger size first heat dissipation plate 230 to press against a larger area of ​​the first type device D1, while pressing the second type device D2 located between multiple first type devices D1 against the floating cold plate 220, so that the arrangement of the first type device D1 and the second type device D2 is more flexible.

[0127] For example, at least one of the floating cold plate 220 and the second type of device D2 may be inserted into the second clearance opening N2.

[0128] In some examples where the heat dissipation assembly 200 includes multiple floating cold plates 220, the first heat dissipation plate 230 has multiple second clearance openings N2 corresponding one-to-one with the floating cold plate 220. The second clearance openings N2 are used to avoid at least one of the corresponding floating cold plate 220 and the second type of device D2 pressed by the corresponding floating cold plate 220.

[0129] For example, the first heat sink 230 surrounds the second clearance opening N2, that is, the second clearance opening N2 is surrounded by the first heat sink 230, which makes the first heat sink 230 have good structural strength.

[0130] For example, the first clearance N1 and the second clearance N2 are opposite to the same floating cold plate 220.

[0131] Figure 9 This is a cross-sectional schematic diagram of a computing device provided in an embodiment of this application.

[0132] like Figure 9 As shown, in some possible embodiments, at least one of the surfaces of the first heat sink 230 facing the fixed cold plate 210 and the fixed cold plate 210 facing the first heat sink 230 has a groove G. A first spring 310 is provided in the groove G. The two ends of the first spring 310 abut against the first heat sink 230 and the fixed cold plate 210 respectively. The first spring 310 is compressed between the first heat sink 230 and the fixed cold plate 210.

[0133] After the first heat sink 230 is disconnected from the fixed cold plate 210, a relatively large force is often required to separate the first heat sink 230 from the fixed cold plate 210 and the floating cold plate 220 from the second type of device D2 due to the effect of the heat-conducting medium. By setting a compressed first spring 310 between the first heat sink 230 and the fixed cold plate 210, the compressed first spring 310 generates an elastic force opposite to the pressing direction of the first heat sink 230 and the fixed cold plate 210. The elastic force of the first spring 310 makes it easier to separate the first heat sink 230 from the fixed cold plate 210 and the floating cold plate 220 from the second type of device D2, which is beneficial for the maintenance of the computing device. In addition, placing the first spring 310 in the groove G facilitates the pressing of the fixed cold plate 210 and the first heat sink 230.

[0134] For example, the first spring 310, which is compressed by the first heat sink 230 and the fixed cold plate 210, is used to provide a force on the fixed cold plate 210 and the first heat sink 230 along the thickness direction of the computing board 100.

[0135] For example, a plurality of first springs 310 are provided between the first heat sink 230 and the fixed cold plate 210, so that a large force can be provided on the fixed cold plate 210 and the first heat sink 230, so as to facilitate the separation of the first heat sink 230 from the fixed cold plate 210 after the first heat sink 230 is disconnected from the fixed cold plate 210, and to facilitate the separation of the floating cold plate 220 from the second type of device D2.

[0136] For example, eight first springs 310 may be provided between the first heat sink 230 and the fixed cold plate 210. When the first heat sink 230 and the fixed cold plate 210 are fixed, each first spring 310 can provide an elastic force of 5 kg, and the eight first springs 310 can provide a total elastic force of 40 kg. After the first heat sink 230 and the fixed cold plate 210 are disconnected, the fixed cold plate 210 and the floating cold plate 220 can be separated from the second type of device D2 by the action of the eight first springs 310.

[0137] For example, the surface of the first heat sink 230 facing the fixed cold plate 210 has a groove G, which makes it easier to set the groove G and the groove G is less likely to affect the flow path of the fixed cold plate 210.

[0138] In the example where multiple first springs 310 are provided between the first heat sink 230 and the fixed cold plate 210, the surface of the first heat sink 230 facing the fixed cold plate 210 has multiple grooves G that correspond one-to-one with the first springs 310. The first springs 310 are provided in the corresponding grooves G to limit the first springs 310 and make the first springs 310 less likely to move at will.

[0139] For example, the first spring 310 is fixedly connected to the first heat sink 230, so that after the first heat sink 230 is separated from the fixed cold plate 210, the first spring 310 can move with the first heat sink 230, the first spring 310 is not easy to lose, and the assembly between the first heat sink 230 and the fixed cold plate 210 is also relatively easy.

[0140] For example, the first spring 310 can be fixedly connected to the first heat sink 230 by means of bonding, welding or other methods.

[0141] In some possible implementations, the fixed cold plate 210 is connected to the first heat sink 230 by a first fastener 320 passing through the groove G along the thickness direction of the calculation plate 100, so that the fixed cold plate 210 is pressed against the first heat sink 230, and the first spring 310 is sleeved on the outside of the first fastener 320.

[0142] In this way, the first fastener 320 can be used to fix the connection between the cold plate 210 and the first heat sink 230, and can also be used to position the first spring 310. The structure between the cold plate 210 and the first heat sink 230 is relatively simple and compact. In addition, the first spring 310 is located at the first fastener 320 that connects the cold plate 210 and the first heat sink 230, which can make the connection between the cold plate 210 and the first heat sink 230 more stable and easier to assemble and disassemble.

[0143] For example, the first fastener 320 can be a threaded fastener, which can be threadedly connected to the fixed cold plate 210 to facilitate the assembly and disassembly of the fixed cold plate 210 and the first heat sink 230. For example, the first fastener 320 can be a captive bolt.

[0144] For example, the first fastener 320 is used to connect the fixed cold plate 210, the first heat sink 230, the computing board 100, and the second heat sink 240. That is, the fixed cold plate 210, the first heat sink 230, the computing board 100, and the second heat sink 240 are fixedly connected by the first fastener 320 passing through the groove G along the thickness direction of the computing board 100. The first heat sink 230, the computing board 100, and the second heat sink 240 have through holes through which the first fastener 320 passes. In this way, the structure of the computing device can be made simpler and more compact.

[0145] For example, the fixed cold plate 210, the first heat sink 230, the computing board 100 and the second heat sink 240 can be connected by eight first fasteners 320.

[0146] For example, the first spring 310 corresponds one-to-one with the first fastener 320, and the first spring 310 is sleeved on the outside of the corresponding first fastener 320.

[0147] For example, the first spring 310 may be a flat spring, such that the first spring 310 can provide a large elastic force by a small deformation in the thickness direction of the calculation plate 100.

[0148] For example, the first heat sink 230, the computing board 100 and the second heat sink 240 can be fixedly connected by a third fastener 330 extending along the thickness direction of the computing board 100. The first heat sink 230, the computing board 100 and the second heat sink 240 can be assembled into a whole and then connected to the fixed cold plate 210, which makes the maintenance of the computing device more convenient.

[0149] Figure 10 This is an exploded view of another computing device provided in an embodiment of this application. Figure 11 This is a schematic diagram of another computing device provided in an embodiment of this application.

[0150] like Figure 10 , Figure 11 As shown, in some possible embodiments, the heat dissipation assembly 200 further includes a heat conductor 250. The heat conductor 250 is connected to the surface of the second heat sink 240 and the liquid inlet pipe 31, so that the liquid inlet pipe 31 can perform liquid cooling heat dissipation on the third type device D3 through the heat conductor 250 and the second heat sink 240.

[0151] In this way, the second heat sink 240 can be extended to the liquid inlet pipe 31 through the heat conduction component 250, and liquid cooling can be performed using the liquid inlet pipe 31. This makes the structure for liquid cooling of the third type of device D3 relatively simple and easy to set up.

[0152] For example, the second heat sink 240 can be an aluminum plate.

[0153] For example, the heat-conducting element 250 can be a heat pipe.

[0154] For example, the second heat sink 240 can be connected to the surface of the liquid inlet pipe 31 through multiple heat-conducting elements 250, so that the second heat sink 240 and the liquid inlet pipe 31 have high thermal conductivity.

[0155] In some possible implementations, the second heat sink 240 may also be a cold plate, and the second heat sink 240 may be connected to the manifold 30 via a pipe.

[0156] like Figure 11 As shown, in some possible implementations, the fixed cold plate 210 and the floating cold plate 220 are close to the bottom plate of the chassis 10 relative to the computing board 100.

[0157] This design allows for full utilization of the space in the thickness direction of the computing board 100 within the chassis 10 to accommodate the heat dissipation components 200, making their placement easier and facilitating efficient heat dissipation for the components on both sides of the computing board 100. Furthermore, maintenance can be performed by removing the computing board 100; therefore, it is not necessary to disassemble the fixed cold plate 210 and the floating cold plate 220 during computing device maintenance, making maintenance of the computing device more convenient.

[0158] In some possible implementations, the fixed cold plate 210 is fixedly connected to the base plate 11, and the computing board 100 is fixed to the base plate 11 through the fixed cold plate 210, which makes it easier to disassemble and assemble the computing board 100 and facilitates the maintenance of the computing device.

[0159] For example, the computing board 100, the first heat sink 230 and the second heat sink 240 can be removed from the fixed cold plate 210 to maintain the computing device.

[0160] For example, the chassis 10 also includes an end plate located at one end of the chassis 10 in a first direction. The end plate is provided with an external connector for connecting to an external device outside the computing device to enable signal interaction between the computing device and the external device. The external connector is connected to the computing board 100 through a flexible connection component, enabling the computing board 100 to interact with the external device. This allows for more flexible relative positions between the external connector and the computing board 100, facilitating the flexible arrangement of the computing board 100 within the chassis 10 and thus the arrangement of the heat dissipation component 200.

[0161] Figure 12 This is an exploded view of another computing device provided in an embodiment of this application.

[0162] like Figure 12 As shown, in some possible embodiments, the elastic connection structure 400 includes a second fastener 410 and a second spring 420. The rod portion of the second fastener 410 passes through the floating cold plate 220 and is fixedly connected to the fixed cold plate 210. The floating cold plate 220 can slide relative to the second fastener 410 along the thickness direction of the calculation board 100. The second spring 420 is sleeved on the outside of the rod portion of the second fastener 410, and both ends of the second spring 420 abut against the heads of the floating cold plate 220 and the second fastener 410, respectively, so that the floating cold plate 220 can float relative to the fixed cold plate 210 along the thickness direction of the calculation board 100. The second spring 420 is used to press the floating cold plate 220 against the second type of device D2.

[0163] This facilitates the floating cold plate 220 to be buoyantly connected to the fixed cold plate 210. The head of the second fastener 410 can be used to limit the floating range of the floating cold plate 220 in the thickness direction of the calculation plate 100. The rod of the second fastener 410 can be used to connect with the fixed cold plate 210 and guide the second spring 420. The elastic connection structure 400 is relatively simple and compact.

[0164] In some possible implementations, the fixed cold plate 210 has a connection hole H1 on the surface away from the computing board 100. The floating cold plate 220 includes a connecting portion 221 located on the side of the fixed cold plate 210 away from the first surface 110. The connecting portion 221 has a communicating hole H2 opposite to the connection hole H1, and the communicating hole H2 extends through the connecting portion 221 along the thickness direction of the computing board 100.

[0165] The shank of the second fastener 410 passes through the connecting hole H1 and the communicating hole H2, and the head of the second fastener 410 is located on the side of the connecting portion 221 away from the fixed cold plate 210 and spaced apart from the connecting portion 221. In this way, it is convenient to connect the fixed cold plate 210 and the floating cold plate 220.

[0166] For example, the second fastener 410 can be a screw.

[0167] For example, the overall height of the computing board 100 and the corresponding heat dissipation component 200 can be less than or equal to 35mm. That is, within a height space of 35mm, the heat dissipation component 200 can efficiently dissipate heat from the devices on both sides of the computing board 100.

[0168] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0169] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0170] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A computing device, characterized in that, Includes a computing board (100) and a heat dissipation assembly (200); The computing board (100) includes a first surface (110) and a second surface (120) located on both sides of the thickness direction of the computing board (100). The first surface (110) is provided with a first type of device (D1) and a second type of device (D2). The heat flux density of the first type of device (D1) is less than that of the second type of device (D2). The heat dissipation assembly (200) includes a fixed cold plate (210) and a floating cold plate (220). The fixed cold plate (210) and the floating cold plate (220) are opposite to the first surface (110). The fixed cold plate (210) is fixedly connected to the computing board (100). The floating cold plate (220) is connected to the fixed cold plate (210) through an elastic connection structure (400). The floating cold plate (220) can float relative to the fixed cold plate (210) along the thickness direction of the computing board (100). The first type of device (D1) is disposed between the fixed cold plate (210) and the first surface (110), and the fixed cold plate (210) is used to perform liquid cooling heat dissipation on the first type of device (D1); The second type of device (D2) is disposed between the floating cold plate (220) and the first surface (110). The floating cold plate (220) is pressed onto the second type of device (D2). The floating cold plate (220) is used to perform liquid cooling heat dissipation on the second type of device (D2).

2. The computing device according to claim 1, characterized in that, The first surface (110) is provided with a plurality of the first type of devices (D1); The heat dissipation assembly (200) also includes a first heat dissipation plate (230); The first heat sink (230) is disposed between the fixed cold plate (210) and the plurality of first-type devices (D1). The first heat sink (230) is fixedly connected to the computing board (100). The first heat sink (230) is pressed onto the plurality of first-type devices (D1). The fixed cold plate (210) is pressed onto the first heat sink (230). The fixed cold plate (210) is used to perform liquid cooling heat dissipation on the plurality of first-type devices (D1) through the first heat sink (230).

3. The computing device according to claim 2, characterized in that, At least one of the surface of the first heat sink (230) facing the fixed cold plate (210) and the surface of the fixed cold plate (210) facing the first heat sink (230) has a groove (G), and a first spring (310) is provided in the groove (G). The two ends of the first spring (310) abut against the first heat sink (230) and the fixed cold plate (210) respectively, and the first spring (310) is compressed between the first heat sink (230) and the fixed cold plate (210).

4. The computing device according to any one of claims 1-3, characterized in that, The second surface (120) is provided with a third type of device (D3); The heat dissipation assembly (200) also includes a second heat dissipation plate (240). The second heat sink (240) is opposite to the second surface (120), and the second heat sink (240) is fixedly connected to the computing board (100). The third type of device (D3) is disposed between the second heat sink (240) and the second surface (120). The second heat sink (240) is pressed onto the third type of device (D3). The second heat sink (240) is used to dissipate heat from the third type of device (D3).

5. The computing device according to claim 4, characterized in that, It also includes an inlet pipe (31); The liquid inlet pipe (31) is connected to the liquid inlet of the fixed cold plate (210) through a pipeline to supply liquid to the fixed cold plate (210). The liquid inlet pipe (31) is also connected to the liquid inlet of the floating cold plate (220) through a flexible pipeline to supply liquid to the floating cold plate (220). The heat dissipation assembly (200) also includes a heat-conducting component (250); The heat-conducting component (250) is connected to the surface of the second heat sink (240) and the liquid inlet pipe (31), so that the liquid inlet pipe (31) can perform liquid cooling heat dissipation on the third type of device (D3) through the heat-conducting component (250) and the second heat sink (240).

6. The computing device according to any one of claims 1-5, characterized in that, It also includes the chassis (10); The computing board (100) and the heat dissipation assembly (200) are located inside the chassis (10); The fixed cold plate (210) and the floating cold plate (220) are close to the bottom plate (11) of the chassis (10) relative to the computing board (100).

7. The computing device according to any one of claims 1-6, characterized in that, The heat dissipation assembly (200) includes a plurality of floating cold plates (220), each of which is connected to the fixed cold plate (210) via an independent elastic connection structure (400), such that each of the floating cold plates (220) can float independently relative to the fixed cold plate (210) along the thickness direction of the computing board (100).

8. The computing device according to any one of claims 1-7, characterized in that, The fixed cold plate (210) has a first clearance opening (N1) for avoiding at least one of the floating cold plate (220) and the second type of device (D2) so that the floating cold plate (220) and the second type of device (D2) can be pressed together.

9. The computing device according to any one of claims 1-8, characterized in that, The elastic connection structure (400) includes a second fastener (410) and a second spring (420). The rod portion of the second fastener (410) passes through the floating cold plate (220) and is fixedly connected to the fixed cold plate (210). The floating cold plate (220) can slide relative to the second fastener (410) along the thickness direction of the calculation plate (100). The second spring (420) is sleeved on the outside of the rod of the second fastener (410). The two ends of the second spring (420) abut against the floating cold plate (220) and the head of the second fastener (410) respectively, so that the floating cold plate (220) can float relative to the fixed cold plate (210) along the thickness direction of the calculation board (100). The second spring (420) is used to press the floating cold plate (220) onto the second type of device (D2).

10. The computing device according to any one of claims 1-9, characterized in that, The computing device includes a plurality of computing boards (100) and a plurality of heat dissipation components (200) corresponding one-to-one with the computing boards (100). The heat dissipation component (200) is connected to the corresponding computing board (100), and the heat dissipation component (200) is used to dissipate heat from the devices disposed on the corresponding computing board (100).

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