Support for a flexible display screen and a method of forming the same

Abstract

This invention proposes a support component for a flexible display screen and its forming method. The forming method includes the following steps: first, performing single-sided chemical semi-etching on the support surface of the bending area of ​​the support component to form several blind grooves on the support surface of the bending area; then, using a laser cutting device, performing laser penetration processing within the blind grooves to form a through-hole connected to the blind grooves, wherein the blind grooves and the through-holes constitute a stepped through-hole with a T-shaped cross-section, the opening width of the blind grooves being greater than the opening width of the through-holes, and the depth of the blind grooves being configured to accommodate the recast layer formed during laser cutting of the through-holes; finally, removing the ink film from the support component after laser cutting. Through the above method, the mesh seam width is effectively reduced, thereby significantly reducing the crease marks formed on the screen surface by the folding screen support component and improving the fatigue resistance and toughness of the support component.

Description

Technical Field

[0001] This invention relates to the field of flexible screen support technology, and in particular to a support for a flexible display screen and its molding method. Background Technology

[0002] As people's demands for electronic products continue to increase, foldable flexible screen phones are becoming increasingly popular. In the production process of foldable flexible screen phones, the support components play a crucial role in the mechanical strength and flatness of the flexible screen. While traditional metal support components offer good mechanical strength, their weight is significant, increasing the overall weight of the electronic product. To reduce weight while maintaining good mechanical strength, carbon fiber composite support components are increasingly being used. For example, Chinese Patent 202310461382.7 discloses electronic devices, flexible display components, support plates, and their preparation methods. This involves laser cutting to create small-sized hollow patterns, simultaneously meeting the bending requirements of the support plate and the support requirements of the flexible display. However, carbon fiber composite support components face the problem of difficult-to-clean high-temperature residue from laser cutting during production. This not only affects the appearance of the support components but may also cause the flexible screen to shrink and carbonize at the cutting edges, thus affecting cutting accuracy and continuous production. Although dedicated vacuum adsorption stage devices have been developed to improve cutting quality, this significantly increases the manufacturing and R&D costs of the support components.

[0003] In the design of support components, through holes are usually required in the bending area to absorb the stress generated during bending. However, this design may reduce the mechanical strength of the support component, especially after multiple bends, where existing support structures struggle to balance bending performance and support capacity. In addition, in existing technologies, through holes in the bending area are usually achieved through etching or laser cutting. Currently, the minimum kerf width of etching is only 0.07mm. If the kerf width is too wide, the molding (crease) in the bending area will be too deep, requiring optimization. Laser perforation is also used, but the kerf width of conventional laser cutting is 0.1-0.3mm, which is too wide. If high-precision or ultra-fast laser cutting is used, narrower kerfs can be cut, but the number of through holes required for each support component is large, resulting in very high operating costs. Furthermore, laser cutting can deform thin substrates, leading to significant material waste.

[0004] Therefore, there is an urgent need for a new method for forming support components that can ensure the support effect, avoid the above-mentioned problems, and reduce the manufacturing cost. Summary of the Invention

[0005] To address the above problems, this invention proposes a support component for a flexible display screen and its molding method.

[0006] A method for forming a support component for a flexible display screen, wherein the support component has a screen surface and a support surface arranged opposite to each other, and a bending area is provided on the support component. The substrate of the support component is an etchable metal material with a thickness of 0.1-0.13mm. A plurality of stepped through holes penetrating the support component are provided in the bending area of ​​the support component, and the plurality of stepped through holes are arranged in the bending area to form a grid structure that facilitates bending.

[0007] The molding method includes the following steps:

[0008] S1. Perform single-sided chemical semi-etching on the support surface of the bending area of ​​the support member to form several blind grooves on the support surface of the bending area.

[0009] S2. Laser penetration processing is performed in the blind groove using a laser cutting device to form a through part that communicates with the blind groove. The blind groove and the through part constitute the stepped through hole with a T-shaped cross section. The opening width of the blind groove is greater than the opening width of the through part, and the depth of the blind groove is configured to accommodate the recast layer formed when the through part is laser cut.

[0010] S3. Remove the ink film from the support component after laser cutting.

[0011] Preferably, the etchable metal material is a titanium alloy plate or a stainless steel plate.

[0012] Preferably, in step S1, the single-sided chemical half-etching time is 10-20 min; the etching depth of the blind trench is 0.03-0.065 mm, its top surface width is 0.07-0.15 mm, and its bottom surface width is 0.05-0.07 mm.

[0013] Preferably, in step S3, before removing the ink film from the support component after laser cutting, the support component after laser cutting is first subjected to a second etching, which is a double-sided etching, and the second etching time is 1-3 minutes. After the second etching is completed, the ink film is removed.

[0014] Preferably, in step S1, the single-sided chemical half-etching time is 10-20 min; the etching depth of the blind trench is 0.065-0.085 mm, its top surface width is 0.07-0.15 mm, and its bottom surface width is 0.05-0.07 mm.

[0015] Preferably, in step S2, the laser cutting device used is a picosecond laser device, and the laser cutting device is controlled to scan along a preset trajectory to form a through part. The preset trajectory is a closed contour formed by multiple discrete positioning points and line segments connecting adjacent positioning points within a blind groove.

[0016] Preferably, in step S2, the laser cutting equipment used is a nanosecond laser equipment, and the laser cutting equipment is controlled to scan along a preset trajectory to form the through part. The preset trajectory is a plurality of evenly distributed discrete positioning points set along the length direction in the blind groove, or a single line segment set along the length direction.

[0017] Preferably, when the preset trajectory consists of multiple evenly distributed discrete positioning points, the diameter of the discrete positioning points ranges from 0.007 to 0.03 mm; when the preset trajectory consists of a single line segment, the width of the single line segment ranges from 0.007 to 0.03 mm.

[0018] Preferably, in step S3, the support component after laser cutting is subjected to two ink removal processes, or after one ink removal process, it is subjected to an ultrasonic alkaline wash.

[0019] A support for a flexible display screen, the support being prepared using the molding method described above for a flexible display screen support.

[0020] The beneficial effects of this invention are as follows:

[0021] By using a composite process of "chemical semi-etching + laser cutting", a stepped through-hole structure consisting of blind grooves and through-holes is formed in the bending area of ​​the support component. This allows the opening width of the through-hole on the screen side to be as small as 0.007mm, which is much smaller than the minimum seam width of 0.07mm in the existing chemical etching process. This effectively reduces the mesh seam width, thereby significantly reducing the crease marks formed on the screen surface by the folding screen support component and improving the visual flatness of the folding screen.

[0022] Using titanium alloy or stainless steel as the base material, compared with carbon fiber composite materials, titanium alloy and stainless steel have both good etchability and excellent fatigue resistance and toughness, which can adapt to the precise control of chemical etching process. At the same time, they are not easy to produce permanent creases during repeated bending, which significantly extends the service life.

[0023] The recast layer generated by laser cutting is contained in a blind groove pre-etched on the support side, which avoids the recast layer protruding and affecting the flatness of the support. In some cases, it is not necessary to completely remove the recast layer by secondary etching, which simplifies the production process and reduces production costs.

[0024] By providing several stepped through holes in the bending area of ​​the support, a grid structure is formed in the bending area to facilitate bending. This grid structure can significantly reduce crease marks in the bending area after multiple bends. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the support structure in a preferred embodiment;

[0026] Figure 2 This is a partial structural schematic diagram of a support member according to a preferred embodiment;

[0027] Figure 3 A schematic cross-sectional view of a support member before single-sided chemical etching, according to a preferred embodiment;

[0028] Figure 4 A schematic cross-sectional view of a support member after single-sided chemical etching, according to a preferred embodiment;

[0029] Figure 5 This is a schematic diagram of the cross-sectional structure of the support member after laser cutting, according to a preferred embodiment.

[0030] Figure 6 A schematic cross-sectional view of the support member under secondary chemical etching in a preferred embodiment;

[0031] Figure 7 This is a schematic diagram of a blind groove with a preset trajectory of a closed contour in one embodiment;

[0032] Figure 8 This is a schematic diagram of a blind slot in one embodiment, where the preset trajectory consists of multiple evenly distributed discrete positioning points.

[0033] Figure 9 This is a schematic diagram of a blind groove in one embodiment, where the preset trajectory is a single line segment;

[0034] Figure 10 This is a schematic diagram of a support component with a blind groove etching depth of 30 μm in one embodiment;

[0035] Figure 11 This is a schematic diagram of a support component with a blind groove etching depth of 50 μm in one embodiment;

[0036] Figure 12 This is a schematic diagram of a support component with a blind groove etching depth of 70 μm in one embodiment;

[0037] Figure label:

[0038] 1. Support component; 2. Bending area; 3. Blind groove; 4. Through section; 5. Stepped through hole; 6. First grid area; 7. Second grid area. Detailed Implementation

[0039] The following is in conjunction with the appendix Figure 1-12 The technical solution protected by this invention will be described in detail below.

[0040] This invention provides a support component for a flexible display screen and its forming method, aiming to solve problems in existing carbon fiber composite support components, such as the difficulty in cleaning high-temperature residues during laser cutting, the inability of the support structure to balance bending performance and support capacity, excessively wide etched seams, obvious creases, and high costs associated with high-precision cutting. This invention utilizes a combination of chemical semi-etching and laser cutting to form stepped through holes 5 in the bending area 2 of the support component 1, thereby significantly improving bending performance while ensuring support strength and effectively reducing crease marks.

[0041] like Figure 1 As shown, the support member 1 has a screen surface and a support surface arranged opposite to each other, and a bending area 2 is provided on the support member 1. The bending area 2 is the area where the support member 1 mainly undergoes bending deformation during the folding process. In a specific embodiment, the bending area 2 may be provided only once and extended along the Y-axis direction in the middle of the support member 1; or it may be adapted to be provided in multiple places and arranged along the Y-axis direction on the support member 1.

[0042] The substrate of support 1 is an etchable metal material with a thickness of 0.1-0.13mm, preferably a titanium alloy plate or a stainless steel plate. Compared with carbon fiber composite materials, titanium alloys and stainless steel have good etchability, which can precisely control the etching depth and shape during chemical etching to achieve fine processing; at the same time, they have better fatigue resistance and toughness, meaning that they are less likely to produce permanent creases during repeated bending; and they can avoid the problems of difficult-to-clean high-temperature residues that occur when carbon fiber materials are laser cut.

[0043] The bending area 2 of the support member 1 is provided with a plurality of stepped through holes 5 penetrating the support member 1. These stepped through holes 5 are arranged in an array within the bending area 2 to form a network structure that facilitates bending. This network structure design can effectively disperse the stress generated during bending, avoid stress concentration in local areas, and thus reduce crease marks in the bending area after multiple bends.

[0044] The stepped through-hole 5 includes a blind groove 3 on the support surface and a through portion 4 on the screen surface, with the through portion 4 and the blind groove 3 interconnected. The blind groove 3 is a groove structure formed by single-sided chemical semi-etching, and the through portion 4 is a slit structure formed by laser penetration along the bottom of the blind groove 3. The opening width of the blind groove 3 is greater than the opening width of the through portion 4, forming a stepped through-hole 5 with a T-shaped (or funnel-shaped) cross-section. Through this structural design, the opening width of the through portion 4 on the screen surface is extremely small, as small as 0.007mm, far smaller than the 0.07mm achieved by current chemical etching processes, which can effectively reduce crease marks on the folding screen support component. In addition, the blind groove 3 on the support surface has a large opening width and depth, which can accommodate the recast layer generated by laser cutting, preventing the recast layer from protruding from the surface of the support component 1 and affecting the flatness of the support component 1.

[0045] In a preferred embodiment, a plurality of stepped through holes 5 are arranged within the bending region 2 to form a grid structure. For example... Figure 2 As shown, specifically, a number of stepped through holes 5 arranged along the length direction of the bending area 2 (i.e., the Y-axis direction in the figure) form a first grid area 6. This first grid area 6 is located in the middle of the bending area 2 and at least two sets are provided. The two sets of first grid areas 6 are staggered along the width direction of the bending area 2. By setting two sets of staggered first grid areas 6, the bending stress is effectively dispersed in the middle of the bending area 2, further reducing the concentration of crease marks.

[0046] Furthermore, at least one side of the first grid area 6 is provided with at least one row of uniformly distributed stepped through holes 5, which constitute the second grid area 7. The extension length of the second grid area 7 in the bending area 2 is less than the extension length of the first grid area 6 in the bending area 2. When two or more sets are provided on one side, the second grid areas 7 are staggered in pairs. In a specific embodiment, on both sides of the first grid area 6, a second grid area composed of a row of uniformly distributed stepped through holes 5 is provided. Specifically, the length of the blind groove 3 in the first grid area 6 is greater than the length of the blind groove 3 in the second grid area 7, and the spacing between adjacent blind grooves 3 in the first grid area 6 is equal to the spacing between adjacent blind grooves 3 in the second grid area 7.

[0047] Through the partitioned design of the above-mentioned grid structure, when the support 1 is bent, the main bending deformation is concentrated on the first grid area 6 (at the axis of symmetry), while the second grid area 7 bears a smaller bending stress (the bending radius becomes smaller), thereby further improving the structural strength of the support 1 while ensuring the overall bending performance.

[0048] In other embodiments, the support member 1 is provided with multiple bending areas 2, and the grid structure and distribution pattern are the same as those in the above embodiments.

[0049] The following describes specific embodiments and accompanying drawings. Figure 3-6 The molding method of the support member of the present invention will be described in detail, which specifically includes the following steps:

[0050] S1. After the exposure and development step of the support component 1, a single-sided chemical semi-etch is performed on the support surface of the bending area 2 of the support component 1. The time of the single-sided chemical semi-etch is controlled at 10-20 minutes, so that several blind trenches 3 are formed on the support surface of the bending area. By precisely controlling the etching amount and etching time, it is ensured that each blind trench 3 has a trapezoidal cross-section that is wider at the top and narrower at the bottom, with the top etching width controlled at 0.07-0.15 mm and the bottom etching width controlled at 0.05-0.07 mm.

[0051] In one embodiment, the etching depth of the blind groove 3 is controlled between 0.03 and 0.65 mm. Within this depth range, the blind groove 3 has a certain accommodating space to accommodate the laser-cut recast layer, and avoids excessive etching that would affect the overall structural strength of the support member 1. In another embodiment, the etching depth of the blind groove 3 is controlled between 0.065 and 0.085 mm. Within this depth range, increasing the etching depth of the blind groove 3 can accommodate more laser-cut recast layers, eliminating the need for subsequent secondary etching steps, effectively reducing processing costs and improving efficiency.

[0052] In the exposure and development step before the etching process, the positioning marks of the blind groove 3 and the positioning marks of the through part 4 need to be set on the front and back sides of the support 1 respectively, so as to clarify the processing surface that needs to be etched on one side, and to accurately position the blind groove 3 and the through part 4 to ensure the accuracy of the subsequent processing position.

[0053] S2. After completing the initial single-sided chemical semi-etching, laser penetration processing is performed within the blind groove 3 using laser cutting equipment to form a through-hole 4 interconnected with the blind groove 3. The blind groove 3 is located on one side of the support surface, and the through-hole 4 is located on one side of the screen surface. The opening width of the blind groove 3 is greater than the opening width of the through-hole 4, so that the blind groove 3 and the through-hole 4 form a stepped through-hole 5 with a T-shaped (or funnel-shaped) cross-section. During the laser perforation process, the laser will cause the titanium alloy or stainless steel material to partially melt and accumulate within the blind groove to form a recast layer.

[0054] In a specific embodiment, the laser cutting equipment may be a picosecond laser or a nanosecond laser.

[0055] In one embodiment, the laser cutting equipment uses a picosecond laser, controlling the laser frequency to be 100-110 kHz and the laser energy to be 8-10 W, with the laser scanning along a preset trajectory. For example... Figure 7 As shown, the preset trajectory is a closed contour composed of multiple discrete positioning points and line segments of adjacent positioning points within the blind groove 3. By scanning along the closed contour, a closed through contour can be cut out within the blind groove 3, thereby completely removing the material at the bottom of the blind groove to form a through part. The opening width of the through part is as small as 0.007mm.

[0056] In another embodiment, the laser cutting equipment uses a nanosecond laser, controlling the laser frequency to be 100-110 kHz and the laser energy to be 5-7 W. The laser scans along a preset trajectory. This preset trajectory includes at least two forms: such as... Figure 8 As shown, one is a plurality of evenly distributed discrete positioning points arranged along the length direction within the blind groove 3. Laser is used to make pinpoint perforations at these discrete positioning points, forming multiple circular through holes. These circular through holes are spaced apart from each other, collectively forming the through section; as shown... Figure 9As shown, the second feature is a single line segment set along the length direction within the blind groove 3. A continuous long strip-shaped through-slit is formed by linear scanning along this single line segment using a laser. When using the discrete positioning point method, the diameter of the discrete positioning point ranges from 0.007 to 0.03 mm; when using the single line segment method, the width of the single line segment ranges from 0.007 to 0.03 mm.

[0057] During the laser cutting process, some molten material will accumulate in the blind groove to form a recast layer. Since the blind groove 3 has sufficient depth and a large opening width, the recast layer can be completely contained inside the blind groove 3 and will not protrude from the surface of the support 1, that is, it will not affect the flatness of the support 1.

[0058] S3. After laser cutting is completed, the support 1 is de-inked to remove the protective ink applied before the etching process, and to clean the dust inside the stepped through hole 5.

[0059] To further improve the cleaning effect, a two-step ink removal process can be used to ensure complete removal of the protective film; alternatively, after one ink removal step, the support 1 can be subjected to an ultrasonic alkaline cleaning. Since the etching solution mainly contains acidic components, ultrasonic alkaline cleaning can effectively neutralize the acidity and alkalinity, remove residual etching solution and dust, and effectively improve the cleanliness.

[0060] In one embodiment, when the etching depth of the blind groove 3 is relatively small (e.g., 0.03-0.065 mm), on the one hand, the internal space of the blind groove 3 is relatively small; on the other hand, the unetched depth on the support member 1 (i.e., the depth requiring laser penetration processing) is large, resulting in a large accumulation of the recast layer generated by laser cutting. Therefore, the recast layer cannot be completely contained within the blind groove 3, and some will protrude from the surface of the support member 1. Therefore, after laser processing in step S2 and before ink removal in step S3, the support member 1 needs to be etched a second time to eliminate the recast layer within the blind groove 3, preventing any impact on the molding and use of the blind groove 3.

[0061] This secondary etching employs a double-sided etching method, allowing the etching solution to simultaneously erode the inner walls of both the blind trench 3 and the through-hole 4. Since the removal of the portion within the recast layer cannot be controlled during the etching process, the inner wall of the through-hole 4 will be eroded to some extent during the secondary etching, thus increasing the width of the through-hole 4 (e.g., Figure 4 , Figure 5(As shown). To reduce the erosion impact on the penetration portion 4, during the secondary etching process, only the etching time parameter is changed, controlling the secondary etching time to 1-3 minutes. The opening width of the penetration portion 4 may be slightly increased from about 0.01 mm to about 0.03 mm, still much smaller than the 0.07 mm of the existing process, to ensure the structural performance of the penetration portion. In other embodiments, the secondary etching process can also choose to change any parameter such as the flow rate, temperature, or composition of the etching solution.

[0062] In another embodiment, when the etching depth of the blind groove 3 is relatively large (e.g., 0.065-0.085 mm), on the one hand, the internal space of the blind groove 3 increases; on the other hand, the unetched depth on the support member 1 (i.e., the depth requiring laser penetration processing) decreases, and the amount of recast layer deposited by laser cutting decreases, keeping the deposit amount within an acceptable range. Therefore, the recast layer can be completely contained within the blind groove 3 without affecting its use. Thus, the secondary etching step can be omitted, simplifying the process flow, reducing production costs, and ensuring that the width of the penetration portion does not increase due to secondary etching, thereby guaranteeing the structural performance of the penetration portion.

[0063] The following provides three embodiments for setting the blind trench etching depth to 30μm, 50μm, and 70μm (as shown in the appendix). Figure 10-12 The specific parameters are shown in Tables 1-3. In all embodiments, the laser cutting parameters remain consistent: 50-75 cuts, 90%-95% laser energy, and 100-110 kHz frequency.

[0064] Table 1: Structural dimensional data when blind trench etching depth is 30 μm (unit: mm)

[0065]

[0066] Table 2: Structural dimensional data when blind trench etching depth is 50 μm (unit: mm)

[0067]

[0068] Table 3: Structural dimensional data when blind trench etching depth is 70 μm (unit: mm)

[0069]

[0070] The experimental data above show that, through the etching process and laser cutting method, even under different blind groove etching depths, the width of the through-part 3 on the screen side can be maintained at approximately 0.007-0.03 mm, which is much smaller than the minimum slit width of 0.07 mm for existing chemical etching processes, and the other dimensions of the blind groove 3 and the through-part 4 meet the design standards.

[0071] The support component prepared using the technical solution of this invention has a bending life increased from 300,000 bending cycles to 500,000 bending cycles in the prior art, and the crease marks in the bending area are significantly reduced, effectively extending the service life.

[0072] The support component prepared by this invention is made of titanium alloy or stainless steel, which has stronger fatigue resistance and toughness than carbon fiber material, and is not prone to creases even after repeated bending.

[0073] This invention employs a combination of "chemical semi-etching + nanosecond laser cutting" process, which significantly reduces equipment and processing costs compared to using high-precision or ultrafast laser cutting (such as femtosecond laser) alone. At the same time, by accommodating the recast layer in a blind groove, the post-processing steps are simplified, further improving production efficiency.

[0074] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for forming a support member for a flexible display screen, the support member having a screen surface and a support surface disposed opposite to each other, and the support member having a bending area, characterized in that, The substrate of the support is an etchable metal material with a thickness of 0.1-0.13mm. The bending area of ​​the support is provided with a number of stepped through holes penetrating the support. The number of stepped through holes are arranged in the bending area to form a grid structure that facilitates bending. The molding method includes the following steps: S1. Perform single-sided chemical semi-etching on the support surface of the bending area of ​​the support member to form several blind grooves on the support surface of the bending area. S2. Laser penetration processing is performed in the blind groove using a laser cutting device to form a through part that communicates with the blind groove. The blind groove and the through part constitute the stepped through hole with a T-shaped cross section. The opening width of the blind groove is greater than the opening width of the through part, and the depth of the blind groove is configured to accommodate the recast layer formed when the through part is laser cut. S3. Remove the ink film from the support component after laser cutting.

2. The molding method according to claim 1, characterized in that, The etchable metal material is a titanium alloy plate or a stainless steel plate.

3. The molding method according to claim 1, characterized in that, In step S1, the single-sided chemical half-etching time is 10-20 min; the etching depth of the blind trench is 0.03-0.065 mm, its top surface width is 0.07-0.15 mm, and its bottom surface width is 0.05-0.07 mm.

4. The molding method according to claim 3, characterized in that, In step S3, before removing the ink film from the support component after laser cutting, the support component after laser cutting is first etched twice. The second etching is double-sided etching, and the second etching time is 1-3 minutes. After the second etching is completed, the ink film is removed.

5. The molding method according to claim 1, characterized in that, In step S1, the single-sided chemical half-etching time is 10-20 min; the etching depth of the blind trench is 0.065-0.085 mm, its top surface width is 0.07-0.15 mm, and its bottom surface width is 0.05-0.07 mm.

6. The molding method according to claim 1, characterized in that, In step S2, the laser cutting equipment used is a picosecond laser device. The laser cutting device is controlled to scan along a preset trajectory to form a through section. The preset trajectory is a closed contour formed by multiple discrete positioning points and line segments connecting adjacent positioning points within a blind groove.

7. The molding method according to claim 1, characterized in that, In step S2, the laser cutting equipment used is a nanosecond laser equipment. The laser cutting equipment is controlled to scan along a preset trajectory to form the through part. The preset trajectory is a plurality of evenly distributed discrete positioning points set along the length direction in the blind groove, or a single line segment set along the length direction.

8. The molding method according to claim 7, characterized in that, When the preset trajectory consists of multiple evenly distributed discrete positioning points, the diameter of the discrete positioning points ranges from 0.007 to 0.03 mm; when the preset trajectory consists of a single line segment, the width of the single line segment ranges from 0.007 to 0.03 mm.

9. The molding method according to claim 1, characterized in that, In step S3, the support component after laser cutting is subjected to two ink removal processes, or after one ink removal process, it is subjected to an ultrasonic alkaline wash.

10. A support component for a flexible display screen, characterized in that, The support member is prepared using the molding method for the support member of the flexible display screen as described in any one of claims 1-9.

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