Methods, apparatus, equipment, and storage media for determining the crosslinking time of cable joints

By preparing multiple interface samples of cross-linked polyethylene and semiconductive shielding layer, multi-dimensional index data were obtained and a mapping relationship was established. This solved the problem of low reliability of cross-linking time of cable joints under complex marine conditions, achieved accurate determination of cross-linking time, and improved the stability and safety of submarine cable systems.

CN122490776APending Publication Date: 2026-07-31ZHONGTIAN TECH SUBMARINE CABLE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHONGTIAN TECH SUBMARINE CABLE CO LTD
Filing Date
2026-04-23
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

In complex operating conditions at sea with high voltage and greater distances, the cross-linking time of the heterogeneous interface insulation performance of the XLPE/semiconductive shielding layer is difficult to determine using a single index, resulting in low reliability of the cross-linking time of the cable joint.

Method used

Multiple interface samples of cross-linked polyethylene and semiconductive shielding layer were prepared. Multi-dimensional index data related to the mechanical, structural and electrical properties of each interface sample were obtained. The mapping relationship between cross-linking time and interface insulation performance was established. The target cross-linking time of the cable joint was determined by inversion method.

Benefits of technology

It enables accurate prediction of interface insulation performance, simplifies the process of determining process parameters, improves the accuracy and reliability of crosslinking time, and enhances the stability and safety of submarine cable transmission systems.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

This application provides a method, apparatus, device, and storage medium for determining the crosslinking time of a cable joint. It relates to the field of power research technology. The method includes: preparing multiple interface samples after crosslinking of cross-linked polyethylene and a semiconductive shielding layer, the interface samples including cross-linked polyethylene, a semiconductive shielding layer, and a transition layer between the two; determining first index data related to mechanical properties, second index data related to structural properties, and third index data related to electrical properties for each interface sample; obtaining a mapping relationship between the crosslinking time and the interface insulation performance, the mapping relationship being obtained based on the crosslinking time of each interface sample, multiple first index data, multiple second index data, and multiple third index data; and, based on the mapping relationship, performing an inversion with the interface insulation performance meeting preset conditions as the objective to obtain the target crosslinking time of the cable joint, thereby improving the reliability of determining the crosslinking time of the cable joint.
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Description

Technical Field

[0001] This application relates to the field of power research technology, and in particular to a method, apparatus, equipment and storage medium for determining the cross-linking time of a cable joint. Background Technology

[0002] As core equipment for global communication, energy transmission, and cross-sea power transmission, submarine cables directly affect the safe operation of marine engineering due to their reliability and stability. In practical applications, due to the limited length of the cable itself, multiple cable segments need to be connected through factory splicing technology to form a continuous power transmission system.

[0003] In related technologies, the homogeneous interface of cross-linked polyethylene (XLPE) is usually treated. Specifically, the cross-linking time of the factory joint can be determined based on the influence of XLPE preparation process parameters (e.g., vulcanization pressure) on its insulation performance.

[0004] However, in the above methods, under the complex operating conditions of high voltage and longer distance at sea, the insulation performance of the heterogeneous interface of the XLPE / semiconductive shielding layer is more susceptible to multi-dimensional coupling effects, making it difficult to determine the appropriate cross-linking time through a single index, resulting in low reliability in determining the cross-linking time of the cable joint. Summary of the Invention

[0005] This application provides a method, apparatus, device, and storage medium for determining the crosslinking time of a cable joint, in order to solve the technical problem of low reliability in determining the crosslinking time of a cable joint.

[0006] In a first aspect, this application provides a method for determining the cross-linking time of a cable joint, including:

[0007] Multiple interface samples were prepared after cross-linking of cross-linked polyethylene and semiconductive shielding layer. The interface samples included cross-linked polyethylene, semiconductive shielding layer and transition layer between the two. The cross-linking time of each interface sample was different.

[0008] Determine the first index data related to mechanical performance, the second index data related to structural performance, and the third index data related to electrical performance for each interface sample;

[0009] The mapping relationship between crosslinking time and interface insulation performance was obtained. The mapping relationship was obtained based on the crosslinking time of each interface sample, multiple first index data, multiple second index data and multiple third index data.

[0010] Based on the mapping relationship, the target cross-linking time of the cable joint is obtained by inversion with the goal of meeting the preset conditions for interface insulation performance.

[0011] In one possible implementation, determining the first index data related to mechanical performance, the second index data related to structural performance, and the third index data related to electrical performance for each interface sample includes:

[0012] Each interface sample was stretched, and multiple peel tests were performed on the stretched interface samples to obtain the adhesion force corresponding to each interface sample. The adhesion force was determined as the first indicator data.

[0013] The cross-sectional structure of the transition layer in each interface sample is scanned to obtain the area of ​​the transition layer in each interface sample, and the area of ​​the transition layer is determined as the second indicator data.

[0014] The current and voltage parameters of the transition layer in each interface sample are determined, and the current and voltage parameters are used as the third index data.

[0015] In one possible implementation, determining the current and voltage parameters of the transition layer in each interface sample includes:

[0016] A polarization voltage is applied to the interface sample to obtain the corresponding polarization current value, and the polarization voltage is stopped from being applied to the interface sample to obtain the corresponding depolarization current value.

[0017] Based on the polarization current value and the depolarization current value, the current parameters of the interface sample are determined. The current parameters are used to indicate the conductivity of the interface sample.

[0018] A breakdown test was performed on the interface sample to obtain the corresponding breakdown voltage value, and the breakdown voltage value was determined as the voltage parameter.

[0019] In one possible implementation, the mapping relationship is obtained based on the crosslinking duration of each interface sample, multiple first indicator data, multiple second indicator data, and multiple third indicator data, including:

[0020] Feature extraction processing is performed on multiple first indicator data, multiple second indicator data, and multiple third indicator data to obtain multiple feature parameters. The feature parameters are used to indicate the degree of correlation between the various indicator data.

[0021] The prediction model is trained based on the cross-linking duration and multiple feature parameters of each interface sample to obtain the mapping relationship.

[0022] In one possible implementation, the prediction model is trained based on the cross-linking duration of each interface sample and multiple feature parameters to obtain the mapping relationship, including:

[0023] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each first index data, the first mapping relationship between crosslinking time and mechanical properties is determined.

[0024] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each second index data, the second mapping relationship between crosslinking time and structural performance is determined.

[0025] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each third index data, the third mapping relationship between crosslinking time and electrical performance is determined.

[0026] The first, second, and third mapping relationships are defined as mapping relationships.

[0027] In one possible implementation, based on the mapping relationship, an inversion is performed with the goal of satisfying preset conditions for interface insulation performance to obtain the target crosslinking time of the cable joint, including:

[0028] Determine the constraints corresponding to the interface insulation performance. The constraints are used to limit the range of the first index data, the second index data, and the third index data.

[0029] Based on the pre-trained prediction model and mapping relationship, the target cross-linking time of the cable joint is obtained by inversion solution with the interface insulation performance meeting the constraint conditions.

[0030] In one possible implementation, based on a pre-trained prediction model and mapping relationship, an inversion solution is performed to obtain the target crosslinking time of the cable joint, including:

[0031] Within the preset crosslinking time range, determine the initial crosslinking time;

[0032] Based on the initial crosslinking time, the pre-trained prediction model, and the mapping relationship, the performance index corresponding to the initial crosslinking time is obtained;

[0033] Based on the deviation between the performance index and the constraint conditions corresponding to the initial crosslinking time, the current crosslinking time is adjusted to obtain the updated crosslinking time;

[0034] Repeat the above adjustment steps until the deviation meets the preset requirements, and then determine the current crosslinking time as the target crosslinking time of the cable joint.

[0035] Secondly, this application provides a device for determining the crosslinking time of a cable joint, comprising: a preparation module, a determination module, an acquisition module, and a processing module, wherein,

[0036] The preparation module is used to prepare multiple interface samples after cross-linking of cross-linked polyethylene and semi-conductive shielding layer. The interface sample includes cross-linked polyethylene, semi-conductive shielding layer and transition layer containing the two. The cross-linking time of each interface sample is set at equal intervals.

[0037] The determination module is used to determine the first index data related to mechanical performance, the second index data related to structural performance, and the third index data related to electrical performance for each interface sample.

[0038] The acquisition module is used to acquire the mapping relationship between cross-linking time and interface insulation performance. The mapping relationship is obtained based on the cross-linking time of each interface sample, multiple first index data, multiple second index data and multiple third index data.

[0039] The processing module is used to perform inversion based on the mapping relationship, with the goal of meeting the preset conditions for interface insulation performance, to obtain the target cross-linking time of the cable joint.

[0040] In one possible implementation, the determining module is specifically used for:

[0041] Each interface sample was stretched, and multiple peel tests were performed on the stretched interface samples to obtain the adhesion force corresponding to each interface sample. The adhesion force was determined as the first indicator data.

[0042] The cross-sectional structure of the transition layer in each interface sample is scanned to obtain the area of ​​the transition layer in each interface sample, and the area of ​​the transition layer is determined as the second indicator data.

[0043] The current and voltage parameters of the transition layer in each interface sample are determined, and the current and voltage parameters are used as the third index data.

[0044] In one possible implementation, the determining module is specifically used for:

[0045] A polarization voltage is applied to the interface sample to obtain the corresponding polarization current value, and the polarization voltage is stopped from being applied to the interface sample to obtain the corresponding depolarization current value.

[0046] Based on the polarization current value and the depolarization current value, the current parameters of the interface sample are determined. The current parameters are used to indicate the conductivity of the interface sample.

[0047] A breakdown test was performed on the interface sample to obtain the corresponding breakdown voltage value, and the breakdown voltage value was determined as the voltage parameter.

[0048] In one possible implementation, the acquisition module is specifically used for:

[0049] Feature extraction processing is performed on multiple first indicator data, multiple second indicator data, and multiple third indicator data to obtain multiple feature parameters. The feature parameters are used to indicate the degree of correlation between the various indicator data.

[0050] The prediction model is trained based on the cross-linking duration and multiple feature parameters of each interface sample to obtain the mapping relationship.

[0051] In one possible implementation, the acquisition module is specifically used for:

[0052] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each first index data, the first mapping relationship between crosslinking time and mechanical properties is determined.

[0053] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each second index data, the second mapping relationship between crosslinking time and structural performance is determined.

[0054] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each third index data, the third mapping relationship between crosslinking time and electrical performance is determined.

[0055] The first, second, and third mapping relationships are defined as mapping relationships.

[0056] In one possible implementation, the processing module is specifically used for:

[0057] Determine the constraints corresponding to the interface insulation performance. The constraints are used to limit the range of the first index data, the second index data, and the third index data.

[0058] Based on the pre-trained prediction model and mapping relationship, the target cross-linking time of the cable joint is obtained by inversion solution with the interface insulation performance meeting the constraint conditions.

[0059] In one possible implementation, the processing module is specifically used for:

[0060] Within the preset crosslinking time range, determine the initial crosslinking time;

[0061] Based on the initial crosslinking time, the pre-trained prediction model, and the mapping relationship, the performance index corresponding to the initial crosslinking time is obtained;

[0062] Based on the deviation between the performance index and the constraint conditions corresponding to the initial crosslinking time, the current crosslinking time is adjusted to obtain the updated crosslinking time;

[0063] Repeat the above adjustment steps until the deviation meets the preset requirements, and then determine the current crosslinking time as the target crosslinking time of the cable joint.

[0064] Thirdly, this application provides an electronic device, including: a memory and a processor;

[0065] The memory stores the instructions that the computer executes;

[0066] The processor executes computer execution instructions stored in memory, causing the processor to perform the first aspect and / or various possible implementations of the first aspect as described above.

[0067] Fourthly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the first aspect and / or various possible embodiments of the first aspect.

[0068] Fifthly, this application provides a computer program product, including a computer program that, when executed by a processor, implements the first aspect and / or various possible implementations of the first aspect.

[0069] The method, apparatus, equipment, and storage medium for determining the crosslinking time of cable joints provided in this application prepare multiple interface samples after crosslinking of crosslinked polyethylene and a semiconductive shielding layer. The interface samples include crosslinked polyethylene, a semiconductive shielding layer, and a transition layer containing the two. The crosslinking time of each interface sample is different. The method determines the first index data related to mechanical properties, the second index data related to structural properties, and the third index data related to electrical properties corresponding to each interface sample. The method obtains the mapping relationship between the crosslinking time and the interface insulation performance. The mapping relationship is obtained based on the crosslinking time of each interface sample, multiple first index data, multiple second index data, and multiple third index data. Based on the mapping relationship, the method performs inversion with the interface insulation performance meeting the preset conditions as the target to obtain the target crosslinking time of the cable joint. In the above method, electronic devices can cover the influence of crosslinking time on interface performance by setting interface samples with different crosslinking times at equal intervals. By acquiring index data in three dimensions—mechanical, structural, and electrical—interface insulation performance can be comprehensively analyzed from multiple levels, such as interface bonding strength, micro-fusion degree, and electrical tolerance, avoiding the limitations of single-index analysis. By establishing a mapping relationship between crosslinking time and interface insulation performance, accurate prediction of interface performance can be achieved based on the complex nonlinear coupling relationship between multi-dimensional performance indicators. By performing inversion with the goal of meeting preset conditions for interface insulation performance, the optimal crosslinking time can be directly determined in reverse according to performance requirements, eliminating the need for repeated trial and error experiments, simplifying the process parameter determination process, and realizing intelligent collaborative optimization of crosslinking time and interface insulation performance, further improving the accuracy and reliability of determining the crosslinking time of cable joints. Attached Figure Description

[0070] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0071] Figure 1 This application provides an illustration of the application scenario.

[0072] Figure 2A schematic diagram illustrating the process of determining the crosslinking time of a cable joint provided in this application;

[0073] Figure 3 A schematic diagram illustrating the preparation process of the interface sample provided in this application;

[0074] Figure 4 A schematic diagram of the peel test process for the interface sample provided in this application;

[0075] Figure 5 A schematic diagram of the scanning results of the interface sample provided in this application;

[0076] Figure 6 A schematic diagram of the polarization current curve of the interface sample provided in this application;

[0077] Figure 7 A schematic diagram of the depolarization current curve provided in this application;

[0078] Figure 8 A schematic diagram of the breakdown voltage of the interface sample provided in this application;

[0079] Figure 9 A schematic diagram of the adhesion forces of interface samples with different crosslinking durations provided in this application;

[0080] Figure 10 A schematic diagram showing the DC conductivity of interface samples with different crosslinking durations provided in this application;

[0081] Figure 11 A schematic diagram of the breakdown voltage of interface samples with different crosslinking durations provided in this application;

[0082] Figure 12 A schematic diagram illustrating the process of determining a mapping relationship provided in this application;

[0083] Figure 13 A schematic diagram illustrating the process for determining the target crosslinking duration provided in this application;

[0084] Figure 14 A schematic diagram of a device for determining the crosslinking time of a cable joint provided in this application;

[0085] Figure 15 A schematic diagram of the structure of the electronic device provided in this application.

[0086] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0087] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0088] The collection, storage, use, processing, transmission, provision, and disclosure of financial data or user data involved in the technical solution of this application all comply with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0089] It should be noted that in the embodiments of this application, certain software, components, models and other existing solutions in the industry may be mentioned. These should be regarded as exemplary and are only intended to illustrate the feasibility of implementing the technical solution of this application. However, it does not mean that the applicant has used or necessarily used the solution.

[0090] Figure 1 The application scenario diagram provided in this application is as follows: Figure 1 As shown, it includes cables, multiple testing devices, and electronic equipment.

[0091] Users can use multiple testing devices (Test Device 1, Test Device 2, ..., Test Device N) to test the insulation of the cable, obtaining multiple data points related to the cable's insulation performance. This data is then sent to an electronic device, which receives and processes the data to determine the cross-linking time of the cable joint. The electronic device can be a server, computer, or other device with data processing capabilities.

[0092] As can be seen from the above scenarios, in existing technologies, the homogeneous interface of cross-linked polyethylene (XLPE) is typically treated. Specifically, the cross-linking time of the factory joint can be determined based on the influence of XLPE manufacturing process parameters (e.g., vulcanization pressure) on its insulation performance. However, in the complex operating conditions of high voltage and longer distances at sea, the insulation performance of the heterogeneous interface of XLPE / semiconductive shielding layer is easily affected by multi-dimensional coupling, making it difficult to determine the appropriate cross-linking time using a single indicator. This results in low reliability in determining the cross-linking duration of the cable joint.

[0093] The method, apparatus, equipment, and storage medium for determining the crosslinking time of cable joints provided in this application obtain multi-dimensional index data related to the mechanical, structural, and electrical properties of each interface sample by preparing multiple interface samples with crosslinking times, as well as the mapping relationship between the crosslinking time and the interface insulation performance determined by the crosslinking time and the multi-dimensional index data. The target crosslinking time of the cable joint is obtained by inversion with the interface insulation performance meeting the preset conditions. In the above method, electronic devices can cover the influence range of crosslinking time on interface performance by setting interface samples with different crosslinking times, providing a complete data foundation for subsequent modeling and avoiding model bias caused by uneven sample distribution. By acquiring index data in three dimensions—mechanical, structural, and electrical—interface insulation performance can be comprehensively evaluated from multiple levels, including interface bonding strength, micro-fusion degree, and electrical tolerance, realizing the correlation analysis between multi-dimensional indicators and avoiding the limitations of single-indicator analysis. By obtaining the mapping relationship between crosslinking time and interface insulation performance, the complex nonlinear coupling relationship between multi-dimensional performance indicators can be determined, enabling accurate prediction of interface performance. By performing inversion with the goal of meeting preset conditions for interface insulation performance, the optimal crosslinking time can be directly determined in reverse according to performance requirements, simplifying the process parameter determination process and realizing intelligent collaborative optimization of crosslinking time and interface insulation performance. In addition, this method is applicable to the determination of process parameters for different types of cable joints, enhancing the versatility and scalability of the solution, ensuring the insulation performance of the XLPE / semiconductive shielding layer interface, and significantly improving the stability and safety of submarine cable transmission systems while improving the accuracy and reliability of crosslinking time determination.

[0094] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0095] Figure 2 A schematic diagram illustrating the process of determining the crosslinking time of a cable joint provided in this application is shown below. Figure 2 As shown, the method includes:

[0096] S201. Prepare multiple interface samples after cross-linking of cross-linked polyethylene and semiconductive shielding layer.

[0097] The execution subject of this application embodiment can be an electronic device or a device for determining the crosslinking duration disposed in the electronic device. The device for determining the crosslinking duration can be implemented by software or by a combination of software and hardware.

[0098] The interface samples include cross-linked polyethylene, a semi-conductive shielding layer, and a transition layer between the two, with different cross-linking times for each interface sample.

[0099] Interface samples can refer to composite samples formed by secondary cross-linking of cross-linked polyethylene insulation material and semi-conductive shielding material. They simulate the heterogeneous bonding interface and internal layered structure of XLPE and semi-conductive shielding layer at the cable joint, and can reflect the actual performance state of the joint interface in the factory.

[0100] Cross-linked polyethylene can refer to the insulating layer portion of an interface sample, i.e., polyethylene material formed through a chemical cross-linking reaction, used to simulate the recovery insulation layer formed by secondary injection molding in factory joints.

[0101] The semiconductive shielding layer can refer to the conductive layer portion that serves as an interface sample. It is used to distribute the electric field uniformly and avoid electric field concentration on the surface of the conductor or the surface of the insulation layer, so as to simulate the original semiconductive shielding layer of the cable body. In the embodiments of this application, the semiconductive shielding layer can be an inner semiconductive shielding layer or an outer semiconductive shielding layer.

[0102] The transition layer can refer to the microstructural transition region formed by molecular chain diffusion and mutual penetration between cross-linked polyethylene and the semi-conductive shielding layer during the secondary cross-linking process.

[0103] Crosslinking time can refer to the duration during which XLPE material and semiconductive shielding material undergo crosslinking reaction and form a stable interface under set high temperature and high pressure process conditions during the secondary crosslinking process.

[0104] Below, in conjunction with Figure 3 The preparation process of the interface sample of this application is described.

[0105] Figure 3 A schematic diagram illustrating the preparation process of the interface sample provided in this application. Please refer to [link / reference]. Figure 3 The specific process for preparing multiple interface samples of cross-linked polyethylene and semiconductive shielding layer includes the preparation process of cable insulation recovery layer (XLPE) and the preparation process of interface samples of XLPE / semiconductive shielding layer.

[0106] Specifically, in preparing the cable insulation restoration layer, a certain amount (e.g., 44 grams) of XLPE cable granules is placed in a mold of a set size (e.g., 100mm × 100mm × 0.2mm), and preheated at 120°C for 15 minutes using a flat vulcanizing machine to fully soften the material and remove air bubbles. Subsequently, the temperature is raised to 180°C, and crosslinking is performed at a pressure of 1 MPa for 15 minutes to fully decompose the crosslinking agent and initiate the formation of a three-dimensional network structure of polyethylene molecular chains. After crosslinking is completed, the sample is cooled to room temperature to obtain a sample simulating the cable's main insulation layer, with dimensions of 100mm × 100mm × 0.2mm.

[0107] In preparing the XLPE / semi-conductive shielding layer interface samples, the semi-conductive shielding layer particles were placed in the same mold and preheated at 120℃ for 15 minutes on a flat vulcanizing machine to soften and uniformly spread the particles. The prepared simulated cable insulation recovery layer sample was placed on top of the preheated semi-conductive shielding layer particles and subjected to secondary cross-linking at 180℃ and 1MPa pressure for different durations. The cross-linking durations were marked to obtain multiple XLPE / semi-conductive shielding layer interface samples with different cross-linking durations.

[0108] In practical applications, the prepared interface samples need to be placed in a vacuum drying oven at 70°C for 48 hours to remove byproducts generated during the crosslinking process and avoid interference with subsequent performance test results.

[0109] Combination Figure 3 It can be seen that if the crosslinking time is set to 15 minutes, 30 minutes, 45 minutes and 60 minutes, four sets of interface samples with different crosslinking times can be obtained. The size of each sample is 100mm×100mm×0.2mm, and the thickness ratio of the insulation recovery layer, the semiconductive shielding layer and the transition layer is about 1:1:1. According to the different crosslinking times, the samples are marked as #15min, #30min, #45min and #60min respectively.

[0110] In some embodiments, the crosslinking time of each interface sample can be set by setting equal intervals. Specifically, different crosslinking times can be set by setting a preset time interval and a crosslinking time range. The preset time interval can be a pre-set interval used to divide the crosslinking time, and the crosslinking time range can be a pre-set maximum and minimum value used to constrain the crosslinking time.

[0111] For example, the preset time interval can be 3 minutes, 5 minutes, 10 minutes, etc., and the cross-linking time range can be 30 minutes, 60 minutes, etc. Since the performance of the interface sample gradually decreases when the cross-linking time is too long, the reference significance of a longer cross-linking time (e.g., 2 hours) is weak. The specific setting value can be configured according to actual needs.

[0112] For example, when training a model, a smaller time interval (e.g., 1 minute, 2 minutes, etc.) can be set. This allows for a denser set of interface samples within the cross-linking duration, expanding the sample quantity and data richness, and ensuring a more uniform distribution of performance data under different cross-linking durations. This enables the accurate acquisition of the continuous trend of interface performance changes with cross-linking duration. When further screening is required, a larger time interval (e.g., 10 minutes, 15 minutes, etc.) can be set. This allows for a rapid narrowing of the candidate range for the optimal cross-linking duration, and then more refined sampling and modeling can be performed based on the narrowed range.

[0113] By flexibly adjusting the preset time interval, a balance can be achieved between modeling accuracy and experimental cost, providing a high-quality training data foundation for establishing a high-precision mapping relationship between crosslinking duration and interface insulation performance.

[0114] Optionally, a non-equal interval setting can be used to set the crosslinking time of each interface sample. Specifically, based on the formation mechanism of the transition zone at the interface between crosslinked polyethylene and the semiconductive shielding layer, as well as the kinetic characteristics of the crosslinking reaction, it can be found that the rate of change of the interface insulation performance with the crosslinking time is not constant, but changes drastically in the middle of crosslinking and tends to level off or saturate in the later stage of crosslinking. Therefore, the sampling interval of the crosslinking time can be dynamically adjusted according to the rate of change of the interface insulation performance with the crosslinking time. That is, a smaller interval is used in the range where the performance changes drastically to capture key change details with dense sampling; and a larger interval is used in the range where the performance tends to level off or saturate to reduce redundant samples and improve the overall processing efficiency.

[0115] For example, if the crosslinking time is within the range of 15 to 30 minutes, and the interfacial properties (e.g., breakdown voltage) change significantly, a smaller time interval can be set within this range, for example, sampling once every 1 minute; in the range of 30 to 60 minutes, the performance change gradually slows down, and the time interval can be appropriately increased, for example, sampling once every 3 or 5 minutes; above 60 minutes, the performance tends to saturate or slowly decline, and the interval can be further increased, for example, sampling once every 10 minutes. This non-equidistant setting method, which first dense and then sparse, can effectively reduce the number of samples and lower experimental costs while ensuring the capture of key change trends.

[0116] S202. Determine the first index data related to mechanical performance, the second index data related to structural performance, and the third index data related to electrical performance for each interface sample.

[0117] Mechanical properties refer to the ability of a material to resist deformation or damage under stress. In the embodiments of this application, mechanical properties can be understood as the interfacial bonding strength of the XLPE / semi-conductive shielding layer.

[0118] The first indicator can refer to the adhesion force between cross-linked polyethylene and the semi-conductive shielding layer. The greater the adhesion force, the tighter the interfacial bonding, and the smaller the adhesion force, the sparser the interfacial bonding.

[0119] Structural properties can refer to the characteristic attributes of the microstructure inside a material. In the embodiments of this application, structural properties can be understood as the degree of mutual diffusion and penetration of molecular chains between XLPE and the semiconductive shielding layer during the secondary cross-linking process.

[0120] The second indicator can refer to the area of ​​the transition layer between cross-linked polyethylene and the semi-conductive shielding layer. The larger the area of ​​the transition zone, the stronger the interface between the two materials.

[0121] Electrical properties refer to the conductivity or insulation characteristics of a material under the influence of an electric field, and are a core indicator for evaluating the interfacial insulation capability.

[0122] The third indicator data can refer to the DC conductivity and breakdown voltage of the XLPE / semiconductive shielding layer interface sample. Among them, the lower the DC conductivity, the better the insulation performance; the breakdown voltage reflects the interface's ability to withstand the electric field limit, and the higher the breakdown voltage, the better the insulation performance.

[0123] In some embodiments, the electronic device may determine the first index data related to mechanical performance, the second index data related to structural performance, and the third index data related to electrical performance for each interface sample based on the following implementation: stretching each interface sample and performing multiple peel tests on each stretched interface sample to obtain the adhesion force corresponding to each interface sample, and determining the adhesion force as the first index data; scanning the cross-sectional structure of the transition layer in each interface sample to obtain the transition layer area of ​​each interface sample, and determining the transition layer area as the second index data; determining the current parameters and voltage parameters of the transition layer in each interface sample, and determining the current parameters and voltage parameters as the third index data.

[0124] In some embodiments, interface samples prepared with different crosslinking times can be made into strip specimens of a set size, for example, 50 mm in length, 20 mm in width, and 1 mm in thickness. The strip specimens are placed in a constant temperature environment at 25 ± 2 °C and subjected to a peel test at a tensile rate of 20-25 mm / s.

[0125] During the test, the electronic device recorded the force required to peel the cross-linked polyethylene from the semi-conductive shielding layer. Five repeated tests were performed on samples with the same cross-linking time. After removing the maximum and minimum values, the average of the remaining data was taken as the adhesion force of the interface sample at that cross-linking time. Through the above tests, adhesion force data corresponding to different cross-linking times were obtained, i.e., the first index data.

[0126] Below, in conjunction with Figure 4 The peeling test process of the interface sample of this application is described in detail.

[0127] Figure 4 For a schematic diagram of the peel test process of the interface sample provided in this application, please refer to [link / reference]. Figure 4 The interface sample was a strip-shaped composite specimen, 50 mm long and 20 mm wide. Before testing, the interface sample maintained a complete layered structure. Figure 4 On the left), the XLPE insulation layer and the semi-conductive shielding layer are tightly bonded; during the test, one end of the interface sample is clamped in the tensile testing machine fixture, and the semi-conductive shielding layer is peeled off at a constant rate along the interlayer direction, causing the semi-conductive shielding layer to gradually separate from the XLPE insulation layer. Figure 4 (On the right side), tensile data is collected simultaneously during the peeling process until the interface sample is completely peeled off.

[0128] In some embodiments, scanning electron microscopy (SEM) tests can be performed on each XLPE / semiconductive shielding layer interface transition layer sample. Specifically, the transition layer position of each interface sample is selected and made into a strip-shaped sample, and a wedge-shaped notch is cut at the tangential interface of the strip-shaped sample. The strip-shaped sample is then immersed in liquid nitrogen for cryogenic freezing for 15-30 minutes to bring the material to a brittle state.

[0129] Subsequently, the frozen sample was quenched along the notch using a fixture to obtain a smooth fracture surface. To improve the conductivity of the semiconductive layer material during scanning electron microscopy testing, a thin and uniform layer of liquid gold can be sprayed onto the fracture surface of the sample using an ion sputtering instrument.

[0130] Subsequently, the fracture surface was observed using a scanning electron microscope (SEM) at a set magnification (e.g., 15,000x) to obtain microscopic morphology images of the transition layer. Based on the SEM images, the area of ​​the transition layer of the interface samples under different crosslinking durations was calculated, which is the second index data. The resolution of the SEM equipment is adjustable from 1.0 nm (15 kV) to 1.4 nm (1 kV), and the magnification is 25-100,000x.

[0131] Below, in conjunction with Figure 5 The scanning results of the interface sample of this application are described in detail.

[0132] Figure 5 For a schematic diagram of the scanning results of the interface sample provided in this application, please refer to [link / reference]. Figure 5Taking crosslinking times of 15 minutes, 30 minutes, 45 minutes and 60 minutes as examples, Figure (a) corresponds to the interface sample of the XLPE / semiconductive shielding layer with a crosslinking time of 15 minutes, Figure (b) corresponds to the interface sample of the XLPE / semiconductive shielding layer with a crosslinking time of 30 minutes, Figure (c) corresponds to the interface sample of the XLPE / semiconductive shielding layer with a crosslinking time of 45 minutes, and Figure (d) corresponds to the interface sample of the XLPE / semiconductive shielding layer with a crosslinking time of 60 minutes.

[0133] In Figures (a), (b), (c), and (d), the upper region is a semi-conductive shielding layer, the lower region is an XLPE insulating layer, and the area enclosed by the dashed line in the middle is the transition layer at the interface between the two. The width and morphological changes of the transition layer are clearly shown, and the area of ​​the transition region corresponding to its crosslinking time is shown in Table 1.

[0134] Table 1

[0135]

[0136] Combination Figure 5 As shown in Table 1, as the crosslinking time gradually increases from 15 min to 60 min, the width of the transition layer region gradually narrows, and the corresponding area of ​​the transition layer gradually decreases. This indicates that the crosslinking time mainly affects the overall insulation performance of the interface by regulating the formation and evolution of the interface transition region.

[0137] In some embodiments, the electronic device may determine the current and voltage parameters of the transition layer in each interface sample based on the following implementation: applying a polarization voltage to the interface sample to obtain the corresponding polarization current value, and stopping the application of the polarization voltage to the interface sample to obtain the corresponding depolarization current value; determining the current parameters of the interface sample based on the polarization current value and the depolarization current value; performing a breakdown test on the interface sample to obtain the corresponding breakdown voltage value, and determining the breakdown voltage value as the voltage parameter.

[0138] The current parameter is used to indicate the conductivity of the interface sample. That is, the current parameter can be understood as DC conductivity, which reflects the ease with which free charges move at the interface. The lower the DC conductivity, the fewer the interface defects and the better the insulation performance.

[0139] Voltage parameters can refer to characteristic breakdown voltage, which reflects the interface's ability to withstand electric field limits. The higher the characteristic breakdown voltage, the better the interface insulation performance.

[0140] In some embodiments, the polarization-depolarization current method (PDC) can be used to determine the current parameters. This involves using a ring electrode structure in a three-electrode system to measure the polarization-depolarization current of each interface sample. The three-electrode system includes a ground electrode, a high-voltage electrode, and a ring-shaped shielding electrode. In this embodiment, considering the thinness of the interface sample, the polarization voltage can be set to 1 kV and the polarization time to 120 seconds.

[0141] The polarization current value is collected using a picoammeter by applying a polarization voltage to the sample. After the applied polarization voltage is stopped, the corresponding depolarization current value is simultaneously acquired. The steady-state average values ​​of the polarization current and depolarization current at the end are calculated separately. Combined with the sample geometric capacitance and polarization voltage, the DC conductivity is calculated and determined as the current parameter. The specific formula is as follows:

[0142]

[0143] in, DC conductivity This represents the final steady-state average value of the polarization current. This represents the terminal steady-state average value of the depolarization current. For a constant polarization voltage, Geometric capacitance is an insulating dielectric.

[0144] Below, in conjunction with Figure 6 and Figure 7 The polarization current curves and depolarization current curves of the interface samples under different crosslinking times are described in detail in this application.

[0145] Figure 6 A schematic diagram of the polarization current curve of the interface sample provided in this application. Figure 7 For a schematic diagram of the depolarization current curve provided in this application, please refer to [link / reference]. Figure 6 and Figure 7 Taking cross-linking times of 15 minutes, 30 minutes, 45 minutes and 60 minutes as examples, it can be seen that the polarization current gradually increases with the increase of cross-linking time, while the depolarization current gradually decreases with the increase of cross-linking time.

[0146] Below, in conjunction with Figure 8 This paper provides a detailed description of the breakdown voltage test of interface samples under different crosslinking durations.

[0147] Figure 8The schematic diagram of the breakdown voltage of the interface sample provided in this application shows that each interface sample (15mm×15mm×0.5mm) can be placed between ball-ball electrodes. To prevent surface discharge, since the sample size is small, the sample is immersed in 25# transformer oil for testing.

[0148] For example, a uniform voltage ramping method can be used, where the voltage is ramped up to 5kV at a ramping rate of 500V / s, and then ramped up at a ramping rate of 1kV / min until the sample breaks down, and the breakdown voltage value is recorded. Five samples are prepared for each crosslinking time group for breakdown testing, and five breakdown voltage values ​​are obtained.

[0149] Due to the dispersion and randomness of breakdown voltage, a Weiber distribution was used to analyze the breakdown voltage data. The voltage corresponding to a 63.2% breakdown probability was taken as the characteristic breakdown voltage of the interface sample at that crosslinking time. Through the above tests, the characteristic breakdown voltage data, i.e., the voltage parameters, corresponding to different crosslinking times were obtained, and the specific formula is as follows:

[0150]

[0151] Where F is the failure probability and U is the breakdown voltage. For scale parameters, For shape parameters.

[0152] Taking the logarithm of both sides of the above formula, we get the following formula:

[0153]

[0154] set up , , Then the above formula can be expressed as:

[0155]

[0156] Thus, by calculating the slope and intercept of the curve, we can obtain... and .

[0157] Thus, taking the breakdown voltage value corresponding to a failure probability of 63.2% as the characteristic breakdown voltage of the sample, the characteristic breakdown voltages of the interface samples at different crosslinking temperatures can be shown in Table 2:

[0158] Table 2

[0159]

[0160] As shown in Table 2, the breakdown voltage gradually decreases with increasing crosslinking time. The characteristic breakdown voltage of the sample is the highest when the crosslinking time is 15 min, which is 20.45 kV. The characteristic breakdown voltage of the sample is the lowest when the crosslinking time is 60 min, which is 17.36 kV, a decrease of 3.08 kV.

[0161] S203. Obtain the mapping relationship between crosslinking time and interfacial insulation performance.

[0162] The mapping relationship is obtained based on the cross-linking time of each interface sample, multiple first indicator data, multiple second indicator data, and multiple third indicator data.

[0163] The mapping relationship can refer to the correspondence between cross-linking time and various indicators of interfacial insulation performance, including but not limited to the trends of cross-linking time and adhesion force, cross-linking time and transition layer area, cross-linking time and DC conductivity, cross-linking time and characteristic breakdown voltage, as well as the interrelationships between various performance indicators. The mapping relationship can be presented in the form of data tables, trend curves, mathematical functions, or empirical formulas.

[0164] Below, in conjunction with Figure 9 , Figure 10 and Figure 11 The cross-linking time and the changing trends of various performance indicators are explained in detail.

[0165] Taking cross-linking times of 15 minutes, 30 minutes, 45 minutes, and 60 minutes as examples, Figure 9 This is a schematic diagram showing the adhesion force of interface samples with different crosslinking times provided in this application. Figure 10 This is a schematic diagram showing the DC conductivity of interface samples with different crosslinking durations provided in this application. Figure 11 A schematic diagram of the breakdown voltage of interface samples with different crosslinking durations provided in this application.

[0166] Among them, Figure 9 During the crosslinking process, as the crosslinking time gradually increased from 15 min to 60 min, the adhesion force of the interface samples showed a continuous downward trend. Specifically, the adhesion force was 55 N at 15 min, decreased to 49 N at 30 min, further decreased to 47 N at 45 min, and was 43 N at 60 min. The rate of decrease showed a fluctuating characteristic of being fast at first, slow at second, and then fast again. The largest decrease was observed between 15 min and 30 min (10.9%), the decrease narrowed between 30 min and 45 min (4.1%), and the decrease expanded again between 45 min and 60 min (8.5%). This indicates that the rate of decrease in adhesion force gradually decreases with increasing time, which has an inhibitory effect on the insulation performance of the interface. That is, the interfacial bonding strength between XLPE and the semiconductive shielding layer gradually weakens with the extension of crosslinking time.

[0167] exist Figure 10 In the crosslinking process, the DC conductivity of the interface sample showed a continuous increasing trend with the extension of crosslinking time, reaching 2.1174 × 10⁻⁶ at 15 min. S / m, increased to 3.83594× at 30 min. S / m, 4.32289× at 45 min. S / m, which jumped significantly to 8.366× at 60 min. S / m; among them, the increase was relatively slow from 15 min to 45 min, and the increase was significantly larger from 45 min to 60 min, indicating that the leakage conductivity of the interface insulation layer gradually deteriorates with the extension of cross-linking time. Excessive cross-linking time will aggravate the interface charge transport and reduce insulation reliability.

[0168] exist Figure 11 In the study, the Weber distribution curves of the breakdown voltage of interface samples with different cross-linking times shifted to the left as the cross-linking time increased. The characteristic breakdown voltage corresponding to a failure probability of 63.2% gradually decreased with the extension of the cross-linking time: the characteristic breakdown voltage was the highest at 15 min, and decreased sequentially at 30 min, 45 min, and 60 min. This indicates that the high voltage breakdown resistance of the interface samples continued to decrease with the extension of the cross-linking time. An excessively long cross-linking time will significantly weaken the electrical insulation strength of the interface and increase the likelihood of cable joint breakdown failure under high voltage conditions.

[0169] In some embodiments, the mapping relationship can be determined by the changing trend of each performance index with the crosslinking time. Specifically, the different crosslinking times prepared in step S201 (e.g., 15 min, 30 min, 45 min, 60 min) are used as independent variables, and the adhesion force, transition layer area, DC conductivity and characteristic breakdown voltage corresponding to each crosslinking time measured in step S202 are used as dependent variables. Curves of each performance index changing with the crosslinking time are plotted respectively.

[0170] Furthermore, by analyzing the various change curves, the following pattern can be observed: as the crosslinking time increases, the characteristic breakdown voltage shows a continuous downward trend, decreasing in the 15min to 30min stage, with the decrease widening in the 30min to 45min stage, and further decreasing in the 45min to 60min stage.

[0171] The area of ​​the transition layer gradually decreases with the increase of crosslinking time, and its trend is basically consistent with the decreasing trend of characteristic breakdown voltage, indicating that there is a clear positive correlation between the two. The DC conductivity gradually increases with the extension of crosslinking time, with the increase being particularly significant at 45 min and 60 min, indicating that the DC conductivity is negatively correlated with the characteristic breakdown voltage.

[0172] The adhesion strength fluctuated with the crosslinking time, showing an initial rapid decrease followed by a slower decrease and then a rapid increase again. The decrease was most pronounced between 15 and 30 minutes, narrowed between 30 and 45 minutes, and decreased again between 45 and 60 minutes. Adhesion strength essentially reflects the compatibility and bonding degree of the two materials at the interface. It is generally believed that an increased transition zone area is beneficial for enhancing interfacial bonding. In this experiment, the adhesion strength increased with the expansion of the transition zone area, showing consistency. This may indicate that with longer crosslinking times, the internal structure may deteriorate, such as due to uneven crosslinking distribution, interfacial stress concentration, or weakened chemical bonds, leading to a smaller transition zone area and thus reduced adhesion strength.

[0173] Further analysis of the correlations among the various indicators reveals that both characteristic breakdown voltage and adhesion force are positively correlated with the transition layer area; that is, the larger the transition layer area, the higher the breakdown voltage and the stronger the adhesion force. Conversely, DC conductivity is negatively correlated with the transition layer area; that is, the larger the transition layer area, the lower the DC conductivity. This indicates that the crosslinking time primarily affects the overall insulation performance of the interface by regulating the formation and evolution of the interfacial transition layer, and the transition layer area is a key microstructural feature determining the interfacial insulation performance.

[0174] Among them, the transition layer, as the transition region between the two phases, has an area and structural characteristics that are key factors determining the breakdown voltage and adhesion strength. On the one hand, a decrease in the area of ​​the transition layer indicates a decrease in the cross-linking area between the cross-linked polyethylene and the semi-conductive layer, resulting in a decrease in breakdown voltage and adhesion strength. On the other hand, the composition and morphology of this region also directly affect the interaction of molecular chains and stress transmission at the interface, thus determining its insulation performance.

[0175] From a mechanistic perspective, the formation of the permeation zone is the result of the combined effects of multiple factors during the cross-linking process. As cross-linking proceeds, the interaction between the filler and the matrix in the semiconductive layer, the diffusion behavior of the cross-linking agent, and the motion state of the molecular chains at the interface all change, forming a transition region with a certain structure and gradient. The size, uniformity, and density of this region not only affect the electric field distribution and charge transport behavior near the interface but also determine the failure mode and energy dissipation mechanism of the material under stress.

[0176] Through the above analysis, a mapping relationship between crosslinking time and interfacial insulation performance can be established. For example, crosslinking time can be used as the independent variable, and the set of changing trends of multiple indicators or the comprehensive performance can be used as the dependent variable to form a mapping relationship between crosslinking time and interfacial insulation performance. For example, the comprehensive insulation performance level of the interface under different crosslinking times can be presented intuitively through the form of "crosslinking time - multiple indicator change curves" or "crosslinking time - performance correlation table".

[0177] This mapping relationship includes both the correspondence between crosslinking time and each individual performance indicator, as well as the interrelationship between the performance indicators, providing a data foundation and basis for subsequently determining the target crosslinking time that meets the preset conditions.

[0178] S204. Based on the mapping relationship, the target cross-linking time of the cable joint is obtained by inversion with the goal of meeting the preset conditions for interface insulation performance.

[0179] Interface insulation performance can be defined as a comprehensive evaluation index composed of three indicators: first, adhesion; second, transition layer area; and third, DC conductivity and characteristic breakdown voltage. Interface insulation performance reflects the overall performance of the interface between cross-linked polyethylene and the semi-conductive shielding layer in terms of mechanical strength, microstructure, and electrical withstand capability.

[0180] The target crosslinking time can refer to the crosslinking time obtained by inversion under the premise of meeting the preset interface insulation performance conditions, so as to ensure that the joint interface has excellent insulation performance.

[0181] Optionally, in cable insulation design and process control, the dual impact of crosslinking time on the penetration zone structure must be comprehensively considered. By optimizing the crosslinking process, a balance can be achieved between the penetration zone area, interfacial bonding strength, and electrical performance, thereby improving the overall reliability of the cable insulation system. In other words, rationally controlling the crosslinking time is crucial for achieving optimized interfacial structure and synergistic performance. Taking crosslinking times of 15 minutes, 30 minutes, 45 minutes, and 60 minutes as examples, based on the above, it can be concluded that the XLPE / semi-conductive shielding layer exhibits the best interfacial insulation performance at a crosslinking time of 15 minutes. Therefore, the target crosslinking time can be determined to be 15 minutes.

[0182] In some embodiments, preset conditions for the interface insulation performance can be set according to the application scenario and performance requirements of the cable joint. For example, the characteristic breakdown voltage can be set to be no less than a certain threshold (e.g., 19kV), the adhesion force can be set to be no less than a certain threshold (e.g., 50N), and the DC conductivity can be set to be no more than a certain threshold (e.g., 3.0×). (S / m), or any combination of the above conditions. The preset conditions can be flexibly configured according to factors such as the cable voltage level, operating environment, and safety margin.

[0183] Furthermore, based on the mapping relationship obtained in step S203, and with preset conditions as the constraint objectives, an inversion solution is performed. Specifically, the time intervals that satisfy each preset condition can be found from the mapping relationship. For example, if the preset condition requires the characteristic breakdown voltage to be no less than 19kV, then based on the curve of crosslinking time versus characteristic breakdown voltage, it is assumed that the time interval satisfying this condition is a crosslinking time of no more than 35 minutes; if at the same time, the transition layer area is required to be no less than 80μm... 2Based on the curve showing the change in crosslinking time versus transition layer area, the time interval can be further narrowed to a crosslinking time not exceeding 30 minutes; if the DC conductivity is further required to be no higher than 3.0 × 10⁻⁶, then... Based on the crosslinking time and DC conductivity variation curve, the time interval that satisfies all preset conditions can be finally determined to be a crosslinking time between 15 min and 20 min.

[0184] In some embodiments, an optimization algorithm can be used for accurate solution. For example, an evaluation function is constructed with crosslinking time as the decision variable and the objective of minimizing the deviation between the predicted performance and the preset conditions. An iterative search is performed within the crosslinking time range to gradually approach the optimal crosslinking time that ensures the interface insulation performance meets the preset conditions. Through the above inversion solution process, the target crosslinking time of the cable joint is finally obtained.

[0185] In some embodiments, the target crosslinking time can be a specific value, such as 16.3 min; or it can be a time range, such as 15 min to 20 min. This target crosslinking time is used to guide the setting of process parameters in cable joint production, which helps to improve the insulation performance of the joint interface and ensure the long-term reliable operation of the cable system.

[0186] The method, apparatus, equipment, and storage medium for determining the crosslinking time of cable joints provided in this application obtain multi-dimensional index data related to the mechanical, structural, and electrical properties of each interface sample by preparing multiple interface samples with crosslinking times, as well as the mapping relationship between the crosslinking time and the interface insulation performance determined by the crosslinking time and the multi-dimensional index data. The target crosslinking time of the cable joint is obtained by inversion with the interface insulation performance meeting the preset conditions. In the above method, electronic devices can cover the influence range of crosslinking time on interface performance by setting interface samples with different crosslinking times, avoiding model bias caused by uneven sample distribution. By acquiring index data in three dimensions—mechanical, structural, and electrical—interface insulation performance can be comprehensively evaluated from multiple levels, including interface bonding strength, micro-fusion degree, and electrical tolerance. This achieves correlation analysis between multi-dimensional indicators, avoiding the limitations of single-indicator analysis. By obtaining the mapping relationship between crosslinking time and interface insulation performance, the complex nonlinear coupling relationship between multi-dimensional performance indicators can be determined, enabling accurate prediction of interface performance. By performing inversion with the goal of meeting preset conditions for interface insulation performance, the optimal crosslinking time can be directly determined in reverse according to performance requirements. This achieves intelligent collaborative optimization of crosslinking time and interface insulation performance, significantly improving the stability and safety of submarine cable transmission systems while enhancing the accuracy and reliability of crosslinking time determination.

[0187] Figure 12 A schematic diagram illustrating the process of determining a mapping relationship provided in this application, as shown below. Figure 12 As shown, in this embodiment... Figure 2 Based on the examples, a method for determining the mapping relationship between crosslinking time and interfacial insulation performance is described in detail. This method includes:

[0188] S1201. Perform feature extraction processing on multiple first indicator data, multiple second indicator data and multiple third indicator data to obtain multiple feature parameters.

[0189] Among them, feature parameters are used to indicate the degree of correlation between various indicator data. This can be understood as the quantitative correlation features obtained through comprehensive analysis and correlation mining of three types of indicator data: mechanical properties (adhesion force), structural properties (transition layer area), and electrical properties (DC conductivity, characteristic breakdown voltage). For example, feature parameters may include, but are not limited to, Pearson correlation coefficients, covariance, slope of indicator changes with crosslinking time, extreme value features, etc., used to characterize the coupling law between multi-dimensional performances, providing high-information input for subsequent model training, thereby improving the expressive power and generalization performance of subsequent prediction models.

[0190] In some embodiments, the electronic device can collect measured data of a first indicator (adhesion force), a second indicator (transition layer area), and a third indicator (DC conductivity and characteristic breakdown voltage) under different cross-linking durations. Furthermore, by comprehensively analyzing the three types of indicators, the Pearson correlation coefficients between each indicator are calculated (e.g., the positive correlation coefficient between adhesion force and transition layer area, and the negative correlation coefficient between DC conductivity and characteristic breakdown voltage). The slope of each indicator's change with cross-linking duration (e.g., the rate of decrease in adhesion force and the rate of increase in DC conductivity), as well as the extreme value characteristics of each indicator (e.g., the maximum value of adhesion force and the minimum value of characteristic breakdown voltage), are extracted. Finally, the aforementioned correlation coefficients, slopes, and extreme value characteristics are integrated into multiple feature parameters to characterize the coupling laws and trends among multi-dimensional performance.

[0191] Optionally, the electronic device can also calculate one or more of the following characteristic parameters. Specifically, first, it calculates the ratio of adhesion force to transition layer area, which reflects the contribution of unit transition layer area to interfacial bonding strength and is used to characterize the efficiency of the influence of microstructure on mechanical properties. Second, it calculates the product of transition layer area and characteristic breakdown voltage, as well as the ratio of DC conductivity to transition layer area. The former reflects the contribution of transition layer area to insulation limit, and the latter reflects the density of conductive defects per unit transition layer area. Third, it calculates the correlation index between characteristic breakdown voltage and adhesion force, as well as the ratio of DC conductivity to characteristic breakdown voltage, to characterize the synergistic or restrictive relationship between mechanical and electrical properties.

[0192] In some embodiments, electronic devices can normalize index data of different dimensions and then perform combined calculations, or use principal component analysis to extract principal component features that can retain the original data information to the greatest extent.

[0193] In this way, through the above feature extraction process, multiple feature parameters are obtained. These feature parameters not only contain information about each individual indicator, but more importantly, they reflect the coupling relationship between performance in different dimensions, providing richer input features for subsequent model training.

[0194] S1202. Based on the cross-linking time of each interface sample and multiple feature parameters, the prediction model is trained to obtain the mapping relationship.

[0195] A predictive model can refer to a mathematical model trained using machine learning algorithms, used to describe the mapping relationship between crosslinking time and interfacial insulation performance. A predictive model can be a single model (e.g., random forest, support vector machine, neural network, etc.) or a combined model composed of multiple sub-models.

[0196] In some embodiments, the electronic device may train a prediction model based on the crosslinking time of each interface sample and multiple feature parameters to obtain a mapping relationship: a first mapping relationship between crosslinking time and mechanical properties is determined based on the prediction model, the crosslinking time of each interface sample, and the feature parameters corresponding to each first index data; a second mapping relationship between crosslinking time and structural properties is determined based on the prediction model, the crosslinking time of each interface sample, and the feature parameters corresponding to each second index data; a third mapping relationship between crosslinking time and electrical properties is determined based on the prediction model, the crosslinking time of each interface sample, and the feature parameters corresponding to each third index data; and the first, second, and third mapping relationships are then defined as the mapping relationship.

[0197] The first mapping relationship can refer to the correspondence between cross-linking time and interfacial mechanical properties, specifically manifested as the functional relationship or law between cross-linking time and adhesion force.

[0198] The second mapping relationship can refer to the correspondence between crosslinking time and interface structural performance, specifically manifested as a functional relationship or law between crosslinking time and transition layer area.

[0199] The third mapping relationship can refer to the correspondence between cross-linking time and interface electrical properties, specifically manifested as the functional relationship or law between cross-linking time and DC conductivity and characteristic breakdown voltage.

[0200] In some embodiments, the electronic device can use the cross-linking time of each interface sample as model input and the feature parameters corresponding to the first index data (e.g., measured adhesion force, correlation coefficient between adhesion force and transition layer area) as model output to construct a training dataset. Based on the prediction model, the training dataset is iteratively trained to optimize the model parameters, enabling the model to accurately fit the nonlinear relationship between cross-linking time and mechanical performance feature parameters. After training, the model can output the corresponding mechanical performance feature parameters according to the input cross-linking time, forming the first mapping relationship between cross-linking time and mechanical performance. For example, if the input cross-linking time is 15 minutes, the model can output the corresponding predicted adhesion force value and its correlation with the structural index.

[0201] In some embodiments, the electronic device can use the cross-linking duration of each interface sample as model input and the feature parameters corresponding to the second indicator data (e.g., the measured value of the transition layer area, the correlation coefficient between the transition layer area and the characteristic breakdown voltage) as model output to construct a training dataset; using the same prediction model framework as the first mapping relationship, iteratively train the training dataset to optimize the model parameters, so that the model can accurately fit the nonlinear relationship between the cross-linking duration and the structural performance feature parameters; after training, the model can output the corresponding structural performance feature parameters according to the input cross-linking duration, forming a second mapping relationship between the cross-linking duration and the structural performance.

[0202] In some embodiments, the electronic device can use the cross-linking duration of each interface sample as model input and the feature parameters corresponding to the third indicator data (e.g., measured DC conductivity, measured characteristic breakdown voltage, and the negative correlation coefficient between the two) as model output to construct a training dataset. Using the same prediction model framework, the training dataset is iteratively trained to optimize the model parameters, enabling the model to accurately fit the nonlinear relationship between cross-linking duration and electrical performance feature parameters. After training, the model can output the corresponding electrical performance feature parameters based on the input cross-linking duration, forming a third mapping relationship between cross-linking duration and electrical performance.

[0203] Optionally, the prediction model may include a first sub-model for describing the relationship between crosslinking time and mechanical properties, a second sub-model for describing the relationship between crosslinking time and structural properties, and a third sub-model for describing the relationship between crosslinking time and electrical properties.

[0204] For example, the cross-linking duration of each interface sample can be used as the input feature, the adhesion force corresponding to each interface sample can be used as the output label, and the mechanical-structural correlation features extracted in step S1201 can be used as auxiliary features to construct a first training dataset. The first training dataset is input into the first sub-model for training, and the model parameters are adjusted by an optimization algorithm to minimize the error between the predicted adhesion force output by the model and the actual measured adhesion force. After training, a first sub-model that can describe the mapping relationship between cross-linking duration and adhesion force is obtained, and this sub-model is the first mapping relationship.

[0205] The first mapping relationship reflects the influence of crosslinking time on the interfacial mechanical properties. For example, as the crosslinking time increases, the adhesion force exhibits a decreasing trend of first rapidly, then slowly, and then rapidly again. The second mapping relationship can be obtained through the second sub-model. For example, as the crosslinking time increases, the transition layer area gradually decreases. The third mapping relationship can be obtained through the third sub-model. For example, as the crosslinking time increases, the DC conductivity gradually increases, and the characteristic breakdown voltage gradually decreases.

[0206] The method, apparatus, equipment, and storage medium for determining the crosslinking time of cable joints provided in this application obtain multiple feature parameters indicating the degree of correlation between various indicator data by performing feature extraction processing on multiple first indicator data, multiple second indicator data, and multiple third indicator data. The prediction model is trained based on the crosslinking time of each interface sample and the multiple feature parameters to determine the first mapping relationship between crosslinking time and mechanical properties, the second mapping relationship between crosslinking time and structural properties, and the third mapping relationship between crosslinking time and electrical properties, thereby establishing a complete mapping relationship between crosslinking time and interface insulation performance. In the above method, electronic devices can use feature extraction to uncover the coupling correlation between mechanical, structural, and electrical performance indicators, avoiding the limitations of single-indicator analysis and providing more representative input features for subsequent modeling. By training prediction models to establish mapping relationships between crosslinking time and mechanical, structural, and electrical performance, decoupling and collaborative modeling of multi-dimensional performance indicators can be achieved, capturing the complex nonlinear coupling relationship between crosslinking time and interface insulation performance, and avoiding prediction bias caused by relying on linear assumptions or empirical formulas. In addition, this method is applicable to the optimization of process parameters for different types of cable joints, significantly improving the intelligence level and efficiency of process parameter setting while improving the accuracy and reliability of crosslinking time determination.

[0207] Figure 13 A schematic diagram illustrating the process for determining the target crosslinking duration provided in this application. Please refer to [link / reference]. Figure 13 The method may include:

[0208] S1301. Determine the constraints corresponding to the interface insulation performance.

[0209] The constraints are used to limit the range of the first, second, and third index data. They can be understood as restrictive requirements set for each index of the interface insulation performance, characterizing the performance standards that the target crosslinking time needs to meet. For example, constraints may include constraints on a single index (e.g., characteristic breakdown voltage not less than 20kV), or combined constraints on multiple indexes (e.g., characteristic breakdown voltage not less than 20kV and adhesion force not less than 45N, etc.).

[0210] S1302. Based on the pre-trained prediction model and mapping relationship, the target crosslinking time of the cable joint is obtained by inversion solution with the interface insulation performance meeting the constraint conditions.

[0211] In practical applications, this mapping relationship can be pre-established and stored in electronic devices. When it is necessary to determine the target crosslinking time, the electronic device directly obtains the established mapping relationship without the need for re-preparation of samples and retraining of the model, significantly reducing the computational overhead and operational complexity in field applications. Based on the pre-obtained mapping relationship and combined with the preset conditions for interface insulation performance, the target crosslinking time that meets the performance requirements can be obtained quickly and accurately, providing a direct basis for setting subsequent process parameters.

[0212] In some embodiments, the electronic device may, based on a pre-trained prediction model and mapping relationship, perform inversion to solve for the interface insulation performance to meet the constraint conditions, thereby obtaining the target crosslinking time of the cable joint: within a preset crosslinking time range, determine the initial crosslinking time; based on the initial crosslinking time, the pre-trained prediction model, and the mapping relationship, obtain the performance index corresponding to the initial crosslinking time; based on the deviation between the performance index corresponding to the initial crosslinking time and the constraint conditions, adjust the current crosslinking time to obtain the updated crosslinking time; repeat the above adjustment steps until the deviation meets the preset requirements, and determine the crosslinking time as the target crosslinking time of the cable joint.

[0213] The initial crosslinking duration can refer to the starting search point selected within a preset crosslinking duration range, serving as the initial value for iterative optimization. The initial crosslinking duration can be selected based on empirical values ​​(e.g., a default of 15 minutes), the changing trend of the mapping relationship (e.g., selecting a region with relatively gradual performance changes as the starting point), or randomly within the crosslinking duration range. The selection of the initial crosslinking duration affects the speed of iterative convergence but does not affect the final solution result.

[0214] In some embodiments, the electronic device can determine a range of crosslinking durations to be predicted, for example, from 10 minutes to 70 minutes. Within this range, an initial crosslinking duration (e.g., 20 minutes) is determined. The initial crosslinking duration is then input into a pre-trained prediction model. Based on the established mapping, the prediction model makes a forward prediction of the initial crosslinking duration and outputs the predicted performance metrics corresponding to that crosslinking duration. For example, the first sub-model of the prediction model outputs the predicted adhesion force, the second sub-model outputs the predicted transition layer area, and the third sub-model outputs the predicted DC conductivity and the predicted characteristic breakdown voltage.

[0215] Through the above process, a complete set of predicted performance indicators corresponding to the initial crosslinking time is obtained, including predicted adhesion force, predicted transition layer area, predicted DC conductivity and predicted characteristic breakdown voltage. The initial crosslinking time is associated with the corresponding multi-dimensional performance indicators and stored to form a crosslinking time-performance indicator correspondence table.

[0216] In some embodiments, the electronic device calculates the deviation between the predicted performance indicators and the constraints. If the deviation meets a preset requirement (e.g., all indicators meet the constraints, or the overall deviation is less than a preset threshold), the current crosslinking time is determined as the target crosslinking time.

[0217] If the deviation does not meet the requirements, the crosslinking time is adjusted in reverse based on the deviation information: the adjustment direction and step size of the crosslinking time are determined according to the degree and direction of deviation of each predicted performance from the constraint conditions. For example, if the predicted characteristic breakdown voltage is lower than the constraint lower limit, it indicates that the current crosslinking time is too long and should be adjusted in the direction of reducing the crosslinking time; if the predicted adhesion is lower than the constraint lower limit and the transition layer area is too small, the adjustment should also be made in the direction of reducing the crosslinking time. The adjustment step size is dynamically determined according to the magnitude of the deviation. When the deviation is large, a larger step size is used to quickly approach the target area, and when the deviation is small, a smaller step size is used to finely locate the optimal value. The crosslinking time is updated according to the determined adjustment direction and step size to obtain the updated crosslinking time.

[0218] Furthermore, the updated crosslinking time is used as the new current crosslinking time, and the iterative cycle of predicting performance, calculating deviation, determining whether the requirements are met, and making reverse adjustments is repeated until the deviation meets the preset requirements. When the iteration converges, the current crosslinking time is determined as the target crosslinking time that satisfies the interface insulation performance constraint. In this way, performance constraints can be used as the solution objective, the prediction model can be used as the forward calculation tool, and the crosslinking time that satisfies the constraints can be approximated by iterative adjustments, thus realizing the inverse derivation of process parameters from the performance objective.

[0219] Optionally, a Bayesian optimization algorithm can be used to replace the gradient-based adjustment method described above. Specifically, the cross-linking duration is used as the decision variable, and the combined deviation between prediction performance and constraints is used as the objective function to be optimized. A Gaussian process surrogate model is constructed to approximate the objective function, and the uncertainty estimation of the surrogate model is used to guide the search direction.

[0220] In each iteration, the expected improvement of each candidate crosslinking duration is calculated based on the model, and the crosslinking duration with the largest expected improvement is selected as the baseline for this round. This crosslinking duration is input into the prediction model to obtain the actual deviation value, and the surrogate model is updated with this result. The iteration is repeated to gradually approach the optimal crosslinking duration that minimizes the deviation.

[0221] Upon convergence, the current crosslinking duration is determined as the target crosslinking duration. This method can find the optimal solution with fewer iterations and is suitable for situations where the objective function is complex and the gradient is difficult to calculate directly.

[0222] The method, apparatus, equipment, and storage medium for determining the crosslinking time of cable joints provided in this application determine the constraint conditions corresponding to the interface insulation performance. These constraint conditions constrain the range of the first, second, and third indicator data. Based on a pre-trained prediction model and mapping relationship, the method performs an inversion solution with the interface insulation performance meeting the constraint conditions as the objective, thereby obtaining the target crosslinking time of the cable joint. In this method, the electronic equipment can flexibly set constraint conditions according to the specific requirements of the interface mechanical, structural, and electrical performance in the actual application scenario, and perform an inversion solution based on the pre-established mapping relationship to directly obtain the target crosslinking time that meets all performance constraints. This effectively avoids the problem of long testing cycles caused by blind adjustment of process parameters, eliminates the need for repeated adjustments based on human experience, and improves the efficiency and accuracy of crosslinking time determination. Furthermore, this method is applicable to different crosslinking time ranges and the complex operating conditions of high-voltage submarine cable joints, ensuring interface insulation performance. It can also dynamically adjust constraint conditions and solution results according to different performance requirements, significantly improving the intelligence level and efficiency of cable joint process parameter setting while improving the accuracy and reliability of crosslinking time determination.

[0223] Figure 14 A schematic diagram of a device for determining the crosslinking time of a cable joint provided in this application is shown below. Figure 14 As shown, the cable joint crosslinking time determination device 1400 provided in this embodiment includes: a preparation module 1401, a determination module 1402, an acquisition module 1403, and a processing module 1404, wherein,

[0224] The preparation module 1401 is used to prepare multiple interface samples after cross-linking of cross-linked polyethylene and semiconductive shielding layer. The interface samples include cross-linked polyethylene, semiconductive shielding layer and transition layer containing the two. The cross-linking time of each interface sample is different.

[0225] The determination module 1402 is used to determine the first index data related to mechanical performance, the second index data related to structural performance, and the third index data related to electrical performance corresponding to each interface sample.

[0226] The acquisition module 1403 is used to acquire the mapping relationship between cross-linking time and interface insulation performance. The mapping relationship is obtained based on the cross-linking time of each interface sample, multiple first index data, multiple second index data and multiple third index data.

[0227] The processing module 1404 is used to perform inversion based on the mapping relationship, with the interface insulation performance meeting the preset conditions as the objective, to obtain the target cross-linking time of the cable joint.

[0228] The device for determining the crosslinking time of a cable joint provided in this application embodiment can execute the technical solution shown in the above method embodiment. Its implementation principle and beneficial effects are similar, and will not be described again here.

[0229] In one possible implementation, the determining module 1402 is specifically used for:

[0230] Each interface sample was stretched, and multiple peel tests were performed on the stretched interface samples to obtain the adhesion force corresponding to each interface sample. The adhesion force was determined as the first indicator data.

[0231] The cross-sectional structure of the transition layer in each interface sample is scanned to obtain the area of ​​the transition layer in each interface sample, and the area of ​​the transition layer is determined as the second indicator data.

[0232] The current and voltage parameters of the transition layer in each interface sample are determined, and the current and voltage parameters are used as the third index data.

[0233] In one possible implementation, the determining module 1402 is specifically used for:

[0234] A polarization voltage is applied to the interface sample to obtain the corresponding polarization current value, and the polarization voltage is stopped from being applied to the interface sample to obtain the corresponding depolarization current value.

[0235] Based on the polarization current value and the depolarization current value, the current parameters of the interface sample are determined. The current parameters are used to indicate the conductivity of the interface sample.

[0236] A breakdown test was performed on the interface sample to obtain the corresponding breakdown voltage value, and the breakdown voltage value was determined as the voltage parameter.

[0237] In one possible implementation, the acquisition module 1403 is specifically used for:

[0238] Feature extraction processing is performed on multiple first indicator data, multiple second indicator data, and multiple third indicator data to obtain multiple feature parameters. The feature parameters are used to indicate the degree of correlation between the various indicator data.

[0239] The prediction model is trained based on the cross-linking duration and multiple feature parameters of each interface sample to obtain the mapping relationship.

[0240] In one possible implementation, the acquisition module 1403 is specifically used for:

[0241] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each first index data, the first mapping relationship between crosslinking time and mechanical properties is determined.

[0242] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each second index data, the second mapping relationship between crosslinking time and structural performance is determined.

[0243] Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each third index data, the third mapping relationship between crosslinking time and electrical performance is determined.

[0244] The first, second, and third mapping relationships are defined as mapping relationships.

[0245] In one possible implementation, the processing module 1404 is specifically used for:

[0246] Determine the constraints corresponding to the interface insulation performance. The constraints are used to limit the range of the first index data, the second index data, and the third index data.

[0247] Based on the pre-trained prediction model and mapping relationship, the target cross-linking time of the cable joint is obtained by inversion solution with the interface insulation performance meeting the constraint conditions.

[0248] In one possible implementation, the processing module 1404 is specifically used for:

[0249] Within the preset crosslinking time range, determine the initial crosslinking time;

[0250] Based on the initial crosslinking time, the pre-trained prediction model, and the mapping relationship, the performance index corresponding to the initial crosslinking time is obtained;

[0251] Based on the deviation between the performance index and the constraint conditions corresponding to the initial crosslinking time, the current crosslinking time is adjusted to obtain the updated crosslinking time;

[0252] Repeat the above adjustment steps until the deviation meets the preset requirements, and then determine the current crosslinking time as the target crosslinking time of the cable joint.

[0253] Figure 15 A schematic diagram of the structure of the electronic device provided in this application. Figure 15 As shown, the electronic device 1500 provided in this embodiment includes at least one processor 1501 and a memory 1502. Optionally, the electronic device 1500 further includes a communication component 1503. The processor 1501, memory 1502, and communication component 1503 are connected via a bus.

[0254] In a specific implementation, at least one processor 1501 executes computer execution instructions stored in memory 1502, causing at least one processor 1501 to perform the above-described method.

[0255] The specific implementation process of processor 1501 can be found in the above method embodiments, and its implementation principle and technical effect are similar. It will not be repeated here.

[0256] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0257] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0258] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0259] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0260] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method.

[0261] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0262] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0263] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0264] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0265] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0266] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0267] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0268] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A method of determining the crosslinking duration of a cable joint, characterized in that, include: Multiple interface samples were prepared after cross-linking of cross-linked polyethylene and a semiconductive shielding layer. The interface samples included cross-linked polyethylene, a semiconductive shielding layer, and a transition layer between the two. The cross-linking time of each interface sample was different. Determine the first index data related to mechanical performance, the second index data related to structural performance, and the third index data related to electrical performance for each interface sample; The mapping relationship between the crosslinking time and the interface insulation performance is obtained, and the mapping relationship is obtained based on the crosslinking time of each interface sample, multiple first index data, multiple second index data and multiple third index data; Based on the mapping relationship, the target crosslinking time of the cable joint is obtained by inversion with the goal of meeting the preset conditions for interface insulation performance.

2. The method according to claim 1, characterized in that, Determining the first index data related to mechanical performance, the second index data related to structural performance, and the third index data related to electrical performance for each interface sample includes: Each interface sample is stretched, and the stretched interface samples are subjected to multiple peel tests to obtain the adhesion force corresponding to each interface sample, and the adhesion force is determined as the first index data. The cross-sectional structure of the transition layer in each interface sample is scanned to obtain the area of ​​the transition layer of each interface sample, and the area of ​​the transition layer is determined as the second index data. The current and voltage parameters of the transition layer in each interface sample are determined, and the current and voltage parameters are used as the third index data.

3. The method according to claim 2, characterized in that, For any given interface sample; determine the current and voltage parameters of the transition layer in each interface sample, including: A polarization voltage is applied to the interface sample to obtain the corresponding polarization current value, and the polarization voltage is stopped from being applied to the interface sample to obtain the corresponding depolarization current value. Based on the polarization current value and the depolarization current value, the current parameters of the interface sample are determined, and the current parameters are used to indicate the conductivity of the interface sample. The interface sample is subjected to a breakdown test to obtain the corresponding breakdown voltage value, and the breakdown voltage value is determined as a voltage parameter.

4. The method according to claim 1, characterized in that, The mapping relationship is obtained based on the crosslinking duration of each interface sample, multiple first indicator data, multiple second indicator data, and multiple third indicator data, including: Feature extraction processing is performed on the plurality of first indicator data, the plurality of second indicator data, and the plurality of third indicator data to obtain a plurality of feature parameters, which are used to indicate the degree of correlation between the indicator data; The prediction model is trained based on the cross-linking duration of each interface sample and the multiple feature parameters to obtain the mapping relationship.

5. The method according to claim 4, characterized in that, Based on the cross-linking duration of each interface sample and the multiple feature parameters, the prediction model is trained to obtain the mapping relationship, including: Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each first index data, a first mapping relationship between the crosslinking time and the mechanical properties is determined. Based on the prediction model, the crosslinking time of each interface sample, and the characteristic parameters corresponding to each second index data, a second mapping relationship between the crosslinking time and the structural performance is determined. Based on the prediction model, the crosslinking duration of each interface sample, and the characteristic parameters corresponding to each third index data, a third mapping relationship between the crosslinking duration and the electrical performance is determined. The first mapping relationship, the second mapping relationship, and the third mapping relationship are determined as the mapping relationship.

6. The method according to claim 5, characterized in that, Based on the mapping relationship, an inversion is performed with the goal of meeting preset conditions for interface insulation performance to obtain the target crosslinking time of the cable joint, including: Determine the constraints corresponding to the interface insulation performance, wherein the constraints are used to constrain the range of the first index data, the second index data, and the third index data; Based on the pre-trained prediction model and the mapping relationship, the target crosslinking time of the cable joint is obtained by inversion solution with the interface insulation performance meeting the constraint conditions.

7. The method according to claim 6, characterized in that, Based on the pre-trained prediction model and the mapping relationship, an inversion solution is performed with the interface insulation performance satisfying the constraint conditions to obtain the target crosslinking time of the cable joint, including: Within the preset crosslinking time range, determine the initial crosslinking time; Based on the initial crosslinking duration, the pre-trained prediction model, and the mapping relationship, the performance index corresponding to the initial crosslinking duration is obtained; Based on the deviation between the performance index corresponding to the initial crosslinking time and the constraint conditions, the current crosslinking time is adjusted to obtain the updated crosslinking time; Repeat the above adjustment steps until the deviation meets the preset requirements, and determine the current crosslinking time as the target crosslinking time of the cable joint.

8. A device for determining the cross-linking time of a cable joint, characterized in that, include: The module comprises a preparation module, a determination module, an acquisition module, and a processing module, among which... The preparation module is used to prepare multiple interface samples after cross-linking of cross-linked polyethylene and semi-conductive shielding layer. The interface sample includes cross-linked polyethylene, semi-conductive shielding layer and transition layer containing the two. The cross-linking time of each interface sample is different. The determining module is used to determine the first index data associated with mechanical performance, the second index data associated with structural performance, and the third index data associated with electrical performance corresponding to each interface sample. The acquisition module is used to acquire the mapping relationship between the crosslinking time and the interface insulation performance. The mapping relationship is obtained based on the crosslinking time of each interface sample, multiple first index data, multiple second index data and multiple third index data. The processing module is used to perform inversion based on the mapping relationship, with the goal of meeting the preset conditions for interface insulation performance, to obtain the target crosslinking time of the cable joint.

9. An electronic device, characterized in that, include: Memory, processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory, causing the processor to perform the method as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any one of claims 1-7.