Processing control methods and devices

Abstract

This application provides a processing control method and apparatus. The method includes: emitting a light beam towards a processing object; forming a light beam coverage area on the processing object through the light rays in the light beam; obtaining the position information of pixel points mapped by measurement points from an image corresponding to the light beam coverage area; and obtaining the coordinate information of each measurement point in the light beam coverage area based on a pre-configured calibration relationship and the pixel position information. The method proposed in this application solves the problem that processing equipment often requires expensive hardware to measure the processing area, leading to excessively high overall costs for the processing equipment.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, specifically to a processing control method and apparatus. Background Technology

[0002] As processing equipment evolves from industrial applications to end-user applications, it is no longer limited to industrial use. Processing equipment has become intelligent hardware that can be used at the end, enabling people to perform laser processing on objects through the use of processing equipment.

[0003] The processing procedure performed by the processing equipment allows the desired pattern to be engraved onto the processing area of ​​the workpiece. When processing the processing area, a processing trajectory needs to be established within it, thus requiring measurement of the processing area. This measurement often necessitates expensive hardware, making the entire processing equipment prohibitively expensive.

[0004] Therefore, how to achieve regional measurement at low cost is a pressing dilemma that needs to be solved. Summary of the Invention

[0005] One objective of this application is to solve the technical problem of achieving area measurement at low cost.

[0006] According to one aspect of the embodiments of this application, a processing control method is disclosed, the method comprising:

[0007] A light beam is emitted toward the workpiece, and the light rays in the light beam form a beam coverage area on the workpiece, the beam coverage area containing several measurement points;

[0008] The position information of the pixels mapped from the measurement point is obtained from the image corresponding to the area covered by the beam.

[0009] Based on the pre-configured calibration relationship and the position information of the pixels, the coordinate information of each measurement point in the beam coverage area is obtained, and the coordinate information is used in the processing of the processing object.

[0010] According to one aspect of the embodiments of this application, the processing equipment for carrying out the processing includes a light source for emitting a light beam and forming a plurality of measurement points in the area covered by the light beam.

[0011] According to one aspect of the embodiments of this application, a grid and / or a galvanometer are provided in the optical path of the light source, and the light is distributed at several measurement points in the area covered by the light beam through the grid and / or the galvanometer.

[0012] According to one aspect of the embodiments of this application, the step of emitting a light beam toward a workpiece, and forming a light beam coverage area on the workpiece by the light rays in the light beam, includes:

[0013] A beam of light is emitted, and the light rays in the beam form a beam coverage area;

[0014] The beam is moved according to the relative position of the beam coverage area and the workpiece until the beam coverage area is above the workpiece.

[0015] According to one aspect of the embodiments of this application, the step of emitting a light beam toward a workpiece and forming a light beam coverage area on the workpiece by the light rays in the light beam further includes:

[0016] If it is determined whether the formed beam coverage area completely covers the processing object, then after obtaining the pixel position information mapped by the current measurement point, the beam coverage area continues to move so that the beam coverage area continues to cover other areas of the processing object until the processing object is completely measured.

[0017] According to one aspect of the embodiments of this application, the beam coverage area forms a grid of lines or a dot matrix through light rays, and the plurality of measurement points included in the beam coverage area correspond to the intersections of the grid lines or the points on the dot matrix.

[0018] According to one aspect of the embodiments of this application, obtaining the position information of the pixel points mapped by the measurement point from the image corresponding to the beam coverage area includes:

[0019] Obtain an image corresponding to the area covered by the light beam;

[0020] Identify the pixels corresponding to each measurement point on the image;

[0021] The position information of the pixels mapped by each measurement point in the image is obtained by calculating the position of the pixels in the image based on the position of the pixels.

[0022] According to one aspect of the embodiments of this application, the method further includes:

[0023] Linear fitting is performed based on the coordinate information of the measurement point at different heights of the processed object, and the pixel position information corresponding to the measurement point, to obtain the calibration relationship between the coordinate information of the measurement point and the corresponding pixel position information.

[0024] According to one aspect of the embodiments of this application, after obtaining the coordinate information of each measurement point in the beam coverage area based on the pre-configured calibration relationship and the position information of the pixel, the method further includes:

[0025] Generate a processing area model based on the coordinate information of each measurement point on the processing object;

[0026] The target processing graphic is mapped to the processing area model for pattern adaptation and processing alignment, thereby obtaining the pattern transformation data of the target processing graphic on the processing area model;

[0027] The pattern mapped from the target processing graphic is processed onto the processing object based on the pattern transformation data.

[0028] According to one aspect of the embodiments of this application, a processing control device is disclosed, comprising:

[0029] Projection module: used to emit a light beam toward the workpiece, and the light rays in the light beam form a beam coverage area on the workpiece, the beam coverage area containing several measurement points;

[0030] Acquisition module: used to acquire the position information of the pixel points mapped by the measurement points from the image corresponding to the area covered by the beam;

[0031] Positioning module: used to obtain the coordinate information of each measurement point in the beam coverage area according to the pre-configured calibration relationship and the position information of the pixel, and the coordinate information is used in the processing of the processing object.

[0032] In this embodiment, to achieve rapid and accurate measurement of the coordinates of the processing area and precise positioning of the processing area of ​​the object, thereby enabling the processing of the object, a light beam is first emitted towards the object. The light rays in the beam form a beam coverage area on the object, which contains several measurement points. Next, the position information of the pixels mapped to the measurement points is obtained from the image corresponding to the beam coverage area. Finally, based on a pre-configured calibration relationship and the pixel position information, the coordinate information of each measurement point in the beam coverage area is obtained. This coordinate information is used in the processing of the object. This allows the processing equipment to have the capability for area measurement without relying on expensive equipment, achieving area measurement at low cost. Attached Figure Description

[0033] The above and other objectives, features and advantages of this application will become more apparent from a detailed description of exemplary embodiments thereof with reference to the accompanying drawings.

[0034] Figure 1 A system architecture diagram is shown that is applied according to one embodiment of this application.

[0035] Figure 2 A flowchart of a processing control method for a processing apparatus according to an embodiment of this application is shown.

[0036] Figure 3 A flowchart is shown showing a process for emitting a light beam onto a workpiece according to an embodiment of the present application, and forming a beam coverage area on the workpiece by the light rays in the light beam.

[0037] Figure 4 A flowchart illustrating the acquisition of pixel location information of a measurement point mapping from an image corresponding to a beam coverage area according to an embodiment of this application is shown.

[0038] Figure 5 A schematic diagram of a calibration process according to an embodiment of this application is shown.

[0039] Figure 6 A flowchart of the calibration process according to an embodiment of this application is shown.

[0040] Figure 7 A flowchart illustrating how, according to an embodiment of this application, coordinate information of each measurement point in the beam coverage area is obtained based on a pre-configured calibration relationship and pixel position information.

[0041] Figure 8 A flowchart illustrating the calculation of reference coordinate information of a measurement point under a calibration relationship according to an embodiment of this application is shown.

[0042] Figure 9 The flowchart illustrates the steps following the process of obtaining the coordinate information of each measurement point in the beam coverage area based on a pre-configured calibration relationship and pixel position information, according to one embodiment of this application.

[0043] Figure 10 A hardware schematic diagram of a laser processing apparatus according to an embodiment of this application is shown.

[0044] Figure 11 A schematic diagram of a processing control device for a processing apparatus according to one embodiment of the application is shown.

[0045] Figure 12 A hardware structure diagram of a processing device according to an embodiment of this application is shown. Detailed Implementation

[0046] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided to make the description of this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The drawings are merely illustrative of this application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0047] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more exemplary embodiments. Numerous specific details are provided in the following description to give a full understanding of exemplary embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced with one or more of the specific details omitted, or other methods, components, steps, etc., can be employed. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0048] Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0049] Please see Figure 1 , Figure 1 This is a system architecture used in the embodiments of this application. The system architecture may include: at least one external device 11, such as a host computer, and processing equipment 12 for each external device 11, and at least one production fixture (not shown) for use by the processing equipment, thereby providing users with customizable laser engraving or cutting processing functions. The processing equipment 12 achieves visible-to-see laser engraving or cutting through its own imaging process, and displays the results of the laser engraving or cutting through a visual display.

[0050] As used herein, the term "cutting" generally refers to altering the appearance, properties, and / or state of a material. Cutting can include, for example, through-cutting, engraving, bleaching, curing, firing, etc., and when specifically mentioned herein, engraving refers to the process by which a CNC machine alters the appearance of a material without completely penetrating it. For example, in the context of processing equipment, it can mean removing some material from a surface, or, for example, discoloring a material by applying focused electromagnetic radiation that transfers electromagnetic energy as described below.

[0051] It should be clarified that the process of processing equipment processing the object includes: first, measuring the processing area of ​​the object and determining the coordinate information of the processing area in the mechanical coordinate system constructed by the processing equipment; and then constructing the processing trajectory or processing area model based on the coordinate information of the processing area.

[0052] This application provides a method for measuring the processing area of ​​curved surface processing objects and planar processing objects for processing equipment. Based on this method, the coordinate information of the processing area is obtained. Then, based on the obtained coordinate information of the processing area, the processing equipment constructs the processing trajectory and processing area model, and simulates the processing trajectory or places a processing pattern on the processing area model as a processing reference.

[0053] See Figure 2 , Figure 2 A flowchart of a machining control method for a machining apparatus according to an embodiment of this application is shown. This application provides a method for controlling the machining of a machining apparatus, comprising:

[0054] Step S210: A light beam is emitted toward the workpiece, and the light rays in the light beam form a beam coverage area on the workpiece.

[0055] Step S220: Obtain the position information of the pixel points mapped by the measurement points from the image corresponding to the area covered by the beam;

[0056] Step S230: Based on the pre-configured calibration relationship and the position information of the pixels, obtain the coordinate information of each measurement point in the beam coverage area.

[0057] The following is a detailed description of these three steps.

[0058] In step S210, before the processing equipment performs processing on the object it carries, the object needs to be measured. During the measurement, measurement points need to be formed on the surface of the object. Therefore, the processing equipment controls a light source to emit a light beam towards the object, and the light beam forms a beam coverage area containing the measurement points on the surface of the object.

[0059] In one embodiment of this application, the processing equipment used in the processing is equipped with a light source and a camera. The relative positional relationship between the beam coverage area and the camera remains unchanged, such as the camera always being located directly above the beam coverage area, so as to accurately capture the various measurement points distributed above the beam coverage area. Exemplarily, the light source and camera have a fixed relative positional relationship, such as the light source and camera being configured on the same motion mechanism of the processing equipment. Specifically, both the light source and camera can be configured on a movable motion mechanism within the processing equipment. This motion mechanism can be a movable laser head that emits laser light to perform laser processing on a workpiece, a tool for moving engraving, cutting, or indentation, or a movable nozzle of a 3D printer, etc. Alternatively, the light source can be fixed to the processing equipment, such as the inner wall of the processing equipment. By adding a galvanometer and / or grid to the front end of the light source, the beam coverage area moves with the camera, always maintaining a constant relative positional relationship between the beam coverage area and the camera.

[0060] Furthermore, as used herein, “camera” includes, for example, visible light cameras, black and white cameras, infrared or ultraviolet sensitive cameras, individual brightness sensors such as photodiodes, sensitive photon detectors such as photomultiplier tubes or avalanche photodiodes, detectors of infrared radiation beyond the visible spectrum such as microwaves, X-rays or gamma rays, optically filtered detectors, spectrometers and other detectors, which may include sources that provide electromagnetic radiation for illumination to aid in acquisition, such as flashes, UV illumination, etc.

[0061] In one embodiment of this application, a grid is set in the light path of the light source toward the processing plane, thereby forming a beam coverage area on the processing object.

[0062] Specifically, the light source of the processing equipment emits a light beam towards the object being processed. A grid attached to the surface of the light source alters the light beam's path, causing the light rays to form a beam coverage area on the object's surface corresponding to the grid. This beam coverage area contains several measurement points. A camera captures an image of the beam coverage area on the object, which is the measurement image. This measurement image provides the pixels mapped to the measurement points, as well as the pixel location information.

[0063] In this embodiment, the grid is attached to the surface of the light source in the form of a sticker, thereby changing the optical path of the light beam emitted from the light source towards the workpiece, forming a beam coverage area on the workpiece corresponding to the grid. The resulting measurement image is used, with its contained feature points serving as measurement points. For example, in a grid-type measurement image, the intersection points between line segments corresponding to light rays are used as measurement points.

[0064] It should be clarified that the light source and the grid can be an integrated device, inseparable from each other, and detachably installed on the processing equipment, such as when painting or engraving the grid on the front of the light source. Alternatively, the light source and the grid can be separate structures, detachable and separately installed and removed from the processing equipment. For example, a light source cover can be installed on the front of the light source, connected to the light source by threads. The light source cover is hollow, and a glass grid is installed in the hollow part of the cover.

[0065] In the processing equipment, the light beam emitted by the light source towards the processing object can be infrared light or other light that can be captured and identified by the camera, and there are no restrictions here.

[0066] The light source is controlled to emit a beam of light through a grid onto the workpiece, forming a beam-covered area on the workpiece. Feature points in the corresponding image obtained by capturing the beam-covered area are used as measurement points.

[0067] To clarify further, grids come in different types, distinguishable by the area covered by the beams they map, such as dot matrix or grid type. For example, a light source projects light through a dot matrix grid onto the workpiece, creating a beam coverage area where the light forms a dot matrix; the points formed by these light beams are the measurement points.

[0068] The light source passes through a grid-like grating, forming a grid-like beam coverage area on the workpiece. Above this grid-like beam coverage area, several parallel light rays (denoted as parallel lines A) intersect with several parallel light rays (denoted as parallel lines B, where A and B are not parallel) to form the grid. The intersection of parallel lines A and B is the measurement point. In the use of the processing equipment, different numbers of measurement points and different grid shapes can be freely selected according to the required measurement accuracy.

[0069] In one embodiment of this application, the processing object includes a planar processing object and a curved surface processing object. The following description will focus on processing a curved surface processing object. To perform curved surface processing on the processing equipment, the curved surface processing object is placed on a material support platform; the surface of the curved surface processing object is an undulating curved surface.

[0070] For example, if the distance between the highest and lowest points on the surface is greater than 1 mm, the surface is considered to have obvious undulations; in contrast, if the distance between the highest and lowest points is less than 1 mm, the surface is considered to be a relatively flat surface and is regarded as a plane.

[0071] The surface machining object is the workpiece with a curved surface to be machined, and the surface machining object provides the machining surface for the surface engraving performed by the machining equipment. For the provided machining surface, the machining equipment first controls the light source to emit a beam of light through a grid, and the grid formed on the machining surface maps the designated measurement points in the area covered by the beam.

[0072] See Figure 3 , Figure 3 A flowchart illustrating the emission of a light beam toward a workpiece according to an embodiment of this application, and the formation of a light beam coverage area on the workpiece by the light rays in the light beam, is shown. This embodiment of the application provides step S210, which involves emitting a light beam toward a workpiece and forming a light beam coverage area on the workpiece by the light rays in the light beam, including:

[0073] Step S211: A beam is emitted, and the light rays in the beam form a beam coverage area;

[0074] Step S212: Control the beam movement according to the relative position of the beam coverage area and the workpiece until the beam coverage area is above the workpiece.

[0075] The two steps are described in detail below.

[0076] In step S211, for the area measurement initiated towards the object being processed, the processing equipment turns on the light source and emits a light beam toward the object being processed, forming a light beam coverage area on the surface of the object being processed.

[0077] In step S212, during the area measurement that has begun, as the light source is turned on and emits a light beam, the position of the emitted light beam on the workpiece is adjusted so that the emitted light beam can form a beam coverage area in a designated processing area of ​​the workpiece, thereby performing a measurement on that area.

[0078] The processing area refers to the processable portion of the workpiece, therefore, it needs to be measured. In one embodiment of this application, at the start of the measurement, the light source is in its initial position and has not moved to the processing area. Furthermore, after the processing equipment completes the measurement of the processing area, the light source returns to its initial position. The processing equipment controls the light source to move so that the beam coverage area is placed within the processing area of ​​the workpiece.

[0079] To further clarify, when measuring the workpiece, placing the beam coverage area within the workpiece's processing area includes two scenarios: first, the beam coverage area completely covers the processing area; second, the beam coverage area only partially covers the processing area.

[0080] Therefore, the processing equipment determines whether the beam coverage area completely covers the processing area. If yes, it stops moving and proceeds to the following measurement steps. If no, it first performs the following measurement steps on the current beam coverage area. Then, the processing equipment positions itself according to the input processing area and controls the light source to move and measure until the processing area is completely measured.

[0081] Alternatively, based on the operator's observation, determine whether the beam coverage area will cover the processing area. If it does, stop moving and proceed with the following measurement steps. If not, first perform the following measurement steps on the current beam coverage area, then the processing equipment responds to the operator's control to move the light source and measure until the processing area has been completely measured.

[0082] In step S220, after the light source forms a beam coverage area in the processing area, that is, the measurement points have been determined, the camera will be triggered to take a picture of the beam coverage area to obtain the corresponding image. The obtained corresponding image has pixels mapped to the measurement points. The pixel position is identified according to the corresponding image, and the position information of the pixel is calculated.

[0083] See Figure 4 , Figure 4A flowchart illustrating the acquisition of pixel location information of a measurement point mapping from an image corresponding to a beam coverage area according to an embodiment of this application is shown. This embodiment provides step S220 for acquiring pixel location information of a measurement point mapping from an image corresponding to a beam coverage area, including:

[0084] Step S221: Obtain the image corresponding to the area covered by the light beam;

[0085] Step S222: Identify the pixels corresponding to each measurement point on the image;

[0086] Step S223: Calculate the position information of the pixels mapped to each measurement point in the image based on the position of the pixels in the image.

[0087] The following is a detailed description of these three steps.

[0088] In step S221, in response to the light source stopping its movement or the beam coverage area moving to the processing area on the workpiece to be processed, an image of the beam coverage area is acquired. In one embodiment of this application, in response to the light source stopping its movement or the beam coverage area moving to the processing area, the camera takes a picture of the beam coverage area to obtain a corresponding image.

[0089] In step S222, the pixels corresponding to the measurement points are identified through the corresponding image. For example, the intersections of lines in a grid pattern in the image are identified as pixels, or each point in a dot matrix is ​​identified as a pixel. This establishes a correspondence between each measurement point and the pixels mapped to it in the corresponding image, thus clarifying the measurement point corresponding to each pixel.

[0090] In step S223, a two-dimensional coordinate system is established with the corresponding image as the plane. Based on the position of the pixel on the corresponding image, the position information of the pixel is obtained. The position information of the pixel is the position of the pixel in the two-dimensional coordinate system established with the corresponding image as the plane.

[0091] In step S230, when calculating the coordinate information of the measurement point based on the pixel position information identified in the captured image, a pre-configured calibration file corresponding to the measurement point needs to be obtained from the processing equipment. The acquisition of the calibration file is described in detail below. The calibration file contains the calibration relationship between the pixel position information and the coordinate information of the measurement point. Based on the pixel position information identified in the corresponding image, the calibration file, and the camera position information, the coordinate information of each measurement point is obtained.

[0092] In one embodiment of this application, prior to step S230, a calibration relationship is pre-established between the position information of each pixel and the reference coordinates of the corresponding measurement point in the mechanical coordinate system of the processing equipment. This calibration relationship indicates the relationship between the pixel position information and the reference coordinate information of the measurement point, where the reference coordinate information refers to the coordinate information of the measurement point in the mechanical coordinate system with the camera position as the reference point. Furthermore, the relative positional relationship between the camera and each measurement point in the beam coverage area remains unchanged. Thus, the relative positional relationship between the camera and each measurement point in the beam coverage area remains unchanged, and the existing calibration relationship can be used regardless of how the camera or light source moves. This greatly increases the flexibility for large-area measurements.

[0093] After obtaining the reference coordinate information of the measurement point, it is necessary to update the reference coordinate information of the measurement point with the camera as the reference point to the mechanical coordinate system according to the mechanical coordinate system information of the camera, so as to obtain the coordinate information of the measurement point with the origin as the reference point in the mechanical coordinate system.

[0094] In other words, the positional information of a pixel represents the reference coordinate information of the measurement point in the mechanical coordinate system, with the camera position as the reference point.

[0095] For example, pixels formed by projecting measurement points and taking pictures are captured in advance, and corresponding captured images are obtained. The captured images are then identified to obtain pixel position information. The reference coordinate information of the corresponding measurement points in the mechanical coordinate system of the formed pixels is obtained. A set of data is formed by the pixel position information and the corresponding measurement point reference coordinate information. Then, the calibration relationship is obtained by linear fitting through multiple sets of data.

[0096] This is the execution of the calibration process. The obtained calibration relationship indicates the pixel position information and the corresponding reference coordinate values ​​of each coordinate axis of the corresponding measurement point in the mechanical coordinate system, thereby obtaining the reference coordinate information of the measurement point. The reference coordinate information of the measurement point is used to describe the position of the measurement point in three-dimensional space. Numerically, it represents the reference coordinate values ​​of the measurement point in a physical coordinate system, such as the mechanical coordinate system constructed by the processing equipment, with the camera as the reference point. For example, the reference coordinate information of the measurement point includes the coordinate values ​​of the measurement point on the X-axis, Y-axis, and Z-axis of the mechanical coordinate system constructed by the processing equipment, with the camera as the reference point, and the unit can be millimeters.

[0097] Furthermore, the calibration process can be performed only once when the processing equipment leaves the factory. See also: Figure 5 , Figure 5This illustration shows a calibration process according to an embodiment of the present application. In this embodiment, the light source projects measurement points onto the workpiece through a grid, forming measurement points at different positions on the workpiece at different heights, which correspond to different reference coordinate information in the machine coordinate system.

[0098] For the images captured during the calibration process, the position information of the corresponding pixel points can be obtained through image recognition. However, the calibration process is required to obtain the reference coordinate information of the measurement points corresponding to the pixel points in the mechanical coordinate system.

[0099] Therefore, just as Figure 5 The diagram illustrates how the pixel position information, calibrated at a set height, is mapped to the corresponding reference coordinate information of the measurement point in the mechanical coordinate system. For example, the set height starts at 0 mm and increases in increments of 3 mm. Each increase in height involves projecting a measurement point onto the workpiece through a grid using a light source and taking a photograph to obtain the pixel position information at the current height, as well as the reference coordinate information of its corresponding measurement point.

[0100] By analogy, the pixel position information and the corresponding reference coordinate information of the measurement point at each height can be obtained. To perform a linear fit between the pixel position information and its corresponding reference coordinate information, as mentioned earlier, the measurement point reference coordinate information consists of physical coordinates in the mechanical coordinate system. Therefore, the pixel position information and the corresponding measurement point reference coordinate information at each height will be regrouped to obtain three sets of parameters. Figure 6 A flowchart illustrating the calibration process according to an embodiment of this application is shown. As... Figure 6 As shown, each height, for example, between 0 mm and 15 mm, is calibrated starting from 0 mm and increasing by 3 mm, such as 0 mm, 3 mm, 6 mm, 9 mm, 12 mm and 15 mm.

[0101] For each height calibration, a set of parameters is obtained from the captured image, namely the pixel position information CX and the corresponding measurement point reference coordinate information (X,Y,Z), and then this set of parameters is regrouped.

[0102] For example, when performing a calibration process on a height, the obtained pixel position information CX and the corresponding measurement point reference coordinate information (X,Y,Z) form a group. This group is then regrouped in pairs by pixel position information and the corresponding measurement point reference coordinate values ​​to obtain three sets of parameters, namely (CX,Z), (X,Z), and (Y,Z).

[0103] This process is repeated for each altitude, resulting in three sets of parameters through regrouping. For all altitudes, parameters from the same set are grouped together; for example, all (CX,Z) are grouped together for linear fitting, such as performing linear fitting on (CX0,Z0), (CX3,Z3), (CX6,Z6), (CX9,Z9), (CX12,Z12), and (CX15,Z15).

[0104] The regrouping is adapted, and the mapping from the position parameters to the reference coordinate values ​​is obtained through linear fitting. This mapping specifically includes the mapping from the position parameters to the Z-axis reference coordinate values, the mapping from the X-axis reference coordinate values ​​to the Z-axis reference coordinate values, and the mapping from the Y-axis reference coordinate values ​​to the Z-axis reference coordinate values, and so on. The calibration relationship between the pixel position information and its corresponding measurement point reference coordinate information is obtained and stored in the processing equipment in the form of a calibration file.

[0105] For example, the mapping from pixel position information to the reference coordinate information of the corresponding measurement point indicates the relationship between the pixel position information, the corresponding measurement point reference coordinate information, and the reference coordinate values. This relationship can be characterized by a linear function and its coefficients. Therefore, by linear fitting, the coefficients used for the linear function corresponding to the relationship between the pixel position information, the corresponding measurement point reference coordinate information, and the coordinate values ​​can be obtained. From these coefficients, the corresponding linear function can be determined, thereby obtaining the measurement point reference coordinate information corresponding to the pixel position information.

[0106] For example, as Figure 6 As shown, the linear function obtained by linearly fitting the pixel position information CX and the corresponding measurement point reference coordinate value, i.e., the Z-axis reference coordinate value, is Z = a*CX + b; the linear function obtained by linearly fitting the X-axis reference coordinate value and the Z-axis reference coordinate value is X = c*Z + d; and the linear function obtained by linearly fitting the Y-axis reference coordinate value and the Z-axis reference coordinate value is Y = e*Z + f.

[0107] Among them, a, b, c, d, e, and f are coefficients read from the calibration file obtained from the calibration process.

[0108] Therefore, the coefficients obtained from the linear fitting are extracted to form a calibration file. Correspondingly, during the measurement of the measurement points, the calibration relationship between the pixel position and the reference coordinate information of the corresponding measurement point can be obtained simply by calling the calibration file.

[0109] The reference coordinate value constitutes the position parameters of the corresponding measurement point. The construction of the calibration relationship between the pixel position information and the corresponding measurement point's reference coordinate information is mainly achieved through the following method: The calibration relationship between the pixel position information and the measurement point's reference coordinate information is pre-defined. This calibration relationship indicates the reference coordinate value mapped to the measurement point in the mechanical coordinate system with the camera position as the reference point. This reference coordinate value constitutes the reference coordinate information of the corresponding measurement point. Each measurement point is calibrated, and a corresponding calibration file is generated.

[0110] See Figure 7 , Figure 7 A flowchart illustrating how, according to an embodiment of this application, coordinate information of each measurement point in a beam coverage area is obtained based on a pre-configured calibration relationship and pixel position information. This embodiment provides step S230, which involves obtaining coordinate information of each measurement point in a beam coverage area based on a pre-configured calibration relationship and pixel position information, including:

[0111] Step S231: Substitute the position information of the pixel into the calibration relationship between the position information of the pixel and the coordinate information of the corresponding measurement point to obtain the reference coordinate information of the measurement point;

[0112] Step S232: Based on the camera's position information and the reference coordinate information of the measurement point, calculate the coordinate information of the measurement point in the mechanical coordinate system constructed by the processing equipment.

[0113] The two steps are described in detail below.

[0114] In step S231, after obtaining the corresponding image and pixel position information in step S220, the calibration file is read in step S231 to obtain the required calibration relationship.

[0115] Specifically, Figure 8 A flowchart illustrating the calculation of reference coordinate information of a measurement point under a calibration relationship according to an embodiment of this application is shown. Figure 8 As shown, the coordinate information of the measurement point in the mechanical coordinate system is used as the reference coordinate information with the camera position as the reference point. In the execution of step S231, the coefficients are first read from the corresponding calibration file of the measurement point, and the formulas are constructed from the read coefficients, that is, the linear functions X = c * Z + d and Y = e * Z + f between the pixel position information and a reference coordinate value Z = a * CX + b, and the reference coordinate value.

[0116] The image obtained by taking the picture, that is, the image of the pixel corresponding to the measurement point, is displayed. The pixel position information CX' is obtained by image recognition, and then Z', Y' and X' are calculated sequentially by the constructed linear function. Z', Y' and X' constitute the reference coordinate information of the measurement point corresponding to the pixel.

[0117] This is the process of calculating the reference coordinate information of a measurement point within the beam coverage area. This process is repeated to obtain the reference coordinate information for each measurement point. Furthermore, in this embodiment, the relative positions of the light source and the camera are fixed.

[0118] In step S232, the coordinate information of the measurement point with the origin as the reference point is calculated based on the reference coordinate information of the measurement point obtained in step S231 and the coordinate information of the camera in the mechanical coordinate system.

[0119] Furthermore, unlike structured light, which typically uses invisible lasers of a specific wavelength as a light source to emit light carrying coded information, projecting it onto an object and then using an algorithm to calculate the distortion of the returned coded pattern to obtain the object's position and depth information, this application obtains the coordinate information of the measurement point directly from the pixel position information corresponding to the light source on the object at different heights, along with a pre-configured calibration relationship. This significantly reduces the computational load of calculating the coordinate information of the measurement point and improves measurement efficiency. On the other hand, structured light-related equipment is too expensive; this application, as mentioned above, offers a simple and economical configuration.

[0120] See Figure 9 , Figure 9 This document illustrates a flowchart illustrating the steps following the process of obtaining the coordinate information of each measurement point in a mechanical coordinate system based on the calibration relationship between the position information of a pixel and the coordinate information of the corresponding measurement point, according to an embodiment of this application. The embodiment of this application provides the steps following the process of obtaining the coordinate information of each measurement point in a mechanical coordinate system based on the calibration relationship between the position information of a pixel and the coordinate information of the corresponding measurement point, including:

[0121] Step S401: Generate a processing area model based on the coordinate information of each measurement point on the processing object;

[0122] Step S402: The pattern mapped to the target processing graphic is adapted to the processing area model for processing alignment, and the pattern transformation data of the target processing graphic on the processing area model is obtained.

[0123] Step S403: The pattern mapped from the target processing graphic is processed onto the processing object according to the pattern transformation data.

[0124] The following is a detailed description of the three steps.

[0125] In step S401, the coordinate information of each measurement point on the processing area is a numerical description of the processing area. Therefore, the three-dimensional processing area can be determined and a processing area model can be generated based on the coordinate information of each measurement point at the position indicated by the mechanical coordinate system constructed by the processing equipment.

[0126] In other words, the machining area model is a numerical description of the machining area provided by the machining object. For machining performed by machining equipment, the generated machining area model, especially for machining with curved surfaces, serves two purposes: firstly, it is used to perform machining alignment, and secondly, it can provide machining preview services.

[0127] In step S402, the target processing graphic is a screenshot of the image library from the host computer, user input, audio-visual files, etc., which is used by the processing equipment. The target processing graphic is used to provide the engraving pattern for the processing to be performed, that is, the pattern mapped by the target processing graphic. The target processing graphic includes, but is not limited to, fonts, lines, patterns, etc.

[0128] In other words, the laser processing performed in this application involves engraving a pattern mapped from a target processing graphic onto a processing area. The pattern mapped from the target processing graphic is adapted to the processing area provided by the processing object, such that the pattern is engraved at a specific location within the processing area.

[0129] It should be understood that the location and placement of the pattern engraved on the processing area are both specifyable, and the size of the engraved pattern is also adapted to the specified placement. Therefore, the pattern can be rotated, translated, and scaled according to the specified configuration. Furthermore, the pattern adapts to the undulating deformation of the processed curved surface.

[0130] By aligning the patterns on the processing area model, the pattern mapped to the target processing graphic is transformed, thereby obtaining pattern transformation data. This pattern transformation data numerically represents and describes the pattern engraved in the processing area.

[0131] In step S403, processing parameters are obtained for the processing area adapted to the processing object. These parameters include power, laser head movement speed, etc., used to configure the laser head's laser emission power and laser head movement speed for engraving the processing area performed by the processing equipment. For example, the processing parameters can be transmitted from a host computer to the processing equipment for its use.

[0132] Under the control of processing parameters and pattern transformation data, the processing process of the pattern mapped by the target processing graphic on the processing object is executed.

[0133] Figure 10 A hardware schematic diagram of a laser processing apparatus according to one embodiment of this application is shown. In one embodiment, as... Figure 10 As shown, the laser processing equipment 100 includes a housing, a movable laser head 50, a laser tube 30, a close-up camera, and a distant camera. The housing includes an upper shell 90 and a lower shell 70. The close-up camera is mounted on the laser head 50. The laser processing equipment 100 integrates cameras, including but not limited to a distant camera for capturing a panoramic processing view of the interior space of the housing, and the aforementioned close-up camera. The movable close-up camera performs movement and capture.

[0134] In one embodiment, the laser source can be generated by the laser head 50. In another embodiment, the laser source can be generated by other components such as the laser tube 30 of a carbon dioxide laser tube, and enter the laser emission device through the reflector 10, etc., and finally be emitted after passing through the laser head 50 to process the workpiece.

[0135] In one embodiment, a reflector 10 is provided between the laser head 50 and the laser tube 30. The laser generated by the laser tube 30 is reflected by the reflector 10 to the laser head 50, and then emitted after reflection and focusing to process the workpiece.

[0136] In one embodiment, the housing of the laser processing equipment 100, i.e., Figure 10 The upper shell 90 and the lower shell 70 shown together enclose an internal space for accommodating the object being processed. The upper shell 90 and the lower shell 70 can be detachably connected or fixedly connected, or the upper shell 90 and the lower shell 70 can be a single integral structure. For laser processing, the internal space is equipped with a laser head 50, a laser tube 30 as a light source, and a close-up camera. The laser head 50 and the close-up camera slide via a configured track device.

[0137] In one embodiment, the upper shell 90 is also provided with a rotatable cover plate, which the operator can open or close to open the internal space to put in or take out the workpiece.

[0138] The blocking and / or filtering effect of the upper shell 90 and the bottom shell 70 can prevent laser leakage from the laser head 50 during operation, thus preventing personal injury to the operator.

[0139] For example, in one embodiment, a track device may be provided within the internal space, and the laser head 50 is mounted on the track device. The track device may be an X-axis or Y-axis guide rail, which may be a linear guide rail or a guide rail in which the optical axis and rollers slide together, etc., as long as it can drive the laser head 50 to move and process on the X and Y axes. A Z-axis moving track may also be provided inside the laser head 50 for moving in the Z-axis direction for focusing before and / or during processing.

[0140] Please see Figure 11 , Figure 11A schematic diagram of a machining control device for a machining apparatus according to one embodiment of a patent application is shown. This application discloses a machining control device for a machining apparatus, including…

[0141] Projection module 610: used to emit a light beam toward the workpiece, and form a light beam coverage area on the workpiece through the light rays in the light beam;

[0142] Image module 620: used to obtain the position information of the pixel points mapped by the measurement point from the image corresponding to the area covered by the beam;

[0143] Positioning module 630: used to obtain the coordinate information of each measurement point in the beam coverage area according to the pre-configured calibration relationship and the position information of the pixel.

[0144] In describing these steps, it should first be noted that the processing equipment used in the embodiments of this application is capable of processing curved surfaces and is designed for end-users. While industrial processing equipment can certainly process undulating curved surfaces, the equipment and sensors used for this purpose are very expensive. Due to cost considerations, end-user processing equipment cannot necessarily be equipped with the same expensive equipment and sensors as industrial processing equipment. The processing equipment used in the embodiments of this application, while performing low-cost area measurements, can also achieve curved surface processing capabilities without relying on expensive equipment and sensors, which is urgently needed in the current laser processing field.

[0145] Taking the machining of curved surfaces by machining equipment as an example, this application illustrates the method described in this application and its application in machining objects by machining equipment.

[0146] The object of surface machining is the workpiece with a curved surface that needs to be machined, and it provides a surface machining area for the machining equipment to perform surface machining.

[0147] The processing equipment projects a light source through a grid onto the curved surface being processed, forming a grid pattern on the processing area of ​​the surface. The area covered by the grid pattern is the beam coverage area. The light projected by the light source can be infrared light or other light that can be captured and identified by a camera. The intersections of the lines in the grid are the measurement points.

[0148] The light source is moved to a designated position, and an image is taken of the area covered by the beam. The corresponding image is then identified to determine the correspondence between pixels and measurement points. Using the center of the corresponding image as a reference point, the position information of each pixel is obtained. Based on the position information of each pixel and its corresponding calibration file, the reference coordinate information of each measurement point is obtained. Finally, based on the reference coordinate information of the measurement points and the position information of the camera, the coordinate information of each measurement point in the curved surface processing area is obtained. The camera position is obtained using the positioning function of the processing equipment.

[0149] The processing equipment performs linear fitting between points and planar fitting between lines based on the coordinate information of each measurement point in the processing area. This results in a curved surface processing area model. The curved surface processing area serves two purposes: firstly, it facilitates machining alignment during processing; secondly, it provides a machining preview service.

[0150] The pattern mapped from the target machining graphic is adapted to the curved surface machining area, so that the pattern is engraved at a specific location within the machining area. The pattern is rotated, translated, and scaled according to the specified configuration. Furthermore, the pattern is adapted to the machining surface to undergo corresponding elevation and undulation deformations.

[0151] By aligning the pattern on the processing area model, the pattern mapped to the target processing graphic is transformed, thus obtaining pattern transformation data. This pattern transformation data numerically represents and describes the pattern engraved in the processing area. An adapted surface processing area is then created for processing the target processing graphic, and processing parameters are obtained. Under the control of the processing parameters and the pattern transformation data, the processing procedure on the processing object is executed, based on the pattern mapped to the target processing graphic.

[0152] It should be noted that when measuring the laser processing area, it is necessary to determine whether the beam coverage area covers the curved processing area. If so, the measurement is performed directly; otherwise, the measurement is performed first, and then the process is translated until the entire processing area is measured.

[0153] First, a beam is emitted, and the emitted beam marks a measurement point on the machined surface. The irradiation point formed by the beam on the machined surface is the currently designated measurement point.

[0154] After a beam of light is emitted and forms an illumination point on the processed curved surface, a camera is triggered to take a picture of the surface being processed, and an image of the surface being processed is obtained. The position parameters of the measurement point are calculated based on the position of the illumination point identified in the image, and the measurement of a measurement point is completed.

[0155] The processing control method applicable to processing equipment according to the embodiments of this application can be implemented by... Figure 12 This is achieved using processing equipment 12. See below for reference. Figure 12To describe the processing equipment 12 according to an embodiment of this application. Figure 12 The processing equipment 12 shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0156] like Figure 12 As shown, the welding robot may be represented in the form of a general-purpose computing device. The components of the welding robot may include, but are not limited to: at least one processing unit 810, at least one storage unit 820, and a bus 830 connecting different system components (including storage unit 820 and processing unit 810).

[0157] The storage unit stores program code that can be executed by the processing unit 810, causing the processing unit 810 to perform the steps described in the exemplary method description section of this specification according to various exemplary embodiments of the present invention. For example, the processing unit 810 can perform actions such as... Figure 2 The steps shown are as follows.

[0158] Storage unit 820 may include a readable medium in the form of a volatile storage unit, such as random access memory (RAM) 8201 and / or cache memory 8202, and may further include a read-only memory (ROM) 8203.

[0159] The storage unit 820 may also include a program / utility 8204 having a set (at least one) of program modules 8205, including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0160] Bus 830 can represent one or more of several types of bus structures, including a memory cell bus or memory cell controller, a peripheral bus, a graphics acceleration port, a processing unit, or a local bus using any of the various bus structures.

[0161] The welding robot can also communicate with one or more external devices 700 (e.g., keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable users to interact with the welding robot, and / or any device that enables the welding robot to communicate with one or more other computing devices (e.g., routers, modems, etc.). This communication can be performed via input / output (I / O) interface 850. Furthermore, the welding robot can communicate with one or more networks (e.g., local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) via network adapter 860. As shown, network adapter 860 communicates with other modules of the point cloud camera 12 via bus 830. It should be understood that, although not shown in the figures, other hardware and / or software modules can be used in conjunction with the welding robot, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0162] Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, terminal device, or network device, etc.) to execute the method according to the embodiments of this application.

[0163] In an exemplary embodiment of this application, a computer program medium is also provided, on which computer-readable instructions are stored, which, when executed by a computer's processor, cause the computer to perform the methods described in the above method embodiments.

[0164] According to one embodiment of this application, a program product for implementing the methods in the above-described method embodiments is also provided. This product may employ a portable compact disc read-only memory (CD-ROM) and include program code, and may run on a terminal device, such as a personal computer. However, the program product of this invention is not limited thereto. In this document, a readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, apparatus, or device.

[0165] The program product may employ any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0166] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A readable signal medium may also be any readable medium other than a readable storage medium, capable of sending, propagating, or transmitting programs for use by or in conjunction with an instruction execution system, apparatus, or device.

[0167] The program code contained on the readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0168] Program code for performing the operations of this invention can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can execute entirely on the user's computing device, partially on the user's device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0169] It should be noted that although several modules or units for the device used to perform actions have been mentioned in the detailed description above, this division is not mandatory. In fact, according to the embodiments of this application, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0170] Furthermore, although the steps of the method in this application are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or a step may be broken down into multiple steps.

[0171] Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, mobile terminal, or network device, etc.) to execute the method according to the embodiments of this application.

[0172] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.

Claims

1. A processing control method, characterized in that, The method includes: A light beam is emitted toward the workpiece, and the light rays in the light beam form a beam coverage area on the workpiece, the beam coverage area containing several measurement points; The position information of the pixels mapped from the measurement point is obtained from the image corresponding to the area covered by the beam. Based on the pre-configured calibration relationship and the position information of the pixels, the coordinate information of each measurement point in the beam coverage area is obtained, and the coordinate information is used in the processing of the processing object.

2. The method according to claim 1, characterized in that, The processing equipment used to carry out the processing includes a light source for emitting a light beam and forming a plurality of measurement points in the area covered by the light beam.

3. The method according to claim 2, characterized in that, A grid and / or a galvanometer are provided in the optical path of the light source, and the light is distributed at several measurement points in the area covered by the light beam through the grid and / or the galvanometer.

4. The method according to claim 1, characterized in that, The step of emitting a light beam toward the workpiece, wherein the light rays in the light beam form a beam coverage area on the workpiece, includes: A beam of light is emitted, and the light rays in the beam form a beam coverage area; The beam is moved according to the relative position of the beam coverage area and the workpiece until the beam coverage area is above the workpiece.

5. The method according to claim 4, characterized in that, The step of emitting a light beam toward the workpiece, wherein the light rays in the light beam form a beam coverage area on the workpiece, further includes: If it is determined whether the formed beam coverage area completely covers the processing object, then after obtaining the pixel position information mapped by the current measurement point, the beam coverage area continues to move so that the beam coverage area continues to cover other areas of the processing object until the processing object is completely measured.

6. The method according to claim 1, characterized in that, The area covered by the light beam forms a grid of lines or a dot matrix, and the measurement points contained in the area covered by the light beam correspond to the intersections of the grid lines or the points on the dot matrix.

7. The method according to claim 1, characterized in that, The step of obtaining the position information of the pixel points mapped from the image corresponding to the area covered by the beam includes: Obtain an image corresponding to the area covered by the light beam; Identify the pixels corresponding to each measurement point on the image; The position information of the pixels mapped by each measurement point in the image is obtained by calculating the position of the pixels in the image based on the position of the pixels.

8. The method according to claim 1, characterized in that, The method further includes: Linear fitting is performed based on the coordinate information of the measurement point at different heights of the processed object, and the pixel position information corresponding to the measurement point, to obtain the calibration relationship between the coordinate information of the measurement point and the corresponding pixel position information.

9. The method according to claim 8, characterized in that, After obtaining the coordinate information of each measurement point in the beam coverage area based on the pre-configured calibration relationship and pixel position information, the process further includes: Generate a processing area model based on the coordinate information of each measurement point on the processing object; The target processing graphic is mapped to the processing area model for pattern adaptation and processing alignment, thereby obtaining the pattern transformation data of the target processing graphic on the processing area model; The pattern mapped from the target processing graphic is processed onto the processing object based on the pattern transformation data.

10. A processing control device, characterized in that, include: Projection module: used to emit a light beam toward the workpiece, and the light rays in the light beam form a beam coverage area on the workpiece, the beam coverage area containing several measurement points; Acquisition module: used to acquire the position information of the pixel points mapped by the measurement points from the image corresponding to the area covered by the beam; Positioning module: used to obtain the coordinate information of each measurement point in the beam coverage area according to the pre-configured calibration relationship and the position information of the pixel, and the coordinate information is used in the processing of the processing object.

Images