A display module and a display device

Abstract

This invention provides a display module and a display device. The display module includes a display panel having a first region, a bending region, and a second region. The first region includes a display area. The second region is located behind the first region and has a chip disposed thereon. The display module further includes a heat-resistant layer disposed between the first and second regions, such that the orthographic projection of the chip onto the second region at least partially overlaps with the orthographic projection of the heat-resistant layer onto the second region. By disposing a heat-resistant layer between the first and second regions and defining the relative position of the orthographic projection of the heat-resistant layer onto the second region and the orthographic projection of the chip onto the second region, the heat generated by the chip is blocked, effectively preventing the heat generated by the chip from being transferred to the first region and affecting the display of the first region, thereby improving the display performance of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and a display device. Background Technology

[0002] Currently, foldable OLED display modules are trending towards thinner designs to reduce weight and thickness. In addition, there is an increasing demand for ultra-narrow bezels. However, in related technologies, the bonding area of ​​the OLED display panel requires wiring, and the circuit board needs to be bent towards the back of the display panel to achieve a narrower bezel.

[0003] To further reduce the bezel of the display panel, it is necessary to reduce the bending radius at the bending area of ​​the display panel. In related technologies, this is achieved by thinning the relevant film layers. However, since the bonding area of ​​the display panel is bonded with a chip, the chip will continuously generate heat during use. The accumulation of heat will affect the display and cause display abnormalities. Summary of the Invention

[0004] To address the aforementioned issues, embodiments of this application provide a display module and a display device.

[0005] In a first aspect, the present invention provides a display module, comprising: a display panel, the display panel including a first region, a bending region and a second region; wherein one end of the bending region is connected to the first region and the other end of the bending region is connected to the second region, the first region including a display area; the second region is located on the back side of the first region and a chip is disposed in the second region; the display module further comprises: a heat-resistant layer, the heat-resistant layer being disposed between the first region and the second region, and the orthographic projection of the chip on the second region at least partially overlapping the orthographic projection of the heat-resistant layer on the second region.

[0006] In some embodiments, the orthographic projection of the chip on the second region lies within the orthographic projection of the heat-resistant layer on the second region.

[0007] In some embodiments, the heat-insulating layer is porous vacuum silicone.

[0008] In some embodiments, one end of the heat-insulating layer is connected to the first region, and the other end of the heat-insulating layer is connected to the second region.

[0009] In some embodiments, the display module further includes: a raised block located between the first region and the second region; and the orthographic projection of the raised block on the second region at least partially overlaps with the orthographic projection of the heat-insulating layer on the second region.

[0010] In some embodiments, the raised block is located on the side of the heat-insulating layer facing the second region.

[0011] In some embodiments, the display module further includes a metal layer and a heat transfer layer; wherein the metal layer is located on the side of the first region facing the second region, and the metal layer is connected to the chip through the heat transfer layer.

[0012] In some embodiments, the material of the metal layer includes copper foil or stainless steel.

[0013] In some embodiments, the material of the heat transfer layer includes copper foil, graphite, graphene, or silicone grease.

[0014] In some embodiments, the display module further includes a reinforcing structure that is in contact with the metal layer.

[0015] In some embodiments, the reinforcing structure comprises resin or silicone.

[0016] In some embodiments, the reinforcing structure also includes carbon powder.

[0017] In some embodiments, the reinforcing structure is at least partially located between the heat-insulating layer and the metal layer.

[0018] In some embodiments, the display module further includes: a first support layer; the first support layer is located on the side of the first region facing the second region.

[0019] In some embodiments, the display module further includes a buffer layer located on the side of the first support layer away from the first region, and the orthographic projection of the buffer layer on the first region at least partially overlaps with the orthographic projection of the first support layer on the first region.

[0020] In some embodiments, the buffer layer comprises composite foam or silicone gel.

[0021] In some embodiments, the heat transfer layer is located on the side of the buffer layer away from the first support layer.

[0022] In some embodiments, the orthographic projection of the first support layer onto the first region does not overlap with the orthographic projection of the heat-insulating layer onto the first region.

[0023] In some embodiments, the display module further includes a reinforcing structure, which is at least partially located between the heat-insulating layer and the metal layer, and is in contact with the metal layer.

[0024] In some embodiments, the reinforcing structure is in contact with the end of the buffer layer near the heat-insulating layer.

[0025] In some embodiments, the reinforcing structure is in contact with the end of the first support layer near the heat-insulating layer.

[0026] In some embodiments, the reinforcing structure includes carbon powder.

[0027] In some embodiments, the orthographic projection of the heat-insulating layer on the first region at least partially overlaps with the orthographic projection of the first support layer on the first region, and the heat-insulating layer is located on the side of the first support layer facing the second region.

[0028] In some embodiments, the orthographic projection of the heat-insulating layer on the first region lies within the orthographic projection of the first support layer on the first region.

[0029] In some embodiments, the display module further includes a second support layer located on the side of the second region facing the first region, wherein the orthographic projection of the chip on the second region at least partially overlaps with the orthographic projection of the second support layer on the second region.

[0030] In some embodiments, the heat-insulating layer is located between the first support layer and the second support layer.

[0031] In some embodiments, the display module further includes a reinforcing structure, which is at least partially located between the heat-insulating layer and the buffer layer, and the reinforcing structure is in contact with the buffer layer.

[0032] In some embodiments, the reinforcing structure is located between the second support layer and the metal layer, and the reinforcing structure is in contact with the metal layer.

[0033] In some embodiments, the distance between the first area and the second area along the thickness direction of the display module is less than or equal to 0.2 mm.

[0034] In some embodiments, the display module further includes a cover plate located on the side of the first region away from the second region.

[0035] In some embodiments, the display module further includes a polarizer located on the side of the cover plate facing the first region.

[0036] Secondly, the present invention provides a display device, including the display module in any of the above embodiments.

[0037] This application provides a heat-insulating layer between the first and second regions, and defines the relative position of the orthographic projection of the heat-insulating layer on the second region and the orthographic projection of the chip on the second region. This heat-insulating layer blocks the heat generated by the chip, effectively preventing the heat generated by the chip from being transferred to the first region and affecting the display of the first region, thereby improving the display performance of the display module. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of this application, the drawings used in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the structure of a display module before it is bent, provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention; Figure 3 for Figure 2 A schematic diagram of a cross-sectional structure at point AA in the middle; Figure 4 for Figure 2 Another cross-sectional structural diagram at point AA; Figure 5 for Figure 2 Another cross-sectional structural diagram at point AA; Figure 6 for Figure 2 Another cross-sectional structural diagram at point AA; Figure 7 for Figure 2 Another cross-sectional structural diagram at point AA; Figure 8 for Figure 2 Another cross-sectional structural diagram at point AA; Figure 9 for Figure 2 Another cross-sectional structural diagram at point AA; Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention.

[0040] Explanation of reference numerals in the attached figures: 1. Display device; 10. Display module; 110. Zone 1; 120. Bending Zone; 130. Zone 2; 140. Protective Layer; 210. Chip; 220. Circuit board; 300. Heat-insulating layer; 400. Raising blocks; 510. First support layer; 520. Second support layer; 610. Buffer layer; 620. Metal layer; 630. Reinforcing structure; 700, heat transfer layer; 800, polarizing film; 910. Cover plate; 920. Adhesive layer; AA is the display area; NA is the non-display area. Detailed Implementation

[0041] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0042] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, this does not indicate any order, quantity, or importance, but is merely used to distinguish different components. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Words such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0044] Currently, foldable OLED display modules are trending towards thinner designs to reduce weight and thickness. In addition, there is an increasing demand for ultra-narrow bezels. However, in related technologies, the bonding area of ​​the OLED display panel requires wiring, and the circuit board needs to be bent towards the back of the display panel to achieve a narrower bezel.

[0045] To further reduce the bezel of the display panel, it is necessary to reduce the bending radius at the bending area of ​​the display panel. In related technologies, this is achieved by thinning the relevant film layers. However, in practical applications, the inventors have discovered that although the aforementioned methods can further reduce the bezel of the display panel, the chip is bonded to the bonding area of ​​the display panel. During use, the chip continuously generates heat, which is more easily transferred to the display area of ​​the display panel. With the accumulation of usage time, this can cause display abnormalities in local areas, thereby affecting the display effect.

[0046] To address the aforementioned issues, embodiments of this application provide a display module and a display device.

[0047] The following will combine Figures 1-10 The display module and display device provided in the embodiments of this application will be described.

[0048] Combination Figures 1-3 This application provides a display module 10, which includes: a display panel, the display panel including a first area 110, a bending area 120 and a second area 130; wherein, one end of the bending area 120 is connected to the first area 110 and the other end of the bending area 120 is connected to the second area 130, the first area 110 includes a display area AA, through which different images are displayed; the second area 130 is located on the back of the first area 110, and a chip 210 is disposed in the second area 130, that is, the chip 210 is bound to the second area 130; the display module 10 further includes: a heat-resistant layer 300, the heat-resistant layer 300 is disposed between the first area 110 and the second area 130, and the orthographic projection of the chip 210 on the second area 130 and the orthographic projection of the heat-resistant layer 300 on the second area 130 at least partially overlap.

[0049] This application provides a heat-insulating layer 300 between the first region 110 and the second region 130, and defines the relative position of the orthographic projection of the heat-insulating layer 300 on the second region 130 and the orthographic projection of the chip 210 on the second region 130. This effectively blocks the heat generated by the chip 210, preventing the heat generated by the chip 210 from being transferred to the first region 110 and affecting the display area AA of the first region 110, thereby improving the display performance of the display module 10.

[0050] like Figure 1 and Figure 2 As shown in the embodiments of this application, the display panel can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel includes a display area AA with display function and a non-display area NA surrounding at least a portion of the display area AA.

[0051] In some embodiments, the shape of the display area AA of the display panel can be rectangular, or it can be a square, a circle, an ellipse, or other shapes, and this application does not limit it.

[0052] In some embodiments, the second region 130 is part of the non-display region NA, and the second region 130 includes a bonding region to which the chip 210 is bonded. The chip 210 includes a display driver chip or a touch driver chip, or a chip formed by integrating the display driver chip and the touch driver chip.

[0053] In addition, combined Figure 1 and Figure 2To achieve a narrow bezel, the bending area 120 between the first area 110 and the second area 130 is bent so that the second area 130 is bent to the back of the first area 110. That is, in the thickness direction of the display module 10, the second area 130 is located on one side of the first area 110.

[0054] To achieve a narrow bezel, in some embodiments, when the second area 130 is bent to the back of the first area 110, the distance between the first area 110 and the second area 130 along the thickness direction of the display module 10 is less than or equal to 0.2 mm. That is, the distance between the surface of the first area 110 facing the second area 130 and the surface of the second area 130 facing the first area 110 is less than or equal to 0.2 mm. For example, the distance between the surface of the first area 110 facing the second area 130 and the surface of the second area 130 facing the first area 110 is 0.08 mm, 0.082 mm, 0.086 mm, 0.088 mm, 0.09 mm, 0.091 mm, 0.094 mm, 0.095 mm, 0.098 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.18 mm, 0.188 mm, 0.19 mm, or 0.2 mm, etc.

[0055] To further improve the heat shielding effect of the heat shield layer 300 on the chip 210, in some embodiments, the orthographic projection of the chip 210 on the second region 130 is located within the orthographic projection of the heat shield layer 300 on the second region 130. That is, the orthographic projection of the heat shield layer 300 on the second region 130 completely covers the orthographic projection of the chip 210 on the second region 130, so that the heat generated by the chip 210 can be better blocked when it is transferred to the first region 110, thereby improving the display performance of the display module 10.

[0056] In some embodiments, the heat-insulating layer 300 is a porous vacuum silicone, wherein the porous vacuum silicone (also known as porous vacuum silicon) has an extremely low thermal conductivity of less than or equal to 0.02 W / (m·K), and its pore size is 10-40 nanometers, with an internal porosity of greater than or equal to 96%. This ensures the barrier effect.

[0057] like Figure 3 and Figure 4 As shown, in some embodiments, along the thickness direction of the display module 10, one end of the heat-insulating layer 300 is connected to the first region 110, and the other end of the heat-insulating layer 300 is connected to the second region 130.

[0058] Of course, in some embodiments, in order to connect the heat-insulating layer 300 to the corresponding region, an adhesive layer (not shown in the figure) can be provided between the heat-insulating layer 300 and the first region 110, and between the heat-insulating layer 300 and the second region 130, so that the heat-insulating layer 300 is disposed between the first region 110 and the second region 130 through the adhesive layer. In this embodiment, the heat-insulating layer 300 can support the first region 110 and the second region 130 to a certain extent, ensuring the stability of the first region 110 and the second region 130. At the same time, the heat-insulating layer 300 can effectively ensure the stability of the bending region 120, and prevent the relevant film layers in the bending region 120 from separating or breaking.

[0059] In the above embodiments, the thickness of the heat-insulating layer 300 along the thickness direction of the display module 10 is less than 0.2 mm; for example, the thickness of the heat-insulating layer 300 is 0.198 mm, 0.196 mm, 0.195 mm, 0.194 mm, 0.192 mm, 0.188 mm, 0.186 mm, 0.185 mm, 0.182 mm, 0.18 mm, or 0.175 mm, etc.

[0060] like Figure 5 As shown, in some embodiments, the display module 10 further includes a shim block 400, which is located between the first region 110 and the second region 130. The orthographic projection of the shim block 400 on the second region 130 at least partially overlaps with the orthographic projection of the heat-insulating layer 300 on the second region 130. The heat-insulating layer 300 and the shim block 400 together block the heat generated by the chip 210, ensuring the display performance of the display module 10. In addition, the shim block 400 can release the stress generated by the bending region 120, ensuring the stability of the display module 10.

[0061] In some specific embodiments, the shim block 400 is located on the side of the heat-insulating layer 300 facing the second zone 130.

[0062] In some other embodiments, the heat-insulating layer 300 is located on the side of the raised block 400 facing the second zone 130.

[0063] In the above embodiments, the shim block 400 and the heat-insulating layer 300 are both connected by an adhesive layer (not shown in the figure).

[0064] Of course, in some other embodiments, the heat-insulating layer 300 can be directly prepared on one side of the raised block 400 by printing.

[0065] like Figures 3-5As shown, in some embodiments, the display module 10 further includes a metal layer 620 and a heat transfer layer 700; wherein, the metal layer 620 is located on the side of the first region 110 facing the second region 130, and the metal layer 620 is connected to the chip 210 through the heat transfer layer 700; in this embodiment, the heat generated by the chip 210 is transferred to the metal layer 620 through the heat transfer layer 700, thereby transferring the heat away and avoiding excessive heat concentration in the area of ​​the chip 210.

[0066] In some embodiments, the metal layer 620 is made of copper foil or stainless steel, which can better absorb heat and at the same time provide some support for the display module 10.

[0067] In some embodiments, to accelerate the heat transfer generated by the chip 210, the heat transfer layer 700 is made of a material with better heat transfer properties. For example, the material of the heat transfer layer 700 includes copper foil, graphite, graphene, or silicone grease. In addition, the heat transfer layer 700 is made of a black or opaque material, which can effectively avoid the problem of light transmission in the display panel.

[0068] Due to process errors, gaps exist between film layers, such as a gap between the metal layer 620 and the heat-resistant layer 300. Therefore, in some embodiments, the display module 10 further includes a reinforcing structure 630, which contacts the metal layer 620 and is at least partially located between the heat-resistant layer 300 and the metal layer 620. That is, a reinforcing structure 630 is provided in the area between the metal layer 620 and the heat-resistant layer 300 to fill the gap, ensuring the stability of the entire display module. Simultaneously, due to the presence of the reinforcing structure 630, the stress generated in the bending area 120 will not produce a large stress difference in the gap area, thus ensuring the stability of this area. Furthermore, since the gap mainly extends along the thickness direction of the display module 10, and the reinforcing structure 630 contacts the metal layer 620, the heat generated by the chip 210 can be further transferred to the metal layer 620 through the reinforcing structure 630, thereby preventing heat concentration.

[0069] In some specific embodiments, the reinforcing structure 630 comprises resin or silicone.

[0070] Furthermore, in some specific embodiments, the reinforcing structure 630 also includes toner; by adding toner, the reinforcing structure 630 is black, avoiding the problem of light transmission caused by filling the gap area with transparent material.

[0071] Combination Figures 2-5Since the overall thickness of the display panel is relatively thin, especially the flexible display panel in related technologies, in order to ensure the display effect, in some embodiments, the display module 10 further includes: a first support layer 510; the first support layer 510 is located on the side of the first area 110 facing the second area 130; thereby supporting the first area 110 through the first support layer 510 to prevent the display panel from bending and deforming.

[0072] In one specific embodiment, the material used for the first support layer 510 may include one or more of the following: polyethylene terephthalate (PET), polyimide (PI), transparent polyimide (CPI), polymethyl methacrylate (PMMA), cellulose triacetate film (TAC), cyclic olefin polymer (COP), ultrathin glass (UTG), polyethylene naphthalate (PEN), resin, etc. There are no specific limitations on this, and it can be set as needed.

[0073] In addition, in some other embodiments, the first support layer 510 can be a single-layer structure or a multi-layer structure. When it is a multi-layer structure, the materials used in different layers can be the same or different, and this application does not limit it.

[0074] To further improve the reliability of the display module 10, such as Figures 3-9 As shown, the display module 10 further includes a buffer layer 610, which is located on the side of the first support layer 510 away from the first region 110, and the orthographic projection of the buffer layer 610 on the first region 110 at least partially overlaps with the orthographic projection of the first support layer 510 on the first region 110. By placing the buffer layer 610 below the first support layer 510, the first region 110 is supported on the one hand, and on the other hand, the buffer layer 610 can absorb the impact energy generated by drops, squeezing, and vibrations, protecting the fragile display panel (especially the OLED flexible screen) and other film layers in the display module 10, and avoiding breakage, delamination, and display abnormalities.

[0075] Specifically, in some embodiments, the buffer layer 610 includes composite foam or silicone gel; wherein, the composite foam is generally a multi-layer structure, including at least: foam, mesh adhesive, and copper foil; the multi-layer structure achieves buffering, shielding, and heat dissipation functions. Furthermore, the foam is black foam, which can both ensure the buffering function and block light, thereby ensuring the display effect of the display module 10.

[0076] In some embodiments, the heat transfer layer 700 is located on the side of the buffer layer 610 away from the first support layer 510, that is, the heat transfer layer 700 is relatively far from the first region 110, and the distance between the heat transfer layer 700 and the chip 210 is small. On the one hand, this is beneficial for transferring the heat generated by the chip 210 to the metal layer 620. On the other hand, the heat transferred to the metal layer 620 is not easily transferred to the first region 110, thereby effectively avoiding heat concentration that could cause abnormal display of the display area AA in the first region 110.

[0077] like Figures 3-5 As shown, in some specific embodiments, the orthographic projection of the first support layer 510 on the first region 110 does not overlap with the orthographic projection of the heat-insulating layer 300 on the first region 110; that is, the first support layer 510 and the heat-insulating layer 300 are provided on the side of the first region 110 facing the second region 130; the first support layer 510 and the heat-insulating layer 300 jointly support the first region 110, ensuring the flatness of the first region 110, thereby ensuring the display effect.

[0078] Furthermore, the buffer layer 610 and the metal layer 620 are located on the side of the first support layer 510 away from the first region 110, and the orthographic projection of the buffer layer 610 on the first region 110 does not overlap with the orthographic projection of the heat-insulating layer 300 on the first region 110; the orthographic projection of the metal layer 620 on the first region 110 does not overlap with the orthographic projection of the heat-insulating layer 300 on the first region 110.

[0079] In some specific embodiments, the display module 10 further includes a reinforcing structure 630, which is at least partially located between the heat-insulating layer 300 and the metal layer 620, and the reinforcing structure 630 is in contact with the metal layer 620, thereby transferring the heat generated by the chip 210 to the metal layer 620 through the reinforcing structure 630.

[0080] In addition, the reinforcing structure 630 is in contact with the end of the buffer layer 610 near the heat-insulating layer 300.

[0081] Furthermore, the reinforcing structure 630 contacts the end of the first support layer 510 near the heat-insulating layer 300.

[0082] To further ensure the heat transfer effect of the chip 210, and to address the issue of light transmission caused by gaps between film layers due to process errors, the material of its reinforcing structure 630 includes carbon powder.

[0083] like Figure 3 As shown, a portion of the reinforcing structure 630 is located between the heat-insulating layer 300 and the buffer layer 610, and a portion of the reinforcing structure 630 is located between the heat-insulating layer 300 and the metal layer 620.

[0084] like Figure 4 and Figure 5As shown, a portion of the reinforcing structure 630 is located between the heat-insulating layer 300 and the first support layer 510; a portion of the reinforcing structure 630 is located between the heat-insulating layer 300 and the buffer layer 610; and a portion of the reinforcing structure 630 is located between the heat-insulating layer 300 and the metal layer 620.

[0085] In addition, combined Figure 3 and Figure 4 In some embodiments, within the allowable range of process error, the side of the second region 130 away from the bending region 120 is flush with the side of the heat-insulating layer 300 away from the bending region 120, and the reinforcing structure 630 is connected to the side of both away from the bending region 120.

[0086] Or, such as Figure 5 As shown, in some embodiments, when the display module 10 further includes a shim block 400, within the allowable range of process error, the side of the second region 130 away from the bending region 120, the side of the shim block 400 away from the bending region 120, and the side of the heat-insulating layer 300 away from the bending region 120 are flush with each other, and the reinforcing structure 630 is connected to the side of the three away from the bending region 120.

[0087] In some other specific embodiments, such as Figures 6-9 As shown, the orthographic projection of the heat-insulating layer 300 on the first region 110 at least partially overlaps with the orthographic projection of the first support layer 510 on the first region 110, and the heat-insulating layer 300 is located on the side of the first support layer 510 facing the second region 130. That is, the heat-insulating layer 300 and the first support layer 510 are stacked on the side of the first region 110 facing the second region 130, and the heat insulation effect is further guaranteed through the stacked structure.

[0088] Furthermore, the orthographic projection of the heat-insulating layer 300 on the first region 110 is located within the orthographic projection of the first support layer 510 on the first region 110, that is, the orthographic projection of the first support layer 510 on the first region 110 covers the orthographic projection of the heat-insulating layer 300 on the first region 110, so that the orthographic projection of the first support layer 510 on the first region 110 has a larger area, thereby providing better support for the display module 10.

[0089] Furthermore, in some other embodiments, such as Figures 7-9 As shown, the display module 10 further includes a second support layer 520, which is located on the side of the second region 130 facing the first region 110. The orthographic projection of the chip 210 on the second region 130 and the orthographic projection of the second support layer 520 on the second region 130 overlap at least partially. The first region is supported by the first support layer 510, and the second region 130 is supported by the second support layer 520, thereby ensuring the flatness and stability of the display panel.

[0090] In some embodiments, the heat-insulating layer 300 is located between the first support layer 510 and the second support layer 520, that is, a stacked structure of the first support layer 510, the heat-insulating layer 300 and the second support layer 520 is formed on one side of the chip 210, which ensures the flatness and stability of the display panel while ensuring the heat insulation effect.

[0091] In one specific embodiment, the material used for the second support layer 520 may include one or more of the following: polyethylene terephthalate (PET), polyimide (PI), transparent polyimide (CPI), polymethyl methacrylate (PMMA), cellulose triacetate film (TAC), cyclic olefin polymer (COP), ultrathin glass (UTG), polyethylene naphthalate (PEN), resin, etc. There are no specific limitations on this, and it can be set as needed.

[0092] In addition, in some other embodiments, the second support layer 520 can be a single-layer structure or a multi-layer structure. When it is a multi-layer structure, the materials used in different layers can be the same or different, and this application does not limit it.

[0093] Of course, the materials of the first support layer 510 and the second support layer 520 can be the same or different.

[0094] Preferably, the first support layer 510 and the second support layer 520 are made of the same material.

[0095] In addition, the display module 10 also includes a reinforcing structure 630, which is at least partially located between the heat-insulating layer 300 and the buffer layer 610, and the reinforcing structure 630 is in contact with the buffer layer 610.

[0096] In some embodiments, the reinforcing structure 630 is located between the second support layer 520 and the metal layer 620, and the reinforcing structure 630 is in contact with the metal layer 620.

[0097] In the above embodiments, the function of the reinforcing structure 630 is as described above, and will not be repeated here.

[0098] like Figure 7 As shown, the reinforcing structure 630 is located on the side of the first support layer 510 facing the first region 110, and part of the reinforcing structure 630 is located between the heat-insulating layer 300 and the buffer layer 610, and part of the reinforcing structure 630 is located between the second support layer 520 and the metal layer 620. Of course, in some other embodiments, part of the reinforcing structure 630 is also located between the second support layer 520 and the buffer layer 610.

[0099] like Figure 8As shown, when the display module 10 also includes a shim block 400, a portion of the reinforcing structure 630 is located between the heat-insulating layer 300 and the buffer layer 610, a portion of the reinforcing structure 630 is located between the shim block 400 and the buffer layer 610, and a portion of the reinforcing structure 630 is located between the second support layer 520 and the metal layer 620. That is, along the thickness direction of the display module 10, the sum of the thicknesses of the shim block 400 and the heat-insulating layer 300 is equal to the thickness of the buffer layer 610.

[0100] Of course, in some other embodiments, such as Figure 9 As shown, in order to further improve the buffering effect of the entire display module 10, some reinforcement structures 630 are located between the heat-insulating layer 300 and the buffer layer 610, some reinforcement structures 630 are located between the raised block 400 and the buffer layer 610, some reinforcement structures 630 are located between the second support layer 520 and the buffer layer 610, and some reinforcement structures 630 are located between the second support layer 520 and the metal layer 620. That is, along the thickness direction of the display module 10, the sum of the thicknesses of the raised block 400 and the heat-insulating layer 300 is less than the thickness of the buffer layer 610.

[0101] Furthermore, in the above embodiments, combined with Figure 1 In the second zone 130, a circuit board 220 is also bonded, which provides corresponding electrical signals to the display panel. In addition, in the bent state, the orthographic projection of the circuit board 220 on the first zone 110 and the orthographic projection of the heat transfer layer 700 on the first zone 110 do not overlap at least partially, so that the heat transfer layer 700 is connected to the metal layer 620 through the non-overlapping area, which is more conducive to transferring the heat generated by the chip 210 to the metal layer 620.

[0102] Furthermore, to avoid the problem of film separation and circuit breakage caused by bending, the orthographic projection of the reinforcement structure 630 on the first area 110 is located at the beginning of the bending area. The beginning of the bending area is the critical position where the display panel changes from a flat state to a bent state. It is the starting point of the bending and also the dividing point where stress accumulates from 0.

[0103] Combination Figures 3-9 In some embodiments, the display module 10 further includes a cover plate 910, which is located on the side of the first area 110 away from the second area 130, and protects the display panel.

[0104] In some embodiments, the display module 10 further includes a polarizer 800, which is located on the side of the cover plate 910 facing the first region 110. For example, the polarizer 800 is connected to the cover plate 910 through an adhesive layer 920, thereby improving the display effect of the display panel. Of course, in some other embodiments, a color filter layer can be used instead of the polarizer 800, wherein the color filter layer includes a color resist and a black matrix.

[0105] In addition, in some other embodiments, the display module 10 may also include other film layers such as a touch layer.

[0106] This application also provides a display device, such as... Figure 10 As shown, the display device 1 may include the display module 10 in the above embodiments. The display device 1 may be an electronic paper device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, smart bracelet, smartwatch, supercomputer, navigator, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, clock, calculator, television monitor, computer monitor, car display (e.g., odometer display, etc.), cockpit controller and / or display, camera view display (e.g., display of rearview camera in a vehicle), electronic billboard or sign, projector, and other mobile or fixed terminals.

[0107] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0108] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0109] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display module, characterized in that: include: The display panel includes a first area, a bending area, and a second area; wherein one end of the bending area is connected to the first area, and the other end of the bending area is connected to the second area, the first area includes a display area; the second area is located on the back of the first area, and a chip is disposed in the second area; the display module further includes a heat-resistant layer, the heat-resistant layer is disposed between the first area and the second area, and the orthographic projection of the chip on the second area at least partially overlaps with the orthographic projection of the heat-resistant layer on the second area.

2. A display module according to claim 1, characterized in that: The orthographic projection of the chip on the second region lies within the orthographic projection of the heat-resistant layer on the second region; Preferably, the heat-insulating layer is porous vacuum silicone; Preferably, one end of the heat-insulating layer is connected to the first region, and the other end of the heat-insulating layer is connected to the second region. Preferably, the display module further includes: a raised block, the raised block being located between the first area and the second area; and the orthographic projection of the raised block on the second area at least partially overlaps with the orthographic projection of the heat-insulating layer on the second area; Preferably, the raised block is located on the side of the heat-insulating layer facing the second region.

3. A display module according to any one of claims 1-2, characterized in that: The display module further includes a metal layer and a heat transfer layer; wherein the metal layer is located on the side of the first region facing the second region, and the metal layer is connected to the chip through the heat transfer layer; Preferably, the material of the metal layer includes copper foil or stainless steel; Preferably, the material of the heat transfer layer includes copper foil, graphite, graphene, or silicone grease.

4. A display module according to claim 3, characterized in that: The display module further includes a reinforcing structure, which is in contact with the metal layer; Preferably, the reinforcing structure comprises resin or silicone; Preferably, the reinforcing structure further includes carbon powder; Preferably, the reinforcing structure is at least partially located between the heat-insulating layer and the metal layer.

5. A display module according to claim 3, characterized in that: The display module further includes: a first support layer; the first support layer is located on the side of the first area facing the second area; Preferably, the display module further includes: a buffer layer, the buffer layer being located on the side of the first support layer away from the first area, and the orthographic projection of the buffer layer on the first area at least partially overlapping the orthographic projection of the first support layer on the first area; Preferably, the buffer layer comprises composite foam or silicone gel; Preferably, the heat transfer layer is located on the side of the buffer layer away from the first support layer.

6. A display module according to claim 5, characterized in that: The orthographic projection of the first support layer onto the first region does not overlap with the orthographic projection of the heat-insulating layer onto the first region; Preferably, the display module further includes: a reinforcing structure, the reinforcing structure being at least partially located between the heat-resistant layer and the metal layer, and the reinforcing structure being in contact with the metal layer; Preferably, the reinforcing structure is in contact with the end of the buffer layer near the heat-insulating layer; Preferably, the reinforcing structure is in contact with one end of the first support layer near the heat-insulating layer; Preferably, the reinforcing structure comprises carbon powder.

7. A display module according to claim 5, characterized in that: The orthographic projection of the heat-insulating layer on the first region at least partially overlaps with the orthographic projection of the first support layer on the first region, and the heat-insulating layer is located on the side of the first support layer facing the second region; Preferably, the orthographic projection of the heat-insulating layer on the first region lies within the orthographic projection of the first support layer on the first region; Preferably, the display module further includes: a second support layer, the second support layer being located on the side of the second region facing the first region, and the orthographic projection of the chip on the second region at least partially overlapping the orthographic projection of the second support layer on the second region; Preferably, the heat-insulating layer is located between the first support layer and the second support layer; Preferably, the display module further includes: a reinforcing structure, the reinforcing structure being at least partially located between the heat-resistant layer and the buffer layer, and the reinforcing structure being in contact with the buffer layer; Preferably, the reinforcing structure is located between the second support layer and the metal layer, and the reinforcing structure is in contact with the metal layer.

8. A display module according to claim 1, characterized in that: Along the thickness direction of the display module, the distance between the first area and the second area is less than or equal to 0.2 mm.

9. A display module according to claim 1, characterized in that: The display module further includes a cover plate, which is located on the side of the first area away from the second area; Preferably, the display module further includes a polarizer located on the side of the cover plate facing the first area.

10. A display device, characterized in that: Includes the display module as described in any one of claims 1-9.

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