A new built-in passive circulating water cooling structure for a notebook computer

Abstract

This invention discloses a novel passive circulating water cooling structure for laptops, comprising a heat dissipation back cover and a pump. The heat dissipation back cover includes an upper cover and a lower cover, the lower cover being a metal plate with recessed water channels on its surface. The upper cover and the lower cover are sealed and welded together. One end of each water channel is an inlet, and the other end is an outlet. The inlet is connected to one end of a heat pipe via a connector, and the other end of the heat pipe is connected to the outlet via a connector. A water pump is installed between the heat pipes, and the heat pipes and the connected water channels are filled with cooling liquid. This patent directly replaces the traditional air-cooling mode, innovatively placing the heat dissipation area behind the laptop display for the first time. When the water pump operates, the flow channels are arranged through the laptop hinge, allowing the coolant to dissipate heat through the lower cover. The large area of ​​the A-side has a natural heat exchange advantage; after the coolant passes through the heat dissipation area on the A-side, its temperature decreases, and it flows back through the flow channels, achieving a cooling effect on the chip.

Description

Technical Field

[0001] This invention relates to the field of notebook computer technology, and more specifically to a novel passive circulating water cooling structure built into a notebook computer. Background Technology

[0002] As users have increasingly higher demands and have extreme requirements for laptop size and weight, lighter and smaller laptops are becoming more popular with consumers.

[0003] Most thin and light laptops place their cooling modules below the keyboard, taking up considerable space. These modules typically employ a conventional design: heat pipes transfer heat from the chip, followed by forced cooling by a fan. This space-consuming design forces laptops to increase internal space to house the cooling module and fan. Furthermore, the large space occupied by the cooling module and fan reduces the space available for the battery, impacting battery life. Consumers are particularly concerned about laptop weight, size, and battery life.

[0004] Therefore, a new approach is needed to reduce the size and weight of thin and light laptops, increase their battery life, and attract consumers' attention. Summary of the Invention

[0005] To overcome the aforementioned deficiencies of the prior art, the present invention provides a novel passive circulating water cooling structure for laptops.

[0006] The technical solution of this invention is as follows: A novel passive circulating water cooling structure for laptops, comprising a heat dissipation back cover and a pump.

[0007] The heat dissipation back cover includes an upper cover and a lower cover. The lower cover is a metal plate with recessed water channels on its surface. The upper cover and the lower cover are sealed and welded together.

[0008] One end of the water channel is an inlet, and the other end is an outlet; the inlet is connected to one end of a heat pipe via a connector, and the other end of the heat pipe is connected to the outlet via a connector.

[0009] A water pump is installed between the heat pipes, and the heat pipes and the connected water channels are filled with heat dissipation liquid.

[0010] The water flow channel is designed with multiple channels, which are distributed in a wave-like pattern to increase the contact time between the water flow and the heat dissipation cover, thereby increasing the heat dissipation.

[0011] The connector is a swivel connector with an internal flow channel, which is rotatably connected to the heat pipe. A seal is installed at the connection point to ensure that rotation does not cause leakage. The flow channel inside the connector is connected to the heat pipe.

[0012] The heat pipe is in close contact with the heat spreader, and the heat spreader is in close contact with the chip, thus achieving heat conduction.

[0013] The heat dissipation back cover is used as the outer shell of the screen, and a heat insulation pad is placed between the heat dissipation back cover and the screen to prevent heat from being conducted to the screen.

[0014] The technical effects and advantages of this invention are as follows:

[0015] This patent directly replaces the traditional air-cooling mode, innovatively placing the heat dissipation area behind the laptop display for the first time. A water pump operates, and through the laptop hinge, flow channels allow coolant to pass through the heat dissipation cover on the laptop's A-side (back of the screen) for cooling. The large area of ​​the A-side has a natural heat exchange advantage; after passing through the A-side heat dissipation area, the coolant's temperature decreases, and it flows back through the channels, achieving a cooling effect on the chip.

[0016] By utilizing the space previously reserved for the display screen, a heatsink is installed, forming a loop with a water pump and pipes to cool the chip using a novel approach. This module occupies little space, saving internal space in the laptop and thus reducing its size and weight, achieving a lighter laptop design. The smaller heatsink also allows for more space for the battery, increasing battery life. Furthermore, eliminating the traditional heatsink means the laptop operates without a fan, achieving near-silent operation and improving user experience. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the present invention with the top cover removed; Figure 3 This is an exploded view of the present invention. Detailed Implementation

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Example 1

[0020] A novel passive circulating water cooling structure for laptops includes a heat dissipation back cover 1 and a water pump 2.

[0021] The heat dissipation back cover includes an upper cover 11 and a lower heat dissipation cover 12. The lower heat dissipation cover 12 is a metal plate with recessed water channels 121 on its surface. The upper cover and the lower heat dissipation cover are sealed and welded together.

[0022] One end of the water channel is an inlet 122, and the other end is an outlet 123; the inlet is connected to one end of the heat pipe 3 through a connector, and the other end of the heat pipe 3 is connected to the outlet through a connector.

[0023] Furthermore, a water pump 2 is installed between the heat pipes 3, and the heat pipes and the connected water channels are filled with heat dissipation liquid.

[0024] Furthermore, the water flow channel is designed with three channels arranged in a wave-like pattern, which can increase the contact time between the water flow and the heat dissipation cover, thereby increasing the heat dissipation.

[0025] Furthermore, the connector 4 is a rotating shaft connector with an internal flow channel, which is rotatably connected to the heat pipe, and a sealing element is provided at the connection to achieve the effect of rotating without leakage.

[0026] Furthermore, the connector can be based on a traditional rotating shaft, with a hollow tube with a flow channel added to the side, so that it can be used for both rotating connection of the screen and the housing as well as connecting the heat pipe.

[0027] Furthermore, the heat pipe is in close contact with the heat spreader 5, and the heat spreader is in close contact with the chip 6, thus achieving heat conduction.

[0028] Furthermore, the heat dissipation back cover is used as the outer shell of the screen, and a heat insulation pad is provided between the heat dissipation back cover and the screen to prevent heat from being conducted to the screen.

[0029] Example 2

[0030] This patent directly replaces the traditional air-cooling mode, innovatively placing the heat dissipation area behind the laptop display for the first time. A water pump operates, and through the laptop hinge, flow channels allow coolant to pass through the heat dissipation cover on the laptop's A-side (back of the screen). The large area of ​​the heat dissipation cover provides a natural heat exchange advantage; after passing through the A-side heat dissipation area, the coolant's temperature decreases, and it flows back through the channels, achieving a cooling effect on the chip.

[0031] By utilizing the space previously reserved for the display screen, a heatsink is installed, forming a loop with a water pump and pipes to cool the chip using a novel approach. This module occupies little space, saving internal space in the laptop and thus reducing its size and weight, achieving a lighter laptop design. The smaller heatsink also allows for more space for the battery, increasing battery life. Furthermore, eliminating the traditional heatsink means the laptop operates without a fan, achieving near-silent operation and improving user experience.

[0032] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A novel passive circulating water cooling structure for laptops, characterized in that: Including heat sink back cover, pump, The heat dissipation back cover includes an upper cover and a lower cover. The lower cover is a metal plate with recessed water channels on its surface. The upper cover and the lower cover are sealed and welded together. One end of the water channel is an inlet, and the other end is an outlet; the inlet is connected to one end of a heat pipe via a connector, and the other end of the heat pipe is connected to the outlet via a connector. A water pump is installed between the heat pipes, and the heat pipes and the connected water channels are filled with heat dissipation liquid.

2. A novel built-in passive circulating water cooling structure for a laptop according to claim 1, characterized in that: The water flow channel is designed with multiple channels, which are distributed in a wave-like pattern to increase the contact time between the water flow and the heat dissipation cover, thereby increasing the heat dissipation.

3. The novel built-in passive circulating water cooling structure for a laptop according to claim 1, characterized in that: The connector contains a flow channel and is rotatably connected to the heat pipe. A seal is provided at the connection point to achieve the effect of rotating without leakage.

4. The novel built-in passive circulating water cooling structure for a laptop according to claim 1, characterized in that: The connector is a swivel connector, which can be used for the swivel connection of both the screen and the housing.

5. The novel built-in passive circulating water cooling structure for laptop according to claim 1, characterized in that: The heat pipe is in close contact with the heat spreader, and the heat spreader is in close contact with the chip, thus achieving heat conduction.

6. A novel built-in passive circulating water cooling structure for a laptop according to claim 1, characterized in that: The heat dissipation back cover is used as the outer shell of the screen, and a heat insulation pad is placed between the heat dissipation back cover and the screen to prevent heat from being conducted to the screen.

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